Device and method for testing reliability of integrated circuit

Abstract

The invention discloses a reliability testing device and method for an integrated circuit, and relates to the field of integrated circuit tests.The reliability testing device comprises a supporting frame, the two ends of the supporting frame are fixedly connected with supporting feet, the outer surface of the supporting frame is fixedly connected with a transmitter motor, and the output end of the transmitter motor is fixedly connected with a transmission unit; a testing unit is fixedly connected to the top of the supporting frame, a water tank is arranged in the middle of the supporting frame, a drying unit is fixedly connected to the position, close to the water tank, of the supporting frame, a heating bin is fixedly connected to the end, away from the drying unit, of the supporting frame, and a heater is fixedly connected to the outer surface of the heating bin. The inner wall of the heater is fixedly connected with a heat preservation curtain, the integrated circuit board can be heated in the heating bin for a period of time, then the first testing unit can conduct performance testing on the integrated circuit board, then the integrated circuit board is cooled through the water tank and processed through the drying unit, and finally the reliability of the integrated circuit board is continuously detected in the second testing unit.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit testing, and in particular to a reliability testing device and a testing method for an integrated circuit. Background Art

[0002] Integrated Circuit (IC) is a microelectronic device or component. It uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in the circuit, and is made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a microstructure with the required circuit function. Integrated circuits have the advantages of small size, light weight, few lead wires and welding points, long life, high reliability, good performance, etc., and at the same time, low cost and easy mass production. It is widely used in almost all electronic equipment fields such as computers, communication equipment, consumer electronics, industrial control, automotive electronics, etc. It is the core and cornerstone of modern information technology, and has promoted the continuous development of electronic equipment towards miniaturization, high performance and intelligence.

[0003] Reliability tests for integrated circuits include high-temperature operating life tests, temperature cycle tests, etc. During the testing process, impurities may exist in the test ports on the integrated circuit, hindering the testing process. Summary of the invention

[0004] In view of the deficiencies of the prior art, the present invention adopts the following technical solution to solve the technical problems: the reliability test device of an integrated circuit described in the present invention comprises a support frame, two ends of the support frame are fixedly connected with support feet, the outer surface of the support frame is fixedly connected with a transmission motor, the output end of the transmission motor is fixedly connected with a transmission unit, the top of the support frame is fixedly connected with a test unit, the number of the test units is two, a water tank is arranged in the middle of the support frame, a drying unit is fixedly connected to the support frame near the water tank, a heating chamber is fixedly connected to one end of the support frame away from the drying unit, a heater is fixedly connected to the outer surface of the heating chamber, and a thermal insulation curtain is fixedly connected to the inner wall of the heater; The test unit comprises a support plate 1, a servo motor 1 is fixedly connected to the outer surface of the support plate 1, a lead screw is fixedly connected to the output end of the servo motor 1, a moving block is threadedly connected to the outer surface of the lead screw, a telescopic rod is fixedly connected to the bottom of the moving block, and a detection mechanism is fixedly connected to the bottom of the telescopic rod; The detection mechanism includes a support plate 2, a circular hole is provided on the support plate 2, a power block is fixedly connected to the top of the support plate 2, an electric wire is fixedly connected to the outer surface of the power block, a power port is connected at the bottom height of the electric wire, and a pretreatment mechanism is fixedly connected to the outer surface of the support plate 2.

[0005] Preferably, the bottom of the support plate one is fixedly connected to the top of the support frame, the top of the support plate two is fixedly connected to the bottom of the telescopic rod, and the top of the power port is fixedly connected to the bottom of the support plate two.

[0006] Preferably, the pretreatment mechanism includes a support rod 1, the bottom of the support rod 1 is rotatably connected to a rotating rod, the outer surface of the rotating rod is fixedly connected to a support rod 2, the end of the support rod 2 away from the rotating rod is fixedly connected to a protective plate, brushes are evenly arranged on the bottom of the protective plate, the outer surface of the support rod 2 is fixedly connected to a pull rope, the end of the pull rope away from the support rod 2 is highly connected to a magnetic block 1, and the inner wall of the magnetic block 1 is slidably connected to a support column.

[0007] Preferably, the top of the support rod one is fixedly connected to the outer surface of the support plate two, and the bottom of the support column is fixedly connected to the top of the support plate two.

[0008] Preferably, the transmission unit includes a transmission belt, the outer surface of the transmission belt is evenly provided with placement grooves, an integrated circuit block is placed on the placement groove, and a power connection terminal is provided on the integrated circuit block. The transmission belt is fixedly connected to a rubber card block near the placement groove, the transmission belt is fixedly connected to a magnetic block 2 near the rubber card block, and racks are fixedly connected to both ends of the transmission belt.

[0009] Preferably, the drying unit includes a support plate three, a dryer is fixedly connected to the bottom of the support plate three, an air outlet is arranged at the bottom of the dryer, a support rod three is fixedly connected to the outer surface of the dryer, a gas storage plate is fixedly connected to the bottom of the support rod three, gas distribution ports are symmetrically arranged at the bottom of the gas storage plate, a support plate four is fixedly connected to the bottom of the support plate three, and a wiping mechanism is fixedly connected to the outer surface of the support plate four.

[0010] Preferably, the wiping mechanism includes a rotating shaft, a sponge block is fixedly connected to the outer surface of the rotating shaft, a round block 1 is fixedly connected to both ends of the rotating shaft, a gear is fixedly connected to a place of the rotating shaft near the round block, a track is sleeved on the outer surface of the round block 1, and a blowing mechanism is sleeved on the end of the track away from the round block 1.

[0011] Preferably, the blowing mechanism includes a support rod four, the outer surface of the support rod four is fixedly connected to a round block two, the outer surface of the round block two is fixedly connected to a fan blade, the outer surface of the air storage plate is fixedly connected to an air outlet pipe, and the outer surface of the air outlet pipe is fixedly connected to an air collection pipe.

[0012] Preferably, the bottom of the support plate three is fixedly connected to the top of the support frame, the two ends of the rotating shaft are fixedly connected to the outer surface of the support plate four, and the outer surface of the round block two is sleeved with the crawler track.

[0013] A testing method for an integrated circuit reliability testing device comprises the following steps: S1: First, the integrated circuit is placed in the transmission unit, which will drive the integrated circuit to pass through the heating chamber, the test unit, the water tank, the drying unit and the test unit in sequence; S2: The drying unit will place the integrated circuit in a high temperature environment for a period of time, after which the test unit will detect whether the integrated circuit can work normally and its performance parameters, such as output voltage, current, and frequency; S3: The transport unit will bring the integrated circuit into the water tank to achieve rapid cooling, and then it will be quickly dried after passing through the drying unit; S4: The test unit will retest the integrated circuits that are cycled in different temperature environments to observe the performance changes of the chip during temperature changes, the thermal expansion and contraction of the packaging materials, and the reliability of the solder joints.

[0014] The beneficial effects of the present invention are as follows: 1. The present invention sets a test unit. When the transmission unit drives the integrated circuit board to move to the bottom of the first test unit, the transmission unit will temporarily stop working, and the servo motor will drive the lead screw to rotate, thereby driving the moving block to move horizontally to the top of the integrated circuit board in sequence, and then the telescopic rod will move downward to make the power port contact the power terminal on the integrated circuit board.

[0015] 2. The present invention sets a pre-treatment mechanism. Before the power-on port contacts the power-connecting terminal on the integrated circuit board, since repulsion is generated between the magnetic block 1 and the magnetic block 2, as the support plate 2 moves downward, the magnetic block 1 is pushed by the repulsive force to move upward along the support column. Accompanied by the pulling of the pull rope, the rotating rod, the support rod 2 and the protection plate are rotated, so that the protection plate is separated from the power-on port, which is convenient for subsequent performance testing. At the same time, during the rotation of the protection plate, the brush at the bottom is brushed against the power-connecting terminal on the integrated circuit, so that the dust that falls on the surface of the power-connecting terminal during the transmission process is scraped off, thereby avoiding the power-on port from being unable to fully contact the power-connecting terminal on the integrated circuit board.

[0016] 3. The present invention sets a wiping mechanism. After the integrated circuit board is cooled in the water tank, moisture will adhere to the integrated circuit board. Before the performance test, the moisture needs to be completely removed. As the transmission belt moves, the rack drives the gear to rotate, and then drives the shaft to rotate, so that the sponge block and the integrated circuit board are wiped. The sponge block absorbs the moisture on the integrated circuit board, which is convenient for subsequent performance testing.

[0017] 4. The present invention provides an air blowing mechanism, so that the rotation of the rotating shaft will also drive the first round block to rotate, and then the second round block will rotate through the transmission of the crawler belt, and drive the fan blades to rotate, thereby generating wind force, which will pass through the air receiving pipe and flow out from the air outlet pipe, and then the hot air generated by the dryer will flow out from the two air distribution ports at the bottom of the air storage plate, so that the hot air can dry the power connection terminal on the integrated circuit board, so that the moisture on the power connection terminal can be quickly dried. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the present invention.

[0019] Figure 2 It is a top view of the structure of the present invention.

[0020] Figure 3 It is a structural schematic diagram of the test unit of the present invention.

[0021] Figure 4 It is a structural schematic diagram of the detection mechanism of the present invention.

[0022] Figure 5 It is a structural schematic diagram of the pretreatment mechanism of the present invention.

[0023] Figure 6 It is a structural schematic diagram of the transmission unit of the present invention.

[0024] Figure 7 yes Figure 6 Enlarged view of point A in the middle.

[0025] Figure 8 It is a structural schematic diagram of the drying unit of the present invention.

[0026] Fig. 9 It is a bottom view of the structure of the drying unit of the present invention.

[0027] Fig.10 It is a structural schematic diagram of the wiping mechanism of the present invention.

[0028] Fig.11 It is a structural schematic diagram of the blowing mechanism of the present invention.

[0029] Fig.12 It is a block diagram of the test method for integrated circuit reliability of the present invention.

[0030] In the figure: 1, support frame; 2, support foot; 3, transmission motor; 4, transmission unit; 5, test unit; 6, drying unit; 7, heating chamber; 8, heater; 9, thermal insulation curtain; 10, sink; 51, support plate 1; 52, servo motor 1; 53, screw rod; 54, moving block; 55, telescopic rod; 56, detection mechanism; 561, support plate 2; 562, round hole; 563, power block; 564, wire; 565, power port; 566, pretreatment mechanism; 5661, support rod 1; 5662, rotating rod; 5663, support rod 2; 5664, protection plate; 5665, brush; 5666, pull rope; 5 667. magnetic block one; 5668. support column; 41. conveyor belt; 42. placement slot; 43. integrated circuit block; 44. power terminal; 45. rubber card block; 46. magnetic block two; 47. rack; 61. support plate three; 62. dryer; 63. air outlet; 64. support rod three; 65. air storage plate; 66. air distribution port; 67. support plate four; 68. wiping mechanism; 681. rotating shaft; 682. sponge block; 683. gear; 684. round block one; 685. crawler track; 686. blowing mechanism; 6861. support rod four; 6862. round block two; 6863. fan blade; 6864. air collection duct; 6865. air outlet duct. DETAILED DESCRIPTION

[0031] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses. Example 1, using Figure 1-Figure 12 A reliability testing device and a testing method for an integrated circuit according to an embodiment of the present invention are described as follows.

[0032] like Figure 1-Figure 2 As shown, a reliability test device for an integrated circuit of the present invention comprises a support frame 1, support legs 2 are fixedly connected to both ends of the support frame 1, a transmission motor 3 is fixedly connected to the outer surface of the support frame 1, a transmission unit 4 is fixedly connected to the output end of the transmission motor 3, a test unit 5 is fixedly connected to the top of the support frame 1, and the number of the test units 5 is two, a water tank 10 is arranged in the middle of the support frame 1, a drying unit 6 is fixedly connected to the support frame 1 near the water tank 10, a heating chamber 7 is fixedly connected to one end of the support frame 1 away from the drying unit 6, a heater 8 is fixedly connected to the outer surface of the heating chamber 7, and a heat preservation curtain 9 is fixedly connected to the inner wall of the heater 8; When the present invention is working, the integrated circuit board first needs to be placed in the transmission unit 4 for movement. The integrated circuit board will be heated in the heating chamber 7 for a period of time, and then the first test unit 5 will perform a performance test on the integrated circuit board. After that, the integrated circuit board will be cooled in the water tank 10 and processed by the drying unit 6, and finally the reliability will continue to be tested in the second test unit 5.

[0033] like Figure 3 As shown, the test unit 5 includes a support plate 51, a servo motor 52 is fixedly connected to the outer surface of the support plate 51, a screw rod 53 is fixedly connected to the output end of the servo motor 52, a moving block 54 is threadedly connected to the outer surface of the screw rod 53, a telescopic rod 55 is fixedly connected to the bottom of the moving block 54, and a detection mechanism 56 is fixedly connected to the bottom of the telescopic rod 55; like Figure 4 As shown, the detection mechanism 56 includes a support plate 561, a circular hole 562 is provided on the support plate 561, a power block 563 is fixedly connected to the top of the support plate 561, an electric wire 564 is fixedly connected to the outer surface of the power block 563, a power port 565 is connected at the bottom height of the electric wire 564, and a pre-treatment mechanism 566 is fixedly connected to the outer surface of the support plate 561.

[0034] When the transmission unit 4 drives the integrated circuit board to move to the bottom of the first test unit 5, the transmission unit 4 will temporarily stop working, and the servo motor 52 will drive the screw rod 53 to rotate, thereby driving the moving block 54 to move horizontally to the top of the integrated circuit board in sequence, and then the telescopic rod 55 will move downward and make the power port 565 contact with the power terminal 44 on the integrated circuit board.

[0035] The bottom of the support plate 1 51 is fixedly connected to the top of the support frame 1 , the top of the support plate 2 561 is fixedly connected to the bottom of the telescopic rod 55 , and the top of the power port 565 is fixedly connected to the bottom of the support plate 2 561 .

[0036] like Figure 5 As shown, the pretreatment mechanism 566 includes a support rod 1 5661, the bottom of the support rod 1 5661 is rotatably connected to a rotating rod 5662, the outer surface of the rotating rod 5662 is fixedly connected to a support rod 2 5663, the end of the support rod 2 5663 away from the rotating rod 5662 is fixedly connected to a protective plate 5664, brushes 5665 are evenly arranged on the bottom of the protective plate 5664, the outer surface of the support rod 2 5663 is fixedly connected to a pull rope 5666, the end of the pull rope 5666 away from the support rod 2 5663 is highly connected to a magnetic block 1 5667, and the inner wall of the magnetic block 1 5667 is slidably connected to a support column 5668.

[0037] Before the power-on port 565 contacts the power-on terminal 44 on the integrated circuit board, since there is repulsion between the magnetic block 1 5667 and the magnetic block 2 46, as the support plate 2 561 moves downward, the magnetic block 1 5667 will be pushed upward along the support column 5668 by the repulsive force, and along with the pulling of the pull rope 5666, the rotating rod 5662, the support rod 2 5663 and the protective plate 5664 will rotate, so that the protective plate 5664 will be separated from the power-on port 565, which is convenient for subsequent performance testing. At the same time, during the rotation of the protective plate 5664, the brush 5665 at the bottom will brush against the power-on terminal 44 on the integrated circuit, so that the dust that falls on the surface of the power-on terminal 44 during the transmission process is scraped off, thereby avoiding the power-on port 565 from being unable to fully contact the power-on terminal 44 on the integrated circuit board.

[0038] The top of the support rod 1 5661 is fixedly connected to the outer surface of the support plate 2 561 , and the bottom of the support column 5668 is fixedly connected to the top of the support plate 2 561 .

[0039] like Figure 6-Figure 7 As shown, the transmission unit 4 includes a transmission belt 41, the outer surface of the transmission belt 41 is evenly provided with placement grooves 42, an integrated circuit block 43 is placed on the placement groove 42, and an electrical terminal 44 is provided on the integrated circuit block 43. The transmission belt 41 is fixedly connected to a rubber clamp 45 near the placement groove 42, the transmission belt 41 is fixedly connected to a magnetic block 46 near the rubber clamp 45, and racks 47 are fixedly connected to both ends of the transmission belt 41.

[0040] The second magnetic block 46 will produce a gear 683 with the first magnetic block 5667, and the rubber clamp block 45 can ensure that the integrated circuit board does not fall off the conveyor belt 41.

[0041] The specific workflow is as follows: During operation, the servo motor 1 52 will drive the lead screw 53 to rotate, thereby driving the moving block 54 to move horizontally to the top of the integrated circuit board in sequence, and then the telescopic rod 55 will move downward to make the power port 565 contact with the power terminal 44 on the integrated circuit board. As the support plate 2 561 moves downward, the magnetic block 1 5667 will be pushed upward along the support column 5668 by the repulsive force, and accompanied by the pulling of the pull rope 5666, the rotating rod 5662, the support rod 2 5663 and the protective plate 5664 will rotate, so that the protective plate 5664 will be separated from the power port 565, which is convenient for subsequent performance testing. At the same time, during the rotation of the protective plate 5664, the brush 5665 at the bottom will brush against the power terminal 44 on the integrated circuit, so that the dust that falls on the surface of the power terminal 44 during the transmission process can be scraped off, which is convenient for the subsequent power port 565 to fully contact with the power terminal 44 on the integrated circuit board and detect the reliability.

[0042] Example 2, using Figure 1-Figure 12 A reliability testing device and a testing method for an integrated circuit according to an embodiment of the present invention are described as follows.

[0043] like Figure 8-9 As shown in the figure, a reliability testing device for an integrated circuit of the present invention is based on the first embodiment, and the drying unit 6 includes a support plate three 61, the bottom of the support plate three 61 is fixedly connected to a dryer 62, the bottom of the dryer 62 is provided with an air outlet 63, the outer surface of the dryer 62 is fixedly connected to a support rod three 64, the bottom of the support rod three 64 is fixedly connected to an air storage plate 65, the bottom of the air storage plate 65 is symmetrically provided with air distribution ports 66, the bottom of the support plate three 61 is fixedly connected to a support plate four 67, and the outer surface of the support plate four 67 is fixedly connected to a wiping mechanism 68.

[0044] The dryer 62 heats the air, and the heated air flows into the air storage plate 65 , and the wiping mechanism 68 absorbs water from the integrated circuit board.

[0045] like Fig.10 As shown, the wiping mechanism 68 includes a rotating shaft 681, a sponge block 682 is fixedly connected to the outer surface of the rotating shaft 681, round blocks 684 are fixedly connected to both ends of the rotating shaft 681, a gear 683 is fixedly connected to the rotating shaft 681 near the round block 684, a track 685 is sleeved on the outer surface of the round block 684, and a blowing mechanism 686 is sleeved on the end of the track 685 away from the round block 684.

[0046] After the integrated circuit board is cooled by the water tank 10, moisture will adhere to the integrated circuit board. Before the performance test, the moisture needs to be completely removed. As the conveyor belt 41 moves, the rack 47 will drive the gear 683 to rotate, and then drive the rotating shaft 681 to rotate, so that the sponge block 682 and the integrated circuit board will be wiped. The sponge block 682 will absorb the moisture on the integrated circuit board, which is convenient for subsequent performance testing.

[0047] like Fig.11 As shown, the blowing mechanism 686 includes a support rod 4 6861, the outer surface of the support rod 4 6861 is fixedly connected to a round block 2 6862, the outer surface of the round block 2 6862 is fixedly connected to a fan blade 6863, the outer surface of the air storage plate 65 is fixedly connected to an air outlet pipe 6865, and the outer surface of the air outlet pipe 6865 is fixedly connected to an air collecting pipe 6864.

[0048] The rotation of the rotating shaft 681 will also drive the round block 1 684 to rotate, and then through the transmission of the crawler 685, the round block 2 6862 will rotate, and drive the fan blades 6863 to rotate, thereby generating wind force, which will pass through the air collecting pipe 6864 and flow out from the air outlet pipe 6865, and then the hot air generated by the dryer 62 will flow out from the two air distribution ports 66 at the bottom of the air storage plate 65, so that the hot air can dry the power terminal 44 on the integrated circuit board, so that the moisture on the power terminal 44 can be quickly dried.

[0049] The bottom of the support plate three 61 is fixedly connected to the top of the support frame 1 , the two ends of the rotating shaft 681 are fixedly connected to the outer surface of the support plate four 67 , and the outer surface of the round block two 6862 is sleeved with the crawler 685 .

[0050] like Fig.12 As shown, a testing method of an integrated circuit reliability testing device comprises the following steps: S1: First, the integrated circuit is placed in the transmission unit 4, and the transmission unit 4 drives the integrated circuit to pass through the heating chamber 7, the test unit 5, the water tank 10, the drying unit 6 and the test unit 5 in sequence; S2: The drying unit 6 places the integrated circuit in a high temperature environment for a period of time, after which the testing unit 5 detects whether the integrated circuit can work normally and its performance parameters, such as output voltage, current, and frequency; S3: The transport unit 4 brings the integrated circuit into the water tank 10 to achieve rapid cooling, and then passes through the drying unit 6 to be quickly dried; S4: Test unit 5 will retest the integrated circuit that is cyclically switched in different temperature environments to observe the performance changes of the chip during temperature changes, the thermal expansion and contraction of the packaging material, and the reliability of the solder joints.

[0051] The specific workflow is as follows: During operation, as the conveyor belt 41 moves, the rack 47 will drive the gear 683 to rotate, and then drive the rotating shaft 681 to rotate, so that the sponge block 682 and the integrated circuit board will be wiped, and the sponge block 682 will absorb the moisture on the integrated circuit board. At the same time, the rotation of the rotating shaft 681 will also drive the round block 1 684 to rotate, and then through the transmission of the crawler 685, the round block 2 6862 will rotate, and drive the fan blade 6863 to rotate, thereby generating wind force. The wind force will pass through the air collecting pipe 6864 and flow out from the air outlet pipe 6865, and then the hot air generated by the dryer 62 will flow out from the two air distribution ports 66 at the bottom of the air storage plate 65, so that the hot air can dry the power terminal 44 on the integrated circuit board.

[0052] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A reliability test device and a test method for an integrated circuit, comprising a support frame (1), characterized in that: The two ends of the support frame (1) are fixedly connected to support feet (2), the outer surface of the support frame (1) is fixedly connected to a transmission motor (3), the output end of the transmission motor (3) is fixedly connected to a transmission unit (4), the top of the support frame (1) is fixedly connected to a test unit (5), the number of the test units (5) is two, a water tank (10) is provided in the middle of the support frame (1), the support frame (1) is fixedly connected to a drying unit (6) near the water tank (10), the end of the support frame (1) away from the drying unit (6) is fixedly connected to a heating chamber (7), the outer surface of the heating chamber (7) is fixedly connected to a heater (8), and the inner wall of the heater (8) is fixedly connected to a thermal insulation curtain (9); The test unit (5) comprises a support plate 1 (51), the outer surface of the support plate 1 (51) is fixedly connected to a servo motor 1 (52), the output end of the servo motor 1 (52) is fixedly connected to a screw rod (53), the outer surface of the screw rod (53) is threadedly connected to a moving block (54), the bottom of the moving block (54) is fixedly connected to a telescopic rod (55), and the bottom of the telescopic rod (55) is fixedly connected to a detection mechanism (56); The detection mechanism (56) comprises a second support plate (561), a circular hole (562) is provided on the second support plate (561), a power block (563) is fixedly connected to the top of the second support plate (561), an electric wire (564) is fixedly connected to the outer surface of the power block (563), a power port (565) is connected at the bottom height of the electric wire (564), and a pre-processing mechanism (566) is fixedly connected to the outer surface of the second support plate (561).

2. The reliability testing device and testing method of an integrated circuit according to claim 1, characterized in that: The bottom of the support plate 1 (51) is fixedly connected to the top of the support frame (1), the top of the support plate 2 (561) is fixedly connected to the bottom of the telescopic rod (55), and the top of the power port (565) is fixedly connected to the bottom of the support plate 2 (561).

3. The reliability testing device and testing method of an integrated circuit according to claim 1, characterized in that: The pretreatment mechanism (566) comprises a support rod 1 (5661), the bottom of the support rod 1 (5661) is rotatably connected to a rotating rod (5662), the outer surface of the rotating rod (5662) is fixedly connected to a support rod 2 (5663), one end of the support rod 2 (5663) away from the rotating rod (5662) is fixedly connected to a protective plate (5664), brushes (5665) are evenly arranged on the bottom of the protective plate (5664), the outer surface of the support rod 2 (5663) is fixedly connected to a pull rope (5666), one end of the pull rope (5666) away from the support rod 2 (5663) is highly connected to a magnetic block 1 (5667), and the inner wall of the magnetic block 1 (5667) is slidably connected to a support column (5668).

4. The reliability testing device and testing method of an integrated circuit according to claim 3, characterized in that: The top of the support rod 1 (5661) is fixedly connected to the outer surface of the support plate 2 (561), and the bottom of the support column (5668) is fixedly connected to the top of the support plate 2 (561).

5. The reliability testing device and testing method of an integrated circuit according to claim 1, characterized in that: The transmission unit (4) comprises a transmission belt (41), the outer surface of the transmission belt (41) is evenly provided with placement grooves (42), an integrated circuit block (43) is placed on the placement groove (42), and an electrical connection terminal (44) is provided on the integrated circuit block (43), a rubber clamping block (45) is fixedly connected to the transmission belt (41) near the placement groove (42), a second magnetic block (46) is fixedly connected to the transmission belt (41) near the rubber clamping block (45), and racks (47) are fixedly connected to both ends of the transmission belt (41).

6. The reliability testing device and testing method of an integrated circuit according to claim 1, characterized in that: The drying unit (6) comprises a support plate three (61), the bottom of the support plate three (61) is fixedly connected to a dryer (62), the bottom of the dryer (62) is provided with an air outlet (63), the outer surface of the dryer (62) is fixedly connected to a support rod three (64), the bottom of the support rod three (64) is fixedly connected to an air storage plate (65), the bottom of the air storage plate (65) is symmetrically provided with air distribution ports (66), the bottom of the support plate three (61) is fixedly connected to a support plate four (67), and the outer surface of the support plate four (67) is fixedly connected to a wiping mechanism (68).

7. The reliability testing device and testing method of an integrated circuit according to claim 6, characterized in that: The wiping mechanism (68) comprises a rotating shaft (681), a sponge block (682) being fixedly connected to the outer surface of the rotating shaft (681), a round block one (684) being fixedly connected to both ends of the rotating shaft (681), a gear (683) being fixedly connected to the rotating shaft (681) near the round block one (684), a track (685) being sleeved on the outer surface of the round block one (684), and a blowing mechanism (686) being sleeved on one end of the track (685) away from the round block one (684).

8. The reliability testing device and testing method of an integrated circuit according to claim 7, characterized in that: The blowing mechanism (686) comprises a support rod four (6861), the outer surface of the support rod four (6861) is fixedly connected to a round block two (6862), the outer surface of the round block two (6862) is fixedly connected to a fan blade (6863), the outer surface of the air storage plate (65) is fixedly connected to an air outlet pipe (6865), and the outer surface of the air outlet pipe (6865) is fixedly connected to an air collection pipe (6864).

9. The reliability testing device and testing method of an integrated circuit according to claim 8, characterized in that: The bottom of the support plate three (61) is fixedly connected to the top of the support frame (1), the two ends of the rotating shaft (681) are fixedly connected to the outer surface of the support plate four (67), and the outer surface of the round block two (6862) is sleeved with the crawler (685).

10. A reliability testing device for an integrated circuit according to any one of claims 1 to 9 implements a testing method thereof, characterized in that: The steps include: S1: firstly, the integrated circuit is placed in the transmission unit (4), and the transmission unit (4) drives the integrated circuit to pass through the heating chamber (7), the testing unit (5), the water tank (10), the drying unit (6) and the testing unit in sequence; S2: The drying unit (6) places the integrated circuit in a high temperature environment for a period of time, after which the testing unit (5) detects whether the integrated circuit can work normally and its performance parameters, such as output voltage, current, and frequency; S3: The transport unit (4) brings the integrated circuit into the water tank (10) to achieve rapid cooling, and then passes through the drying unit (6) to be quickly dried; S4: The test unit (5) will retest the integrated circuit that is cycled in different temperature environments to observe the performance changes of the chip during temperature changes, the thermal expansion and contraction of the packaging material, and the reliability of the solder joints.

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