Ejector rod type temperature testing device and testing method
By designing a rod-type temperature testing device, the combination of heating mechanism and rod-type mechanism is used to solve the problem of damage to the heat-proof small plates when fixing the thermocouple with high-temperature glue, and high-precision and damage-free temperature testing is achieved.
Patent Information
- Application Number
- CN202411852301.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-04-18
AI Technical Summary
In the thermal shock test of heat-proof small plate floor, when using high-temperature glue to fix the thermocouple, it will affect the temperature distribution, lead to data deviation, and cause damage to the surface of the heat-proof small plate during removal.
A top rod temperature testing device is designed, including a heating mechanism and a top rod mechanism. The heating mechanism consists of a heater and a heat reflector plate, which reduces the heat loss of the heater. The pinch mechanism consists of a shaft sleeve, pinch rod, connecting ring and pinch tightening assembly. The thermocouple is fixed to the end of the pinch tightening assembly to ensure close contact between the thermocouple and the heat-proof plate through the pinch tightening assembly.
The device can fix the thermocouple on the surface of the heat-proof plate without damage, improving the accuracy and efficiency of temperature testing, ensuring that accurate temperature data can still be obtained under extreme thermal shock conditions.
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Figure CN119845435A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of temperature testing devices, and in particular to a top rod type temperature testing device and a testing method. Background Art
[0002] The new generation of aircraft has the characteristics of ultra-long range, ultra-high speed, and high maneuverability. Therefore, the loads they bear during flight are more severe, and the requirements for heat protection materials are becoming higher and higher. For this reason, a series of material-level (heat protection board) ground thermal shock tests are required during the research stage of heat protection materials. Usually, when conducting ground tests on heat protection boards, thermocouples are pasted on the heat protection boards for temperature testing. Thermocouples usually need to be fixed with high-temperature glue, which will affect the temperature near the pasting area to a certain extent. When removing them after the test, the surface of the heat protection board will be damaged. Summary of the invention
[0003] In view of this, the purpose of the present application is to propose a top rod type temperature testing device and testing method to solve the technical problem that the heat protection plate will be damaged when the thermocouple is fixed on the heat protection plate with glue.
[0004] Based on the above purpose, the present application provides a top rod type temperature testing device, comprising:
[0005] The heating mechanism is located opposite to the heat protection plate and includes a heater and a heat reflection plate;
[0006] The push rod mechanism includes a sleeve, a push rod, a connecting ring and a tightening assembly. The sleeve passes through the heat reflecting plate and is connected to the sleeve. The push rod passes through the sleeve along the length direction of the sleeve. The connecting ring is located between the push rod and the sleeve. The connecting ring is slidably connected to the sleeve and is clamped with the push rod. A thermocouple is provided at the end of the push rod, and the thermocouple abuts against a small heat-proof plate. The tightening assembly is connected to the sleeve to tighten the connecting ring so that the thermocouple at the end of the push rod presses against the small heat-proof plate.
[0007] Optionally, the tightening assembly includes:
[0008] A top shaft, at least a portion of which is located in the shaft sleeve and connected to the shaft sleeve;
[0009] A gasket, located in the shaft sleeve and abutting against the top shaft;
[0010] a spring connected between the gasket and the connecting ring;
[0011] The ejector rod passes through the ejector shaft, the gasket and the spring in sequence.
[0012] Optionally, the top rod is hollow, the thermocouple is installed in the hollow portion of the top rod, and part of the thermocouple protrudes from the top rod.
[0013] Optionally, the connecting ring includes an elastic rubber ring and a guide ring, the elastic rubber ring is sleeved on the push rod, the guide ring is sleeved on the elastic rubber ring, and is slidably connected to the shaft sleeve.
[0014] Optionally, a limiting groove is provided on the inner wall of the sleeve in the length direction, and a sliding block is protrudingly provided on the outer wall of the guide ring, and the sliding block slides in the limiting groove.
[0015] Optionally, the end of the shaft sleeve close to the heat-proof plate is closed, and a limiting hole is provided at the center of the end, and the push rod passes through the limiting hole along the central axis of the elastic rubber ring.
[0016] Optionally, the heater is a quartz lamp, and the quartz lamps are arranged in plurality and evenly laid on the surface of the heat reflecting plate.
[0017] Optionally, a pair of guide bars are provided on one side of the heat reflecting plate close to the heat protection plate, and the guide bars are respectively provided on both sides of the heat reflecting plate. The guide bars are provided with a plurality of slots for installing the end of the quartz lamp.
[0018] Optionally, a threading hole is provided at one end of the push rod close to the heat protection plate, and the threading hole is connected to the inside of the push rod.
[0019] Based on the same inventive concept, the present disclosure also provides a testing method, which is applied to the above-mentioned testing device, comprising:
[0020] Turn on the heater, and the heat reflector reflects the heat emitted by the heater to the heat protection plate;
[0021] Thermocouples are used to test the surface temperature of the heat shield.
[0022] As can be seen from the above, the temperature testing device provided by the present application includes a heating mechanism and a push rod mechanism. The heating mechanism includes a heater and a heat reflecting plate. The heater heats the heat protection plate. The heat reflecting plate reduces the heat loss of the heater and is used to install the push rod mechanism at the same time. The push rod mechanism includes a sleeve, a push rod, a connecting ring and a tightening assembly. The sleeve is used to install the push rod, the connecting ring and the tightening assembly. The connecting ring is used to drive the push rod to move toward or away from the heat protection plate. The thermocouple is arranged at one end of the push rod close to the heat protection plate and abuts against the heat protection plate to monitor the temperature of the surface of the heat protection plate. The tightening assembly tightens the connecting ring so that the thermocouple at the end of the push rod presses against the heat protection plate, increases the connectivity between the thermocouple and the heat protection plate, thereby improving the test accuracy of the heat protection plate. The temperature testing device in the present application fixes the thermocouple on the surface of the heat protection plate without damaging the heat protection plate. At the same time, the temperature measurement is accurate and efficient. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0024] Figure 1 This is a schematic diagram of the structure of an embodiment of the present application;
[0025] Figure 2 This is a schematic diagram showing the structure of the shaft sleeve in an embodiment of the present application;
[0026] Figure 3 This is a schematic diagram showing the structure of the tightening assembly according to an embodiment of the present application;
[0027] Figure 4 A cross-sectional view showing a tightening assembly according to an embodiment of the present application;
[0028] Figure 5 A flow chart of the test method for this application;
[0029] Figure 6 This is a schematic diagram of the hardware structure of the electronic device in this application.
[0030] Attached figures: 01, heat protection plate; 1, heating mechanism; 11, heater; 12, heat reflecting plate; 2, push rod mechanism; 21, bushing; 211, limiting hole; 22, push rod; 23, connecting ring; 231, elastic rubber ring; 232, guide ring; 2321, slider; 2322, limiting groove; 24, tightening assembly; 241, push shaft; 242, gasket; 243, spring; 3, guide strip; 31, slot. DETAILED DESCRIPTION
[0031] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.
[0032] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0033] Based on the background, given the significant improvement in ultra-long-range, ultra-high-speed and high-maneuverability of the new generation of aircraft, the load environment they face during flight is becoming increasingly harsh, which poses unprecedented challenges to heat-resistant materials. Ideal heat-resistant materials must have excellent high-temperature tolerance, lightweight design, excellent environmental adaptability and multi-functional integration capabilities. In order to meet these stringent requirements, an indispensable part of the material research and development stage is to conduct in-depth material-level (heat-resistant small board) ground thermal shock tests to comprehensively evaluate the comprehensive performance of the material.
[0034] In current ground tests of heat shields, thermocouples are usually pasted on the heat shields to monitor temperature changes and provide key evidence for data analysis and material performance evaluation. However, this method of fixing thermocouples with high-temperature glue has obvious defects: the glue not only affects the temperature distribution in the area near the thermocouples, causing data deviation, but also inevitably causes slight damage to the surface of the heat shield when the glue is removed after the test. When the same heat shield needs to be tested under multiple different conditions, this accumulation of damage will seriously limit its reusability.
[0035] Faced with this problem, although the field of ground thermal shock testing has explored non-contact temperature measurement technologies as alternatives, such as digital image correlation (DIC) technology and infrared spot thermometers, these methods also have limitations. DIC technology is limited by the spatial layout and high cost of test equipment, and it is difficult to popularize and apply it in all test scenarios. Although infrared spot thermometers can provide temperature monitoring functions in some cases, their optical path is easily disturbed by strong light when passing through the lamp tube, resulting in a significant decrease in temperature measurement accuracy and unable to meet the needs of high-precision tests.
[0036] In order to solve the above problems, the present application provides a top rod type temperature testing device, which can effectively and non-destructively fix the thermocouple on the surface of the heat protection plate, while ensuring that accurate and reliable temperature data can still be obtained under extreme thermal shock conditions.
[0037] The following is combined with Figure 1-5 The embodiments of the present application will be described in detail.
[0038] like Figure 1 , Figure 2 and Figure 3 As shown, the present application provides a top rod type temperature testing device, comprising:
[0039] The heating mechanism 1 is located opposite to the heat protection plate 01 and includes a heater 11 and a heat reflection plate 12;
[0040] The push rod mechanism 2 includes a sleeve 21, a push rod 22, a connecting ring 23 and a tightening assembly 24. The sleeve 21 passes through the heat reflecting plate 12 and is connected thereto. The push rod 22 passes through the sleeve 21 along the length direction of the sleeve 21. The connecting ring 23 is located between the push rod 22 and the sleeve 21. The connecting ring 23 is slidably connected to the sleeve 21 and is clamped with the push rod 22. A thermocouple is provided at the end of the push rod 22, and the thermocouple abuts against the heat protection plate 01. The tightening assembly 24 is connected to the sleeve 21 to tighten the connecting ring 23 so that the thermocouple at the end of the push rod 22 presses against the heat protection plate 01.
[0041] Specifically, the heat protection board 01 is installed on the heat insulation board, the heat insulation board is provided with a mounting groove, the heat protection board 01 is arranged in the mounting groove, and the heat insulation board and the heat protection board 01 are both opposite to the heating mechanism 1. The heat insulation board can be a rock wool board or an organic material heat insulation board. No matter what material is selected for the heat insulation board, it is necessary to avoid heat transfer between the heat insulation board and the heat protection board 01 as much as possible to ensure that the heat of the heat protection board 01 is uniform, thereby ensuring the accuracy of the experimental data.
[0042] In addition, the push rod mechanism 2 includes a shaft sleeve 21, which is a hollow cylindrical shape. The shaft sleeve 21 penetrates the heat reflecting plate 12 along the direction of the heat protection plate 01, and the outer surface of the shaft sleeve 21 is provided with a thread, and the shaft sleeve 21 is threadedly connected with the heat reflecting plate 12, thereby enhancing the stability of the push rod mechanism 2. The heat reflecting plate 12 can be selected from an aluminum plate or a stainless steel plate. The heat reflecting plate 12 of this material has a certain strength, so that the push rod mechanism 2 can be installed thereon, and has a certain heat reflection effect, reducing the heat loss of the heater 11. The push rod mechanism 2 also includes a push rod 22, a connecting ring 23 and a tightening assembly 24. The connecting ring 23 is clamped with the push rod 22 and is slidably connected in the shaft sleeve 21, thereby driving the push rod 22 to move toward or away from the heat protection plate 01. The thermocouple is arranged at one end of the push rod 22 close to the heat protection plate 01 and abuts against the heat protection plate 01 to test the temperature of the surface of the heat protection plate 01. The tightening assembly 24 tightens the connecting ring 23 to make the thermocouple at the end of the push rod 22 press against the heat protection plate 01, thereby increasing the connectivity between the thermocouple and the heat protection plate 01 and improving the test accuracy.
[0043] In summary, the temperature testing device in the present application includes a heating mechanism 1 and a push rod mechanism 2, the heating mechanism 1 includes a heater 11 and a heat reflecting plate 12, the heater 11 heats the heat protection plate 01, the heat reflecting plate 12 reduces the heat loss of the heater 11, and is used to install the push rod mechanism 2; the push rod mechanism 2 includes a sleeve 21, a push rod 22, a connecting ring 23 and a tightening assembly 24, the sleeve 21 is used to install the push rod 22, the connecting ring 23 and the tightening assembly 24, the connecting ring 23 is used to drive the push rod 22 to approach or move away from the heat protection plate 0 1, the thermocouple is arranged at one end of the push rod 22 close to the heat protection plate 01 and abuts against the heat protection plate 01 to monitor the temperature of the surface of the heat protection plate 01, and the tightening component 24 tightens the connecting ring 23 to make the thermocouple at the end of the push rod 22 press against the heat protection plate 01, thereby increasing the connectivity between the thermocouple and the heat protection plate 01, thereby improving the test accuracy of the heat protection plate 01. The temperature testing device in the present application fixes the thermocouple on the surface of the heat protection plate 01 without damaging the heat protection plate 01, and at the same time, the temperature measurement is accurate and efficient.
[0044] like Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, the tightening assembly 24 includes:
[0045] A top shaft 241, at least a portion of which is located in the shaft sleeve 21 and connected to the shaft sleeve 21;
[0046] A gasket 242 is located in the shaft sleeve 21 and abuts against the top shaft 241;
[0047] A spring 243 connected between the gasket 242 and the connecting ring 23;
[0048] The push rod 22 passes through the push shaft 241 , the washer 242 , and the spring 243 in sequence.
[0049] Specifically, the top shaft 241 is arranged at one end of the sleeve 21 away from the heat-proof small plate 01. The top shaft 241 is threadedly connected to the sleeve 21 to improve the stability of the connection. One end of the top shaft 241 is protruding relative to the sleeve 21, and the end of the top shaft 241 is provided with an anti-skid cut surface. The anti-skid cut surface is a plane. The plane anti-skid cut surface facilitates the operation of tools or hands to more easily apply rotational force to the top shaft 241, reduces the difficulty of tightening the top shaft 241, and improves the efficiency of tightening the top shaft 241. The gasket 242 is located in the sleeve 21 and is slidably connected to the sleeve 21. The spring 243 is connected between the gasket 242 and the connecting ring 23. The top shaft 241 pushes the gasket 242 forward (toward the direction close to the heat-proof small plate 01), and the spring 243 is compressed. The spring 243 pushes the connecting ring 23 forward so that the top rod 22 presses the heat-proof small plate 01. The push rod 22 passes through the center of the gasket 242 and the center of the connecting ring 23 along the central axis of the push shaft 241 to prevent the push rod 22 from tilting, thereby avoiding affecting the experiment.
[0050] In this embodiment, the gasket 242 slides in the sleeve 21 and abuts against the top shaft 241, and the spring 243 is connected between the gasket 242 and the connecting ring 23. When the top shaft 241 is pushed forward (i.e., in the direction close to the heat protection plate 01), the top shaft 241 compresses the spring 243 through the gasket 242, and then transmits the thrust to the connecting ring 23 and the top rod 22, thereby finally tightening the heat protection plate 01. The tightening component 24 can provide a stable and adjustable tightening force, ensuring that the heat protection plate 01 will not move or loosen during the experiment or equipment operation, thereby improving the reliability and safety of the experiment.
[0051] like Figure 4 As shown, in some embodiments, the top rod 22 is hollow, the thermocouple is installed in the hollow portion of the top rod 22 , and part of the thermocouple protrudes from the top rod 22 .
[0052] In addition, a threading hole is provided at one end of the push rod 22 close to the heat-proof small plate 01 , and the threading hole is connected to the inside of the push rod 22 .
[0053] Specifically, the top rod 22 can be a ceramic rod or a steel rod. Both the ceramic rod and the steel rod have strong high temperature resistance and can maintain stable performance during the high temperature resistance experiment of the heat protection board 01 to ensure the normal progress of the experiment. The top rod 22 is hollow, which is convenient for installing thermocouples. One part of the thermocouple is stuck in the hollow part of the top rod 22, and the other part of the thermocouple protrudes from the top rod 22 and abuts against the heat protection board 01 to test the temperature of the heat protection board 01. Two rows of threading holes are provided on the side of the top rod 22 close to the heat protection board 01 for routing the thermocouples.
[0054] In this embodiment, the thermocouple is connected to the hollow part of the top rod 22, which facilitates the installation and removal of the thermocouple and improves the operating efficiency of the experiment. The setting of the threading hole makes the routing of the thermocouple neater and more orderly, avoiding the potential risks caused by line confusion.
[0055] like Figure 4 As shown, in some embodiments, the sleeve 21 is closed near the end of the heat protection plate 01, and a limiting hole 211 is provided at the center of the end, and the push rod 22 passes through the limiting hole 211 along the central axis of the elastic rubber ring 231.
[0056] Specifically, the push rod 22 passes through the center of the gasket 242, the center of the connecting ring 23 and the limiting hole 211 along the center axis of the top shaft 241 in sequence, so that the push rod 22 coincides with the center axis of the sleeve 21, thereby preventing the temperature measuring head of the thermocouple from being unable to fit tightly against the heat protection plate 01 due to the offset of the push rod 22, thereby affecting the progress of the experiment.
[0057] Exemplarily, the outer diameter of the push rod 22 is 3 mm, the diameter of the threading hole is 0.3 mm, and the diameter of the limiting hole 211 is 3.1 mm, so that the push rod 22 can easily pass through the limiting hole 211 while limiting and guiding the push rod 22.
[0058] In this embodiment, the top rod 22 passes through the center of the gasket 242, the center of the connecting ring 23 and the limiting hole 211 along the central axis of the top shaft 241, ensuring that it can move in the direction perpendicular to the heat protection plate 01, thereby avoiding the temperature measuring head of the thermocouple from being unable to fit tightly against the heat protection plate 01 due to the offset of the top rod 22, thereby affecting the progress of the experiment.
[0059] like Figure 3 and Figure 4 As shown, in some embodiments, the connecting ring 23 includes an elastic rubber ring 231 and a guide ring 232 , the elastic rubber ring 231 is sleeved on the push rod 22 , the guide ring 232 is sleeved on the elastic rubber ring 231 , and is slidably connected to the shaft sleeve 21 .
[0060] Specifically, the elastic rubber ring 231 has good elasticity and can be tightly sleeved on the top rod 22, so that the top rod 22 can move with the forward movement of the elastic rubber ring 231, and when the top rod 22 is pressed against the heat-proof small plate 01, the elastic rubber ring 231 can fix the top rod 22 to prevent the top rod 22 from moving backward and affecting the experiment. The guide ring 232 is usually made of a metal material with high hardness and good wear resistance. The guide ring 232 is sleeved on the outside of the elastic rubber ring 231 and forms a sliding connection with the shaft sleeve 21 to ensure that the top rod 22 can stably move to the specified position.
[0061] In this embodiment, the elastic rubber ring 231 can be tightly sleeved on the push rod 22 to maintain the stability of the push rod 22. The guide ring 232 is sleeved on the outside of the elastic rubber ring 231 and forms a sliding connection with the shaft sleeve 21 to ensure that the push rod 22 can stably move to the specified position.
[0062] like Figure 4 As shown, in some embodiments, a limiting groove 2322 is provided in the length direction of the inner wall of the sleeve 21 , and a sliding block 2321 is protruded on the outer wall of the guide ring 232 , and the sliding block 2321 slides in the limiting groove 2322 .
[0063] In this embodiment, the limit groove 2322 is arranged in the length direction of the inner wall of the sleeve 21, providing a clear sliding path for the slider 2321, so that the guide ring 232 can only move forward or backward, thereby preventing the guide ring 232 from rotating in the sleeve 21 and causing the position to deflect, affecting the push rod 22 to tighten the heat-proof plate 01.
[0064] like Figure 1 As shown, in some embodiments, the heater 11 is a quartz lamp, and the quartz lamps are arranged in plurality and evenly laid on the surface of the heat reflecting plate 12 .
[0065] Specifically, the quartz lamps are arranged and evenly laid on the surface of the heat reflecting plate 12 to ensure uniform heating of the heating area. The quartz lamps are temperature controlled by an intelligent temperature control system. The intelligent control system calculates the required heating power or heating time according to the preset temperature setting value through a control algorithm, and adjusts the power output of the quartz lamp to achieve precise temperature control. The intelligent control system also includes safety devices such as overheating protection and short circuit protection to ensure that the power supply can be cut off in time under abnormal circumstances to prevent damage to the device or safety accidents such as fire.
[0066] In this embodiment, the quartz lamp generates heat by exciting the filament through electric current. The heat is radiated in the form of infrared rays and is used to heat the heat protection plate 01. The quartz lamp can heat quickly and is easy to control the system, so as to facilitate precise control of the heating conditions. The quartz lamps are arranged and evenly laid on the surface of the heat reflecting plate 12 to ensure uniform heat in the heating area to improve the accuracy of the experiment.
[0067] In some embodiments, a pair of guide bars 3 are provided on one side of the heat reflecting plate 12 close to the heat protection plate 01. The guide bars 3 are respectively provided on both sides of the heat reflecting plate 12. The guide bars 3 are provided with multiple slots 31 for installing the end of the quartz lamp.
[0068] Specifically, the guide bar 3 is made of high temperature resistant material to adapt to high temperature environment and prolong its service life. The slots 31 on the two guide bars 3 are opposite to each other, which is convenient for installing the quartz lamp. The two ends of the quartz lamp are flat, and the slots 31 clamp the two ends of the quartz lamp to increase the stability of the quartz lamp.
[0069] In this embodiment, the slot 31 on the guide bar 3 is clamped to the end of the quartz lamp, which enhances the stability of the quartz lamp and prevents the quartz lamp from falling off or shifting due to vibration or external force during the heating process, thereby ensuring the continuity and stability of the heating process.
[0070] Based on the same inventive concept, corresponding to any of the above embodiments and methods, Figure 5 As shown, the present application also provides a testing method, comprising the following steps:
[0071] S101: Assemble the temperature test device and debug the device before the experiment, turn on the heater 11, and the heat reflection plate 12 reflects the heat emitted by the heater 11 to the heat protection plate 01.
[0072] Specifically, the assembly temperature test device includes:
[0073] Assemble the push rod mechanism 2: install the thermocouple at the end of the push rod 22, sleeve the connecting ring 23 on the push rod 22, the push rod 22 passes through the shaft sleeve 21 and the connecting ring 23 is located in the shaft sleeve 21, and the tightening assembly 24 is installed in the shaft sleeve 21;
[0074] Assemble the heating mechanism 1: install the heater 11 on the heat reflection plate 12 and align it with the heat protection plate 01;
[0075] Fix the push rod mechanism 2: pass the shaft sleeve 21 through the heat reflecting plate 12 and threadedly connect it to the heat reflecting plate 12, adjust the tightening assembly 24, and tighten the connecting ring 23 until the thermocouple at the end of the push rod 22 presses against the heat protection plate 01.
[0076] The device debugging before the experiment includes:
[0077] A material plate with the same thermal conductivity as the heat shield plate 01 is used to replace the heat shield plate 01 for temperature testing to verify the effectiveness of the ejector mechanism 2 and determine the heating coefficient of the heater 11, wherein the heating coefficient is the ratio of the preset temperature of the heater 11 to the actual temperature;
[0078] Debug the temperature of heater 11, check the error of heating coefficient, and determine the final heating coefficient.
[0079] Turning on the heater 11 includes:
[0080] According to the experimental requirements and the heating coefficient, the temperature of the heater 11 is set;
[0081] The heater 11 is preheated so that the temperature of the heater 11 reaches a stable state.
[0082] During the actual experiment, the heater 11 can be temperature controlled by an intelligent temperature control system (refer to the electronic equipment below for specific components). The intelligent control system calculates the heating power or heating time required by the heater 11 through a control algorithm based on the preset temperature setting value and heating coefficient, and adjusts the power output of the heater 11 to achieve precise temperature control. The intelligent control system also includes safety devices such as overheating protection and short circuit protection to ensure that the power supply can be cut off in time under abnormal circumstances to prevent damage to the device or safety accidents such as fire.
[0083] S102: The surface temperature of the heat protection board 01 is tested by a thermocouple.
[0084] Specifically, before the test, the thermocouple is calibrated to ensure the accuracy of the test results; while the thermocouple is detecting the temperature of the heat protection board 01, a data acquisition system is used to record the temperature data of the thermocouple test in real time, and the data is processed and analyzed to calculate the average temperature, temperature gradient and other parameters to comprehensively evaluate the heat resistance of the heat protection board 01.
[0085] The testing method in the present application has high testing efficiency, high testing accuracy, and a wide testing temperature range, thereby improving the flexibility of the temperature testing of the heat protection board 01.
[0086] Based on the same inventive concept, corresponding to any of the above-mentioned embodiments and methods, the present application also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the test method described in any of the above embodiments is implemented.
[0087] Figure 6 A more specific schematic diagram of the hardware structure of an electronic device provided in this embodiment is shown, and the device may include: a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040 are connected to each other through the bus 1050 in the device.
[0088] The processor 1010 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.
[0089] The memory 1020 may be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 may store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program codes are stored in the memory 1020 and are called and executed by the processor 1010.
[0090] The input / output interface 1030 is used to connect the input / output module to realize information input and output. The input / output module can be configured in the device as a component (not shown in the figure), or it can be externally connected to the device to provide corresponding functions. The input device may include a keyboard, a mouse, a touch screen, a microphone, various sensors, etc., and the output device may include a display, a speaker, a vibrator, an indicator light, etc.
[0091] The communication interface 1040 is used to connect a communication module (not shown) to realize communication interaction between the device and other devices. The communication module can realize communication through a wired mode (such as USB, network cable, etc.) or a wireless mode (such as mobile network, WIFI, Bluetooth, etc.).
[0092] The bus 1050 includes a path that transmits information between the various components of the device (eg, the processor 1010, the memory 1020, the input / output interface 1030, and the communication interface 1040).
[0093] It should be noted that, although the above device only shows the processor 1010, the memory 1020, the input / output interface 1030, the communication interface 1040 and the bus 1050, in the specific implementation process, the device may also include other components necessary for normal operation. In addition, it can be understood by those skilled in the art that the above device may also only include the components necessary for implementing the embodiments of the present specification, and does not necessarily include all the components shown in the figure.
[0094] The electronic device of the above embodiment is used to implement the corresponding test method in any of the above embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be described in detail here.
[0095] Based on the same inventive concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores computer instructions, and the computer instructions are used to enable the computer to execute the test method described in any of the above embodiments.
[0096] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device.
[0097] The computer instructions stored in the storage medium of the above embodiments are used to enable the computer to execute the test method described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.
[0098] Based on the same concept, corresponding to any of the above-mentioned embodiment methods, the present application also provides a computer program product, including computer program instructions. When the computer program instructions are run on a computer, the computer executes the test method described in any of the above embodiments, which has the beneficial effects of the corresponding method embodiments and will not be repeated here.
[0099] A person skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.
[0100] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.
[0101] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.
[0102] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the protection scope of the present application.
Claims
1. A top rod temperature testing device, characterized in that: include: The heating mechanism (1) is located opposite to the heat protection plate (01), and comprises a heater (11) and a heat reflection plate (12); The push rod mechanism (2) comprises a shaft sleeve (21), a push rod (22), a connecting ring (23) and a tightening assembly (24); the shaft sleeve (21) passes through the heat reflecting plate (12) and is connected thereto; the push rod (22) passes through the shaft sleeve (21) along the length direction of the shaft sleeve (21); the connecting ring (23) is located between the push rod (22) and the shaft sleeve (21); the connecting ring (23) is slidably connected to the shaft sleeve (21) and is clamped to the push rod (22); a thermocouple is provided at the end of the push rod (22), and the thermocouple abuts against a heat protection plate (01); the tightening assembly (24) is connected to the shaft sleeve (21) and is used to tighten the connecting ring (23) so that the thermocouple at the end of the push rod (22) presses against the heat protection plate (01).
2. A top rod type temperature testing device according to claim 1, characterized in that: The tightening assembly (24) comprises: A top shaft (241), at least a portion of the top shaft (241) is located in the shaft sleeve (21) and is connected to the shaft sleeve (21); A gasket (242) is located in the shaft sleeve (21) and abuts against the top shaft (241); A spring (243) connected between the gasket (242) and the connecting ring (23); The push rod (22) passes through the push shaft (241), the gasket (242) and the spring (243) in sequence.
3. A top rod type temperature testing device according to claim 1, characterized in that: The top rod (22) is hollow, the thermocouple is installed in the hollow portion of the top rod (22), and a portion of the thermocouple protrudes from the top rod (22).
4. A top rod type temperature testing device according to claim 1, characterized in that: The connecting ring (23) comprises an elastic rubber ring (231) and a guide ring (232); the elastic rubber ring (231) is sleeved on the push rod (22); the guide ring (232) is sleeved on the elastic rubber ring (231) and is slidably connected to the shaft sleeve (21).
5. A top rod type temperature testing device according to claim 4, characterized in that: A limiting groove (2322) is provided on the inner wall of the shaft sleeve (21) in the length direction, and a sliding block (2321) is convexly provided on the outer wall of the guide ring (232), and the sliding block (2321) slides in the limiting groove (2322).
6. A top rod type temperature testing device according to claim 4, characterized in that: The end of the shaft sleeve (21) close to the heat-proof small plate (01) is closed, and a limiting hole (211) is provided at the center of the end, and the push rod (22) passes through the limiting hole (211) along the central axis of the elastic rubber ring (231).
7. A top rod type temperature testing device according to claim 1, characterized in that: The heater (11) is a quartz lamp, and a plurality of the quartz lamps are arranged and evenly laid on the surface of the heat reflection plate (12).
8. A top rod type temperature testing device according to claim 7, characterized in that: A pair of guide bars (3) are provided on one side of the heat reflection plate (12) close to the heat protection plate (01), and the guide bars (3) are respectively provided on two sides of the heat reflection plate (12). The guide bars (3) are provided with a plurality of slots (31) for mounting the ends of the quartz lamps.
9. A top rod type temperature testing device according to claim 3, characterized in that: A threading hole is provided at one end of the push rod (22) close to the heat-proof small plate (01), and the threading hole is communicated with the interior of the push rod (22).
10. A testing method, applied to the testing device according to claims 1-9, characterized in that: include: The heater (11) is turned on, and the heat reflecting plate (12) reflects the heat emitted by the heater (11) to the heat protection plate (01); The surface temperature of the heat protection plate (01) is tested by a thermocouple.