Temperature measuring device, temperature measuring equipment, measuring method and storage medium

Abstract

The invention relates to the technical field of electronic equipment, and discloses a temperature measuring device, temperature measuring equipment, a measuring method and a storage medium. The temperature measuring device comprises a first temperature measuring assembly, a separating assembly and a second temperature measuring assembly which are sequentially arranged in a stacked mode. Wherein the first temperature measuring assembly comprises a first substrate, a first temperature sensor and a heating part, and the first temperature sensor and the heating part are arranged on the first substrate. The separation assembly is provided with a heat insulation structure which is used for blocking heat transfer from the heating component to the second temperature measurement assembly. The second temperature measuring assembly comprises a second substrate and a second temperature sensor, and the second temperature sensor is arranged on the second substrate. According to the temperature measuring device, the heat insulation structure is additionally arranged, so that the risk of heat mixing between the heating component and the second temperature measuring assembly is effectively reduced, the measuring accuracy of the temperature measuring device is improved, and non-invasive measurement of the core body temperature is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a temperature measuring device, a temperature measuring equipment, a measuring method and a storage medium. Background Art

[0002] In clinical practice, core body temperature specifically refers to the temperature of the chest cavity, abdominal cavity and central nervous system inside the body of an organism. Its value is relatively stable and higher than the surface temperature. Currently, one way to measure human core body temperature is invasive measurement. Among them, invasive measurement is to insert a needle probe into the measured part (for example, inside the blood vessel, inside the bladder, inside the tympanic membrane, oral cavity, esophagus, temporal artery, and nasopharynx, etc.), and measure the core body temperature through the correlation between the probe voltage, resistance or impedance and the core body temperature change. However, invasive measurement has the problem of being unable to accurately locate the measurement position, resulting in inaccurate measurement results, or cannot be used for certain measurement parts (such as the heart or brain).

[0003] Therefore, there are some non-invasive measurement methods for measuring human core body temperature, for example, non-invasive measurement usually includes ultrasonic transmission method, X-ray computed tomography (X-CT) method, electromagnetic wave measurement method, nuclear magnetic resonance (NMR) method, infrared temperature measurement and heat flux method, etc. The current non-invasive measurement methods are difficult to balance measurement accuracy and measurement convenience, and the scope of application is limited. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides a temperature measuring device, a temperature measuring equipment, a measuring method and a storage medium. The present application is introduced from multiple aspects below, and the implementation methods and beneficial effects of the following multiple aspects can be referenced to each other.

[0005] The first aspect of the present application provides a temperature measuring device. The temperature measuring device includes a first temperature measuring component and a separation component, and a second temperature measuring component, which are stacked in sequence. The first temperature measuring component includes a first substrate, a first temperature sensor and a heating component, and the first temperature sensor and the heating component are arranged on the first substrate. The separation component is provided with a heat insulation structure, and the heat insulation structure is used to block the heat transfer from the heating component to the second temperature measuring component. The second temperature measuring component includes a second substrate and a second temperature sensor, and the second temperature sensor is arranged on the second substrate.

[0006] The temperature measuring device described above effectively reduces the risk of heat transfer between the heating component and the second temperature measuring component by adding a heat insulation structure, thereby improving the measurement accuracy of the temperature measuring device and realizing non-invasive measurement of core body temperature.

[0007] In a possible implementation of the first aspect above, the thermal insulation structure includes a through hole, a blind hole or a thermal insulation pad.

[0008] In a possible implementation of the first aspect above, the partition component is plate-shaped, the thermal insulation structure is a through hole, the through hole is opened on the partition component, and the heating component on the first substrate is located within a projection area of ​​the through hole on the first substrate.

[0009] In this way, there is no physical connection between the heating component and the partition component, which has a heat insulation effect, reduces the heat transfer from the heating component to the second temperature measuring component, and thus improves the measurement accuracy of the temperature measuring device.

[0010] In a possible implementation of the first aspect above, the thickness of the partition assembly is between 1 mm and 10 mm.

[0011] According to the embodiment of the present application, when the material of the partition component is polydimethylsiloxane, the thickness of the partition component can be 1 mm, so that the temperature measuring device and the object to be tested can reach thermal equilibrium more quickly, further reducing the measurement time.

[0012] In a possible implementation of the first aspect above, the first substrate and the second substrate are plate-shaped.

[0013] In a possible implementation of the first aspect above, the through hole, the first substrate, and the second substrate together form a closed cavity, and the heating component is located in the cavity.

[0014] The above-mentioned cavity can isolate the heating component from the outside world, thereby effectively reducing the impact of external temperature changes on the heat exchange process, making the heat exchange environment of the heating component more stable, thereby improving the repeatability and anti-interference of thermal conductivity measurement, and improving measurement accuracy.

[0015] In a possible implementation of the first aspect above, the thermal conductivity of the material of the partition component is between 0.01 W / (m·K) and 10 W / (m·K) to meet the working requirements of the temperature measuring device.

[0016] In a possible implementation of the first aspect above, the material of the partition component includes polydimethylsiloxane.

[0017] In a possible implementation of the first aspect above, the first substrate and the second substrate are bonded to the separation component respectively.

[0018] According to the embodiment of the present application, when the material of the partition component is polydimethylsiloxane, the first substrate and the second substrate can be bonded to the partition component respectively according to the chemical properties of polydimethylsiloxane. Therefore, there is no need to set additional adhesive for fixing between the first substrate and the partition component, and between the second substrate and the partition component, thereby effectively reducing the contact thermal resistance between the first substrate and the partition component, and the contact thermal resistance between the second substrate and the partition component, so that the temperature measuring device and the user's wrist can reach thermal equilibrium faster, thereby greatly reducing the measurement time.

[0019] In a possible implementation of the first aspect above, materials of the first substrate and the second substrate include sapphire or glass.

[0020] In a possible implementation of the first aspect above, the first temperature measuring component includes a plurality of first temperature sensors distributed in a ring shape, and / or the second temperature measuring component includes a plurality of second temperature sensors distributed in a ring shape.

[0021] According to the implementation manner of the present application, multiple first temperature sensors and / or second temperature sensors distributed in a ring shape can cover a larger area, thereby further improving the measurement accuracy.

[0022] The second aspect of the present application provides a temperature measuring device, which includes a control module and the temperature measuring device in the first aspect and any possible implementation of the first aspect, wherein the temperature measuring device is communicatively connected to the control module.

[0023] According to the implementation mode of the present application, the temperature measuring device first measures the thermal conductivity of the object to be tested through the temperature measuring device and the control module, and then further calculates the core body temperature based on the thermal conductivity, so it can effectively avoid the measurement error caused by the difference in skin conditions of different objects to be tested, thereby improving the accuracy of core body temperature measurement. In addition, the non-invasive measurement of core body temperature can be completed by simply fitting the object to be tested with the temperature measuring device, so the object to be tested will not be damaged during the measurement process, the measurement comfort is high, the measurement steps are simple, and the scope of application is wide.

[0024] In a possible implementation of the second aspect above, the temperature measuring device is a wearable electronic device.

[0025] In a possible implementation of the second aspect above, the wearable electronic device includes at least one of a watch, a bracelet, a temperature patch, an electrocardiogram patch, a smart fabric, headphones, and smart glasses.

[0026] The third aspect of the present application provides a core body temperature measurement method, the method comprising: heating a subject to be tested by a temperature measuring device, and obtaining a plurality of temperature values ​​of the subject to be tested in a first time period during the heating process. Then, the thermal conductivity of the subject to be tested is determined based on the plurality of temperature values. Finally, the core body temperature of the subject to be tested is determined based on the upper layer temperature and the lower layer temperature of the temperature measuring device and the thermal conductivity of the subject to be tested.

[0027] The above core body temperature measurement method first measures the thermal conductivity of the object to be tested, and then further calculates the core body temperature based on the thermal conductivity, which can effectively avoid the measurement error caused by the difference in skin conditions of different objects to be tested, thereby improving the accuracy of core body temperature measurement. In addition, non-invasive measurement can be completed by simply fitting the object to be tested with the temperature measuring device, which will not cause damage to the object to be tested, has high measurement comfort, simple measurement steps, and a wide range of applications.

[0028] In a possible implementation of the third aspect, determining a first thermal conductivity of the object to be tested based on multiple temperature values ​​includes: determining a first temperature rise value of the object to be tested within a first time period based on the multiple temperature values. Obtaining a first heat flow distribution coefficient corresponding to the first temperature rise value. Calculating a first thermal conductivity of the object to be tested based on the first heat flow distribution coefficient and the first temperature rise value. If the difference between the first thermal conductivity and a second thermal conductivity corresponding to the pre-stored first heat flow distribution coefficient is less than a first threshold, determining the first thermal conductivity as the thermal conductivity of the object to be tested.

[0029] In a possible implementation of the third aspect, the measuring method further includes: corresponding to the difference between the first thermal conductivity and the second thermal conductivity corresponding to the pre-stored first heat flow distribution coefficient being greater than a first threshold, adjusting the size of the first heat flow distribution coefficient to obtain the second heat flow distribution coefficient. Based on the second heat flow distribution coefficient and a plurality of temperature values, calculating a third thermal conductivity of the object to be tested. Corresponding to the difference between the third thermal conductivity and the fourth thermal conductivity corresponding to the pre-stored second heat flow distribution coefficient being less than the first threshold, determining the third thermal conductivity as the thermal conductivity of the object to be tested.

[0030] The above measurement method first determines a first heat flow distribution coefficient according to the first temperature rise value, and then calculates the first thermal conductivity based on the first temperature rise value and the first heat flow distribution coefficient. Then, the first thermal conductivity is compared with the pre-stored second thermal conductivity corresponding to the first heat flow distribution coefficient, and the size of the first heat flow distribution coefficient is adjusted by continuous iteration based on the comparison result, so that the difference between the first thermal conductivity and the pre-stored second thermal conductivity corresponding to the first heat flow distribution coefficient can be made smaller and smaller, thereby further improving the accuracy of thermal conductivity measurement, and then improving the accuracy of core body temperature measurement.

[0031] In a possible implementation of the third aspect, the first threshold value belongs to a numerical range of 0.001 W / (m·K) to 0.01 W / (m·K).

[0032] In a possible implementation of the third aspect, calculating a first thermal conductivity of the object to be tested based on the first heat flux distribution coefficient and the first temperature rise value includes:

[0033] The first thermal conductivity of the object to be tested is calculated based on the following formula:

[0034]

[0035] Wherein, ΔT is the first temperature rise value; A1 is the first heat flux distribution coefficient; A2 is the distance between the heating point and the detection point of the temperature measuring device; Q is the heating power of the temperature measuring device; t is the first time period; λ tissue is the first thermal conductivity of the object to be measured; ρ tissue c p,tissue is the volume specific heat of the object to be measured.

[0036] In a possible implementation of the third aspect, the temperature measuring device includes a first temperature measuring component, a partition component, and a second temperature measuring component, which are stacked in sequence. The first temperature measuring component includes a first substrate, a first temperature sensor, and a heating component, and the first temperature sensor and the heating component are arranged on the first substrate. A heat insulation structure is provided on the partition component, and the heat insulation structure is used to block the heat transfer from the heating component to the second temperature measuring component. The second temperature measuring component includes a second substrate and a second temperature sensor, and the second temperature sensor is arranged on the second substrate. The first temperature sensor and the second temperature sensor are used to measure multiple temperature values ​​of the object to be tested within a first time period during the heating process.

[0037] A fourth aspect of the present application provides a computer-readable storage medium having instructions stored thereon, which, when executed by a computer, enables the computer to implement the core body temperature measurement method of the third aspect and any possible implementation of the third aspect.

[0038] In a fifth aspect, the present application provides a temperature measuring device, which includes a memory and one or more processors. The memory is used to store instructions, and when the instructions are executed by one or more processors, the processors execute the core body temperature measurement method of the third aspect and any possible implementation of the third aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1A An exemplary block diagram of a temperature measuring device in an embodiment of the present application is shown;

[0040] Figure 1BAn exemplary structural diagram of a temperature measuring device in an embodiment of the present application is shown;

[0041] Figure 1C A schematic diagram of a temperature measuring device in a temperature measuring device in an embodiment of the present application is shown;

[0042] Figure 1D A schematic diagram showing a temperature measuring device measuring core body temperature in an embodiment of the present application is shown;

[0043] Figure 2A A three-dimensional diagram of a temperature measuring device in a temperature measuring device in an embodiment of the present application is shown;

[0044] Figure 2B An exploded view of a temperature measuring device in a temperature measuring device in an embodiment of the present application is shown;

[0045] Figure 3A A structural schematic diagram 1 of the heat insulation structure in an embodiment of the present application is shown;

[0046] Figure 3B A second structural diagram of the heat insulation structure in an embodiment of the present application is shown;

[0047] Figure 3C A third structural diagram of the heat insulation structure in an embodiment of the present application is shown;

[0048] Figure 4 A flow chart of a core body temperature measurement method in an embodiment of the present application is shown;

[0049] Figure 5 A flow chart showing the method of determining the thermal conductivity of a user by a temperature measuring device in an embodiment of the present application is shown;

[0050] Fig. 6A A schematic diagram showing a temperature measuring device measuring a test sample in an embodiment of the present application is shown;

[0051] Figure 6B A schematic diagram showing the comparison between the experimental temperature rise scatter points and the theoretical fitting temperature rise curve of the test sample in the embodiment of the present application is shown;

[0052] Figure 6C A schematic diagram of a temperature rise curve of a test sample in an embodiment of the present application is shown;

[0053] Fig. 7A A schematic diagram of a verification experiment in which a temperature measuring device according to an embodiment of the present application measures the core body temperature of a test sample is shown;

[0054] Figure 7B A schematic diagram showing the reference core body temperature of the test sample in the embodiment of the present application is shown;

[0055] Figure 7C A schematic diagram showing the error of the core body temperature of the test sample in the embodiment of the present application;

[0056] Figure 8 A block diagram of a temperature measuring device according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0057] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0058] To facilitate understanding of the technical solution of the present application, some concepts or terms involved in the present application are first explained.

[0059] (1) Thermal conductivity: also known as "thermal conductivity coefficient", is a physical quantity that indicates the heat conduction capacity of a material. The specific definition of thermal conductivity is: if two parallel planes with a distance of 1 meter and an area of ​​1 square meter are taken inside an object perpendicular to the heat conduction direction, and the temperature difference between the two planes is 1K, then the heat transferred from one plane to another within 1 second is defined as the thermal conductivity of the material.

[0060] (2) Heat flux distribution coefficient: the proportion of the sensor's heat that is actually conducted vertically into the object to be tested.

[0061] It should be noted that the organism described in this embodiment may be a human or other animal, and the core body temperature may be the core body temperature of a human or other animal. For ease of description, the following description is based on the example that the core body temperature is the core body temperature of a human.

[0062] As mentioned above, one of the current methods for measuring human core body temperature is invasive measurement. In some application scenarios, a needle-shaped sensor probe made of a sensitive element can be inserted into the measured part to achieve invasive measurement of core body temperature. The measured part can be a blood vessel, bladder, tympanic membrane, oral cavity, esophagus, temporal artery, nasopharynx, etc.

[0063] For example, the sensor may be a thermocouple sensor, a thermistor sensor, or a fiber optic thermometer, etc., which measures the core body temperature by using the correlation between the probe voltage, resistance, and core body temperature changes. For another example, the sensor may be an electrical impedance sensor, which measures the core body temperature by using the correlation between the electrical impedance of the probe electrode and core body temperature changes.

[0064] However, in actual operation, it is difficult to accurately locate the position of the needle sensor probe after it is inserted into the deep tissue, resulting in inaccurate measurement results. In addition, since the needle sensor probe needs to be inserted into the measured part to measure the core body temperature, it is not suitable for measuring measured parts such as the heart or brain. It is difficult to meet the real-time monitoring of core body temperature in daily life and has a limited scope of application. In addition, this invasive measurement method can also cause bleeding, thereby increasing the risk of tissue infection and the user's measurement comfort is poor.

[0065] To this end, in other application scenarios, non-invasive measurement of core body temperature can also be achieved by establishing a relationship between the user's physiological indicators or other indicators and the core body temperature.

[0066] For example, the blood flow and water content of the skin are related to the core body temperature, so the core body temperature can be measured by measuring the blood flow and water content of the skin. Specifically, since the regulation of core body temperature depends on the mechanism of the central nervous system to dynamically regulate the body's heat production and heat dissipation, and the heat dissipation depends on the temperature difference between the skin and the environment, the temperature of the skin is strongly correlated with the blood flow of the skin, and 83% of human blood is water. Therefore, the measurement of core body temperature can be achieved by establishing the relationship between skin water content and blood flow, and the relationship between blood flow and skin temperature. However, due to the different skin conditions of different users, the differences in skin water content and blood flow are large, which will lead to large errors in the measurement of core body temperature.

[0067] For example, the microwaves released by the human body are related to the core body temperature. Therefore, based on the principle of electromagnetic wave measurement, the microwaves released by the human body can also be used to measure temperature. The sensitivity of this measurement method can reach 0.1°C and the temperature measurement depth can reach about 3cm. However, changes in the external environment temperature will cause changes in the microwaves released by the human body, so the measurement error of this measurement method is also large.

[0068] For example, when ultrasound penetrates the human body, its attenuation coefficient is also related to the core body temperature. Therefore, the core body temperature can also be measured by ultrasound transmission method. For example, when the center frequency of ultrasound is 3.5MHz and the temperature varies in the range of 24℃-25℃, pork is used as a sample, and the attenuation coefficient of ultrasound with temperature is -1.6×10 -2 dB / (MHz·cm·℃). By establishing the relationship between the attenuation coefficient of ultrasound and core body temperature, the core body temperature can be measured. However, the unevenness of human tissue will interfere with and hinder the propagation of ultrasound, so the measurement error of the ultrasound transmission method is also large.

[0069] For another example, the heat exchange between the skin surface and the environment is related to the core body temperature. Therefore, it is also possible to use the heat flux method (for example, the single heat flux method or the double heat flux method) to design the heat conduction channel of the sensor so that the heat from the human core is only conducted from the skin tissue to the sensor in a unidirectional direction perpendicular to the body surface, and a corresponding temperature gradient is formed in the heat conduction channel of the surface sensor, and then the core body temperature is measured by using the correlation between the core body temperature and the temperature gradient in the surface heat conduction channel. However, it is generally assumed that the thermal conductivity of the human body is a constant to calculate the core body temperature. For users with large differences in skin conditions, the difference in thermal conductivity is also large. Therefore, this measurement method will also produce large measurement errors.

[0070] For example, human tissue density is related to core body temperature. Therefore, the core body temperature can also be measured by measuring the change of human tissue density with core body temperature through X-ray computed tomography. However, in medicine, the human body is not allowed to be exposed to X-rays for a long time, so the scope of application of this measurement method is limited.

[0071] For another example, the nuclear magnetic resonance signal is related to the core body temperature. Therefore, the core body temperature can also be measured by nuclear magnetic resonance. For example, the tumor substance S-180 can be placed in the nuclear magnetic resonance detection circle to measure the relaxation signal of the proton related to the temperature, thereby realizing the measurement of the core body temperature. Its magnetization temperature dependence is -1.3% / ℃. However, the nuclear magnetic resonance method has a relatively complex device, poor measurement convenience, and is expensive, and has a limited scope of application.

[0072] In summary, the above-mentioned various measurement methods for measuring core body temperature have large measurement errors, high measurement conditions, complex operations, and limited scope of application. They are not conducive to users accurately and conveniently measuring core body temperature, and are difficult to meet users' daily health management needs.

[0073] In view of this, the embodiments of the present application are used to provide a temperature measurement method capable of non-invasively measuring core body temperature. The method measures the thermal conductivity of the object to be tested in real time, and then determines the core body temperature of the object to be tested based on the relationship between thermal conductivity and core body temperature. Compared with the above-mentioned heat flux method that uses empirical thermal conductivity values ​​to measure core body temperature, the present application can effectively avoid measurement errors caused by differences in skin conditions of different objects to be tested, thereby improving the accuracy of core body temperature measurement.

[0074] For example, in some embodiments, the relationship between thermal conductivity and the core body temperature of the subject to be tested can be expressed by the following formula:

[0075] T core-esti =T bottom +g(T bottom -T top ) (1)

[0076] In formula (1), T core-esti is the core body temperature, in °C; T bottom is the lower layer temperature of the temperature measuring device (for example, the temperature measuring device 100 in the temperature measuring apparatus 10 described below), in °C; T top is the upper temperature of the temperature measuring device, in °C; R tissue is the skin thermal resistance of the object to be tested, in K·m 2 / W; t tissue is the detectable skin thickness of the subject to be tested, in m; λ tissueis the skin thermal conductivity of the test object, in W / (m·K); R partition(i) The thermal resistance of the temperature measuring device separating the components, in K·m 2 / W.

[0077] It can be understood that in some embodiments, the corresponding temperature measuring device can be used to implement the above-mentioned temperature measuring method. And the temperature measuring device can be in the form of a wearable device. For example, a watch, a bracelet, a temperature sticker, an ECG sticker, a smart fabric (for example, a smart insole), headphones, smart glasses (for example, virtual reality glasses), etc. Alternatively, in other embodiments, the temperature measuring device provided in the present application can also be in the form of a home health device, such as an electronic scale. This application does not make specific restrictions on this, as long as the temperature measuring device is in the form of an electronic device that can contact the skin.

[0078] For example, Figure 1A FIG. 1 shows an exemplary block diagram of a temperature measuring device 10 in an embodiment of the present application. Figure 1A The temperature measuring device 10 includes a temperature measuring device 100 and a control module 200 which are communicatively connected. The temperature measuring device 100 is used to feed back a signal to the control module 200 in real time, and the control module 200 can determine the thermal conductivity of the object to be tested in real time according to the obtained signal, and then calculate the core body temperature of the object to be tested.

[0079] Specifically, the temperature measuring device 100 includes a first temperature measuring component 110, a second temperature measuring component 120 and a partition component 130. Among them, the first temperature measuring component 110 includes a heating component 112 and a first temperature sensor 113. The heating component 112 is used to heat the object to be tested. The signal fed back by the first temperature sensor 113 to the control module 200 is used to measure the lower layer temperature of the temperature measuring device 100. The second temperature measuring component 120 includes a second temperature sensor 120. The signal fed back by the second temperature sensor 120 to the control module 200 is used to measure the upper layer temperature of the temperature measuring device 100. In addition, the signals fed back by the first temperature sensor 113 and the second temperature sensor 122 to the control module 200 are also used to confirm multiple temperature values ​​of the object to be tested in the first time period during the heating process, and then determine the thermal conductivity of the object to be tested according to the multiple temperature values. Substituting the measured thermal conductivity of the user, the upper layer temperature of the temperature measuring device 100 and the lower layer temperature of the temperature measuring device 100 into the above formula (1), the core body temperature of the object to be tested can be calculated.

[0080] The separation component 130 includes a heat insulation structure 140. The heat insulation structure 140 is used to block the heat transfer from the heating component 112 to the second temperature measurement component 120, so as to further improve the measurement accuracy.

[0081] Figure 1BAn exemplary structural diagram of the temperature measuring device 10 in an embodiment of the present application is shown. Figure 1C FIG. 1 is a schematic diagram of a temperature measuring device 100 in a temperature measuring device 10 according to an embodiment of the present application. Figures 1A to 1C , the temperature measuring device 100 and the control module 200 in the temperature measuring device 10 are connected to the control module 200 by wired communication methods such as signal transmission lines 300. Alternatively, in other alternative embodiments, the temperature measuring device 100 can also be connected to the control module 200 by wireless communication methods such as Bluetooth, which is not limited in this application. Among them, the first temperature measuring component 110, the partition component 130 and the second temperature measuring component 120 of the temperature measuring device 100 are stacked in sequence, and the whole is similar to a sandwich structure.

[0082] Figure 1D FIG. 1 is a schematic diagram showing a temperature measuring device 10 measuring core body temperature in an embodiment of the present application. Figure 1D Combined with Figures 1A to 1C First, the temperature measuring device 100 is placed on the wrist of the user (as an example of the object to be tested). And, the first temperature measuring component 110 of the temperature measuring device 100 faces the wrist of the user. Then, the heating component 112 of the temperature measuring device 100 enters the heating mode so as to provide constant heat to the wrist of the user, thereby warming up the wrist of the user. Next, the first temperature measuring sensor 113 and the second temperature measuring sensor 122 of the temperature measuring device 100 feedback signals (e.g., voltage signals, current signals, etc.) to the control module 200. The control module 200 then determines the temperatures of the upper and lower layers of the temperature measuring device 100 and the thermal conductivity value of the user according to the signals fed back by the temperature measuring device 100, and then determines the core body temperature of the user in combination with the relevant formula of the single heat flux method (e.g., formula (1)). Among them, the upper layer temperature of the temperature measuring device 100 refers to the temperature of the side of the temperature measuring device 100 facing away from the wrist of the user, and the lower layer temperature of the temperature measuring device 100 refers to the temperature of the side of the temperature measuring device 100 facing the wrist of the user.

[0083] Since the thermal conductivity of the user's wrist is first measured by the temperature measuring device 100 and the control module 200, and then the core body temperature is further calculated based on the thermal conductivity, the measurement error caused by the difference in skin conditions of different users can be effectively avoided, thereby improving the accuracy of core body temperature measurement and achieving 1mm to 10mm deep core body temperature measurement. In addition, the user only needs to fit the wrist with the temperature measuring device 100 to complete the non-invasive measurement of the core body temperature, so the user's skin will not be damaged during the measurement process, the measurement is comfortable, the measurement steps are simple, and the user can measure the core body temperature anytime and anywhere, with a wide range of applications.

[0084] Understandably, Figure 1BThe structural form of the temperature measuring device 10 shown in the figure is only an exemplary description, and other variations can be made by those skilled in the art. For example, in this embodiment, the temperature measuring device 100 and the control module 200 are separately provided. In other embodiments, the temperature measuring device 100 and the control module 200 can also be integrated into a smaller device. For example, when the temperature measuring device 10 is in the form of a watch, the temperature measuring device 100 can be provided at the bottom of the dial, and the control module 200 can be a control chip in the watch.

[0085] The specific process of the above-mentioned temperature measuring device 10 measuring the core body temperature of the user will be described in detail later. The following first introduces the specific structure and installation method of each component in the temperature measuring device 10 with reference to the accompanying drawings.

[0086] Figure 2A and Figure 2B The schematic diagram of the structure of the temperature measuring device 100 in the temperature measuring device 10 in the embodiment of the present application is shown, wherein: Figure 2A is a three-dimensional diagram of the temperature measuring device 100, Figure 2B FIG. 1 is an exploded view of the temperature measuring device 100. Figure 2A and Figure 2B , the temperature measuring device 100 includes a first temperature measuring component 110, a second temperature measuring component 120 and a partition component 130. The first temperature measuring component 110, the partition component 130 and the second temperature measuring component 140 can be stacked in sequence along direction A. Exemplarily, the first temperature measuring component 110, the second temperature measuring component 120 and the partition component 130 can all be similar to a plate-like structure, such as a circular plate-like structure or a rectangular plate-like structure.

[0087] Specifically, the first temperature measuring component 110 includes a first substrate 111, a heating component 112 and a first temperature sensor 113. The heating component 112 and the first temperature sensor 113 are both disposed on the first substrate 111. The heating component 112 is used to heat the user's wrist, thereby increasing the temperature of the user's wrist. The first temperature sensor 113 is used to measure the temperature of the lower layer of the temperature measuring device 100.

[0088] The second temperature measuring component 120 includes a second substrate 121 and a second temperature sensor 122. The second temperature sensor 122 is disposed on the second substrate 121. The second temperature sensor 122 is used to measure the upper temperature of the temperature measuring device 100.

[0089] In addition, the first temperature sensor 113 and the second temperature sensor 122 are also used to measure multiple temperature values ​​of the user's wrist within the first time period, and then determine the thermal conductivity of the user according to the multiple temperature values.

[0090] In this way, the core body temperature of the user can be determined based on the measured upper temperature of the temperature measuring device 100, the lower temperature of the temperature measuring device 100, and the thermal conductivity of the user's wrist.

[0091] A heat insulation structure 140 is provided on the partition assembly 130. The heat insulation structure 140 is used to block the heat transfer from the heating component 112 to the second temperature measuring component 120, effectively reducing the risk of heat transfer between the heating component 112 and the second temperature measuring component 120, thereby improving the accuracy of the temperature measuring device 100 in measuring thermal conductivity, and further improving the accuracy of the temperature measuring device 100 in measuring core body temperature.

[0092] FIG. 3A to FIG. 3C Schematic diagrams of the structures of several heat insulation structures 140 in the embodiments of the present application are shown. Figure 3A Combined with Figure 2A and Figure 2B In some embodiments of the present application, the heat insulation structure 140 may be a through hole 140a. The through hole 140a may be provided on the partition component 130. Moreover, the heating component 112 provided on the first substrate 111 is located within the projection area of ​​the through hole 140a on the first substrate 111. In this way, there is no physical connection between the heating component 112 and the partition component 130, thereby achieving a heat insulation effect, reducing the heat transfer from the heating component 112 to the second temperature measuring component 120, and thereby improving the measurement accuracy of the temperature measuring device 100.

[0093] Alternatively, in some other alternative embodiments, the heat insulation structure 140 may also have other structural forms. Figure 3B Combined with Figure 2A and Figure 2B , the heat insulation structure 140 may also be a blind hole 140b opened on the partition component 130. Similarly, the heating component 112 disposed on the first substrate 111 is located within the projection area of ​​the blind hole 140b on the first substrate 111. The blind hole 140b may also make it possible to have no physical connection between the heating component 12 and the partition component 130, thereby achieving a heat insulation effect, reducing the heat transfer from the heating component 112 to the second temperature measuring component 120, and thereby improving the measurement accuracy of the temperature measuring device 100.

[0094] For another example, the thermal insulation structure 140 may also be a thermal insulation pad 140c (e.g., asbestos, glass fiber, vacuum board, etc.) disposed between the heating component 112 and the partition assembly 130. The thermal insulation pad 140c can block heat transfer, thereby reducing the risk of heat transfer between the heating component 112 and the second temperature measurement assembly 120, thereby improving the measurement accuracy of the temperature measurement device 100.

[0095] It can be understood that the present application does not specifically limit the structural form of the thermal insulation structure 140. Any structural form of the thermal insulation structure 140 that can block the heat transfer from the heating component 112 to the second temperature measuring component 120 is within the protection scope of the present application.

[0096] Continue reading Figure 3A In some embodiments of the present application, the through hole 140a can be enclosed together with the first substrate 111 and the second substrate 121 to form a closed cavity 150. The heating component 112 is located in the cavity 150. The cavity 150 can isolate the heating component 112 from the outside world, thereby effectively reducing the impact of external temperature changes on the heat exchange process, making the heat exchange environment of the heating component 112 more stable, thereby improving the repeatability and anti-interference of thermal conductivity measurement, and improving measurement accuracy.

[0097] It is understood that in some other embodiments, the cavity 150 may also have other structural forms, and the present application does not limit this. Figure 3B The cavity 150 may also be surrounded by the blind hole 140 b and the first substrate 111 .

[0098] In some embodiments of the present application, the thermal conductivity of the material of the partition component 130 is between 0.01 W / (m·K) and 10 W / (m·K) to meet the working requirements of the temperature measuring device 100. For example, the material of the partition component 130 can be polydimethylsiloxane (PDMS), and the thermal conductivity is about 0.15 W / (m·K).

[0099] In some implementations, when the material of the partition component 130 is polydimethylsiloxane, according to the chemical properties of polydimethylsiloxane itself, the first substrate 111 and the second substrate 121 can be bonded to the partition component 130 respectively. Therefore, there is no need to set additional adhesive for fixing between the first substrate 111 and the partition component 130, and between the second substrate 121 and the partition component 130, thereby effectively reducing the contact thermal resistance between the first substrate 111 and the partition component 130, and the contact thermal resistance between the second substrate 121 and the partition component 130, so that the temperature measuring device 100 and the user's wrist can reach thermal equilibrium faster, thereby greatly reducing the measurement time.

[0100] Alternatively, in some other alternative implementations, a high thermal conductivity material (e.g., thermal grease) may be coated between the first substrate 111 and the partition component 130, and between the second substrate 121 and the partition component 130 to further reduce the contact thermal resistance between the first substrate 111 and the partition component 130, and between the second substrate 121 and the partition component 130.

[0101] In some embodiments of the present application, the thickness of the partition component 130 may be between 1 mm and 10 mm, so that the temperature measuring device 100 and the user's wrist can reach thermal equilibrium more quickly, thereby further reducing the measurement time. The thickness of the partition component 130 refers to the size of the partition component 130 along the A direction. For example, when the material of the partition component 130 is polydimethylsiloxane, the thickness of the partition component 130 may be 1 mm.

[0102] Continue reading Figure 2A and Figure 2B In some embodiments of the present application, the first temperature measuring component 110 may include a plurality of first temperature sensors 113, wherein the plurality of first temperature sensors 113 may be distributed in a ring shape, for example Figure 2A and Figure 2B The seven first temperature sensors 113 are shown to be distributed in a circular ring shape. The multiple first temperature sensors 113 distributed in a circular ring shape can cover a larger area, thereby further improving the measurement accuracy.

[0103] In some embodiments of the present application, the second temperature measurement component 120 may include a plurality of second temperature sensors 122, wherein the plurality of second temperature sensors 122 may be distributed in a ring shape, for example Figure 2A and Figure 2B The seven second temperature sensors 122 are shown as being distributed in a circular ring shape. The plurality of second temperature sensors 122 distributed in a circular ring shape can cover a larger area, thereby further improving the measurement accuracy.

[0104] Alternatively, in other alternative embodiments, the plurality of first temperature sensors 113 and / or the plurality of second temperature sensors 122 may also be distributed in other manners, for example, in a rectangular array. The present application does not impose any specific limitation on this, as long as the first temperature sensor 113 and / or the second temperature sensor 122 can cover a larger area.

[0105] In some other embodiments, the first temperature measuring component 110 may also include a first temperature sensor 113 . The second temperature measuring component 120 may also include a second temperature sensor 122 .

[0106] In some embodiments of the present application, the materials of the first substrate 111 and the second substrate 121 may include rigid materials such as sapphire or glass.

[0107] Continue reading Figure 1BIn some embodiments of the present application, the control module 200 may include a data acquisition board 210, a control panel 220 and a host computer (not shown) that are stacked. The data acquisition board 210 is used to collect signals fed back from the test device 100. The control panel 220 is used to transmit the signal to a host computer (e.g., a mobile phone, a computer) that is connected to it for communication (e.g., a Bluetooth connection), and convert the received signal into temperature data through the host computer to obtain the core body temperature of the user. Alternatively, in some other alternative implementations, the control module 200 can also convert the received signal into temperature data to obtain the core body temperature of the user without the aid of a host computer.

[0108] After introducing the specific structure of each component in the temperature measuring device 10, the specific process of measuring the core body temperature by using the temperature measuring device 10 will be further introduced in conjunction with the accompanying drawings.

[0109] Figure 4 FIG. 2 is a flow chart showing a method for measuring core body temperature in an embodiment of the present application. Figure 4 As shown, the measurement method provided by this application specifically includes the following steps:

[0110] S110: The temperature measuring device 100 heats the user's wrist.

[0111] refer to Figure 1D Combined with Figure 2A and Figure 2B In some embodiments of the present application, the first temperature measuring component 110 in the temperature measuring device 100 contacts the user's wrist. When the temperature measuring device 100 contacts the user's wrist, the heating component 112 of the first temperature measuring component 110 starts to enter the heating mode to heat the user's wrist, thereby increasing the temperature of the user's wrist.

[0112] S120: The control module 200 obtains multiple temperature values ​​of the user's wrist in a first time period during the heating process.

[0113] Continue to refer Figure 1D Combined with Figure 2A and Figure 2B In some embodiments of the present application, the first temperature sensor 113 and the second temperature sensor 122 of the temperature measuring device 100 can send voltage signals to the control module 200 respectively. The data acquisition board 210 of the control module 200 obtains the voltage signals fed back by the first temperature sensor 113 and the second temperature sensor 122. Then, the voltage signal is transmitted to the host computer through the control panel 220, and the voltage data is converted by the host computer to obtain multiple temperature values ​​of the user's wrist in the first time period during the heating process. Among them, the first time period can be the time when the heating component 112 is heated.

[0114] For example, after the heating component 112 is attached to the user's wrist and reaches thermal equilibrium with the user's wrist, the temperature measuring device 100 will return a stable initial voltage value u0 to the control module 200. During the heating process, the resistance of the heating component 112 itself will increase. Therefore, during the heating process, the control module 200 can obtain a curve of the relationship between the voltage rise and the heating time, and then convert the curve into a curve of the relationship between the temperature rise and the heating time according to the resistance temperature coefficient of the heating component 112 and the initial voltage value u0, and then obtain multiple temperature values ​​of the user's wrist in the first time period during the heating process according to the curve of the relationship between the temperature rise and the heating time.

[0115] S130: The control module 200 determines the thermal conductivity of the user based on a plurality of temperature values ​​within a first time period.

[0116] In some embodiments of the present application, the multiple temperature values ​​include multiple temperature rise values ​​corresponding to the user's wrist at different times within the first time period, and the control module 200 can determine the first temperature rise value based on these temperature rise values. For example, the temperature rise value can be the difference between the real-time temperature at a certain moment after the heating component 112 heats up and the initial temperature before the heating component 112 heats up and after the user reaches thermal equilibrium. Optionally, the temperature rise value corresponding to the last moment in the first time period can be selected as the first temperature rise value to ensure the accuracy of the subsequent calculation of thermal conductivity. Among them, since the temperature rise value at the last moment is strongly correlated with the heat flux distribution coefficient, the heat flux distribution coefficient can be selected more accurately based on the temperature rise value at the last moment, thereby improving the accuracy of the calculated thermal conductivity.

[0117] The control module 200 includes a pre-stored heat flow distribution coefficient database. The heat flow distribution coefficient database includes a plurality of heat flow distribution coefficients. These heat flow distribution coefficients correspond to first temperature rise values ​​of different sizes, respectively. Therefore, the control module 200 can select a suitable heat flow distribution coefficient from the heat flow distribution coefficient database according to the size of the first temperature rise value. Exemplarily, the heat flow distribution coefficient database can be a database established by expanding based on the correlation between the reference heat flow distribution coefficients of a plurality of test samples and their first temperature rise values, and by using linear interpolation.

[0118] Substituting the first temperature rise value and the finally selected heat flux distribution coefficient (ie, the first heat flux distribution coefficient) into the following formula, the user's thermal conductivity can be calculated.

[0119]

[0120] Wherein, ΔT is the first temperature rise value, in °C; A1 is the first heat flux distribution coefficient; A2 is the distance between the heating point and the detection point of the temperature measuring device, in m; Q is the heating power of the temperature measuring device, in W; t is the first time period, in s; λ tissueis the user's first thermal conductivity, in W / (m·K); ρ tissue c p,tissue The volume specific heat of the user, in J / (m 3 ·K).

[0121] S140 : The control module 200 determines the core body temperature of the user based on the thermal conductivity of the user and the upper layer temperature and the lower layer temperature of the temperature measuring device 100 .

[0122] In some embodiments of the present application, the lower layer temperature of the temperature measuring device 100 can be measured based on the voltage signal fed back by the first temperature sensor 113 to the control module 200, and the upper layer temperature of the temperature measuring device 100 can be measured based on the voltage signal fed back by the second temperature sensor 122 to the control module 200.

[0123] The core body temperature of the user can be calculated based on the upper layer temperature of the temperature measuring device 100, the lower layer temperature of the temperature measuring device 100, and the thermal conductivity of the user, and based on formula (1) and the following formula.

[0124]

[0125]

[0126]

[0127]

[0128]

[0129] Among them, t tissue is the detectable skin thickness, in m; α tissue is the user's skin thermal diffusivity, in m 2 / s; R tissue is the user's skin thermal resistance, in K·m 2 / W;R partition(i) is the thermal resistance of the partition assembly 130, in K·m 2 / W;λ partition is the thermal conductivity of the partition assembly 130, in W / (m·K); t partition(i) is the thickness of the partition assembly 130; T core-esti T is the user's core body temperature, in °C; bottom is the lower layer temperature of the temperature measuring device 100, in °C; T top is the upper layer temperature of the temperature measuring device 100, in °C.

[0130] The following describes how to determine the user's core body temperature T core-esti An exemplary calculation process of .

[0131] First, according to the aforementioned step S130, the user's skin thermal conductivity λ can be obtained. tissue and the user's volume specific heat ρ tissue c ptissue , due to the user's skin thermal diffusivity Therefore, the user's skin thermal diffusivity α can be calculated tissue Then the user's skin thermal diffusivity α tissue Substituting into formula (3), the detectable skin thickness t is calculated tissue Next, the detectable skin thickness t tissue The thermal conductivity λ of the user calculated in the above step S130 tissue Substituting into formula (4), the user's skin thermal resistance R is calculated tissue .

[0132] Thermal conductivity λ of the partition assembly 130 partition and thickness t partition(i) The thermal resistance R of the partition assembly 130 can be measured in advance and then calculated according to formula (5): partition(i) .

[0133] Then, the user's skin thermal resistance R tissue and the thermal resistance R of the partition assembly 130 partition(i) Substitute it into formula (6) to calculate g.

[0134] Formula (1) can be obtained by transforming formula (7), and the calculated g and the upper temperature T of the temperature measuring device 100 are top and the lower layer temperature T of the temperature measuring device 100 bottom Substituting into formula (1), the user's core body temperature T can be calculated core-esti .

[0135] The above core body temperature measurement method first measures the thermal conductivity of the user, and then further calculates the core body temperature based on the thermal conductivity, which can effectively avoid measurement errors caused by differences in skin conditions of different users, thereby improving the accuracy of core body temperature measurement. In addition, the user only needs to fit the wrist with the temperature measuring device 100 to complete the non-invasive measurement, which will not cause damage to the user, has high measurement comfort, and simple measurement steps. The user can more conveniently measure the core body temperature anytime and anywhere, and has a wide range of applications.

[0136] In some embodiments of the present application, in step S130, the heat flux distribution coefficient can be selected multiple times and substituted into formula (2) for iterative calculation until the optimal heat flux distribution coefficient is obtained, thereby obtaining a more accurate thermal conductivity value, thereby further improving the measurement accuracy of the core body temperature. Figure 5FIG. 1 is a flow chart showing the method for the temperature measuring device 10 to determine the thermal conductivity of a user in an embodiment of the present application. Figure 5 , step S130 may include the following sub-steps:

[0137] S131: The control module 200 determines a first temperature rise value of the user's wrist within a first time period based on multiple temperature values.

[0138] In some embodiments of the present application, the multiple temperature values ​​may include multiple temperature rise values ​​corresponding to the user's wrist at different times in the first time period. The control module 200 may select the last temperature rise value (i.e., the final temperature rise value) in the first time period as the first temperature rise value to ensure the accuracy of the subsequent calculation of the first thermal conductivity.

[0139] For example, the first time period starts from time t0 and ends at time t1. Between time t0 and time t1, four temperature rise values ​​ΔT0, ΔT01, ΔT02 and ΔT1 are obtained in chronological order, and ΔT1 can be selected as the first temperature rise value. Among them, ΔT0, ΔT01, ΔT02 and ΔT1 can be the difference between the user's wrist temperature value and the ambient temperature value at time t0, time t01, time t02 and time t1 respectively.

[0140] S132: The control module 200 obtains a first heat flux distribution coefficient corresponding to the first temperature rise value.

[0141] According to the aforementioned embodiment, the first temperature rise value is ΔT1. The heat flow distribution coefficient database stores a heat flow distribution coefficient A10 corresponding to the temperature rise value ΔT0, and a heat flow distribution coefficient A12 corresponding to the temperature rise value ΔT2. And ΔT0<ΔT1<ΔT2. At this time, the larger one of the heat flow distribution coefficient A11 and the heat flow distribution coefficient A12 can be selected as the first heat flow distribution coefficient. For example, if the heat flow distribution coefficient A11 is greater than the heat flow distribution coefficient A12, the heat flow distribution coefficient A11 is determined as the first heat flow distribution coefficient.

[0142] Alternatively, in other alternative implementations, the smaller one of the heat flux distribution coefficient A11 and the heat flux distribution coefficient A12 may be selected as the first heat flux distribution coefficient, and the present application does not impose any limitation on this.

[0143] S133: The control module 200 calculates a first thermal conductivity of the user based on the first heat flow distribution coefficient and the first temperature rise value.

[0144] According to the above embodiment, the first temperature rise value ΔT1 and the first heat flow distribution coefficient A11 are substituted into the above formula (1) to calculate the first thermal conductivity λ of the user: tissue1 .

[0145] S134: The control module 200 determines whether the difference between the first thermal conductivity and the second thermal conductivity corresponding to the pre-stored first heat flux distribution coefficient is less than a first threshold.

[0146] If the judgment is no, then go to step S135 and continue to execute steps S133 and S134; if the judgment is yes, then go to step S136.

[0147] In some embodiments of the present application, the control module 200 may include a pre-stored thermal conductivity database. The thermal conductivity database includes multiple thermal conductivities. Among them, each thermal conductivity corresponds to a heat flow distribution coefficient. Exemplarily, the multiple thermal conductivities in the thermal conductivity database are the thermal conductivities of multiple test samples measured by a measuring mechanism through a professional measurement method (for example, a planar heat source method (Hotdisk)). By testing these test samples, the relationship between thermal conductivity and heat flow distribution coefficient can be established in advance. Therefore, a corresponding second thermal conductivity λ can be found in the thermal conductivity database according to the size of the selected first heat flow distribution coefficient A11. tissue2 .

[0148] In some embodiments of the present application, the first threshold value has a numerical range of 0.001 W / (m·K) to 0.01 W / (m·K). For example, 0.001 W / (m·K), 0.002 W / (m·K), 0.003 W / (m·K), etc. The following takes the first threshold value of 0.001 W / (m·K) as an example.

[0149] For example, the first thermal conductivity λ tissue1 and the second thermal conductivity λ tissue2 The difference between them can be 0.002 W / (m·K), which is greater than the first threshold value 0.001 W / (m·K). That is, the judgment is no, therefore, the process goes to step S135, adjusts the size of the first heat flux distribution coefficient, and continues to execute steps S133 and S144.

[0150] Specifically, first enter step S135 to adjust the size of the first heat flow distribution coefficient. According to the above embodiment, since the first heat flow distribution coefficient selects a larger heat flow distribution coefficient A11, the first heat flow distribution coefficient can be adjusted to be smaller to obtain the adjusted first heat flow distribution coefficient A111 (as an example of the second heat flow distribution coefficient).

[0151] In other embodiments, if a smaller heat flux distribution coefficient A12 is selected as the first heat flux distribution coefficient, the first heat flux distribution coefficient may be adjusted to be larger.

[0152] Then, step S133 is entered to substitute the re-adjusted first heat flux distribution coefficient A111 and the first temperature rise value ΔT1 into the above formula (1) to recalculate the adjusted first thermal conductivity λ of the user. tissue3 (As an example of the third thermal conductivity).

[0153] Next, step S134 is entered. Since the adjusted first heat flux distribution coefficient A111 is re-corresponding to an adjusted second thermal conductivity λ tissue4 (As an example of the fourth thermal conductivity). Therefore, comparing the first thermal conductivity λ after adjustment tissue3 , the second thermal conductivity λ tissue4 The difference between the first thermal conductivity λ and the first threshold value. tissue3 , the second thermal conductivity λ tissue4 When the difference between them is less than the first threshold value 0.001 W / (m·K), it is determined to be yes, and the process proceeds to step S136.

[0154] S135: The control module 200 adjusts the magnitude of the first heat flux distribution coefficient.

[0155] S136: The control module 200 determines the first thermal conductivity as the thermal conductivity of the user.

[0156] The above thermal conductivity measurement method first determines a first heat flow distribution coefficient according to the first temperature rise value, and then calculates the first thermal conductivity based on the first temperature rise value and the first heat flow distribution coefficient. Then, the first thermal conductivity is compared with the pre-stored second thermal conductivity corresponding to the first heat flow distribution coefficient, and the size of the first heat flow distribution coefficient is adjusted by continuous iteration based on the comparison result, so that the difference between the first thermal conductivity and the pre-stored second thermal conductivity corresponding to the first heat flow distribution coefficient can be made smaller and smaller, thereby further improving the accuracy of thermal conductivity measurement, and then improving the accuracy of core body temperature measurement.

[0157] To facilitate understanding of the measurement accuracy of the above thermal conductivity and core body temperature measurement methods, the following description is combined with schematic diagrams such as thermal conductivity accuracy verification and core body temperature accuracy verification.

[0158] For example, Fig. 6A A schematic diagram showing the temperature measuring device 10 measuring the test sample 20 in the embodiment of the present application is shown. Figure 6B A schematic diagram comparing the experimental temperature rise scatter points and the theoretical fitting temperature rise curve of the test sample 20 in the embodiment of the present application is shown. Figure 6C A schematic diagram of a temperature rise curve of a test sample 20 in an embodiment of the present application is shown.

[0159] refer to Fig. 6A , the test device 100 of the test equipment 10 is placed on the test sample 20 for measurement, and the following can be obtained: Figure 6B The multiple experimental temperature rise value scatter points are shown. The material of the test sample 20 may be high-density polyethylene (HDPE). The thermal conductivity of the test sample 20 may be measured by a professional measurement institution using a professional measurement method (e.g., a plane heat source method) as a reference thermal conductivity. Substituting the reference thermal conductivity and the corresponding reference heat flow distribution coefficient into the above formula (1) may calculate multiple temperature rise values, thereby fitting to obtain Figure 6B Theoretical fitting temperature rise curve shown. Comparing the theoretical fitting temperature rise curve and the experimental temperature rise value scatter points, it can be seen that the first temperature rise value of the test sample 10 measured by the test device 10 is more accurate, and the thermal conductivity and core body temperature can be determined more accurately based on the first temperature rise value.

[0160] Furthermore, in order to ensure the reliability of the thermal conductivity accuracy verification experiment results, the test samples 20 of different materials can be measured multiple times by the test equipment 10 to obtain multiple temperature rise curves, thereby obtaining the first temperature rise value according to the temperature rise curve, and determining the thermal conductivities of multiple different materials based on the first temperature rise value, so as to obtain the thermal conductivity measurement error more accurately.

[0161] For example Figure 6C As shown, the material of the test sample 20 may also include polydimethylsiloxane, polyamide (PA) 66, and polyimide (PI). By testing the test samples 20 made of these three different materials using the temperature measuring device 10, the following results can be obtained: Figure 6C The multiple temperature rise curves shown. Among them, since the thermal conductivity values ​​of the four materials of polydimethylsiloxane, polyamide 66, polyimide and high-density polyethylene are different, the corresponding temperature rise curves are also inconsistent. For example, the temperature rise curve of the high thermal conductivity material (for example, high-density polyethylene) is located in the low range, while the temperature rise curve of the low thermal conductivity material (for example, polydimethylsiloxane, polyamide 66, polyimide) is located in the high range.

[0162] The first temperature rise value can be determined based on the four temperature rise curves measured by the temperature measuring device 10. For example, the last temperature rise value corresponding to the temperature rise curve can be selected as the first temperature rise value to ensure the accuracy of the subsequent calculation of the first thermal conductivity. Specifically, for the temperature rise curve corresponding to polydimethylsiloxane, the first temperature rise value can be determined to be 0.63°C, for the temperature rise curve corresponding to polyamide 66, the first temperature rise value can be determined to be 0.6°C, for the temperature rise curve corresponding to polyimide, the first temperature rise value can be determined to be 0.575°C, and for the temperature rise curve corresponding to high-density polyethylene, the first temperature rise value can be determined to be 0.50°C. Then based on the above Figure 5The thermal conductivity measurement method shown can obtain the thermal conductivity of four materials: polydimethylsiloxane, polyamide 66, polyimide and high-density polyethylene.

[0163] Table 1 shows the measurement errors of thermal conductivity and heat flow distribution coefficient of four materials: polydimethylsiloxane, polyamide 66, polyimide and high-density polyethylene. Among them, the thermal conductivity and the corresponding heat flow distribution coefficient measured by the temperature measuring device 10 are the measured thermal conductivity and the measured heat flow distribution coefficient. The thermal conductivity and the corresponding heat flow distribution coefficient measured by a professional measurement agency using a professional measurement method (for example, a plane heat source method) are the reference thermal conductivity and the reference heat flow distribution coefficient.

[0164] Table 1

[0165]

[0166] As shown in Table 1, the thermal conductivity of the four materials, polydimethylsiloxane, polyamide 66, polyimide and high-density polyethylene, covers the thermal conductivity range of human skin, and the thermal conductivity errors and heat flow distribution coefficient errors of the test samples 20 of the four different materials are within 5%. Therefore, the temperature measuring device 10 is Figure 5 The thermal conductivity measurement method shown has high accuracy in measuring thermal conductivity, which can effectively improve the measurement accuracy of core body temperature.

[0167] Fig. 7A A schematic diagram of a verification experiment in which the temperature measuring device 10 measures the core body temperature of a test sample 20 in an embodiment of the present application is shown. Figure 7B A schematic diagram showing the reference core body temperature of the test sample 20 in an embodiment of the present application is shown. Figure 7C A schematic diagram showing the error of the core body temperature of the test sample 20 in the embodiment of the present application is shown.

[0168] refer to Fig. 7A The material of the test sample 20 is polydimethylsiloxane that can be cured at room temperature, and the thickness can be 4 mm. The test sample 20 is placed on an aluminum substrate 30. A constant current I is passed through the aluminum substrate 30, so that the aluminum substrate 30 forms a hot surface due to the Joule heating effect. The hot surface can provide a relatively stable core body temperature interface to form a measurement environment that simulates human body temperature measurement.

[0169] In some embodiments of the present application, the thickness of the aluminum substrate 30 may be 1.6 mm, and the aluminum substrate 30 may be supported on support columns 31 to ensure the uniformity of the core body temperature interface, thereby further improving the reliability of the measurement data.

[0170] The temperature probe 40 is packaged at the bottom of the test sample 20 and connected to the temperature display device 50 so as to output the measured core body temperature to the temperature display device 50. The core body temperature measured by the temperature probe 30 is used as the reference core body temperature, and the following can be obtained: Figure 7B The temperature curve shown. In the process of continuous temperature rise, the aluminum substrate 30 will have a relatively stable temperature plateau period, thereby providing a core body temperature. For example, in this embodiment, Figure 7B The temperature curve shown includes four relatively gentle sections, and the temperatures corresponding to these four sections constitute four different reference core body temperature intervals.

[0171] By placing the test device 100 of the temperature measuring device 10 on the test sample 20, based on the core body temperature measurement method, the core body temperature of the test sample 20 can be measured, and a core body temperature measurement error value can be obtained by subtracting the core body temperature from the reference core body temperature. Figure 7C Combined with Figure 7B For four different reference core body temperature intervals, the core body temperature measurement error values ​​are all within ±0.08°C. Therefore, the temperature measuring device 10 has high accuracy in measuring core body temperature and good measurement effect.

[0172] Figure 8 FIG. 1 shows a structural block diagram of a temperature measuring device 10 in an embodiment of the present application. Figure 8 As shown, the temperature measuring device 10 may include a processor 11, a memory 12, a sensor module 13, an audio module 14, a button 15, an input and output interface 16, a communication module 17, a power supply module 18, a display module 19, and the like.

[0173] The processor 11 is generally used to control the overall operation of the temperature measuring device 10, and may include one or more processing units, for example: the processor 11 may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), a video processing unit (video processing unit, VPU) controller, a memory, a video codec, a digital signal processor (digital signal processor, DSP), a baseband processor, and / or a neural-network processing unit (neural-network processing unit, NPU), etc. Among them, different processing units may be independent devices, or may be integrated in one or more processors.

[0174] The processor 11 may also be provided with a memory for storing instructions and data. In some embodiments, the memory in the processor 11 is a cache memory. The memory may store instructions or data that the processor 11 has just used or cyclically used. If the processor 11 needs to use the instruction or data again, it may be directly called from the memory. Repeated access is avoided, the waiting time of the processor 11 is reduced, and the efficiency of the system is improved. Among them, the instruction may include: when executed by at least one of the processors, the temperature measuring device 10 implements the following Figure 4 and Figure 5 Instructions for the method shown.

[0175] In some embodiments, the processor 110 may include one or more interfaces. The interface may include an inter integrated circuit (I2C) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general purpose input / output (GPIO) interface, and / or a universal serial bus (USB) interface, a serial peripheral interface (SPI) interface, etc.

[0176] The memory 12 can be used to store computer executable program codes, which include instructions. The processor 11 executes various functional applications and data processing of the temperature measuring device 1 by running the instructions stored in the memory 12. The memory 12 may include a program storage area and a data storage area. Among them, the program storage area may store an operating system, an application required for at least one function (such as an image display function, a video playback function), etc. The storage data area may store data created during the use of the temperature measuring device 10 (such as temperature measurement data during the temperature measurement process of the temperature measuring device 10), etc. In addition, the memory 120 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, a universal flash storage (UFS), etc.

[0177] The sensor module 13 may include sensors for detecting the working state and use state of the temperature measuring device 10, including but not limited to a proximity light sensor / contact sensor for detecting whether the user is wearing the temperature measuring device 10, an inertial sensor for detecting the user's motion state, and the like.

[0178] The audio module 14 may include a speaker, a microphone, etc., for implementing audio functions.

[0179] The button 15 may be one or more. The button 15 may be in the form of a button, a switch, a dial, and a touch or near-touch sensing device (such as a touch sensor). The temperature measuring device 10 may trigger a corresponding function according to the user's operation on one or more of the buttons 15, such as controlling the temperature measuring device 10 to enter a temperature measurement mode.

[0180] The input / output interface 16 can connect other devices to the temperature measuring device 10 through suitable components. The components may include, for example, audio / video jacks, data connectors, etc.

[0181] The communication module 17 may include a wireless communication module. The wireless communication function may be implemented by an antenna (not shown), a modem processor (not shown), and a baseband processor (not shown). The antenna is used to transmit and receive electromagnetic wave signals. The temperature measuring device 10 may include multiple antennas, each of which may be used to cover a single or multiple communication frequency bands. Different antennas may also be reused to improve the utilization of the antenna. For example, antenna 1 may be reused as a diversity antenna for a wireless local area network. In some other embodiments, the antenna may be used in conjunction with a tuning switch.

[0182] The wireless communication module can provide wireless communication solutions including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc., which are applied to the temperature measuring device 10. The wireless communication module can be one or more devices integrating at least one communication processing module. The wireless communication module receives electromagnetic waves via an antenna, modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 11. The wireless communication module can also receive the signal to be sent from the processor 11, modulate the frequency of the signal, amplify it, and convert it into electromagnetic waves for radiation through the antenna.

[0183] The power supply module 18 may include a battery for supplying power to various modules of the temperature measuring device 10 .

[0184] It is understandable that the above Figure 8The structure of the temperature measuring device 10 shown is only an example. In other embodiments, the temperature measuring device 10 may include more or fewer modules, and some modules may be combined or split, which is not limited here.

[0185] The above is an explanation of the implementation mode of the present application by specific specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to the implementation mode. On the contrary, the purpose of introducing the application in conjunction with the implementation mode is to cover other options or modifications that may be extended based on the claims of the present application. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details are omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0186] In the description of the present application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "outside", "inside", "circumferential", "radial", "axial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0187] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "setting", "installation", "connection" and "fitting" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0188] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A temperature measuring device, characterized in that: It includes a first temperature measuring component, a second temperature measuring component and a separation component, wherein: The first temperature measuring component, the partition component, and the second temperature measuring component are stacked in sequence, and The first temperature measurement component includes a first substrate, a first temperature sensor and a heating component, and the first temperature sensor and the heating component are arranged on the first substrate; The partition component is provided with a heat insulation structure, and the heat insulation structure is used to block the heat transfer from the heating component to the second temperature measuring component; The second temperature measuring component includes a second substrate and a second temperature sensor, and the second temperature sensor is disposed on the second substrate.

2. The temperature measuring device according to claim 1, characterized in that: The thermal insulation structure includes a through hole, a blind hole or a thermal insulation pad.

3. The temperature measuring device according to claim 2, characterized in that: The partition component is plate-shaped, the heat insulation structure is a through hole, the through hole is opened on the partition component, and, The heating component on the first substrate is located within a projection area of ​​the through hole on the first substrate.

4. The temperature measuring device according to claim 3, characterized in that: The thickness of the partition component is between 1 mm and 10 mm.

5. The temperature measuring device according to claim 3, characterized in that: The first substrate and the second substrate are plate-shaped.

6. The temperature measuring device according to claim 3, characterized in that: The through hole, the first substrate and the second substrate together form a closed cavity, and the heating component is located in the cavity.

7. The temperature measuring device according to claim 1, characterized in that: The thermal conductivity of the material of the partition component is between 0.01 W / (m·K) and 10 W / (m·K).

8. The temperature measuring device according to claim 7, characterized in that: The material of the partition component includes polydimethylsiloxane.

9. The temperature measuring device according to claim 8, characterized in that: The first substrate and the second substrate are bonded to the separation components, respectively.

10. The temperature measuring device according to claim 9, characterized in that: The first substrate and the second substrate are made of sapphire or glass.

11. The temperature measuring device according to claim 1, characterized in that: The first temperature measuring component includes a plurality of the first temperature sensors distributed in a ring shape, and / or the second temperature measuring component includes a plurality of the second temperature sensors distributed in a ring shape.

12. A temperature measuring device, characterized in that: It comprises a control module and the temperature measuring device according to any one of claims 1 to 11, wherein the temperature measuring device is communicatively connected with the control module.

13. The temperature measuring device according to claim 12, characterized in that: The temperature measuring device is a wearable electronic device.

14. The temperature measuring device according to claim 13, characterized in that: The wearable electronic device includes at least one of a watch, a bracelet, a temperature patch, an electrocardiogram patch, a smart fabric, a headset, and smart glasses.

15. A method for measuring core body temperature, characterized in that: The method comprises: Heating the object to be tested by a temperature measuring device, and obtaining a plurality of temperature values ​​of the object to be tested within a first time period during the heating process; determining the thermal conductivity of the object to be tested based on the multiple temperature values; The core body temperature of the object to be tested is determined based on the upper layer temperature and the lower layer temperature of the temperature measuring device and the thermal conductivity of the object to be tested.

16. The measuring method according to claim 15, characterized in that: The step of determining a first thermal conductivity of the object to be tested based on the multiple temperature values ​​comprises: Based on the multiple temperature values, determining a first temperature rise value of the object to be tested within the first time period; Obtaining a first heat flow distribution coefficient corresponding to the first temperature rise value; Calculating a first thermal conductivity of the object to be tested based on the first heat flux distribution coefficient and the first temperature rise value; Corresponding to a difference between the first thermal conductivity and a second thermal conductivity corresponding to the first heat flow distribution coefficient stored in advance being smaller than a first threshold, the first thermal conductivity is determined as the thermal conductivity of the object to be tested.

17. The measuring method according to claim 16, characterized in that: Also includes: Corresponding to the difference between the first thermal conductivity and the second thermal conductivity corresponding to the first heat flow distribution coefficient stored in advance being greater than the first threshold, adjusting the magnitude of the first heat flow distribution coefficient to obtain a second heat flow distribution coefficient; calculating a third thermal conductivity of the object to be tested based on the second heat flow distribution coefficient and the plurality of temperature values; Corresponding to the difference between the third thermal conductivity and the pre-stored fourth thermal conductivity corresponding to the second heat flow distribution coefficient being smaller than a first threshold, the third thermal conductivity is determined as the thermal conductivity of the object to be tested.

18. The measuring method according to claim 17, characterized in that: The numerical range of the first threshold is 0.001 W / (m·K) to 0.01 W / (m·K).

19. The measuring method according to claim 16, characterized in that: The calculating the first thermal conductivity of the object to be tested based on the first heat flux distribution coefficient and the first temperature rise value includes: The first thermal conductivity of the object to be tested is calculated based on the following formula: Wherein, ΔT is the first temperature rise value; A1 is the first heat flux distribution coefficient; A2 is the distance between the heating point and the detection point of the temperature measuring device; Q is the heating power of the temperature measuring device; t is the first time period; λ tissue is the first thermal conductivity of the object to be tested; tissue c p,tissue is the volume specific heat of the object to be tested.

20. The measuring method according to claim 15, characterized in that: The temperature measuring device comprises a first temperature measuring component, a second temperature measuring component and a separation component; wherein, The first temperature measuring component, the partition component, and the second temperature measuring component are stacked in sequence; The first temperature measuring component comprises a first substrate, a first temperature sensor and a heating component, wherein the first temperature sensor and the heating component are arranged on the first substrate, and the heating component is used to heat the object to be tested; The partition component is provided with a heat insulation structure, and the heat insulation structure is used to block the heat transfer from the heating component to the second temperature measuring component; The second temperature measuring component includes a second substrate and a second temperature sensor, and the second temperature sensor is arranged on the second substrate; The first temperature sensor and the second temperature sensor are used to measure a plurality of temperature values ​​of the object to be tested within the first time period during the heating process.

21. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores instructions, which, when executed by a computer, cause the computer to implement the core body temperature measurement method according to any one of claims 15 to 20.

22. A temperature measuring device, characterized in that: include: memory for storing instructions, and One or more processors, when the instructions are executed by the one or more processors, the processors perform the core body temperature measurement method according to any one of claims 15 to 20.

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