Wafer alignment device and method, electronic equipment and computer readable storage medium

Abstract

The invention relates to a wafer alignment device and method, electronic equipment and a computer readable storage medium, a rotating assembly is arranged on a moving assembly, and an adsorption assembly is arranged on the rotating assembly and used for adsorbing a to-be-aligned wafer in a negative pressure adsorption mode; the moving assembly is used for moving the adsorption assembly on the rotating assembly to the shooting position of the camera assembly; the camera assembly is used for shooting the wafer on the adsorption assembly and providing a shooting result to determine the circle center position of the wafer. On one hand, when the rotating assembly drives the adsorption assembly and the wafer to be aligned to be in a rotating state, shooting imaging is achieved through the camera assembly so that the circle center position of the wafer can be positioned; and on the other hand, the moving assembly drives the rotating assembly and the adsorption assembly to move to the shooting position suitable for the camera assembly, and shooting positioning can be carried out, so that the application range is widened on the premise that the wafers are not damaged, the wafers of various specifications are supported, the positioning precision is high, and the wafer transfer robot can be matched to realize an automatic process.

Description

Technical Field

[0001] The present application relates to the field of chip processing, and in particular to a wafer alignment device, method, electronic device and computer-readable storage medium. Background Art

[0002] Wafers are silicon chips used to make semiconductor circuits. They are usually arched, that is, incomplete round pieces with one straight edge. Wafers need to be aligned before they can be handled, which can also be called calibration. After calibration, the center of the circle and the straight edge are found, and then the handling robot picks up the material according to the located center of the circle.

[0003] Traditional wafer calibrators are usually implemented using positioning fixtures or optical fibers. Positioning fixtures achieve positioning through physical contact, which can easily damage the wafer. Optical fibers have a small positioning range and a single function, so their scope of application is relatively small. For example, they only support 4-inch, 5-inch, 6-inch or 8-inch wafers. Summary of the invention

[0004] Based on this, it is necessary to provide a wafer alignment device, method, electronic device and computer-readable storage medium.

[0005] One embodiment of the present application is a wafer alignment device, which includes a moving component, a rotating component, an adsorption component, a camera component and an electric control component;

[0006] The electric control component is respectively connected to the moving component, the rotating component and the camera component;

[0007] The rotating assembly is arranged on the moving assembly, and the adsorption assembly is arranged on the rotating assembly, and is used for adsorbing the wafer to be aligned in a negative pressure adsorption manner;

[0008] The moving component is used to move the adsorption component on the rotating component to the shooting position of the camera component;

[0009] The camera assembly is used to photograph the wafer on the adsorption assembly and provide photographing results to determine the center position of the wafer.

[0010] The above-mentioned wafer alignment device cooperates with a moving component, a rotating component, an adsorption component, a camera component and an electronic control component. On the one hand, when the rotating component drives the adsorption component and the wafer to be aligned to rotate, the camera component is used to realize imaging to locate the center position of the wafer; on the other hand, the moving component drives the rotating component and the adsorption component to move to a shooting position suitable for the camera component, and shooting positioning can be performed, thereby improving the scope of application without damaging the wafer, supporting wafers of various specifications, and having high positioning accuracy, which is conducive to cooperating with the wafer handling robot to realize the automation process.

[0011] In some embodiments, the shooting direction of the camera assembly is taken as the Z axis.

[0012] The moving component has an XY moving plane perpendicular to the Z axis;

[0013] The rotating assembly has an axial direction parallel to the Z axis;

[0014] And the adsorption component has an adsorption surface perpendicular to the Z axis.

[0015] In some of the embodiments, the wafer alignment device further includes a computing component, which is connected to the electronic control component and is used to calculate the center position of the wafer based on the shooting results.

[0016] In some embodiments, the electric control component is also connected to the adsorption component; or,

[0017] The camera assembly is a line scan camera; or,

[0018] The wafer alignment device also includes a sending component, which is connected to the electronic control component and the computing component respectively, and is used to send out the center position of the wafer.

[0019] In some embodiments, the wafer alignment device also includes a shell, the moving component, the electronic control component and the computing component are all disposed in the shell, the rotating component is at least partially disposed in the shell, the adsorption component is at least partially disposed outside the shell, and the camera component is disposed on the shell.

[0020] In some embodiments, the housing is provided with a power source interface and a gas source interface;

[0021] The power interface is connected to the electric control component for accessing the power supply;

[0022] The air source interface is connected to the adsorption component for receiving negative pressure.

[0023] In some of the embodiments, the wafer alignment device further includes a light source assembly, which is connected to the electronic control assembly and is used to provide illumination when the camera assembly photographs the wafer.

[0024] Exemplarily, in some of the embodiments, the light source assembly includes a coaxial light source device and a backlight source device;

[0025] The coaxial light source device is arranged on the camera assembly or adjacent to the camera assembly, and the light emitting direction of the coaxial light source device is the same as the shooting direction of the camera assembly;

[0026] The backlight source device is arranged adjacent to the adsorption component and is lower than the adsorption component in the height direction. The backlight source device is at least partially located outside the outline of the wafer. The backlight source device has a light emitting direction opposite to the shooting direction of the camera component.

[0027] In some embodiments, a wafer alignment method is implemented by using the wafer alignment device described in any embodiment, and the wafer alignment method comprises the steps of:

[0028] Negative pressure adsorbs the wafer to be aligned;

[0029] Moving the wafer to a shooting position of the camera assembly;

[0030] Photograph the wafer;

[0031] The center position of the wafer is calculated based on the shooting results.

[0032] In some embodiments, an electronic device includes a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of the wafer alignment method described in any embodiment are implemented.

[0033] In some of the embodiments, a computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the wafer alignment method described in any embodiment are implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 This is a schematic diagram of component connections of the first embodiment of the wafer alignment device described in the present application.

[0036] Figure 2 This is a schematic diagram of component connections of the second embodiment of the wafer alignment device described in the present application.

[0037] Figure 3 This is a schematic diagram of component connections of the third embodiment of the wafer alignment device described in the present application.

[0038] Figure 4 It is a structural schematic diagram of the fourth embodiment of the wafer alignment device described in the present application.

[0039] Figure 5 for Figure 4Another schematic diagram of the embodiment shown.

[0040] Figure 6 for Figure 5 Schematic diagram of the internal structure of the embodiment shown.

[0041] Figure 7 for Figure 6 Another schematic diagram of the embodiment shown.

[0042] Figure 8 for Figure 4 Schematic diagram of the application of the illustrated embodiment.

[0043] Fig. 9 for Figure 8 Another schematic diagram of the embodiment shown.

[0044] Figure numerals: wafer alignment device 100, moving component 110, X-axis motor 111, X-axis slide 112, Y-axis motor 113, Y-axis slide 114, moving seat 115, cross roller bearing 116, rotating component 120, rotating motor 121, adsorption component 130, camera component 140, light source component 150, coaxial light source device 151, backlight device 152, electronic control component 160, computing component 170, sending component 180, shell 190, power interface 191, gas source interface 192, bracket component 193, wafer 200. DETAILED DESCRIPTION

[0045] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0046] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0048] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are in contact indirectly through an intermediate medium. Moreover, a first feature being “above”, “above”, or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0049] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0050] The present application discloses a wafer alignment device, method, electronic device and computer-readable storage medium, which include some or all of the technical features of the following embodiments; as an example, the wafer alignment device includes some or all of the following structures. In some embodiments of the present application, a wafer alignment device includes a moving component, a rotating component, an adsorption component, a camera component and an electronic control component; the electronic control component is respectively connected to the moving component, the rotating component, the adsorption component and the camera component; the rotating component is arranged on the moving component, and the adsorption component is arranged on the rotating component, and is used to adsorb the wafer to be aligned in a negative pressure adsorption manner; the moving component is used to move the adsorption component on the rotating component to the shooting position of the camera component; the camera component is used to shoot the wafer on the adsorption component and provide shooting results to determine the center position of the wafer. The above-mentioned wafer alignment device cooperates with a moving component, a rotating component, an adsorption component, a camera component and an electronic control component. On the one hand, the rotating component drives the adsorption component and the wafer to be aligned to rotate, and the camera component is used to realize imaging to locate the center of the wafer; on the other hand, the moving component drives the rotating component and the adsorption component to move to a shooting position suitable for the camera component, and then the shooting positioning can be carried out, thereby improving the scope of application without damaging the wafer, supporting wafers of various specifications, and having high positioning accuracy, which is conducive to cooperating with the wafer handling robot to realize the automation process. Figures 1 to 9 , the wafer alignment device, method, electronic device and computer-readable storage medium are described in detail.

[0051] In some embodiments, a wafer alignment apparatus 100 is Figure 1 As shown, it includes a moving component 110, a rotating component 120, an adsorption component 130, a camera component 140 and an electric control component 160; the electric control component 160 is respectively connected to the moving component 110, the rotating component 120 and the camera component 140; Figure 4 and Figure 5 The rotating assembly 120 is disposed on the moving assembly 110, and the adsorption assembly 130 is disposed on the rotating assembly 120, and is combined with Figure 8 and Fig. 9The adsorption component 130 is used to adsorb the wafer 200 to be aligned by negative pressure adsorption; the moving component 110 is used to move the adsorption component 130 on the rotating component 120 to the shooting position of the camera component 140; the camera component 140 is used to shoot the wafer 200 on the adsorption component 130 and provide shooting results to determine the center position of the wafer 200. Such a design, through the coordination of the moving component 110, the rotating component 120, the adsorption component 130, the camera component 140 and the electronic control component 160, on the one hand, when the rotating component 120 drives the adsorption component 130 and the wafer 200 to be aligned to be in a rotating state, the camera component 140 realizes imaging to locate the center position of the wafer 200; on the other hand, the moving component 110 drives the rotating component 120 and the adsorption component 130 to move to a shooting position suitable for the camera component 140, and shooting positioning can be performed, thereby improving the scope of application without damaging the wafer 200, supporting wafers 200 of various specifications, and having high positioning accuracy, which is conducive to cooperating with the wafer handling robot to realize the automation process.

[0052] In order to provide better shooting effects, such as Figure 1 As shown, in some embodiments, the wafer alignment device 100 further includes a light source assembly 150, which is connected to the electronic control assembly 160 and is used to provide illumination when the camera assembly 140 photographs the wafer 200. Such a design is conducive to the camera assembly 140 obtaining a better photographing effect, so that the center position of the wafer 200 to be aligned can be determined faster and more accurately.

[0053] For the embodiments with the light source assembly 150, illustratively, in some of the embodiments, as Figure 4 and Figure 5As shown, the light source assembly 150 includes a coaxial light source device 151 and a backlight source device 152; as an example, the coaxial light source device 151 and the backlight source device 152 are respectively connected to the electric control assembly 160, and are used to provide illumination when the camera assembly 140 photographs the wafer 200 under the control of the electric control assembly 160. As an example, the coaxial light source device 151 is arranged on the camera assembly 140 or adjacent to the camera assembly 140, and the light emitting direction of the coaxial light source device 151 is the same as the shooting direction of the camera assembly 140; the backlight source device 152 is arranged adjacent to the adsorption assembly 130 and is lower than the adsorption assembly 130 in the height direction, the backlight source device 152 is at least partially located outside the outline of the wafer 200, and the backlight source device 152 has a light emitting direction opposite to the shooting direction of the camera assembly 140. Exemplarily, the backlight device 152 is a planar backlight composed of linear backlights, and the linear direction of the linear backlight is perpendicular to the shooting direction of the camera assembly 140, that is, while the light emitting direction of the linear backlight is opposite to the shooting direction of the camera assembly 140, the linear backlight also forms a light source extension area perpendicular to the shooting direction of the camera assembly 140. With this design, there are two lighting methods, with coaxial light at the line scan camera and backlight at the platform. On the one hand, the coaxial light source device 151 is strongly associated with the camera assembly 140, and the light emitting direction of the coaxial light source device 151 is the same as the shooting direction of the camera assembly 140, and the coaxial light source device 151 is arranged on the camera assembly 140 or adjacent to the camera assembly 140, thereby ensuring the lighting effect of the coaxial light source device 151 on the wafer 200 as much as possible; on the other hand, the backlight source device 152, especially the linear backlight source, provides a lighting effect for the camera assembly 140 at the bottom of the wafer 200 in a planar light emitting manner, that is, the wafer 200 is between the backlight source device 152 and the camera assembly 140, therefore, combined with the shielding of the wafer 200, a contrast lighting effect is formed for the camera assembly 140, which is beneficial to the rotating assembly 120 driving the adsorption assembly 130 and the wafer 200 to be aligned to be in a rotating state, thereby realizing accurate shooting and imaging of the camera assembly 140, and having the advantages of good imaging effect, high recognition and high positioning accuracy.

[0054] In some embodiments, such as Figure 2 As shown, the wafer alignment device 100 further includes a computing component 170, which is connected to the electronic control component 160 and is used to calculate the center position of the wafer 200 according to the shooting result. Figure 3As shown, the wafer alignment device 100 also includes a sending component 180, and the sending component 180 is connected to the electronic control component 160 and the computing component 170 respectively, and is used to send out the center position of the wafer 200. In this embodiment, the calculation process can be completed in the wafer alignment device 100; in other embodiments, the calculation process can also be completed in an external system or background. After the calculation is completed, the wafer alignment device 100 can passively wait for the external system or background or the handling robot to obtain the center position of the wafer 200, or actively send out the center position of the wafer 200 through the sending component 180.

[0055] In some embodiments, such as Figure 4 and Figure 5 As shown, the wafer alignment device 100 also includes a housing 190, Figure 6 and Figure 7 The moving component 110, the electric control component 160 and the computing component 170 are all disposed in the housing 190, the rotating component 120 is at least partially disposed in the housing 190, the adsorption component 130 is at least partially disposed outside the housing 190, and the camera component 140 is disposed on the housing 190. Such a design is conducive to forming an integral body, so that the wafer alignment device 100 is easy to carry, transport and use.

[0056] For the embodiments having the housing 190, in some embodiments, as Figure 4 As shown, the housing 190 is provided with a power interface 191 and an air source interface 192; the power interface 191 is connected to the electric control component 160 for accessing the power supply; the air source interface 192 is connected to the adsorption component 130 for accessing the negative pressure. As an example, the air source interface 192 is used to connect a vacuum pump or other negative pressure generating device. With this design, when in use, the power supply and negative pressure can be quickly accessed through the power interface 191 and the air source interface 192, making the wafer alignment device 100 easy to use.

[0057] For example, in some of the embodiments, in combination Figure 6 and Figure 7The wafer alignment device 100 is further provided with a support member 193 on the housing 190, and the camera assembly 140 is arranged on the support member 193. For the embodiment with the coaxial light source device 151, the coaxial light source device 151 is directly arranged on the support member 193, or is indirectly arranged on the support member 193 through the camera assembly 140. The support member 193 cooperates with the housing 190 to leave a certain space for the wafer 200 on the adsorption assembly 130 for the camera assembly 140 to take pictures. In contrast, the traditional wafer aligner is usually implemented by a positioning fixture or an optical fiber, and does not use the camera assembly 140, so the support member 193 is not required, that is, the prerequisite for using the support member 193 is lacking.

[0058] In each embodiment, the electric control component 160 is connected to the moving component 110, the rotating component 120 and the camera component 140, respectively. As an example, the electric control component 160 is used to supply power or provide power to the moving component 110, the rotating component 120 and the camera component 140, or to control the start and shut down of the moving component 110, the rotating component 120 and the camera component 140. In some embodiments, the electric control component 160 is also connected to the adsorption component 130 to control the start and shut down of the adsorption component 130. As an example, the adsorption component 130 is connected to an external vacuum pump through an air pipe; or the wafer alignment device 100 is provided with the vacuum pump. As an example, the electric control component 160 is connected to an electronic valve to control the opening and closing of the air pipe through the electronic valve.

[0059] In each embodiment, the rotating assembly 120 is disposed on the moving assembly 110, and the adsorption assembly 130 is disposed on the rotating assembly 120, and is used to adsorb the wafer 200 to be aligned by negative pressure adsorption. As an example, the rotating assembly 120 is fixed on the moving assembly 110, and the rotating assembly 120 has a rotatable part; or, the rotating assembly 120 is rotatably disposed on the moving assembly 110.

[0060] In each embodiment, the moving component 110 is used to move the adsorption component 130 on the rotating component 120 to the shooting position of the camera component 140, that is, to move the adsorption component 130 adsorbing the wafer 200 to the shooting position of the camera component 140. That is, in this embodiment, the camera component 140 remains stationary, and the position of the adsorption component 130 is adjusted by the moving component 110, so that the wafer 200 adsorbed by the adsorption component 130 reaches a suitable shooting position.

[0061] In various embodiments, the camera assembly 140 is used to photograph the wafer 200 on the adsorption assembly 130, and provide photographing results to determine the center position of the wafer 200. In some embodiments, the camera assembly 140 is a line scan camera, which is used to provide clear and distortion-free images during the rotation process, so that when the rotating assembly 120 is rotating, the image can be collected by rotating, and then by rotating one, two or more circles to calculate the center position and the angle of the straight edge, so that the wafer handling robot can accurately locate and take the wafer 200. In the test, usually only two circles of rotation are needed to quickly and accurately locate the center position and the angle of the straight edge of the wafer 200.

[0062] In some embodiments, such as Figure 6 and Figure 7 As shown, the shooting direction of the camera assembly 140 is the Z axis, and the moving assembly 110 has an XY moving plane perpendicular to the Z axis, that is, the moving assembly 110 can drive the rotating assembly 120 to move along the X axis and along the Y axis, and the X axis and the Y axis are perpendicular to the Z axis; the rotating assembly 120 has an axial direction parallel to the Z axis, that is, the rotating axis of the rotating assembly 120 is parallel to the Z axis; and the adsorption assembly 130 has an adsorption surface perpendicular to the Z axis. For the wafer 200 in sheet form, the wafer 200 has two opposite surfaces, so that the two surfaces are parallel to the XY moving plane and perpendicular to the Z axis. Such a design is conducive to accurately moving the wafer 200 to adjust the position of the wafer 200, so that the wafer 200 can be quickly and accurately moved to the shooting position of the camera assembly 140, and it is also conducive to quickly locating the center position of the wafer 200.

[0063] For example, in some of the embodiments, Figure 6 and Figure 7As shown, the moving assembly 110 includes an X-axis motor 111, an X-axis slide rail 112, a Y-axis motor 113, a Y-axis slide rail 114, a moving seat 115 and a cross roller bearing 116. The X-axis slide rail 112 is arranged on the Y-axis slide rail 114, the Y-axis motor 113 drives the X-axis slide rail 112 to slide on the Y-axis slide rail 114, the moving seat 115 is arranged on the X-axis slide rail 112, the X-axis motor 111 drives the moving seat 115 to slide on the X-axis slide rail 112, and the rotating assembly 120 is arranged on the moving seat 115 through the cross roller bearing 116. Exemplarily, the extension direction of the X-axis slide rail 112 is the X-axis, the extension direction of the Y-axis slide rail 114 is the Y-axis, the X-axis is perpendicular to the Y-axis, and the X-axis and the Y-axis are both perpendicular to the Z-axis. With such a design, on the one hand, the rotating component 120 can realize free rotation relative to the moving component 110 without being constrained by the moving component 110; on the other hand, the rotating component 120 is matched with the cross roller bearing 116, which is beneficial to ensure the structural strength and rotation accuracy while reducing the product volume; on the other hand, the moving component 110 can slide along the X-axis slide 112 and the Y-axis slide 114 in the XY moving plane, so as to accurately and efficiently adjust the position of the rotating component 120, thereby adjusting the position of the adsorption component 130 on the rotating component 120, and then adjusting the position of the wafer 200 on the adsorption component 130, thereby improving the scope of application without damaging the wafer 200, supporting wafers 200 of various specifications, and having high positioning accuracy, which is beneficial to cooperate with the wafer handling robot to realize the automation process, and therefore is beneficial to cooperate to realize automated production.

[0064] In some of the embodiments, a wafer alignment method is implemented by using the wafer alignment device 100 described in any embodiment, that is, the wafer alignment method uses the wafer alignment device 100 described in any embodiment. As an example, the wafer alignment method includes the steps of: negative pressure adsorption of the wafer 200 to be aligned; moving the wafer 200 to the shooting position of the camera assembly 140; shooting the wafer 200; calculating the center position of the wafer 200 based on the shooting results. The remaining embodiments are similar and will not be described in detail. Since the wafer alignment device 100 described in any embodiment is adopted, the wafer alignment method also has the beneficial technical effects of the wafer alignment device 100, which will not be described in detail here.

[0065] Next, continue to combine Figures 1 to 9, the wafer alignment device 100 and the wafer alignment method are illustrated. In some embodiments, the wafer alignment device 100 is calibrated by using a line scan camera sensor in conjunction with a backlight source, and the center of the wafer 200 to be aligned is obtained by image acquisition and calculation, and the code of the material sheet, i.e., the wafer 200, can be identified at the same time, so as to facilitate the next process such as a transport process or a detection process. The wafer 200 has a flat edge, and the wafer alignment device 100 photographs the wafer 200 through the camera assembly 140, and provides the photographing results to achieve the center finding and the leveling edge finding; it can also be achieved by cooperating with other structures.

[0066] The XY moving plane of the moving component 110 has an X-axis and a Y-axis, and the axial direction of the rotating component 120 is the R-axis. The movements of the X, Y, and R axes adopt feedback stepper motors, precision guide rails and precision cross roller bearings. The plane accuracy is high and the positioning accuracy can reach 0.05mm, so that the camera component 140 required for calibration can capture images more clearly and accurately.

[0067] Illustratively, after the wafer alignment device 100 is calibrated to find the center of the circle, the adsorption component 130 can also be automatically moved to the center of the material picking circle of the wafer handling robot through the moving component 110, and the wafer handling robot is notified to pick up the material. The wafer handling robot no longer needs to calculate internally to move to the center of the circle, thereby greatly improving the material picking efficiency of the wafer handling robot. Since the positioning accuracy can reach 0.05mm, the material picking accuracy of the wafer handling robot is also improved.

[0068] The housing 190 of the wafer alignment device 100 includes a bottom plate, a Y-axis guide slider is provided on the top of the bottom plate, an X-axis guide slider is installed on the Y-axis guide slider, and a cross roller bearing is installed on the X-axis guide slider as the R axis. As an example, the three axes X, Y, and R all use closed-loop stepper motors as the power for movement and rotation. The R axis is a cylinder, and an adsorption component 130 is provided on the upper surface. The adsorption component 130 is connected to a vacuum air source so that the sheet will not slip during translation and rotation alignment. There are line scan cameras, backlight devices 152, and coaxial light source devices 151 above the sheet. The cylinder rotates to match the line scan camera to collect images, and then the position of the center of the circle and the angle of the straight edge are calculated by rotating the image for one circle. Finally, the center of the sheet is moved to the material picking position of the wafer handling robot through X and Y translation.

[0069] In some embodiments, an electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the steps of any one of the wafer alignment methods when executing the computer program. The electronic device may also be referred to as a device or an electronically controlled device. In some embodiments, an electronic device is also provided, including a memory and a processor, the memory stores a computer program, and the processor implements the steps of the above-mentioned embodiments of the wafer alignment method when executing the computer program. Since the wafer alignment method described in any embodiment is implemented, the electronic device also has the beneficial technical effects of the wafer alignment method, which will not be elaborated here.

[0070] In some of the embodiments, a computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the wafer alignment method described in any embodiment are implemented.

[0071] It should be noted that the user information and data involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data need to comply with relevant regulations; among them, the user information includes but is not limited to user device information, user personal information, etc., and the data includes but is not limited to data used for analysis, stored data, displayed data, etc.

[0072] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0073] It should be noted that other embodiments of the present application also include wafer alignment devices, methods, electronic devices and computer-readable storage media that can be implemented by combining the technical features in the above embodiments.

[0074] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A wafer alignment device (100), characterized in that: It comprises a moving component (110), a rotating component (120), an adsorption component (130), a camera component (140) and an electric control component (160); The electric control component (160) is respectively connected to the moving component (110), the rotating component (120) and the camera component (140); The rotating component (120) is arranged on the moving component (110), and the adsorption component (130) is arranged on the rotating component (120) and is used to adsorb the wafer (200) to be aligned in a negative pressure adsorption manner; The moving component (110) is used to move the adsorption component (130) on the rotating component (120) to a shooting position of the camera component (140); The camera component (140) is used to photograph the wafer (200) on the adsorption component (130) and provide photographing results to determine the center position of the wafer (200).

2. The wafer alignment device (100) according to claim 1, characterized in that: The shooting direction of the camera assembly (140) is taken as the Z axis. The moving component (110) has an XY moving plane perpendicular to the Z axis; The rotating assembly (120) has an axial direction parallel to the Z axis; Furthermore, the adsorption component (130) has an adsorption surface that is perpendicular to the Z axis.

3. The wafer alignment device (100) according to claim 1, characterized in that: The wafer alignment device (100) further comprises a calculation component (170), wherein the calculation component (170) is connected to the electric control component (160) and is used to calculate the center position of the wafer (200) according to the shooting result.

4. The wafer alignment device (100) according to claim 3, characterized in that: The electrical control component (160) is also connected to the adsorption component (130); or, The camera assembly (140) is a line scan camera; or, The wafer alignment device (100) further comprises a sending component (180), wherein the sending component (180) is respectively connected to the electric control component (160) and the computing component (170) and is used to send out the center position of the wafer (200).

5. The wafer alignment device (100) according to claim 3, characterized in that: The wafer alignment device (100) further comprises a housing (190); The moving component (110), the electric control component (160) and the computing component (170) are all arranged in the shell (190), the rotating component (120) is at least partially arranged in the shell (190), the adsorption component (130) is at least partially arranged outside the shell (190), and the camera component (140) is arranged on the shell (190).

6. The wafer alignment device (100) according to claim 5, characterized in that: The housing (190) is provided with a power source interface (191) and a gas source interface (192); The power interface (191) is connected to the electric control component (160) and is used to access the power supply; The gas source interface (192) is connected to the adsorption component (130) and is used to receive negative pressure.

7. The wafer alignment device (100) according to any one of claims 1 to 6, characterized in that: The wafer alignment device (100) further comprises a light source assembly (150), wherein the light source assembly (150) is connected to the electric control assembly (160) and is used to provide illumination when the camera assembly (140) photographs the wafer (200).

8. A wafer alignment method, characterized in that: The wafer alignment method is implemented by using the wafer alignment device (100) as claimed in any one of claims 1 to 7, and comprises the steps of: Adsorbing the wafer to be aligned by negative pressure (200); Moving the wafer (200) to a shooting position of the camera assembly (140); ShootWafer(200); The center position of the wafer (200) is calculated based on the photographing results.

9. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the wafer alignment method according to claim 8 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the wafer alignment method according to claim 8 are implemented.

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