Automatic conveying and cleaning equipment and method for wafer cleaning liquid

Abstract

The invention discloses an automatic conveying and cleaning device and method for wafer cleaning fluid, and relates to the technical field of wafer cleaning equipment.The automatic conveying and cleaning device comprises a cleaning equipment body, a cleaning fluid assembly used for providing the cleaning fluid is installed at the top end of a box body so that the cleaning fluid can be supplied in the cleaning process, and a driving assembly is arranged in the box body and used for driving the box body to rotate; the driving assembly is arranged in the box body so as to utilize flowing force of cleaning liquid, the cleaning assembly used for spraying the cleaning liquid is arranged on the side, located on the driving assembly, of the interior of the box body so as to clean materials, and the wafer assembly is installed on the portion, located below the cleaning assembly, of the interior of the box body so as to load the materials. And one side of the wafer assembly is also provided with a guide assembly so as to guide the wafer assembly. According to the wafer cleaning device, by arranging the guide assembly, single-piece type cleaning can be carried out on batch wafers, and therefore the cleaning efficiency of the wafers is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning equipment, in particular to automatic conveying and cleaning equipment for wafer cleaning liquid. Background Art

[0002] With the continuous development of semiconductor technology, the requirements for process technology are getting higher and higher, especially the requirements for the surface quality of wafers are getting stricter and stricter. The wafer manufacturing process has the most cleaning steps and the most cleaning equipment. Cutting, photolithography, etching, deposition, ion implantation, and CMP all require cleaning processes. The quality of wafer cleaning has a serious impact on device performance. In the current integrated circuit production, due to the contamination problem on the surface of the wafer, more than 50% of the material is lost and 80% of the chips fail electrically. Since wafer cleaning is the most important and frequent process in the semiconductor manufacturing process, and as the size decreases and the structure becomes more complicated, the chip's sensitivity to impurity content also increases accordingly, which will directly affect the device's yield, performance and reliability. Therefore, major domestic and foreign companies, research institutions, etc. have been continuously strengthening their research on cleaning processes.

[0003] In the current wafer cleaning process, the processed wafers are placed in a placement frame, transported to the cleaning equipment by a robot, and then cleaned with a cleaning liquid. The above method is called tank washing in the industry. Since tank washing is a unified cleaning method, the cleaning quality of tank washing is low for single wafers and cannot meet the wafer requirements of high-end process chips. For this reason, we propose an automated conveying and cleaning device for wafer cleaning liquid for single-wafer cleaning. Summary of the invention

[0004] Based on this, the purpose of the present invention is to provide an automated conveying and cleaning device for wafer cleaning liquid to solve the technical problems mentioned in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automated conveying and cleaning device for wafer cleaning liquid, comprising a cleaning device, the cleaning device comprising a box body, and a feed port is opened on one side of the box body, a guide rail extending to the outside of the box body is installed inside the box body, and a slide board adapted to the guide rail is installed on the inner side of the guide rail, a placement frame for loading materials is arranged at the top of the slide board, and a hydraulic cylinder is installed below the placement frame, a cleaning liquid assembly for providing cleaning liquid is installed at the top of the box body to realize the supply of cleaning liquid during the cleaning process, a driving assembly is arranged inside the box body to realize the utilization of the flow force of the cleaning liquid, a cleaning assembly for spraying cleaning liquid is arranged on one side of the driving assembly inside the box body to realize the cleaning of the materials, a wafer assembly is installed inside the box body below the cleaning assembly to realize the loading of materials, and a guide assembly is also arranged on one side of the wafer assembly to realize the guidance of the wafer assembly.

[0006] By adopting the above technical solution, batches of wafers can be cleaned in a single wafer manner, thereby significantly improving the cleaning efficiency of the wafers.

[0007] The present invention is further configured such that the cleaning liquid assembly includes a cleaning liquid tank fixed to the top of the box body, and a liquid replenishing port for replenishing the cleaning liquid inside the cleaning liquid tank is opened at the top of the cleaning liquid tank, a water pump is installed on the outside of the cleaning liquid tank on the top end face of the box body, and the input end of the water pump is connected to a water suction pipe extending into the cleaning liquid tank, and the output end of the water pump is connected to a water supply pipe extending to the installation position of the drive assembly, and a plurality of groups of stirring shafts distributed at intervals are also installed inside the cleaning liquid tank, and a plurality of groups of annularly distributed stirring blades are fixedly connected to the outer wall of each group of the stirring shafts, and the plurality of groups of stirring shafts are connected to each other through a transmission turntable and a transmission belt to achieve stirring of the cleaning liquid in the cleaning liquid tank.

[0008] By adopting the above technical solution, the effect of supplying cleaning liquid is achieved.

[0009] The present invention is further configured as follows: the driving assembly includes a power box installed inside the box body, and a water inlet connected to the water pipe is opened at the top of the power box, and a water outlet is opened at the bottom of the power box, a rotating shaft is installed inside the power box, and a plurality of groups of annularly distributed blades are fixedly connected to the outer wall of the rotating shaft, the top of the rotating shaft is synchronously connected to a first driving shaft extending upward, and the first driving shaft is transmission-connected to the stirring shaft installed at the middle position through a transmission turntable and a transmission belt, the bottom end of the rotating shaft is synchronously connected to a second driving shaft extending downward, and the bottom end of the second driving shaft is fixedly connected to a first driving gear, and there are multiple groups of the first driving gears, and the multiple groups of the first driving gears are distributed at intervals.

[0010] By adopting the above technical solution, the driving effect of the wafer assembly and the stirring shaft is achieved.

[0011] The present invention is further configured such that the cleaning component includes a water supply pipe arranged inside the box and connected to the water outlet, and a plurality of groups of nozzles are installed below the water supply pipe, and the top of each group of nozzles is connected to a water outlet pipe connected to the water supply pipe to supply cleaning liquid to the nozzles.

[0012] By adopting the above technical solution, the cleaning effect of the wafer is achieved.

[0013] The present invention is further configured as follows: the wafer assembly includes a bottom plate, and vertical plates are fixed on both sides of the bottom plate, a base is arranged between the two groups of vertical plates, and the inner side of the base clamps the wafer, the bottom end of the base is fixedly connected to a connecting shaft extending to the inside of the bottom plate, and the connecting shaft is rotatably connected to the inner wall of the bottom plate, the side wall of the bottom plate is installed with a first driven gear connected to the connecting shaft through a transmission turntable and a transmission belt, and the first driven gear is meshed with the first driving gear, the inner end face of the vertical plate is fixed with a driving tooth plate, and the top end of the driving tooth plate is meshed with the second driven gear, and the end of the second driven gear is fixedly connected with a transmission shaft extending to the inside of the base, the end of the transmission shaft is fixedly connected with the second driving gear, and one side of the second driving gear is meshed with the third driven gear, the inner walls on both sides of the base are respectively installed with a first driving wheel and a second driving wheel for driving the wafer to rotate, and the first driving wheel is transmission-connected to the third driven gear through the transmission turntable and the transmission belt, and the second driving wheel is transmission-connected to the second driving gear through the transmission turntable and the transmission belt.

[0014] By adopting the above technical solution, the installation and driving effect of the wafer is achieved.

[0015] The present invention is further configured such that the guide assembly includes a load-bearing plate slidably connected to the inner wall of the placement frame, and a guide plate fixedly connected to the inner wall of the box is arranged on the outer side of the load-bearing plate, a guide groove is opened on the end face of the guide plate, and a guide rod extending to the inside of the vertical plate is slidably connected in the inner wall of the guide groove, the guide rod is slidably reset connected to the inner wall of the vertical plate through a slide groove and a spring, and a multi-stage telescopic rod is connected between every two groups of the bottom plates.

[0016] By adopting the above technical solution, the guiding effect of the wafer is achieved.

[0017] A cleaning method for an automated wafer cleaning fluid delivery cleaning device comprises the following steps;

[0018] S1. First, pure water and Diamaflow cutting fluid are mixed evenly in equal proportions to prepare a cleaning fluid;

[0019] S2. Next, the cleaning liquid is injected into the cleaning liquid tank, and then the placement frame loaded with the wafers is placed on the slide and transported to the cleaning station via the guide rail;

[0020] S3. Further, the water pump and the hydraulic cylinder are started. The hydraulic cylinder drives the wafers in the placement frame to move upward and present a large spacing distribution under the action of the guide assembly, and the water pump pumps the cleaning liquid from the cleaning liquid tank and sprays it through the nozzle to achieve the cleaning of the wafers. During the cleaning process, the wafer assembly and the drive assembly work together to achieve the compound movement of the wafer, thereby improving the cleaning quality of the wafer;

[0021] S4. Finally, the hydraulic cylinder is started to reset, and the wafer in the unfolded state is stored back into the placement frame and unloaded through the guide rail.

[0022] In summary, the present invention mainly has the following beneficial effects:

[0023] 1. The present invention sets a guide component, a cleaning liquid component and a cleaning component. First, pure water and Diamaflow cutting fluid are uniformly mixed in equal proportions to form a cleaning liquid and injected into the cleaning liquid tank through a liquid replenishing port. Subsequently, a placement frame loaded with wafers is placed on a slide and transported to a cleaning station through a guide rail. Further, a water pump and a hydraulic cylinder are started. The hydraulic cylinder drives the carrier plate in the placement frame to move upward, and the carrier plate then drives the wafer to move upward. When the guide rod installed inside the vertical plate moves out of the placement frame, the guide rod pops out and moves to the guide groove in the guide plate under the action of a spring. As the carrier plate continues to move, the guide rod drives the bottom plate to move outward under the action of the guide groove. When the carrier plate stops moving, a large spacing distribution is formed between multiple bottom plates, thereby realizing a large spacing distribution between wafers. At the same time, the water pump draws cleaning liquid from the cleaning liquid tank into a water supply pipe, and the nozzle draws cleaning liquid from the water supply pipe through a connecting pipe and sprays it onto the outer wall of the wafer, thereby realizing single-wafer cleaning of the wafer and significantly improving the cleaning quality of the wafer.

[0024] 2. The present invention provides a driving assembly and a wafer assembly. In the process of the cleaning liquid flowing from the cleaning liquid tank to the water supply pipe, the cleaning liquid will pass through the driving assembly and drive the driving assembly to operate. Specifically, the cleaning liquid will flow into the power box through the water delivery pipe and the water inlet of the water pump, and be discharged from the water outlet of the power box. In this process, the cleaning liquid will drive the blades to rotate. After the blades rotate, they will drive the rotating shaft to rotate. The rotation of the rotating shaft will drive both the first driving shaft and the second driving shaft to rotate. After the first driving shaft rotates, it will drive the stirring shaft to rotate, so that the stirring shaft drives the stirring blades to rotate. After the stirring blades rotate, the cleaning liquid can be stirred and mixed, thereby preventing the problem of stratification of the cleaning liquid and causing deterioration of the wafer cleaning quality. After the second driving shaft rotates, it will drive the first driving gear to rotate. After the first driving gear rotates, it will drive the connecting shaft to rotate through the transmission action. The second driven gear drives the transmission shaft to rotate, and the driven shaft then drives the second driving gear to rotate. The second driving gear drives the third driven gear to rotate through meshing. At this time, under the action of the second driving gear and the third driven gear, both the first driving wheel and the second driving wheel rotate, thereby driving the wafer. Therefore, the wafer rotates slowly in the base, and the wafer rotates under the action of the connecting shaft, forming a resetting motion of the wafer, which is beneficial for the cleaning liquid to clean the wafer in all directions, and can also effectively prevent the base from having a cleaning blind spot due to clamping the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0027] Figure 3 It is a schematic diagram of the structure of the guide assembly of the present invention;

[0028] Figure 4 It is a schematic diagram of the structure of the driving assembly of the present invention;

[0029] Figure 5 It is a schematic diagram of the power box structure of the present invention;

[0030] Figure 6 It is a schematic diagram of the internal structure of the power box of the present invention;

[0031] Figure 7 It is a schematic diagram of the structure of the wafer mounting assembly of the present invention;

[0032] Figure 8It is a schematic diagram of the wafer driving structure of the present invention.

[0033] In the figure: 1. cleaning equipment; 101. box; 102. feed port; 103. guide rail; 104. slide plate; 105. placement frame; 106. hydraulic cylinder; 2. cleaning liquid assembly; 201. cleaning liquid tank; 202. liquid replenishing port; 203. water pump; 204. water pumping pipe; 205. water pipe; 206. stirring shaft; 207. stirring blade; 3. driving assembly; 301. power box; 302. water inlet; 303. water outlet; 304. rotating shaft; 305. blade; 306. first driving shaft; 307. second driving shaft; 308. first driving gear; 4. cleaning Cleaning assembly; 401, water supply pipe; 402, water outlet pipe; 403, nozzle; 5, wafer assembly; 501, bottom plate; 502, vertical plate; 503, base; 504, wafer; 505, connecting shaft; 506, first driven gear; 507, driving gear plate; 508, second driven gear; 509, transmission shaft; 510, second driving gear; 511, third driven gear; 512, first driving wheel; 513, second driving wheel; 6, guide assembly; 601, bearing plate; 602, guide plate; 603, guide rod; 604, guide groove; 605, multi-stage telescopic rod. DETAILED DESCRIPTION

[0034] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] The following describes an embodiment of the present invention based on its overall structure.

[0036] Automated delivery and cleaning equipment for wafer cleaning fluids, such as Figure 1-Figure 8 As shown, the cleaning device 1 includes a box body 101, and a feed port 102 is opened on one side of the box body 101, a guide rail 103 extending to the outside of the box body 101 is installed inside the box body 101, and a slide plate 104 adapted to the guide rail 103 is installed on the inner side of the guide rail 103, a placement frame 105 for loading materials is arranged at the top of the slide plate 104, and a hydraulic cylinder 106 is installed below the placement frame 105.

[0037] See also Figure 1-Figure 2 , a cleaning liquid assembly 2 for providing cleaning liquid is installed at the top of the box 101 to realize the supply of cleaning liquid during the cleaning process;

[0038] Specifically, the cleaning liquid component 2 includes a cleaning liquid tank 201 fixed on the top of the box body 101, and a liquid replenishing port 202 for replenishing the cleaning liquid in the cleaning liquid tank 201 is opened at the top of the cleaning liquid tank 201. A water pump 203 is installed on the outer side of the cleaning liquid tank 201 on the top end face of the box body 101, and the input end of the water pump 203 is connected to a water suction pipe 204 extending into the cleaning liquid tank 201, and the output end of the water pump 203 is connected to a water delivery pipe 205 extending to the installation position of the drive component 3. A plurality of groups of stirring shafts 206 distributed at intervals are also installed inside the cleaning liquid tank 201, and the outer wall of each group of stirring shafts 206 is fixedly connected to a plurality of groups of annularly distributed stirring blades 207, and the plurality of stirring shafts 206 are connected to each other through a transmission turntable and a transmission belt to achieve stirring of the cleaning liquid in the cleaning liquid tank 201.

[0039] See also Figure 2 as well as Figure 4-Figure 6 , a driving assembly 3 is provided inside the box 101 to realize the utilization of the flow force of the cleaning liquid;

[0040] Specifically, the driving assembly 3 includes a power box 301 installed inside the box body 101, and a water inlet 302 connected to the water pipe 205 is opened at the top of the power box 301, and a water outlet 303 is opened at the bottom of the power box 301, a rotating shaft 304 is installed inside the power box 301, and the outer wall of the rotating shaft 304 is fixedly connected to multiple groups of annularly distributed blades 305, the top of the rotating shaft 304 is synchronously connected to a first driving shaft 306 extending upward, and the first driving shaft 306 is transmission-connected to the stirring shaft 206 installed at the middle position through a transmission turntable and a transmission belt, the bottom end of the rotating shaft 304 is synchronously connected to a second driving shaft 307 extending downward, and the bottom end of the second driving shaft 307 is fixedly connected to a first driving gear 308, and there are multiple groups of first driving gears 308, and the multiple groups of first driving gears 308 are distributed at intervals.

[0041] See also Figure 2 and Figure 4 A cleaning component 4 for spraying cleaning liquid is provided on one side of the driving component 3 inside the box 101 to clean the material;

[0042] Specifically, the cleaning component 4 includes a water supply pipe 401 arranged inside the box 101 and connected to the water outlet 303, and a plurality of groups of nozzles 403 are installed below the water supply pipe 401. The top of each group of nozzles 403 is connected to a water outlet pipe 402 connected to the water supply pipe 401 to supply cleaning liquid to the nozzles 403.

[0043] See also Figure 3 , Figure 7 as well as Figure 8, a wafer assembly 5 is installed inside the box 101 below the cleaning assembly 4 to achieve loading of materials;

[0044] Specifically, the wafer assembly 5 includes a bottom plate 501, and vertical plates 502 are fixed on both sides of the bottom plate 501, a base 503 is arranged between the two groups of vertical plates 502, and the inner side of the base 503 clamps the wafer 504, the bottom end of the base 503 is fixedly connected with a connecting shaft 505 extending to the inside of the bottom plate 501, and the connecting shaft 505 is rotatably connected to the inner wall of the bottom plate 501, and the side wall of the bottom plate 501 is installed with a first driven gear 506 connected to the connecting shaft 505 through a transmission turntable and a transmission belt, and the first driven gear 506 is meshed with the first driving gear 308, and the inner end surface of the vertical plate 502 is fixed with a driving gear plate 507, and the driving gear plate 507 The top of the base 503 is meshed with a second driven gear 508, and the end of the second driven gear 508 is fixedly connected to a transmission shaft 509 extending to the inside of the base 503, the end of the transmission shaft 509 is fixedly connected to a second driving gear 510, and one side of the second driving gear 510 is meshed with a third driven gear 511, and the inner walls on both sides of the base 503 are respectively installed with a first driving wheel 512 and a second driving wheel 513 for driving the wafer 504 to rotate, and the first driving wheel 512 is connected to the third driven gear 511 through a transmission turntable and a transmission belt, and the second driving wheel 513 is connected to the second driving gear 510 through a transmission turntable and a transmission belt.

[0045] See also Figure 2-3 A guide assembly 6 is also provided on one side of the wafer assembly 5 to guide the wafer assembly 5;

[0046] Specifically, the guide assembly 6 includes a supporting plate 601 which is slidably connected to the inner wall of the placement frame 105, and a guide plate 602 which is fixedly connected to the inner wall of the box body 101 is arranged on the outer side of the supporting plate 601, a guide groove 604 is opened on the end face of the guide plate 602, and a guide rod 603 which extends to the inside of the vertical plate 502 is slidably connected in the inner wall of the guide groove 604, and the guide rod 603 is slidably reset connected to the inner wall of the vertical plate 502 through a slide groove and a spring, and a multi-stage telescopic rod 605 is connected between every two groups of bottom plates 501.

[0047] The working principle of the present invention is as follows: first, pure water and Diamaflow cutting fluid are uniformly mixed in equal proportions to form a cleaning fluid and injected into the cleaning fluid tank 201 through the fluid replenishing port 202, then, the placement frame 105 loaded with the wafer 504 is placed on the slide 104 and transported to the cleaning station through the guide rail 103;

[0048] Further, the water pump 203 and the hydraulic cylinder 106 are started, and the hydraulic cylinder 106 drives the carrier plate 601 in the placement frame 105 to move upward, and the carrier plate 601 then drives the wafer 504 to move upward. When the guide rod 603 installed inside the vertical plate 502 moves out of the placement frame 105, the guide rod 603 pops out and moves to the guide groove 604 in the guide plate 602 under the action of the spring. As the carrier plate 601 continues to move, the guide rod 603 drives the bottom plate 501 to move outward under the action of the guide groove 604. When the carrier plate 601 stops moving, a large spacing distribution is formed between the multiple bottom plates 501, thereby achieving a large spacing distribution between the wafers 504.

[0049] At the same time, the water pump 203 draws the cleaning liquid from the cleaning liquid tank 201 into the water supply pipe 401, and the nozzle 403 draws the cleaning liquid from the water supply pipe 401 through the water outlet pipe 402 and sprays it onto the outer wall of the wafer 504, thereby achieving single-chip cleaning of the wafer 504 and significantly improving the cleaning quality of the wafer 504;

[0050] Furthermore, in the process of the cleaning liquid flowing from the cleaning liquid tank 201 to the water supply pipe 401, the cleaning liquid will pass through the driving assembly 3 and drive the driving assembly 3 to operate. Specifically, the cleaning liquid will flow into the power box 301 through the water delivery pipe 205 and the water inlet 302 of the water pump 203, and will be discharged from the water outlet 303 of the power box 301. In this process, the cleaning liquid will drive the blades 305 to rotate, and the rotation of the blades 305 will drive the rotating shaft 304 to rotate. The rotation of the rotating shaft 304 will drive the first driving shaft 306 and the second driving shaft 307 to rotate.

[0051] The first driving shaft 306 rotates to drive the stirring shaft 206 to rotate, so that the stirring shaft 206 drives the stirring blade 207 to rotate. The stirring blade 207 rotates to stir and mix the cleaning liquid, thereby preventing the cleaning liquid from being stratified and causing the cleaning quality of the wafer 504 to deteriorate.

[0052] The second driving shaft 307 rotates and drives the first driving gear 308 to rotate. The first driving gear 308 rotates and drives the first driven gear 506 to rotate through meshing. The first driven gear 506 drives the connecting shaft 505 to rotate through transmission. Therefore, the base 503 drives the wafer 504 to rotate and clean under the action of the connecting shaft 505.

[0053] Furthermore, during the rotation of the base 503, the second driven gear 508 on its outer side will contact the driving gear plate 507 during the rotation, so the driving gear plate 507 will drive the second driven gear 508 to rotate, and after the second driven gear 508 rotates, it will drive the transmission shaft 509 to rotate, and the transmission shaft 509 will then drive the second driving gear 510 to rotate, and the second driving gear 510 will drive the third driven gear 511 to rotate through the meshing action. At this time, under the action of the second driving gear 510 and the third driven gear 511, the first driving wheel 512 and the second driving wheel 513 will both rotate, thereby realizing the driving of the wafer 504. Therefore, the wafer 504 rotates slowly in the base 503, and the rotation of the wafer 504 under the action of the connecting shaft 505 is combined to form a compound movement of the wafer 504, which is beneficial for the cleaning liquid to clean the wafer 504 in all directions, and can also effectively prevent the base 503 from having a cleaning blind spot due to clamping the wafer 504.

[0054] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. An automated conveying cleaning device for wafer cleaning liquid, comprising a cleaning device (1), characterized in that: The cleaning device (1) comprises a box (101), and a material inlet (102) is provided on one side of the box (101); a guide rail (103) extending to the outside of the box (101) is installed inside the box (101), and a slide plate (104) adapted to the guide rail (103) is installed inside the guide rail (103); a placement frame (105) for loading materials is provided at the top of the slide plate (104), and a hydraulic cylinder (106) is installed below the placement frame (105); A cleaning liquid assembly (2) for providing cleaning liquid is installed at the top of the box (101) to realize the supply of cleaning liquid during the cleaning process. A driving assembly (3) is arranged inside the box (101) to realize the utilization of the flow force of the cleaning liquid. A cleaning assembly (4) for spraying cleaning liquid is arranged inside the box (101) on one side of the driving assembly (3) to realize the cleaning of materials. A wafer assembly (5) is installed inside the box (101) below the cleaning assembly (4) to realize the loading of materials. A guiding assembly (6) is also arranged on one side of the wafer assembly (5) to realize the guidance of the wafer assembly (5).

2. The automatic conveying and cleaning equipment for wafer cleaning liquid according to claim 1, characterized in that: The cleaning liquid assembly (2) comprises a cleaning liquid tank (201) fixed to the top of the box body (101), and a liquid replenishing port (202) for replenishing the cleaning liquid in the cleaning liquid tank (201) is provided at the top of the cleaning liquid tank (201), a water pump (203) is installed on the outer side of the cleaning liquid tank (201) on the top end surface of the box body (101), and the input end of the water pump (203) is connected to a water pumping pipe (204) extending into the cleaning liquid tank (201), and the output end of the water pump (203) is connected to a water delivery pipe (205) extending to the installation position of the drive assembly (3).

3. The automatic conveying and cleaning equipment for wafer cleaning liquid according to claim 2, characterized in that: The cleaning liquid tank (201) is also provided with a plurality of stirring shafts (206) distributed at intervals, and the outer wall of each group of stirring shafts (206) is fixedly connected with a plurality of stirring blades (207) distributed in an annular pattern, and the plurality of stirring shafts (206) are connected to each other via a transmission turntable and a transmission belt, so as to achieve stirring of the cleaning liquid in the cleaning liquid tank (201).

4. The automatic conveying and cleaning equipment for wafer cleaning liquid according to claim 3, characterized in that: The driving assembly (3) comprises a power box (301) installed inside the box body (101), and a water inlet (302) connected to a water pipe (205) is provided at the top of the power box (301), and a water outlet (303) is provided at the bottom of the power box (301). A rotating shaft (304) is installed inside the power box (301), and a plurality of groups of annularly distributed blades (305) are fixedly connected to the outer wall of the rotating shaft (304).

5. The automatic conveying and cleaning equipment for wafer cleaning liquid according to claim 4, characterized in that: The top end of the rotating shaft (304) is synchronously connected to a first driving shaft (306) extending upward, and the first driving shaft (306) is transmission-connected to the stirring shaft (206) installed at the middle position through a transmission turntable and a transmission belt, and the bottom end of the rotating shaft (304) is synchronously connected to a second driving shaft (307) extending downward, and the bottom end of the second driving shaft (307) is fixedly connected to a first driving gear (308), and there are multiple groups of the first driving gears (308), and the multiple groups of the first driving gears (308) are distributed at intervals.

6. The automatic conveying and cleaning equipment for wafer cleaning liquid according to claim 4, characterized in that: The cleaning component (4) comprises a water supply pipe (401) arranged inside the box (101) and connected to the water outlet (303), and a plurality of groups of nozzles (403) are installed below the water supply pipe (401), and the top of each group of nozzles (403) is connected to a water outlet pipe (402) connected to the water supply pipe (401), so as to supply cleaning liquid to the nozzles (403).

7. The automatic conveying and cleaning equipment for wafer cleaning liquid according to claim 5, characterized in that: The wafer assembly (5) comprises a bottom plate (501), and vertical plates (502) are fixed on both sides of the bottom plate (501), a base (503) is arranged between the two groups of vertical plates (502), and the inner side of the base (503) clamps the wafer (504), the bottom end of the base (503) is fixedly connected with a connecting shaft (505) extending to the inside of the bottom plate (501), and the connecting shaft (505) is rotatably connected to the inner wall of the bottom plate (501), and the side wall of the bottom plate (501) is installed with a first driven gear (506) connected to the connecting shaft (505) through a transmission turntable and a transmission belt, and the first driven gear (506) is meshingly connected with the first driving gear (308).

8. The automatic conveying and cleaning equipment for wafer cleaning liquid according to claim 7, characterized in that: A driving tooth plate (507) is fixed to the inner end surface of the vertical plate (502), and the top end of the driving tooth plate (507) is meshedly connected to the second driven gear (508), and the end of the second driven gear (508) is fixedly connected to a transmission shaft (509) extending to the inside of the base (503), and the end of the transmission shaft (509) is fixedly connected to a second driving gear (510), and one side of the second driving gear (510) is meshedly connected to a third driven gear (511), and the inner walls on both sides of the base (503) are respectively installed with a first driving wheel (512) and a second driving wheel (513) for driving the wafer (504) to rotate, and the first driving wheel (512) is connected to the third driven gear (511) through a transmission turntable and a transmission belt, and the second driving wheel (513) is connected to the second driving gear (510) through a transmission turntable and a transmission belt.

9. The automatic conveying and cleaning equipment for wafer cleaning liquid according to claim 7, characterized in that: The guide assembly (6) comprises a bearing plate (601) slidably connected to the inner wall of the placement frame (105), and a guide plate (602) fixedly connected to the inner wall of the box body (101) is arranged on the outer side of the bearing plate (601), a guide groove (604) is provided on the end surface of the guide plate (602), and a guide rod (603) extending to the inside of the vertical plate (502) is slidably connected in the inner wall of the guide groove (604), and the guide rod (603) is slidably resetably connected to the inner wall of the vertical plate (502) through a sliding groove and a spring, and a multi-stage telescopic rod (605) is connected between each two groups of the bottom plates (501).

10. A cleaning method for an automated wafer cleaning liquid delivery cleaning device, characterized in that The process of using the automated conveying and cleaning equipment for wafer cleaning liquid according to any one of claims 1 to 9 comprises the following steps: S1. First, pure water and Diamaflow cutting fluid are mixed evenly in equal proportions to prepare a cleaning fluid; S2. Next, the cleaning liquid is injected into the cleaning liquid tank, and then the placement frame loaded with the wafers is placed on the slide and transported to the cleaning station via the guide rail; S3. Further, the water pump and the hydraulic cylinder are started. The hydraulic cylinder drives the wafers in the placement frame to move upward and present a large spacing distribution under the action of the guide assembly, and the water pump pumps the cleaning liquid from the cleaning liquid tank and sprays it through the nozzle to achieve the cleaning of the wafers. During the cleaning process, the wafer assembly and the drive assembly work together to achieve the compound movement of the wafer, thereby improving the cleaning quality of the wafer; S4. Finally, the hydraulic cylinder is started to reset, and the wafer in the unfolded state is stored back into the placement frame and unloaded through the guide rail.

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