Wafer defect detection equipment and method

Abstract

The invention discloses wafer defect detection equipment and a wafer defect detection method, and belongs to the field of detection of semiconductor elements. Wafer defect detection equipment comprises a detection substrate, and further comprises a supporting assembly used for fixing a wafer, and the supporting assembly is installed on the detection substrate in a turnover mode; the air injection assembly is used for cleaning the surface of the wafer; the coating assembly is used for spraying a detection material on the surface of the wafer, and the coating assembly is movably arranged above the supporting assembly; the number of the suction cups can be selected according to the size of the wafer, contact friction between the suction cups and the wafer is small, and damage to the wafer is reduced as much as possible; according to the wafer defect detection device, the size of a sunken defect on a wafer can be increased, so that the sunken defect can be conveniently detected, the defect can be timely and effectively detected, and the loss caused by the defect is reduced; and dust on the surface of the wafer is removed through the air pipe, and coating of the compound and timely surface removal can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor element detection, and in particular to a wafer defect detection device and method. Background Art

[0002] With the miniaturization of semiconductor product device size and the advancement of manufacturing technology, more and more tiny defects will have a huge impact on the yield of semiconductor products, which may seriously affect the function of the formed semiconductor devices, thereby causing yield loss. In order to improve the yield of semiconductor devices, multiple inspection processes are usually set up during the manufacturing process to detect defects in time during the manufacturing process and improve the process in time, so that the yield of subsequent wafers can be improved. Current wafer inspection equipment can use a detection beam to scan the surface of the wafer to be tested, and process the beam reflected back from the wafer surface to obtain the concave defect data on the wafer surface.

[0003] The existing detection equipment has the following defects:

[0004] 1. Traditional wafer inspection devices can only inspect wafers of fixed size. When the wafer size changes, a new inspection device needs to be remade, which has high inspection costs and low inspection efficiency.

[0005] 2. When detecting concave defects, wafer inspection equipment has a certain measurement range. When the size of the concave defect on the wafer is too small, it is difficult for the wafer inspection equipment to capture the concave defect, which can easily cause batches of wafers to be scrapped due to defects, resulting in huge losses. Summary of the invention

[0006] The purpose of the present invention is to solve the problems in the prior art of high detection cost and low detection efficiency; when the size of the concave defect on the wafer is too small, it is difficult for the wafer detection equipment to fully detect the concave defect of the wafer, which can easily cause batches of wafers to be scrapped due to defects, resulting in huge losses, and a wafer defect detection device and method are proposed.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions:

[0008] A wafer defect detection device includes a detection substrate and also includes: a support component for fixing the wafer, the support component can be flipped and installed on the detection substrate; a jet component for cleaning the surface of the wafer; a coating component for spraying a detection material onto the surface of the wafer, the coating component can be movably arranged above the support component.

[0009] Preferably, one side of the detection substrate is connected to an electric control cabinet, and one side of the electric control cabinet is provided with a detection component, the detection component includes an optical imaging module and a display screen pinned to the top of the electric control cabinet, and the optical imaging module and the electric control cabinet are slidably connected.

[0010] Preferably, the support assembly includes a flip frame, two groups of second ear plates are symmetrically arranged on one side of the bottom of the flip frame, support shafts penetrate through and are fixedly connected to the two groups of second ear plates, and two groups of first ear plates are symmetrically arranged on the upper surface of the detection substrate, and both ends of the support shaft are rotatably connected to the first ear plates.

[0011] Preferably, a driving assembly is arranged between the flip frame and the detection substrate, the driving assembly includes a screw rod, a driving block is slidably connected to the surface of the screw rod, an internal threaded sleeve is connected between the driving block and the screw rod, a third ear plate is fixedly connected to the driving block, and the driving block is slidably connected in the detection substrate, a fourth ear plate is fixedly connected to the center position of one side of the bottom of the flip frame, and a first connecting plate is pinned between the fourth ear plate and the third ear plate.

[0012] In order to ensure the stability of the flipping structure of the flipping frame, further, two groups of guide components are arranged on both sides of the first connecting plate, and the guide components include a guide block slidably arranged in the detection substrate, and the second connecting plate is pinned on the guide block, and the fourth ear plate and the first connecting plate are connected with a connecting rod at the pin connection position, and two groups of fifth ear plates are symmetrically arranged on one side of the bottom of the flipping frame, and both ends of the connecting rod are rotatably installed in the fifth ear plate, the connecting rod and the second connecting plate are pinned, and a first guide groove is opened in the detection substrate, and a guide shaft is arranged in the first guide groove, and the guide shaft and the guide block are slidably connected.

[0013] In order to ensure that the structure for fixing the wafer can adapt to wafers of different sizes, further, the flip frame is slidably connected to a fixed plate, a suction cup is arranged in the fixed plate, and two groups of sliders are symmetrically arranged on the bottom surface of the fixed plate, and at least six groups of slide grooves are opened in the flip frame, and the sliders and slide grooves are matched.

[0014] Preferably, the coating component is slidably arranged on the processing plate above the fixed plate, the first airbag and the processing plate are connected, the processing plate is filled with a detection compound, the first airbag coats the compound on the surface of the wafer to be detected during the extrusion process, adjustment sleeves are arranged at both ends of the processing plate, electric slides are symmetrically arranged on both sides of the flip frame, a support rod is connected to the electric slide, and the adjustment sleeve and the support rod are slidably arranged; it also includes a first airbag arranged on the outside of the guide shaft, one end of the first airbag is slidably connected to one side of the guide block, and the other end of the first airbag is fixedly connected to the guide groove, and the fixed end of the first airbag is connected to a spray branch pipe.

[0015] In order to make the coating of detection compounds and the removal of surface coatings act synchronously and improve efficiency, the processing plate further includes a spray tank, the spray tank is filled with detection compounds and the bottom of the spray tank is connected to a spray pipe, and a spray main pipe is connected between the two groups of spray branches, and the spray main pipe is connected to the spray tank through a steel wire hose; it also includes an air chamber, the spray tank and the air chamber are connected to the first air bag through a connecting pipe, the bottom of the air chamber is connected to a cleaning plate through a spring, a guide rod is arranged in the spring, one end of the guide rod is slidably connected to the air chamber, and the other end of the guide rod is fixedly connected to the cleaning plate, a pressure pipe connected to the air chamber is arranged between the air chamber and the cleaning plate, and the gas discharged from the pressure pipe drives the cleaning plate and the wafer with detection to fit together.

[0016] Preferably, the jet assembly includes two groups of second airbags which are sleeved on the outside of the electric slide, one end of the second airbag is connected to the movable block of the electric slide, and the other end of the second airbag is fixedly connected to one end of the slide groove, one end of the two groups of second airbags are connected to a connecting air pipe, and an air outlet pipe is provided on one side of the electric control cabinet, and the connecting air pipe and the air outlet pipe are connected.

[0017] A wafer defect detection method comprises the following steps:

[0018] Step 1: Place the wafer to be inspected on the suction cup, start the external pump to drive the suction cup to evacuate, adsorb the wafer, and thus fix the inspection position of the wafer;

[0019] Step 2: Start the motor to drive the lead screw to rotate, drive the drive block to move forward, change the angle of the first connecting plate, and thus adjust the wafer angle;

[0020] Step 3: During the turning process of the fixed plate, the first airbag is squeezed, and the detection compound in the spray tank is sprayed onto the surface of the wafer through the spray pipe. The cleaning plate placed on one side of the spray tank removes the detection compound immediately after spraying;

[0021] Step 4: During the spraying process, the electric slide is started, the second airbag is squeezed, and air is blown through the air outlet pipe to the surface of the wafer to remove floating dust;

[0022] Step 5: Start the optical imaging module to illuminate the wafer surface, and detect wafer defects by interacting with the detection compound in the concave parts of the wafer surface.

[0023] Compared with the prior art, the present invention provides a wafer defect detection device, which has the following beneficial effects:

[0024] 1. The wafer defect detection equipment is provided with a fixing plate, and multiple groups of suction cups are provided in the fixing plate. The suction cups are used to fix the wafer by adsorbing it. The number of suction cups can be selected according to the size of the wafer. At the same time, the contact friction between the suction cup and the wafer is small, which can minimize the damage to the wafer;

[0025] 2. The wafer defect detection equipment is provided with a processing plate above a fixed plate, the processing plate including a spraying tank and an air chamber, and the detection compound is coated on the surface of the wafer through the spraying tank, and then the detection compound is removed through the cleaning plate at the bottom of the air chamber and the wafer bonding action, so that the size of the concave defect on the wafer can be increased, so that it can be conveniently detected, thereby timely and effectively detecting the occurrence of defects and reducing the losses caused by them;

[0026] 3. The wafer defect detection device, by arranging a first airbag between the flip frame and the detection substrate, can achieve compound coating by squeezing the airflow generated by the first airbag, thereby improving detection efficiency and saving the installation of the driving mechanism, simplifying the device and improving the structural utilization rate;

[0027] 4. The wafer defect detection equipment, by arranging guide components on both sides of the driving component, enables the guide block and the driving block to move synchronously, thereby enhancing the supporting force on both sides of the driving component, ensuring the stability of the flipping structure of the flip frame, and finally enhancing the stability of the wafer detection support;

[0028] 5. The wafer defect detection equipment is equipped with a second airbag on the outer surface of the electric slide. When the electric slide is started, the second airbag can be squeezed to exhaust the gas to the wafer surface through the outlet pipe. It can not only blow away the dust on the wafer surface, but also prevent the spray layer from flowing excessively to a low position on the inclined wafer surface, thereby ensuring uniform spraying.

[0029] The parts not involved in the device are the same as the prior art or can be implemented by the prior art. The present invention can select the number of suction cups according to the size of the wafer. At the same time, the contact friction between the suction cup and the wafer is small, which can minimize the damage to the wafer; the size of the concave defect on the wafer can be increased so that it can be easily detected, thereby timely and effectively detecting the occurrence of defects and reducing the losses caused thereby; not only can the dust on the wafer surface be removed through the air pipe, but also the coating of the compound and timely surface removal can be achieved, thereby improving the detection efficiency and saving the installation of the driving mechanism, simplifying the equipment and improving the structural utilization; enhancing the supporting force on both sides of the driving assembly to ensure the stability of the flipping structure of the flipping frame, and finally enhancing the stability of the wafer detection support; not only can the dust blowing work on the wafer surface be performed, but also the excessive flow of the spray layer to a low position on the inclined wafer surface can be prevented to ensure uniform spraying. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a schematic diagram of the main stereoscopic structure of a wafer defect detection device proposed by the present invention;

[0031] Figure 2A schematic diagram of the bottom structure of a fixing plate of a wafer defect detection device proposed by the present invention;

[0032] Figure 3 A schematic diagram of a partial cross-sectional structure of a wafer defect detection device proposed by the present invention;

[0033] Figure 4 A schematic diagram of the internal structure of a first airbag of a wafer defect detection device proposed by the present invention;

[0034] Figure 5 A schematic diagram of a rear-view stereoscopic structure of a wafer defect detection device proposed by the present invention;

[0035] Figure 6 A schematic diagram of the main cross-sectional structure of a processing board of a wafer defect detection device proposed by the present invention;

[0036] Figure 7 This is a schematic diagram of the cross-sectional structure of a processing plate of a wafer defect detection device proposed by the present invention when viewed from above.

[0037] In the figure: 1, detection substrate; 2, optical imaging module; 3, electric control cabinet; 4, display screen; 5, fixed plate; 6, suction cup; 7, slider; 8, flip frame; 9, slide; 10, first ear plate; 11, second ear plate; 12, support shaft; 13, motor; 14, lead screw; 15, drive block; 16, third ear plate; 17, first connecting plate; 18, connecting rod; 19, fourth ear plate; 20, second connecting plate; 21, guide block; 22, guide Towards the shaft; 23, the first air bag; 24, the spray branch pipe; 25, the electric slide; 26, the processing plate; 27, the support rod; 28, the guide groove; 29, the fifth ear plate; 30, the spray main pipe; 31, the second air bag; 32, the connecting air pipe; 33, the air outlet pipe; 34, the spray tank; 35, the spray pipe; 36, the adjustment sleeve; 37, the air chamber; 38, the pressure pipe; 39, the spring; 40, the cleaning plate; 41, the guide rod; 42, the connecting pipe. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0039] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0040] Example:

[0041] Reference Figure 1-Figure 7 A wafer defect detection device includes a detection substrate 1, one side of the detection substrate 1 is connected to an electric control cabinet 3, one side of the electric control cabinet 3 is provided with a detection component, the detection component includes an optical imaging module 2 and a display screen 4 pinned to the top of the electric control cabinet 3, and the optical imaging module 2 and the electric control cabinet 3 are slidably connected.

[0042] In this embodiment, a detection substrate 1 is provided, and a wafer to be detected is placed on the detection substrate 1. The surface of the wafer is detected by optical imaging technology using an electric control cabinet 3 and an optical imaging module 2 slidably arranged on one side of the electric control cabinet 3.

[0043] In this embodiment, the optical imaging module 2 is preferably an optical microscope, which uses the optical imaging system of the optical microscope to observe the microstructure of the wafer surface and identify defects such as dents, which has the advantages of being intuitive and easy to operate.

[0044] It should be noted that since the wafer needs to be flipped at a certain angle during inspection, the optical imaging module 2 needs to remain vertical to the wafer being inspected. Therefore, a moving device and a rotating device for changing the imaging angle of the optical imaging module 2 are provided between the optical imaging module 2 and the electrical control cabinet 3 to facilitate the optical imaging module 2 to adjust the angle according to the angle of the wafer before inspection.

[0045] This embodiment also includes: a support assembly for fixing the wafer, the support assembly can be flipped and installed on the detection substrate 1, the support assembly includes a flip frame 8, a fixed plate 5 is slidably connected to the flip frame 8, a suction cup 6 is arranged in the fixed plate 5, and two groups of sliders 7 are symmetrically arranged on the bottom surface of the fixed plate 5, at least six groups of slide grooves 9 are opened in the flip frame 8, and the sliders 7 and the slide grooves 9 are matched.

[0046] In the present embodiment, a group of fixing plates 5 with suction cups 6 are provided to fix the wafers. Considering the special material and structure of the wafers, the suction cups 6 are connected by an external air pump. A solenoid valve is provided at the bottom of each group of suction cups 6. The solenoid valves are connected to the PLC electrical signals in the electric control cabinet 3. Therefore, a suitable number of suction cups 6 can be selected according to the size of the wafers. The wafers are placed at the air inlets of the suction cups 6, and the external air pump is started to extract air to form a negative pressure area. The negative pressure area will be transmitted along the surface of the suction cups 6 from the inlet. Due to the pressure difference between the negative pressure area and the environment, air molecules will be pushed to the negative pressure area to form a negative pressure adsorption force. When the negative pressure adsorption force is greater than the contact force between the wafer and the surface of the suction cups 6, the wafer will be tightly adsorbed on the suction cups 6. Not only can the number of suction cups 6 be selected according to the size of the wafer, but also the contact friction between the suction cups 6 and the wafer is small, which can minimize the damage to the wafer.

[0047] Two groups of second ear plates 11 are symmetrically arranged on one side of the bottom of the flip frame 8, and support shafts 12 are passed through and fixedly connected to the two groups of second ear plates 11. Two groups of first ear plates 10 are symmetrically arranged on the upper surface of the detection substrate 1, and both ends of the support shaft 12 are rotatably connected to the first ear plates 10.

[0048] In this embodiment, one side of the flip frame 8 is rotatably connected to one side of the detection substrate 1 through a pin-connected structure formed by a first ear plate 10, a second ear plate 11 and a support shaft 12, so that after the fixed plate 5 and the flip frame 8 are connected, the angle of the fixed wafer can be adjusted to find the most suitable optical angle for detection, thereby ensuring the accuracy of detection and improving detection efficiency.

[0049] A driving assembly is arranged between the flip frame 8 and the detection substrate 1, and the driving assembly includes a screw rod 14, a driving block 15 is slidably connected to the surface of the screw rod 14, an internal threaded sleeve is connected between the driving block 15 and the screw rod 14, a third ear plate 16 is fixedly connected to the driving block 15, and the driving block 15 is slidably connected in the detection substrate 1, a fourth ear plate 19 is fixedly connected to the center position of one side of the bottom of the flip frame 8, and a first connecting plate 17 is pinned between the fourth ear plate 19 and the third ear plate 16.

[0050] In this embodiment, a driving assembly is provided at a central position at the bottom of the flip frame 8 and away from one side of the support shaft 12. When adjusting the angle of the flip frame 8, the motor 13 is started to drive the screw rod 14 to rotate. Since the driving block 15 is confined in a groove matching it, the rotation of the screw rod 14 can drive the driving block 15 to move under the transmission of the internal threaded sleeve. During the movement of the driving block 15, the inclination angle of the first connecting plate 17 is changed. When the angle between the first connecting plate 17 and the detection substrate 1 becomes larger, the flipping angle of the flip frame 8 will also increase accordingly. Therefore, the flip frame 8 takes the support shaft 12 as a fulcrum and can be lifted to the required angle driven by the driving assembly to meet the detection conditions of the wafer.

[0051] Two groups of guide components are arranged on both sides of the first connecting plate 17, and the guide components include a guide block 21 slidably arranged in the detection substrate 1, and the second connecting plate 20 is pinned on the guide block 21. The fourth ear plate 19 and the first connecting plate 17 are connected with a connecting rod 18 at the pin connection position. Two groups of fifth ear plates 29 are symmetrically arranged on one side of the bottom of the flip frame 8. Both ends of the connecting rod 18 are rotatably installed in the fifth ear plate 29. The connecting rod 18 and the second connecting plate 20 are pinned. A first guide groove 28 is opened in the detection substrate 1, and a guide shaft 22 is arranged in the first guide groove 28. The guide shaft 22 and the guide block 21 are slidably connected.

[0052] In the present embodiment, considering that the flip frame 8 only relies on the support of the first connecting plate 17 during the flipping process, and its balance and stability are relatively weak, therefore, guide assemblies are symmetrically arranged on both sides of the driving assembly, and the connecting rod 18 is used to sequentially connect and penetrate the first connecting plate 17 and the two groups of second connecting plates 20. In the process of changing the angle of one end of the first connecting plate 17, the two groups of guide blocks 21 also rotate synchronously, and the guide blocks 21 slide on the surface of the guide shaft 22, thereby enhancing the supporting force on both sides of the driving assembly and ensuring the stability of the flipping structure of the flip frame 8.

[0053] It should be noted that, in order to ensure that the force of the airflow is sufficient to spray the wafer, designers in this field are aware of installing a boost valve in the spray branch pipe 24 .

[0054] A coating assembly for spraying a test material onto the surface of a wafer, the coating assembly is movably arranged above the support assembly. The coating assembly is slidably arranged on a processing plate 26 above the fixed plate 5, the first airbag 23 and the processing plate 26 are connected, the processing plate 26 is filled with a test compound, the first airbag 23 applies the compound to the surface of the wafer to be tested during the extrusion process, adjustment sleeves 36 are arranged at both ends of the processing plate 26, the electric slide 25 is symmetrically arranged on both sides of the flip frame 8, the electric slide 25 is connected to a support rod 27, and the adjustment sleeve 36 and the support rod 27 are slidably sleeved.

[0055] In this embodiment, a coating assembly is provided above the fixed plate 5, and the coating assembly is connected to the first airbag 23. During the process of adjusting the wafer angle, the guide block 21 moves along the guide shaft 22. During the movement, the guide block 21 squeezes the first airbag 23, and the air is squeezed into the processing plate 26. The detection compound in the processing plate 26 is squeezed and then sprayed on the surface of the wafer. At the same time, the coated detection compound is wiped off by the processing plate 26, which can increase the size of the concave defect on the wafer so that it can be easily detected, thereby timely and effectively detecting the occurrence of defects and reducing the losses caused thereby.

[0056] It also includes a first airbag 23 sleeved on the outside of the guide shaft 22. One end of the first airbag 23 is slidably connected to one side of the guide block 21, and the other end of the first airbag 23 is fixedly connected to the guide groove 28. The fixed end of the first airbag 23 is connected to a spray branch pipe 24.

[0057] In this embodiment, a first airbag 23 is sleeved in the guide groove 28 and outside the guide shaft 22 . When the guide block 21 moves, the first airbag 23 is squeezed to form an airflow.

[0058] The processing plate 26 includes a spray tank 34, in which a test compound is contained and a spray pipe 35 is connected to the bottom of the spray tank 34. A spray main pipe 30 is connected between the two groups of spray branches 24, and the spray main pipe 30 is connected to the spray tank 34 through a steel hose.

[0059] Specifically, the processing plate 26 is divided into two cavities, the spraying slot 34 is filled with the detection compound, and the airflow is formed by squeezing the first airbag 23 to increase the gas tower intensity in the spraying slot 34, and the detection compound is sprayed out through the spraying pipe 35.

[0060] It also includes an air chamber 37. The spray tank 34 and the air chamber 37 are connected to the first air bag 23 through a connecting pipe 42. The bottom of the air chamber 37 is connected to a cleaning plate 40 through a spring 39. A guide rod 41 is arranged in the spring 39. One end of the guide rod 41 is slidably connected to the air chamber 37, and the other end of the guide rod 41 is fixedly connected to the cleaning plate 40. A pressure pipe 38 connected to the air chamber 37 is arranged between the air chamber 37 and the cleaning plate 40. The gas discharged from the pressure pipe 38 pushes the cleaning plate 40 to fit the wafer with detection.

[0061] In this embodiment, one side of the spray tank 34 is set as an air chamber 37, and the air flow pressure generated by the extrusion of the first airbag 23 is also used to discharge through the pressure pipe 38. Since the cleaning plate 40 is elastically and slidably connected to the outside of the air chamber 37 through the spring 39 and the guide rod 41, when the gas is discharged, the cleaning plate 40 is blown to extend to the surface of the wafer, thereby erasing the detection compound from the coated wafer, ensuring that the wafer defects can be clearly identified under the action of light later.

[0062] It should be noted that when the covering layer is removed, the size of the concave defect on the wafer can be increased so that it can be easily detected, thereby timely and effectively monitoring the occurrence of defects and reducing the losses caused thereby.

[0063] The jet assembly includes two groups of second air bags 31 which are sleeved on the outside of the electric slide 25. One end of the second air bag 31 is connected to the movable block of the electric slide 25, and the other end of the second air bag 31 is fixedly connected to one end of the slide groove 9. One end of the two groups of second air bags 31 is connected to a connecting air pipe 32. An air outlet pipe 33 is provided on one side of the electric control cabinet 3, and the connecting air pipe 32 and the air outlet pipe 33 are connected.

[0064] In the present embodiment, while the electric slide 25 drives the processing plate 26 to spray on the surface of the wafer, the movable block of the electric slide 25 squeezes the second airbag 31 during the movement of the electric slide 25. The second airbag 31 is connected to the air outlet pipe 33 arranged on one side of the electric control cabinet 3 through the connecting air pipe 32. The air outlet connected in the air outlet pipe 33 faces the inclined wafer detection surface. After the airflow is sprayed out, it can not only blow away the dust on the surface of the wafer, but also prevent the spray layer from flowing excessively to a low position on the inclined wafer surface, thereby ensuring uniform spraying and effectively preventing the dust coverage from affecting the subsequent coating effect.

[0065] In the present invention, the wafer to be inspected is first placed on the suction cup 6, and the external pump body is started to drive the suction cup 6 to evacuate and adsorb the wafer, thereby fixing the inspection position of the wafer. Not only can the number of suction cups 6 be selected according to the size of the wafer, but also the contact friction between the suction cup 6 and the wafer is small, which can minimize the damage to the wafer.

[0066] Then, the motor 13 is started to drive the screw 14 to rotate, drive the driving block 15 to move forward, change the angle of the first connecting plate 17, and thus adjust the angle of the wafer. The angle of the fixed wafer is adjusted to find the most suitable optical angle for detection, meet the detection condition requirements of the wafer, ensure the accuracy of detection, and improve the detection efficiency;

[0067] It should be noted that in wafer inspection, factors such as the polarization state control, band selection, cross-sectional shape, and incident angle of the illumination beam will affect the signal-to-noise ratio of the defect scattering signal. By adjusting the angle, the lighting effect can be optimized and the accuracy and reliability of defect detection can be improved.

[0068] Among them, the purpose of adjusting the angle in wafer inspection is to optimize the lighting effect, improve the detection accuracy and ensure the optimization of the selection of the optical imaging module 2, thereby improving the inspection quality and efficiency of the wafer.

[0069] At the same time, when turning over, the first airbag 23 is squeezed, and the airflow is poured into the spray tank 34, and the detection compound in the spray tank 34 is sprayed onto the wafer surface through the spray pipe 35. The cleaning plate 40 placed on one side of the spray tank 34 removes the detection compound immediately after spraying, and the detection compound is wiped off the coated wafer to ensure that the wafer defects can be clearly identified under the action of light later;

[0070] During spraying, the electric slide 25 is started, and the movable block inside it squeezes the second airbag 31 during the process of moving along the electric slide 25. The second airbag 31 is connected to the air outlet pipe 33 arranged on one side of the electric control cabinet 3 through the connecting air pipe 32. The air outlet connected in the air outlet pipe 33 faces the inclined wafer detection surface. After the airflow is sprayed out, it can not only blow away the dust on the wafer surface, but also prevent the spray layer from excessively flowing to a low position on the inclined wafer surface, thereby ensuring uniform spraying.

[0071] Finally, the optical imaging module 2 is started to illuminate the wafer surface, and the microstructure of the wafer surface is observed by using the optical imaging system of the optical microscope to detect wafer defects.

[0072] A wafer defect detection method comprises the following steps:

[0073] Step 1: Place the wafer to be inspected on the suction cup 6, start the external pump to drive the suction cup 6 to evacuate, adsorb the wafer, and thus fix the inspection position of the wafer;

[0074] Step 2: Start the motor 13 to drive the screw rod 14 to rotate, drive the driving block 15 to move forward, change the angle of the first connecting plate 17, and thus adjust the wafer angle;

[0075] Step 3: During the turning process of the fixed plate 5, the first airbag 23 is squeezed, and the detection compound in the spray tank 34 is sprayed onto the wafer surface through the spray pipe 35. The cleaning plate 40 placed on one side of the spray tank 34 removes the detection compound immediately after spraying;

[0076] Step 4: During the spraying process, the electric slide 25 is started, the second airbag 31 is squeezed, and the air is exhausted to the wafer surface through the air outlet pipe 33 to remove floating dust;

[0077] Step 5: Start the optical imaging module 2 to illuminate the wafer surface, and detect wafer defects by interacting the light with the detection compound at the concave part of the wafer surface.

[0078] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A wafer defect detection device, comprising a detection substrate (1), characterized in that: Also includes: A support assembly for fixing the wafer, wherein the support assembly can be flipped and mounted on the detection substrate (1); A jet assembly for cleaning the surface of a wafer; A coating component is used for spraying a testing material onto a wafer surface, and the coating component is movably arranged above a supporting component.

2. The wafer defect detection device according to claim 1, characterized in that: One side of the detection substrate (1) is connected to an electric control cabinet (3), and one side of the electric control cabinet (3) is provided with a detection component, the detection component comprising an optical imaging module (2) and a display screen (4) pinned to the top of the electric control cabinet (3), and the optical imaging module (2) and the electric control cabinet (3) are slidably connected.

3. The wafer defect detection device according to claim 2, characterized in that: The support assembly comprises a flip frame (8), two groups of second ear plates (11) are symmetrically arranged on one side of the bottom of the flip frame (8), support shafts (12) penetrate through and are fixedly connected to the two groups of second ear plates (11), and two groups of first ear plates (10) are symmetrically arranged on the upper surface of the detection substrate (1), and both ends of the support shaft (12) are rotatably connected to the first ear plates (10).

4. The wafer defect detection device according to claim 3, characterized in that: A driving assembly is arranged between the flip frame (8) and the detection substrate (1), and the driving assembly comprises a screw rod (14), a driving block (15) is slidably connected to the surface of the screw rod (14), an internal threaded sleeve is connected between the driving block (15) and the screw rod (14), a third ear plate (16) is fixedly connected to the driving block (15), and the driving block (15) is slidably connected in the detection substrate (1), a fourth ear plate (19) is fixedly connected to the center position of one side of the bottom of the flip frame (8), and a first connecting plate (17) is pinned between the fourth ear plate (19) and the third ear plate (16).

5. The wafer defect detection device according to claim 4, characterized in that: Two groups of guide assemblies are arranged on both sides of the first connecting plate (17), and the guide assemblies include a guide block (21) slidably arranged in the detection substrate (1), a second connecting plate (20) is pinned on the guide block (21), a connecting rod (18) is connected to the pinned position of the fourth ear plate (19) and the first connecting plate (17), two groups of fifth ear plates (29) are symmetrically arranged on one side of the bottom of the flip frame (8), both ends of the connecting rod (18) are rotatably installed in the fifth ear plate (29), the connecting rod (18) and the second connecting plate (20) are pinned, a first guide groove (28) is opened in the detection substrate (1), a guide shaft (22) is arranged in the first guide groove (28), and the guide shaft (22) and the guide block (21) are slidably connected.

6. The wafer defect detection device according to claim 5, characterized in that: A fixed plate (5) is slidably connected to the flip frame (8), a suction cup (6) is arranged inside the fixed plate (5), and two groups of sliders (7) are symmetrically arranged on the bottom surface of the fixed plate (5), at least six groups of slide grooves (9) are opened in the flip frame (8), and the sliders (7) and the slide grooves (9) are matched.

7. The wafer defect detection device according to claim 5, characterized in that: The coating assembly is slidably arranged on a treatment plate (26) above the fixed plate (5), the treatment plate (26) is filled with a detection compound, and adjustment sleeves (36) are arranged at both ends of the treatment plate (26). Electric slides (25) are symmetrically arranged on both sides of the flip frame (8), and a support rod (27) is connected to the electric slide (25), and the adjustment sleeve (36) and the support rod (27) are slidably arranged; It also includes a first airbag (23) sleeved on the outside of the guide shaft (22), one end of the first airbag (23) is slidably connected to one side of the guide block (21), and the other end of the first airbag (23) is fixedly connected to the guide groove (28), and the fixed end of the first airbag (23) is connected to a spray branch pipe (24).

8. The wafer defect detection device according to claim 7, characterized in that: The treatment plate (26) comprises a spray tank (34), wherein the spray tank (34) contains a test compound and the bottom of the spray tank (34) is connected to a spray pipe (35), and a spray main pipe (30) is connected between the two groups of spray branch pipes (24), and the spray main pipe (30) is connected to the spray tank (34) through a steel wire hose; The invention also comprises an air chamber (37), wherein the spraying tank (34) and the air chamber (37) are both connected to the first air bag (23) through a connecting pipe (42), the bottom of the air chamber (37) is connected to a cleaning plate (40) through a spring (39), a guide rod (41) is arranged in the spring (39), one end of the guide rod (41) is slidably connected to the air chamber (37), and the other end of the guide rod (41) is fixedly connected to the cleaning plate (40), a pressure pipe (38) connected to the air chamber (37) is arranged between the air chamber (37) and the cleaning plate (40), and the gas discharged from the pressure pipe (38) pushes the cleaning plate (40) to fit with the wafer with detection.

9. The wafer defect detection device according to claim 7, characterized in that: The jet assembly comprises two groups of second air bags (31) sleeved on the outside of the electric slide (25), one end of the second air bag (31) is connected to the movable block of the electric slide (25), and the other end of the second air bag (31) is fixedly connected to one end of the slide groove (9), one end of the two groups of the second air bags (31) is connected to a connecting air pipe (32), one side of the electric control cabinet (3) is provided with an air outlet pipe (33), and the connecting air pipe (32) and the air outlet pipe (33) are connected.

10. A wafer defect detection method, comprising a wafer defect detection device according to any one of claims 1 to 9, characterized in that: The steps include: Step 1: placing the wafer to be inspected on the suction cup (6), starting the external pump body to drive the suction cup (6) to evacuate the vacuum, adsorbing the wafer, thereby fixing the inspection position of the wafer; Step 2: starting the motor (13), driving the screw (14) to rotate, driving the driving block (15) to move forward, changing the angle of the first connecting plate (17), and thus adjusting the wafer angle; Step 3: During the turning process of the fixed plate (5), the first airbag (23) is squeezed, and the detection compound in the spray tank (34) is sprayed onto the surface of the wafer through the spray pipe (35). As for the cleaning plate (40) on one side of the spray tank (34), the detection compound is removed immediately after the spraying; Step 4: During the spraying process, the electric slide (25) is started, the second air bag (31) is squeezed, and exhaust is discharged to the surface of the wafer through the air outlet pipe (33) to remove floating dust; Step 5: Start the optical imaging module (2) to illuminate the wafer surface, and detect wafer defects by interacting the light with the detection compound at the concave part of the wafer surface.

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