Electronic control device

Abstract

An electronic control device is provided with: a circuit board having a wiring board on which a wiring pattern including a high-speed signal line is formed, and an electronic component mounted on a first surface of the wiring board and connected to the high-speed signal line; a housing that houses the circuit board; and a first heat conductive member in contact with the electronic component and the housing. The first heat conductive member is configured to extend from an upper surface of the electronic component to the housing, and is configured to contact a part of an outer peripheral surface of the electronic component at a position away from the high-speed signal line and extend from the first surface of the wiring board to the housing.

Description

Technical Field

[0001] The present invention relates to an electronic control device, and more particularly to an electronic control device in which a circuit substrate is housed in a casing. Background Art

[0002] A plurality of electronic control devices are generally mounted on vehicles such as automobiles. An electronic control device mounted on a vehicle (hereinafter sometimes referred to as an on-vehicle electronic control device) is a structure in which a circuit board on which electronic components are mounted is housed inside a housing.

[0003] In recent years, the functionality of vehicle-mounted electronic control devices has been developing, led by electronic control devices for autonomous driving and advanced driver assistance systems, and the heat generated by electronic components has tended to increase. If the temperature of an electronic component rises above the rated temperature, the function of the electronic component decreases, which may cause malfunction of the electronic control device. Therefore, in order to suppress the temperature rise caused by the heat generated by the electronic component, a method is known to dissipate the heat of the electronic component to the frame by using a thermal interface material (TIM) such as heat dissipation grease (for example, refer to Patent Document 1).

[0004] The electronic control device described in Patent Document 1 is configured to transfer the heat generated by the electronic component to the housing by filling a heat dissipation gel (TIM) between the mounting surface of a substrate on which a heat-generating electronic component (e.g., a power MOSFET as a semiconductor element) is mounted and the opposite surface of a housing opposite to the mounting surface (e.g., see Patent Document 1). Fig.18 ). That is, the heat dissipation gel is filled in a manner that completely covers the entire outer surface (the upper surface and the entire circumference of the side surface) of the electronic component mounted on the substrate. Prior art literature Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2011-023593 Summary of the invention Problem that the invention aims to solve

[0006] However, in electronic control devices used for autonomous driving or advanced driver assistance systems, the electronic components that generate heat are sometimes high-function components that operate at high speed, such as SoC (System-on-Chip) with a BGA (Ball Grid Array) packaging structure. Such high-function electronic components are often electrically connected to high-speed signal lines. In this specification, electronic components that operate at an operating frequency higher than 100 MHz are defined as electronic components that can operate at high speed, and signal lines used to transmit high-frequency signals higher than 100 MHz are defined as high-speed signal lines.

[0007] For high-function electronic components that can operate at high speed, in order to improve heat dissipation, it is envisioned that the technology described in Patent Document 1 is used. In this case, since the TIM is configured to cover the entire outer surface (the upper surface and the entire circumference of the side) of the electronic component connected to the high-speed signal line on the substrate, it may cause the quality of the high-frequency signal transmitted to the high-speed signal line to be reduced and the radiation noise to increase. This is because the TIM covering the electronic component becomes a state between the high-speed signal line configured on the substrate and the shell, so the electrostatic capacitance between the high-speed signal line and the shell increases due to the TIM. The increase in this electrostatic capacitance becomes the main reason for the reduction in the quality of the high-frequency signal and the increase in the radiation noise. When the quality of the high-frequency signal is reduced or the radiation noise increases, the high functionality of the vehicle-mounted electronic control device may be reduced.

[0008] In addition, in the technology described in Patent Document 1, power MOSFET is listed as a heat-generating electronic component mounted on a substrate. Power MOSFET usually operates at a frequency lower than 100 MHz, which is assumed to be a high-speed operation in this specification. Therefore, it is not necessary to consider the above-mentioned problems such as the degradation of high-frequency signal quality and the increase of radiation noise caused by the configuration of TIM for improving the heat dissipation of electronic components.

[0009] The present invention is proposed to solve the above-mentioned problems, and an object of the present invention is to provide an electronic control device capable of ensuring the quality of high-frequency signals and suppressing radiation noise while maintaining heat dissipation. Technical means of solving problems

[0010] The present application includes a plurality of means for solving the above-mentioned problems. As an example, an electronic control device is provided, which comprises: a circuit substrate having a wiring board formed with a wiring pattern including a high-speed signal line, and an electronic component mounted on a first surface of two surfaces of the wiring board and electrically connected to the high-speed signal line; a frame that accommodates the circuit substrate; and a first heat-conducting member that is in direct contact with the electronic component and the frame, wherein the electronic component comprises: a bottom surface facing the first surface of the wiring board, an upper surface located on the opposite side of the bottom surface, and an outer peripheral surface connected to an outer edge of the bottom surface and an outer edge of the upper surface, wherein the first heat-conducting member is configured to extend from the upper surface of the electronic component to the frame, and is configured to contact a portion of the outer peripheral surface of the electronic component at a position avoiding the high-speed signal line, and extends from the first surface of the wiring board to the frame. Effects of the Invention

[0011] According to the present invention, the first heat conducting member is arranged to be in contact with the upper surface and a part of the outer peripheral surface of the electronic component, so that the heat dissipation can be maintained, and the first heat conducting member is arranged at a position away from the high-speed signal line, so that the increase of the electrostatic capacitance between the high-speed signal line and the frame body caused by the arrangement of the first heat conducting member can be avoided. Thus, the quality of the high-frequency signal can be ensured and the radiation noise can be suppressed while maintaining the heat dissipation. The other objects, structures, and effects than those described above will become clear from the following description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic perspective view showing an electronic control device according to an embodiment of the present invention in an exploded state. Figure 2 This is a schematic cross-sectional view showing an electronic component and its peripheral structure on a circuit board in the electronic control device according to the first embodiment. Figure 3 This is a schematic plan view showing electronic components and their peripheral structures on a circuit board in the electronic control device according to the first embodiment. Figure 4 Yes means Figure 3 FIG. 1 is a schematic perspective view of an electronic component and its peripheral structure in a circuit board of an electronic control device according to a first embodiment. Figure 5 This is a schematic plan view showing electronic components and their peripheral structures on a circuit board in an electronic control device of a comparative example to the electronic control device of the first embodiment. Figure 6 This is a schematic cross-sectional view (a cross section taken along the upper surface of the electronic component) showing the arrangement of a TIM in contact with a side surface of an electronic component of a circuit board in an electronic control device according to a first modification of the first embodiment. Figure 7 This is a schematic cross-sectional view (a cross section taken along the upper surface of the electronic component) showing the arrangement of a TIM in contact with a side surface of an electronic component of a circuit board in an electronic control device according to a second modification of the first embodiment. Figure 8 This is a schematic cross-sectional view (a cross section taken along the upper surface of the electronic component) showing the arrangement of a TIM in contact with a side surface of an electronic component of a circuit board in an electronic control device according to a third modified example of the first embodiment. Fig. 9 This is a perspective view showing an electronic component and its peripheral structure on a circuit board in an electronic control device according to a second embodiment of the present invention. Fig.10 This is a schematic bottom view showing electronic components and their peripheral structures on a circuit board in an electronic control device according to a second embodiment. Fig.11 This is a perspective view showing an electronic component on a circuit board and its peripheral structure in an electronic control device according to a first example of a first modification of the second embodiment. Fig.12 This is a perspective view showing electronic components and their peripheral structures on a circuit board in an electronic control device according to a second example of the first modified example of the second embodiment. Fig.13 This is a cross-sectional view showing an electronic component and its peripheral structure on a circuit board in an electronic control device according to a first example of a second modification of the second embodiment. Fig.14 This is a cross-sectional view showing an electronic component and its peripheral structure on a circuit board in an electronic control device according to a second example of a second modification of the second embodiment. Fig.15 This is a schematic diagram showing the arrangement relationship between electronic components and heat transfer paths (through holes) on a circuit board in an electronic control device according to a first example of a third modified example of the second embodiment. Fig.16 This is a schematic diagram showing the arrangement relationship between electronic components and heat transfer paths (through holes) on a circuit board in an electronic control device according to a second example of the third modification of the second embodiment. Fig.17 This is a profile diagram showing the heat flow rate of the circuit board in the electronic control device according to the first example of the third modified example of the second embodiment. Fig.18 This is a schematic cross-sectional view showing an electronic component and its peripheral structure on a circuit board in an electronic control device according to a third embodiment of the present invention. Fig.19 It is a schematic perspective view showing the appearance of an electronic control device according to a fourth embodiment of the present invention. Fig. 20 It is a schematic perspective view showing the appearance of an electronic control device according to a fifth embodiment of the present invention. DETAILED DESCRIPTION

[0013] Hereinafter, an embodiment of the electronic control device of the present invention will be described using the drawings. In this specification and the drawings, elements having substantially the same function or configuration are denoted by the same reference numerals, and duplicate descriptions are omitted.

[0014] [First embodiment] First, use Figure 1 The configuration and structure of the electronic control device according to the first embodiment will be described. Figure 1 It is a schematic perspective view showing the electronic control device according to the embodiment in an exploded state.

[0015] exist Figure 1In the embodiment, the electronic control device 1 is a control device that performs high-speed communication. The electronic control device 1 is mounted on a vehicle (not shown) and used as a control device that controls or assists vehicle driving. The electronic control device 1 can also be used as a control device for a millimeter wave radar or a vehicle-mounted camera. The control object of the electronic control device 1 is not limited to a specific object.

[0016] The electronic control device 1 includes a circuit board 2 constituting an electronic circuit and a housing 3 accommodating the circuit board 2 .

[0017] The circuit board 2 has a high-speed signal line 12 (see the following) formed thereon. Figure 3 ) and a plurality of electronic components 14 mounted on the printed wiring board 11. The printed wiring board 11 has two surfaces, a first surface 11a and a second surface 11b, on which electronic components can be mounted. The printed wiring board 11 may be either a single-sided substrate having a wiring pattern formed on only one of the first surface 11a and the second surface 11b, or a double-sided substrate having wiring patterns formed on both surfaces. The printed wiring board 11 is, for example, composed of a rigid substrate using glass epoxy resin as a base material. The electronic components 14 include, in addition to various elements such as resistors, capacitors, diodes, storage elements, switching elements, and connectors 15, electronic components 16 that generate heat and require heat dissipation measures. In the Figure 1 In the circuit board 2 shown, the electronic component 16 that generates heat is mounted on the first surface 11a of the printed wiring board 11. That is, the first surface 11a of the printed wiring board 11 is the mounting surface of the electronic component 16 that generates heat.

[0018] The heat-generating electronic component 16 in the present embodiment is an electronic component that can operate at a high-speed operating frequency of hundreds of MHz to several GHz. The electronic component 16 that can operate at high speed (hereinafter sometimes referred to as a high-speed electronic component) is accompanied by high-speed processing, and the power consumption is very high, sometimes reaching tens of W, and a large amount of heat is generated. The high-speed electronic component 16 is, for example, a high-function component such as a microcontroller with a processor such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit), or an IC (Integrated Circuit) chip or a semiconductor chip. The high-function electronic component 16 is, for example, capable of high-speed communication with various electronic components such as a DDR memory or a SERializer with a signal conversion function. As a high-speed electronic component 16, for example, a memory capable of high-speed operation that can communicate at high speed with a microcontroller including the above-mentioned processor through a high-speed communication line is also included. The electronic component 16 with a high operating speed generates a large amount of heat, so a heat dissipation countermeasure is required. The specific structure of the high-speed electronic component 16 will be described later.

[0019] The frame 3 is composed of, for example, a housing body 21 that forms an internal space for accommodating the circuit board 2 and a cover 22 that closes an opening for inserting the circuit board 2 into the housing body 21. The housing body 21 has an opposing surface 21a (see below) that is opposed to the first surface 11a (mounting surface of the electronic component 16) of the printed wiring board 11. Figure 2 The cover 22 is disposed opposite to the second surface 11b of the printed wiring board 11. The housing body 21 and the cover 22 are formed of a metal material, for example, from the viewpoint of heat dissipation. The housing body 21 and the cover 22 in a state where the circuit board 2 is stored are joined by a plurality of screws 23.

[0020] Next, use Figures 2 to 4 The configuration of high-speed electronic components and the heat dissipation structure for the high-speed electronic components in the electronic control device according to the first embodiment will be described. Figure 2 This is a schematic cross-sectional view showing an electronic component and its peripheral structure on a circuit board in the electronic control device according to the first embodiment. Figure 3 This is a schematic plan view showing electronic components and their peripheral structures on a circuit board in the electronic control device according to the first embodiment. Figure 4 Yes means Figure 3 FIG. 1 is a schematic perspective view of an electronic component and its peripheral structure in a circuit board of an electronic control device according to a first embodiment.

[0021] For example, Figure 2 As shown, the electronic component 16 capable of high-speed operation has an IC chip 32 as a heat source built into a semiconductor package of a BGA (Ball Grid Array) structure. In more detail, the electronic component 16 includes: an IC chip 32 arranged on a substrate 31, solder balls 33 capable of electrically connecting the IC chip 32 to the wiring pattern on the circuit substrate 2, a cover 34 covering and protecting the IC chip 32; and a packaging resin 35 filled in the cover 34 and encapsulating the IC chip 32. The electronic component 16 is formed into a flat rectangular parallelepiped, and is formed into a rectangle when viewed from the upper surface 16b side described later. For example, Figure 2 to Figure 4 As shown, the outer surface of the high-speed electronic component 16 includes: a bottom surface 16a on the solder ball 33 side facing the first surface 11a of the printed wiring board 11, an upper surface 16b located on the opposite side of the bottom surface 16a, and an outer peripheral surface 16c connected to the outer edge of the bottom surface 16a and the outer edge of the upper surface 16b. The upper surface 16b of the electronic component 16 is opposite to the opposite surface 21a of the housing body 21 of the frame body 3. The outer peripheral surface 16c of the electronic component 16 is composed of four side surfaces.

[0022] like Figure 3 and Figure 4As shown, the electronic component 16 for high-speed processing is connected to the high-speed signal line 12 (a part of the wiring pattern) on the printed wiring board 11. The high-speed signal line 12 is configured as a signal line capable of transmitting a high-frequency signal of several hundred MHz to several GHz. The high-speed signal line 12 extends from two side surfaces 16c located on opposite sides of each other among the four side surfaces 16c of the electronic component 16, for example. More specifically, the high-speed signal line 12 extends from the area side close to the corner of the side surface 16c of the electronic component 16.

[0023] The high-speed electronic component 16 generates heat due to the high-speed operation of the IC chip 32, so a heat dissipation countermeasure is required. Figure 2 to Figure 4 As shown, the outer surface of the high-speed electronic component 16 is thermally connected to the housing body 21 of the frame body 3 via the heat-conducting member 40. That is, the heat-conducting member 40 is thermally connected by directly contacting the electronic component 16 and the housing body 21, and has the function of transferring the heat generated by the electronic component 16 to the housing body 21. The heat-conducting member 40 is made of a resin to which a heat-conducting filler is added. As the heat-conducting member 40, for example, a TIM (Thermal Interface Material) such as a heat-dissipating grease or a heat-conducting sheet mainly made of silicone, acrylic, epoxy resin, or polyurethane resin is used.

[0024] like Figure 3 and Figure 4 As shown, the heat conducting member 40 in this embodiment is arranged to contact a part of the upper surface 16b and the side surface 16c of the outer surface of the electronic component 16 at a position avoiding the space on the high-speed signal line 12 of the printed wiring board 11. Specifically, the heat conducting member 40 includes, for example, an upper surface conducting portion 41 which is arranged to extend from the upper surface 16b of the electronic component 16 to the opposite surface 21a of the housing body 21; and four side surface conducting portions 42 which are arranged to contact the central portion (a part) of each of the four side surfaces 16c of the electronic component 16 and extend from the printed wiring board 11 to the opposite surface 21a of the housing body 21. The upper surface conducting portion 41 contacts the upper surface 16b of the electronic component 16 so as to include the entire area of ​​the orthographic projection of the IC chip 32 with respect to the upper surface 16b of the electronic component 16. The side surface conduction portion is composed of a first side surface conduction portion 42a and a second side surface conduction portion 42b. The first side surface conduction portion 42a is formed to protrude in a substantially semi-elliptical shape from the center portions of the two side surfaces 16c of the electronic component 16 on the side where the high-speed signal line 12 does not extend when viewed from the upper surface 16b of the electronic component 16, and the second side surface conduction portion 42b is formed to protrude in a substantially semi-elliptical shape from the center portions of the two side surfaces 16c of the electronic component 16 on the side where the high-speed signal line 12 extends. The second side surface conduction portion 42b is arranged to contact the center portion of the side surface 16c which is a position away from the high-speed signal line 12, and not to contact one end portion of the side surface 16c which is located on the high-speed signal line 12.

[0025] Next, the effects of the heat transfer member in the electronic control device of the first embodiment will be described using an electronic control device of a comparative example. Figure 5 A heat dissipation structure of an electronic control device according to a comparative example will be described. Figure 5 1 is a schematic top view showing an electronic component and its surrounding structure of a circuit board in an electronic control device of a comparative example to the electronic control device of the first embodiment. Figure 5 In, with Figure 1 to Figure 4 The same symbols as shown are the same parts, and their detailed description is omitted.

[0026] Figure 5 The electronic control device 100 of the comparative example shown has the same configuration and structure of the circuit substrate 2 and the frame 3 as the electronic control device 1 of the present embodiment, but has a different heat dissipation structure. Specifically, in the electronic control device 100 of the comparative example, the entire outer surface of the electronic component 16 mounted on the first surface 11a of the printed wiring board 11 of the circuit substrate 2 is connected to the housing body 21 ( Figure 5 That is, the heat conducting member 140 is in contact with the entire upper surface 16b and the entirety of the four side surfaces 16c (the entire outer peripheral surface) of the electronic component 16. Specifically, the heat conducting member 140 includes: an upper surface conducting portion 141, which is configured to conduct from the upper surface 16b of the electronic component 16 to the opposite surface 21a ( Figure 5 The side conductive portion 142 is configured to contact the entirety of the four side surfaces 16c of the electronic component 16 and to extend from the first surface 11a of the printed wiring board 11 to the opposite surface 21a of the housing body 21. Therefore, in the electronic control device 100 of the comparative example, a portion of the side conductive portion 142 of the heat conductive member 140 is located in the space above the high-speed signal line 12 of the printed wiring board 11. In addition, the material of the heat conductive member 140 in the electronic control device 100 of the comparative example is the same as the material of the heat conductive member 40 in the electronic control device 1 of the present embodiment.

[0027] Next, based on the influence of the heat conducting member when the electronic control device of the comparative example is operated, Figure 2 to Figure 5 The effects of the heat transfer member in the electronic control device according to the first embodiment will be described.

[0028] exist Figure 5In the operation of the electronic control device 100 of the comparative example shown, the electronic component 16 communicates with other electronic components at high speed. When the electronic component 16 is a high-function component, for example, high-speed communication is performed with a memory via the high-speed signal line 12 on the printed wiring board 11. By performing such communication, various electronic components 14 (see FIG. 1 ) mounted on the printed wiring board 11, including the electronic component 16, are connected to the printed wiring board 11. Figure 1 ) generates heat, so the temperature of the electronic control device 100 of the comparative example rises. At this time, the heat of the electronic component 16 is transferred from the entire upper surface 16b of the electronic component 16 to the upper surface conduction portion 141 of the heat conductive member 140, and is transferred from the entirety of the four side surfaces 16c of the electronic component 16 to the side conduction portion 142 of the heat conductive member 140. The heat transferred to the upper surface conduction portion 141 of the heat conductive member 140 and the heat transferred to the side conduction portion 142 of the heat conductive member 140 are transmitted to the heat conductive member 140 via the case body 21 (refer to FIG. 2 ) of the frame body 3. Figure 1 ) is released to the outside of the frame 3 and is transferred to the printed wiring board 11. In the electronic control device 100 of the comparative example, since the heat conductive member 140 is configured to be in contact with the entire upper surface 16b and the entire four side surfaces 16c of the electronic component 16, the heat dissipation effect of the heat conductive member 140 can be improved.

[0029] However, in the electronic control device 100 of the comparative example, a part of the side conductive portion 142 of the heat conductive member 140 occupies the space on the high-speed signal line 12 of the printed wiring board 11. Due to the arrangement of the heat conductive member 140, the electrostatic capacitance between the high-speed signal line 12 and the housing body 21 increases. The electrostatic capacitance C is represented by the following formula (1).

[0030] C=ε·S / L…Formula (1) In formula (1), ε represents the relative dielectric constant, S represents the area of ​​the high-speed signal line 12 in the arrangement area of ​​the heat conductive member 140, and L represents the distance from the high-speed signal line 12 to the housing body 21. The relative dielectric constant of air is 1, and the relative dielectric constant of the heat conductive member 140 is, for example, approximately 8. That is, the relative dielectric constant of the heat conductive member 140 is approximately 8 times that of air.

[0031] Thus, in the electronic control device 100 of the comparative example, the electrostatic capacitance between the high-speed signal line 12 of the printed wiring board 11 and the housing body 21 increases due to the arrangement of the heat conducting member 140. As a result, the quality of the high-frequency signal transmitted to the high-speed signal line 12 is reduced, and the radiation noise is increased. When the quality of the high-frequency signal is reduced or the radiation noise is increased, the high functionality of the electronic control unit 100 may be reduced.

[0032] In contrast, in the electronic control device 1 of the present embodiment, the heat conducting member 40 is arranged so as to contact a portion of the outer peripheral surface 16c of the electronic component 16 at a position avoiding the high-speed signal line 12 and to extend from the first surface 11a of the printed wiring board 11 to the housing body 21 of the frame body 3. As a result, in the region between the high-speed signal line 12 and the housing body 21, since the heat conducting member 40 is not arranged and air exists, the electrostatic capacitance of the region does not increase. Therefore, there is no need to worry about the quality of the high-frequency signal transmitted on the high-speed signal line 12 being degraded or the increase of the radiation noise due to the arrangement of the heat conducting member 40.

[0033] Furthermore, in the present embodiment, the heat conducting member 40 is arranged to contact a portion of each of the four side surfaces 16c in addition to the upper surface 16b of the electronic component 16. Thus, the heat of the electronic component 16 is transferred to the heat conducting member 40 from not only the upper surface 16b but also the four side surfaces 16c, thereby maintaining heat dissipation.

[0034] In addition, in the present embodiment, the heat conducting member 40 is arranged so as to be in contact with only a portion of each of the four side surfaces 16c of the electronic component 16. The heat conducting member 40 arranged in this way can reduce the amount of heat conducting member used compared to the heat conducting member 140 arranged so as to be in contact with the entire four side surfaces 16c of the electronic component 16 in the electronic control device 100 of the comparative example.

[0035] [Modification of the first embodiment] Next, use Figure 6 to Figure 8 An electronic control device according to a modified example of the first embodiment will be described. Figure 6 This is a schematic cross-sectional view (a cross section taken along the upper surface of the electronic component) showing the arrangement of a TIM in contact with a side surface of an electronic component of a circuit board in an electronic control device according to a first modification of the first embodiment. Figure 7 This is a schematic cross-sectional view (a cross section taken along the upper surface of the electronic component) showing the arrangement of a TIM in contact with a side surface of an electronic component of a circuit board in an electronic control device according to a second modification of the first embodiment. Figure 8 This is a schematic cross-sectional view (a cross section taken along the upper surface of the electronic component) showing the arrangement of a TIM in contact with a side surface of an electronic component of a circuit board in an electronic control device according to a third modified example of the first embodiment.

[0036] Figure 6The first modification of the first embodiment shown is different from the first embodiment in that the arrangement of the high-speed signal line 12A connected to the high-speed electronic component 16 on the printed wiring board 11 of the circuit substrate 2A is different, and the structure of the heat conductive member 40A is different. Specifically, the high-speed signal line 12A extends from the adjacent two side surfaces 16c of the four side surfaces 16c of the electronic component 16. One of the high-speed signal lines 12A extends from the central portion of one side surface 16c of the adjacent side surfaces 16c of the electronic component 16. The other high-speed signal line 12A extends from the vicinity of the corner of the other side surface 16c of the adjacent side surfaces 16c of the electronic component 16. The heat conductive member 40A is arranged to contact a portion of the outer peripheral surface 16c of the electronic component 16 at a position avoiding the high-speed signal line 12A according to the arrangement of the high-speed signal line 12A on the printed wiring board 11, and extends from the first surface 11a of the printed wiring board 11 to the housing body 21 of the frame 3. Specifically, the heat conducting member 40A includes an upper surface conducting portion 41 (not shown) and a side surface conducting portion 42A, the side surface conducting portion 42A being arranged to contact the center portion of the side surfaces 16c located on the opposite sides of the four side surfaces 16c of the electronic component 16 and extending from the first surface 11a of the printed wiring board 11 to the housing body 21 of the frame body 3. The heat conducting member is not arranged on the side surface 16c of the electronic component 16 where the high-speed signal line 12A is arranged on the center side.

[0037] Figure 7 The second modification of the first embodiment shown is different from the first embodiment in that the arrangement of the high-speed signal line 12B connected to the electronic component 16 on the printed wiring board 11 of the circuit substrate 2B is different, and the structure of the heat-conducting member 40B is different. Specifically, the high-speed signal line 12B extends from the central part side of two adjacent side surfaces 16c among the four side surfaces 16c of the electronic component 16. The heat-conducting member 40B is arranged to contact a part of the outer peripheral surface 16c of the electronic component 16 at a position avoiding the high-speed signal line 12B according to the arrangement of the high-speed signal line 12B on the printed wiring board 11, and extends from the first surface 11a of the printed wiring board 11 to the housing body 21 of the frame body 3. Specifically, the heat conducting member 40 includes an upper surface conducting portion 41 (not shown) and a side surface conducting portion 42B, the side surface conducting portion 42B being arranged to contact the entirety of two adjacent side surfaces 16c of the four side surfaces 16c of the electronic component 16 where the high-speed signal line 12 is not arranged, and extending from the first surface 11a of the printed wiring board 11 to the housing body 21 of the frame body 3. The heat conducting member is not arranged on the side surface 16c of the electronic component 16 where the high-speed signal line 12A is arranged.

[0038] Figure 8The third modification of the first embodiment shown is different from the first embodiment in that the arrangement of the high-speed signal line 12C connected to the high-speed electronic component 16 on the printed wiring board 11 of the circuit substrate 2C is different, and the structure of the heat conductive member 40C is different. Specifically, the high-speed signal line 12C extends from the central portion of two side surfaces 16c located on opposite sides of each other among the four side surfaces 16c of the electronic component 16. The heat conductive member 40C is arranged to contact a part of the outer peripheral surface 16c of the electronic component 16 at a position avoiding the high-speed signal line 12C according to the arrangement of the high-speed signal line 12C on the printed wiring board 11, and extends from the first surface 11a of the printed wiring board 11 to the housing body 21 of the frame 3. Specifically, the heat conducting member 40C includes an upper surface conducting portion 41 (not shown) and a side surface conducting portion 42C, the side surface conducting portion 42C being arranged so as to be in contact with the entire side surface 16c of the four side surfaces 16c of the electronic component 16 on which the high-speed signal line 12 is not arranged, and extending from the first surface 11a of the printed wiring board 11 to the housing body 21 of the frame body 3. The heat conducting member is not arranged on the side surface 16c of the electronic component 16 on which the high-speed signal line 12C is arranged.

[0039] The heat conducting members 40A, 40B, 40C of the first to third modified examples are arranged so as to contact a part of the outer peripheral surface 16c of the electronic component 16 at a position avoiding the high-speed signal lines 12A, 12B, 12C according to the arrangement of the high-speed signal lines 12A, 12B, 12C on the printed wiring board 11 and extend from the first surface 11a of the printed wiring board 11 to the housing body 21 of the frame body 3. Therefore, as in the first embodiment, there is no concern about the quality of the high-frequency signal transmitted by the high-speed signal lines 12A, 12B, 12C being degraded or the radiation noise being increased due to the arrangement of the heat conducting members 40A, 40B, 40C.

[0040] In addition, the heat conducting member 40A of the first modified example is in contact with a part of two of the four side surfaces 16c in addition to the upper surface 16b of the electronic component 16. Therefore, the heat of the electronic component 16 is transferred from the two side surfaces 16c in addition to the upper surface 16b, so that the heat dissipation can be maintained. In addition, since the heat conducting member 40A is arranged to be in contact with a part of two of the four side surfaces 16c of the electronic component 16, the amount of the heat conducting member 40A used can be reduced compared with the heat conducting member 40 in the first embodiment that is in contact with a part of each of the four side surfaces 16c of the electronic component 16.

[0041] In addition, the heat conducting member 40B of the second modified example is in contact with the entirety of two of the four side surfaces 16c in addition to the upper surface 16b of the electronic component 16. Therefore, the heat of the electronic component 16 is transferred not only from the upper surface 16b but also from the entirety of the two side surfaces 16c, so that the heat dissipation can be maintained.

[0042] In addition, the heat conducting member 40C of the third modification is in contact with the entirety of one of the four side surfaces 16c in addition to the upper surface 16b of the electronic component 16. Therefore, the heat of the electronic component 16 is transferred not only from the upper surface 16b but also from the entirety of one of the side surfaces 16c, so that heat dissipation can be maintained.

[0043] As described above, the electronic control device 1 of the first embodiment and its modified example comprises: a circuit substrate 2, 2A, 2B, 2C having a printed wiring board 11 (wiring board) on which a wiring pattern including high-speed signal lines 12, 12A, 12B, 12C is formed, and an electronic component 16 mounted on a first surface 11a of both surfaces of the printed wiring board 11 (wiring board) and electrically connected to the high-speed signal lines 12A, 12B, 12C; a housing 3 accommodating the circuit substrate 2, 2A, 2B, 2C; and a heat conducting member 40, 40A, 40B, 40C (first heat conducting member) in direct contact with the electronic component 16 and the housing 3. The electronic component 16 has a bottom surface 16a facing the first surface 11a of the printed wiring board 11 (wiring board), an upper surface 16b located on the opposite side of the bottom surface 16a, and an outer peripheral surface 16c connected to the outer edge of the bottom surface 16a and the outer edge of the upper surface 16b. The heat-conducting members 40, 40A, 40B, 40C (first heat-conducting members) are configured to extend from the upper surface 16b of the electronic component 16 to the frame 3, and are configured to contact a portion of the outer peripheral surface 16c of the electronic component 16 at a position avoiding the high-speed signal lines 12, 12A, 12B, 12C and extend from the first surface 11a of the printed wiring board 11 (wiring board) to the frame 3.

[0044] According to this configuration, the heat dissipation can be maintained by arranging the heat conducting members 40, 40A, 40B, 40C (first heat conducting member) in contact with a portion of the upper surface 16b and the outer peripheral surface 16c of the electronic component 16, and the heat conducting members 40, 40A, 40B, 40C (first heat conducting member) are arranged at positions avoiding the high-speed signal lines 12, 12A, 12B, 12C, so that the increase in electrostatic capacitance between the high-speed signal lines 12, 12A, 12B, 12C and the frame 3 caused by the arrangement of the heat conducting members 40, 40A, 40B, 40C (first heat conducting member) can be avoided. Thus, the quality of high-frequency signals can be ensured and radiation noise can be suppressed while maintaining the heat dissipation.

[0045] In addition, the electronic component 16 in the electronic control device 1 of the first embodiment is configured to be rectangular when viewed from the upper surface 16b side, and has four side surfaces as the outer peripheral surface 16c. In addition, the heat conducting member 40 (first heat conducting member) is arranged to contact a part of each of the four side surfaces 16c of the electronic component 16 at a position avoiding the high-speed signal line 12, and extends from the first surface 11a of the printed wiring board 11 (wiring board) to the frame 3.

[0046] According to this configuration, since the heat of the electronic component 16 is transferred to the heat conducting member 40 (first heat conducting member) from each of the four side surfaces 16c in addition to the upper surface 16b, the heat dissipation can be improved compared to a case where the heat conducting member 40 (first heat conducting member) is not in contact with any of the four side surfaces 16c of the electronic component 16.

[0047] In addition, the electronic control device 1 of the first embodiment has an IC chip 32 (chip) as a heat source having an electronic component built therein. In addition, the heat conducting member 40 (first heat conducting member) is in contact with the upper surface 16 b of the electronic component 16 so as to include the entire area of ​​the orthographic projection of the IC chip 32 (chip) with respect to the upper surface 16 b of the electronic component 16.

[0048] According to this configuration, since the heat conducting member 40 (first heat conducting member) is in contact with a region of the upper surface 16 b of the electronic component 16 that has reached a relatively high temperature due to the heat of the IC chip 32 (chip) as a heat source, heat dissipation by the heat conducting member 40 (first heat conducting member) can be improved.

[0049] [Second embodiment] Next, use Fig. 9 and Fig.10 An electronic control device according to a second embodiment of the present invention will be described. Fig. 9 This is a perspective view showing an electronic component and its peripheral structure on a circuit board in an electronic control device according to a second embodiment of the present invention. Fig.10 This is a schematic bottom view showing electronic components and their peripheral structures on a circuit board in an electronic control device according to a second embodiment.

[0050] Fig. 9 and Fig.10 The electronic control device 1D of the second embodiment shown is different from the first embodiment mainly in that a heat conducting member 50 is arranged on the opposite side of the heat conducting member 40 with the printed wiring board 11 of the circuit substrate 2D interposed therebetween, and a heat conducting path 13 for thermally connecting the heat conducting member 50 and the heat conducting member 40 is provided on the printed wiring board 11 of the circuit substrate 2D. The other configurations of the electronic control device 1D of the second embodiment are the same as those of the electronic control device 1 of the first embodiment, and description thereof is omitted.

[0051] Specifically, the heat conduction path 13 of the circuit board 2D is a through hole that penetrates from the first surface 11a to the second surface 11b of the printed wiring board 11, and the conductor plating is applied to the inner surface. The heat conduction path 13 is arranged at a position that can be thermally connected to the heat conduction member 40 on the housing body 21 side, that is, in an area where the side conduction part 42 of the heat conduction member 40 contacts the first surface 11a of the printed wiring board 11. For example, four heat conduction paths 13 are arranged so as to be thermally connected to the side conduction parts 42 that contact the side surfaces 16c of the electronic component 16, respectively.

[0052] The heat-conducting member 50 is arranged so as to extend from the second surface 11b of the printed wiring board 11 of the circuit substrate 2D to the protrusion 22a in the cover 22 of the frame 3. The heat-conducting member 50 on the cover 22 side is made of a resin to which a heat-conducting filler is added, similarly to the heat-conducting member 40 on the housing body 21 side. As the heat-conducting member 50, for example, a TIM (Thermal Interface Material) such as heat-dissipating grease or a heat-conducting sheet is used. The heat-conducting member 50 on the cover 22 side is arranged so as to be in direct contact with the heat-conducting path 13 of the circuit substrate 2D, and is configured to be thermally connected to the heat-conducting member 40 on the housing body 21 side via the heat-conducting path 13. The heat-conducting member 50 is formed, for example, so that the shape of the orthographic projection relative to the printed wiring board 11 is substantially the same as the shape of the orthographic projection of the heat-conducting member 40 on the housing body 21 side relative to the printed wiring board 11. In addition, the heat-conducting member 50 may be any shape as long as it can be in direct contact with the heat-conducting path 13.

[0053] In the present embodiment, the heat conducting member 40 in direct contact with the electronic component 16 and the housing body 21 of the frame 3 is thermally connected to the heat conducting member 50 in direct contact with the cover 22 of the frame 3 via the heat conducting path 13 of the circuit board 2D. Thus, the heat from the electronic component 16 is not only transferred to the housing body 21 via the heat conducting member 40 and released to the outside of the frame 3, but also transferred from the heat conducting member 40 to the heat conducting member 50 via the heat conducting path 13 and finally transferred to the cover 22, thereby being released to the outside of the frame 3. That is, the heat dissipation path from the electronic component 16 to the outside of the frame 3 is ensured not only on the housing body 21 side but also on the cover 22 side, thereby enabling heat to be dissipated from both the housing body 21 and the cover 22 of the frame 3.

[0054] [First Modification of Second Embodiment] Next, use Fig.11 and Fig.12 An electronic control device according to a first modified example of the second embodiment will be described. Fig.11 This is a perspective view showing electronic components and their peripheral structures on a circuit board in an electronic control device according to a first example of a first modification of the second embodiment. Fig.12This is a perspective view showing electronic components and their peripheral structures on a circuit board in an electronic control device according to a second example of the first modified example of the second embodiment.

[0055] Fig.11 The electronic control device 1E of the first example of the first modification of the second embodiment shown in the figure is different from the second embodiment in the following main points. First, the structure of the heat conducting member 40E on the case body 21 side is different. Second, the structure of the heat conducting member 50E on the cover 22 side is different from the structure of the heat conducting member 40E on the case body 21 side. Third, the arrangement of the heat conducting path 13E of the circuit board 2E is different from the structure of the heat conducting member 40E on the case body 21 side and the heat conducting member 50E on the cover 22 side.

[0056] Specifically, the heat conducting member 40E on the housing body 21 side is arranged to be in contact with the upper surface 16b and three of the four side surfaces 16c of the electronic component 16 as a whole. That is, the heat conducting member 40E has an upper surface conducting portion 41 in contact with the upper surface 16b of the electronic component 16, and three side surface conducting portions 42E in contact with the entirety of the three side surfaces 16c of the electronic component 16. For example, the heat conducting path 13E is arranged so as to be in contact with the three side surface conducting portions 42E of the heat conducting member 40E, respectively. Fig.11 Only two are shown in the figure). The heat conducting member 50E on the cover 22 side is arranged at a position avoiding the area corresponding to the area directly below the electronic component 16 on the second surface 11b of the printed wiring board 11, and includes the arrangement position of the heat conducting path 13E. The heat conducting member 50E is configured, for example, so that the shape of the orthographic projection onto the printed wiring board 11 is the same shape as the shape of the orthographic projection of the three side conduction parts 42E of the heat conducting member 40E on the housing body 21 side onto the printed wiring board 11.

[0057] Fig.12 The electronic control device 1F of the second example of the first modification of the second embodiment shown in the figure is different from the second embodiment in the following main points. First, the structure of the heat conducting member 40F on the case body 21 side is different. Second, the structure of the heat conducting member 50F on the cover 22 side is different from the structure of the heat conducting member 40F on the case body 21 side. Third, the arrangement of the heat conducting path 13F of the circuit board 2F is different from the structure of the heat conducting member 40F on the case body 21 side and the heat conducting member 50F on the cover 22 side.

[0058] Specifically, the heat conducting member 40F on the housing body 21 side is arranged to be in contact with the upper surface 16b of the electronic component 16 and two adjacent side surfaces among the four side surfaces 16c. That is, the heat conducting member 40F has an upper surface conducting portion 41 in contact with the upper surface 16b of the electronic component 16 and two side surface conducting portions 42F in contact with the entirety of two adjacent side surfaces 16c of the electronic component 16. The heat conducting path 13F is arranged, for example, with two ( Fig.12 Only one is shown in the figure). The heat conducting member 50F on the cover 22 side is arranged at a position avoiding the area corresponding to the area directly below the electronic component 16 on the second surface 11b of the printed wiring board 11, and includes the arrangement position of the heat conducting path 13F. The heat conducting member 50F is configured, for example, so that the shape of the orthographic projection onto the printed wiring board 11 is the same shape (L-shaped) as the shape of the orthographic projection of the two side conduction parts 42F of the heat conducting member 40F on the housing body 21 side onto the printed wiring board 11.

[0059] In the circuit substrates 2E and 2F of the first and second examples of the first variant of the second embodiment, wiring and chip components are sometimes also densely mounted in the area on the back side of the mounting portion of the high-functional performance electronic component 16 in the second surface 11b of the printed wiring board 11. In this case, there is a restriction on the configuration of the heat-conducting members 50E and 50F on the cover 22 side. The heat-conducting members 50E and 50F on the cover 22 side have a structure that assumes such a situation. The heat-conducting members 50E and 50F are thermally connected to the heat-conducting members 40E and 40F via the heat-conducting paths 13E and 13F of the circuit substrates 2E and 2F, thereby transferring the heat from the electronic component 16 to the cover 22, and therefore do not need to be configured on the entire back side area of ​​the mounting portion of the electronic component 16 in the second surface 11b of the printed wiring board 11.

[0060] In addition, in the first and second examples of the first modified example, similarly to the second embodiment, the heat conducting members 40E and 40F in direct contact with the electronic component 16 are thermally connected to the heat conducting members 50E and 50F via the heat conducting paths 13E and 13F of the circuit boards 2E and 2F. As a result, the heat of the electronic component 16 is not only transferred to the case body 21 via the heat conducting members 40E and 40F and released to the outside of the frame 3, but also transferred from the heat conducting members 40E and 40F to the heat conducting members 50E and 50F via the heat conducting paths 13E and 13F and finally transferred to the cover 22, thereby being released to the outside of the frame 3. That is, the heat dissipation path from the electronic component 16 to the outside of the frame 3 is ensured not only on the case body 21 side but also on the cover 22 side, thereby enabling heat to be dissipated from both the case body 21 and the cover 22 of the frame 3.

[0061] [Second Modification of Second Embodiment] Next, use Fig.13 and Fig.14 An electronic control device according to a second modified example of the second embodiment will be described. Fig.13 This is a cross-sectional view showing an electronic component and its peripheral structure on a circuit board in an electronic control device according to a first example of a second modification of the second embodiment. Fig.14 This is a cross-sectional view showing an electronic component and its peripheral structure on a circuit board in an electronic control device according to a second example of a second modification of the second embodiment.

[0062] Fig.13 The electronic control device 1G of the first example of the second modification of the second embodiment shown in the figure is different from the first example of the first modification of the second embodiment in that the arrangement and number of heat conduction paths 13G of the circuit board 2G are different. Specifically, the heat conduction paths 13G are not arranged one by one with respect to each of the three side conduction portions 42E of the heat conduction member 40E on the case body 21 side, but are arranged in two rows at intervals along the circumferential direction of the side surface 16c of the electronic component 16.

[0063] Fig.14 The electronic control device 1H of the second example of the second modification of the second embodiment shown in the figure is different from the first example of the second modification of the second embodiment in that the arrangement and number of heat conduction paths 13H of the circuit board 2G are different. Specifically, the heat conduction paths 13H are arranged in four rows at intervals along the circumferential direction of the side surface 16c of the electronic component 16 for each of the three side conduction portions 42 of the heat conduction member 40 on the housing body 21 side.

[0064] In the first and second examples of the second modification of the second embodiment, similarly to the first example of the first modification of the second embodiment, the heat conducting member 40E in direct contact with the electronic component 16 is thermally connected to the heat conducting member 50E via the heat conducting paths 13G and 13H of the circuit boards 2G and 2H. As a result, the heat of the electronic component 16 is not only transferred to the housing body 21 via the heat conducting member 40E and released to the outside of the frame 3, but is also transferred from the heat conducting member 40E to the heat conducting member 50E via the heat conducting paths 13G and 13H and finally transferred to the cover 22, thereby being released to the outside of the frame 3. That is, the heat dissipation path from the electronic component 16 to the outside of the frame 3 is ensured not only on the housing body 21 side but also on the cover 22 side, thereby enabling heat to be dissipated from both the housing body 21 and the cover 22 of the frame 3.

[0065] Furthermore, in the first and second examples of the second modified example, the heat conduction paths 13G and 13H of the circuit boards 2G and 2H are arranged in two or four (multiple) rows along the side surface 16c of the electronic component 16, and are in contact with the heat conduction member 40 on the case body 21 side and the heat conduction member 50E on the cover 22 side. According to this configuration, heat is effectively transferred from the heat conduction member 40E on the case body 21 side to the heat conduction member 50E on the cover 22 side via the heat conduction paths 13G and 13H. Therefore, since the amount of heat transferred from the electronic component 16 to the heat conduction member 50E on the cover 22 side via the heat conduction paths 13G and 13H is increased compared with the first and second examples of the first modified example of the second embodiment, heat dissipation can be improved.

[0066] [Third Modification of Second Embodiment] Next, use Figure 15 to Figure 17 An electronic control device according to a third modified example of the second embodiment will be described. Fig.15 This is a schematic diagram showing the arrangement relationship between electronic components and heat transfer paths (through holes) on a circuit board in an electronic control device according to a first example of a third modified example of the second embodiment. Fig.16 This is a schematic diagram showing the arrangement relationship between electronic components and heat transfer paths (through holes) on a circuit board in an electronic control device according to a second example of the third modification of the second embodiment. Fig.17 This is a profile diagram showing the heat flow rate of the circuit board in the electronic control device according to the first example of the third modified example of the second embodiment.

[0067] Fig.15 The electronic control device of the first example of the third modification of the second embodiment shown in the figure is different from the second embodiment in that the arrangement of the heat conduction path 13J of the circuit board 2J is different. Specifically, the heat conduction path 13J of the circuit board 2J of the first example of the third modification of the second embodiment is arranged one at each of the central portions of the four side surfaces 16c of the electronic component 16, similarly to the heat conduction path 13 of the circuit board 2D of the second embodiment, and is arranged at a position closer to the central portion of each side surface 16c of the electronic component 16 than the heat conduction path 13 of the second embodiment.

[0068] Fig.16The electronic control device of the second example of the third modification of the second embodiment shown in the figure is different from the first example of the third modification of the second embodiment in that the arrangement of the heat conduction path 13K of the circuit board 2K is different. Specifically, the heat conduction path 13K of the circuit board 2K of the second example of the third modification of the second embodiment is different from the heat conduction path 13J of the first example of the third modification of the second embodiment in that one heat conduction path 13K is arranged corresponding to each of two adjacent side surfaces of the four side surfaces 16c of the electronic component 16, and on the other hand, similarly to the heat conduction path 13J of the second example of the third modification, it is arranged at a position close to the center of the side surface 16c of the electronic component 16.

[0069] In the electronic control devices of the first and second examples of the third variation of the second embodiment, the heat transfer paths 13J and 13K of the circuit boards 2J and 2K are arranged at positions corresponding to the center of at least one of the four side surfaces 16c of the electronic component 16. Fig.17 The results of the thermal fluid analysis shown in the figure show that the heat from the IC chip 32 located at the center of the electronic component 16 is transferred radially, and therefore the heat from the IC chip 32 is transferred most to the central portion of the region of each side surface 16c of the electronic component 16. Therefore, heat can be effectively transferred from the heat conducting member (not shown) on the side of the housing body 21 to the heat conducting member (not shown) on the side of the cover 22 via the heat conducting paths 13J and 13K of the circuit substrates 2J and 2K.

[0070] In the first and second examples of the third variant of the second embodiment, the electronic component 16 has an IC chip 32 serving as a heat source in the center portion thereof, and a plurality of heat conduction paths 13J, 13K of the circuit substrates 2J, 2K are arranged at intervals at positions equidistant from the IC chip 32 serving as the heat source of the electronic component 16.

[0071] According to this configuration, the heat from the heat source IC chip 32 is transferred radially, and thus the heat transfer amounts to the plurality of heat transfer paths 13J and 13K located at equal distances from the IC chip 32 are substantially the same, thereby enabling non-biased heat dissipation.

[0072] In the first and second examples of the third modification of the second embodiment, the heat conduction paths 13J and 13K of the circuit boards 2J and 2K are preferably arranged at positions closest to the outer peripheral surface 16c of the electronic component 16. According to this configuration, the heat radially transferred from the electronic component 16 can be efficiently guided to the heat conduction paths 13J and 13K.

[0073] As described above, according to the second embodiment and its modified example, similarly to the first embodiment, the heat conducting members 40, 40E, 40F (first heat conducting member) are arranged to contact a portion of the upper surface 16b and the outer peripheral surface 16c of the electronic component 16, thereby maintaining heat dissipation, and at the same time, by arranging the heat conducting members 40, 40E, 40F (first heat conducting member) at a position away from the high-speed signal line 12, it is possible to avoid an increase in electrostatic capacitance between the high-speed signal line 12 and the frame 3 due to the arrangement of the heat conducting members 40, 40E, 40F (first heat conducting member). As a result, the quality of the high-frequency signal can be ensured and the radiation noise can be suppressed while maintaining the heat dissipation.

[0074] In addition, in the present embodiment and its modified examples, the circuit substrates 2D, 2E, 2F, 2G, 2H, 2J, 2K have heat conduction paths 13, 13E, 13F, 13G, 13H, 13J, 13K provided on the printed wiring board 11 (wiring board), and the heat conduction paths 13, 13E, 13F, 13G, 13H, 13J, 13K of the circuit substrates 2D, 2E, 2F, 2G, 2H, 2J, 2K are arranged at positions capable of being thermally connected to the heat conduction components 40, 40E, 40F (first heat conduction components).

[0075] According to this configuration, the heat of the electronic component 16 is not only transferred from the heat-conducting components 40, 40E, 40F (first heat-conducting components) to the frame 3, but is also transferred from the heat-conducting components 40, 40E, 40F (first heat-conducting components) to the printed wiring board 11 (wiring board) side of the circuit substrates 2D, 2E, 2F, 2G, 2H, 2J, 2K via the heat-conducting paths 13, 13E, 13F, 13G, 13H, 13J, 13K of the circuit substrates 2D, 2E, 2F, 2G, 2H, 2J, 2K, so that the heat dissipation can be improved compared with the first embodiment and its modified examples.

[0076] In addition, the electronic control device of the present embodiment and its modified example further includes heat conducting members 50, 50E, 50F (second heat conducting members) which are in direct contact with the second surface 11b located on the back side of the first surface 11a of the two surfaces of the printed wiring board 11 (wiring board) and the frame 3. The heat conducting members 50, 50E, 50F (second heat conducting members) are thermally connected to the heat conducting members 40, 40E, 40F (first heat conducting members) via the heat conducting paths 13, 13E, 13F, 13G, 13H, 13J, 13K of the circuit substrates 2D, 2E, 2F, 2G, 2H, 2J, 2K.

[0077] According to this configuration, the heat of the electronic component 16 is not only transferred to one side (housing body 21) of the frame 3 via the heat conducting members 40, 40E, 40F (first heat conducting member) and released to the outside, but is also transferred to the heat conducting members 50, 50E, 50F (second heat conducting member) via the heat conducting paths 13, 13E, 13F, 13G, 13H, 13J, 13K and finally transferred to the other side (cover 22) of the frame 3, thereby releasing to the outside. That is, two systems of heat dissipation paths from the electronic component 16 to the outside of the frame 3 are ensured on one side and the other side of the frame 3. Therefore, the heat dissipation can be improved.

[0078] In addition, in the second embodiment, the heat-conducting member 40 (first heat-conducting member) is configured to contact a portion of each of the four side surfaces 16 c of the electronic component 16 at a position avoiding the high-speed signal line 12, and the heat-conducting path 13 of the circuit substrate 2D is configured to correspond to each of the four side surfaces 16 c of the electronic component 16.

[0079] According to this configuration, the heat of the electronic component 16 is transferred to the thermal path 13 arranged corresponding to the four side surfaces 16c of the electronic component 16 via the thermally conductive member 40 (first thermally conductive member) in contact with the four side surfaces 16c of the electronic component 16, thereby enabling effective heat transfer from the electronic component 16 to the thermally conductive path 13, thereby improving heat dissipation.

[0080] [Third Embodiment] Next, use Fig.18 An electronic control device according to a third embodiment of the present invention will be described. Fig.18 This is a schematic cross-sectional view showing an electronic component and its peripheral structure on a circuit board in an electronic control device according to a third embodiment of the present invention.

[0081] Fig.18 The electronic control device 1L of the third embodiment shown is different from the second embodiment in that it further includes a heat conductive member 60 interposed between the first surface 11a of the printed wiring board 11 and the bottom surface 16a of the electronic component 16. Specifically, the heat conductive member 60 is an underfill that reinforces the solder joint between the solder ball 33 on the bottom surface 16a side of the electronic component 16 and the wiring pattern on the first surface 11a of the printed wiring board 11. The underfill 60 is used to improve the life of the solder connection, and is made of, for example, epoxy resin, and also functions as a heat conductive member. The other structures of the electronic control device 1L of the third embodiment are the same as those of the electronic control device 1D of the second embodiment, and the description thereof is omitted.

[0082] In the present embodiment, in addition to the heat conducting member 40 on the housing body 21 side and the heat conducting member 50 on the cover 22 side, the underfill 60 interposed between the printed wiring board 11 and the electronic component 16 in the circuit substrate 2L functions as a heat conducting member for transferring heat of the electronic component 16. Thus, the reliability of the solder connection between the electronic component 16 and the printed wiring board 11 can be improved, and the amount of heat transferred from the electronic component 16 to the printed wiring board 11 can be increased. Therefore, both the improvement of soldering life and the improvement of heat dissipation can be achieved.

[0083] According to the third embodiment, similarly to the first embodiment, the heat conducting member 40 (first heat conducting member) is arranged to contact a part of the upper surface 16b and the outer peripheral surface 16c of the electronic component 16, thereby maintaining heat dissipation and arranging the heat conducting member 40 (first heat conducting member) at a position avoiding the high-speed signal line (not shown), thereby avoiding an increase in electrostatic capacitance between the high-speed signal line and the frame 3 due to the arrangement of the heat conducting member 40 (first heat conducting member). Thus, the quality of the high-frequency signal can be ensured and the radiation noise can be suppressed while maintaining heat dissipation.

[0084] The electronic control device 1L according to the third embodiment further includes a heat conducting member 60 interposed between the first surface 11 a of the printed wiring board 11 (wiring board) and the bottom surface 16 a of the electronic component 16 .

[0085] According to this configuration, the heat of the electronic component 16 can be transferred to the housing 3 via the heat conducting member 40 and also to the printed wiring board 11 (wiring board) via the heat conducting member 60. Thus, heat dissipation can be improved.

[0086] In the present embodiment, the heat conduction member 60 (third heat conduction member) is an underfill that reinforces the solder joint portion on the bottom surface 16 a side of the electronic component 16 .

[0087] According to this configuration, the heat conduction member 60 can improve the soldering life and the heat dissipation performance.

[0088] [Fourth embodiment] Next, use Fig.19 An electronic control device according to a fourth embodiment of the present invention will be described. Fig.19 1 is a schematic perspective view showing the appearance of an electronic control device according to a fourth embodiment of the present invention. Fig.19 In, with Figures 1 to 18 The same symbols as shown are the same parts, and their detailed description is omitted.

[0089] Fig.19The electronic control device 1M of the fourth embodiment shown is different from the first embodiment in that a cooling fan 70 is mounted on the case body 21 of the frame body 3. The electronic control device 1M is of a forced air cooling type in which cooling air generated by the cooling fan 70 is supplied to the heat sink 25 of the case body 21.

[0090] In this embodiment, from Figure 2 The heat transferred from the electronic component 16 to the housing body 21 of the frame body 3 via the heat conducting member 40 is Fig.19 The cooling air generated by the cooling fan 70 shown is released. As a result, the temperature of the housing 3 decreases, and the temperature difference with the electronic component 16 increases, thereby promoting heat transfer from the electronic component 16 to the housing 3. Therefore, the heat dissipation performance of the electronic control device 1M is further improved.

[0091] As described above, the electronic control device 1M of this embodiment further includes the cooling fan 70 that supplies cooling air to the outer surface of the housing 3. This configuration promotes heat transfer from the electronic component 16 to the housing 3, thereby further improving the heat dissipation performance of the electronic control device 1M.

[0092] [Fifth embodiment] Next, use Fig. 20 An electronic control device according to a fifth embodiment of the present invention will be described. Fig. 20 1 is a schematic perspective view showing the appearance of an electronic control device according to a fifth embodiment. Fig. 20 In, with Figures 1 to 19 The same symbols as shown are the same parts, and their detailed description is omitted.

[0093] Fig. 20 The electronic control device 1N of the fifth embodiment shown is different from the first embodiment in that it has a water cooling system 80 for supplying cooling water to the frame 3 for cooling. Specifically, the water cooling system 80 includes a supply line 81 for supplying cooling water to the frame 3, and a discharge line 82 for flowing the cooling water discharged from the frame 3. The electronic control device 1 is a forced water cooling type in which the cooling water supplied from the supply line 81 cools the frame 3 and then is discharged to the discharge line 82.

[0094] In this embodiment, from Figure 2 The heat transferred from the electronic component 16 to the housing body 21 of the frame body 3 via the heat conducting member 40 is Fig. 20 The cooling water of the water cooling system 80 shown is released. As a result, the temperature of the housing 3 drops, and the temperature difference with the electronic component 16 increases, thereby promoting heat transfer from the electronic component 16 to the housing 3. Therefore, the heat dissipation performance of the electronic component 16 and the electronic control device 1M is further improved.

[0095] As described above, the electronic control device 1N of this embodiment further includes a water cooling system 80 that supplies cooling water to cool the housing 3. This configuration promotes heat transfer from the electronic components 16 to the housing 3, thereby further improving the heat dissipation performance of the electronic control device 1M.

[0096] [Other embodiments] In addition, the present invention is not limited to the above-mentioned embodiments, and includes various modified examples. The above-mentioned embodiments are described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to a mode having all the described structures. A part of the structure of one embodiment can be replaced by the structure of another embodiment, and the structure of another embodiment can be added to the structure of one embodiment. In addition, for a part of the structure of each embodiment, other structures can also be added, deleted, or replaced.

[0097] For example, in the above-mentioned embodiment, an example is shown in which the electronic control device 1 is configured as an electronic control device mounted on a vehicle to control or assist vehicle driving. However, if the electronic control device is an electronic control device that performs high-speed communication, it may also be configured to be mounted on a device other than a vehicle. For example, it may also be applicable to electronic control devices such as unmanned aerial vehicles (drones).

[0098] In addition, in the above-mentioned embodiment, an example is shown in which the electronic component 16 capable of high-speed operation has a semiconductor package structure of a BGA structure. However, the electronic component for high-speed processing may also have a semiconductor package structure for surface mounting such as a QFP (Quad Flat Package) structure, a QFN (Quad Flat Non-leaded Package), or a SOP (Small Outline Package) structure. In addition, the electronic component capable of high-speed operation may also have a semiconductor package structure for insertion mounting such as a PGA (Pin Grid Array) structure. Explanation of symbols

[0099] 1, 1D, 1E, 1F, 1G, 1H, 1L, 1M, 1N...electronic control device, 2, 2A, 2B, 2C, 2D, 2E, 2F, 2G, 2H, 2J, 2K, 2L...circuit substrate, 3...frame, 11...printed wiring board (wiring board), 11a...first side, 11b...second side, 12, 12A, 12B, 12C...high-speed signal line, 13, 13E, 13F, 13G, 13H, 13 J, 13K…heat conduction path, 16…electronic component, 16a…bottom surface, 16b…upper surface, 16c…peripheral surface (side surface), 32…IC chip (chip), 40, 40A, 40B, 40C, 40E, 40F…heat conduction component (first heat conduction component), 50, 50E, 50F…heat conduction component (second heat conduction component), 60…bottom filler (third heat conduction component), 70…cooling fan, 80…water cooling system.

Claims

1. An electronic control device, characterized in that: have: A circuit substrate having a wiring board on which a wiring pattern including a high-speed signal line is formed, and an electronic component mounted on a first surface of two surfaces of the wiring board and electrically connected to the high-speed signal line; a frame body, which accommodates the circuit substrate; as well as a first heat conducting member directly in contact with the electronic component and the frame, The electronic component has a bottom surface facing the first surface of the wiring board, an upper surface located on the opposite side of the bottom surface, and an outer peripheral surface connected to an outer edge of the bottom surface and an outer edge of the upper surface. The first heat conducting member is configured to extend from the upper surface of the electronic component to the frame, and is configured to contact a portion of the outer peripheral surface of the electronic component at a position avoiding the high-speed signal line and extend from the first surface of the wiring board to the frame.

2. The electronic control device according to claim 1, characterized in that: The electronic component is configured in a rectangular shape when viewed from the upper surface side and has four side surfaces as the outer peripheral surface. The first heat conducting member is arranged to contact a portion of each of the four side surfaces of the electronic component at a position avoiding the high-speed signal line, and extends from the first surface of the wiring board to the frame.

3. The electronic control device according to claim 1, characterized in that: The electronic component has a built-in chip as a heat source, The first heat conduction member is in contact with the upper surface of the electronic component so as to include an entire area of ​​an orthographic projection of the chip with respect to the upper surface of the electronic component.

4. The electronic control device according to claim 1, characterized in that: The circuit substrate has a heat conduction path provided on the wiring board, The heat conduction path of the circuit substrate is arranged at a position that can be thermally connected to the first heat conduction member.

5. The electronic control device according to claim 4, characterized in that: further comprising a second heat conducting member in direct contact with a second surface of the wiring board located on the back side of the first surface and the frame, The second heat conducting member is thermally connected to the first heat conducting member via the heat conducting path of the circuit substrate.

6. The electronic control device according to claim 4, characterized in that: The electronic component is configured in a rectangular shape when viewed from the upper surface side and has four side surfaces as the outer peripheral surface. The heat conduction path of the circuit substrate is arranged at a position corresponding to a center portion of at least one of the four side surfaces of the electronic component.

7. The electronic control device according to claim 4, characterized in that: The electronic component is configured in a rectangular shape when viewed from the upper surface side and has four side surfaces as the outer peripheral surface. The first heat conducting member is arranged to contact a portion of each of the four side surfaces of the electronic component at a position avoiding the high-speed signal line. The heat conduction paths of the circuit board are arranged corresponding to each of the four side surfaces of the electronic component.

8. The electronic control device according to claim 4, characterized in that: The heat conduction path of the circuit substrate is arranged at a position closest to the outer peripheral surface of the electronic component.

9. The electronic control device according to claim 4, characterized in that: The electronic component has a heat source at its center. A plurality of the heat transfer paths of the circuit board are arranged at equal distances from the heat source of the electronic component at intervals.

10. The electronic control device according to claim 4, characterized in that: The heat conduction paths of the circuit board are arranged in a plurality of rows in a direction along the outer peripheral surface of the electronic component.

11. The electronic control device according to claim 1, characterized in that: A third heat conduction member is further provided between the first surface of the wiring board and the bottom surface of the electronic component.

12. The electronic control device according to claim 11, characterized in that: The third heat conducting member is an underfill material that reinforces a solder joint portion on the bottom surface side of the electronic component.

13. The electronic control device according to claim 1, characterized in that: A cooling fan is further provided to supply cooling air to the outer surface of the frame.

14. The electronic control device according to claim 1, characterized in that: A water cooling system is further provided for supplying cooling water to cool the housing.

Images