Hollowed-out finger processing method

Abstract

The invention is applicable to the technical field of circuit board processing, and particularly relates to a hollowed-out finger processing method which comprises the following steps: covering an etching surface of a copper substrate with a dry film to obtain a to-be-processed copper substrate; wherein the laser surface of the copper substrate is provided with a PI layer; exposing and etching the etched surface of the copper substrate to be treated to obtain an etched copper substrate; removing the dry film on the etched surface of the etched copper substrate, and covering the etched surface with the formed covering film to obtain a semi-finished copper substrate; and performing laser windowing treatment on the PI layer of the semi-finished copper substrate to obtain the hollow copper substrate. According to the method, a dry film and a covering film can be omitted, the material cost is reduced, meanwhile, the film pasting step is reduced, the efficiency is improved, the PI layer is adopted to replace another covering layer, laser windowing treatment is carried out on the PI layer, windowing does not need to be carried out in advance, and the effect of production synchronization is achieved.

Description

Technical Field

[0001] The present application belongs to the technical field of circuit board processing, and in particular, relates to a method for processing hollow fingers. Background Art

[0002] In the field of circuit boards, "hollow finger processing" usually refers to making specific hollow areas on a circuit board (PCB). These areas may be used to install components such as connectors, slots, heat sinks, or to solve problems such as signal integrity, weight reduction, and material saving. Hollow design is very important in circuit board design and can affect the functionality and reliability of the circuit board.

[0003] In the related art, a cover film with a window is usually attached to one side of the copper substrate, and then a dry film is attached to the other side of the copper layer and the cover film, followed by exposure and etching. After the dry film is stripped, a cover film with a window is attached to the substrate to obtain a hollow copper substrate. This processing method is relatively complicated and has low processing efficiency. In addition, two layers of dry film and two layers of cover film are used, which consumes more materials and has a higher processing cost. Summary of the invention

[0004] The embodiment of the present application provides a method for processing a hollow finger, which can solve the problems in the related art that the processing method and steps are relatively complicated, the processing efficiency is low, the material consumption is high, and the processing cost is high.

[0005] In a first aspect, an embodiment of the present application provides a method for processing a hollow finger, comprising:

[0006] Covering the etched surface of the copper substrate with a dry film to obtain a copper substrate to be processed; wherein the laser surface of the copper substrate is provided with a PI layer;

[0007] Exposing and etching the etched surface of the copper substrate to be processed to obtain an etched copper substrate;

[0008] removing the dry film on the etched surface of the etched copper substrate, and covering the etched surface with a formed covering film to obtain a semi-finished copper substrate;

[0009] The PI layer of the semi-finished copper substrate is subjected to laser window opening treatment to obtain a hollow copper substrate.

[0010] The above technical solutions in the embodiments of the present application have at least the following technical effects:

[0011] The hollow finger processing method provided in the present application is to obtain a copper substrate to be processed by covering the etching surface of the other side of the copper substrate with a laser surface provided with a PI layer with a dry film; then the etching surface of the copper substrate to be processed is exposed and etched to obtain an etched copper substrate; then the dry film on the etching surface of the etched copper substrate is removed, and a molded covering film is covered on the etching surface to obtain a semi-finished copper substrate; finally, the PI layer of the semi-finished copper substrate is subjected to laser windowing treatment to obtain a hollow copper substrate. This method can save a piece of dry film and a piece of covering film, reduce material costs, and reduce the film pasting steps, improve efficiency, and by using a PI layer instead of another covering layer, the PI layer is subjected to laser windowing treatment, and there is no need to open the window in advance, so as to achieve the effect of production synchronization.

[0012] In a possible implementation manner of the first aspect, exposing the etched surface of the copper substrate to be processed includes:

[0013] Acquire the specification information of the copper substrate to be processed; wherein the specification information is used to reflect the size information and thickness information of the copper substrate to be processed and the position information of the current position of the copper substrate to be processed in the exposure device, and the size information is used to reflect the length and width of the copper substrate to be processed;

[0014] Analyze the specification information to obtain exposure time; wherein the exposure time is used to reflect the opening time of each exposure lamp of the exposure device;

[0015] The exposure device is controlled based on the exposure time to expose the etched surface of the copper substrate to be processed.

[0016] In a possible implementation manner of the first aspect, the analyzing according to the specification information to obtain the exposure time includes:

[0017] Determine a first exposure light sequence according to the size information and the position information of the specification information; wherein the first exposure light sequence is used to reflect the number of exposure lights turned on and the corresponding positions of the exposure devices;

[0018] Analyze the thickness information of the specification information to obtain at least one thickness region group; wherein the thickness region group includes a plurality of thickness regions, the thickness of each position of each thickness region in the thickness region group is within the same preset interval, and the plurality of thickness regions cover all exposure regions of the copper substrate to be processed;

[0019] An exposure time is obtained by analyzing the first exposure light sequence and the thickness region group.

[0020] In a possible implementation manner of the first aspect, the analyzing according to the first exposure light sequence and the thickness region group to obtain the exposure time includes:

[0021] Analyzing the thickness region group to obtain boundary information; wherein the boundary information is used to reflect the boundary line of two adjacent thickness regions;

[0022] Analyze the thickness region group to obtain the regional exposure time; wherein the regional exposure time is used to reflect the exposure time required for each thickness region;

[0023] When the boundary line reflected by the boundary information is not located in the central exposure area of ​​any of the exposure lamps, the exposure time is obtained by analyzing the first exposure light sequence and the regional exposure time; wherein the central exposure area is used to reflect the central area of ​​each of the exposure lamps.

[0024] In a possible implementation manner of the first aspect, the analyzing according to the first exposure light sequence and the thickness region group to obtain the exposure time further includes:

[0025] When the boundary line reflected by the boundary information is located in the central exposure area of ​​any one of the exposure lamps, a thickness difference is calculated; wherein the thickness difference is used to reflect the thickness difference between the boundaries of two adjacent thickness areas where the boundary line is located in the central exposure area of ​​the exposure lamp;

[0026] When the thickness difference is less than a preset threshold, an analysis is performed according to the first exposure light sequence and the regional exposure time to obtain the exposure time.

[0027] In a possible implementation manner of the first aspect, the analyzing according to the first exposure light sequence and the thickness region group to obtain the exposure time further includes:

[0028] When the thickness difference is greater than or equal to the preset threshold, acquiring boundary line position information; wherein the boundary line position information is used to reflect the relative position between the boundary line of two adjacent thickness regions and the first exposure light sequence;

[0029] Analyzing the position information of the boundary line to obtain movement distance information; wherein the movement distance information is used to reflect the distance and movement direction of moving the boundary line to the light-emitting edge of a single exposure lamp in the first exposure lamp sequence; wherein the movement direction includes linear movement and rotational movement in the horizontal direction;

[0030] The control device controls the exposure device to move the copper substrate to be processed based on the moving distance information, and adjusts the first exposure light sequence based on the moving distance information to obtain a second exposure light sequence;

[0031] An exposure time is obtained by analyzing the second exposure light sequence and the regional exposure time.

[0032] In a possible implementation of the first aspect, performing a laser windowing process on the PI layer of the semi-finished copper substrate to obtain a hollow copper substrate includes:

[0033] Acquire etching information; wherein the etching information is used to reflect the etching position and size of the semi-finished copper substrate;

[0034] Analyze the etching information to obtain window information; wherein the window information is used to reflect the number of windows required for the PI layer and the corresponding positions and sizes;

[0035] Analyze the windowing information to obtain windowing path information; wherein the windowing path information is used to reflect the windowing route of the laser device on the PI layer;

[0036] Based on the window opening path information, the laser device is controlled to perform laser window opening processing on the PI layer of the semi-finished copper substrate to obtain a hollow copper substrate.

[0037] In a possible implementation manner of the first aspect, the analyzing according to the windowing information to obtain the windowing path information includes:

[0038] Analyzing the window opening information to obtain a hollowing relationship group; wherein the hollowing relationship group refers to a set including the mutual position relationship between any two holes, which is used to reflect the mutual position of every two hollow holes;

[0039] Analyze according to the hollowing relationship group to obtain the window opening path information.

[0040] In a possible implementation manner of the first aspect, the performing analysis according to the hollowing relationship group to obtain the window opening path information includes:

[0041] Analyze the hollowing relationship group to obtain window opening route group information; wherein the window opening route group information is used to reflect the distance relationship between the two hollowing holes;

[0042] Analyze the window opening route group information to obtain the starting hollowing information; wherein the starting hollowing information is used to reflect the position where the laser window opening is required first;

[0043] Analyze the starting hollowing information and the window opening route group information to obtain the window opening path information.

[0044] In a possible implementation manner of the first aspect, the analyzing according to the window opening route group information to obtain the starting hollowing information includes:

[0045] Sorting according to the windowed route group information to obtain a route sequence;

[0046] Determine a maximum distance according to the distance sequence; wherein the maximum distance is used to reflect the distance between two holes reflected by the distance sequence that is farthest apart;

[0047] Determine two hollowing holes in the maximum distance as starting hollowing information;

[0048] And / or, the analyzing according to the starting hollowing information and the window opening route group information to obtain the window opening path information includes:

[0049] The two hollow holes reflected in the starting hollowing information are used as window opening starting points in turn to perform route simulation, and the route with the shortest distance is screened out to be determined as the window opening path information.

[0050] In the second aspect, an embodiment of the present application provides a hollow finger processing device, including an exposure device, a laser device and a control device, wherein the control device is electrically connected to the exposure device and the laser device, and the control device includes a memory, a processor and a computer program stored in the memory and executable on the processor, and when the processor executes the computer program, the method described in any one of the first aspects is implemented.

[0051] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of the above-mentioned first aspects is implemented.

[0052] In a fourth aspect, an embodiment of the present application provides a computer program product. When the computer program product runs on a hollow finger processing device, the hollow finger processing device executes the hollow finger processing method described in any one of the first aspects above.

[0053] It can be understood that the beneficial effects of the second to fourth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0055] Figure 1 It is a schematic diagram of the process of the hollow finger processing method provided in the embodiment of the present application;

[0056] Figure 2 It is a schematic diagram of the implementation process of step S300 in the hollow finger processing method provided in an embodiment of the present application;

[0057] Figure 3 It is a schematic diagram of the implementation process of step S320 in the hollow finger processing method provided in the embodiment of the present application;

[0058] Figure 4 It is a schematic diagram of the implementation process of step S323 in the hollow finger processing method provided in the embodiment of the present application;

[0059] Figure 5 It is a schematic diagram of the implementation process of step S500 in the hollow finger processing method provided in an embodiment of the present application;

[0060] Figure 6 It is a schematic diagram of the implementation process of step S532 in the hollow finger processing method provided in the embodiment of the present application;

[0061] Figure 7 It is a schematic diagram of the implementation process of step S5322 in the hollow finger processing method provided in the embodiment of the present application;

[0062] Figure 8 It is a structural schematic diagram of the control device of the hollow finger processing equipment provided in an embodiment of the present application. DETAILED DESCRIPTION

[0063] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0064] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0065] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0066] As used in the specification of this application and the appended claims, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting" depending on the context. Similarly, the phrase "if it is determined" or "if the described condition or event is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce the described condition or event is detected" or "in response to detecting the described condition or event" depending on the context.

[0067] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0068] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0069] In the field of circuit boards, "hollow finger processing" usually refers to making specific hollow areas on a circuit board (PCB). These areas may be used to install components such as connectors, slots, heat sinks, or to solve problems such as signal integrity, weight reduction, and material saving. Hollow design is very important in circuit board design and can affect the functionality and reliability of the circuit board.

[0070] In the related art, a cover film with a window is usually attached to one side of the copper substrate, and then a dry film is attached to the other side of the copper layer and the cover film, followed by exposure and etching. After the dry film is stripped, a cover film with a window is attached to the substrate to obtain a hollow copper substrate. This processing method is relatively complicated and has low processing efficiency. In addition, two layers of dry film and two layers of cover film are used, which consumes more materials and has a higher processing cost.

[0071] To solve the above problems, the embodiment of the present application provides a hollow finger processing method. In this method, the PI layer is first covered on the laser surface of the copper substrate; then the dry film is covered on the etching surface of the copper substrate to obtain the copper substrate to be processed; then the etching surface of the copper substrate to be processed is exposed and etched to obtain an etched copper substrate; then the dry film on the etching surface of the etched copper substrate is removed, and the molded covering film is covered on the etching surface to obtain a semi-finished copper substrate; finally, the PI layer of the semi-finished copper substrate is subjected to laser windowing to obtain a hollow copper substrate. Compared with the traditional processing method, this method can save a piece of dry film and a piece of covering film, reduce material costs, and reduce the film pasting steps, improve efficiency, and by using a PI layer instead of another covering layer, the PI layer can also be subjected to laser windowing after the PI layer is attached to the copper substrate, without the need to open the window in advance, achieving the effect of production synchronization.

[0072] The hollow finger processing method provided in the embodiment of the present application can be applied to a hollow finger processing device. At this time, the hollow finger processing device is the executor of the hollow finger processing method provided in the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of the hollow finger processing device.

[0073] For example, the hollow finger processing equipment may include an exposure device, a laser device and a control device, and the control device is electrically connected to the exposure device and the laser device. The exposure device is used to expose the dry film covering the etching surface of the copper substrate so as to perform subsequent etching on the dry film. The exposure device includes a workbench, an exposure lamp group and a mask, wherein the workbench is used to place the copper substrate with the dry film attached. The exposure lamp group is composed of a plurality of exposure lamp units, and each exposure lamp unit can be exposed separately. There is a pre-designed pattern on the mask. During the exposure process, the ultraviolet light emitted by the exposure lamp is irradiated onto the dry film through the mask, so that the dry film in the exposure area undergoes chemical changes and becomes soluble in the developer, while the dry film that has not been exposed will be etched by the etching solution to form a hollow hole. The laser device is used to perform window processing on the PI layer. The laser device includes a control workbench, a laser emitter and a drive device, wherein the control workbench is used to place the semi-finished copper substrate and can control the semi-finished copper substrate to rotate and move in the horizontal direction, that is, it supports X-axis and Y-axis translation and θ-axis rotation. For example, the control workbench can be a combination of a linear slide and a rotating platform, or an air-floating workbench, etc., but is not limited thereto. The laser transmitter is located above the control workbench and is used to laser process the PI layer of the semi-finished copper substrate placed on the control workbench. For example, the laser transmitter can be a CO 2 The driving device is used to drive the laser emitter to move so that the laser emitter performs laser treatment on multiple areas of the PI layer. For example, the driving device can be a combination of a manipulator, a motor and a transmission mechanism, etc., but is not limited thereto. The control device monitors and controls the entire exposure process and the laser treatment process.

[0074] For example, the control device can be a mobile phone, a tablet computer, a wearable device, an augmented reality (AR) / virtual reality (VR) device, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), a desktop computer, a smart large screen, a smart TV and other terminal devices, a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, an Internet of Things terminal, a computer, a laptop computer, a handheld communication device, a handheld computing device, a satellite wireless device, a wireless modem card, etc.

[0075] In order to better understand the hollow finger processing method provided in the embodiment of the present application, the specific implementation process of the hollow finger processing method provided in the embodiment of the present application is exemplarily introduced below.

[0076] Figure 1 A schematic flow chart of a hollow finger processing method provided in an embodiment of the present application is shown, and the hollow finger processing method includes:

[0077] S100, covering the etched surface of the copper substrate with a dry film to obtain a copper substrate to be processed; wherein the laser surface of the copper substrate is provided with a PI layer.

[0078] S200, exposing and etching the etching surface of the copper substrate to be processed to obtain an etched copper substrate.

[0079] S300, removing the dry film on the etched surface of the etched copper substrate, and covering the etched surface with a formed covering film to obtain a semi-finished copper substrate.

[0080] S400, performing laser window opening processing on the PI layer of the semi-finished copper substrate to obtain a hollow copper substrate.

[0081] It can be understood that the PI layer refers to the polyimide layer. Polyimide is a high-performance engineering plastic with many excellent physical and chemical properties, such as high temperature resistance, corrosion resistance, etc. The etching treatment method can be to put the exposed copper substrate into the developer, remove the unexposed dry film, expose the copper layer to be etched, and then put the developed copper substrate into the etching solution to dissolve the copper layer not protected by the dry film to form the required holes; plasma or gas etching technology (such as reactive ion etching, RIE) can also be used to etch the copper layer to be etched, etc., but not limited to this. The dry film on the etched surface can be removed by using a stripping solution or a dedicated removal device.

[0082] With this arrangement, the processing steps are relatively simple, reducing material costs, while also reducing the film-sticking steps and improving processing efficiency.

[0083] In one possible implementation, see Figure 2 In step S200, the etched surface of the copper substrate to be processed is exposed, including:

[0084] S210, obtaining specification information of the copper substrate to be processed; wherein the specification information is used to reflect the size information and thickness information of the copper substrate to be processed and the current position of the copper substrate to be processed in the exposure device, and the size information is used to reflect the length and width of the copper substrate to be processed.

[0085] It is understandable that the specification information can be obtained through devices such as cameras and scanners, or can be manually input after human inspection, etc., but is not limited to this. Thickness information refers to the collection of thicknesses at various locations in the copper substrate to be processed. When producing copper substrates, uneven thickness may occur, and the quality of exposure is related to the thickness of the copper substrate to be processed. Thicker areas of the copper substrate to be processed will make the dry film on the surface closer to the exposure lamp, that is, the exposure intensity will be greater, and the degree of cross-linking between the dry film and the copper substrate depends on the illumination time and intensity. In the case of uneven board thickness, some thicker areas may receive too much light energy, resulting in excessive cross-linking; while some thinner areas may not receive enough light energy, resulting in insufficient cross-linking.

[0086] S220, analyzing the specification information to obtain exposure time; wherein the exposure time is used to reflect the opening time of each exposure lamp of the exposure device.

[0087] It can be understood that each exposure lamp can expose an area of ​​the copper substrate to be processed, and the exposure lamp group composed of the exposure lamps can cover all areas of the surface of the copper substrate to be processed. Exemplarily, the number and position of the exposure lamps to be turned on can be determined by the size information, and the exposure time of each exposure lamp can be determined by the thickness information; the specification information can also be input into the learning model, and the learning model outputs the number and corresponding position of the exposure lamp group turned on and the turn-on time of each exposure lamp, etc., but is not limited to this. The learning model is trained by multiple sets of training data, and each set of training data in the multiple sets of training data includes specification information and the number of exposure lamp groups turned on and the corresponding turn-on time.

[0088] In one possible implementation, see Figure 3 In step S220, the exposure time is obtained by analyzing the specification information, including:

[0089] S221, determining a first exposure light sequence according to the size information and the position information of the specification information; wherein the first exposure light sequence is used to reflect the number of exposure lights turned on and the corresponding positions of the exposure devices.

[0090] It can be understood that the exposure lamps are turned on in accordance with the covering principle, that is, the turned-on exposure lamps completely cover the entire surface of the copper substrate to be processed, and each exposure lamp is responsible for exposing different areas or ranges. Exemplarily, the number of exposure lamps turned on along the length direction of the copper substrate to be processed can be determined based on the length direction of the copper substrate to be processed reflected by the size information and the current position. For example, if a total of 10 exposure lamps are required for exposure of the copper substrate to be processed at the current position, the number of exposure lamps turned on along the length direction of the copper substrate to be processed is 10. If a total of 10 exposure lamps are required for exposure of the copper substrate to be processed at the current position, there are two situations. The first situation is that the exposure edges of the exposure lamps at both ends of the 10 exposure lamps just coincide with the edge positions of the length direction of the copper substrate to be processed, that is, the exposure length of the 10 exposure lamps along the length direction of the copper substrate to be processed just completely covers the length of the copper substrate to be processed at the current position; the second situation is The exposure edge of at least one of the two end exposure lamps of the 10 exposure lamps exceeds the edge of the length direction of the copper substrate to be processed, that is, the exposure area of ​​at least one end of the exposure lamp is partially on the copper substrate to be processed and partially outside the copper substrate to be processed. In this case, the exposure lamp still needs to be turned on. The number of exposure lamps turned on along the length direction of the copper substrate to be processed is determined according to the width direction of the copper substrate to be processed reflected by the size information and the current position, which is similar to the situation in the length direction of the copper substrate to be processed. Finally, according to the number of exposure lamps turned on = the number of exposure lamps turned on along the length direction of the copper substrate to be processed × the number of exposure lamps turned on along the width direction of the copper substrate to be processed, the number of exposure lamps that need to be turned on is obtained. For example, if the number of exposure lamps turned on along the length direction of the copper substrate is 14 and the number of exposure lamps turned on along the width direction of the copper substrate is 10, then the number of exposure lamps that need to be turned on is 140, and so on. Then, the current position of the copper substrate is used for positioning, and the number of exposure lights that need to be turned on is matched one by one through the position; the size information and position information can also be input into the learning model, and the learning model outputs the corresponding first exposure light sequence, etc., but not limited to this.

[0091] S222, analyzing the thickness information of the specification information to obtain at least one thickness region group; wherein the thickness region group includes multiple thickness regions, the thickness of each position of each thickness region in the thickness region group is within the same preset range, and the multiple thickness regions cover all exposure areas of the copper substrate to be processed.

[0092] It can be understood that the preset interval refers to a preset thickness interval, and the preset interval can be manually input by humans, or can be obtained from an exposure database, etc., but is not limited thereto. The exposure database refers to a database containing all preset intervals, and these data can be obtained through laboratory experiments, on-site measurements and monitoring, and past experience. After obtaining, the collected data is sorted, classified and archived, useful information and rules are extracted, and the relevant data is saved in the database to form an exposure database. Exemplarily, assuming that the preset intervals include 4.80-4.85mm, 4.86-4.90mm, 4.91-4.95mm, 4.96-5.00mm, 5.01-5.05mm, and 5.06-5.10mm, if the thickness reflected by the thickness information in the exposure area of ​​the copper substrate to be processed includes multiple 5.02mm, multiple 5.00mm, multiple 4.95mm, and multiple 5.03mm, etc., first determine the continuous areas with the same thickness value in the copper substrate to be processed as one thickness area, for example, if all position areas with a thickness of 5.02mm are continuous, then all positions with a thickness of 5.02mm are determined as one thickness area, if a part of the position areas with a thickness of 5.02mm are continuous, and the remaining part is continuous and discontinuous with the previous part of the continuous area, then the position with a thickness of 5.02mm is determined as two thickness areas, and these two thickness areas are the same thickness area group, and so on. If the analysis shows that the thickness of region A is 5.02 mm, the thickness of region B is 5.00 mm, the thickness of region C is 4.95 mm, and the thickness of region D is 5.03 mm, then regions A and D are in the same thickness region group, regions B and C are in different thickness region groups, and so on.

[0093] S223, analyzing according to the first exposure light sequence and the thickness region group to obtain exposure time.

[0094] It can be understood that different thickness region groups correspond to an exposure time. For example, the corresponding exposure time can be obtained through the thickness region group corresponding to each thickness region, and then the exposure time of each exposure lamp can be matched according to the location of each thickness region; or the first exposure sequence and the thickness region group can be input into the learning model, and the learning model inputs the corresponding exposure time, etc., but it is not limited thereto.

[0095] With this arrangement, the exposure time of each exposure lamp is controlled by analyzing the thickness, so that the copper substrate in different thickness areas can receive appropriate light energy during the exposure process, thereby improving the consistency and accuracy of exposure, reducing overexposure or underexposure problems caused by uneven board thickness, and thus improving the quality of the final product and production efficiency.

[0096] In one possible implementation, see Figure 4In step S223, the exposure time is obtained by analyzing the first exposure light sequence and the thickness region group, including:

[0097] S2231, analyzing the thickness region group to obtain boundary information; wherein the boundary information is used to reflect the boundary line between two adjacent thickness regions.

[0098] Exemplarily, each thickness area of ​​the thickness area group can be marked point by point, and then whether the thickness of two adjacent coordinate points is in the same preset interval can be judged according to the thickness value of the marked coordinate point. If they are not in the same preset interval, the two coordinate points are marked as boundary points. If they are in the same preset interval, they are not marked, and each adjacent boundary point is connected in sequence to obtain boundary information; it is also possible to directly generate block areas for each thickness area of ​​the thickness area group, define a virtual boundary line between adjacent block areas, and so on, but not limited to this.

[0099] S2232, analyzing the thickness region group to obtain the regional exposure time; wherein the regional exposure time is used to reflect the exposure time required for each thickness region.

[0100] It is understood that the regional exposure time can be obtained by matching the thickness regional group with the corresponding exposure time in the exposure database; the thickness regional group can also be input into the learning model, and the learning model outputs the corresponding regional exposure time, etc., but is not limited thereto. The exposure database also includes different thickness regions and corresponding exposure times.

[0101] S2233a, when the boundary line reflected by the boundary information is not located in the central exposure area of ​​any exposure light, analyzing is performed according to the first exposure light sequence and the regional exposure time to obtain the exposure time; wherein the central exposure area is used to reflect the central area of ​​each exposure light.

[0102] It can be understood that the central area refers to the area in the exposure area of ​​the exposure lamp extending from the exposure center to the surrounding preset range. The preset range is a pre-set value, which can be manually input or obtained from the exposure database, etc., but not limited thereto. The exposure range of a single exposure lamp is an exposure unit. When the boundary lines reflected by the boundary information are not located in the central area of ​​any exposure lamp, it means that all exposure lamps have not uniformly irradiated the areas on both sides of the boundary line. At this time, the exposure range of the thickness area on both sides of the boundary line of the exposure lamp is larger, and the exposure time of the exposure lamp corresponds to the thickness area with larger exposure range. The exposure time of each exposure lamp located on the boundary line but not located in the central exposure area can be obtained by analyzing the thickness area corresponding to each exposure lamp located on the boundary line in sequence, that is, the exposure time required for the corresponding exposure lamp in the first exposure lamp sequence is determined according to the thickness area reflected by the regional exposure time.

[0103] In one possible implementation, see Figure 4 In step S223, analyzing the first exposure light sequence and the thickness region group to obtain the exposure time also includes:

[0104] S2233b, when the boundary line reflected by the boundary information is located in the central exposure area of ​​the exposure lamp, calculate the thickness difference; wherein the thickness difference is used to reflect the thickness difference between the boundaries of two adjacent thickness areas.

[0105] It can be understood that the thickness difference on both sides of the boundary can be obtained according to the preset distance, that is, the thickness at the preset distances on both sides of the boundary is respectively used as the thickness of the boundary of two adjacent thickness regions, and then the difference between the two thicknesses is calculated, which is the thickness difference. The preset distance is a preset value, which can be manually input by humans, or obtained from an exposure database, etc., but is not limited thereto.

[0106] S22331b, when the thickness difference is less than a preset threshold, analyze according to the first exposure light sequence and the regional exposure time to obtain the exposure time.

[0107] It can be understood that the preset thickness value of the preset threshold can be manually input or obtained from the exposure database, etc., but is not limited thereto. When the thickness difference is less than the preset threshold, it means that the thickness difference near the boundary is not large. Even if the boundary line is located at the exposure center of a certain exposure lamp, there is no need to expose the area near the boundary line for different times, thereby improving the exposure efficiency. The exposure time of each exposure lamp can be obtained in a similar manner to the exposure time of each exposure lamp in step S2233a. When the exposure center area of ​​a certain exposure lamp is located at a certain boundary line, the average thickness value can be obtained based on the average thickness of the thickness areas on both sides of the boundary line. The exposure time corresponding to the exposure database is matched according to the average thickness value, which is the exposure time of the exposure lamp. The exposure time corresponding to the larger thickness value or the smaller thickness value corresponding to the thickness areas on both sides of the boundary line can also be determined as the exposure time of the exposure, etc.

[0108] In one possible implementation, see Figure 4 In step S223, analyzing the first exposure light sequence and the thickness region group to obtain the exposure time also includes:

[0109] S22331a, when the thickness difference is greater than or equal to a preset threshold, obtaining boundary line position information; wherein the boundary line position information is used to reflect the relative position between the boundary line of two adjacent thickness areas and the first exposure light sequence.

[0110] It can be understood that when the thickness difference is greater than or equal to the preset threshold, it means that the thickness difference near the boundary is large, and at this time, the position relationship between the positions of all boundary lines and the positions of all exposure lights reflected by the first exposure light sequence is obtained. Exemplarily, the position coordinates of the boundary lines can be homologously mapped with the position coordinates of the first exposure light sequence to obtain the boundary line position information.

[0111] S22332a, analyze according to the boundary line position information to obtain the moving distance information; wherein the moving distance information is used to reflect the distance and moving direction of moving the boundary line to the light-emitting edge of a single exposure light in the first exposure light sequence; wherein the moving direction includes linear movement and rotational movement in the horizontal direction.

[0112] It can be understood that the area exposed by each exposure lamp and the boundary coordinates of each exposure area can be obtained according to the position of the first exposure lamp sequence, and the coordinate position of the thickness area in the boundary line position information is traversed and moved until the coordinate position of the boundary of the thickness area coincides with the boundary coordinates of the exposure area of ​​each exposure lamp or is less than the preset coincidence distance. At this time, the movement trajectory of each coordinate position of the thickness area is the movement distance information. The preset coincidence distance refers to the distance between the coordinate position of the boundary of the thickness area and the boundary coordinates of the exposure area of ​​each exposure lamp after the movement. It is a preset value, which can be manually input by humans or obtained from the exposure database, etc., but is not limited thereto.

[0113] S22333a, the control device controls the exposure device to move the copper substrate to be processed based on the moving distance information, and adjusts the first exposure light sequence based on the moving distance information to obtain the second exposure light sequence.

[0114] It can be understood that the second exposure light sequence refers to the number of exposure lights that need to be turned on and the corresponding positions of the exposure light group after the copper substrate to be processed is moved. The number of exposure lights reflected in the first exposure light sequence that needs to be increased and decreased can be determined according to the moving direction reflected by the moving distance information, and then the number of exposure lights reflected in the first exposure light sequence is increased in the same direction and decreased in the opposite direction according to the moving distance reflected by the moving distance information, so as to obtain the number of exposure lights and the corresponding positions of the second exposure light sequence.

[0115] S22334a, analyzing according to the second exposure light sequence and the regional exposure time to obtain the exposure time.

[0116] It can be understood that after the copper substrate to be processed is moved, the position of its thickness area undergoes the same change. The exposure time can be obtained according to the first exposure light sequence and the regional exposure time in a similar manner as in step S2233a and step S22331b. The corresponding exposure light in the second exposure light sequence is found according to the position information of the thickness area, and the exposure time of each exposure light in the corresponding second exposure light sequence is obtained according to the regional exposure time corresponding to each thickness area.

[0117] With such settings, boundary information extraction, regional exposure time determination, boundary line and exposure lamp position relationship analysis, thickness difference calculation, and movement distance information acquisition and application, this solution can significantly improve the accuracy and consistency of exposure during PCB manufacturing, and ensure that the transition area between different thickness areas can obtain appropriate exposure processing. Specifically, by generating boundary information by point-by-point marking or mapping of the thickness area group, and judging the thickness difference in combination with a preset threshold, the system can dynamically adjust the exposure parameters when the boundary line is not located at the center of the exposure lamp, and simplify the exposure process to improve efficiency when the thickness difference is small. In addition, by obtaining the boundary line position information and calculating the movement distance, the control device can accurately adjust the position of the copper substrate to be processed and generate a second exposure lamp sequence, thereby ensuring that each thickness area can receive the most appropriate light energy. This method not only enhances the flexibility and adaptability of the process, but also effectively reduces the risk of overexposure or underexposure, and improves the quality and production efficiency of the final product.

[0118] S230, controlling the exposure device to expose the etched surface of the copper substrate to be processed based on the exposure time.

[0119] This setting obtains the specification information (including size and thickness) of the copper substrate to be processed, and accurately analyzes the opening time of each exposure lamp based on this information, thereby ensuring that each area can receive the most appropriate exposure treatment. This setting not only improves the consistency and accuracy of exposure, reduces the problem of overexposure or underexposure caused by uneven board thickness, but also enhances the flexibility and adaptability of the process, and improves the quality and production efficiency of the final product.

[0120] In one possible implementation, see Figure 5 In step S400, the PI layer of the semi-finished copper substrate is subjected to laser windowing to obtain a hollow copper substrate, including:

[0121] S410, obtaining etching information; wherein the etching information is used to reflect the etching position and size of the semi-finished copper substrate.

[0122] It is understandable that the semi-finished copper substrate can be imaged by a camera or other imaging device, and the etching information can be obtained by analyzing the image, or it can be manually input by a person, etc., but it is not limited thereto.

[0123] S420, analyzing the etching information to obtain window information; wherein the window information is used to reflect the number of windows required for the PI layer and the corresponding positions and sizes.

[0124] It can be understood that the number, position and size of the windows required to be opened in the PI layer correspond to the etching information.

[0125] S430, analyzing the windowing information to obtain windowing path information; wherein the windowing path information is used to reflect the windowing route of the laser device on the PI layer.

[0126] It can be understood that the windowing route of the PI layer reflects the windowing sequence of each position that needs to be windowed. Exemplarily, the position that needs to be windowed first can be determined based on the relationship between each position that needs to be windowed, and then the windowing path information can be determined based on the distance between the position that needs to be windowed first and other main windowing locations; the windowing information can also be input into a learning model, and the learning model then outputs the corresponding windowing path information, etc., but is not limited thereto.

[0127] In a possible implementation, in step S430, analyzing the windowing information to obtain the windowing path information includes:

[0128] S431, analyzing according to the window opening information to obtain a hollowing relationship group; wherein the hollowing relationship group refers to a set including the relative position relationship between any two holes, which is used to reflect the relative position of every two hollow holes.

[0129] It can be understood that the position coordinates of all the holes can be extracted from the window opening information, and the relative distance between the centers of every two holes can be calculated while connecting every two centers in sequence to form a matrix or graph structure to represent the relative position relationship between the holes.

[0130] S432, analyzing according to the hollowing relationship group to obtain window opening path information.

[0131] Exemplarily, the actual distance between the hollow holes can be calculated through the positions between the hollow holes reflected by the hollow relationship group, that is, the moving distance of the laser emitter from one hollow hole to another, and then the most optimal route analysis is performed through each moving distance to obtain the window opening path information; the hollow relationship group can also be input into the learning model, and the learning model then outputs the corresponding window opening path information, and so on, but not limited to this.

[0132] In one possible implementation, see Figure 6 In step S432, the window opening path information is obtained by analyzing the hollowing relationship group, including:

[0133] S4321, analyzing the hollowing relationship group to obtain window opening route group information; wherein the window opening route group information is used to reflect the distance relationship between two hollowing holes.

[0134] It can be understood that the window opening route group information includes the shortest moving route between any two hollow holes, that is, the window opening route group information reflects all possible moving routes for opening windows at all positions where windows are required. Through all the connecting line segments connecting every two hole centers reflected in the hollow relationship group, each hole center can be simulated as a window opening route through the connecting line segments. After passing through each hole center in turn, the covered connecting line segments are a window opening route. All the connecting line segments are arranged and combined, and the window opening routes obtained after passing through all the hole centers are collectively counted, which is the window opening route group information.

[0135] S4322, analyzing the window opening route group information to obtain the starting hollowing information; wherein the starting hollowing information is used to reflect the position where the laser window opening is required first.

[0136] Exemplarily, the window opening route group information can be sorted to determine the two hollow positions with the farthest distance from each other, and any one of these two hollow positions can be used as the starting hollow information; the window opening route group information can also be input into the learning model, and the learning model then outputs the corresponding starting hollow information, and so on, but is not limited to this.

[0137] In one possible implementation, see Figure 7 In step S4322, the window opening route group information is analyzed to obtain the starting hollowing information, including:

[0138] S43221, sorting according to the windowed route group information to obtain a route sequence.

[0139] It can be understood that a sorting algorithm (such as quick sort, merge sort) can be used to sort the distances between all two holes by size to obtain a distance sequence.

[0140] S43222, determining a maximum distance according to the distance sequence; wherein the maximum distance is used to reflect the longest distance between two hollow holes reflected by the distance sequence.

[0141] It can be understood that if the distance sequence is in order, the first order bit is determined as the maximum distance, and if the distance sequence is in reverse order, the last order bit is determined as the maximum distance.

[0142] S43223, determine the two hollowing holes in the maximum distance as the starting hollowing information.

[0143] It can be understood that determining the two hollowing holes in the maximum distance as the starting hollowing information means determining the position of any one of the two hollowing holes in the maximum distance as the starting hollowing information.

[0144] With this setting, the sorting algorithm is used to ensure the efficiency and accuracy of path selection. Selecting the two farthest holes as the starting points reduces the total stroke of the laser head in the entire window opening process, reduces unnecessary movement and cutting time, and thus improves the efficiency and accuracy of the window opening process.

[0145] S4323, analyzing the starting hollowing information and the window opening route group information to obtain the window opening path information.

[0146] It can be understood that after determining the starting hollowing position, the window opening route group can be arbitrarily combined through the starting position to obtain multiple window opening paths, each window opening path contains all the positions where windows need to be opened, and then the multiple window opening paths are screened to obtain the optimal window opening path, and it is determined as the window opening path information; the starting hollowing information and the window opening route group information can also be input into the learning model, and the learning model then outputs the corresponding window opening path information, and so on, but not limited to this.

[0147] In a possible implementation, in step S4323, analysis is performed based on the starting hollowing information and the window opening route group information to obtain the window opening path information, including:

[0148] The two hollow holes reflected in the starting hollowing information are used as the window opening starting points in turn to perform route simulation, and the route with the shortest distance is selected to determine as the window opening path information.

[0149] It can be understood that the two holes reflected in the starting hollowing information can be traversed and simulated based on the window opening route group to obtain multiple routes, and then the total moving distance of each route is calculated respectively, and the route corresponding to the shortest total moving distance is determined as the window opening path information.

[0150] S440, based on the window opening path information, controlling the laser device to perform laser window opening processing on the PI layer of the semi-finished copper substrate to obtain a hollow copper substrate.

[0151] With this setting, the entire process from obtaining etching information to finally controlling the laser device for window opening processing is highly automated and intelligent, so that the position and size of each hollow hole can accurately match the design requirements. Through detailed analysis of the hollowing relationship group and window opening route group information, the two farthest hollow holes are selected as the starting points, and the shortest window opening path is screened out, which effectively reduces the total stroke of the laser head and unnecessary movement time, and improves the speed and quality of window opening processing. This setting not only enhances the flexibility and adaptability of the process, and is suitable for complex and changing manufacturing needs, but also greatly reduces production costs, improves production efficiency and product quality, and improves consistency and high-precision laser window opening effects.

[0152] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0153] An embodiment of the present application also provides a hollow finger processing device, including an exposure device, a laser device and a control device, and the control device is electrically connected to the exposure device and the laser device. Figure 8 This is a schematic diagram of the structure of a control device 6 provided in an embodiment of the present application. Figure 8 As shown, the control device 6 of this embodiment includes: at least one processor 60 ( Figure 8 Only one is shown), at least one memory 61 ( Figure 8 Only one is shown) and a computer program 62 stored in the at least one memory 61 and executable on the at least one processor 60. When the processor 60 executes the computer program 62, the control device 6 implements the steps in any of the above-mentioned embodiments of the hollow finger processing method.

[0154] Exemplarily, the computer program 62 may be divided into one or more modules / units, which are stored in the memory 61 and executed by the processor 60 to complete the present application. The one or more modules / units may be a series of computer program instruction segments capable of completing specific functions, which are used to describe the execution process of the computer program 62 in the control device 6.

[0155] The control device 6 can be a computing device such as a desktop computer, a notebook, a PDA, a cloud server, etc. The hollow finger processing device can include, but is not limited to, a processor 60 and a memory 61. Those skilled in the art can understand that Figure 8It is only an example of the control device 6 and does not constitute a limitation on the control device 6. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, buses, etc.

[0156] The processor 60 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0157] In some embodiments, the memory 61 may be an internal storage unit of the control device 6, such as a hard disk or memory of the control device 6. In other embodiments, the memory 61 may also be an external storage device of the control device 6, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the control device 6. Further, the memory 61 may also include both an internal storage unit and an external storage device of the control device 6. The memory 61 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of the computer program. The memory 61 may also be used to temporarily store data that has been output or is to be output.

[0158] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0159] An embodiment of the present application provides a computer program product. When the computer program product runs on a hollow finger processing device, the hollow finger processing device implements the steps in any of the above-mentioned method embodiments.

[0160] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device that can carry the computer program code to the hollow finger processing equipment, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a disk or an optical disk.

[0161] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0162] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0163] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for processing a hollow finger, characterized in that: include: Covering the etched surface of the copper substrate with a dry film to obtain a copper substrate to be processed; wherein the laser surface of the copper substrate is provided with a PI layer; Exposing and etching the etched surface of the copper substrate to be processed to obtain an etched copper substrate; removing the dry film on the etched surface of the etched copper substrate, and covering the etched surface with a formed covering film to obtain a semi-finished copper substrate; The PI layer of the semi-finished copper substrate is subjected to laser window opening treatment to obtain a hollow copper substrate.

2. The hollow finger processing method according to claim 1, characterized in that: Exposing the etched surface of the copper substrate to be processed comprises: Acquire the specification information of the copper substrate to be processed; wherein the specification information is used to reflect the size information and thickness information of the copper substrate to be processed and the position information of the current position of the copper substrate to be processed in the exposure device, and the size information is used to reflect the length and width of the copper substrate to be processed; Analyze the specification information to obtain exposure time; wherein the exposure time is used to reflect the opening time of each exposure lamp of the exposure device; The exposure device is controlled based on the exposure time to expose the etched surface of the copper substrate to be processed.

3. The hollow finger processing method according to claim 2, characterized in that: The analyzing according to the specification information to obtain the exposure time includes: Determine a first exposure light sequence according to the size information and the position information of the specification information; wherein the first exposure light sequence is used to reflect the number of exposure lights turned on and the corresponding positions of the exposure devices; Analyze the thickness information of the specification information to obtain at least one thickness region group; wherein the thickness region group includes a plurality of thickness regions, the thickness of each position of each thickness region in the thickness region group is within the same preset interval, and the plurality of thickness regions cover all exposure regions of the copper substrate to be processed; The exposure time is obtained by analyzing the first exposure light sequence and the thickness region group.

4. The hollow finger processing method according to claim 3, characterized in that: The step of analyzing the first exposure light sequence and the thickness region group to obtain the exposure time includes: Analyzing the thickness region group to obtain boundary information; wherein the boundary information is used to reflect the boundary line of two adjacent thickness regions; Analyze the thickness region group to obtain the regional exposure time; wherein the regional exposure time is used to reflect the exposure time required for each thickness region; When the boundary line reflected by the boundary information is not located in the central exposure area of ​​any of the exposure lamps, the exposure time is obtained by analyzing the first exposure light sequence and the regional exposure time; wherein the central exposure area is used to reflect the central area of ​​each of the exposure lamps.

5. The hollow finger processing method according to claim 4, characterized in that: The step of analyzing the first exposure light sequence and the thickness region group to obtain the exposure time further includes: When the boundary line reflected by the boundary information is located in the central exposure area of ​​any one of the exposure lamps, a thickness difference is calculated; wherein the thickness difference is used to reflect the thickness difference between the boundaries of two adjacent thickness areas where the boundary line is located in the central exposure area of ​​the exposure lamp; When the thickness difference is less than a preset threshold, an analysis is performed according to the first exposure light sequence and the regional exposure time to obtain the exposure time.

6. The hollow finger processing method according to claim 5, characterized in that: The step of analyzing the first exposure light sequence and the thickness region group to obtain the exposure time further includes: When the thickness difference is greater than or equal to the preset threshold, acquiring boundary line position information; wherein the boundary line position information is used to reflect the relative position between the boundary line of two adjacent thickness regions and the first exposure light sequence; Analyzing the position information of the boundary line to obtain movement distance information; wherein the movement distance information is used to reflect the distance and movement direction of moving the boundary line to the light-emitting edge of a single exposure lamp in the first exposure lamp sequence; wherein the movement direction includes linear movement and rotational movement in the horizontal direction; The control device controls the exposure device to move the copper substrate to be processed based on the moving distance information, and adjusts the first exposure light sequence based on the moving distance information to obtain a second exposure light sequence; An exposure time is obtained by analyzing the second exposure light sequence and the regional exposure time.

7. The hollow finger processing method according to claim 1, characterized in that: The step of performing laser window opening processing on the PI layer of the semi-finished copper substrate to obtain a hollow copper substrate comprises: Acquire etching information; wherein the etching information is used to reflect the etching position and size of the semi-finished copper substrate; Analyze the etching information to obtain window information; wherein the window information is used to reflect the number of windows required for the PI layer and the corresponding positions and sizes; Analyze the windowing information to obtain windowing path information; wherein the windowing path information is used to reflect the windowing route of the laser device on the PI layer; Based on the window opening path information, the laser device is controlled to perform laser window opening processing on the PI layer of the semi-finished copper substrate to obtain a hollow copper substrate.

8. The hollow finger processing method according to claim 7, characterized in that: The analyzing according to the windowing information to obtain the windowing path information includes: Analyzing the window opening information to obtain a hollowing relationship group; wherein the hollowing relationship group refers to a set including the mutual position relationship between any two holes, which is used to reflect the mutual position of every two hollow holes; Analyze according to the hollowing relationship group to obtain the window opening path information.

9. The hollow finger processing method according to claim 8, characterized in that: The step of analyzing the hollowing relationship group to obtain the window opening path information includes: Analyze the hollowing relationship group to obtain window opening route group information; wherein the window opening route group information is used to reflect the distance relationship between the two hollowing holes; Analyze the window opening route group information to obtain the starting hollowing information; wherein the starting hollowing information is used to reflect the position where the laser window opening is required first; Analyze the starting hollowing information and the window opening route group information to obtain the window opening path information.

10. The hollow finger processing method according to claim 9, characterized in that: The analyzing according to the window opening route group information to obtain the starting hollowing information includes: Sorting according to the windowed route group information to obtain a route sequence; Determine a maximum distance according to the distance sequence; wherein the maximum distance is used to reflect the distance between two holes reflected by the distance sequence that is farthest apart; Determine two hollowing holes in the maximum distance as starting hollowing information; And / or, the analyzing according to the starting hollowing information and the window opening route group information to obtain the window opening path information includes: The two hollow holes reflected in the starting hollowing information are used as window opening starting points in turn to perform route simulation, and the route with the shortest distance is screened out to be determined as the window opening path information.

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