Wafer fixing device and method and detection equipment

Abstract

The invention relates to a wafer fixing device and method and detection equipment. The wafer fixing device comprises an adsorption module, a pressurization module and a switch module, wherein the adsorption module is used for fixing a wafer; the pressurization module is used for applying voltage to the wafer; the switch module is respectively connected with the adsorption module and the pressurization module, and the switch module is used for communicating one of the adsorption module and the pressurization module with a power supply at any moment. The switch module does not turn on the adsorption module and the pressurization module at the same time, so that when the pressurization module is connected with the power supply and voltage is applied, the adsorption module and the power supply are disconnected, signal noise carried by the adsorption module is also isolated, the influence of the signal noise on a test result is avoided, and the test accuracy is improved. And the test accuracy is ensured.

Description

Technical Field

[0001] The present disclosure relates to the field of wafer testing technology, and in particular to a wafer fixing device, method and testing equipment. Background Art

[0002] In the electron beam test equipment of wafer, it is necessary to pressurize the wafer to realize electron beam deceleration, reduce the energy of the electron beam, so that it has suitable kinetic energy when contacting the wafer surface, thereby avoiding the electron beam from causing excessive damage to the wafer surface. Due to the limited withstand voltage of the dielectric layer in the electrostatic chuck for fixing the wafer, in order to protect the dielectric layer from being broken down, the electrostatic chuck and the pressurized probe are usually powered at the same time in the conventional technology to ensure that the voltage between the wafer and the dielectric layer will not damage the dielectric layer. However, due to the presence of signal noise in the power supply of the electrostatic chuck, the voltage of the wafer will be affected, thereby affecting the test result of the electron beam test equipment. Therefore, how to eliminate the influence of the signal noise in the power supply on the test result becomes a technical problem that those skilled in the art need to solve urgently. Summary of the invention

[0003] In order to solve the above technical problems or at least partially solve the above technical problems, the present disclosure provides a wafer fixing device, method and detection equipment.

[0004] In a first aspect, the present disclosure provides a wafer fixing device, comprising: an adsorption module, a pressurizing module and a switch module. The adsorption module is used to fix the wafer; the pressurizing module is used to apply voltage to the wafer; the switch module is connected to the adsorption module and the pressurizing module respectively, and the switch module is used to connect one of the adsorption module and the pressurizing module to a power source at any time.

[0005] Optionally, the switch module includes a first switch unit, a second switch unit and a master control switch; the control ends of the first switch unit and the second switch unit are both connected to the master control switch, the first switch unit is connected to the adsorption module, and the second switch unit is connected to the pressurizing module; wherein the first switch unit is used to connect the adsorption module to the power supply, and the second switch unit is used to connect the pressurizing module to the power supply; the master control switch is used to turn on one of the first switch unit and the second switch unit at the same time.

[0006] Optionally, the master control switch includes a first relay; the control end of the first relay is connected to the control module, the first end of the first relay is connected to the control voltage end, the second end of the first relay is connected to the control end of the second switch unit, and the third end of the first relay is connected to the control end of the first switch unit; the first relay is used to connect the first end with the second end when a first control signal is received, or to connect the first end with the third end when a second control signal is received.

[0007] Optionally, the master control switch also includes a second relay; the adsorption module includes a first adsorption unit and a second adsorption unit; the first switch unit includes a first sub-switch and a second sub-switch; wherein the first adsorption unit and the second adsorption unit are used together to fix a first-size wafer, and the second adsorption unit is used to fix a second-size wafer; the size of the first-size wafer is larger than the size of the second-size wafer; the control end of the second relay is connected to the control module, the first end of the second relay is connected to the third end of the first relay, the second end of the second relay is connected to the control end of the first sub-switch and the control end of the second sub-switch, and the third end of the second relay is connected to the control end of the second sub-switch; wherein the first sub-switch is connected between the first adsorption unit and the power supply, and the second sub-switch is connected between the second adsorption unit and the power supply; the second relay is used to connect the first end with the second end when a third control signal is received, or to connect the first end with the third end when a fourth control signal is received.

[0008] Optionally, the first adsorption unit includes a first annular chuck; the second adsorption unit includes a second annular chuck; the first pole of the first annular chuck is connected to the negative terminal of the first power supply through the first sub-switch, and the second pole of the first annular chuck is connected to the positive terminal of the first power supply through the first sub-switch; the first pole of the second annular chuck is connected to the negative terminal of the first power supply through the second sub-switch, and the second pole of the second annular chuck is connected to the positive terminal of the first power supply through the second sub-switch; wherein the diameter of the first annular chuck is larger than the diameter of the second annular chuck, the first annular chuck and the second annular chuck are nested, and the first annular chuck and the second annular chuck are used to adsorb the wafer when connected to the first power supply.

[0009] Optionally, the pressurizing module includes a pressurizing probe; the pressurizing probe is connected to the second power supply through the switch module, and the pressurizing probe is used to connect to the wafer when the adsorption module fixes the wafer; the switch module is used to conduct the second power supply and the pressurizing probe; the pressurizing probe is used to apply voltage to the wafer when connected to the second power supply.

[0010] Optionally, the pressurizing module includes a protection unit; a first end of the protection unit is connected to the pressurizing probe, and a second end of the protection unit is connected to the second power supply through the switch module.

[0011] Optionally, the protection unit includes a protection resistor; a first end of the protection resistor is connected to the pressure probe, and a second end of the protection resistor is connected to the second power supply through the switch module.

[0012] In a second aspect, the present disclosure further provides a wafer inspection device, comprising the wafer fixing device of the first aspect.

[0013] In a third aspect, the present disclosure also provides a wafer fixing method, which is applied to the wafer fixing device of the first aspect; the method includes: controlling the switch module to connect the adsorption module with the power supply; when the adsorption module fixes the wafer, controlling the switch module to connect the pressurizing module with the power supply.

[0014] The present disclosure provides a wafer fixing device, method and detection equipment, wherein the wafer fixing device includes an adsorption module, a pressurizing module and a switch module. During the test process, the switch module first conducts the connection between the adsorption module and the power supply, at which time the pressurizing module is not connected to the power supply, and the adsorption module fixes the wafer after power is turned on. After the wafer is fixed, the switch module first disconnects the connection between the power supply and the adsorption module, and then conducts the connection between the power supply and the pressurizing module, thereby allowing the pressurizing module to apply voltage to the wafer, thereby reducing the energy of the electron beam and protecting the wafer. Moreover, the switch module does not connect the adsorption module and the pressurizing module to the power supply at the same time, but after the adsorption module completes the fixation of the wafer, the connection between the adsorption module and the power supply is first disconnected and then the connection between the pressurizing module and the power supply is conducted, so that the adsorption module can be avoided from being broken down due to the simultaneous operation of the adsorption module and the pressurizing module, thereby protecting the adsorption module. Moreover, when the voltage is applied by the pressurizing module, the connection between the adsorption module and the power supply has been disconnected, so the signal noise carried by the adsorption module is also cut off, thereby avoiding the influence of the signal noise on the test results and ensuring the accuracy of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic structural diagram of a wafer fixing device provided in an embodiment of the present disclosure.

[0017] Figure 2 A schematic structural diagram of a preferred wafer fixing device provided in an embodiment of the present disclosure.

[0018] Figure 3 A schematic flow chart of a wafer fixing method provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0019] The features and exemplary embodiments of various aspects of the application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the application. However, it is obvious to those skilled in the art that the application can be implemented when some details in these specific details are not needed. The following description of the embodiments is only to provide a better understanding of the application by illustrating the example of the application.

[0020] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The embodiments will be described in detail below in conjunction with the accompanying drawings.

[0021] Figure 1 A schematic diagram of the structure of a wafer fixing device provided in an embodiment of the present disclosure is shown in FIG. Figure 1 As shown, the wafer fixing device includes: an adsorption module 100, a pressurizing module 200 and a switch module 300. The adsorption module 100 is used to fix the wafer 400; the pressurizing module 200 is used to apply voltage to the wafer 400; the switch module 300 is connected to the adsorption module 100 and the pressurizing module 200 respectively, and the switch module 300 is used to connect one of the adsorption module 100 and the pressurizing module 200 to the power supply 500 at any time.

[0022] Specifically, the power supply 500 is connected to the adsorption module 100 and the pressurizing module 200 respectively through the switch module 300. When the switch module 300 turns on the connection between the power supply and the adsorption module 100, the adsorption module 100 adsorbs and fixes the wafer 400. After the wafer 400 is fixed, the pressurizing pin 201 of the pressurizing module 200 is connected to the wafer 400. At this time, the switch module 300 first cuts off the connection between the power supply 500 and the adsorption module 100, and then turns on the connection between the power supply 500 and the pressurizing module 200, so that the pressurizing module 200 starts to apply voltage to the wafer 400 through the pressurizing pin 201, thereby reducing the energy of the electron beam and achieving protection for the wafer 400.

[0023] The switch module 300 can only conduct the connection between the power source 500 and one of the adsorption module 100 and the pressurizing module 200, that is, the switch module 300 will not conduct the connection between the adsorption module 100 and the pressurizing module 200 and the power source 500 at the same time. Because the pressurizing module 200 needs to apply voltage to the wafer 400, if the adsorption module 100 and the pressurizing module 200 work at the same time, the adsorption module 100 may be broken down by the high voltage provided to the wafer 400 by the pressurizing module 200. Therefore, the switch module 300 provided by the present disclosure can avoid the adsorption module 100 and the pressurizing module 200 from being connected to the power source 500 at the same time, and thus can avoid the problem of the adsorption module 100 being broken down due to the adsorption module 100 and the pressurizing module 200 working at the same time, thereby achieving protection for the adsorption module 100. In addition, when the pressure module 200 of the present invention applies voltage to the wafer 400 through the pressure pin 201, the connection between the adsorption module 100 and the power supply 500 has been disconnected, so the signal noise carried by the adsorption module 100 is also isolated, thereby avoiding the influence of the signal noise on the voltage of the wafer 400, and further avoiding the influence on the test results, thereby ensuring the accuracy of the test.

[0024] In some embodiments, the switch module includes a first switch unit, a second switch unit and a master control switch; the control ends of the first switch unit and the second switch unit are both connected to the master control switch, the first switch unit is connected to the adsorption module, and the second switch unit is connected to the pressurizing module; wherein the first switch unit is used to connect the adsorption module to the power supply, and the second switch unit is used to connect the pressurizing module to the power supply; the master control switch is used to turn on one of the first switch unit and the second switch unit at the same time.

[0025] Specifically, the power supply is connected to the adsorption module through the first switch unit, and the power supply is also connected to the pressurization module through the second switch module. During the test, the master control switch first turns on the first switch unit, and the power supply supplies power to the adsorption module through the turned-on first switch unit. The adsorption module adsorbs and fixes the wafer. After the wafer is fixed, the master control switch first disconnects the first switch unit and then turns on the second switch unit, so that the power supply first stops cutting off the power to the adsorption module and then starts to supply power to the pressurization module. After the connection between the pressurization module and the power supply is turned on, the pressurization module starts to apply voltage to the wafer through the pressurization pin, thereby reducing the energy of the electron beam and protecting the wafer. Since the master control switch will not turn on the first switch unit and the second switch unit at the same time, the problem of the adsorption module being broken down due to the simultaneous operation of the adsorption module and the pressurization module can be avoided, thereby protecting the adsorption module. In addition, when the pressure module of the present invention applies voltage to the wafer through the pressure pin, the first switch unit is always in a disconnected state, so the connection between the adsorption module and the power supply is disconnected, and the signal noise carried by the adsorption module is isolated, thereby avoiding the influence of the signal noise on the voltage of the wafer, and further avoiding the influence of the signal noise on the test results, thereby ensuring the accuracy of the test.

[0026] In some embodiments, the master control switch includes a first relay; the control end of the first relay is connected to the control module, the first end of the first relay is connected to the control voltage end, the second end of the first relay is connected to the control end of the second switch unit, and the third end of the first relay is connected to the control end of the first switch unit; the first relay is used to connect the first end with the second end when a first control signal is received, or to connect the first end with the third end when a second control signal is received.

[0027] Specifically, during the test process, the control module first outputs the second control signal to the first relay, so that the first end of the first relay is connected to the third end. At this time, the control voltage end outputs the conduction voltage to the control end of the first switch unit through the first relay, so that the first switch unit is turned on, and the power supply supplies power to the adsorption module through the first switch unit that is turned on, and the adsorption module adsorbs and fixes the wafer. After the wafer is fixed, the control module stops outputting the second control signal to the first relay, so that the first switch unit is disconnected. At this time, the control module will continue to output the first control signal to the first relay, so that the first end of the first relay is connected to the second end, and the control voltage end outputs the conduction voltage to the control end of the second switch unit through the first relay, so that the second switch unit is turned on, so that the power supply stops first cutting off the power to the adsorption module, and then starts to supply power to the pressurization module. After the connection between the pressurization module and the power supply is turned on, the pressurization module starts to apply voltage to the wafer through the pressurization pin, thereby reducing the energy of the electron beam and realizing the protection of the wafer. Since the first relay can only conduct the first end and the second end or the first end and the third end at the same time, the first relay will not conduct the first switch unit and the second switch unit at the same time, thereby avoiding the problem of the adsorption module being broken down due to the simultaneous operation of the adsorption module and the pressurizing module, thereby protecting the adsorption module. In addition, when the pressurizing module applies a voltage to the wafer through the pressurizing pin, the first switch unit is always in a disconnected state, so the connection between the adsorption module and the power supply is disconnected, and the signal noise carried by the adsorption module is isolated, thereby avoiding the influence of the signal noise on the voltage of the wafer, thereby avoiding the influence of the signal noise on the test results, and ensuring the accuracy of the test.

[0028] In some embodiments, the master control switch also includes a second relay; the adsorption module includes a first adsorption unit and a second adsorption unit; the first switch unit includes a first sub-switch and a second sub-switch, wherein the first adsorption unit and the second adsorption unit are used together to fix a first-size wafer, and the second adsorption unit is used to fix a second-size wafer; the size of the first-size wafer is larger than the size of the second-size wafer.

[0029] The control end of the second relay is connected to the control module, the first end of the second relay is connected to the third end of the first relay, the second end of the second relay is connected to the control end of the first sub-switch and the control end of the second sub-switch, and the third end of the second relay is connected to the control end of the second sub-switch.

[0030] Among them, the first sub-switch is connected between the first adsorption unit and the power supply, and the second sub-switch is connected between the second adsorption unit and the power supply; the second relay is used to connect the first end with the second end when a third control signal is received, or to connect the first end with the third end when a fourth control signal is received.

[0031] Exemplarily, the first size is 8 inches and the second size is 6 inches. During the test, if the wafer is a wafer of the first size, the control module first outputs the second control signal to the first relay, so that the first end of the first relay is connected to the third end of the first relay, and the control module then outputs the third control signal to the second relay, so that the first end of the second relay is connected to the second end of the second relay, at this time, the control end of the first sub-switch and the control end of the second sub-switch both receive the conduction voltage output from the control voltage end and are turned on, and the first adsorption unit and the second adsorption unit start working at the same time to fix the first size wafer. If the wafer is a wafer of the second size, the control module first outputs the second control signal to the first relay, so that the first end of the first relay is connected to the third end of the first relay, and the control module then outputs the fourth control signal to the second relay, so that the first end of the second relay is connected to the third end of the second relay, at this time, only the control end of the second sub-switch receives the conduction voltage output from the control voltage end and is turned on, and the second adsorption unit starts working to fix the second size wafer.

[0032] It should be noted that the first size of 8 inches and the second size of 6 inches are only examples, and the specific wafer size needs to be determined according to actual conditions and is not specifically limited here.

[0033] In some embodiments, the first adsorption unit includes a first annular chuck; and the second adsorption unit includes a second annular chuck.

[0034] The first pole of the first annular chuck is connected to the negative terminal of the first power supply through the first sub-switch, and the second pole of the first annular chuck is connected to the positive terminal of the first power supply through the first sub-switch; the first pole of the second annular chuck is connected to the negative terminal of the first power supply through the second sub-switch, and the second pole of the second annular chuck is connected to the positive terminal of the first power supply through the second sub-switch; wherein the diameter of the first annular chuck is greater than the diameter of the second annular chuck, the first annular chuck and the second annular chuck are nested, and the first annular chuck and the second annular chuck are used to adsorb the wafer when connected to the first power supply.

[0035] Specifically, the diameter of the first annular chuck is greater than the diameter of the second annular chuck, and the second annular chuck is nested in the inner ring of the first annular chuck. The first annular chuck and the second annular chuck are used to adsorb and fix the wafer after being connected to the first power supply. The first annular chuck and the second annular chuck both include a first dielectric layer and a first electrode, and the first dielectric layer and the first electrode can be equivalent to a capacitor with the wafer when powered on. After the first annular chuck and the second annular chuck are connected to the first power supply, the alternating current output by the first power supply will charge the equivalent capacitor formed by the first dielectric layer and the first electrode and the wafer, thereby generating an induced charge to realize the adsorption of the wafer by the first annular chuck and the second annular chuck. After the first annular chuck and the second annular chuck fix the wafer, the connection between the first power supply and the first annular chuck and the second annular chuck is cut off. At this time, the charge in the equivalent capacitor cannot be released, so the wafer can be continuously adsorbed.

[0036] During the test of the first size wafer, the control module first outputs the second control signal to the first relay, so that the first end of the first relay is connected to the third end of the first relay, and then the control module outputs the third control signal to the second relay, so that the first end of the second relay is connected to the second end of the second relay. At this time, the control end of the first sub-switch and the control end of the second sub-switch both receive the conduction voltage output from the control voltage end and are turned on, so that the connection between the first annular chuck and the second annular chuck and the first power supply is turned on, and the adsorption and fixation of the first size wafer is realized. After completing the fixation of the first size wafer, the control module stops outputting the second control signal to the first relay. After the first switch unit is disconnected, the control module outputs the first control signal to the first relay, so that the first end of the first relay is connected to the second end. The control voltage end outputs the conduction voltage to the control end of the second switch unit through the first relay, so that the second switch unit is turned on, so that the power supply stops cutting off the adsorption module first, and then starts to supply power to the pressurization module.

[0037] During the test of the second size wafer, the control module first outputs the second control signal to the first relay, so that the first end of the first relay is connected to the third end of the first relay, and then the control module outputs the fourth control signal to the second relay, so that the first end of the second relay is connected to the third end of the second relay. At this time, the control end of the second sub-switch receives the conduction voltage output from the control voltage end and is turned on, so that the connection between the second annular chuck and the first power supply is turned on, and the adsorption and fixation of the second size wafer is realized. After completing the fixation of the second size wafer, the control module stops outputting the second control signal to the first relay. After the first switch unit is disconnected, the control module outputs the first control signal to the first relay, so that the first end of the first relay is connected to the second end. The control voltage end outputs the conduction voltage to the control end of the second switch unit through the first relay, so that the second switch unit is turned on, so that the power supply stops cutting off the adsorption module first, and then starts to supply power to the pressurization module.

[0038] The pressurizing module starts to pressurize the wafer, thereby reducing the energy of the electron beam and protecting the wafer. Since the withstand voltage of the first dielectric layer of the first annular chuck and the second annular chuck is limited, the connection between the pressurizing module and the power supply will not be turned on while the connection between the first power supply and the first annular chuck and the second annular chuck is turned on, which can avoid the problem of the first dielectric layer being broken down by high voltage due to the first annular chuck and the second annular chuck working simultaneously with the pressurizing module, thereby protecting the first annular chuck and the second annular chuck. And in the present disclosure, when the voltage applied to the wafer by the pressurizing module, the connection between the first annular chuck and the second annular chuck and the first power supply has been disconnected, so the signal noise carried by the first annular chuck and the second annular chuck during operation is also cut off, thereby avoiding the influence of the signal noise on the voltage of the wafer, thereby avoiding the influence on the test result and ensuring the accuracy of the test.

[0039] In some embodiments, the pressurizing module includes a pressurizing probe; the pressurizing probe is connected to the second power supply through the switching module, and the pressurizing probe is used to connect to the wafer when the adsorption module fixes the wafer; the switching module is used to connect the second power supply and the pressurizing probe; the pressurizing probe is used to apply voltage to the wafer when connected to the second power supply.

[0040] Specifically, during the test, the switch module will first connect the power supply to the adsorption module, so that the adsorption module adsorbs and fixes the wafer. After the wafer is fixed, the pressure probe is connected to the wafer. At this time, the switch module first cuts off the connection between the power supply and the adsorption module, and then connects the connection between the second power supply and the pressure probe, so that the second power supply applies voltage to the wafer through the pressure probe, thereby reducing the energy of the electron beam and protecting the wafer.

[0041] In some embodiments, the pressurizing module includes a protection unit; a first end of the protection unit is connected to the pressurizing probe, and a second end of the protection unit is connected to the second power supply through the switch module.

[0042] Specifically, the second power supply is connected to the pressure probe through the protection unit. The protection unit can avoid the problem of excessive voltage when the second power supply is connected to the pressure probe, thereby damaging the wafer, thereby protecting the wafer.

[0043] In some embodiments, the protection unit includes a protection resistor; a first end of the protection resistor is connected to the pressure probe, and a second end of the protection resistor is connected to the second power supply through a switch module.

[0044] Specifically, the second power supply is connected to the pressure probe through a protective resistor. The voltage applied by the second power supply can be divided through the protective resistor to avoid damage to the wafer due to excessive voltage when the second power supply is connected to the pressure probe, thereby protecting the wafer.

[0045] Figure 2 A schematic diagram of a preferred wafer fixing device provided in an embodiment of the present disclosure is shown in FIG. Figure 2 As shown, the wafer fixing device includes a first annular chuck 110 , a second annular chuck 120 , a pressurizing probe 210 , a protection unit 220 , a first sub-switch 311 , a second sub-switch 312 , a second switch unit 320 , a first relay 330 and a second relay 340 .

[0046] The first end 331 of the first relay 330 is connected to the control voltage end 501, the second end 332 of the first relay 330 is connected to the control end of the second switch unit 320, the third end 333 of the first relay 330 is connected to the first end 341 of the second relay 340, the second end 342 of the second relay 340 is connected to the control end of the first sub-switch 311 and the control end of the second sub-switch 312, the third end 343 of the second relay 340 is connected to the control end of the second sub-switch 312, the control end 334 of the first relay 330 is connected to the control module 600, and the control end 344 of the second relay 340 is connected to the control module 600.

[0047] The first pole 111 of the first annular chuck 110 is connected to the first power source 510 through the first sub-switch 311, and the second pole 112 of the first annular chuck 110 is connected to the first power source 510 through the first sub-switch 311; the first pole 121 of the second annular chuck 120 is connected to the first power source 510 through the second sub-switch 312, and the second pole 122 of the second annular chuck 120 is connected to the first power source 510 through the second sub-switch 312. The second power source 520 is connected to the first end of the protection unit 220 through the second switch unit 320, and the second end of the protection unit 220 is connected to the pressurization probe 210.

[0048] Specifically, during the test, the control module 600 first outputs the second control signal to the control terminal 334 of the first relay 330, so that the first terminal 331 of the first relay 330 is connected to the third terminal 333, and the voltage provided by the control voltage terminal 501 is output to the first terminal 341 of the second relay 340. The control module 600 also selects to output the third control signal or the fourth control signal according to the size of the wafer 400.

[0049] When the wafer 400 is a wafer of the first size, the control module 600 outputs a third control signal, the first end 341 of the second relay 340 is connected to the second end 342, the first sub-switch 311 and the second sub-switch 312 are turned on, the first annular chuck 110 and the second annular chuck 120 are both connected to the first power supply 510, the first annular chuck 110 and the second annular chuck 120 adsorb and fix the wafer 400, and the pressure probe 210 is connected to the wafer 400.

[0050] When the wafer 400 is a second-size wafer, the control module 600 outputs a fourth control signal, the first end 341 of the second relay 340 is connected to the third end 343, the second sub-switch 312 is turned on, and only the second annular chuck 120 is connected to the first power supply 510. The second annular chuck 120 adsorbs and fixes the wafer 400. At this time, the pressure probe 210 is connected to the wafer 400.

[0051] After the wafer 400 is fixed, the control module 600 outputs a first control signal to the control terminal 334 of the first relay 330, so that the first terminal 331 of the first relay 330 is connected to the second terminal 332, and the second switch unit 320 is turned on. The second power supply 520 is connected to the pressure probe 210 through the protection unit 220, so that the second power supply 520 starts to apply voltage to the wafer 400 through the pressure probe 210, thereby reducing the energy of the electron beam. Furthermore, since the first relay 330 will not simultaneously connect the first end 331 of the first relay 330 to the second end 332 or the third end 333, the connection between the pressurized probe 210 and the second power source 520 will not be connected while the connection between the first annular chuck 110 and the second annular chuck 120 and the first power source 510 is connected. Instead, after the first annular chuck 110 and the second annular chuck 120 complete the fixation of the wafer 400, the connection between the first annular chuck 110 and the second annular chuck 120 and the first power source 510 is first disconnected, and then the connection between the pressurized probe 210 and the second power source 520 is connected. Therefore, the occurrence of the first annular chuck 110 and the second annular chuck 120 and the second power source 520 being disconnected can be avoided.

[0052] The problem that the dielectric layers of the first annular chuck 110 and the second annular chuck 120 are broken down by high voltage due to the simultaneous operation of the pressure probe 210 and the pressure probe 210 is avoided, thereby protecting the first annular chuck 110 and the second annular chuck 120. In addition, when the voltage is applied to the wafer 400 by the pressure probe 210, the connection between the first annular chuck 110 and the second annular chuck 120 and the first power supply 510 is disconnected, so the signal noise carried by the first annular chuck 110 and the second annular chuck 120 during operation is also isolated, thereby avoiding the influence of the signal noise on the voltage of the wafer 400, thereby avoiding the influence on the test results, and ensuring the accuracy of the test.

[0053] The embodiments of the present disclosure also provide a wafer inspection device, comprising the wafer fixing device as described in any of the above embodiments.

[0054] It can be understood that the wafer inspection equipment provided in the embodiment of the present application can achieve the corresponding beneficial effects of the wafer fixing device provided in the above-mentioned embodiment, which will not be elaborated here.

[0055] Figure 3 A schematic flow chart of a wafer fixing method provided in an embodiment of the present disclosure, wherein the wafer fixing method is applied to the wafer fixing device as described in any of the above embodiments; Figure 3 As shown, the wafer fixing method includes: S610 and S620.

[0056] S610, controlling the switch module to connect the adsorption module to the power supply.

[0057] S620 , when the adsorption module fixes the wafer, controlling the switch module to connect the pressurizing module to the power supply.

[0058] Specifically, the control module controls the switch module to connect the adsorption module with the power supply, the adsorption module starts to work to adsorb and fix the wafer, and the pressure module is connected to the wafer after the wafer is fixed. At this time, the switch module first cuts off the connection between the power supply and the adsorption module, and then connects the connection between the power supply and the pressure module, so that the pressure module starts to apply voltage to the wafer, thereby reducing the energy of the electron beam and protecting the wafer. In addition, the switch module does not simultaneously connect the connection between the adsorption module and the pressure module and the power supply, but after the adsorption module completes the fixation of the wafer, it first disconnects the connection between the adsorption module and the power supply and then connects the connection between the pressure module and the power supply, so that the problem of the adsorption module being broken down due to the simultaneous operation of the adsorption module and the pressure module can be avoided, thereby protecting the adsorption module. In addition, when the pressure module applies a voltage to the wafer through the pressure pin, the connection between the adsorption module and the power supply has been disconnected, so the signal noise carried by the adsorption module is also cut off, thereby avoiding the influence of the signal noise on the voltage of the wafer, thereby avoiding the influence on the test results, and ensuring the accuracy of the test.

[0059] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0060] The above are only specific embodiments of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to these embodiments herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer fixing device, characterized in that: include: Adsorption module, used to fix the wafer; A pressure module, used for applying voltage to the wafer; A switch module, wherein the switch module is connected to the adsorption module and the pressurizing module respectively, and the switch module is used to connect one of the adsorption module and the pressurizing module to a power source at any time.

2. The wafer fixing device according to claim 1, characterized in that: The switch module includes a first switch unit, a second switch unit and a master control switch; The control ends of the first switch unit and the second switch unit are both connected to the master control switch, the first switch unit is connected to the adsorption module, and the second switch unit is connected to the pressurizing module; Among them, the first switch unit is used to connect the adsorption module with the power supply, and the second switch unit is used to connect the pressurizing module with the power supply; the master control switch is used to turn on one of the first switch unit and the second switch unit at the same time.

3. The wafer fixing device according to claim 2, characterized in that: The master control switch includes a first relay; The control end of the first relay is connected to the control module, the first end of the first relay is connected to the control voltage end, the second end of the first relay is connected to the control end of the second switch unit, and the third end of the first relay is connected to the control end of the first switch unit; The first relay is used to connect the first end with the second end when receiving a first control signal, or to connect the first end with the third end when receiving a second control signal.

4. The wafer fixing device according to claim 3, characterized in that: The master control switch also includes a second relay; The adsorption module includes a first adsorption unit and a second adsorption unit; the first switch unit includes a first sub-switch and a second sub-switch; wherein the first adsorption unit and the second adsorption unit are used together to fix a first-size wafer, and the second adsorption unit is used to fix a second-size wafer; the size of the first-size wafer is larger than the size of the second-size wafer; The control end of the second relay is connected to the control module, the first end of the second relay is connected to the third end of the first relay, the second end of the second relay is connected to the control end of the first sub-switch and the control end of the second sub-switch, and the third end of the second relay is connected to the control end of the second sub-switch; wherein the first sub-switch is connected between the first adsorption unit and the power supply, and the second sub-switch is connected between the second adsorption unit and the power supply; The second relay is used to connect the first end with the second end when receiving a third control signal, or to connect the first end with the third end when receiving a fourth control signal.

5. The wafer fixing device according to claim 4, characterized in that: The first adsorption unit includes a first annular chuck; the second adsorption unit includes a second annular chuck; The first pole of the first annular chuck is connected to the negative terminal of the first power supply through the first sub-switch, and the second pole of the first annular chuck is connected to the positive terminal of the first power supply through the first sub-switch; the first pole of the second annular chuck is connected to the negative terminal of the first power supply through the second sub-switch, and the second pole of the second annular chuck is connected to the positive terminal of the first power supply through the second sub-switch; Among them, the diameter of the first annular chuck is greater than the diameter of the second annular chuck, the first annular chuck and the second annular chuck are nested, and the first annular chuck and the second annular chuck are used to adsorb the wafer when connected to the first power supply.

6. The wafer fixing device according to claim 1, characterized in that: The pressurizing module includes a pressurizing probe; The pressurizing probe is connected to the second power supply through the switch module, and the pressurizing probe is used to connect to the wafer when the adsorption module fixes the wafer; The switch module is used to conduct the second power supply and the pressurizing probe; The pressure probe is used to apply voltage to the wafer when connected to the second power supply.

7. The wafer fixing device according to claim 6, characterized in that: The pressurizing module includes a protection unit; The first end of the protection unit is connected to the pressure probe, and the second end of the protection unit is connected to the second power supply through the switch module.

8. The wafer fixing device according to claim 7, characterized in that: The protection unit includes a protection resistor; The first end of the protection resistor is connected to the pressure probe, and the second end of the protection resistor is connected to the second power supply through the switch module.

9. A wafer inspection device, characterized in that: It comprises a wafer fixing device as described in any one of claims 1-8.

10. A wafer fixing method, characterized in that: Applicable to the wafer fixing device as described in any one of claims 1 to 8; The method comprises: Control the switch module to connect the adsorption module to the power supply; When the adsorption module fixes the wafer, the switch module is controlled to connect the pressurizing module to the power supply.

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