Flexible conductive material for signal transmission of micro-inertial device and preparation method thereof

By using flexible conductive materials, using molding agents of polychlorinated grease and silicone rubber and aggregates of low-melting metal indium, silver powder and carbon powder, the problems of inconvenient signal transmission and unstable signal transmission in the prior art are solved, and the signal transmission capability under vibration and impact resistance is achieved, and the testing efficiency is improved.

CN119786122APending Publication Date: 2025-04-08BEIJING AUTOMATION CONTROL EQUIP INST
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Patent Information

Application Number
CN202411778104.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-05
Publication Date
2025-04-08

AI Technical Summary

Technical Problem

The existing micro-inertial device signal transmission method is inconvenient during the product screening and testing stage of user scenarios, which increases working hours and affects efficiency. As the number of plug-ins and unplugging increases, there are problems such as poor contact, high retest rate and easy damage, resulting in unstable signal.

Method used

Flexible conductive material is used, which consists of molding agent and aggregate. The molding agent is mixed with polychlorinated grease and silicone rubber. The aggregate is composed of micron-scale metal indium, silver powder and carbon powder with low melting point, and is prepared by ultrasonic vibration stirring and vacuum treatment to achieve elastic connection of signals.

Benefits of technology

This conductive material ensures point-to-point conduction of signal when under pressure, has good conductivity and elasticity, and has signal transmission capabilities under vibration and impact resistance, which improves the fast and reliable connection of signal output of micro-inertial devices and improves the product testing efficiency.

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Abstract

The present invention provides a flexible conductive material for signal transmission of a micro-inertial device, the conductive material comprising a molding agent and an aggregate, wherein the molding agent is a mixture of polyvinyl chloride and silicone rubber; the aggregate is composed of micron-grade metal indium with a low melting point, silver powder and carbon powder. Compared with conventional connection methods, the scheme of the present invention can provide good anti-vibration and anti-impact capabilities while ensuring normal conductive function.
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Description

Technical Field

[0001] The invention belongs to the technical field of conductive materials and relates to a flexible conductive material for signal transmission of a micro-inertial device and a preparation method thereof. Background Art

[0002] Micro-inertial devices have the characteristics of small size, light weight, low power consumption, etc., and have broad prospects in many fields such as aerospace, military and automobile. With the development of information technology, higher requirements are put forward for the convenience and reliability of screening and testing of micro-inertial device instruments before leaving the factory.

[0003] In this case, the point-to-point conductive connection between the micro-inertial device pins and the test circuit needs to be fast, convenient, anti-interference, signal stable and reliable.

[0004] Conventional micro-inertial device signal transmission mostly adopts fixed connection methods such as pin soldering and gold wire bonding. These methods are not convenient in the user scenario product screening and testing stage, increase working hours, and affect efficiency. For devices in the traditional TO package form, metal hole pins or spring pin connectors are used to achieve conductive connection. As the number of plug-in and unplug times increases, there are problems such as poor contact, high retest rate and easy damage, which is not conducive to the stable output of signals. Summary of the invention

[0005] The purpose of the present invention is to provide a flexible conductive material for signal transmission of a micro-inertial device and a preparation method thereof, wherein the conductive material ensures point-to-point conduction of the signal when under pressure, and has signal communication capability under vibration and impact resistance. The material is prepared by mixing a molding agent and an aggregate to achieve elastic connection of the signal, and is used for stable electrical connection of the output signal of the micro-inertial device.

[0006] The technical solution of the present invention is:

[0007] According to one aspect, a flexible conductive material for signal transmission of a micro-inertial device is provided. The conductive material comprises a molding agent and an aggregate, wherein the molding agent is a mixture of polyvinyl chloride and silicone rubber; and the aggregate is composed of micron-sized metal indium with a low melting point, silver powder, and carbon powder.

[0008] Furthermore, the mass ratio of the molding agent is 67% to 80% of polyvinyl chloride and 20% to 33% of silicone rubber.

[0009] Furthermore, the mass ratio of the aggregate is 60% to 85% of metal indium, 10% to 30% of silver powder, and 5% to 10% of carbon powder.

[0010] Furthermore, the diameter of the metal indium in the aggregate is 100 μm to 200 μm, the diameter of the silver powder is 0.5 μm to 3 μm, and the diameter of the carbon powder is 100 nm to 500 nm.

[0011] According to another aspect, the present invention also provides a method for preparing the above-mentioned flexible conductive material for signal transmission of a micro-inertial device, the preparation method comprising:

[0012] The polyurethane and silicone rubber are mixed and stirred evenly according to the mass ratio for a stirring time of not less than 5 minutes to obtain a molding agent;

[0013] Add metal indium, silver powder and carbon powder to the prepared molding agent in proportion and mix them evenly by ultrasonic vibration for at least 10 minutes;

[0014] The mixed materials are put into the mold, placed in a vacuum box, and vacuumized at room temperature;

[0015] The vacuum-treated mixed material is placed in an oven for drying, and the temperature is raised step by step according to the set program. When the oven cools down, it is taken out.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The flexible conductive material proposed in the present invention uses a molding agent as a skeleton matrix to provide fixed support for aggregates, which can improve the overall strength and provide guarantees for mechanics and viscosity. Through the coordinated cooperation of polyvinyl chloride and silicone rubber, the vibration and impact resistance are greatly improved, and it is easy to operate, mold and solidify. At the same time, by adding aggregates with specific components and proportions, the conductivity is greatly enhanced. The conductive material has good conductivity and elasticity, can achieve signal conduction in a compressed state, and has signal transmission capabilities under vibration and impact resistance. It can be used for fast and reliable connection of signal output in micro-inertial device screening tests, and improve product testing efficiency. During testing, compared with conventional connection methods, while ensuring the normal conduction function, it provides good vibration and impact resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is the signal output of the device under shock and vibration resistance in conventional connection mode;

[0019] Figure 2 The device signal output of the flexible conductive connection method of the present invention under impact and vibration resistance. DETAILED DESCRIPTION

[0020] Specific embodiments of the present invention are described in detail below. In the following description, for the purpose of explanation and not limitation, specific details are set forth to help fully understand the present invention. However, it will be apparent to those skilled in the art that the present invention may also be practiced in other embodiments that depart from these specific details.

[0021] It should be noted that, in order to avoid obscuring the present invention due to unnecessary details, only the device structure and / or processing steps closely related to the solution according to the present invention are shown in the accompanying drawings, while other details that are not closely related to the present invention are omitted.

[0022] In one embodiment of the present invention, a flexible conductive material for signal transmission of a micro-inertial device is provided. The conductive material comprises a molding agent and an aggregate, wherein the molding agent is a mixture of polyvinyl chloride and silicone rubber; the aggregate is composed of micron-grade metal indium with a low melting point, silver powder and carbon powder, wherein the mass ratio of the molding agent is 67% to 80% of polyvinyl chloride and 20% to 33% of silicone rubber; the mass ratio of the aggregate is 60% to 85% of metal indium, 10% to 30% of silver powder and 5% to 10% of carbon powder.

[0023] The flexible conductive material proposed in the embodiment of the present invention uses a molding agent as a skeleton matrix to provide fixed support for the aggregate, which can improve the overall strength and provide guarantees for mechanics and viscosity. Through the coordinated cooperation of polyvinyl chloride and silicone rubber, the vibration and impact resistance are greatly improved, and it is easy to operate molding and curing. At the same time, by adding specific components and proportions of aggregates, the conductivity is greatly enhanced. The conductive material has good conductivity and elasticity, can achieve signal conduction in a compressed state, and has signal transmission capabilities under vibration and impact resistance. It can be used for fast and reliable connection of signal output in micro-inertial device screening tests, thereby improving product testing efficiency. During the test, compared with conventional connection methods, while ensuring the normal conduction function, it provides good vibration and impact resistance.

[0024] Preferably, in order to better ensure the conductive performance, the diameter of the metal indium in the aggregate is 100 μm to 200 μm, the diameter of the silver powder is 0.5 μm to 3 μm, and the diameter of the carbon powder is 100 nm to 500 nm.

[0025] According to another embodiment, a method for preparing the above-mentioned flexible conductive material for signal transmission of a micro-inertial device is also provided, and the preparation method comprises:

[0026] S1. Mix polyurethane and silicone rubber in a mass ratio and stir evenly for at least 5 minutes to obtain a molding agent;

[0027] S2. Add metal indium, silver powder and carbon powder to the prepared molding agent in proportion and mix them, and stir them evenly by ultrasonic vibration for at least 10 minutes;

[0028] S3, putting the mixed materials into a mold, placing it in a vacuum box, and vacuumizing it at room temperature;

[0029] During the evacuation process, pay attention to the state of the mixed material until there are no more continuous bubbles on the surface of the mixed material, keep it for 5min to 10min, and then take it out for use;

[0030] S4. Put the vacuum-treated mixed material into an oven for drying, raise the temperature step by step according to the set program, and take it out after the oven cools down.

[0031] It can be seen that the conductive material prepared by the preparation method of the embodiment of the present invention is prepared by mixing the molding agent and the aggregate to achieve elastic connection of the signal and is used for stable electrical connection of the output signal of the micro-inertial device. The conductive material ensures point-to-point conduction of the signal when under pressure, and has signal communication capability under vibration and impact resistance.

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described below in conjunction with embodiments.

[0033] Example 1

[0034] A novel method for preparing a flexible conductive material comprises the following steps:

[0035] The first step is to mix and stir the polyurethane and silicone rubber in a mass ratio to obtain a molding agent for 6 minutes, wherein the weight percentage of the polyurethane is 74% and the weight percentage of the silicone rubber is 26%;

[0036] In the second step, metal indium with a diameter of 100 μm, silver powder with a diameter of 1 μm, and carbon powder with a diameter of 200 nm are added to the prepared molding agent in proportion and mixed, and stirred evenly by ultrasonic vibration for 12 minutes, wherein the weight mass ratio is 70% of metal indium, 23% of silver powder, and 7% of carbon powder;

[0037] The third step is to load the evenly mixed materials into the mold, put them into the vacuum box, and evacuate them to 100Pa at room temperature. During the evacuation process, pay attention to the state of the mixed materials. If it is found that the materials are about to overflow from the mold, stop evacuating, wait for the liquid level to drop, and then start evacuating until there are no more large numbers of continuous bubbles on the surface of the mixed materials. Keep it for 5 minutes and take it out for use.

[0038] The fourth step is to put the mixed material into an oven for drying, heat it to 40°C and keep it for 1 hour, then heat it to 60°C and keep it for 2 hours, with a heating rate of 3°C / min, and take it out after the oven cools down.

[0039] Example 2

[0040] A novel method for preparing a flexible conductive material comprises the following steps:

[0041] The first step is to mix and stir the polyurethane and silicone rubber in a mass ratio to obtain a molding agent, with a stirring time of 6 minutes, wherein the weight percentage of polyurethane is 67% and the weight percentage of silicone rubber is 33%;

[0042] In the second step, metal indium with a diameter of 100 μm, silver powder with a diameter of 1 μm, and carbon powder with a diameter of 300 nm are added to the prepared molding agent in proportion and mixed, and stirred evenly by ultrasonic vibration for 12 minutes, wherein the weight mass ratio is 85% of metal indium, 10% of silver powder, and 5% of carbon powder;

[0043] The third step is to load the evenly mixed materials into the mold, put them into the vacuum box, and evacuate them to 100Pa at room temperature. During the evacuation process, pay attention to the state of the mixed materials. If it is found that the materials are about to overflow from the mold, stop evacuating, wait for the liquid level to drop, and then start evacuating until there are no more large numbers of continuous bubbles on the surface of the mixed materials. Keep it for 5 minutes and take it out for use.

[0044] The fourth step is to put the mixed material into an oven for drying, heat it to 40°C and keep it for 1 hour, then heat it to 60°C and keep it for 2 hours, with a heating rate of 3°C / min, and take it out after the oven cools down.

[0045] Example 3

[0046] A novel method for preparing a flexible conductive material comprises the following steps:

[0047] The first step is to mix and stir the polyurethane and silicone rubber in a mass ratio to obtain a molding agent, and the stirring time is 6 minutes, wherein the weight percentage of polyurethane is 80% and the weight percentage of silicone rubber is 20%;

[0048] In the second step, metal indium with a diameter of 100 μm, silver powder with a diameter of 1 μm, and carbon powder with a diameter of 300 nm are added to the prepared molding agent in proportion and mixed, and stirred evenly by ultrasonic vibration for 12 minutes, wherein the weight mass ratio is 60% of metal indium, 30% of silver powder, and 10% of carbon powder;

[0049] The third step is to load the evenly mixed materials into the mold, put them into the vacuum box, and evacuate them to 100Pa at room temperature. During the evacuation process, pay attention to the state of the mixed materials. If it is found that the materials are about to overflow from the mold, stop evacuating, wait for the liquid level to drop, and then start evacuating until there are no more large numbers of continuous bubbles on the surface of the mixed materials. Keep it for 5 minutes and take it out for use.

[0050] The fourth step is to put the mixed material into an oven for drying, heat it to 40°C and keep it for 1 hour, then heat it to 60°C and keep it for 2 hours, with a heating rate of 3°C / min, and take it out after the oven cools down.

[0051] like Figure 1 and Figure 2As shown, Figure 1 The signal output of the device under the conventional connection mode is screened under the anti-impact and vibration conditions. Under the conditions of anti-interference, impact and vibration, the signal output is abnormally large, the output signal does not meet the index requirements, the connection mode is not stable enough, and the anti-vibration is poor; Figure 2 For the same product, the flexible conductive connection method of the embodiment of the present invention is used to screen the signal output of the device under impact and vibration resistance. Under the same conditions, the signal output is normal, meets the index requirements, has stable output, and has good vibration resistance.

[0052] Features described and / or illustrated above for one embodiment may be used in the same or similar manner in one or more other embodiments, and / or combined with or used in place of features in other embodiments.

[0053] It should be emphasized that the term "include / comprises" when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps, components or combinations thereof.

[0054] The many features and advantages of these embodiments are apparent from this detailed description, and thus the appended claims are intended to cover all such features and advantages of these embodiments that fall within their true spirit and scope. Furthermore, since numerous modifications and changes will readily occur to those skilled in the art, it is not intended that the embodiments of the invention be limited to the exact construction and operation illustrated and described, but rather all suitable modifications and equivalents falling within the scope thereof are intended to be covered.

[0055] Parts of the present invention that are not described in detail are well known to those skilled in the art.

Claims

1. A flexible conductive material for signal transmission of a micro-inertial device, characterized in that: The conductive material comprises a molding agent and an aggregate, wherein the molding agent is a mixture of polyvinyl chloride and silicone rubber; the aggregate is composed of micron-grade metal indium with a low melting point, silver powder and carbon powder.

2. The flexible conductive material for signal transmission of a micro-inertial device according to claim 1, characterized in that: The mass ratio of the molding agent is 67% to 80% of polyvinyl chloride and 20% to 33% of silicone rubber.

3. The flexible conductive material for signal transmission of a micro-inertial device according to claim 2, characterized in that: The mass ratio of the aggregate is 60% to 85% of metal indium, 10% to 30% of silver powder, and 5% to 10% of carbon powder.

4. A flexible conductive material for signal transmission of a micro-inertial device according to any one of claims 1 to 3, characterized in that: The diameter of the metal indium in the aggregate is 100 μm to 200 μm, the diameter of the silver powder is 0.5 μm to 3 μm, and the diameter of the carbon powder is 100 nm to 500 nm.

5. The method for preparing a flexible conductive material for signal transmission of a micro-inertial device according to claims 1-4, characterized in that: The preparation method comprises: The polyurethane and silicone rubber are mixed and stirred evenly according to the mass ratio for a stirring time of not less than 5 minutes to obtain a molding agent; Add metal indium, silver powder and carbon powder to the prepared molding agent in proportion and mix them evenly by ultrasonic vibration for at least 10 minutes; The mixed materials are put into the mold, placed in a vacuum box, and vacuumized at room temperature; The vacuum-treated mixed material is placed in an oven for drying, and the temperature is raised step by step according to the set program. When the oven cools down, it is taken out.