Copper surface organic acid type super coarsening agent micro-etching device

Abstract

The invention relates to the technical field of copper surface micro-etching processing, in particular to a copper surface organic acid type super coarsening agent micro-etching device which comprises a cleaning pool, a first conveying frame is fixed to the outer wall of one side of the top of the cleaning pool, a first assembly line is installed on the inner wall of the top of the first conveying frame, and a micro-etching pool is arranged on the outer wall of one side of the cleaning pool. A second conveying frame is fixed to the outer wall of the top between the cleaning pool and the micro-etching pool, a second assembly line is installed on the inner wall of the top of the second conveying frame, and lifting frames are symmetrically erected and fixed to the inner walls of the two sides of the bottoms of the cleaning pool and the micro-etching pool; the copper surface organic acid type super coarsening agent micro-etching device is composed of the assembly line, the cleaning pool and the micro-etching pool, the liftable conveying belts are arranged in the cleaning pool and the micro-etching pool, automatic feeding and discharging of micro-etching treatment PCBs can be achieved, and copper surface oil removal cleaning, copper surface micro-etching treatment and cleaning after copper surface micro-etching are sequentially completed; and the automation level of the copper surface organic acid type super coarsening agent micro-etching device is improved.

Description

Technical Field

[0001] The invention relates to the technical field of copper surface micro-etching processing, and in particular to a copper surface organic acid type super-roughening agent micro-etching device. Background Art

[0002] In the manufacture of printed circuit boards (PCBs), the treatment of copper surfaces is one of the key steps. In order to ensure good bonding between the copper layer and insulating materials (such as resins), the copper surface usually needs to be roughened; traditional roughening methods include mechanical grinding, chemical etching, etc., but these methods have problems such as low efficiency, large environmental pollution, and poor surface uniformity. Organic acid-based super-roughening agent micro-etching technology has emerged as a more environmentally friendly and efficient copper surface treatment solution; copper surface organic acid-based super-roughening agent micro-etching device is used to micro-etch the copper surface in PCB manufacturing to enhance its bonding with subsequent layers. The device micro-etches the copper surface through an organic acid type super-roughening agent to form a rough surface and improve adhesion. Patent: CN202671660U discloses a micro-super-roughening micro-etching pre-processor, including a circuit control box and a processing system. The circuit control box and the processing system are connected by a control line. The processing system includes a chemical pump, a base, a connecting pipe, a pressure gauge, a water tank and a main frame cabinet. The chemical pump is fixed to the base, the pressure gauge is arranged on the connecting pipe outside the water tank, the water tank is arranged on the upper part of the main frame cabinet, and the circuit control box and the chemical pump are connected by a control line. The wire connection is made, and the connecting pipes include an input pipe, a reflux pipe, an output pipe, a tee pipe and a diversion pipe. The input pipe is connected to the chemical pump and the diversion pipe, the diversion pipe is connected to the water tank, the reflux pipe is connected to the chemical pump, the reflux pipe and the output pipe are connected to the drain port at the bottom of the water tank through a tee pipe, and vertical clamping devices are provided on the opposite sides of the water tank. In addition, at least one nozzle is provided on the opposite sides respectively to connect with the diversion pipe, which reduces the equipment investment cost, can realize the roughness of the copper surface, effectively improves the bonding force between the copper surface and the interface, occupies a small area, has low investment, and has low maintenance and servicing costs.

[0003] The copper surface organic acid type super-roughening agent micro-etching device currently on the market has a relatively simple structure and requires manual loading and unloading of PCB boards, which is relatively laborious and inconvenient. It does not have the ability to clean and dry before and after the micro-etching process, which affects the effect of the copper surface micro-etching process. In addition, the traditional copper surface organic acid type super-roughening agent micro-etching device does not have the ability to spray the organic acid type super-roughening agent in a linked manner, which is not conducive to uniform micro-etching of the copper surface and affects the efficiency of the copper surface micro-etching process.

[0004] In order to solve the above problems, the present invention proposes a copper surface organic acid type super roughening agent micro-etching device. Summary of the invention

[0005] (1) Technical problems to be solved: The purpose of the present invention is to overcome the problem that the copper surface organic acid type super-roughening agent micro-etching device in the prior art needs to manually load and unload the PCB board, which is relatively laborious and inconvenient, and does not have the ability to clean and dry before and after the micro-etching process, which affects the effect of the copper surface micro-etching process. It also does not have the ability to spray the organic acid type super-roughening agent in a linked manner, which is not conducive to uniform micro-etching of the copper surface and affects the efficiency of the copper surface micro-etching process. In order to meet actual needs, a copper surface organic acid type super-roughening agent micro-etching device is provided to solve the above-mentioned technical problems.

[0006] (2) Technical solution: In order to achieve the purpose of the present invention, the technical solution adopted by the present invention is: A copper surface organic acid type super roughening agent micro-etching device comprises a cleaning pool, a first conveying frame is fixed on the outer wall of one side of the top of the cleaning pool, and a first assembly line is installed on the top inner wall of the first conveying frame, a micro-etching pool is arranged on the outer wall of one side of the cleaning pool, a second conveying frame is fixed on the top outer wall between the cleaning pool and the micro-etching pool, and a second assembly line is installed on the top inner wall of the second conveying frame, lifting frames are symmetrically mounted and fixed on the inner walls on both sides of the bottom of the cleaning pool and the micro-etching pool, mounting frames are arranged inside the cleaning pool and the micro-etching pool, rotating rollers are rotatably installed on the inner walls at both ends of the mounting frame, and a conveying frame is set between the rotating rollers. Belt, guide blocks are fixed on the outer walls at both ends of the two sides of the mounting frame, guide grooves are opened on the inner walls at both sides of the lifting frame, and one end of the guide block is inserted into the inside of the guide groove, and a screw hole is opened through the top outer wall of the guide block, and a screw rod is threadedly connected to the inside of the screw hole, and the two ends of the screw rod are rotatably connected to the inner walls at both ends of the guide groove, a first motor is embedded and fixed on the outer wall of one side of the top of the lifting frame, and the first motor and the screw rod are coaxially connected, a pump liquid conveyor belt driving unit is arranged on the outer wall of one side of the cleaning pool and the micro-etching pool, a linkage drying assembly is arranged on the top outer wall of the second assembly line, and a micro-etching spray assembly is arranged inside the micro-etching pool.

[0007] Preferably, the pump liquid conveyor belt driving unit includes a two-way pump fixed on the outer walls of one side of the cleaning tank and the micro-etching tank, respectively, the suction end of the two-way pump is connected to a suction pipe, and one end of the suction pipe passes through the interior of the tank body, the pump liquid end of the two-way pump is connected to a pump liquid pipe, a mounting groove is opened on the outer wall of one side of the end of the mounting frame, a first gear is rotatably installed on the inner wall of one end of the mounting groove, the rotating roller and the first gear are coaxially connected, and a second gear is rotatably installed on the inner wall of the other end of the mounting groove, a first turbine is installed on the outer wall of one side of the mounting frame, the first turbine and the second gear are coaxially connected, one end of the pump liquid pipe is connected to the outer wall of one side of the first turbine, and a liquid outlet pipe is connected to the outer wall of the other side of the first turbine.

[0008] Preferably, the linkage drying component includes a blowing hood arranged on the top outer wall of the second assembly line, and the two ends of the blowing hood are fixed to the tops of the lifting frames on both sides, a first fixed frame is fixed on the middle outer wall of the mounting frame inside the cleaning pool, a second turbine is installed on the top outer wall of the first fixed frame, a second motor is installed on the top outer wall of the second turbine, and the second motor and the second turbine are coaxially connected, an air filter element is connected to the suction end of the second turbine, a pump air end of the second turbine is connected to the pump air pipe, and one end of the pump air pipe is connected to the inside of the blowing hood, an electric heating rod is installed on the top inner wall of the blowing hood, a blowing hood is arranged on the middle inner wall of the first fixed frame, connecting plates are fixed on the outer walls of both sides of the blowing hood, and one end of the connecting plate is fixedly connected to the middle inner wall of the first fixed frame, a transmission shaft is connected to the bottom end of the second turbine rotating shaft, and the transmission shaft passes through the first impeller fixed on the outer wall at one end inside the blowing hood.

[0009] Preferably, the micro-etching spray assembly includes a liquid pump fixed on the outer wall of one side of the micro-etching pool, the liquid suction end of the liquid pump is connected with a suction pipe, the liquid pump end of the liquid pump is connected with a pump delivery pipe, a second fixing frame is fixed on the middle outer wall of the internal mounting frame of the micro-etching pool, a third turbine is fixed on the top outer wall of the second fixing frame, a rotating pipe is rotatably installed on the middle inner wall of the third turbine, the rotating pipe passes through the inner outer wall of one end of the third turbine and a second impeller is fixed on the outer wall, one end of the pump delivery pipe is through-connected to the outer wall of one side of the third turbine, the other side of the outer wall of the third turbine is through-connected with a bent pipe, the bent pipe and the end of the rotating pipe are rotatably connected, and a rotating joint is installed at the rotating connection, a rotating branch pipe is distributed through-connected on the outer wall of the end of the rotating pipe, and a nozzle is distributed through-installed on the bottom outer wall of the rotating branch pipe.

[0010] Preferably, a filter element is installed through the middle outer wall of the suction pipe.

[0011] Preferably, support frames are installed on the bottom outer walls of the first conveying frame and the second conveying frame.

[0012] Preferably, a first inclined groove is provided on the inner wall of the bottom of the second conveying frame located at one side of the cleaning tank, and a second inclined groove is provided on the inner wall of the bottom of the second conveying frame located at one side of the micro-etching tank.

[0013] Preferably, the pump pipe is a telescopic hose.

[0014] Preferably, brushes are distributed and fixed on the outer wall of the conveyor belt.

[0015] Preferably, the nozzle is a rotary nozzle.

[0016] (3) Beneficial effects: A. The copper surface organic acid type super roughening agent micro-etching device is composed of an assembly line, a cleaning tank and a micro-etching tank, and a lifting conveyor belt is arranged inside the cleaning tank and the micro-etching tank, which can realize the automatic loading and unloading of the micro-etching PCB board, and sequentially complete the copper surface degreasing cleaning, copper surface micro-etching treatment, and copper surface cleaning after micro-etching, thereby improving the automation level of the copper surface organic acid type super roughening agent micro-etching device; B. Through the setting of the pump liquid conveyor belt drive unit and the control of the two-way pump, the two-way pump works to pump the water in the pool body through the suction pipe, and pumps it out through the pump liquid pipe into the first turbine, and returns to the pool body through the outlet pipe on one side of the first turbine. The water will drive the first turbine to rotate during its circulation, thereby driving the second gear to rotate, and the rotating roller will be driven to rotate under the coordinated transmission of the second gear and the first gear. The conveyor belt above the mounting frame will be driven to rotate under the coordinated rotation of the rotating roller, and the two-way pump can be controlled to rotate in the opposite direction and the conveyor belt can be driven to rotate in the opposite direction. The loading and unloading of the PCB board processed by micro-etching is carried out through the rotation of the conveyor belt. During the rotation of the conveyor belt in the cleaning pool or the micro-etching pool, the cleaning liquid or organic acid type super-roughening agent in the pool is stirred and disturbed, thereby improving the efficiency and effect of degreasing and micro-etching of the copper surface.

[0017] C. Through the setting of the linkage drying component, during the transportation process above the second assembly line after the micro-etching and cleaning of the copper surface of the PCB board, the second motor is controlled to drive the second turbine to rotate, and the external air is sucked through the air filter element. The sucked air is input into the blowing hood through the pump air pipe. During the process, the electric heating rod works to heat the blown air, and the hot air is blown out through the blowing hood above the second assembly line to dry the copper surface of the PCB board after the cleaning or micro-etching treatment transported above the second assembly line, which is conducive to the micro-etching of the organic acid type super-roughening agent on the copper surface. During the rotation of the second turbine, the first impeller is driven to rotate synchronously through the transmission shaft. During the sinking of the conveyor belt and the upper PCB board into the cleaning pool, the first impeller is placed in the cleaning pool. The rotating first impeller plays a role in stirring the cleaning liquid in the cleaning pool, thereby enhancing the cleaning effect. After the conveyor belt is lifted, the first impeller rotates in the blowing hood to play a role in blowing and drying the copper surface of the PCB board after the cleaning treatment above the conveyor belt.

[0018] D. Through the setting of the micro-etching spray assembly, the above-mentioned conveyor belt and the PCB board above sink into the micro-etching pool for micro-etching. The control liquid pump works to pump the organic acid type super-roughening agent in the micro-etching pool through the suction pipe, input it into the third turbine through the pump delivery pipe, and then input it into the rotating pipe through the elbow and the rotary joint, and spray it out through the nozzle at the bottom of the rotating branch pipe. The liquid will impact the second impeller during the process of passing through the third turbine, thereby driving the rotating pipe to rotate and also driving the rotating branch pipe to rotate, so that the organic acid type super-roughening agent sprayed by the nozzle acts evenly and effectively on the copper surface, and the copper surface of the PCB board on the conveyor belt is sprayed with the organic acid type super-roughening agent, which improves the effect of the micro-etching treatment of the organic acid type super-roughening agent on the copper surface. During the process of the above-mentioned suction pipe sucking the organic acid type super-roughening agent in the micro-etching pool, the filter element filters the impurities in the organic acid type super-roughening agent, and the impurities can be cleaned at the filter element later, which plays a role in filtering and purifying the organic acid type super-roughening agent in the micro-etching pool. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the copper surface organic acid type super roughening agent micro-etching device of the present invention; Figure 2 It is a schematic diagram of the partial three-dimensional structure of the copper surface organic acid type super-roughening agent micro-etching device of the present invention; Figure 3 for Figure 1 A magnified view of the structure in the middle A area; Figure 4 for Figure 1 A magnified view of the structure in the middle B area; Figure 5 for Figure 1 A magnified view of the structure of the middle C region; Figure 6 for Figure 2 A magnified view of the structure in the middle D region; Figure 7 for Figure 1 A magnified view of the structure in the middle E region; Figure 8 for Figure 1 A magnified view of the structure in the middle F region; Fig. 9 It is a schematic diagram of the partial three-dimensional cross-section structure of the micro-etching spray assembly in the copper surface organic acid type super-roughening agent micro-etching device of the present invention.

[0020] The reference numerals are as follows: 1. Cleaning tank; 2. First conveyor rack; 3. First assembly line; 4. Micro-etching tank; 5. Second conveyor rack; 6. Second assembly line; 7. Lifting rack; 8. Mounting rack; 9. Rotating roller; 10. Conveyor belt; 11. Guide block; 12. Guide groove; 13. Screw hole; 14. Screw rod; 15. First motor; 16. Pump liquid conveyor belt drive unit; 17. Linkage drying assembly; 18. Micro-etching spray assembly; 19. Filter element; 20. Support rack; 21. First chute; 22. Second chute; 23. Brush; 161, bidirectional pump; 162, suction pipe; 163, pump pipe; 164, mounting groove; 165, first gear; 166, second gear; 167, first turbine; 168, liquid outlet pipe; 171, air blowing hood; 172, first fixing frame; 173, second turbine; 174, second motor; 175, air filter element; 176, pump air pipe; 177, electric heating rod; 178, air blowing hood; 179, connecting plate; 1710, transmission shaft; 1711, first impeller; 181. Liquid pump; 182. Suction pipe; 183. Pump delivery pipe; 184. Second fixed frame; 185. Third turbine; 186. Rotating pipe; 187. Second impeller; 188. Bend pipe; 189. Rotating joint; 1810. Rotating branch pipe; 1811. Spray nozzle. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] The following is combined with Figure 1-9 The present invention is further described with examples: In this embodiment, Figure 1-9As shown, a copper surface organic acid type super-roughening agent micro-etching device comprises a cleaning pool 1, a first conveying frame 2 is fixed on the outer wall of one side of the top of the cleaning pool 1, and a first assembly line 3 is installed on the top inner wall of the first conveying frame 2, a micro-etching pool 4 is arranged on the outer wall of one side of the cleaning pool 1, a second conveying frame 5 is fixed on the top outer wall between the cleaning pool 1 and the micro-etching pool 4, and a second assembly line 6 is installed on the top inner wall of the second conveying frame 5, lifting frames 7 are symmetrically mounted and fixed on the inner walls on both sides of the bottom of the cleaning pool 1 and the micro-etching pool 4, mounting frames 8 are arranged inside the cleaning pool 1 and the micro-etching pool 4, rotating rollers 9 are rotatably installed on the inner walls at both ends of the mounting frame 8, and a conveyor belt 10 is set between the rotating rollers 9, and the mounting frames 8 are fixed on the outer walls at both ends of the two sides. A guide block 11 is fixed, guide grooves 12 are provided on the inner walls on both sides of the lifting frame 7, and one end of the guide block 11 is inserted into the inside of the guide groove 12, a screw hole 13 is provided on the top outer wall of the guide block 11, a screw rod 14 is screwed in the screw hole 13, and the two ends of the screw rod 14 are rotatably connected to the inner walls at both ends of the guide groove 12, a first motor 15 is embedded and fixed on the outer wall of one side of the top of the lifting frame 7, the first motor 15 and the screw rod 14 are coaxially connected, a pump liquid conveyor belt drive unit 16 is provided on the outer wall of one side of the cleaning pool 1 and the micro-etching pool 4, a linkage drying component 17 is provided on the top outer wall of the second assembly line 6, and a micro-etching spray component 18 is provided inside the micro-etching pool 4. During the use of the copper surface organic acid type super-roughening agent micro-etching device, the control The first motor 15 is controlled to work and drive the screw 14 to rotate, and the guide block 11 is driven to rise and fall along the guide groove 12 on the inner wall of the lifting frame 7 under the cooperative transmission of the screw 14 and the screw hole 13, thereby driving the mounting frame 8 and the conveyor belt 10 above to rise and fall in the cleaning pool 1 or the micro-etching pool 4, and the first motor 15 is controlled to work, so that the conveyor belt 10 in the cleaning pool 1 and the micro-etching pool 4 rises to the level of the first assembly line 3 and the second assembly line 6, and the PCB board to be micro-etched is conveyed by the first assembly line 3, the conveyor belt 10 and the second assembly line 6 rotating work. The first assembly line 3 conveys the PCB board to be micro-etched to the top of the conveyor belt 10 in the cleaning pool 1, and the first motor 15 is controlled to work so that the conveyor belt 10 and the PCB board above the conveyor belt 10 are raised to the level of the first assembly line 3 and the second assembly line 6. The CB board sinks into the cleaning pool 1, and the conveyor belt 10 rotates to disturb the cleaning liquid in the cleaning pool 1 to clean the PCB board above the conveyor belt 10. After cleaning, the conveyor belt 10 is controlled to be lifted to a horizontal state with the second assembly line 6. The conveyor belt 10 and the second assembly line 6 cooperate to convey the cleaned PCB board to the top of the conveyor belt 10 in the micro-etching pool 4, and then the first motor 15 is controlled to work to make the conveyor belt 10 and the PCB board above sink into the micro-etching pool 4 to perform micro-etching treatment on the copper surface in PCB manufacturing. After the treatment, the conveyor belt 10 is controlled to be lifted to a horizontal state with the second assembly line 6, and then the first assembly line 3, the conveyor belt 10 and the second assembly line 6 are controlled to rotate in opposite directions to automatically unload the PCB board after the micro-etching treatment.

[0023] Furthermore, the pumping liquid conveyor belt driving unit 16 includes a two-way pump 161 respectively fixed on the outer wall of one side of the cleaning pool 1 and the micro-etching pool 4, the suction end of the two-way pump 161 is connected to a suction pipe 162, and one end of the suction pipe 162 runs through the interior of the pool body, the pumping liquid end of the two-way pump 161 is connected to a pumping liquid pipe 163, a mounting groove 164 is provided on the outer wall of one side of the end of the mounting frame 8, a first gear 165 is rotatably installed on the inner wall of one end of the mounting groove 164, the rotating roller 9 and the first gear 165 are coaxially connected, and a second gear 166 is rotatably installed on the inner wall of the other end of the mounting groove 164, a first turbine 167 is installed on the outer wall of one side of the mounting frame 8, the first turbine 167 and the second gear 166 are coaxially connected, one end of the pumping liquid pipe 163 is connected to the outer wall of one side of the first turbine 167, and the outer wall of the other side of the first turbine 167 is connected to a liquid outlet pipe 168. During the rotation and driving process of the above-mentioned conveyor belt 10, by controlling the cleaning pool 1 or the micro-etching The two-way pump 161 above the pool 4 is working. The two-way pump 161 pumps the water in the pool body through the suction pipe 162, and pumps it out through the pump pipe 163 and inputs it into the first turbine 167, and returns to the pool body through the outlet pipe 168 on the side of the first turbine 167. The water will drive the first turbine 167 to rotate during its circulation, thereby driving the second gear 166 to rotate. Under the coordinated transmission of the second gear 166 and the first gear 165, the rotating roller 9 will be driven to rotate. Under the coordinated rotation of the rotating roller 9, the conveyor belt 10 above the mounting frame 8 will be driven to rotate, and the two-way pump 161 can be controlled to rotate in the opposite direction and the conveyor belt 10 can be driven to rotate in the opposite direction. The conveyor belt 10 is rotated to load and unload the PCB board for micro-etching. During the rotation of the conveyor belt 10 in the cleaning pool 1 or the micro-etching pool 4, the cleaning liquid or organic acid type super-roughening agent in the pool is stirred and disturbed, thereby improving the efficiency and effect of degreasing and micro-etching of the copper surface.

[0024] Furthermore, support frames 20 are installed on the bottom outer walls of the first conveying frame 2 and the second conveying frame 5 , and the first conveying frame 2 and the second conveying frame 5 are supported by the support frames 20 .

[0025] Furthermore, a first inclined groove 21 is provided on the bottom inner wall of the second conveying rack 5 located on one side of the cleaning pool 1, and a second inclined groove 22 is provided on the bottom inner wall of the second conveying rack 5 located on one side of the micro-etching pool 4. During the transportation of the above-mentioned cleaned PCB board on the second assembly line 6 on the second conveying rack 5, the cleaning liquid contaminated on the outer wall of the PCB board drips into the first inclined groove 21, and the cleaning liquid flows back to the cleaning pool 1 through the first inclined groove 21; during the unloading of the above-mentioned PCB board after micro-etching through the second assembly line 6, the organic acid type super-roughening agent contaminated on the outer wall of the PCB board drips into the second inclined groove 22, and the organic acid type super-roughening agent flows back to the micro-etching pool 4 through the second inclined groove 22.

[0026] Furthermore, brushes 23 are distributed and fixed on the outer wall of the conveyor belt 10. During the circulation of the conveyor belt 10 in the cleaning tank 1 or the micro-etching tank 4, the brushes 23 above the conveyor belt 10 pass over the outer wall of the PCB board, thereby improving the effect of micro-etching and cleaning treatment of the copper surface of the PCB board.

[0027] In this embodiment, refer to Figure 1 , Figure 3 and Figure 4 The linkage drying assembly 17 includes an air blowing hood 171 arranged on the top outer wall of the second assembly line 6, and the two ends of the air blowing hood 171 are fixed to the tops of the lifting frames 7 on both sides. A first fixing frame 172 is fixed to the middle outer wall of the mounting frame 8 inside the cleaning pool 1, and a second turbine 173 is installed on the top outer wall of the first fixing frame 172. A second motor 174 is installed on the top outer wall of the second turbine 173, and the second motor 174 is coaxially connected to the second turbine 173. The air suction end of the second turbine 173 is connected with an air filter element 175, and the pump air of the second turbine 173 The first end of the second turbine 173 is connected to the pump air pipe 176, and one end of the pump air pipe 176 is connected to the inside of the blowing hood 171. An electric heating rod 177 is installed on the top inner wall of the blowing hood 171. A blowing hood 178 is arranged on the middle inner wall of the first fixed frame 172. Connecting plates 179 are fixed on the outer walls of both sides of the blowing hood 178, and one end of the connecting plate 179 is fixedly connected to the middle inner wall of the first fixed frame 172. The bottom end of the rotating shaft of the second turbine 173 is connected to the transmission shaft 1710, and the transmission shaft 1710 runs through the inner end of the blowing hood 178. The first impeller 171 is fixed on the outer wall of one end. 1. During the transportation process of the copper surface of the PCB board after micro-etching and cleaning above the second assembly line 6, the second motor 174 is controlled to drive the second turbine 173 to rotate, and the external air is sucked through the air filter 175. The sucked air is input into the blowing hood 171 through the pump air pipe 176. During the process, the electric heating rod 177 works to heat the blown air, and the hot air is blown out above the second assembly line 6 through the blowing hood 171, so as to dry the copper surface of the PCB board after cleaning or micro-etching and transported above the second assembly line 6. It is beneficial to the micro-etching of the copper surface by the organic acid type super-roughening agent. During the rotation of the second turbine 173, the first impeller 1711 is driven to rotate synchronously through the transmission shaft 1710. During the sinking of the conveyor belt 10 and the PCB board above into the cleaning tank 1, the first impeller 1711 is placed in the cleaning tank 1. The rotating first impeller 1711 plays a role in stirring the cleaning liquid in the cleaning tank 1 to enhance the cleaning effect. After the conveyor belt 10 is lifted, the first impeller 1711 rotates in the blowing hood 171 to play a role in blowing and drying the copper surface of the PCB board after the cleaning treatment above the conveyor belt 10.

[0028] In this embodiment, refer to Figure 1 , Figure 5 , Figure 8 and Fig. 9 The micro-etching spray assembly 18 includes a liquid pump 181 fixed on the outer wall of one side of the micro-etching pool 4, the liquid suction end of the liquid pump 181 is connected to a suction pipe 182, and the liquid pump end of the liquid pump 181 is connected to a pump delivery pipe 183. A second fixing frame 184 is fixed on the middle outer wall of the mounting frame 8 inside the micro-etching pool 4, and a third turbine 185 is fixed on the top outer wall of the second fixing frame 184. A rotating pipe 186 is rotatably installed on the middle inner wall of the third turbine 185. The rotating pipe 186 passes through the outer wall of one end of the third turbine 185 and is fixed with a second impeller 187. One end of the pump delivery pipe 183 is connected to the outer wall of one side of the third turbine 185, and the outer wall of the other side of the third turbine 185 is connected to a bent pipe 188. The bent pipe 188 is rotatably connected to the end of the rotating pipe 186, and a rotating joint 189 is installed at the rotating connection. A rotating branch pipe 1810 is distributed and connected to the outer wall of the end of the rotating pipe 186. The rotating branch pipe A nozzle 1811 is distributed and installed on the outer wall of the bottom of 1810. When the conveyor belt 10 and the PCB board above sink into the micro-etching pool 4 for micro-etching, the liquid pump 181 is controlled to pump the organic acid type super-roughening agent in the micro-etching pool 4 through the suction pipe 182, and input it into the third turbine 185 through the pump delivery pipe 183, and then input it into the rotating pipe 186 through the bend pipe 188 and the rotary joint 189, and sprayed out through the nozzle 1811 at the bottom of the rotating branch pipe 1810. The liquid will impact the second impeller 187 during the process of passing through the third turbine 185, thereby driving the rotating pipe 186 to rotate, and also driving the rotating branch pipe 1810 to rotate, so that the organic acid type super-roughening agent sprayed by the nozzle 1811 acts on the copper surface evenly and effectively, and the copper surface of the PCB board on the conveyor belt 10 is sprayed with the organic acid type super-roughening agent, thereby improving the effect of the micro-etching treatment of the copper surface with the organic acid type super-roughening agent.

[0029] Furthermore, a filter element 19 is installed through the middle outer wall of the suction pipe 182. When the suction pipe 182 sucks the organic acid type super-roughening agent in the micro-etching pool 4, the filter element 19 filters the impurities in the organic acid type super-roughening agent. Later, the impurities can be cleaned at the filter element 19, thereby filtering and purifying the organic acid type super-roughening agent in the micro-etching pool 4.

[0030] Furthermore, the pumping pipe 183 is a telescopic hose, which facilitates the pumping of liquid in the pumping pipe 183 during the lifting and lowering adjustment of the conveyor belt 10.

[0031] Furthermore, the nozzle 1811 is a rotating nozzle, which improves the spraying effect of the organic acid type super roughening agent.

[0032] Working principle: When the present invention is in use, during the use of the copper surface organic acid type super roughening agent micro-etching device, the first motor 15 is controlled to drive the screw 14 to rotate, and the guide block 11 is driven to rise and fall along the guide groove 12 on the inner wall of the lifting frame 7 under the cooperative transmission of the screw 14 and the screw hole 13, thereby driving the mounting frame 8 and the upper conveyor belt 10 to rise and fall in the cleaning pool 1 or the micro-etching pool 4, and the first motor 15 is controlled to work, so that the conveyor belt 10 in the cleaning pool 1 and the micro-etching pool 4 rises to the level of the first assembly line 3 and the second assembly line 6, and the first assembly line 3, the conveyor belt 10 and the second assembly line 6 rotate to carry out the micro-etching P The first assembly line 3 transports the PCB board to be micro-etched to the top of the conveyor belt 10 in the cleaning tank 1, controls the first motor 15 to work, makes the conveyor belt 10 and the PCB board above sink into the cleaning tank 1, and the conveyor belt 10 rotates to disturb the cleaning liquid in the cleaning tank 1 to clean the PCB board above the conveyor belt 10. After cleaning, the conveyor belt 10 is controlled to be lifted to the horizontal state with the second assembly line 6. The conveyor belt 10 and the second assembly line 6 cooperate to transport the cleaned PCB board to the top of the conveyor belt 10 in the micro-etching tank 4, and then controls the first motor 15 to work, so that the conveyor belt 10 and the PCB board above sink into the micro-etching tank 4. , micro-etching treatment is performed on the copper surface in PCB manufacturing. After the treatment, the conveyor belt 10 is controlled to be lifted to a horizontal state with the second assembly line 6, and then the first assembly line 3, the conveyor belt 10 and the second assembly line 6 are controlled to rotate in the opposite direction to automatically unload the PCB board after the micro-etching treatment; during the rotation and driving process of the conveyor belt 10, the two-way pump 161 above the cleaning pool 1 or the micro-etching pool 4 is controlled to work, and the two-way pump 161 works to pump the water in the pool body through the suction pipe 162, and pumps it out through the pump pipe 163 and inputs it into the first turbine 167, and returns to the pool body through the outlet pipe 168 on one side of the first turbine 167. The water is in the first turbine 167. During the internal circulation process, it will be driven to rotate, thereby driving the second gear 166 to rotate, and the second gear 166 and the first gear 165 will drive the rotating roller 9 to rotate, and the rotating roller 9 will drive the conveyor belt 10 above the mounting frame 8 to rotate under the cooperation of rotation, and the two-way pump 161 will be controlled to rotate in the opposite direction and can drive the conveyor belt 10 to rotate in the opposite direction. The conveyor belt 10 is rotated to carry out loading and unloading of the micro-etching PCB board. During the rotation process in the cleaning tank 1 or the micro-etching tank 4, the conveyor belt 10 plays the role of stirring and disturbing the cleaning liquid or organic acid type super-roughening agent in the tank, thereby improving the efficiency and effect of degreasing cleaning and micro-etching of the copper surface;During the transportation process above the second assembly line 6 after the micro-etching and cleaning of the copper surface of the PCB board, the second motor 174 is controlled to drive the second turbine 173 to rotate, and the external air is sucked through the air filter 175. The sucked air is input into the blowing hood 171 through the pump air pipe 176. During the process, the electric heating rod 177 works to heat the blown air, and the hot air is blown out through the blowing hood 171 above the second assembly line 6, and the copper surface of the PCB board after the cleaning or micro-etching treatment transported above the second assembly line 6 is dried, which is beneficial to the micro-etching of the organic acid type super-roughening agent on the copper surface. During the rotation of the second turbine 173, the first impeller 1711 is driven to rotate synchronously through the transmission shaft 1710. During the sinking of the conveyor belt 10 and the upper PCB board into the cleaning tank 1, the first impeller 1711 is placed in the cleaning tank 1. The rotating first impeller 1711 plays a role in stirring the cleaning liquid in the cleaning tank 1 to enhance the cleaning effect. After the conveyor belt 10 is lifted, The first impeller 1711 rotates in the blowing hood 171, and plays the role of blowing and drying the copper surface of the PCB board after cleaning above the conveyor belt 10; when the conveyor belt 10 and the PCB board above sink into the micro-etching pool 4 for micro-etching, the control liquid pump 181 works to pump the organic acid type super-roughening agent in the micro-etching pool 4 through the suction pipe 182, and inputs it into the third turbine 185 through the pump delivery pipe 183, and then inputs it into the rotating pipe 18 through the elbow 188 and the rotary joint 189. 6, and is sprayed out through the nozzle 1811 at the bottom of the rotating branch pipe 1810. The liquid will impact the second impeller 187 during the process of passing through the third turbine 185, thereby driving the rotating pipe 186 to rotate, and also driving the rotating branch pipe 1810 to rotate, so that the organic acid type super-roughening agent sprayed by the nozzle 1811 acts evenly and effectively on the copper surface, and the copper surface of the PCB board on the conveyor belt 10 is sprayed with the organic acid type super-roughening agent, which improves the effect of the micro-etching treatment of the copper surface with the organic acid type super-roughening agent. ;

[0033] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. Copper surface organic acid type super roughening agent micro-etching device, characterized by: The invention comprises a cleaning pool (1), a first conveying frame (2) being fixed on an outer wall of one side of the top of the cleaning pool (1), and a first assembly line (3) being installed on the inner wall of the top of the first conveying frame (2), a micro-etching pool (4) being arranged on an outer wall of one side of the cleaning pool (1), a second conveying frame (5) being fixed on the outer wall of the top between the cleaning pool (1) and the micro-etching pool (4), and a second assembly line (6) being installed on the inner wall of the top of the second conveying frame (5), lifting frames (7) being symmetrically mounted and fixed on the inner walls of both sides of the bottom of the cleaning pool (1) and the micro-etching pool (4), mounting frames (8) being arranged inside the cleaning pool (1) and the micro-etching pool (4), rotating rollers (9) being rotatably installed on the inner walls of both ends of the mounting frame (8), and a conveyor belt (10) being sleeved between the rotating rollers (9), and the outer walls of both ends of the mounting frame (8) being rotatably mounted on the inner walls of both ends of the mounting frame (8). A guide block (11) is fixed on the top, guide grooves (12) are provided on the inner walls on both sides of the lifting frame (7), and one end of the guide block (11) is inserted into the inside of the guide groove (12), a screw hole (13) is provided on the top outer wall of the guide block (11), a screw rod (14) is screwed into the inside of the screw hole (13), and the two ends of the screw rod (14) are rotatably connected to the inner walls of the two ends of the guide groove (12), a first motor (15) is embedded and fixed on the outer wall of one side of the top of the lifting frame (7), and the first motor (15) and the screw rod (14) are coaxially connected, a pump liquid conveyor belt drive unit (16) is provided on the outer wall of one side of the cleaning pool (1) and the micro-etching pool (4), a linkage drying assembly (17) is provided on the top outer wall of the second assembly line (6), and a micro-etching spray assembly (18) is provided inside the micro-etching pool (4).

2. The copper surface organic acid type super roughening agent micro-etching device according to claim 1, characterized in that: The pumping liquid conveyor belt drive unit (16) comprises a bidirectional pump (161) respectively fixed on the outer wall of one side of the cleaning pool (1) and the micro-etching pool (4); the liquid suction end of the bidirectional pump (161) is connected to a liquid suction pipe (162), and one end of the liquid suction pipe (162) passes through the interior of the pool body; the pumping liquid end of the bidirectional pump (161) is connected to a pumping liquid pipe (163); a mounting groove (164) is provided on the outer wall of one side of the end of the mounting frame (8); a first gear is rotatably mounted on the inner wall of one end of the mounting groove (164) (165), the rotating roller (9) and the first gear (165) are coaxially connected, a second gear (166) is rotatably mounted on the inner wall of the other end of the mounting groove (164), a first turbine (167) is mounted on the outer wall of one side of the mounting frame (8), the first turbine (167) and the second gear (166) are coaxially connected, one end of the pump liquid pipe (163) is connected to the outer wall of one side of the first turbine (167), and a liquid outlet pipe (168) is connected to the outer wall of the other side of the first turbine (167).

3. The copper surface organic acid type super roughening agent micro-etching device according to claim 1, characterized in that: The linkage drying component (17) comprises an air blowing hood (171) arranged on the top outer wall of the second assembly line (6), and the two ends of the air blowing hood (171) are fixed to the tops of the lifting frames (7) on both sides. A first fixing frame (172) is fixed to the middle outer wall of the mounting frame (8) inside the cleaning pool (1), a second turbine (173) is installed on the top outer wall of the first fixing frame (172), a second motor (174) is installed on the top outer wall of the second turbine (173), and the second motor (174) and the second turbine (173) are coaxially connected. The air intake end of the second turbine (173) is connected to an air filter element (175), and the second turbine (173) is provided with a second motor (174) and a second motor (174 ... The pump air end is connected to a pump air pipe (176), and one end of the pump air pipe (176) is connected to the inside of a blowing hood (171). An electric heating rod (177) is installed on the top inner wall of the blowing hood (171). A blowing hood (178) is arranged on the middle inner wall of the first fixed frame (172). Connecting plates (179) are fixed to the outer walls on both sides of the blowing hood (178), and one end of the connecting plate (179) is fixedly connected to the middle inner wall of the first fixed frame (172). The bottom end of the rotating shaft of the second turbine (173) is connected to a transmission shaft (1710), and the transmission shaft (1710) passes through the inner side of the blowing hood (178) and a first impeller (1711) is fixed to the outer wall at one end thereof.

4. The copper surface organic acid type super roughening agent micro-etching device according to claim 1, characterized in that: The micro-etching spray assembly (18) comprises a liquid pump (181) fixed on an outer wall of one side of the micro-etching pool (4); a liquid suction end of the liquid pump (181) is connected to a suction pipe (182); a pump liquid end of the liquid pump (181) is connected to a pump delivery pipe (183); a second fixing frame (184) is fixed on the middle outer wall of the mounting frame (8) inside the micro-etching pool (4); a third turbine (185) is fixed on the top outer wall of the second fixing frame (184); a rotating pipe (186) is rotatably mounted on the middle inner wall of the third turbine (185); the rotating pipe (186) penetrates the third turbine. A second impeller (187) is fixedly mounted on the outer wall of one end of the inner wheel (185); one end of the pump delivery pipe (183) is connected to the outer wall of one side of the third turbine (185); a bent pipe (188) is connected to the outer wall of the other side of the third turbine (185); the bent pipe (188) is connected to the end of the rotating pipe (186) in a rotatable manner, and a rotating joint (189) is installed at the rotatable connection; a rotating branch pipe (1810) is connected to the outer wall of the end of the rotating pipe (186); and a nozzle (1811) is installed on the outer wall of the bottom of the rotating branch pipe (1810).

5. The copper surface organic acid type super roughening agent micro-etching device according to claim 4, characterized in that: A filter element (19) is installed through the outer wall of the middle portion of the suction pipe (182).

6. The copper surface organic acid type super roughening agent micro-etching device according to claim 1, characterized in that: Support frames (20) are installed on the bottom outer walls of the first conveying frame (2) and the second conveying frame (5).

7. The copper surface organic acid type super roughening agent micro-etching device according to claim 1, characterized in that: A first inclined groove (21) is provided on the inner wall of the bottom of the second conveying frame (5) located on one side of the cleaning pool (1), and a second inclined groove (22) is provided on the inner wall of the bottom of the second conveying frame (5) located on one side of the micro-etching pool (4).

8. The copper surface organic acid type super roughening agent micro-etching device according to claim 4, characterized in that: The pump delivery pipe (183) is a telescopic hose.

9. The copper surface organic acid type super roughening agent micro-etching device according to claim 1, characterized in that: Brushes (23) are distributed and fixed on the outer wall of the conveyor belt (10).

10. The copper surface organic acid type super roughening agent micro-etching device according to claim 4, characterized in that: The nozzle (1811) is a rotating nozzle.

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