Wafer test bench based on low-temperature capture probe position
By using low-swelling materials and ultra-high-speed zoom cameras on the wafer test bench, capturing probe positions and adjusting wafer assembly positions, the problem of probe contact deviation between wafer pins at low temperatures is solved, achieving high-precision low-temperature detection and cost reduction.
Patent Information
- Application Number
- CN202510100072.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2025-04-15
AI Technical Summary
The existing wafer test bench cannot achieve accurate testing at low temperatures, and the contact between the probe and the wafer pin is prone to deviation.
A wafer test bench based on the position of the low-temperature capture probe is designed. By combining low-swelling and shrinking materials with the probe assembly structure, it avoids dimensional changes caused by cold shrinkage of the probe. The ultra-high-speed zoom camera is used to track the probe position in real time, and the position of the wafer assembly is adjusted through the electric telescopic rod to achieve high-precision detection.
It achieves the improvement of detection accuracy at low temperatures, reduces the production cost and processing difficulty of probes, and extends the service life of the device and has stronger adaptability.
Smart Images
Figure CN119827955A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor testing technology, and in particular to a wafer testing platform based on low-temperature capture probe positions. Background Art
[0002] Semiconductor test probes are mainly used in semiconductor chip design verification, wafer testing, and finished product testing. They are core components that connect chips / wafers with test equipment for signal transmission, and play an important role in the quality control of semiconductor products.
[0003] From the perspective of structure, common probe types mainly include elastic probes, cantilever probes and vertical probes. Both cantilever probes and vertical probes cannot meet the requirements of good contact between the probe and the wafer pins under low temperature conditions (-55 degrees to 0 degrees) due to the change in the probe's cold shrinkage size.
[0004] The elastic probe is generally composed of four basic parts: needle head, needle tail, spring, and outer tube, which are pre-pressed by precision riveting instruments. Due to the small size of wafer pins, especially the very fine size of chip products, the size of the probe is required to reach the micron level. It is a high-end precision electronic component with high manufacturing technology and high production cost. At the same time, the existing spring probe is not very stable at low temperature (-55 degrees to 0 degrees), which causes the size of each component of the probe station to change, and the contact with the wafer pin is also prone to deviation.
[0005] Therefore, a wafer test station based on low-temperature capture probe position is proposed to adjust the change of wafer probe size at low temperature by compensating for the cold shrinkage of the probe. Summary of the invention
[0006] The object of the present invention is to provide a wafer test bench based on a low temperature capture probe position to solve the technical problem that the existing wafer test bench cannot adapt to realize accurate testing under low temperature conditions.
[0007] To achieve the above object, the present invention provides the following technical solutions: A wafer test bench based on low-temperature capture probe position comprises a base, a wafer assembly, a test assembly, a camera assembly and a motion assembly; the top of the base is connected to the wafer assembly via a motion assembly, the wafer assemblies are symmetrically provided with the test assemblies on both sides of the base, the camera assembly is provided on the rear side of the wafer assembly, the test assembly adjusts the output position according to the change of external temperature, the camera assembly dynamically captures the output position of the test assembly, and drives the wafer assembly to output a specified position by driving the motion assembly.
[0008] Furthermore, the wafer assembly includes a wafer and chip pins, the moving assembly is arranged in the middle of the base, the output end of the moving assembly carries the wafer, and the chip pins are arranged on the top of the wafer. The test assembly realizes the detection of performance indicators such as conduction, current, function and aging of the wafer by contacting the chip pins.
[0009] Furthermore, a robotic arm is symmetrically arranged on the top of the base with respect to the wafer, and the output ends of the robotic arms are connected to the test components, and the test components include a rotating key, a connecting groove, a low expansion and contraction material and a sealing plate; the output end of the robotic arm is rotatably connected to the rotating key through a driving unit, the connecting groove is opened on the top of the rotating key, the low expansion and contraction material is arranged in the connecting groove, and the sealing plate is detachably connected to the top opening of the rotating key.
[0010] Furthermore, the test assembly also includes a test probe, a protective cover and a fixing ring; the protective cover is sleeved on the outer side of the test probe, the fixing ring is fixedly connected to the outer side of the protective cover, the protective cover passes through the rotating key and extends out through the sealing plate, the bottom of the fixing ring movably abuts the sealing plate, the top of the fixing ring movably abuts the sealing plate, and the fixing ring is slidably arranged inside the rotating key.
[0011] Furthermore, the material properties of the sealing plate are set as follows: when the test probe shrinks at low temperature causing the output end to move away from the chip pin, the sealing plate shrinks to a smaller size, and the shrinkage of the sealing plate drives the fixing ring to move downward, thereby causing the test probe to move downward and contact the chip pin.
[0012] Furthermore, the camera assembly includes a camera stage, an ultra-high-speed zoom camera and a thickness gauge; the camera stage is installed on the rear side of the base, and the ultra-high-speed zoom camera and the thickness gauge are respectively arranged inside the camera stage, and the output ends of the ultra-high-speed zoom camera and the thickness gauge are arranged corresponding to the output end of the test probe.
[0013] Furthermore, the motion assembly includes a fixed seat, an electric telescopic rod, a sliding sleeve, a third motor and a connecting key; the fixed seat is installed in the middle of the base, a cavity is opened inside the fixed seat, the electric telescopic rod is installed in the cavity, the electric telescopic rod is fixedly connected to the sliding sleeve, the sliding sleeve is slidably arranged inside the cavity, the electric telescopic rod is electrically connected to the ultra-high-speed zoom camera, the third motor is fixedly installed on the bottom wall of the sliding sleeve, the third motor is drivingly connected to the connecting key, the connecting key is rotatably arranged inside the sliding sleeve, and the end of the connecting key away from the sliding sleeve is used to carry the wafer.
[0014] Furthermore, the driving unit includes a first motor, an output shaft and a connecting rod; the output shaft is fixedly connected to the rear side of the rotating key, the output shaft passes through the mechanical arm and is fixedly connected to the first motor, the first motor is fixedly connected to the mechanical arm through the connecting rod, and the output shaft is rotationally connected to the mechanical arm.
[0015] Furthermore, the driving unit includes a second motor, a rotating shaft, a driving wheel, a belt, a driven wheel, a driven shaft and a support seat; the robotic arm is fixedly installed with the second motor through the support seat, the output end of the second motor is fixedly connected to the rotating shaft, the driving wheel is sleeved on the outer side of the middle part of the rotating shaft, the driving wheel is connected to the driven wheel through the belt, the end of the rotating shaft away from the second motor passes through the robotic arm and is fixedly connected to the rotating key, the middle part of the driven wheel is fixedly connected to the driven shaft, and the end of the driven shaft close to the wafer passes through the robotic arm on the other side and is fixedly connected to the corresponding rotating key.
[0016] Furthermore, the positioning accuracy of the ultra-high-speed zoom camera is set to plus or minus 1 micron.
[0017] The beneficial effects of the present invention are: 1. The present invention prevents the probe from experiencing a significant change in size due to cold shrinkage by combining a low expansion and shrinkage material with a probe assembly structure; by arranging the low expansion and shrinkage material at the junction of the probe and the mechanical wall, the processing difficulty and technical content of the probe are greatly reduced; by using a detachable detection assembly, the production cost of the probe is reduced; and by combining the low expansion and shrinkage material with the probe, the detection accuracy of the probe is higher at low temperatures.
[0018] 2. The present invention achieves a positioning accuracy of plus or minus 1 micron by tracking the position of the probe tip in real time through an ultra-high-speed zoom camera, and then drives the electric telescopic rod through the ultra-high-speed zoom camera to drive the wafer assembly to rise or move down, thereby achieving higher detection accuracy while reducing wear on the probe and extending the service life of the device.
[0019] 3. The present invention can realize detection of different positions on wafers of different sizes and thicknesses through the combined structural setting of the motion component and the detection component. The device has stronger adaptability and higher detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a three-dimensional structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the top view of the structure of the present invention; Figure 3 It is a cross-sectional structural schematic diagram of the present invention; Figure 4is a schematic diagram of the three-dimensional structure between the wafer and the test assembly of the present invention; Figure 5 It is a schematic diagram of the main structure between the wafer and the test assembly of the present invention; Figure 6 is a schematic cross-sectional structural diagram of a test assembly of the present invention; Figure 7 is a schematic diagram of the three-dimensional structure between the driving unit and the test assembly of the present invention; Figure 8 is a schematic diagram of the three-dimensional structure of the test assembly of the present invention; Fig. 9 It is a schematic diagram of the top view structure in the third embodiment of the present invention.
[0021] Description of reference numerals in the figures: 11. Base; 12. Robotic arm; 21. Wafer; 22. Chip pin; 31. Test probe; 32. Protective cover; 33. Fixed ring; 41. Rotating key; 42. Connecting groove; 43. Low expansion and contraction material; 44. Sealing plate; 51. Camera platform; 52. Ultra-high speed zoom camera; 53. Thickness gauge; 61. First motor; 62. Output shaft; 63. Connecting rod; 71. Second motor; 72. Rotating shaft; 73. Driving wheel; 74. Belt; 75. Driven wheel; 76. Driven shaft; 77. Support seat; 81. Fixed seat; 82. Electric telescopic rod; 83. Sliding sleeve; 84. Third motor; 85. Connecting key. DETAILED DESCRIPTION
[0022] Embodiment 1: Please refer to 1-8; A wafer test bench based on low-temperature capture probe position includes a base 11, a wafer assembly, a test assembly, a camera assembly and a motion assembly; the top of the base 11 is connected to the wafer assembly through a motion assembly, the wafer assemblies are symmetrically arranged with the test assemblies on both sides of the base 11, the camera assembly is arranged on the rear side of the wafer assembly, the test assembly adjusts the output position according to the change of external temperature, the camera assembly dynamically captures the output position of the test assembly, and drives the wafer assembly to output a specified position by driving the motion assembly.
[0023] As a further solution of this embodiment, the wafer assembly includes a wafer 21 and a chip pin 22. The moving assembly is arranged in the middle of the base 11, and the output end of the moving assembly carries the wafer 21. The chip pin 22 is arranged on the top of the wafer 21. The test assembly contacts the chip pin 22 to realize the detection of performance indicators such as conduction, current, function and aging of the wafer.
[0024] As a further solution of this embodiment, a mechanical arm 12 is provided on the top of the base 11 symmetrically to the wafer 21, and the output ends of the mechanical arm 12 are connected to the test assembly, and the test assembly includes a rotation key 41, a connecting groove 42, a low expansion and contraction material 43 and a sealing plate 44; The output end of the mechanical arm 12 is rotatably connected to the rotating key 41 through a driving unit, the top of the rotating key 41 is provided with the connecting groove 42, the low expansion and contraction material 43 is arranged in the connecting groove 42, and the top opening of the rotating key 41 is detachably connected to the sealing plate 44.
[0025] Preferably, the rotation key 41 is configured to be spherical so that the rotation key will not be interfered by the mechanical arm 12 when rotating.
[0026] As a further solution of this embodiment, the test assembly also includes a test probe 31, a protective cover 32 and a fixing ring 33; the protective cover 32 is sleeved on the outer side of the test probe 31, and the fixing ring 33 is fixedly connected to the outer side of the protective cover 32, the protective cover 32 passes through the rotating key 41 and extends out through the sealing plate 44, the bottom of the fixing ring 33 movably abuts against the sealing plate 44, the top of the fixing ring 33 movably abuts against the sealing plate 44, and the fixing ring 33 is slidably arranged inside the rotating key 41.
[0027] As a further solution of this embodiment, the material properties of the sealing plate 44 are set as follows: when the test probe 31 shrinks at low temperature and causes the output end to move away from the chip pin 22, the sealing plate 44 shrinks to a smaller size, and the shrinkage of the sealing plate 44 drives the fixing ring 33 to move downward, thereby causing the test probe 31 to move downward and contact the chip pin 22.
[0028] The driving unit includes a first motor 61, an output shaft 62 and a connecting rod 63; The output shaft 62 is fixedly connected to the rear side of the rotation key 41 . The output shaft 62 passes through the robotic arm 12 and is fixedly connected to the first motor 61 . The first motor 61 is fixedly connected to the robotic arm 12 via the connecting rod 63 . The output shaft 62 is rotationally connected to the robotic arm 12 .
[0029] In this embodiment, the test probe 31 can be rotated around the robot arm 12 by the driving unit to detect the chip pins at different positions on the wafer.
[0030] Embodiment 2: In the first embodiment, there is a lack of structural design for the camera component and the motion component. Among them, the camera assembly includes a camera platform 51, an ultra-high-speed zoom camera 52 and a thickness gauge 53; the camera platform 51 is installed on the rear side of the base 11, and the ultra-high-speed zoom camera 52 and the thickness gauge 53 are respectively arranged inside the camera platform 51, and the output ends of the ultra-high-speed zoom camera 52 and the thickness gauge 53 are arranged corresponding to the output end of the test probe 31.
[0031] As a further solution of this embodiment, the material properties of the sealing plate 44 are set as follows: the motion component includes a fixed seat 81, an electric telescopic rod 82, a sliding sleeve 83, a third motor 84 and a connecting key 85; the fixed seat 81 is installed in the middle of the base 11, and a cavity is opened inside the fixed seat 81, and the electric telescopic rod 82 is installed in the cavity, the electric telescopic rod 82 is fixedly connected to the sliding sleeve 83, and the sliding sleeve 83 is slidably arranged inside the cavity, the electric telescopic rod 82 is electrically connected to the ultra-high-speed zoom camera 52, and the third motor 84 is fixedly installed on the inner bottom wall of the sliding sleeve 83, and the third motor 84 is drivingly connected to the connecting key 85, and the connecting key 85 is rotatably arranged inside the sliding sleeve 83, and the end of the connecting key 85 away from the sliding sleeve 83 is used to carry the wafer 21.
[0032] In this embodiment, the present invention uses an ultra-high-speed zoom camera to track the position of the probe tip in real time to achieve a positioning accuracy of plus or minus 1 micron, and then uses the ultra-high-speed zoom camera to drive the electric telescopic rod to drive the wafer assembly to rise or move down, thereby achieving higher detection accuracy while reducing wear on the probe and extending the service life of the device.
[0033] Embodiment 3, See also Fig. 9 In the first embodiment, two sets of first motors are needed to drive the detection components. Therefore, we further improve the driving unit to achieve linkage control of the detection components on both sides.
[0034] The driving unit includes a second motor 71, a rotating shaft 72, a driving wheel 73, a belt 74, a driven wheel 75, a driven shaft 76 and a support seat 77; the robot arm 12 is fixedly installed with the second motor 71 through the support seat 77, the output end of the second motor 71 is fixedly connected to the rotating shaft 72, the driving wheel 73 is sleeved on the outer side of the middle part of the rotating shaft 72, the driving wheel 73 is connected to the driven wheel 75 through the belt 74, the end of the rotating shaft 72 away from the second motor 71 passes through the robot arm 12 and is fixedly connected to the rotating key 41, the middle part of the driven wheel 75 is fixedly connected with the driven shaft 76, the end of the driven shaft 76 close to the wafer 21 passes through the robot arm 12 on the other side and is fixedly connected to the corresponding rotating key 41.
[0035] In summary, the present invention prevents the probe from experiencing a large change in size due to cold shrinkage by combining a low expansion and contraction material with a probe assembly structure; by setting the low expansion and contraction material at the junction of the probe and the mechanical wall, the processing difficulty and technical content of the probe are greatly reduced; by using a detachable detection assembly, the production cost of the probe is reduced; and by combining the low expansion and contraction material with the probe, the detection accuracy of the probe at low temperatures is higher. Then, the present invention tracks the position of the probe tip in real time through an ultra-high-speed zoom camera to achieve a positioning accuracy of plus or minus 1 micron, and then drives the electric telescopic rod through the ultra-high-speed zoom camera to drive the wafer assembly to rise or move downward, thereby achieving higher detection accuracy and reducing wear on the probe, and extending the service life of the device. Finally, the present invention can achieve detection of different positions on wafers of different sizes and thicknesses through the combined structural setting of the motion assembly and the detection assembly, and the device has stronger adaptability and higher detection accuracy.
Claims
1. A wafer test station based on low temperature capture probe position, comprising a base, characterized in that: It also includes a wafer assembly, a test assembly, a camera assembly and a motion assembly; the top of the base is connected to the wafer assembly through the motion assembly, the test assemblies are symmetrically arranged on both sides of the base, the camera assembly is arranged on the back side of the wafer assembly, the test assembly adjusts the output position according to the external temperature change, the camera assembly dynamically captures the output position of the test assembly, and drives the wafer assembly to output the specified position by driving the motion assembly.
2. A wafer test station based on low temperature capture probe position according to claim 1, characterized in that: The wafer assembly includes a wafer and chip pins. The moving assembly is arranged in the middle of the base. The output end of the moving assembly carries the wafer. The chip pins are arranged on the top of the wafer. The test assembly contacts the chip pins to realize the detection of performance indicators such as conduction, current, function and aging of the wafer.
3. A wafer test station based on low temperature capture probe position according to claim 2, characterized in that: A mechanical arm is arranged symmetrically to the wafer on the top of the base, and the output ends of the mechanical arms are connected to the test assembly, which includes a rotating key, a connecting groove, a low expansion and contraction material and a sealing plate; The output end of the mechanical arm is rotatably connected to the rotating key through a driving unit, the top of the rotating key is provided with the connecting groove, the low expansion and contraction material is arranged in the connecting groove, and the top opening of the rotating key is detachably connected to the sealing plate.
4. A wafer test station based on low temperature capture probe position according to claim 3, characterized in that: The test assembly also includes a test probe, a protective cover and a fixing ring; The protective cover is sleeved on the outside of the test probe, the fixing ring is fixedly connected to the outside of the protective cover, the protective cover passes through the rotating key and extends out through the sealing plate, the bottom of the fixing ring movably abuts against the sealing plate, the top of the fixing ring movably abuts against the sealing plate, and the fixing ring is slidably arranged inside the rotating key.
5. A wafer test station based on low temperature capture probe position according to claim 4, characterized in that: The material property of the sealing plate is set as follows: when the test probe shrinks at low temperature and causes the output end to move away from the chip pin, the sealing plate shrinks to a smaller size, and the shrinkage of the sealing plate drives the fixing ring to move downward, thereby causing the test probe to move downward and contact the chip pin.
6. A wafer test station based on low temperature capture probe position according to claim 5, characterized in that: The camera assembly includes a camera platform, an ultra-high-speed zoom camera and a thickness gauge; The camera platform is installed at the rear side of the base, and the ultra-high-speed zoom camera and the thickness gauge are respectively arranged inside the camera platform. The output ends of the ultra-high-speed zoom camera and the thickness gauge are arranged corresponding to the output end of the test probe.
7. A wafer test station based on low temperature capture probe position according to claim 6, characterized in that: The motion assembly includes a fixed seat, an electric telescopic rod, a sliding sleeve, a third motor and a connecting key; The fixing seat is installed in the middle of the base, a cavity is opened inside the fixing seat, the electric telescopic rod is installed in the cavity, the electric telescopic rod is fixedly connected to the sliding sleeve, the sliding sleeve is slidably arranged in the cavity, the electric telescopic rod is electrically connected to the ultra-high-speed zoom camera, the third motor is fixedly installed on the bottom wall of the sliding sleeve, the third motor is drivingly connected to the connecting key, the connecting key is rotatably arranged in the sliding sleeve, and the end of the connecting key away from the sliding sleeve is used to carry the wafer.
8. The wafer test station based on low temperature capture probe position according to claim 7, characterized in that: The driving unit comprises a first motor, an output shaft and a connecting rod; The output shaft is fixedly connected to the rear side of the rotation key, the output shaft passes through the mechanical arm and is fixedly connected to the first motor, the first motor is fixedly connected to the mechanical arm through the connecting rod, and the output shaft is rotationally connected to the mechanical arm.
9. The wafer test station based on low temperature capture probe position according to claim 7, characterized in that: The driving unit includes a second motor, a rotating shaft, a driving wheel, a belt, a driven wheel, a driven shaft and a supporting seat; The robotic arm is fixedly mounted with the second motor via a support seat, the output end of the second motor is fixedly connected to the rotating shaft, the driving wheel is sleeved on the outer side of the middle part of the rotating shaft, the driving wheel is connected to the driven wheel via the belt, the end of the rotating shaft away from the second motor passes through the robotic arm and is fixedly connected to the rotating key, the middle part of the driven wheel is fixedly connected to the driven shaft, and the end of the driven shaft close to the wafer passes through the robotic arm on the other side and is fixedly connected to the corresponding rotating key.
10. A wafer test station based on low temperature capture probe position according to claim 8 or 9, characterized in that: The positioning accuracy of the ultra-high-speed zoom camera is set to plus or minus 1 micron.