Baking device used in wafer packaging and method thereof

Abstract

The baking device comprises a machine body, a baking chamber is arranged at the upper end of the machine body, a machine cover for covering the baking chamber is further hinged to the upper end of the machine body, a carrier plate capable of being taken out is arranged in the baking chamber, a plurality of placing openings matched with wafers and a plurality of vertical hollow holes are formed in the carrier plate, and the hollow holes are communicated with the machine body. The carrying disc and the bottom of the baking chamber are arranged at intervals. A heating cavity is formed in the machine cover, a heating wire is arranged in the heating cavity, the heating cavity is communicated with the baking chamber, an air inlet communicated with the heating cavity is formed in the upper end of the machine cover, an air exhaust cavity communicated with the baking chamber is formed in the machine body, the air exhaust cavity is connected with a fan box, a fan assembly is arranged in the fan box, and the fan box is communicated with an air outlet formed outside the machine body. The air outlet is connected with the air inlet through the hose, energy consumption is reduced, and energy is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a baking device and method used in chip packaging. Background Art

[0002] After the wafer is packaged, it is necessary to print information such as text and patterns on the package shell, usually with white ink. After printing, it is necessary to wait for the ink to dry before testing and packaging can be carried out. In order to speed up work efficiency and reduce online waiting, the wafer is usually sent to a baking oven to quickly dry the ink, and in order to increase the drying speed, hot air is blown. However, the baking oven in the prior art constantly draws air from the environment, heats it, blows it toward the wafer, and then discharges the hot air. This method requires a continuous intake of new air, so it maintains high power heating and high energy consumption. Summary of the invention

[0003] In order to solve the above-mentioned deficiencies in the prior art, the present invention provides a baking device and method for chip packaging.

[0004] In order to achieve the above technical effects, the present invention adopts the following scheme:

[0005] A baking device and method for wafer packaging, comprising a body, a baking chamber is provided at the upper end of the body, a cover for covering the baking chamber is hingedly provided at the upper end of the body, a removable carrier is provided in the baking chamber, a plurality of placement openings matching the wafers and a plurality of vertical hollow holes are provided on the carrier, and the carrier is spaced apart from the bottom of the baking chamber;

[0006] A heating chamber is provided in the machine cover, a heating wire is provided in the heating chamber, the heating chamber is connected to the baking chamber, an air inlet connected to the heating chamber is provided at the upper end of the machine cover, an exhaust chamber connected to the baking chamber is provided in the machine body, the exhaust chamber is connected to a fan box, a fan assembly is provided in the fan box, the fan box is connected to an air outlet provided outside the machine body, and the air outlet is connected to the air inlet through a hose.

[0007] A preferred technical solution is that the air inlet is arranged corresponding to the center of the heating chamber, the heating chamber is connected to the baking chamber through a plurality of blowing holes, the blowing holes are located above the baking chamber, the baking chamber is connected to the exhaust chamber through a plurality of exhaust holes, and the plurality of exhaust holes are arranged at the bottom of the baking chamber.

[0008] According to a preferred technical solution, the diameters of the plurality of blowing holes gradually increase from the blowing hole located in the center toward the blowing holes on the surrounding sides.

[0009] According to a preferred technical solution, a heat insulating layer is provided on the inner wall of the heating chamber, and the heat insulating layer comprises a heat insulating cotton layer.

[0010] According to a preferred technical solution, a support platform is provided on the inner wall of the baking chamber, and the carrier plate is placed on the support platform and spaced apart from the bottom of the baking chamber.

[0011] According to a preferred technical solution, handles are provided on both sides of the carrier.

[0012] A baking method for chip packaging includes placing a plurality of packaged and ink-sprayed chips one by one in a placement opening of a carrier plate, laying them flat and neat, placing the carrier plate into a baking chamber at the upper end of a machine body, closing the machine cover, starting a heating wire to start heating, and then starting a fan assembly to form a circulating airflow, blowing hot air into the baking chamber to dry the ink on the surface of the chips, the heating temperature of the heating wire is 55-70°C, and the wind speed is 3.4-5.4m / s.

[0013] Compared with the prior art, the beneficial effects are:

[0014] The present invention has a simple structure and is easy to use. After a carrier plate with wafers is placed in a baking chamber, the machine cover is closed, and the fan assembly is started. The baking chamber, the exhaust chamber, the fan box, and the heating chamber are connected to form a circulating airflow loop. After the heating wire heats the temperature of the circulating air to a set temperature, since no cold air is added, the heating wire only needs to maintain the temperature at a low power, thereby reducing energy consumption and saving energy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a cross-sectional schematic diagram of the hot baking state of the present invention.

[0016] Figure 2 It is a cross-sectional schematic diagram of the machine cover in the open state in the present invention.

[0017] Figure numerals: 1. machine body; 2. baking chamber; 3. machine cover; 4. support table; 5. carrier plate; 6. placement opening; 7. hollow hole; 8. handle; 9. heating chamber; 10. heating wire; 11. blowing hole; 12. air inlet; 13. exhaust chamber; 14. exhaust hole; 15. fan box; 16. fan assembly; 17. air outlet. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0019] A baking device and method for wafer packaging, comprising a body 1, a baking chamber 2 facing downward is opened at the upper end of the body 1, a cover 3 for covering the baking chamber 2 is hingedly provided at the upper end of the body 1, a removable carrier 5 is provided in the baking chamber 2, a plurality of placement openings 6 matching the wafers are provided on the carrier 5, a plurality of vertical hollow holes 7 are provided on the carrier 5, the carrier 5 is spaced apart from the bottom of the baking chamber 2, a heating chamber 9 is provided in the cover 3, a heating wire 10 is provided in the heating chamber 9, the heating chamber 9 is communicated with the baking chamber 2, an air inlet 12 communicated with the heating chamber 9 is provided at the upper end of the cover 3, an exhaust chamber 13 communicated with the baking chamber 2 is provided in the body 1, a fan box 15 is connected to the exhaust chamber 13, a fan assembly 16 is provided in the fan box 15, the fan box 15 is communicated with an air outlet 17 arranged outside the body 1, and the air outlet 17 is connected to the air inlet 12 through a hose.

[0020] After placing the carrier 5 with the wafers into the baking chamber 2, the machine cover 3 is closed, and the fan assembly 16 is started. The baking chamber 2, the exhaust chamber 13, the fan box 15 and the heating chamber 9 are connected to form a circulating airflow circuit. After the heating wire 10 heats the temperature of the circulating air to the set temperature, since no cold air is added, the heating wire 10 only needs to maintain the temperature at a low power, thereby reducing energy consumption and saving energy.

[0021] First, place several packaged and ink-sprayed wafers one by one in the placement port of the carrier, and after laying them flat, put the carrier into the baking chamber at the upper end of the machine body, then cover the machine, start the heating wire to start heating, and then start the fan assembly to form a circulating airflow, and blow hot air into the baking chamber to dry the ink on the surface of the wafer. The heating temperature of the heating wire is 55-70°C, and the wind speed is 3.4-5.4m / s.

[0022] A preferred technical solution is that the air inlet 12 is arranged at the center of the heating chamber 9, the heating chamber 9 is connected with the baking chamber 2 through a plurality of blowing holes 11, the blowing holes 11 are located above the baking chamber 2, the baking chamber 2 is connected with the exhaust chamber 13 through a plurality of exhaust holes 14, and the plurality of exhaust holes 14 are arranged at the bottom of the baking chamber 2.

[0023] Hot air is blown into the baking chamber 2 from the top and discharged from the bottom of the baking chamber 2, thereby forming a hot air flow that vertically passes through the carrier plate 5, and the hot air can be directly blown onto the surface of the wafer for drying.

[0024] According to a preferred technical solution, the diameters of the plurality of blowing holes 11 gradually increase from the blowing hole 11 located in the center toward the blowing holes 11 located at the surrounding areas.

[0025] Since the air inlet 12 corresponds to the center of the heating chamber 9, the incoming air is mainly concentrated in the middle of the heating chamber 9 and gradually decreases toward the surroundings. Therefore, the aperture of the blowing hole 11 gradually increases from the center to the surroundings, which can balance the wind flux everywhere and try to make the hot air in various places in the baking chamber 2 balanced.

[0026] In a preferred technical solution, a heat insulation layer is provided on the inner wall of the heating chamber 9, and the heat insulation layer includes a heat insulation cotton layer. The heat insulation cotton is a prior art and is pasted on the inner wall of the heating chamber 9 by gluing.

[0027] The heat insulation layer is used to keep the heat in the heating chamber 9 from being lost.

[0028] According to a preferred technical solution, a support platform 4 is provided on the inner wall of the baking chamber 2 , and the carrier plate 5 is placed on the support platform 4 and spaced apart from the bottom of the baking chamber 2 .

[0029] According to a preferred technical solution, handles 8 are provided on both sides of the carrier plate 5 .

[0030] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0032] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present invention.

Claims

1. A baking device for wafer packaging, characterized in that: The machine comprises a body (1), a baking chamber (2) is provided at the upper end of the body (1), a cover (3) for covering the baking chamber (2) is also hingedly provided at the upper end of the body (1), a removable carrier (5) is provided in the baking chamber (2), a plurality of placement openings (6) matching with wafers and a plurality of vertical hollow holes (7) are provided on the carrier (5), and the carrier (5) is spaced apart from the bottom of the baking chamber (2); The cover (3) is provided with a heating chamber (9), the heating chamber (9) is provided with a heating wire (10), the heating chamber (9) is connected to the baking chamber (2), the upper end of the cover (3) is provided with an air inlet (12) connected to the heating chamber (9), the body (1) is provided with an exhaust chamber (13) connected to the baking chamber (2), the exhaust chamber (13) is connected to a fan box (15), the fan box (15) is provided with a fan assembly (16), the fan box (15) is connected to an air outlet (17) provided outside the body (1), and the air outlet (17) is connected to the air inlet (12) via a hose.

2. The baking device for wafer packaging as claimed in claim 1, characterized in that: The air inlet (12) is arranged at the center of the heating chamber (9); the heating chamber (9) is connected to the baking chamber (2) via a plurality of blowing holes (11); the blowing holes (11) are located above the baking chamber (2); the baking chamber (2) is connected to the exhaust chamber (13) via a plurality of exhaust holes (14); and the plurality of exhaust holes (14) are arranged at the bottom of the baking chamber (2).

3. The baking device for wafer packaging as claimed in claim 2, characterized in that: The diameters of the plurality of blowing holes (11) gradually increase from the blowing hole (11) located in the center toward the blowing holes (11) located in the surrounding areas.

4. The baking device for wafer packaging as claimed in claim 1, characterized in that: A heat insulation layer is provided on the inner wall of the heating chamber (9), and the heat insulation layer comprises a heat insulation cotton layer.

5. The baking device for wafer packaging as claimed in claim 1, characterized in that: A support platform (4) is provided on the inner wall of the baking chamber (2), and the carrier plate (5) is placed on the support platform (4) and spaced apart from the bottom of the baking chamber (2).

6. The baking device for wafer packaging as claimed in claim 5, characterized in that: Handles (8) are provided on both sides of the carrier plate (5).

7. A method for baking a wafer package as claimed in claim 1, characterized in that: The method comprises placing a plurality of wafers which have been packaged and sprayed with ink one by one in a placement opening (6) of a carrier (5), laying them flat and neat, placing the carrier into a baking chamber (2) at the upper end of a machine body (1), closing a machine cover (3), starting a heating wire (10) to start heating, and then starting a fan assembly (16) to form a circulating airflow, blowing hot air into the baking chamber (2) to dry the ink on the surface of the wafers, wherein the heating temperature of the heating wire (10) is 55-70°C and the wind speed is 3.4-5.4 m / s.

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