Automatic feeding and discharging device for semiconductor wafers

Abstract

The invention relates to the field of semiconductor processing, and discloses a semiconductor wafer automatic feeding and discharging device which comprises a lifting mechanism and an equidistant adjusting mechanism, the lifting mechanism comprises a mounting seat, track strips are vertically and symmetrically arranged on the surface of the mounting seat, and sliding seats are slidably mounted on the surfaces of the two track strips; a lifting air cylinder used for controlling the sliding seat is vertically mounted on the inner side of the mounting seat, a rotating telescopic mechanism is mounted at the top of the lifting mechanism and comprises a rotating seat fixed to the upper surface of the sliding seat, a cross beam is transversely arranged on the upper surface of the rotating seat, and a telescopic rod is slidably mounted on the upper surface of the cross beam; and the equidistant adjusting mechanism is mounted at the end part of the telescopic rod, comprises a turntable arranged below the end part of the telescopic rod, and can be used for adjusting the orientation after the wafer is adsorbed so as to adapt to a complicated loading and unloading environment, and can be used for rotating the wafer at a certain angle after the wafer is adsorbed so as to adapt to accurate loading and unloading of non-full-round materials.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to an automatic loading and unloading device for semiconductor wafers. Background Art

[0002] Semiconductor wafers refer to silicon chips used to make silicon semiconductor circuits, and their original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, silicon crystal rods are formed into silicon wafers, that is, wafers. Wafers need to be transferred one by one during the grinding, polishing and other processing processes. In order to improve production efficiency, the existing technology mostly uses automation to load and unload wafers. Wafers are a kind of round wafer structure with a smooth surface, so most of them are realized by adsorption when loading and unloading them automatically.

[0003] The sizes of wafers processed vary depending on the environment in which they are used. Common sizes include 6 inches (φ152.4mm), 8 inches (φ203.2mm) and 12 inches (φ304.8mm). The size difference is large. In order to better adsorb the wafers, the common loading and unloading structure mostly uses 3 or 4 suction heads, and the position of the suction heads is a fixed structure. This makes it unable to adapt to the loading and unloading of wafers of different sizes and needs to be re-adjusted according to different production sizes. The adsorption loading method requires that the top of the working area remain empty, which limits the loading and unloading. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides an automatic loading and unloading device for semiconductor wafers, which solves the problem of quickly adjusting the position of the suction head and ensuring the adsorption strength.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: an automatic loading and unloading device for semiconductor wafers, comprising a lifting mechanism and an equidistant adjustment mechanism, the lifting mechanism comprising a mounting seat, a surface of the mounting seat is vertically symmetrically provided with track bars, two surfaces of the track bars are slidably provided with slide seats, and a lifting cylinder for controlling the slide seat is vertically provided inside the mounting seat;

[0006] A rotating telescopic mechanism is installed on the top of the lifting mechanism, and the rotating telescopic mechanism includes a rotating seat fixed on the upper surface of the sliding seat, the upper surface of the rotating seat is transversely arranged with a crossbeam, a telescopic rod is slidably installed on the upper surface of the crossbeam, and the equidistant adjustment mechanism is installed at the end of the telescopic rod;

[0007] The equidistant adjustment mechanism comprises a turntable placed below the end of the telescopic rod, a rotating shaft is arranged at the center of the upper surface of the turntable, the rotating shaft rotates at the end of the telescopic rod, a limiting plate A is arranged on the top of the rotating shaft, and the bottom surface of the limiting plate is movably fitted with the upper surface of the telescopic rod;

[0008] Three suction mechanisms are evenly and slidably mounted on the lower surface of the equidistant adjustment mechanism, and the equidistant adjustment mechanism is used to synchronously adjust the positions of the three suction mechanisms;

[0009] The front end of the turntable is also provided with a clamping mechanism, which is used to clamp the wafer from the side.

[0010] Furthermore, teeth grooves are evenly formed on the upper side of the turntable surface, a driving motor is arranged on the upper surface of the telescopic rod, a driving gear is installed at the output end of the driving motor, and the driving gear is meshed with the teeth grooves.

[0011] Further, three convex plates are arranged on the outer side of the lower surface of the turntable, a convex block is arranged at the center of the lower surface of the turntable, two track rods are arranged in parallel between a single convex plate and a convex block, a slider is slidably installed between two track rods in the same group, three track grooves are opened on the surface of the turntable, and the track groove is placed between two track rods;

[0012] A column is arranged on the lower surface of the protrusion, a limit plate B is arranged at the bottom of the column, a sliding sleeve is slidably installed on the surface of the column, and connecting rods are respectively hinged between the sliding sleeve and the three sliders;

[0013] A driving member for driving the three slide blocks to slide synchronously is also installed on the column.

[0014] Furthermore, the surface of the column is symmetrically provided with open grooves;

[0015] The driving member includes a threaded rod, which is rotatably installed inside the column and the rotating shaft. A knob is provided at the end of the threaded rod, and the knob is placed above the limit plate A. An inner sleeve is provided on the inner side of the sliding sleeve. The connection between the inner sleeve and the sliding sleeve passes through an open groove, and the inner sleeve is screwed on the threaded rod.

[0016] Furthermore, the suction mechanism includes a docking tube fixed on the lower surface of the slider, a suction head is installed at the bottom of the docking tube, a hose is connected to the top of the docking tube, and the hose runs through the track groove.

[0017] Furthermore, the clamping mechanism includes a lower clamping plate fixedly welded to the outer side of the bottom of the frontmost convex plate, the lower clamping plate and the convex plate are in an L-shaped structure, and a through groove is opened on the surface of the convex plate.

[0018] Furthermore, an extension rod is rotatably passed through the inner side of the through slot, the rotation direction of the extension rod is circumferential rotation on a vertical plane, and a movable clamping plate is arranged at the front end of the extension rod, and the movable clamping plate is placed above the lower clamping plate.

[0019] Furthermore, a U-shaped groove is provided at the rear end of the extension rod, a control cylinder is fixed to the front side of the upper surface of the turntable, an I-shaped clamp is installed at the output end of the control cylinder, the I-shaped clamp is placed under the turntable, and the I-shaped clamp is clamped on the U-shaped groove.

[0020] The present invention provides a semiconductor wafer automatic loading and unloading device. It has the following beneficial effects:

[0021] 1. The present invention can adjust the orientation of the wafer after adsorption to adapt to the complex loading and unloading environment, and can rotate the wafer at a certain angle after adsorption to adjust the angle of non-circular materials to ensure the accuracy of loading and unloading.

[0022] 2. The present invention adopts three synchronously adjustable suction mechanisms to adsorb wafers, and can adjust the positions of the three suction heads according to production needs to ensure that the wafers are evenly stressed during loading and unloading to prevent them from falling off. It is suitable for the production of wafers of different sizes. During debugging, it is only necessary to ensure the correspondence between the turntable and the center position of the wafer, thereby improving the convenience of equipment debugging.

[0023] 3. The present invention sets a clamping mechanism for clamping the wafer at the front end of the device. When there are obstacles above the loading area and the material cannot be adsorbed, the wafer can be clamped and loaded by the clamping mechanism at the front end, thereby improving the practicality of the device. The wafer can also be fine-tuned by the clamping mechanism to ensure the accuracy of the wafer position after loading and unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the installation three-dimensional structure of the present invention;

[0025] Figure 2 It is a front view structural schematic diagram of the present invention;

[0026] Figure 3 It is a schematic diagram of the installation structure of the equidistant adjustment mechanism of the present invention;

[0027] Figure 4 It is a schematic diagram of the three-dimensional structure of the material suction mechanism of the present invention;

[0028] Figure 5 For the present invention Figure 4 Schematic diagram of the projection structure;

[0029] Figure 6 It is a schematic diagram of the three-dimensional structure of the movable splint installation of the present invention;

[0030] Figure 7 For the present invention Figure 2 Schematic diagram of the enlarged structure of area A.

[0031] Among them, 1. lifting mechanism; 101. mounting seat; 102. track bar; 103. lifting cylinder; 104. slide seat; 2. rotating and telescopic mechanism; 201. rotating seat; 202. beam; 203. telescopic rod; 204. driving motor; 205. driving gear; 3. equidistant adjustment mechanism; 301. turntable; 302. rotating shaft; 303. limit plate A; 304. track groove; 305. tooth groove; 306. convex plate; 3061. through groove; 307. convex block; 308. 08, track rod; 309, slider; 310, column; 3101, open slot; 311, limit plate B; 312, sleeve; 3121, inner sleeve; 313, connecting rod; 314, threaded rod; 315, knob; 4, suction mechanism; 401, docking tube; 402, suction head; 403, hose; 5, clamping mechanism; 501, lower clamping plate; 502, movable clamping plate; 503, extension rod; 504, U-shaped slot; 505, control cylinder; 506, I-shaped clamp. DETAILED DESCRIPTION

[0032] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Embodiment 1:

[0034] Please refer to Figure 1 , Figure 2 and Figure 7As shown, a semiconductor wafer automatic loading and unloading device includes a lifting mechanism 1 and an equidistant adjustment mechanism 3. The lifting mechanism 1 includes a mounting seat 101. The mounting seat 101 can be fixed on the ground or fixed on a workbench that can be moved laterally according to the usage, so as to cooperate with a telescopic rod 203 to realize the movement of the XY axis. The surface of the mounting seat 101 is vertically symmetrically provided with track bars 102. Slide seats 104 are slidably installed on the surfaces of the two track bars 102. A lifting cylinder 103 for controlling the slide seat 104 is vertically installed on the inner side of the mounting seat 101. The height of the slide seat 104 is controlled by the lifting cylinder 103, and then the height of the wafer adsorbed at the end is controlled. The lifting mechanism 1 is provided with a rotating telescopic mechanism 2 on the top. The rotating telescopic mechanism 2 comprises a rotating seat 201 fixed on the upper surface of the slide 104. The rotating seat 201 has a built-in motor to drive the crossbeam 202 to rotate at an angle. The upper surface of the rotating seat 201 is horizontally arranged with the crossbeam 202. A telescopic rod 203 is slidably installed on the upper surface of the crossbeam 202. A motor is provided at the rear end of the crossbeam 202 to drive the built-in belt to move. The rear end of the telescopic rod 203 is installed on the belt. At this time, when the belt rotates, the telescopic rod 203 can be driven to extend and retract forward and backward, thereby driving the adsorbed wafer to be adjusted in multiple directions, thereby realizing complex loading and unloading.

[0035] Please refer to Figure 3 and Figure 4 As shown, the equidistant adjustment mechanism 3 is installed at the end of the telescopic rod 203, and the equidistant adjustment mechanism 3 includes a turntable 301 placed below the end of the telescopic rod 203. A rotating shaft 302 is arranged at the center of the upper surface of the turntable 301. The rotating shaft 302 rotates and passes through the end of the telescopic rod 203. A limiting plate A303 is arranged on the top of the rotating shaft 302. The bottom surface of the limiting plate A303 is movably fitted with the upper surface of the telescopic rod 203. The limiting plate A303 prevents the equidistant adjustment mechanism 3 from falling, so that the whole mechanism can only rotate. Three suction mechanisms 4 are evenly slidably installed on the lower surface of the equidistant adjustment mechanism 3. The equidistant adjustment mechanism 3 is used to synchronously adjust the positions of the three suction mechanisms 4. The three suction points can ensure that the wafer is evenly stressed. A clamping mechanism 5 is also arranged at the front end of the turntable 301. The clamping mechanism 5 is used to clamp the wafer from the side.

[0036] Please refer to Figure 1 and Figure 4 As shown, teeth grooves 305 are evenly opened on the upper surface of the turntable 301, and a driving motor 204 is arranged on the upper surface of the telescopic rod 203. A driving gear 205 is installed on the output end of the driving motor 204, and the driving gear 205 is meshed with the teeth groove 305. The driving motor 204 drives the driving gear 205 to rotate and then drives the turntable 301 to rotate, so as to adjust the angle of the wafer after adsorption. When the position of the non-circular wafer needs to be adjusted, the orientation angle of the wafer can be controlled by rotating the turntable 301 to ensure the accuracy of loading and unloading.

[0037] Among them, three convex plates 306 are arranged on the outer side of the lower surface of the turntable 301, a convex block 307 is arranged at the center of the lower surface of the turntable 301, two track rods 308 are arranged in parallel between the single convex plate 306 and the convex block 307, and a slider 309 is slidably installed between the two track rods 308 in the same group, so that the slider 309 can only slide along the track rod 308, three track grooves 304 are opened on the surface of the turntable 301, and the track groove 304 is placed between the two track rods 308, and a column 310 is arranged on the lower surface of the convex block 307, and the bottom of the column 310 A limit plate B311 is provided, and a sleeve 312 is slidably installed on the surface of the column 310. Connecting rods 313 are hinged between the sleeve 312 and the three sliders 309 respectively. A driving member for driving the three sliders 309 to slide synchronously is also installed on the column 310. The distance between the three sliders 309 and the center of the turntable 301 is controlled by controlling the position of the sleeve 312 to ensure that the three suction points are evenly stressed. No matter whether the product model or the suction head 402 is replaced, it is only necessary to ensure that the center of the turntable 301 is consistent with the center of the wafer, and no re-debugging is required.

[0038] Please refer to Figure 5 As shown, the surface of the column 310 is symmetrically provided with open grooves 3101, and the driving member includes a threaded rod 314, which is rotatably installed inside the column 310 and the rotating shaft 302. A knob 315 is provided at the end of the threaded rod 314, and the knob 315 is placed above the limit plate A303 to facilitate rapid adjustment of the position of the suction mechanism 4. The knob 315 can also be replaced by a servo motor to achieve automatic control. An inner sleeve 3121 is provided on the inner side of the sleeve 312, and the connection between the inner sleeve 3121 and the sleeve 312 passes through the open groove 3101. The inner sleeve 3121 and the sleeve 312 have two connections in total. The inner sleeve 3121 is screwed on the threaded rod 314. When the threaded rod 314 rotates, it can drive the sleeve 312 to move axially, and then synchronously adjust the positions of the three suction mechanisms 4.

[0039] For ease of installation, the inner sleeve 3121 and the sliding sleeve 312 may be formed of two separate structures and fixed by two bolts that penetrate the open slot 3101 to ensure that the inner sleeve 3121 and the sliding sleeve 312 can move synchronously.

[0040] Please refer to Figure 5 As shown, the suction mechanism 4 includes a docking tube 401 fixed on the lower surface of the slider 309, a suction head 402 is installed at the bottom of the docking tube 401, and the suction head 402 is made of soft material to prevent scratches on the wafer. A hose 403 is connected to the top of the docking tube 401, and the hose 403 passes through the track groove 304. The other end of the hose 403 is installed on the compression pump to control the suction force of the suction head 402.

[0041] Embodiment 2:

[0042] Please refer to Figure 3 and Figure 6 As shown, the clamping mechanism 5 includes a lower clamping plate 501 fixedly welded to the outer side of the bottom of the front convex plate 306. The lower clamping plate 501 is thin and can be inserted under the wafer. The lower clamping plate 501 and the convex plate 306 are in an L-shaped structure, so that the lower clamping plate 501 and the turntable 301 are a whole and can move together. The surface of the convex plate 306 is provided with a through groove 3061, and the through groove 3061 is vertically opened. An extension rod 503 is rotatably penetrated inside the through groove 3061, and the rotation direction of the extension rod 503 is in the vertical plane. The extension rod 503 is provided with a movable clamping plate 502 at the front end thereof, and the movable clamping plate 502 is placed above the lower clamping plate 501. The movable clamping plate 502 is rotated (rotates along with the rotation of the extension rod 503) to control the distance between its end and the lower clamping plate 501. When it is necessary to clamp the wafer from the side, the movable clamping plate 502 can be controlled to keep a distance from the lower clamping plate 501 and be placed respectively above and below the wafer. At this time, the wafer can be clamped by adjusting the angle of the movable clamping plate 502.

[0043] Among them, a U-shaped groove 504 is opened at the rear end of the extension rod 503, and a control cylinder 505 is fixed on the front side of the upper surface of the turntable 301. An I-shaped clamp 506 is installed at the output end of the control cylinder 505. The I-shaped clamp 506 is a cylindrical structure with large ends and a small middle, so that the extension rod 503 can be clamped in the central depression of the I-shaped clamp 506. At this time, the up and down movement of the I-shaped clamp 506 can drive the extension rod 503 to swing in angle, and then control the angle of the front movable splint 502. The I-shaped clamp 506 is placed under the turntable 301, and the I-shaped clamp 506 is clamped on the U-shaped groove 504 and matches with the gap of the U-shaped groove 504.

[0044] It should be noted that, combined with Figure 1 Figure 2 and Figure 7 It can be seen that there is a certain gap between the lower end of the rotating shaft 302 and the bottom surface of the telescopic rod 203, and the gap can allow the hose 403 and the control cylinder 505 to pass through, so that the turntable 301 can rotate smoothly;

[0045] In addition, the maximum rotation angle of the turntable 301 is 360°, after which it needs to be rotated in the opposite direction for resetting, thereby preventing the hose 403 from getting tangled.

[0046] Embodiment 3:

[0047] Please refer to Figure 1 and Figure 4 As shown, the automatic loading and unloading device for semiconductor wafers of the present invention can adjust the position of the wafer after adsorption to adapt to the complex loading and unloading environment. This embodiment describes and expands this process in detail.

[0048] In actual use, the present invention drives the crossbeam 202 to rotate the angle by rotating the rotating seat 201 in the telescopic mechanism 2, thereby achieving different angle adjustments of the wafer. The rotating seat 201 has a built-in servo motor, model YASKAWA SGMSH-20ACA-YR11, which can provide a maximum speed of 2000rpm to ensure flexible rotation angle adjustment. In the actual debugging process, the control system uses PLC (Siemens S7-1200) to control the angle of the rotating seat, which can rotate the wafer to the required specific angle to meet the processing requirements of various types of non-circular materials.

[0049] In order to ensure the stability and accuracy of the adjustment, the crossbeam 202 and the telescopic rod 203 are connected by a precise guide rail. The guide rail is made of aluminum alloy 6061-T6 and uses linear bearings to reduce friction and offset, thereby ensuring the accuracy of the wafer during the adjustment process. The control error of the adjustment process can be controlled within ±0.01°, thereby greatly improving the loading and unloading accuracy in production and reducing the wafer breakage rate.

[0050] Embodiment 4:

[0051] This embodiment is mainly described in detail around beneficial effect 2, and further explains and expands the working principles of three synchronously adjustable suction mechanisms.

[0052] The present invention uses three suction mechanisms 4 to synchronously adsorb the wafer, and the suction mechanism includes a docking tube 401, a suction head 402 and a hose 403. The suction head 402 is made of silicone rubber (hardness 50A), which can prevent scratches on the wafer. At the same time, the positions of the three suction heads can be changed by adjusting the sliding sleeve 312 and the inner sleeve 3121 to ensure the uniformity of the adsorption points. The equidistant adjustment between the three suction mechanisms can be achieved by driving the threaded rod 314 through a servo motor (model: Panasonic A5 series).

[0053] Specifically, when the relative positions of the three suction heads need to be adjusted, the sleeve 312 can be slid on the column 310 by rotating the screw rod 314, thereby changing the distance between the slider 309 and the center of the turntable 301. At this time, the control accuracy of the servo motor is 0.001mm, ensuring that the suction force of each suction head on the wafer remains consistent during the wafer loading and unloading process. The control of the suction force is monitored by a pressure sensor, the sensor model is Honeywell FSS-SMT series, which can be accurate to ±0.5N to ensure that the wafer will not slip during the handling process.

[0054] In order to adapt to wafers of different sizes, the device can adjust the distance range of the three suction mechanisms to between 150mm and 310mm, which can cover the common loading and unloading requirements of 6-inch, 8-inch and 12-inch wafers. During the debugging process, it is only necessary to align the center of the turntable 301 with the center of the wafer, without the need for additional mechanical adjustments, which greatly improves the convenience of equipment debugging.

[0055] Embodiment 5:

[0056] This embodiment expands the working principle of the clamping mechanism in beneficial effect 3 and provides specific data and material descriptions.

[0057] When there are obstacles above the loading area and the wafer cannot be loaded by adsorption, the present invention clamps and loads the wafer by means of a clamping mechanism 5 arranged at the front end of the turntable 301. The clamping mechanism includes a lower clamping plate 501, a movable clamping plate 502 and an extension rod 503. When clamping the wafer, the I-shaped clamping head 506 is driven to move up and down by controlling the cylinder 505 (model SMC MGPM40-50Z), and the I-shaped clamping head 506 is clamped in the U-shaped groove 504 of the extension rod 503, thereby driving the movable clamping plate 502 to swing in angle.

[0058] The material of the movable clamping plate 502 is carbon fiber reinforced composite material, which has high strength and wear resistance, and is light in weight, which can reduce damage to the wafer. The lower clamping plate 501 is thinner, with a thickness of 2mm, and can be easily inserted under the wafer. During the clamping process, the clamping pressure between the movable clamping plate 502 and the lower clamping plate 501 is controlled by the pressure regulating valve installed on the control cylinder 505, and the maximum clamping pressure can reach 50N to ensure that the wafer will not break or slide during the clamping process.

[0059] In summary, the present invention greatly enhances the practicability of the device by combining the adsorption and clamping methods, enables it to cope with complex production environments, and further improves the efficiency and accuracy of wafer loading and unloading.

[0060] Working principle: When in use, the mounting base 101 is used to keep the entire device fixed. The mounting base 101 can also be fixed on a workbench that can be moved laterally, and the three hoses 403 are respectively connected to the compression pumps. The upward movement of the slide 104 is controlled by the track bar 102, and its rotation is controlled by the rotating base 201. The extension and retraction of the telescopic rod 203 is controlled by the crossbeam 202 to achieve movement in different directions.

[0061] The position of the suction mechanism 4 can be adjusted according to the size of different wafers. At this time, the threaded rod 314 can be driven to rotate by rotating the top knob 315, and then the inner sleeve 3121 can be driven to move. Since the inner sleeve 3121 is fixed to the sliding sleeve 312, the sliding sleeve 312 can be driven to move up and down. At this time, the three sliders 309 can be driven to move at the same time by the connecting rod 313 to adjust the distance between the three sliders 309 and the center of the turntable 301, and then the distance between the suction mechanism 4 is adjusted to make the three suction mechanisms 4 consistent with the center of the turntable 301. When in use, the wafer is adsorbed by the suction head 402 to ensure that the force on the suction point of the wafer is uniform, and the wafer can be driven to move in multiple directions by the above mechanism to realize loading and unloading. At the same time, the driving motor 204 can also be used to drive the driving gear 205 to rotate, and then the meshing of the driving gear 205 and the tooth groove 305 drives the equidistant adjustment mechanism 3 to rotate as a whole to adjust the angle of the wafer after adsorption.

[0062] A clamping mechanism 5 is provided at the front end of the turntable 301. The height of the I-shaped clamp 506 can be controlled by controlling the cylinder 505. The cooperation between the I-shaped clamp 506 and the U-shaped groove 504 drives the extension rod 503 to rotate, and then the angle of the movable clamp 502 and the lower clamp 501 is adjusted to realize the clamping of the wafer.

[0063] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer automatic loading and unloading device, comprising a lifting mechanism (1) and an equidistant adjustment mechanism (3), characterized in that: The lifting mechanism (1) comprises a mounting seat (101), a track bar (102) being vertically symmetrically arranged on the surface of the mounting seat (101), a slide seat (104) being slidably mounted on the surfaces of two track bars (102), and a lifting cylinder (103) for controlling the slide seat (104) being vertically mounted on the inner side of the mounting seat (101); A rotating telescopic mechanism (2) is installed on the top of the lifting mechanism (1), and the rotating telescopic mechanism (2) comprises a rotating seat (201) fixed on the upper surface of the sliding seat (104), the upper surface of the rotating seat (201) is transversely arranged with a crossbeam (202), a telescopic rod (203) is slidably installed on the upper surface of the crossbeam (202), and the equidistant adjustment mechanism (3) is installed at the end of the telescopic rod (203); The equidistant adjustment mechanism (3) comprises a rotating disk (301) disposed below the end of the telescopic rod (203); a rotating shaft (302) is disposed at the center of the upper surface of the rotating disk (301); the rotating shaft (302) rotates at the end of the telescopic rod (203); a limiting plate A (303) is disposed on the top of the rotating shaft (302); the bottom surface of the limiting plate A (303) is movably fitted with the upper surface of the telescopic rod (203); Three material suction mechanisms (4) are evenly and slidably mounted on the lower surface of the equidistant adjustment mechanism (3), and the equidistant adjustment mechanism (3) is used to synchronously adjust the positions of the three material suction mechanisms (4); The front end of the turntable (301) is also provided with a clamping mechanism (5), and the clamping mechanism (5) is used to clamp the wafer from the side.

2. The automatic loading and unloading device for semiconductor wafers according to claim 1, characterized in that: Tooth grooves (305) are evenly arranged on the upper surface of the rotating disk (301), a driving motor (204) is arranged on the upper surface of the telescopic rod (203), a driving gear (205) is installed at the output end of the driving motor (204), and the driving gear (205) is meshed with the tooth grooves (305).

3. The automatic loading and unloading device for semiconductor wafers according to claim 1, characterized in that: Three convex plates (306) are arranged on the outer side of the lower surface of the turntable (301); a convex block (307) is arranged at the center of the lower surface of the turntable (301); two track rods (308) are arranged in parallel between a single convex plate (306) and a convex block (307); a slider (309) is slidably installed between two track rods (308) in the same group; three track grooves (304) are opened on the surface of the turntable (301); and the track grooves (304) are arranged between two track rods (308); A column (310) is arranged on the lower surface of the protrusion (307), a limit plate B (311) is arranged at the bottom of the column (310), a sliding sleeve (312) is slidably mounted on the surface of the column (310), and connecting rods (313) are respectively hinged between the sliding sleeve (312) and the three sliders (309); The upright column (310) is also provided with a driving member for driving the three slide blocks (309) to slide synchronously.

4. The automatic loading and unloading device for semiconductor wafers according to claim 3 is characterized in that: The surface of the column (310) is symmetrically provided with open grooves (3101); The driving member comprises a threaded rod (314), the threaded rod (314) being rotatably installed through the inside of the column (310) and the rotating shaft (302), a knob (315) being arranged at the end of the threaded rod (314), the knob (315) being placed above the limit plate A (303), an inner sleeve (3121) being arranged on the inner side of the sliding sleeve (312), the connection between the inner sleeve (3121) and the sliding sleeve (312) passing through the open groove (3101), and the inner sleeve (3121) being screwed onto the threaded rod (314).

5. The semiconductor wafer automatic loading and unloading device according to claim 1, characterized in that: The material suction mechanism (4) comprises a docking tube (401) fixed on the lower surface of the slider (309), a suction head (402) is installed at the bottom of the docking tube (401), a hose (403) is connected to the top of the docking tube (401), and the hose (403) passes through the track groove (304).

6. The automatic loading and unloading device for semiconductor wafers according to claim 3, characterized in that: The material clamping mechanism (5) comprises a lower clamping plate (501) fixedly welded to the outer side of the bottom of the frontmost convex plate (306); the lower clamping plate (501) and the convex plate (306) are in an L-shaped structure; and a through groove (3061) is provided on the surface of the convex plate (306).

7. The automatic loading and unloading device for semiconductor wafers according to claim 6, characterized in that: An extension rod (503) is rotatably passed through the inner side of the through slot (3061), and the rotation direction of the extension rod (503) is circumferential rotation on a vertical plane. A movable clamping plate (502) is arranged at the front end of the extension rod (503), and the movable clamping plate (502) is placed above the lower clamping plate (501).

8. The automatic loading and unloading device for semiconductor wafers according to claim 7, characterized in that: A U-shaped groove (504) is formed at the rear end of the extension rod (503); a control cylinder (505) is fixed on the front side of the upper surface of the rotating disk (301); an I-shaped clamp (506) is installed at the output end of the control cylinder (505); the I-shaped clamp (506) is placed below the rotating disk (301), and the I-shaped clamp (506) is clamped on the U-shaped groove (504).

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