Wafer product anti-mixing device

Abstract

The invention discloses a wafer product mixing prevention device, and relates to the field of industrial product processing equipment.The wafer product mixing prevention device comprises a marble platform, a wafer detection device is arranged on the marble platform, the wafer detection device comprises a tool plate, a mounting bottom plate is arranged in the center of the tool plate, a connecting port is formed in the mounting bottom plate, and the connecting port is connected with the marble platform. A supporting plate is arranged on the connecting opening, and an opening matched with the connecting opening is formed in the supporting plate. According to the anti-mixing device for the wafer product, the edge correction sensors are carefully arranged on the two sides of the wafer on the tool plate, the detection piece connected above the edge correction sensors and the control rod cooperatively operate through the connecting transverse plate, the edge correction sensors can rapidly and sensitively sense subtle changes, signals are transmitted in time, a corresponding adjusting mechanism is started, the position of the wafer is accurately corrected, and the quality of the wafer product is improved. Detection errors caused by position deviation are greatly reduced, a solid foundation is laid for follow-up detection procedures, and the accuracy and reliability of detection data are powerfully guaranteed.

Description

Technical Field

[0001] The invention relates to the field of industrial product processing equipment, and in particular to a wafer product mixing prevention device. Background Art

[0002] With the rapid development of the semiconductor industry, wafers, as the basic materials of integrated circuits, are crucial to the precision and quality control of their manufacturing process. In the large-scale wafer production process, there are many types of products, and wafers of different batches and specifications need to be accurately distinguished and managed to avoid mixing. This places extremely high demands on ensuring product quality and production efficiency. This is the general environment background faced by wafer product anti-mixing devices.

[0003] In current wafer production, some measures have been taken to prevent material mixing. Usually, wafers are simply labeled and stored in partitions on the production line, but these methods are prone to human negligence or unclear labeling when faced with complex production processes and a large number of wafer products, making it difficult to completely ensure that wafers will not be mixed up.

[0004] The steps of the existing technology generally include: first, after the wafer production is completed, the wafers are manually classified and labeled accordingly. Then the wafers are placed in a specific storage area, relying on the workers' memory and simple records to distinguish wafers of different batches and specifications. In the subsequent processing or testing links, the identity of the wafer is also confirmed by manually checking the label information. The whole process is highly dependent on manual operation and lacks an automated and precise detection and identification mechanism.

[0005] Manual operation is easily affected by factors such as fatigue and negligence, which may lead to wrong labeling or misreading, thus causing material mixing problems. Moreover, simple partition storage cannot monitor the position and status of wafers in real time. Once the position of the wafer changes during transportation or storage, it is difficult to detect and correct it in time, which lays a hidden danger for the risk of material mixing and makes it difficult to meet the increasingly high quality and efficiency requirements of semiconductor production. Summary of the invention

[0006] Based on this, the purpose of the present invention is to provide a wafer product mixing prevention device to solve the technical problems of the prior art that manual operation is prone to mixing, has low efficiency and poor precision.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wafer product mixing prevention device, comprising a marble platform, a chip detection device is arranged on the marble platform, the chip detection device comprises a tooling plate, a mounting base plate is arranged at the center position of the tooling plate, a connecting port is arranged on the mounting base plate, a supporting plate is arranged on the connecting port, an opening is arranged on the supporting plate to match the connecting port, a chip is arranged on the supporting plate, a pair of placement plates are arranged on the tooling plate to match the chip, a first connecting rod is slidably arranged on the placement plate, the first connecting rod is arranged in a "Y" shape, and sensing rods are arranged at two ends of the first connecting rod.

[0008] By adopting the above technical solution, a pair of sensing rods limit the position of the wafer, and the two sides of the wafer are limited by the first connecting rod, thereby ensuring the centering of the wafer and facilitating subsequent measurement of the wafer.

[0009] The present invention is further configured such that a pair of edge correction sensors are arranged on the tooling plate on the wafer, a detection piece is arranged above the edge correction sensor, a connecting cross plate is arranged on the top of the detection piece, a connecting ring is arranged at the center position of the connecting cross plate, and a control rod is arranged on one side of the detection piece.

[0010] By adopting the above technical solution, the edge correction sensor is mainly used to monitor and detect the integrity of the chip edge to ensure the integrity of the chip edge. The edge correction sensor is arranged in conjunction with the detection component. The edge defects of the chip are made obvious by the edge correction sensor, and the image is then collected by the detection component to realize defect detection on the chip edge.

[0011] The present invention is further configured such that a pair of support rods are provided on the marble platform to cooperate with the connecting cross plate, and mounting grooves are provided on the support rods.

[0012] By adopting the above technical solution, parts such as external lifting rods are connected through the installation grooves on the support rods, so as to control the height of the connecting cross plate and realize the adjustment of the height of the device according to actual usage requirements.

[0013] The present invention is further configured such that the edge correction sensor comprises a first mounting block and a second mounting block, the inner wall of the first mounting block is provided with a slot, the slot has a pair of clamping jaws, a first knob is provided on one side of the clamping jaw, and a second knob is provided between the first mounting block and the second mounting block.

[0014] By adopting the above technical solution, the first knob is used to control the clamping claw to clamp the wafer. In actual use, the second knob is used to control the distance between the first mounting block and the second mounting block. The distance between the first mounting block and the second mounting block is adjusted according to different usage requirements.

[0015] The present invention is further configured such that a pair of mounting plates are arranged on the tooling plate from top to bottom to cooperate with the chip, a first control motor is arranged on the tooling plate to cooperate with the mounting plate, a thickness measuring sensor is arranged on the mounting plate, a second connecting rod is arranged on the side of the pair of mounting plates close to the chip, a pair of the second connecting rods extend to the upper and lower surfaces of the chip respectively, and a detection head is arranged on the second connecting rod to cooperate with the chip.

[0016] By adopting the above technical solution, the thickness of the wafer is measured by a thickness measuring sensor, and the material of the crystal is detected by a pair of detection heads, thereby preventing material mixing.

[0017] The present invention is further configured such that a weighing sensor is provided on the tooling plate to cooperate with the wafer, and a guide groove is provided on the tooling plate to cooperate with the weighing sensor.

[0018] By adopting the above technical solution, the position of the weighing sensor is adjusted through the guide groove.

[0019] The present invention is further configured such that an output tube is connected to the detection head.

[0020] By adopting the above technical solution, the detector data is output through the output tube.

[0021] In summary, the present invention mainly has the following beneficial effects:

[0022] 1. The present invention carefully places edge correction sensors on both sides of the wafer on the tooling board in the wafer product mixing prevention device, and the detection parts connected above the edge correction sensors work in coordination with the control rod through the connecting cross plate. When the wafer is positionally offset during the detection process, the edge correction sensors can quickly and keenly sense the subtle changes, and transmit the signals in time, start the corresponding adjustment mechanism, and accurately correct the wafer position, which greatly reduces the detection error caused by position deviation, lays a solid foundation for subsequent detection processes, and effectively guarantees the accuracy and reliability of the detection data;

[0023] 2. The present invention uses the device to accurately control the thickness of the wafer with the help of the thickness sensor and the detection head on the tooling plate. The first control motor drives the mounting plate to steadily approach the wafer, and the thickness sensor starts working immediately, and the detection head closely contacts the surface of the wafer. In this way, not only can the actual thickness of the wafer be accurately measured, but also once a wafer with abnormal thickness is found during the detection process, it can be quickly screened out, effectively avoiding bad wafers from entering the subsequent production links, thereby effectively ensuring the quality stability of wafer products, significantly improving the product yield, and reducing cost losses and production delays caused by quality problems for semiconductor manufacturers. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a partial structural schematic diagram of the present invention;

[0026] Figure 3 This is a schematic diagram of the installation of the support plate of the present invention;

[0027] Figure 4 This is a schematic diagram of installing the mounting base plate of the present invention;

[0028] Figure 5 It is a schematic diagram of the structure of the edge correction sensor of the present invention;

[0029] Figure 6 This is a cross-sectional view of the internal structure of the edge correction sensor of the present invention.

[0030] In the figure: 1. marble platform; 2. connecting ring; 3. detection part; 4. control rod; 5. first control motor; 6. mounting groove; 7. support rod; 8. detection head; 9. wafer; 10. weighing sensor; 11. tooling plate; 12. thickness sensor; 13. mounting plate; 14. first connecting rod; 15. sensing rod; 16. opening; 17. edge correction sensor; 18. support plate; 19. second connecting rod; 20. guide groove; 21. clamping claw; 22. connection port; 23. output pipe; 24. slot; 25. first knob; 26. first mounting block; 27. second mounting block; 28. second knob; 29. ​​mounting base plate; 30. placement plate; 31. connecting cross plate. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] The following describes an embodiment of the present invention based on its overall structure.

[0033] A wafer product mixing prevention device, such as Figure 1-6As shown, it includes a marble platform 1, on which a wafer detection device is arranged, and the wafer detection device includes a tooling plate 11, a mounting base plate 29 is arranged at the center position of the tooling plate 11, a connecting port 22 is arranged on the mounting base plate 29, a supporting plate 18 is arranged on the connecting port 22, an opening 16 is arranged on the supporting plate 18 to match the connecting port 22, a wafer 9 is arranged on the supporting plate 18, a pair of placement plates 30 are arranged on the tooling plate 11 to match the wafer 9, a first connecting rod 14 is slidably arranged on the placement plate 30, the first connecting rod 14 is arranged in a "Y" shape, and sensing rods 15 are arranged at two ends of the first connecting rod 14, a pair of sensing rods 15 limit the position of the wafer 9, and the two sides of the wafer 9 are limited by the first connecting rod 14, so as to ensure the centering of the wafer, which is convenient for subsequent measurement of the wafer.

[0034] In coordination therewith, a pair of edge correction sensors 17 are arranged on the tooling plate 11 on the chip 9, a detection component 3 is arranged above the edge correction sensor 17, a connecting cross plate 31 is arranged on the top of the detection component 3, a connecting ring 2 is arranged at the center of the connecting cross plate 31, and a control rod 4 is arranged on one side of the detection component 3. The edge correction sensor 17 is mainly used to monitor and detect the edge integrity of the chip 9 to ensure the integrity of the edge of the chip 9, wherein the edge correction sensor 17 is arranged in coordination with the detection component 3, the edge defects of the chip 9 are made obvious by the edge correction sensor 17, and then the image is collected by the detection component 3 to realize the defect detection of the edge of the chip 9.

[0035] A pair of support rods 7 are provided on the marble platform 1 to cooperate with the connecting cross plate 31, and a mounting groove 6 is provided on the support rod 7. A pair of mounting plates 13 are provided from top to bottom on the tooling plate 11 to cooperate with the chip 9. A first control motor 5 is provided on the tooling plate 11 to cooperate with the mounting plate 13. A thickness sensor 12 is provided on the mounting plate 13, and a detection signal is sent by the thickness sensor 12 to monitor the thickness of the chip. A second connecting rod 19 is provided on the side of the pair of mounting plates 13 close to the chip 9, and a pair of the second connecting rods 19 extend to the upper and lower surfaces of the chip 9 respectively. A detection head 8 is provided on the second connecting rod 19 to cooperate with the chip 9. A detection signal is sent by setting the detection head 8, and the signal contacts the chip 9. The detection result is analyzed together by the upper and lower pair of detection heads 8, so as to determine the material of the chip 9.

[0036] The edge correction sensor 17 includes a first mounting block 26 and a second mounting block 27. The inner wall of the first mounting block 26 is provided with a slot 24. The slot 24 is a pair of clamping jaws 21. A first knob 25 is provided on one side of the clamping jaw 21. A second knob 28 is provided between the first mounting block 26 and the second mounting block 27. The first knob 25 is used to control the first clamping jaw 21 to clamp and fix the wafer 9. The second knob 28 is used to control the distance between the first mounting block 26 and the second mounting block 27, so as to clamp different wafers 9.

[0037] Furthermore, a weighing sensor 10 is provided on the tooling plate 11 to cooperate with the chip 9. The chip 9 is supported by the weighing sensor 10, and the quality of the chip is detected due to the support. At the same time, a guide groove 20 is provided on the tooling plate 11 to cooperate with the weighing sensor 10. The position of the weighing sensor 10 is controlled by the guide groove 20, and the position of the weighing sensor 10 can be adjusted calmly according to actual usage requirements.

[0038] Furthermore, the detection head 8 is connected to an output tube 23, and a plurality of cables are arranged in the output tube 23. The data generated by the detection head 8 is output through the cables to realize the monitoring of the wafer data.

[0039] In actual use, first, ensure that the marble platform 1 is in a stable state, and each component is clean and free of impurities, the power supply of the device is connected normally, and all sensors and motors can work normally;

[0040] Carefully place the wafer 9 to be tested on the support plate 18, ensuring that the wafer 9 is in good contact with the support plate 18 and is located between a pair of placement plates 30 on the tooling plate 11. At this time, the two sensing rods 15 of the "Y"-shaped first connecting rod 14 will preliminarily define the position of the wafer 9 to ensure that the wafer 9 is basically centered, which is convenient for subsequent precise measurement;

[0041] According to the size of the chip 9, the first knob 25 is rotated to adjust the claw 21 in the inner wall groove 24 of the first mounting block 26 so that it gently clamps the chip 9, and then the second knob 28 is rotated to fine-tune the distance between the first mounting block 26 and the second mounting block 27 to ensure that the edge correction sensor 17 can accurately monitor the edge of the chip 9.

[0042] The edge correction sensor 17 is started, and it monitors and detects the edge integrity of the wafer 9. When a defect is detected on the edge, the defect information is transmitted to the detection member 3. The detection member 3 is kept stable by the connecting ring 2 on the connecting cross plate 31. After receiving the signal from the edge correction sensor 17, the image of the edge of the wafer 9 is collected, thereby realizing the detection and analysis of the edge defects of the wafer 9, and ensuring that the edge integrity of the wafer 9 meets the requirements;

[0043] The first control motor 5 on the tooling plate 11 is started, driving a pair of mounting plates 13 to approach the wafer 9. The thickness sensor 12 on the mounting plate 13 will send out a detection signal, monitor the thickness of the wafer 9, and transmit the thickness data to the control system.

[0044] At the same time, the detection head 8 on the second connecting rod 19 on the mounting plate 13 will also send out a detection signal, and the signal contacts the wafer 9. The upper and lower detection heads 8 jointly analyze the detection results, and the generated data is output through the cable in the output tube 23 connected to the detection head 8, so as to judge the material of the wafer 9, and these data will also be recorded and stored for subsequent verification and analysis;

[0045] The wafer 9 is placed on a weighing sensor 10 , which not only supports the wafer 9 , but also monitors the quality of the wafer 9 and transmits the quality data to the control system.

[0046] If the position of the weighing sensor 10 needs to be adjusted, it can be operated through the guide groove 20 on the tooling plate 11. According to actual use requirements, the position of the weighing sensor 10 can be flexibly controlled to ensure that it can accurately measure the weight of the wafer 9 and ensure the stability of the wafer 9 during the entire detection process;

[0047] During the entire detection process, the data collected by each sensor, including the position, edge integrity, thickness, material, weight and other information of the wafer 9, will be recorded by the control system.

[0048] The control system will analyze these data and compare them with the preset standard data to determine whether the wafer 9 meets the quality requirements and whether there is any mixing of materials. If the data is abnormal, the control system will issue an alarm to prompt the operator to conduct further inspection and processing to ensure that each wafer product can pass the inspection accurately, avoid the occurrence of mixing of materials, and ensure product quality.

[0049] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A wafer product mixing prevention device, comprising a marble platform (1), characterized in that: A wafer detection device is arranged on the marble platform (1), and the wafer detection device comprises a tooling plate (11), a mounting base plate (29) is arranged at a central position on the tooling plate (11), a connecting port (22) is arranged on the mounting base plate (29), a supporting plate (18) is arranged on the connecting port (22), an opening (16) is arranged on the supporting plate (18) to match the connecting port (22), a wafer (9) is arranged on the supporting plate (18), a pair of placement plates (30) are arranged on the tooling plate (11) to match the wafer (9), a first connecting rod (14) is slidably arranged on the placement plate (30), the first connecting rod (14) is arranged in a "Y" shape, and sensing rods (15) are arranged at two ends of the first connecting rod (14).

2. A wafer product mixing prevention device according to claim 1, characterized in that: A pair of edge correction sensors (17) are arranged on the tooling plate (11) on the wafer (9), a detection member (3) is arranged above the edge correction sensor (17), a connecting horizontal plate (31) is arranged on the top of the detection member (3), a connecting ring (2) is arranged at the center of the connecting horizontal plate (31), and a control rod (4) is arranged on one side of the detection member (3).

3. The wafer product mixing prevention device according to claim 1, characterized in that: A pair of support rods (7) are provided on the marble platform (1) to cooperate with the connecting transverse plate (31), and mounting grooves (6) are provided on the support rods (7).

4. The wafer product mixing prevention device according to claim 1, characterized in that: The edge correction sensor (17) comprises a first mounting block (26) and a second mounting block (27); a slot (24) is provided on an inner wall of the first mounting block (26); a pair of clamping jaws (21) are provided in the slot (24); a first knob (25) is provided on one side of the clamping jaw (21); and a second knob (28) is provided between the first mounting block (26) and the second mounting block (27).

5. The wafer product mixing prevention device according to claim 1, characterized in that: A pair of mounting plates (13) are arranged on the tooling plate (11) from top to bottom in cooperation with the wafer (9); a first control motor (5) is arranged on the tooling plate (11) in cooperation with the mounting plate (13); a thickness sensor (12) is arranged on the mounting plate (13); a second connecting rod (19) is arranged on one side of the pair of mounting plates (13) close to the wafer (9); the pair of second connecting rods (19) extend to the upper and lower surfaces of the wafer (9) respectively; and a detection head (8) is arranged on the second connecting rod (19) in cooperation with the wafer (9).

6. The wafer product mixing prevention device according to claim 1, characterized in that: A weighing sensor (10) is provided on the tooling plate (11) to match the wafer (9), and a guide groove (20) is provided on the tooling plate (11) to match the weighing sensor (10).

7. The wafer product mixing prevention device according to claim 1, characterized in that: The detection head (8) is connected to an output tube (23).

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