Ultrathin quartz wafer etching process

Abstract

The invention discloses an ultra-thin quartz wafer etching process which comprises a main body unit which comprises a working device, a fixing plate fixedly arranged on the working device, a threaded groove formed in the fixing plate, a connecting frame fixedly arranged on the working device, a connecting belt arranged on the connecting frame, a first motor fixedly arranged in the working device, a fixing disc fixedly arranged on the working device, and a second motor fixedly arranged on the fixing disc, a second motor is started subsequently, the output end of the second motor drives a first rotating wheel to rotate, at the moment, a first bevel gear is driven to rotate through a rotating rod, then a sleeve is driven to rotate through a second bevel gear, and then a fixed block is driven to transversely move through a limiting block under the action of a first threaded rod; in the moving process, a built-in motor is turned on, and the clamping plate is driven to clamp quartz wafers of different specifications.

Description

Technical Field

[0001] The invention relates to the technical field of wafer etching, and in particular to an ultra-thin quartz wafer etching process. Background Art

[0002] Quartz crystal is the most widely used crystal at present. The electronic components made by using the physical properties of quartz crystal have high frequency stability and are widely used in digital circuits, computers, communications and other fields. Its function is to serve as a frequency source and frequency reference in electronic circuits. With the development of communication and electronic technology, the demand for quartz wafers has also increased significantly, and at the same time, the fundamental frequency of quartz wafers has been continuously improved.

[0003] The existing quartz wafer etching process cannot be adjusted according to the size specifications of the quartz wafer during use. When facing quartz wafers of different sizes, corresponding equipment needs to be purchased, which has a high investment cost in the early stage of production and consumes a lot of production costs. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0005] In view of the above problems existing in the existing ultra-thin quartz wafer etching process, the present invention is proposed.

[0006] Therefore, the purpose of the present invention is to provide an ultra-thin quartz wafer etching process, which is to solve the problem of "it cannot be adjusted according to the size specifications of the quartz wafer during use, it is necessary to purchase corresponding equipment when facing quartz wafers of different sizes, the investment cost in the early stage of production is large, and it consumes more production costs."

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: an ultra-thin quartz wafer etching process, comprising:

[0008] The main unit comprises a working device, a fixing plate is fixedly provided on the working device, a threaded groove is provided on the fixing plate, a connecting frame is fixedly provided on the working device, a connecting belt is provided on the connecting frame, a first motor is fixedly provided inside the working device, a fixing disk is fixedly provided on the working device, and a working groove is provided on the fixing disk;

[0009] The working unit includes a conveyor arranged on the connecting frame, a fixing groove is provided on the working device, a starting component is provided in the working device, a transmission component is provided on the starting component, a limiting groove is provided on the working device, a fixing component is provided on the transmission component, a clamping plate is provided on the fixing component, an adjusting component is provided on the fixing plate, a lifting component is provided on the starting component, and a conveying groove is provided on the working device.

[0010] As a preferred solution of the ultra-thin quartz wafer etching process described in the present invention, the starting component includes a second motor fixedly arranged in the working device, a first rotating wheel is fixedly provided at the output end of the second motor, a transmission belt is sleeved on the first rotating wheel, a second rotating wheel is sleeved on one end of the transmission belt, a transmission rod is fixedly provided on the second rotating wheel, and a rotating rod is fixedly provided on the first rotating wheel.

[0011] As a preferred solution of the ultra-thin quartz wafer etching process described in the present invention, the transmission component includes a mounting groove opened on the working device, a first bevel gear is fixedly provided on the upper end of the rotating rod, a second bevel gear is rotatably provided on the mounting groove, a sleeve is fixedly provided on the second bevel gear, a first threaded rod is provided on the sleeve, and a limit block is rotatably provided on the first threaded rod.

[0012] As a preferred solution of the ultra-thin quartz wafer etching process described in the present invention, the first bevel gear is meshed with the second bevel gear, a thread groove is provided on the sleeve, and the first threaded rod is threadedly connected to the sleeve.

[0013] As a preferred solution of the ultra-thin quartz wafer etching process described in the present invention, the fixing component includes a fixing block fixedly connected to the limiting block, a sliding groove is provided on the fixing block, a rectangular block is fixedly provided inside the fixing block, a built-in motor is fixedly provided inside the fixing block, a bidirectional threaded rod is fixedly provided at the output end of the built-in motor, and moving blocks are provided at both ends of the bidirectional threaded rod.

[0014] As a preferred solution of the ultra-thin quartz wafer etching process described in the present invention, a thread groove is provided on the moving block, the moving block is threadedly connected to the bidirectional threaded rod, the moving block is fixedly connected to the clamping plate, and the clamping plate is tightly fitted and slidably connected to the inner wall of the conveying groove.

[0015] As a preferred solution of the ultra-thin quartz wafer etching process described in the present invention, wherein: the adjusting component includes a circular groove opened in the fixed disk, a rotating ring is rotatably provided in the circular groove, a tooth groove is opened on the rotating ring, a gear is rotatably provided on the fixed disk, an adjusting plate is arranged on the fixed disk, and a fixing rod is fixedly provided on the fixed disk.

[0016] As a preferred solution of the ultra-thin quartz wafer etching process described in the present invention, the lifting component includes a stabilizing frame fixedly arranged on the working device, a connecting rod is rotatably provided on the stabilizing frame, a second threaded rod is fixedly provided on the upper end of the connecting rod, a lifting groove is opened on the stabilizing frame, a receiving plate is provided on the stabilizing frame, and an etcher is fixedly provided on the receiving plate.

[0017] Beneficial effects of the present invention:

[0018] 1. Then turn on the second motor, and the output end of the second motor drives the first rotating wheel to rotate. At this time, the first bevel gear is driven to rotate through the rotating rod, and then the sleeve is driven to rotate through the second bevel gear. Then, under the action of the first threaded rod, the fixed block is driven to move horizontally through the limit block. During the movement, the built-in motor is turned on to drive the clamping plate to clamp quartz wafers of different specifications.

[0019] 2. When the fixed block moves, the second thread groove is driven to rotate through the connecting rod under the action of the transmission rod, and then the etcher is driven to move to a suitable position through the receiving plate. When the quartz wafer to be processed moves into the working groove, the first motor is turned on, and the output end of the first motor drives the rotating ring to rotate. Under the action of the tooth groove, the adjusting plate is driven to move through the gear, and then adjusted according to the specifications of the quartz wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0021] Figure 1 This is a schematic diagram of the overall structure of the front side of an ultra-thin quartz wafer etching process proposed by the present invention;

[0022] Figure 2 It is a schematic diagram of the cross-sectional structure of the working device;

[0023] Figure 3 It is a schematic diagram of the startup component structure;

[0024] Figure 4 It is a schematic diagram of the fixed component structure;

[0025] Figure 5 It is a schematic diagram of the structure of the regulating component;

[0026] Figure 6 It is a schematic diagram of the lifting component structure.

[0027] In the figure: 100, main unit; 101, working device; 102, fixing plate; 103, bolt groove; 104, connecting frame; 105, connecting belt; 106, first motor; 107, fixing plate; 108, working groove; 200, working unit; 201, conveyor; 202, fixing groove; 203, starting member; 203a, second motor; 203b, first rotating wheel; 203c, transmission belt; 203d, second rotating wheel; 203e, transmission rod; 203f, rotating rod; 204, transmission member; 204a, mounting groove; 204b, first bevel gear; 204c, sleeve; 204d, second bevel gear; 204e, first thread Rod; 204f, limit block; 205, limit groove; 206, fixed member; 206a, fixed block; 206b, slide groove; 206c, rectangular block; 206d, built-in motor; 206e, bidirectional threaded rod; 206f, moving block; 207, clamping plate; 208, adjusting member; 208a, circular groove; 208b, rotating ring; 208c, tooth groove; 208d, gear; 208e, adjusting plate; 208f, fixed rod; 209, lifting member; 209a, stabilizing frame; 209b, connecting rod; 209c, lifting groove; 209d, second threaded rod; 209e, receiving plate; 209f, etcher; 210, conveying groove. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0029] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0030] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0031] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0032] Reference Figure 1-6The present invention provides an ultra-thin quartz wafer etching process, comprising:

[0033] The main unit 100 includes a working device 101, a fixing plate 102 is fixedly provided on the working device 101, a threaded groove 103 is provided on the fixing plate 102, a connecting frame 104 is fixedly provided on the working device 101, a connecting belt 105 is provided on the connecting frame 104, a first motor 106 is fixedly provided inside the working device 101, a fixing disk 107 is fixedly provided on the working device 101, and a working groove 108 is provided on the fixing disk 107;

[0034] The working unit 200 includes a conveyor 201 arranged on the connecting frame 104, a fixing groove 202 is opened on the working device 101, a starting component 203 is arranged in the working device 101, a transmission component 204 is arranged on the starting component 203, a limiting groove 205 is opened on the working device 101, a fixing component 206 is arranged on the transmission component 204, a clamping plate 207 is arranged on the fixing component 206, an adjusting component 208 is arranged on the fixing plate 107, a lifting component 209 is arranged on the starting component 203, and a conveying groove 210 is opened on the working device 101, and the transmission component 204 and the lifting component 209 are driven to work synchronously by the starting component 203.

[0035] Among them, the starting component 203 includes a second motor 203a fixedly arranged in the working device 101, a first rotating wheel 203b is fixedly arranged at the output end of the second motor 203a, a transmission belt 203c is sleeved on the first rotating wheel 203b, a second rotating wheel 203d is sleeved on one end of the transmission belt 203c, a transmission rod 203e is fixedly arranged on the second rotating wheel 203d, a rotating rod 203f is fixedly arranged on the first rotating wheel 203b, the second motor 203a is turned on, and the output end of the second motor 203a drives the first rotating wheel 203b to rotate, and the second rotating wheel 203d is driven to rotate under the action of the transmission belt 203c.

[0036] Furthermore, the transmission component 204 includes a mounting groove 204a provided on the working device 101, a first bevel gear 204b is fixedly provided on the upper end of the rotating rod 203f, a second bevel gear 204d is rotatably provided on the mounting groove 204a, a sleeve 204c is fixedly provided on the second bevel gear 204e, a first threaded rod 204e is provided on the sleeve 204c, a limit block 204f is rotatably provided on the first threaded rod 204e, the first bevel gear 204b rotates to drive the second bevel gear 204d to rotate, and then drives the first threaded rod 204e through the sleeve 204c to push the limit block 204f to move laterally.

[0037] Furthermore, the first bevel gear 204b is meshed with the second bevel gear 204d, a thread groove is provided on the sleeve 204c, and the first threaded rod 204e is threadedly connected to the sleeve 204c.

[0038] Furthermore, the fixed component 206 includes a fixed block 206a fixedly connected to the limit block 204f, a slide groove 206b is opened on the fixed block 206a, a rectangular block 206c is fixedly provided in the fixed block 206a, a built-in motor 206d is fixedly provided in the fixed block 206a, a bidirectional threaded rod 206e is fixedly provided at the output end of the built-in motor 206d, and moving blocks 206f are provided at both ends of the bidirectional threaded rod 206e.

[0039] Furthermore, a thread groove is provided on the moving block 206f, the moving block 206f is threadedly connected to the bidirectional threaded rod 206e, the moving block 206f is fixedly connected to the clamping plate 207, and the clamping plate 207 is tightly fitted and slidably connected to the inner wall of the conveying trough 210.

[0040] Furthermore, the adjusting component 208 includes a circular groove 208a opened in the fixed disk 107, a rotating ring 208b is rotatably provided in the circular groove 208a, a tooth groove 208c is opened on the rotating ring 208b, a gear 208d is rotatably provided on the fixed disk 107, an adjusting plate 208e is provided on the fixed disk 107, and a fixing rod 208f is fixedly provided on the fixed disk 107.

[0041] Furthermore, the lifting component 209 includes a stabilizing frame 209a fixedly set on the working device 101, a connecting rod 209b is rotatably provided on the stabilizing frame 209a, a second threaded rod 209d is fixedly provided on the upper end of the connecting rod 209b, a lifting groove 209c is opened on the stabilizing frame 209a, a receiving plate 209e is provided on the stabilizing frame 209a, and an etcher 209f is fixedly provided on the receiving plate 209e.

[0042] During use, the switch of the connecting belt 105 is turned on, so that the connecting belt 105 performs intermittent movement. At this time, the quartz wafer to be processed is transported to the conveying groove 210 through the conveyor 201, and then the second motor 203a is turned on. The output end of the second motor 203a drives the first rotating wheel 203b to rotate, and the second rotating wheel 203d is driven to rotate under the action of the transmission belt 203c. At this time, the first bevel gear 204b is driven to rotate through the rotating rod 203f, and then the sleeve 204c is driven to rotate through the second bevel gear 204d. Then, under the action of the first threaded rod 204e, the fixing block 206a is driven to move horizontally through the limit block 204f. During the process, the built-in motor 206d is turned on to drive the clamping plate 207 to clamp quartz wafers of different specifications. When the fixed block 206a moves, the second thread groove 209d is driven to rotate through the connecting rod 209b under the action of the transmission rod 203e, and then the etcher 209f is driven to move to a suitable position through the receiving plate 209e. When the quartz wafer to be processed moves into the working groove 108, the first motor 106 is turned on, and the output end of the first motor 106 drives the rotating ring 208b to rotate, and under the action of the tooth groove 208c, the adjusting plate 208e is driven to move through the gear 208d, and then adjusted according to the specifications of the quartz wafer.

[0043] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. An ultra-thin quartz wafer etching process, characterized in that: include: The main unit (100) comprises a working device (101), a fixing plate (102) is fixedly provided on the working device (101), a threaded groove (103) is provided on the fixing plate (102), a connecting frame (104) is fixedly provided on the working device (101), a connecting belt (105) is provided on the connecting frame (104), a first motor (106) is fixedly provided inside the working device (101), a fixing disk (107) is fixedly provided on the working device (101), and a working groove (108) is provided on the fixing disk (107); The working unit (200) comprises a conveyor (201) arranged on the connecting frame (104); a fixing groove (202) is provided on the working device (101); a starting component (203) is provided inside the working device (101); a transmission component (204) is provided on the starting component (203); a limiting groove (205) is provided on the working device (101); a fixing component (206) is provided on the transmission component (204); a clamping plate (207) is provided on the fixing component (206); an adjusting component (208) is provided on the fixing plate (107); a lifting component (209) is provided on the starting component (203); and a conveying groove (210) is provided on the working device (101).

2. The ultra-thin quartz wafer etching process according to claim 1, characterized in that: The starting component (203) comprises a second motor (203a) fixedly arranged in the working device (101); a first rotating wheel (203b) is fixedly provided at the output end of the second motor (203a); a transmission belt (203c) is sleeved on the first rotating wheel (203b); a second rotating wheel (203d) is sleeved on one end of the transmission belt (203c); a transmission rod (203e) is fixedly provided on the second rotating wheel (203d); and a rotating rod (203f) is fixedly provided on the first rotating wheel (203b).

3. The ultra-thin quartz wafer etching process according to claim 1, characterized in that: The transmission component (204) comprises a mounting groove (204a) provided on the working device (101); a first bevel gear (204b) is fixedly provided on the upper end of the rotating rod (203f); a second bevel gear (204d) is rotatably provided on the mounting groove (204a); a sleeve (204c) is fixedly provided on the second bevel gear (204e); a first threaded rod (204e) is provided on the sleeve (204c); and a limit block (204f) is rotatably provided on the first threaded rod (204e).

4. The ultra-thin quartz wafer etching process according to claim 3, characterized in that: The first bevel gear (204b) is meshed with the second bevel gear (204d), a thread groove is provided on the sleeve (204c), and the first threaded rod (204e) is threadedly connected to the sleeve (204c).

5. The ultra-thin quartz wafer etching process according to claim 3, characterized in that: The fixing member (206) comprises a fixing block (206a) fixedly connected to the limiting block (204f), a sliding groove (206b) being provided on the fixing block (206a), a rectangular block (206c) being fixedly provided inside the fixing block (206a), a built-in motor (206d) being fixedly provided inside the fixing block (206a), a bidirectional threaded rod (206e) being fixedly provided at the output end of the built-in motor (206d), and moving blocks (206f) being provided at both ends of the bidirectional threaded rod (206e).

6. The ultra-thin quartz wafer etching process according to claim 5, characterized in that: The moving block (206f) is provided with a thread groove, the moving block (206f) is threadedly connected to the bidirectional threaded rod (206e), the moving block (206f) is fixedly connected to the clamping plate (207), and the clamping plate (207) is tightly fitted and slidably connected to the inner wall of the conveying groove (210).

7. The ultra-thin quartz wafer etching process according to claim 1, characterized in that: The adjusting member (208) comprises a circular groove (208a) provided in the fixed disk (107), a rotating ring (208b) rotatably provided in the circular groove (208a), a tooth groove (208c) provided on the rotating ring (208b), a gear (208d) rotatably provided on the fixed disk (107), an adjusting plate (208e) provided on the fixed disk (107), and a fixing rod (208f) fixedly provided on the fixed disk (107).

8. The ultra-thin quartz wafer etching process according to claim 1, characterized in that: The lifting component (209) comprises a stabilizing frame (209a) fixedly arranged on the working device (101), a connecting rod (209b) is rotatably arranged on the stabilizing frame (209a), a second threaded rod (209d) is fixedly arranged on the upper end of the connecting rod (209b), a lifting groove (209c) is opened on the stabilizing frame (209a), a receiving plate (209e) is arranged on the stabilizing frame (209a), and an etcher (209f) is fixedly arranged on the receiving plate (209e).

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