A high-density multi-row connector pin local rapid tin process method

Abstract

A kind of high-density multi-array inter-board connector pin local rapid tin process method, design protection tool, the tool includes handle, inter-board connector body protection module, positioning module, pin protection sleeve and base, inter-board connector body protection module, positioning module, base according to inter-board connector pin arrangement position punch corresponding hole position;Clean handle, inter-board connector body protection module, positioning module, pin protection sleeve and base;According to the number of board connector pins and length, process pin protection sleeve;Realize the final assembly of inter-board connector to be tinned;After confirming that the temperature in the tin pot meets the requirements, vertically immerse the tool together with the inter-board connector into the gold-free tin pot, require the tin liquid to be submerged but not exceed the inter-board connector body protection module, after the tool is put into the tin pot, move along the left and right directions, vertically take out the protection tool after the preset time.

Description

Technical Field

[0001] This invention relates to a method for rapid local tinning of pins of high-density multi-row inter-board connectors, applicable to rapid local tinning of high-density multi-row inter-board connectors used in defense and military electronic products. Background Technology

[0002] Inter-board connectors are electrical connectors used to interconnect printed circuit board assemblies, gradually transitioning towards leadless chassis. With the increasing miniaturization and integration of defense and military electronic products, inter-board connectors are gradually replacing the original flexible inter-board wire harness connections.

[0003] High-density multi-row board connectors have special structures and applications, meaning that the pins must be soldered on the printed circuit board while also ensuring that there is a certain length of untinned portion for mating with connectors on adjacent boards.

[0004] The current method for soldering the pins of high-density multi-row board connectors is as follows: prepare solder resist → manually apply solder resist to the parts of each pin that do not need to be soldered → the solder resist cures → manually solder each pin one by one.

[0005] The traditional method of manually applying solder resist and then manually tinning each pin with a soldering iron is effective in terms of process and operational feasibility, but it is difficult to guarantee product consistency and reliability, and it also brings potential quality problems to the product. Therefore, there is an urgent need for a new tinning process to achieve the amount of tin, speed, consistency, stability and uniformity of tinning for each pin. Summary of the Invention

[0006] The technical problem solved by the present invention is to overcome the shortcomings of the prior art and provide a modular and detachable heat-resistant structure for launch vehicles.

[0007] The technical solution of this invention is: a method for rapid local soldering of pins in high-density multi-row inter-board connectors, comprising:

[0008] The design includes a protective fixture, which comprises a handle, an inter-board connector body protection module, a positioning module, a pin protection sleeve, and a base. The inter-board connector body protection module, the positioning module, and the base have corresponding holes drilled according to the pin arrangement of the inter-board connector.

[0009] Cleaning handle, inter-board connector body protection module, positioning module, pin protection sleeve and base;

[0010] Process pin protective sleeves according to the number and length of the inter-board connector pins;

[0011] Insert the processed pin protection sleeves into the holes on the base in sequence and fix them. Assemble the positioning module, the base and the pin protection sleeves into a combination and insert screws on both sides of the combination.

[0012] The inter-board connector body protection module is fixedly installed on the screw, and a handle is installed;

[0013] After confirming that the position and orientation of the inter-board connector to be soldered are correct, place the inter-board connector to be soldered into the inter-board connector body protection module, so that each pin is simultaneously and vertically inserted into the inner hole of the pin protection sleeve in the inter-board connector body protection module and the positioning module until it is installed in place.

[0014] The positioning module is moved vertically towards the base to the top of the base to achieve the final assembly of the inter-board connector to be soldered.

[0015] After confirming that the temperature inside the solder pot meets the requirements, vertically immerse the fixture along with the inter-board connector into the solder pot. The solder liquid should submerge but not exceed the protection module of the inter-board connector body. After the fixture is placed in the solder pot, move it in the left and right direction. After the preset time, vertically remove the protective fixture.

[0016] Preferably, the second tinning is performed in the same manner as the first tinning.

[0017] Preferably, the second tinning requires replacing the tin pot.

[0018] Preferably, the tinning process involves moving 5-7cm in the direction for about 2-3 seconds.

[0019] Preferably, the product is cooled to room temperature for at least 20 seconds after two tinning processes.

[0020] Preferably, the inter-board connector body protection module has a cuboid structure with a groove in the center that matches the shape of the inter-board connector body. Holes corresponding to the pin positions of the inter-board connector and positioning pin holes are opened at the bottom of the groove, and through holes for screws to pass through are opened on both sides of the groove.

[0021] Preferably, the shape of the groove ensures that when the inter-board connector body is installed therein, all the pins of the inter-board connector to be soldered are located on the outside of the bottom surface of the groove.

[0022] Preferably, there is a gap between the pin protection sleeve and the pin of the board connector, with the gap ranging from 0.04mm to 0.05mm.

[0023] Preferably, there is a gap between the holes on the base and the holes on the positioning module and the pin protective sleeve, with the gap range being 0.05-0.1mm.

[0024] Preferably, the protection module, positioning module, base, and pin protection sleeve of the inter-board connector are made of materials that can withstand temperatures of at least 300 degrees Celsius.

[0025] The advantages of this invention compared to the prior art are:

[0026] The method of this invention fully recognizes the special characteristics of the structure and application of the inter-board connector, and ingeniously designs and manufactures a special protective fixture for the non-tinned parts of the inter-board connector pins. This enables the protection of all non-tinned parts of the pins of an inter-board connector in one go, and the one-time tinning of all non-protected parts of the pins of a single inter-board connector.

[0027] The method of this invention eliminates the problems of uneven solder resist application, long curing time, and poor product consistency, poor reliability, and long time consumption caused by traditional manual solder resist application and manual pin tinning process. It improves the quality stability and reliability of electronic products using high-density multi-arrange inter-board connectors in the defense and military industries. Attached Figure Description

[0028] Figure 1 Flowchart of the method of this invention;

[0029] Figure 2 This is a schematic diagram of the tooling for the present invention;

[0030] Figure 3 This is a schematic diagram of the inter-board connector body protection module of the present invention;

[0031] Figure 4 This is a schematic diagram of the handle of the present invention;

[0032] Figure 5 This is a schematic diagram of the positioning module of the present invention;

[0033] Figure 6 This is a schematic diagram of the base of the present invention;

[0034] Figure 7 This is a schematic diagram of the assembly of the pin protection sleeve of the present invention;

[0035] Figure 8 A schematic diagram of the assembly of the positioning module, base, and pin protection sleeve;

[0036] Figure 9 This is a schematic diagram for assembling the screw and nut;

[0037] Figure 10 For assembling handles and inter-board connector body protection modules;

[0038] Figure 11 This is a schematic diagram of the inter-board connector being installed.

[0039] Figure 12This is a schematic diagram showing how the positioning module is slid down to the bottom of the pin protection sleeve. Detailed Implementation

[0040] The present invention will now be described in detail with reference to the accompanying drawings and examples.

[0041] In response to the trend of miniaturization and integration in aerospace electronic products, high-density multi-row board-to-board connectors have emerged as a replacement for existing board-to-board wiring harnesses. When in use, the pins must be soldered on the printed circuit board while ensuring that there is a certain length of untinned portion for mating with the connectors on the adjacent board.

[0042] According to national military standards, gold-plated components must undergo tinning and gold removal before soldering to the printed circuit board. Therefore, high-density multi-row inter-board connectors require tinning and gold removal on specific areas of the gold-plated pins before soldering. However, since high-density multi-row inter-board connectors have ≥80 pins, ≥4 pin rows, and a spacing of only 1.27mm between adjacent pins, the current method of tinning specific areas of each pin is manual. This requires applying solder resist to the non-tinned areas (i.e., the areas that connect with the connector) for protection. This method is time-consuming and makes it difficult to ensure the consistency of tinning position, amount of solder, and appearance of each pin on the same inter-board connector, affecting the subsequent soldering quality.

[0043] This invention provides a method for rapid local soldering of pins in high-density multi-row inter-board connectors, such as... Figure 1 As shown, it includes the following steps:

[0044] (1) Design protective tooling, such as Figure 2 As shown, the tooling includes a handle, an inter-board connector body protection module, a positioning module, a pin protection sleeve, and a base. The inter-board connector body protection module, the positioning module, and the base have corresponding holes drilled according to the pin arrangement positions of the inter-board connector.

[0045] like Figure 3 , 5 As shown in Figure 6, the inter-board connector body protection module, positioning module, and base have corresponding holes drilled according to the pin arrangement of the inter-board connector; the number of pin protection sleeves is consistent with the number of pins of the inter-board connector, and they are installed in the corresponding holes on the base; the corresponding holes on the positioning module pass through the pin protection sleeves, and the positioning module is connected to both sides of the base by screws, allowing the positioning module to move up and down along the screws; the inter-board connector body protection module is fixedly installed on the screws and is used to place the body of the inter-board connector. The pins of the inter-board connector extend from the lower end of the inter-board connector body protection module and enter the pin protection sleeves. The position of the inter-board connector body protection module ensures that the upper end of the pin protection sleeve and the lower end of the inter-board connector body protection module are the soldering areas of the inter-board connector pins. (Handle) Figure 4 It is fixed on the protection module of the inter-board connector and is used as a lifting device during tinning.

[0046] In a preferred embodiment of this invention, the inter-board connector body protection module, positioning module, base, and pin protection sleeve are all made of Teflon material, and the inner diameter of the pin protection sleeve is adapted to the inner diameter of the pin. There are gaps between the holes on the base and the holes on the positioning module and the pin protection sleeve, with a gap range of 0.05-0.1mm.

[0047] (2) Cleaning handle, inter-board connector body protection module, positioning module, pin protection sleeve and base;

[0048] After checking that the handle, board connector body protection module, positioning module, pin protection sleeve and base are intact and undamaged, wipe them clean with a non-woven cloth dipped in a small amount of anhydrous ethanol. After the anhydrous ethanol has completely evaporated, proceed to step (3).

[0049] (3) Process pin protection sleeves according to the number and length of the connector pins on the board; the cut parts should be vertical, without tilting, without damage, and without contamination.

[0050] (4) Insert the processed pin protection sleeves into the holes on the base in sequence and fix them in place (e.g., Figure 7 As shown), there should be no missing insertions. Assemble the positioning module, base, and pin protection sleeve into a single unit (as shown). Figure 8 As shown), the positioning block is required to not damage the pin protective sleeve, cover the pin protective sleeve, and insert screws (M4×25) on both sides of the assembly (as shown). Figure 9 (as shown)

[0051] (5) Fix the inter-board connector body protection module on the screw and install a handle;

[0052] Connect the M4 nut to the assembly of the inter-board connector body protection module, handle and positioning module, and base into a single unit, such as... Figure 10 As shown.

[0053] (6) Move the positioning module toward the inter-board connector body protection module to ensure that the positioning module covers the top of each pin protection sleeve.

[0054] (7) After confirming that the position and orientation of the inter-board connector to be soldered are correct, place the inter-board connector to be soldered into the inter-board connector body protection module, so that each pin simultaneously and vertically penetrates the inner hole of the pin protection sleeve in the inter-board connector body protection module and positioning module until it is installed in place, such as Figure 11 As shown;

[0055] (8) Move the positioning module vertically towards the base to the top of the base to achieve the final assembly of the inter-board connectors to be soldered; such as Figure 12 As shown.

[0056] After checking that the pins of the inter-board connector to be tinned correspond one-to-one with the holes on the inter-board connector body protection module, the module to be positioned is moved vertically and slowly towards the base and the inter-board connector to be tinned towards the inter-board connector body protection module until it can no longer move. The device for local rapid tinning of high-density multi-arranged inter-board connector pins is thus completed.

[0057] (9) After confirming that the temperature inside the solder pot meets the requirements, vertically immerse the fixture along with the inter-board connector into the solder pot. The solder liquid should submerge but not exceed the protection module of the inter-board connector body. After the fixture is placed in the solder pot, move it in the left and right direction. After the preset time, vertically remove the protective fixture to complete the first soldering. The soldering process involves moving 5-7cm in the left and right direction for about 2-3 seconds.

[0058] (10) Perform the second tinning according to the above (9) steps (Note: the tin pot needs to be changed, and the gold-removing tin pot cannot be used for the second tinning).

[0059] (11) Remove the tinned connector, check the tinning quality of the pins, and the tinning is complete.

[0060] This invention abandons the traditional method of manually applying solder resist to non-tinned pins and then manually tinning each pin individually. Instead, it presents a high-density, multi-row inter-board connector pin local rapid tinning fixture, consisting of a handle, an inter-board connector body protection module, a positioning module, a base, pin protection sleeves (Teflon material, inner diameter adapted to pin diameter), and screws and nuts. By assembling the device and protecting non-tinned areas within 2-3 minutes, it lays the foundation for subsequent one-time tinning of all pin areas. Taking an 80-pin inter-board connector as an example, using this device, assuming 100% tinning quality, the tinning time is reduced from approximately 15 minutes by manual tinning to 3 minutes, improving efficiency by approximately 4 times.

[0061] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A method for rapid local soldering of pins in high-density multi-row inter-board connectors, characterized in that... include: The design includes a protective fixture, which comprises a handle, an inter-board connector body protection module, a positioning module, a pin protection sleeve, and a base. The inter-board connector body protection module, the positioning module, and the base have corresponding holes drilled according to the pin arrangement of the inter-board connector. Cleaning handle, inter-board connector body protection module, positioning module, pin protection sleeve and base; Process pin protective sleeves according to the number and length of the inter-board connector pins; Insert the processed pin protection sleeves into the holes on the base in sequence and fix them. Assemble the positioning module, the base and the pin protection sleeves into a combination and insert screws on both sides of the combination. The inter-board connector body protection module is fixedly installed on the screw, and a handle is installed; After confirming that the position and orientation of the inter-board connector to be soldered are correct, place the inter-board connector to be soldered into the inter-board connector body protection module, so that each pin is simultaneously and vertically inserted into the inner hole of the pin protection sleeve in the inter-board connector body protection module and the positioning module until it is installed in place. The positioning module is moved vertically towards the base to the top of the base to achieve the final assembly of the inter-board connector to be soldered. After confirming that the temperature inside the solder pot meets the requirements, vertically immerse the fixture along with the inter-board connector into the gold removal solder pot. The solder liquid should submerge but not exceed the protection module of the inter-board connector body. After the fixture is placed in the solder pot, move it in the left and right directions. After the preset time, vertically remove the protective fixture. The board connector body protection module is a cuboid structure with a groove in the center that matches the shape of the board connector body. Holes corresponding to the pin positions of the board connector and positioning pin holes are opened at the bottom of the groove. Through holes for screws to pass through are opened on both sides of the groove. The shape of the groove ensures that when the inter-board connector body is installed inside it, all the pins of the inter-board connector to be soldered are located on the outside of the bottom surface of the groove.

2. The method according to claim 1, characterized in that: Perform the second tinning in the same manner as the first tinning.

3. The method according to claim 2, characterized in that: The second tinning requires replacing the tin pot.

4. The method according to claim 1, characterized in that: The tinning process takes about 2-3 seconds and involves moving the object 5-7cm in one direction.

5. The method according to claim 1, characterized in that: Cool to room temperature for at least 20 seconds after two tinning processes.

6. The method according to claim 1, characterized in that: There is a gap between the pin protection sleeve and the pin of the board connector, with a gap range of 0.04mm-0.05mm.

7. The method according to claim 1, characterized in that: There are gaps between the holes on the base and the holes on the positioning module and the pin protective sleeve, with a gap range of 0.05-0.1mm.

8. The method according to claim 1, characterized in that: The protection module, positioning module, base, and pin protection sleeve of the inter-board connector are made of materials that can withstand temperatures of at least 300 degrees Celsius.

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