A manufacturing method of a solder-filled via circuit board and the circuit board

Abstract

The present invention discloses a manufacturing method of a solder plug hole circuit board, which includes the steps of: manufacturing an inner core board, taking prepreg and copper foil, and through stacking and pressing, forming a pressed board with a copper layer on the surface; drilling through holes in the pressed board to form a through hole board; electroplating the through hole board to form an electroplated board; pasting a protective film on the electroplated board to form a protective film board; performing tin dipping processing on the protective film board to form a tin dipped board; tearing off the protective film on the surface of the tin dipped board and performing grinding to form a ground board; manufacturing a surface circuit pattern on the ground board and through post-process processing, forming a solder plug hole circuit board, and providing a circuit board whose structure includes a solder plug hole circuit board; by immersing a processing board into molten solder, filling the through holes with solder, replacing the method of electroplating solid copper or filling metal paste in the prior art to form a conductive solid hole, a manufacturing method with technical skills that can meet the signal transmission requirement quality and has a lower processing cost is formed.

Description

Technical Field

[0001] The present invention relates to the field of printed circuit board processing, and particularly to a method for manufacturing a solder-filled hole circuit board and a circuit board. Background Art

[0002] For circuit boards applied in the fields of industrial control or communication, there are relatively high requirements for signal transmission performance and signal fidelity performance. Therefore, a method of making the through holes of the circuit board into solid holes has emerged, providing a more convenient channel for signal transmission and avoiding problems such as reflection and scattering that are likely to occur due to detouring, which may lead to signal disturbance and distortion.

[0003] Currently, generally two methods are used to form solid holes. One is the processing of electroplated solid holes, mainly by using pulse electroplating to electroplate the holes with copper to form through holes of solid copper.

[0004] Although the solid holes made by this method have high reliability and good application effects (can reach the IPC3 standard), the pulse electroplating time is long, and the consumption of electroplating solution used is large, resulting in problems such as high processing cost, long time, and great difficulty. It is generally applicable to the processing of ultra-high-precision circuit boards.

[0005] Another method is to fill the through holes with metal paste (such as copper paste, silver paste, etc.) to form solid holes. Although the processing process of this method is relatively convenient, the material cost is high, and the application of auxiliary tools is more, making the processing process more cumbersome.

[0006] For applications in relatively ordinary fields, such as non-essential consumer electronics products, or electronic products with relatively single functions (entry-level walkie-talkies, basic mobile phones, electronic remote control toys, etc.), and when the reliability requirements for filling are general (for example, reaching the IPC1 or 2 standard is sufficient), using the above two methods shows the problem of relatively excessive material technology and manufacturing technology.

[0007] Therefore, based on the above background and problems, it is necessary to provide a method for manufacturing a solid hole circuit board that can meet certain requirements for circuit board signal transmission and has relatively low processing costs. Summary of the Invention

[0008] In view of the problems of high processing cost, long time, great difficulty, and being more cumbersome in the prior art methods of using pulse electroplating to make electroplated copper solid holes or using metal paste filling to make paste-filled solid holes, the present invention provides a method for manufacturing a solder-filled hole circuit board, and the manufacturing method includes the following steps:

[0009] S10: Manufacture an inner core board, and take prepreg and copper foil, and through stacking and pressing, form a pressed board with a copper layer on the surface;

[0010] S20: Drill through holes in the press plate to form a through-hole plate;

[0011] S30: Electroplate the through-hole plate to form an electroplated plate;

[0012] S40: Attach a protective film to the electroplated plate to form a protective film plate;

[0013] S50: Perform tin dipping on the protective film plate to form a tin-dipped plate;

[0014] S60: Tear off the protective film on the surface of the tin-dipped plate and perform grinding to form a ground plate;

[0015] S70: Make a surface circuit pattern on the ground plate and perform post-process machining to form the solder plug hole circuit board.

[0016] Further, the manufacturing of the inner core board includes taking a copper clad laminate and making an inner layer circuit pattern including a compensation circuit pattern; the compensation circuit pattern corresponds to the distribution of the through holes, and the single side of all sides or part of the sides is larger than the diameter of the through holes.

[0017] Further, the ratio of the thickness of the through-hole plate to the diameter of the through holes is 2:1 to 12:1.

[0018] Further, the electroplating is pulse electroplating. After the through holes are subjected to the pulse electroplating, "hourglass-shaped" holes with a relatively thick copper thickness in the center and a relatively thin copper thickness at both ends are formed.

[0019] Further, forming the electroplated plate further includes performing laser ablation machining on the hole center of the "hourglass-shaped" holes.

[0020] Further, the attaching of the protective film includes taking a high-temperature resistant blue glue, making an opening corresponding to the through holes, and then aligning and attaching it to the surface of the electroplated plate.

[0021] Optionally, the attaching of the protective film includes attaching a high-temperature resistant dry film to the surface of the electroplated plate and making a high-temperature resistant dry film pattern, and the high-temperature resistant dry film pattern is an opening pattern corresponding to the through holes.

[0022] Further, the tin dipping is to completely immerse the protective film plate into the molten solder in a solder pot and then take it out; the protective film plate is immersed at an angle with the surface of the solder.

[0023] Further, the grinding is performed using a sand belt grinding plate.

[0024] The present invention also provides a circuit board, the structure of which includes the solder plug hole circuit board manufactured as described above; one side or both sides of the solder plug hole circuit board are covered by other layers of the circuit board.

[0025] The technical solution of the present invention forms a manufacturing method that can meet the signal transmission requirements and has a low processing cost by immersing the processing board in molten solder and filling the via holes with solder, replacing the methods of electroplating solid copper or filling metal paste in the prior art to form conductive solid holes.

[0026] Furthermore, a compensation circuit pattern is set on the inner layer core board, which can provide a copper layer foundation in the holes for subsequent pulse electroplating processing. Through holes are made and the through holes are electroplated using pulse electroplating to form an unclosed "semi-bridged" state, providing a good solder flow channel and exhaust channel for solder dipping and filling. And a solder dipping method with a certain angle between the board body and the solder surface is adopted, which can improve the smoothness of the solder flowing into the via holes and enable the gas to be discharged smoothly. After solder dipping, through grinding processing, a flat board surface is formed, which is beneficial to the production of surface circuit patterns. After further processing, a solder-filled via hole circuit board is formed. The manufacturing method has the advantages of short time and low cost, and can meet the manufacturing requirements of basic conductive solid hole circuit boards.

[0027] In addition, a circuit board is also provided. The solder-filled via hole circuit board can be regarded as the inner layer core board and is made inside the circuit board, or based on the solder-filled via hole circuit board, further laminated to form a multi-layer circuit board, providing a variety of application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0029] Figure 1 It is the main process flow chart included in this embodiment;

[0030] Figure 2 It is a cross-sectional view of the stacked structure of this embodiment;

[0031] Figure 3 It is a cross-sectional view of the pressed board of this embodiment;

[0032] Figure 4 It is a cross-sectional view of the through hole board of this embodiment;

[0033] Figure 5 It is a cross-sectional view of the electroplated board of this embodiment;

[0034] Figure 6 It is a cross-sectional view of the protective film board of this embodiment;

[0035] Figure 7 Cross-sectional schematic diagram of the solder-dipped board of this embodiment;

[0036] Figure 8 Schematic diagram of the solder dipping process of this embodiment;

[0037] Figure 9 Cross-sectional schematic diagram of the polishing board of this embodiment;

[0038] Figure 10 Cross-sectional schematic diagram of the solder paste filled via circuit board of this embodiment;

[0039] Figure 11 Cross-sectional schematic diagram of the circuit board of this embodiment;

[0040] Figure 12 Physical diagram of the (partial) board surface after solder dipping and removing the protective film of this embodiment;

[0041] Figure 13 Physical diagram of the microsection observation of the via position of the solder paste filled via circuit board of this embodiment;

[0042] Figure 14 Physical diagram of the (partial) microsection observation of the via position of the solder paste filled via circuit board of this embodiment.

[0043] Explanation of the reference numerals in the drawings: 10, stacked structure; 110, core board; 1110, inner layer circuit pattern; 1120, compensation circuit pattern; 120, prepreg; 130, copper foil; 130A, copper layer; 20, laminated board; 210, insulating dielectric layer; 30, through-hole board; 310, through-hole; 1120F, non-compensation circuit; 40, electroplated board; 410, via hole; 4110, hole copper; 4120, semi-bridging copper layer; 420, electroplated copper layer; 50, protective film board; 510, protective film; 60, solder-dipped board; 610, solder; 60A, solder pot; 60B, molten solder; 70, polishing board; 80, solder paste filled via circuit board; 810, surface circuit pattern; 90, circuit board; 910, cover layer.

[0044] The realization, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0045] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0046] It should be noted that all the directional indications (such as up, down, left, right, front, back, inside, outside, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture (as shown in the attached drawings). If the specific posture changes, the directional indications will also change accordingly.

[0047] In addition, in the present invention, the descriptions such as "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0048] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0049] Please refer to Figure 1 ; Figure 1 which is the main process flow chart included in this embodiment.

[0050] On the one hand, the method for manufacturing a solder plug hole circuit board according to the embodiment of the present invention includes Figure 1 the main manufacturing process flow, which will be described in detail in the following steps.

[0051] Please refer to Figure 2 , Figure 3 ; Figure 2 which is the cross-sectional schematic diagram of the stacked structure of this embodiment; Figure 3 which is the cross-sectional schematic diagram of the pressing plate of this embodiment.

[0052] Step S10:

[0053] Manufacture the inner core board 110, and take the prepreg 120 and the copper foil 130. After stacking, form the stacked structure 10, and perform pressing to form the pressing plate 20 with a copper layer 130A on the surface.

[0054] In this embodiment, taking the manufacture of a multi-layer structure circuit board as an example, the pressing combination of the core board and the surface copper foil is adopted to form a multi-layer circuit board structure, and the multi-layer circuit structure includes an insulating dielectric layer 210.

[0055] Please refer to Figure 4 ; Figure 4 which is the cross-sectional schematic diagram of the through-hole board of this embodiment.

[0056] Step S20:

[0057] Drill through holes 310 in the press plate 20 to form a through-hole plate 30.

[0058] Furthermore, manufacturing the inner core board 110 includes taking a copper clad laminate and manufacturing an inner layer circuit pattern 1110 including a compensation circuit pattern 1120; the compensation circuit pattern 1120 is distributed corresponding to the through holes 310, and the single side of all sides or part of the sides is larger than the diameter of the through holes 310.

[0059] The through holes 310 formed in this embodiment are processed by pulse electroplating for deep hole electroplating in subsequent use. In order to provide conditions in the holes that are more easily electroplated with copper for pulse electroplating, a compensation circuit pattern 1120 is particularly set at positions where through holes 310 need to be made but there is no distribution of the inner layer circuit pattern 1110. After drilling the through holes 310, the compensation circuit pattern 1120 forms a hole ring on the inner layer of the through holes 310, which can provide favorable metal layer conditions for the growth of copper in the holes during subsequent pulse electroplating. Setting a complete hole ring means that the single side of all sides of the compensation circuit pattern 1120 is larger than the diameter of the through holes 310.

[0060] However, if the distribution of the inner layer circuit pattern 1110 is relatively dense and the distance between the through holes 310 and adjacent circuits is small, resulting in no large area for setting the compensation circuit pattern 1120, it can be not set or a half hole ring can be set, that is, the single side of part of the sides of the compensation circuit pattern 1120 is larger than the diameter of the through holes 310.

[0061] Preferably, the thickness of the inner layer circuit pattern 1110 ≤ 105 μm. In this embodiment, solder 610 is used to plug the holes. If the inner copper thickness is too thick, excessive heat conduction may cause the problem that it is difficult to fill the holes with solder due to too high temperature in the holes.

[0062] Preferably, the single side of all sides or part of the sides of the compensation circuit pattern 1120 is larger than the diameter of the through holes 310 by 20 μm to 0.1 mm. If the space is large, the hole ring of the inner layer circuit can be appropriately designed to be larger. If the space is small, the hole ring of the inner layer circuit can be appropriately designed to be smaller.

[0063] It can be seen that if the distance between the through holes 310 and the adjacent inner layer circuit pattern 1110 is close, the compensation circuit pattern 1120 cannot be set at this position, and a blank is selected, that is, a non-compensation circuit 1120F is formed.

[0064] Furthermore, the ratio of the thickness of the through-hole plate 30 to the diameter of the through holes 310 is 2:1 to 12:1.

[0065] In the post - process of this embodiment, the via holes 410 are filled with solder 610. If the ratio of the thickness of the via - hole board 30 to the diameter of the via - hole 310 is too large (i.e., the thickness - to - diameter ratio is too large), it is difficult for the solder 610 to enter the hole, resulting in problems such as voids in the hole filled with solder and detachment from the hole wall. If the ratio is too large, the solder 610 easily enters the hole but easily leaks out, causing the problem that it is difficult to retain the filled solder in the hole.

[0066] Please refer to Figure 5 ; Figure 5 which is a cross - sectional schematic diagram of the electroplated board of this embodiment.

[0067] Step S30:

[0068] The via - hole board 30 is electroplated to form an electroplated board 40. Before electroplating, pretreatment is required to clean the board body and perform copper deposition processing.

[0069] Furthermore, the electroplating is pulse electroplating. After the via - hole 310 undergoes pulse electroplating, a "hourglass - shaped" hole with a relatively thick copper thickness in the center and relatively thin copper thickness at both ends is formed. The diameter of the smallest channel position of the "hourglass - shaped" hole ≥ 0.2 mm.

[0070] Pulse electroplating is applicable to situations where strict requirements are imposed on the copper thickness of the inner wall of the hole and the copper deposition rate. Pulse electroplating can be used to electroplate a solid hole (electroplated copper fills the solid hole). The process is "pulse electroplating → bridging → filling with copper" for the via - hole 410. "Bridging" means that the copper in the center of the hole (the copper at the intersection of the two ends of the hole) first grows. After it grows completely and closes, a "bridge" body is formed when observed from a micro - section.

[0071] In this embodiment, when the thickness - to - diameter ratio of the circuit board is small, pulse electroplating is used, and only a semi - bridging copper layer 4120 is formed inside the via - hole 410. The semi - bridging copper layer 4120 makes the copper in the center of the hole grow to a certain thickness without completely closing it, and there is still a relatively small hole in the middle. This provides a flow channel for the molten solder 60B to enter the hole during subsequent tin dipping. The reason for using pulse electroplating to process the semi - bridging copper layer 4120 for a circuit board with a small thickness - to - diameter ratio is that for holes with a small thickness - to - diameter ratio (as described above), the solder 610 easily enters the hole but easily leaks out. The state of the semi - bridging copper layer 4120 can, to a certain extent, increase the thickness - to - diameter ratio, and the copper grown in the hole can provide more favorable attachment conditions for the solder 610.

[0072] Optionally, the main processing parameters of the pulse electroplating are: the forward current is 2.0 A·dm -2 to 7.0 A·dm -2 and the reverse current is 10.0 A·dm -2 to 25.0 A·dm -2, the pulse time ratio (positive: negative) is 80:2 to 80:10, and the jet frequency is 30 Hz to 60 Hz.

[0073] After electroplating, a certain thickness of electroplated copper layer 420 is also electroplated on the surface of the copper layer 130A, which can be used for the subsequent processing of the surface circuit.

[0074] It has been verified that the minimum diameter of the formed "hourglass-shaped" hole should not be too small, that is, the remaining hole channel after the semi-bridging copper layer 4120 should not be too small, otherwise problems such as tin filling blockage and voids will occur.

[0075] It should be noted that, compared with directly using pulse electroplating to process and form a solid electroplated copper hole, this embodiment combines the characteristic that the copper growth rate at the center of the hole is faster than that at both ends of the hole by pulse electroplating, and uses tin filling to replace the process of directly electroplating and filling copper in the subsequent process, effectively reducing the processing cost and greatly improving the processing efficiency.

[0076] It should be noted that, compared with the processing method of directly using ordinary electroplating to increase the overall thickness of the hole copper 4110, using pulse electroplating can, on the one hand, avoid excessive thickening of the surface copper thickness and prevent increasing the difficulty of subsequent process processing, and on the other hand, the cost of increasing the overall thickness of the hole copper 4110 is relatively high.

[0077] Furthermore, forming the electroplated board 40 further includes laser ablation processing on the center of the "hourglass-shaped" hole.

[0078] In order to effectively ensure the smoothness of the central channel of the semi-bridging copper layer 4120 of the "hourglass-shaped" hole and prevent problems such as copper spurs at the edge of the semi-bridging copper layer 4120 formed by pulse electroplating, laser ablation can be used for trimming to make the channel smooth.

[0079] Please refer to Figure 6 ; Figure 6 is a cross-sectional schematic diagram of the protective film board of this embodiment;

[0080] Step S40:

[0081] Attach a protective film 510 to the electroplated board 40 to form a protective film board 50.

[0082] Furthermore, attaching the protective film 510 includes: taking a high-temperature resistant blue glue, making an opening corresponding to the through hole 310, and then aligning and attaching it to the surface of the electroplated board 40.

[0083] For the subsequent tin immersion processing, only tin is filled into the via hole 410. Therefore, the area that does not need to be filled with tin is covered by the protective film 510, and at the same time, an opening needs to be made to expose the via hole 410. Optionally, the unilateral size of the opening is greater than the unilateral size of the via hole 410 by 20 μm to 50 μm to provide an error tolerance range for alignment; the temperature of the tin bath is generally 250 °C to 288 °C, and the high-temperature resistant blue glue needs to withstand this temperature impact.

[0084] Further, the application of the protective film 510 includes applying a high-temperature resistant dry film onto the surface of the electroplated board 40 and fabricating a high-temperature resistant dry film pattern, where the high-temperature resistant dry film pattern is an opening pattern corresponding to the through holes 310.

[0085] The use of high-temperature resistant dry film for processing the opening has higher precision and is more conducive to the high-precision processing of the circuit board.

[0086] Please refer to Figure 7 、 Figure 8 ; Figure 7 which is a cross-sectional schematic view of the solder-dipped board of this embodiment; Figure 8 which is a schematic view of the solder dipping process of this embodiment.

[0087] Step S50:

[0088] Perform solder dipping on the protective film board 50 to form a solder-dipped board 60;

[0089] Further, the solder dipping process involves completely immersing the protective film board 50 into the molten solder 60B in the solder pot 60A and then taking it out; the protective film board 50 is immersed at an angle with the surface of the molten solder 60B.

[0090] Optionally, this embodiment can use the solder pot 60A of the existing solder spraying process (hot air leveling process) for processing, and at the same time, the hot air blowing function is not turned on; optionally, the time for the protective film board 50 to be immersed and taken out of the solder pot 60A is 1 s to 5 s.

[0091] Immersing at an angle (instead of vertically immersing in the solder surface) can make the via holes 410 form an angle with the solder surface. When the molten solder 60B flows into the via holes 410, it is not easy to cause congestion and blockage, and it is more conducive to exhausting air and preventing problems such as solder plugging and voids. Optionally, the angle between the protective film board 50 and the solder surface is 3° to 10°.

[0092] Optionally, after the solder dipping process, the solder-dipped board 60 is allowed to stand and cool naturally, or the natural air blowing method is used to accelerate the cooling.

[0093] Please refer to Figure 9 , Figure 9 which is a cross-sectional schematic view of the grinding board of this embodiment;

[0094] Step S60:

[0095] Tear off the protective film 510 on the surface of the solder-dipped board 60 and perform grinding to form a grinding board 70.

[0096] Further, the grinding is performed using a belt grinding plate; optionally, the grinding parameters that can be used for the belt grinding plate are: grinding once with an 800-mesh belt and then once with a 1200-mesh belt, or grinding twice with a 1000-mesh belt and then once with a 1200-mesh belt, or grinding once with an 800-mesh belt, then once with a 1000-mesh belt, and then once with a 1200-mesh belt.

[0097] Since the hardness of the solder 610 is lower than that of the electroplated copper, the belt grinding can select appropriate grinding parameters according to the height and size of the solder 610 protruding from the board surface to avoid excessive grinding of the copper surface.

[0098] It should be noted that after grinding and leveling, if it is necessary to cover copper on the tin surface, the electroplating for thickening the surface copper layer can be further performed.

[0099] Please refer to Figure 10 , Figure 10 which is a cross-sectional schematic diagram of the solder plug hole circuit board of this embodiment.

[0100] Step S70:

[0101] Make the surface circuit pattern 810 on the grinding plate 70 and form the solder plug hole circuit board 80 through post-process machining.

[0102] Please refer to Figure 11 , Figure 11 which is a cross-sectional schematic diagram of the circuit board of this embodiment.

[0103] On the other hand, a circuit board 90 is provided, and its structure includes the solder plug hole circuit board 80 manufactured as described above; one or both sides of the solder plug hole circuit board 80 are covered by other layers of the circuit board 90 (i.e., Figure 11 the covering layer 910 in

[0104] The solder plug hole circuit board 80 manufactured in this embodiment can be selected as a finished board for use, or can be made into the internal layer of the circuit board 90 according to application, structure, and processing requirements, serving as the core board 110, or further laminating other layers based on the solder plug hole circuit board 80 to form other circuit board products.

[0105] Please refer to Figure 12 , Figure 13 and Figure 14 ; Figure 12 which is a (partial) physical diagram of the board surface after dipping in tin and tearing off the protective film of this embodiment; Figure 13 which is a physical diagram of the microsection observation of the hole position of the solder plug hole circuit board of this embodiment; Figure 14 which is a (partial) physical diagram of the microsection observation of the hole position of the solder plug hole circuit board of this embodiment.

[0106] It can be seen that the tin filling effect of the via hole 410 after tin immersion is good. The microsection shows that the hole is fully filled with tin without voids, poor bonding and other problems. After testing, all performances meet the requirements of relevant IPC standards.

[0107] It is worth noting that due to the actual design and processing of circuit boards, the actual structure diagram and the thickness of each layer, line width and other dimensions are all in the micron level. For example, the thickness of each layer is generally 5μm to 50μm. If the drawings in the specification are made according to the actual proportion, there will be a problem of unclear drawings. Therefore, in order to more clearly show the implementation process of the manufacturing method, the drawings of this embodiment are all schematic diagrams that enlarge the technical features, which do not represent the size of the actual structure diagram, nor do they represent enlarged views of the actual structure diagram in proportion.

[0108] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A manufacturing method of a solder-filled via circuit board, characterized in that: The manufacturing method includes the following steps: S10: Manufacture an inner core board, and take prepreg and copper foil. After stacking and pressing, a pressed board with a copper layer on the surface is formed; S20: Drill through holes in the pressed board to form a through-hole board; The ratio of the thickness of the through-hole board to the diameter of the through hole is 2:1 to 12:1; S30: Electroplate the through-hole board to form an electroplated board; The electroplating is pulse electroplating. After the through hole undergoes the pulse electroplating, a "hourglass-shaped" hole with a thicker copper thickness in the center and thinner copper thicknesses at both ends is formed; Forming the electroplated board further includes laser ablation processing on the center of the hole of the "hourglass-shaped" hole; S40: Stick a protective film on the electroplated board, and make openings corresponding to the through holes to form a protective film board; S50: Perform tin dipping processing on the protective film board to form a tin-dipped board; The tin dipping processing is to completely immerse the protective film board into the molten tin in a tin bath and then take it out; the protective film board is immersed at an angle to the surface of the tin; S60: Tear off the protective film on the surface of the tin-dipped board and perform grinding to form a ground board; S70: Make a surface circuit pattern on the ground board and perform post-process processing to form the tin-filled via circuit board.

2. The manufacturing method of a solder-filled via circuit board according to claim 1, characterized in that: Manufacturing the inner core board includes taking a copper clad laminate and making an inner layer circuit pattern including a compensation circuit pattern; the compensation circuit pattern is distributed corresponding to the through holes, and the single side of all sides or some sides is larger than the diameter of the through hole.

3. The manufacturing method of a solder plugging hole circuit board according to claim 1, characterized in that: Sticking the protective film includes: taking high-temperature resistant blue glue, making openings corresponding to the through holes, and then aligning and attaching it to the surface of the electroplated board.

4. The manufacturing method of a solder plugging hole circuit board according to claim 1, characterized in that: Sticking the protective film includes sticking a high-temperature resistant dry film on the surface of the electroplated board and making a high-temperature resistant dry film pattern, and the high-temperature resistant dry film pattern is an opening pattern corresponding to the through holes.

5. The manufacturing method of a solder plugging via circuit board according to claim 1, wherein: The grinding is performed using a sand belt grinding plate.

6. A circuit board, characterized in that, The structure of the circuit board includes the tin-filled via circuit board according to any one of claims 1 to 5; one side or both sides of the tin-filled via circuit board are covered by other layers of the circuit board.

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