A wafer cleaning machine for wafer processing

Abstract

The present invention relates to the technical field of wafer cleaning, and particularly to a wafer cleaning machine for wafer processing, which includes a cleaning tank. A cleaning component is provided inside the cleaning tank. A top frame is installed on the top surface of the cleaning tank. A double-vibration generating module is installed on the top frame. A double-vibration frame capable of synchronously moving back and forth and reciprocating up and down and a rotatable cleaning shaft are drivingly connected to the double-vibration generating module. A set of bi-directional elastic reset components are installed between the double-vibration frame and the top frame. The cleaning shaft is rotatably installed on the double-vibration frame, and a rotatable gear sleeve is rotatably installed on the double-vibration frame. Through the double-vibration structure of the double-vibration frame and the reciprocating rotation structure of the rocker, the present invention can achieve multi-directional movement during wafer cleaning. Through multi-directional movement, multi-directional flushing of the wafer by the cleaning liquid can be achieved, thereby improving the cleaning effect of the wafer. Moreover, during cleaning, the present device can also achieve the self-rotation of the wafer body during cleaning, thereby increasing the dirt-throwing intensity of the wafer body through centrifugal force.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and particularly relates to a wafer cleaning machine for wafer processing. Background Art

[0002] A wafer refers to a silicon wafer used in the production of silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. During the wafer processing, it is necessary to remove contaminants such as organic matter, particles, metal impurities, native oxide layer, quartz, and plastic on the wafer surface as needed without damaging the surface characteristics of the wafer.

[0003] In the prior art, various types of wafer cleaning devices have emerged. However, the existing wafer cleaning devices have the following technical problems when in use: the wafer cleaning direction is single, the cleaning effect of pollutants before and after the accumulation of surface cleaning traces is inconsistent, resulting in a poor cleaning effect; the traditional cleaning effect is poor, and pollutants are likely to accumulate on the wafer surface after directional surface cleaning, and the decontamination operation after flushing cannot be effectively carried out, affecting the quality of the subsequent processed wafer. Based on this, we propose a wafer cleaning machine for wafer processing. Summary of the Invention

[0004] The purpose of the present invention is to solve the disadvantages in the background art, and propose a wafer cleaning machine for wafer processing.

[0005] To achieve the above object, the technical solution adopted by the present invention is: a wafer cleaning machine for wafer processing, including a cleaning tank. A cleaning component is provided in the cleaning tank. A top frame is installed on the top surface of the cleaning tank. A double-vibration generating module is installed on the top frame. A double-vibration frame capable of synchronously moving back and forth and reciprocating up and down and a rotatable cleaning shaft are drivingly connected to the double-vibration generating module. A group of bidirectional elastic resetting members are installed between the double-vibration frame and the top frame. The cleaning shaft is rotatably installed on the double-vibration frame. A rotatable gear sleeve is rotatably installed on the double-vibration frame. A reciprocating swing shaft is rotatably installed in the gear sleeve. A reciprocating swing module driven by the cleaning shaft is installed on the swing shaft. A swing frame is installed at the tail end of the swing shaft. Two symmetrically arranged driving shafts are rotatably installed on the swing frame. A synchronous belt is drivingly connected to the gear sleeve. Both of the two driving shafts are drivingly connected to the synchronous belt. A wafer storage basket is clamped on the swing frame. A wafer rotation generating module linked to the driving shaft is installed on the wafer storage basket. A wafer body is carried on the wafer storage basket.

[0006] Preferably, the cleaning component includes a gate slot opened in the cleaning tank. A gate plate is slidably installed on the gate slot. Two symmetrically arranged electric heaters are installed on the cleaning tank. A group of regularly distributed ultrasonic cleaning rods are installed at the bottom of the cleaning tank. A sewage discharge valve is installed on the side surface of the cleaning tank. A single-chip microcomputer is installed on the top frame.

[0007] Preferably, the reciprocating rocking module includes a rocking bevel gear installed on a rocking shaft, the rocking shaft is sleeved with a torsion spring connected to a double vibration frame, the rocking shaft is respectively installed with a first missing bevel gear and a second missing bevel gear, the first missing bevel gear and the second missing bevel gear are each provided with a tooth surface, the tooth surface is evenly distributed with teeth meshing with the rocking bevel gear, the gear sleeve and the cleaning shaft are both installed with linked bevel gears, and the two linked bevel gears are meshed with each other.

[0008] Preferably, the curvature of the tooth surface is 45°, the tooth surfaces on the first bevel-missing tooth and the second bevel-missing tooth are staggered by 180°, and the first bevel-missing tooth and the second bevel-missing tooth are respectively arranged on both sides of the rocking bevel tooth.

[0009] Preferably, the bidirectional elastic reset member includes a slide table slidably connected to the top frame, a vertical spring limited by the top frame is installed on the bottom surface of the slide table, a T-shaped guide rod is installed on the double vibration frame, the T-shaped guide rod is slidably connected to the slide table, and a flat spring limited by the T-shaped guide rod is sleeved on the T-shaped guide rod.

[0010] Preferably, the dual-vibration generating module includes a motor mounted on a top frame and a translation frame slidably connected to the top frame, the output shaft end of the motor is mounted with an inner square shaft, the translation frame is rotatably mounted with an outer square shaft linked to the inner square shaft, the top frame is respectively rotatably mounted with a front shaft and a rear shaft, the rear shaft and the inner square shaft are both mounted with a first bevel gear, the two first bevel gears are meshed with each other, the front shaft is transmission-connected to the rear shaft via a chain belt, a first half-tooth gear is mounted on the front shaft, a translation gear plate is mounted on the translation frame, the first half-tooth gear is transmission-connected to the translation gear plate, and a reciprocating guide is mounted on the dual-vibration frame and the translation gear plate.

[0011] Preferably, the reciprocating guide member includes a sleeve shaft rotatably connected to the translation frame, the sleeve shaft is linked to the cleaning shaft, the sleeve shaft and the outer square shaft are both equipped with a second bevel gear, the two second bevel gears are meshed with each other, a vertical tooth plate is installed on the double vibration frame, a circular shaft is rotatably installed on the translation frame, a second half-tooth gear is installed on the circular shaft, and the second half-tooth gear is transmission-connected to the vertical tooth plate.

[0012] Preferably, the outer square shaft is fixedly provided with a first square groove which is slidably connected to the inner square shaft, the sleeve shaft is fixedly provided with a second square groove which is open at both ends, the top of the cleaning shaft is provided with a square section which is slidably connected to the second square groove, and the cross-sections of the square section, the inner square shaft, the first square groove and the second square groove are all regular polygons.

[0013] Preferably, the wafer rotation generating module includes two fixed clamping shafts rotatably connected to the wafer storage basket, the tail end of the fixed clamping shaft and the front end of the driving shaft are both installed with friction disks, and the friction disks are evenly distributed with friction patterns, and a clamping screw and a transmission button are rotatably installed on the wafer storage basket, and the clamping screw is driven by the transmission button, and the clamping screw is symmetrically provided with positive thread sections and negative thread sections, and the positive thread sections and the negative thread sections are both transmission-mounted with clamps, and a dynamic clamping shaft is rotatably installed on the two clamps, and a group of regularly distributed silicone clamping wheels that cooperate with the wafer body are installed on the fixed clamping shaft and the dynamic clamping shaft.

[0014] Preferably, an electromagnetic block cooperating with the cradle is fixedly mounted on the wafer storage basket, and a slide groove cooperating with the wafer storage basket is provided at the bottom of the cradle.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention can realize multi-directional movement during wafer cleaning through the dual-vibration structure setting of the dual-vibration frame and the reciprocating rotation structure setting of the rocker. Through the multi-directional movement, the cleaning liquid can flush the wafer in multiple directions, thereby improving the cleaning effect of the wafer. In addition, the device can also realize the self-spinning of the wafer body during cleaning, thereby improving the dirt rejection intensity of the wafer body through centrifugal force.

[0017] 2. The present invention arranges the tooth surfaces of the first and second conical teeth at an offset of 0.1° and the torsion springs, so that the rocking shaft can drive the rocking frame to rock back and forth within a set angle range. After the rocking frame rocked back and forth, it drives the wafer storage basket to rock back and forth within the set angle. The wafer storage basket rocked back and forth in the cleaning box, so that the cleaning liquid can flush the wafer body in the wafer storage basket back and forth, thereby improving the cleaning efficiency of the wafer body and the effect of removing impurities on the wafer body.

[0018] 3. In the present invention, when the wafer body needs to be installed on the wafer storage basket, the transmission button drives the clamping screw to make the two clamps move away from each other. After the two clamps move away from each other, the two movable clamping shafts are fully separated. After the two movable clamping shafts are fully separated, it is convenient to place the wafer body on the wafer storage basket. When the wafer body is placed on the wafer storage basket, the transmission button drives the clamping screw to make the two movable clamping shafts cooperate with the fixed clamping shafts and realize four-point positioning of the wafer body on the wafer storage basket. The four-point positioning can effectively improve the stability of the wafer body during cleaning. During cleaning, the wafer body placed on the wafer storage basket can rotate at a set speed through the drive shaft. The rotation of the wafer body during cleaning can improve the flushing degree of the cleaning liquid on the wafer body and enable the ultrasonic cleaning rod to act evenly on the wafer body. The rotation of the wafer body during cleaning can improve the effect of throwing away dirt on the wafer body through centrifugal force. Brief Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of a wafer cleaning machine for wafer processing according to the present invention;

[0020] Figure 2 It is a schematic structural diagram of the cleaning tank and the electric heater according to the present invention;

[0021] Figure 3 It is a schematic structural diagram of the double vibration frame and the motor according to the present invention;

[0022] Figure 4 According to the present invention Figure 3 It is a schematic diagram of the partial enlarged structure at position A in the present invention;

[0023] Figure 5 It is a schematic structural diagram of the square section and the second half-tooth gear according to the present invention;

[0024] Figure 6 According to the present invention Figure 5 It is a schematic diagram of the structure from another perspective;

[0025] Figure 7 According to the present invention Figure 6 It is a schematic diagram of the partial enlarged structure at position B in the present invention;

[0026] Figure 8 According to the present invention Figure 6 It is a schematic diagram of the partial enlarged structure at position C in the present invention;

[0027] Figure 9 It is a schematic structural diagram of the cleaning shaft according to the present invention.

[0028] In the figure: 1. Cleaning tank; 2. Top frame; 3. Double vibration frame; 4. Cleaning shaft; 5. Tooth sleeve; 6. Rocking shaft; 7. Rocking frame; 8. Driving shaft; 9. Wafer storage basket; 10. Wafer body; 11. Gate slot; 12. Gate plate; 13. Electric heater; 14. Ultrasonic cleaning rod; 15. Single-chip microcomputer; 16. Rocking bevel gear; 17. First missing bevel gear; 18. Second missing bevel gear; 19. Slide table; 20. Vertical spring; 21. T-shaped guide rod; 22. Flat spring; 23. Torsion spring; 24. Motor; 25. Translation frame; 26. Inner square shaft; 27. Outer square shaft; 28. Front shaft; 29. Rear shaft; 30. First half-tooth gear; 31. Translation tooth plate; 32. Sleeve shaft; 33. Vertical tooth plate; 34. Round shaft; 35. Second half-tooth gear; 36. Square section; 37. Fixed clamping shaft; 38. Friction disc; 39. Clamping screw rod; 40. Transmission knob; 41. Clamp; 42. Moving clamping shaft; 43. Silicone clamping wheel; 44. Electromagnetic block. Detailed Description of the Invention

[0029] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and other obvious variations can be conceived by those skilled in the art.

[0030] As Figures 1-9 shown, a wafer cleaning machine for wafer processing includes a cleaning tank 1, and a cleaning component is provided in the cleaning tank 1;

[0031] A top frame 2 is installed on the top surface of the cleaning tank 1;

[0032] Referring to Figure 1 and Figure 2 shown, the cleaning component includes a gate slot 11 opened in the cleaning tank 1, a gate plate 12 is slidably installed on the gate slot 11, two symmetrically arranged electric heaters 13 are installed on the cleaning tank 1, a group of regularly distributed ultrasonic cleaning rods 14 are installed at the bottom of the cleaning tank 1, a sewage discharge valve is installed on the side of the cleaning tank 1, and a single-chip microcomputer 15 is installed on the top frame 2;

[0033] When the wafer storage basket 9 needs to be installed on the swing frame 7, the gate plate 12 is opened. During cleaning, the gate plate 12 is installed in the gate slot 11. Subsequently, a sufficient amount of cleaning liquid is injected into the interior of the cleaning tank 1. When injecting the cleaning liquid, it should be ensured that the injection height of the cleaning liquid submerges the wafer body 10. During cleaning, the electric heater 13 heats the cleaning liquid in the cleaning tank 1 at a set power, and the ultrasonic cleaning rod 14 generates an ultrasonic frequency at a set power, thereby realizing ultrasonic cleaning of the wafer body 10;

[0034] Referring to Figure 1 、 Figure 3 、 Figure 2 shown, a double-vibration generating module is installed on the top frame 2. A double-vibration frame 3 that can synchronously move back and forth and reciprocate up and down and a rotatable cleaning shaft 4 are drivingly connected to the double-vibration generating module. A group of bidirectional elastic resetting members are installed between the double-vibration frame 3 and the top frame 2, and the cleaning shaft 4 is rotatably installed on the double-vibration frame 3;

[0035] The bidirectional elastic resetting member includes a sliding table 19 slidably connected to the top frame 2. A vertical spring 20 limited by the top frame 2 is installed on the bottom surface of the sliding table 19. A T-shaped guide rod 21 is installed on the double-vibration frame 3. The T-shaped guide rod 21 is slidably connected to the sliding table 19, and a flat spring 22 limited by the T-shaped guide rod 21 is sleeved on the T-shaped guide rod 21;

[0036] When the double-vibration frame 3 moves back and forth and reciprocates up and down, through the setting of the bidirectional elastic resetting member, bidirectional elastic limiting of the double-vibration frame 3 is realized;

[0037] The double-vibration generating module includes a motor 24 installed on the top frame 2 and a translation frame 25 slidably connected to the top frame 2. An inner square shaft 26 is installed at the output shaft end of the motor 24, and an outer square shaft 27 linked with the inner square shaft 26 is rotatably installed on the translation frame 25;

[0038] A first square groove slidably connected to the inner square shaft 26 is fixedly formed on the outer square shaft 27;

[0039] Refer to Figures 5-9 As shown, a front shaft 28 and a rear shaft 29 are respectively rotatably installed on the top frame 2. First bevel gears are installed on both the rear shaft 29 and the inner square shaft 26, and the two first bevel gears mesh with each other. The front shaft 28 is drivingly connected to the rear shaft 29 through a chain belt;

[0040] A first half-tooth gear 30 is installed on the front shaft 28, a translation toothed plate 31 is installed on the translation frame 25, the first half-tooth gear 30 is drivingly connected to the translation toothed plate 31, and a reciprocating guiding member is installed on the double-vibration frame 3 and the translation toothed plate 31;

[0041] After the motor 24 outputs a rotational speed, through the settings of the first half-tooth gear 30, the translation toothed plate 31 and the bi-directional elastic reset member, the reciprocating displacement of the translation frame 25 in the front and rear directions is realized. After the translation frame 25 reciprocates in the front and rear directions, the wafer storage basket 9 is driven to reciprocate in the front and rear directions in the cleaning tank 1;

[0042] The reciprocating guiding member includes a sleeve shaft 32 rotatably connected to the translation frame 25, and the sleeve shaft 32 is linked with the cleaning shaft 4;

[0043] A second square groove with both ends open is fixedly formed on the sleeve shaft 32, and a square section 36 slidably connected to the second square groove is provided at the top of the cleaning shaft 4;

[0044] The cross-sections of the square section 36, the inner square shaft 26, the first square groove and the second square groove are all regular polygons;

[0045] Through the settings of the regular polygon cross-sections of the square section 36, the inner square shaft 26, the first square groove and the second square groove, when the cleaning shaft 4 reciprocates in the front and rear directions and up and down directions synchronously along the double-vibration frame 3, the motor 24 can continuously drive the cleaning shaft 4;

[0046] A second bevel gear is installed on both the sleeve shaft 32 and the outer square shaft 27, and the two second bevel gears mesh with each other;

[0047] Refer to Figures 5-9 As shown, a vertical toothed plate 33 is installed on the double-vibration frame 3, a circular shaft 34 is rotatably installed on the translation frame 25, a second half-tooth gear 35 is installed on the circular shaft 34, and the second half-tooth gear 35 is drivingly connected to the vertical toothed plate 33;

[0048] A rotatable gear sleeve 5 is rotatably mounted on the double vibration frame 3, a reciprocating rocking shaft 6 is rotatably mounted inside the gear sleeve 5, a reciprocating rocking module driven by the cleaning shaft 4 is mounted on the rocking shaft 6, and a cradle 7 is mounted at the tail end of the rocking shaft 6;

[0049] The reciprocating shaking module includes a shaking bevel gear 16 mounted on a shaking shaft 6, a torsion spring 23 connected to the double vibration frame 3 is sleeved on the shaking shaft 6, a first missing bevel gear 17 and a second missing bevel gear 18 are respectively mounted on the shaking shaft 6, and a tooth surface is provided on the first missing bevel gear 17 and the second missing bevel gear 18, and teeth meshing with the shaking bevel gear 16 are evenly distributed on the tooth surface;

[0050] The curvature of the tooth surface is 45°, and the tooth surfaces on the first missing bevel tooth 17 and the second missing bevel tooth 18 are staggered by 180°. The first missing bevel tooth 17 and the second missing bevel tooth 18 are respectively arranged on both sides of the shaking bevel tooth 16;

[0051] By means of the 180° offset setting of the tooth surfaces of the first missing bevel tooth 17 and the second missing bevel tooth 18 and the setting of the torsion spring 23, the rocking shaft 6 can drive the rocking frame 7 to rock back and forth within the set angle range. After the rocking frame 7 rocked back and forth, the wafer storage basket 9 was driven to rock back and forth within the set angle. By means of the reciprocating rocking of the wafer storage basket 9 in the cleaning box 1, the cleaning liquid can realize the reciprocating flushing of the wafer body 10 in the wafer storage basket 9, thereby improving the cleaning efficiency of the wafer body 10 and the removal effect of the impurities on the wafer body 10.

[0052] Linked bevel gears are installed on the gear sleeve 5 and the cleaning shaft 4, and the two linked bevel gears are meshed with each other;

[0053] Two symmetrically arranged drive shafts 8 are rotatably mounted on the cradle 7, and a synchronous belt is connected to the gear sleeve 5 for transmission, and both drive shafts 8 are connected to the synchronous belt for transmission;

[0054] Through the linkage bevel gear arrangement on the cleaning shaft 4 and the gear sleeve 5, after the cleaning shaft 4 rotates, the gear sleeve 5 can reciprocate, and after the gear sleeve 5 reciprocates, it drives the two drive shafts 8 to rotate synchronously at the same speed;

[0055] A wafer storage basket 9 is clamped on the cradle 7;

[0056] See also Figure 3 , Figure 4 and Figure 5 As shown, an electromagnetic block 44 cooperating with the cradle 7 is fixedly mounted on the wafer storage basket 9, a slideway cooperating with the wafer storage basket 9 is provided at the bottom of the cradle 7, and a guide rail portion cooperating with the slideway is fixedly provided on the wafer storage basket 9;

[0057] Through the cooperation of the slide groove and the guide rail, the wafer storage basket 9 is accurately positioned and installed on the cradle 7. After the wafer storage basket 9 is accurately positioned and installed on the cradle 7, the wafer storage basket 9 can be magnetically attracted to the cradle 7 by the setting of the electromagnetic block 44, thereby realizing the accurate positioning of the wafer storage basket 9 on the cradle 7.

[0058] A wafer rotation generating module linked with the driving shaft 8 is installed on the wafer storage basket 9 , and a wafer body 10 is carried on the wafer storage basket 9 .

[0059] The wafer rotation module includes two fixed clamping shafts 37 rotatably connected to the wafer storage basket 9, and the tail ends of the fixed clamping shafts 37 and the front ends of the driving shafts 8 are both equipped with friction discs 38, and the friction discs 38 are evenly distributed with friction lines;

[0060] When the wafer storage basket 9 is installed on the cradle 7, the positions of the two fixed clamping shafts 37 correspond to the positions of the two driving shafts 8 respectively, and the friction disk 38 at the tail of the fixed clamping shaft 37 is pressed and fitted with the friction disk 38 at the front end of the driving shaft 8. When the friction disk 38 at the tail of the fixed clamping shaft 37 is pressed and fitted with the friction disk 38 at the front end of the driving shaft 8, the driving shaft 8 then drives the fixed clamping shaft 37 to rotate at a set speed. After the driving shaft 8 rotates, the wafer body 10 to be cleaned is driven to rotate at a set speed in the wafer storage basket 9;

[0061] A clamping screw 39 and a transmission button 40 are rotatably installed on the upper end of the wafer storage basket 9. The clamping screw 39 is driven by the transmission button 40. The clamping screw 39 is symmetrically provided with a positive thread section and a negative thread section. The positive thread section and the negative thread section are both transmission-mounted with clamps 41. A movable clamping shaft 42 is rotatably installed on the two clamps 41. A group of regularly distributed silicone clamping wheels 43 that cooperate with the wafer body 10 are installed on the fixed clamping shaft 37 and the movable clamping shaft 42.

[0062] When it is necessary to install the wafer body 10 on the wafer storage basket 9, the driving knob 40 drives the clamping screw rod 39, causing the two clamps 41 to move away from each other. After the two clamps 41 move away from each other, the two moving clamping shafts 42 are further separated. After the two moving clamping shafts 42 are fully separated, it is convenient to place the wafer body 10 on the wafer storage basket 9. When the wafer body 10 is placed on the wafer storage basket 9, the driving knob 40 drives the clamping screw rod 39, so that the two moving clamping shafts 42 can cooperate with the fixed clamping shaft 37 to achieve four-point positioning of the wafer body 10 on the wafer storage basket 9. Through four-point positioning, the stability of the wafer body 10 during cleaning is effectively improved. During cleaning, driven by the drive shaft 8, the wafer body 10 placed on the wafer storage basket 9 can rotate at a set speed. Through the rotation of the wafer body 10 during cleaning, the flushing degree of the cleaning liquid on the wafer body 10 is increased and the ultrasonic cleaning rod 14 can act on the wafer body 10 evenly. Moreover, through the rotation of the wafer body 10 during cleaning, the effect of flinging out dirt on the wafer body 10 can be improved by centrifugal force;

[0063] Working principle: When it is necessary to install the wafer storage basket 9 on the swing frame 7, the gate plate 12 is opened. During cleaning, the gate plate 12 is installed in the gate slot 11. Subsequently, a sufficient amount of cleaning liquid is injected into the cleaning tank 1. When injecting the cleaning liquid, it should be ensured that the injection height of the cleaning liquid submerges the wafer body 10. During cleaning, the electric heater 13 heats the cleaning liquid in the cleaning tank 1 at a set power, and the ultrasonic cleaning rod 14 generates an ultrasonic frequency at a set power, thereby realizing ultrasonic cleaning of the wafer body 10. When it is necessary to install the wafer body 10 on the wafer storage basket 9, the driving knob 40 drives the clamping screw rod 39, causing the two clamps 41 to move away from each other. After the two clamps 41 move away from each other, the two moving clamping shafts 42 are further separated. After the two moving clamping shafts 42 are fully separated, it is convenient to place the wafer body 10 on the wafer storage basket 9. When the wafer body 10 is placed on the wafer storage basket 9, the driving knob 40 drives the clamping screw rod 39, so that the two moving clamping shafts 42 can cooperate with the fixed clamping shaft 37 to achieve four-point positioning of the wafer body 10 on the wafer storage basket 9. Through four-point positioning, the stability of the wafer body 10 during cleaning is effectively improved. During cleaning, driven by the drive shaft 8, the wafer body 10 placed on the wafer storage basket 9 can rotate at a set speed. Through the rotation of the wafer body 10 during cleaning, the flushing degree of the cleaning liquid on the wafer body 10 is increased and the ultrasonic cleaning rod 14 can act on the wafer body 10 evenly. Moreover, through the rotation of the wafer body 10 during cleaning, the effect of flinging out dirt on the wafer body 10 can be improved by centrifugal force. Through the double-vibration movement of the double-vibration frame 3, the wafer storage basket 9 can move in multiple directions during cleaning and achieve the effect of multi-directional cleaning.

[0064] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above-mentioned embodiments. What is described in the above embodiments and the specification is only the principle of the present invention. Without departing from the spirit and scope of the present invention, various changes and improvements will occur to the present invention, and these changes and improvements fall within the scope of the present invention claimed. The scope of protection required by the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning machine for wafer processing, comprising a cleaning tank (1), wherein a cleaning component is arranged in the cleaning tank (1), and it is characterized in that: A top frame (2) is installed on the top surface of the cleaning tank (1). A double-vibration generating module is installed on the top frame (2). A double-vibration frame (3) capable of synchronously moving forward and backward and reciprocating up and down, and a rotatable cleaning shaft (4) are drivingly connected to the double-vibration generating module. A set of bi-directional elastic reset members are installed between the double-vibration frame (3) and the top frame (2). The cleaning shaft (4) is rotatably installed on the double-vibration frame (3). A rotatable gear sleeve (5) is rotatably installed on the double-vibration frame (3). A reciprocating swing shaft (6) capable of reciprocatingly swinging is rotatably installed in the gear sleeve (5). A reciprocating swing module driven by the cleaning shaft (4) is installed on the swing shaft (6). A swing frame (7) is installed at the tail end of the swing shaft (6). Two symmetrically arranged driving shafts (8) are rotatably installed on the swing frame (7). A synchronous belt is drivingly connected to the gear sleeve (5). Both of the two driving shafts (8) are drivingly connected to the synchronous belt. A wafer storage basket (9) is clamped on the swing frame (7). A wafer rotation generating module linked to the driving shaft (8) is installed on the wafer storage basket (9). A wafer body (10) is carried on the wafer storage basket (9).

2. The wafer cleaning machine for wafer processing according to claim 1, wherein: The cleaning assembly includes a gate slot (11) opened in the cleaning tank (1). A gate plate (12) is slidably installed on the gate slot (11). Two symmetrically arranged electric heaters (13) are installed on the cleaning tank (1). A set of regularly distributed ultrasonic cleaning rods (14) are installed at the bottom of the cleaning tank (1). A sewage discharge valve is installed on the side of the cleaning tank (1). A single-chip microcomputer (15) is installed on the top frame (2).

3. A wafer cleaning machine for wafer processing according to claim 1, characterized in that: The reciprocating swing module includes a swing bevel gear (16) installed on the swing shaft (6). A torsion spring (23) connected to the double-vibration frame (3) is sleeved on the swing shaft (6). A first missing bevel gear (17) and a second missing bevel gear (18) are respectively installed on the swing shaft (6). A tooth surface is provided on both the first missing bevel gear (17) and the second missing bevel gear (18). Teeth meshing with the swing bevel gear (16) are evenly distributed on the tooth surface. Linkage bevel gears are installed on both the gear sleeve (5) and the cleaning shaft (4). The two linkage bevel gears mesh with each other.

4. A wafer cleaning machine for wafer processing according to claim 3, wherein: The radian of the tooth surface is 45°. The tooth surfaces on the first missing bevel gear (17) and the second missing bevel gear (18) are arranged with a 180° dislocation. The first missing bevel gear (17) and the second missing bevel gear (18) are respectively arranged on both sides of the swing bevel gear (16).

5. A wafer cleaning machine for wafer processing according to claim 1, characterized in that: The bi-directional elastic reset member includes a sliding table (19) slidably connected to the top frame (2). A vertical spring (20) limited by the top frame (2) is installed on the bottom surface of the sliding table (19). A T-shaped guide rod (21) is installed on the double-vibration frame (3). The T-shaped guide rod (21) is slidably connected to the sliding table (19). A flat spring (22) limited by the T-shaped guide rod (21) is sleeved on the T-shaped guide rod (21).

6. A wafer cleaning machine for wafer processing according to claim 5, wherein: The dual vibration generating module comprises a motor (24) mounted on a top frame (2) and a translation frame (25) slidably connected to the top frame (2); an inner square shaft (26) is mounted on the output shaft end of the motor (24); an outer square shaft (27) linked to the inner square shaft (26) is rotatably mounted on the translation frame (25); a front shaft (28) and a rear shaft (29) are rotatably mounted on the top frame (2), respectively; first bevel gears are mounted on the rear shaft (29) and the inner square shaft (26); the two first bevel gears are meshed with each other; the front shaft (28) is transmission-connected to the rear shaft (29) via a chain belt; a first half-tooth gear (30) is mounted on the front shaft (28); a translation tooth plate (31) is mounted on the translation frame (25); the first half-tooth gear (30) is transmission-connected to the translation tooth plate (31); and a reciprocating guide is mounted on the dual vibration frame (3) and the translation tooth plate (31).

7. The wafer cleaning machine for wafer processing according to claim 6, characterized in that: The reciprocating guide member comprises a sleeve shaft (32) rotatably connected to the translation frame (25), the sleeve shaft (32) being linked to the cleaning shaft (4), the sleeve shaft (32) and the outer square shaft (27) being both provided with a second bevel gear, the two second bevel gears being meshed with each other, a vertical tooth plate (33) being provided on the double vibration frame (3), a round shaft (34) being rotatably installed on the translation frame (25), a second half-tooth gear (35) being installed on the round shaft (34), and the second half-tooth gear (35) being transmission-connected to the vertical tooth plate (33).

8. A wafer cleaning machine for wafer processing according to claim 7, characterized in that: The outer square shaft (27) is fixedly provided with a first square groove which is slidably connected to the inner square shaft (26); the sleeve shaft (32) is fixedly provided with a second square groove which is open at both ends; the top of the cleaning shaft (4) is provided with a square section (36) which is slidably connected to the second square groove; the cross-sections of the square section (36), the inner square shaft (26), the first square groove and the second square groove are all regular polygons.

9. A wafer cleaning machine for wafer processing according to claim 1, wherein: The wafer rotation generating module comprises two fixed clamping shafts (37) rotatably connected to the wafer storage basket (9), the tail end of the fixed clamping shaft (37) and the front end of the driving shaft (8) are both equipped with friction disks (38), and the friction disks (38) are evenly distributed with friction lines. A clamping screw (39) and a transmission button (40) are rotatably installed on the wafer storage basket (9), and the clamping screw (39) is driven by the transmission button (40). The clamping screw (39) is symmetrically provided with positive thread segments and negative thread segments, and the positive thread segments and the negative thread segments are both transmission-mounted with clamps (41), and the two clamps (41) are both rotatably equipped with a dynamic clamping shaft (42), and a group of regularly distributed silicone clamping wheels (43) that cooperate with the wafer body (10) are both installed on the fixed clamping shaft (37) and the dynamic clamping shaft (42).

10. A wafer cleaning machine for wafer processing according to claim 9, characterized in that: An electromagnetic block (44) cooperating with the cradle (7) is fixedly mounted on the wafer storage basket (9), and a sliding groove cooperating with the wafer storage basket (9) is provided at the bottom of the cradle (7).

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