Wafer position calibration clamp, wafer position calibration method and semiconductor equipment

Abstract

The invention provides a wafer position calibration clamp, a wafer position calibration method and semiconductor equipment, relates to the technical field of semiconductor preparation, and solves the problem of position deviation of a wafer to be calibrated. The wafer position calibration clamp comprises a transparent area and a non-transparent area, the non-transparent area is located on the periphery of the transparent area, and the center of the wafer position calibration clamp is located in the transparent area; the transparent area is provided with a position mark surrounding the center of the wafer position calibration clamp. And the shape and the size of the wafer position calibration clamp are the same as those of a wafer to be calibrated. By using the wafer position calibration clamp, rapid calibration of the to-be-calibrated wafer is realized, and the to-be-calibrated wafer and the processing sucker are in a concentric state, so that the accuracy and convenience of placing the to-be-calibrated wafer are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor preparation, and in particular to a wafer position calibration fixture and calibration method, and semiconductor equipment. Background Art

[0002] With the development of science and technology, the application of semiconductors is becoming more and more common, and the daily lives of more and more people are closely related to semiconductors.

[0003] At present, in the semiconductor industry, the processing chamber of a single wafer usually uses a suction cup to hold the wafer, and the high-speed rotation of the suction cup drives the wafer to rotate, so as to facilitate processes such as photoresist coating, wet etching, cleaning, and drying. When the suction cup is used to hold the wafer, the wafer and the suction cup may not be concentric, and there is a risk of the wafer being thrown off and colliding when it rotates eccentrically. Summary of the invention

[0004] The disclosed embodiments provide a wafer position calibration fixture and calibration method, and semiconductor equipment to solve the problems of wafer position offset, large error, and low alignment efficiency, and improve the calibration effect.

[0005] To achieve the above objectives, some embodiments of the present disclosure provide the following technical solutions:

[0006] In one aspect, a wafer position calibration fixture is provided. The wafer position calibration fixture comprises a transparent area and a non-transparent area, wherein the non-transparent area is located outside the transparent area. The center of the wafer position calibration fixture is located in the transparent area; the transparent area is provided with a position mark surrounding the center of the wafer position calibration fixture; the shape and size of the wafer position calibration fixture are the same as the shape and size of the wafer to be calibrated.

[0007] The disclosed embodiment provides a wafer position calibration fixture. An operator observes the positional relationship between the center of the wafer position calibration fixture and the center of a processing suction cup through a transparent area, and obtains adjustment parameters of a robotic arm based on a position mark. The robotic arm clamps a wafer to be calibrated onto the processing suction cup based on the adjustment parameters, so that the center of the wafer to be calibrated is aligned with the center of the processing suction cup. At this time, the center of the wafer to be calibrated and the center of the processing suction cup are on a vertical line perpendicular to the horizontal ground.

[0008] By using the wafer position calibration fixture, the wafer to be calibrated can be quickly calibrated, so that the wafer to be calibrated and the processing suction cup are in a concentric state, to ensure the accuracy and convenience of placing the wafer to be calibrated, and avoid the wafer to be calibrated The positional relationship between the center of the wafer to be calibrated and the center of the processing suction cup cannot be determined due to its own obstruction. At the same time, it also avoids repetitive and mechanical work and improves work efficiency.

[0009] In some embodiments, the position mark includes a first scale line and a second scale line; the first scale line and the second scale line intersect, and an intersection point of the first scale line and the second scale line coincides with a center of the wafer position calibration fixture.

[0010] In some embodiments, the transparent area includes: a measuring area and a non-measuring area, and the non-measuring area is located outside the measuring area. The position mark also includes a third scale line; the shape of the measuring area is circular, and the third scale line is set on the boundary line of the measuring area.

[0011] In some embodiments, a ratio of a diameter of the transparent area to a diameter of the wafer position calibration jig is 0.6 to 0.7.

[0012] On the other hand, a semiconductor device is provided, comprising: a wafer position calibration fixture, a pre-alignment device, a processing suction cup, a robotic arm and a controller as described in any one of the above embodiments, wherein the pre-alignment device is used to obtain the center position of the wafer position calibration fixture or the wafer to be calibrated; the processing suction cup is used to carry the wafer position calibration fixture or the wafer to be calibrated; the robotic arm is used to transfer the wafer position calibration fixture or the wafer to be calibrated; and the controller is electrically connected to the robotic arm.

[0013] In some embodiments, the transparent area of ​​the wafer position calibration fixture includes a measuring area and a non-measurement area, and the non-measurement area is located outside the measuring area; the measuring area includes: a first measuring area and a second measuring area located outside the first measuring area, and the shape and size of the second measuring area are the same as the shape and size of the processing suction cup.

[0014] On the other hand, a wafer position calibration method is provided, which is applied to the semiconductor equipment described in some of the above embodiments, and the wafer position calibration method includes: placing a wafer position calibration fixture on a processing suction cup by a robotic arm; obtaining the offset between the center of the wafer position calibration fixture and the center of the processing suction cup by observing the transparent area of ​​the wafer position calibration fixture; obtaining adjustment parameters of the robotic arm according to the offset; and calibrating the position of the wafer to be calibrated based on the adjustment parameters.

[0015] In some embodiments, after obtaining the adjustment parameters of the robotic arm based on the offset, the wafer position calibration method also includes: grabbing the wafer position calibration fixture from the processing suction cup by the robotic arm; the controller adjusts the moving path of the robotic arm according to the adjustment parameters, and places the wafer position calibration fixture on the processing suction cup again; and verifying whether the center of the wafer position calibration fixture and the center of the processing suction cup are aligned by observing the transparent area of ​​the wafer position calibration fixture.

[0016] In some embodiments, before placing the wafer position calibration fixture on the processing suction cup by the robotic arm, the wafer position calibration method also includes: placing the wafer position calibration fixture on the pre-alignment device by the robotic arm; obtaining the relative position of the center of the wafer position calibration fixture on the pre-alignment device by the pre-alignment device, and feeding it back to the controller; the controller controls the center of the robotic arm to align with the center of the wafer position calibration fixture to grab the wafer position calibration fixture from the pre-alignment device.

[0017] In some embodiments, the position of the wafer to be calibrated is calibrated based on the adjustment parameters, including: grabbing the wafer to be calibrated by a robotic arm and placing it on a pre-alignment device; obtaining the relative position of the center of the wafer to be calibrated on the pre-alignment device by the pre-alignment device, and feeding it back to a controller; the controller controls the center of the robotic arm to align with the center of the wafer to be calibrated, and according to the adjustment parameters, places the wafer to be calibrated on a processing suction cup so that the center of the wafer to be calibrated is aligned with the center of the processing suction cup.

[0018] Regarding the beneficial effects of the wafer position calibration method and the semiconductor device, reference may be made to the beneficial effects of the above-mentioned wafer position calibration fixture, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

[0020] Figure 1 A schematic diagram of a semiconductor device provided by an embodiment of the present invention;

[0021] Figure 2 A schematic top view of the positional relationship between a wafer to be calibrated and a vacuum chuck provided in an embodiment of the present invention;

[0022] Figure 3 A bottom-up schematic diagram of the positional relationship between a wafer to be calibrated and a vacuum chuck provided in an embodiment of the present invention;

[0023] Figure 4 A schematic side view of the positional relationship between a wafer to be calibrated and a vacuum chuck provided in an embodiment of the present invention;

[0024] Figure 5 A schematic diagram of a semiconductor device using a wafer position calibration fixture provided by an embodiment of the present invention;

[0025] Figure 6 A schematic diagram of a mechanical arm provided by an embodiment of the present invention;

[0026] Figure 7 A schematic diagram of a vacuum suction cup provided in an embodiment of the present invention;

[0027] Figure 8 A schematic diagram of a wafer position calibration fixture provided by an embodiment of the present invention;

[0028] Fig. 9 A schematic diagram of the relationship between the wafer position calibration fixture and the vacuum chuck provided in an embodiment of the present invention;

[0029] Fig.10 A schematic diagram of position coordinates provided by an embodiment of the present invention;

[0030] Fig.11 A flow chart of a wafer position calibration method provided by an embodiment of the present invention;

[0031] Fig.12 Another flow chart of a wafer position calibration method provided by an embodiment of the present invention;

[0032] Fig.13 Another flow chart of a wafer position calibration method provided by an embodiment of the present invention;

[0033] Fig.14 Another flow chart of a wafer position calibration method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0034] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0035] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] In the description of the present invention, unless the context requires otherwise, throughout the specification and claims, the term "including" is interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "exemplarily" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present invention. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. In addition, when describing the pipeline, the "connected" and "connection" used in this application have the meaning of conduction. The specific meaning needs to be understood in conjunction with the context.

[0038] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, unless otherwise specified, "plurality" means two or more.

[0039] In the description of the present invention, the use of “suitable for” or “configured to” is meant to be open and inclusive language that does not exclude devices being suitable for or configured to perform additional tasks or steps.

[0040] In the description of the present invention, exemplary embodiments are described with reference to cross-sectional views and / or plan views as idealized exemplary drawings. In the drawings, some drawings are simplified and enlarged for clarity. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown in the present invention, but include shape deviations caused by, for example, manufacturing.

[0041] As described in the background technology, at present, in the semiconductor industry, the processing of single wafers is an important part of the production process. When processing wafers in a processing chamber, a suction cup is usually used to hold the wafer, and the high-speed rotation of the suction cup drives the wafer to rotate, so as to facilitate subsequent processes such as photoresist coating, wet etching, cleaning, and drying. When the suction cup is used to hold the wafer, the wafer and the suction cup may not be concentric, and there is a risk of the wafer being thrown off and colliding when the wafer rotates eccentrically.

[0042] like Figure 1 As shown, the semiconductor device 1000 includes: a processing chamber 9, a robot 2 and a first wafer box 101, the first wafer box 101 is used to store the wafer 5 to be calibrated, and the processing chamber 9 includes: a processing suction cup 1. The robot 2 takes out the wafer 5 to be calibrated from the first wafer box 101 and places it on the processing suction cup 1 in the processing chamber 9, so as to apply photoresist, wet etch, clean, dry and other operations on the wafer 5 to be calibrated.

[0043] During the high-speed rotation of the processing suction cup 1 of the processing chamber 9, if the wafer 5 to be calibrated is not concentric with the processing suction cup 1, the wafer 5 to be calibrated will move eccentrically or the wafer 5 to be calibrated will be thrown away, which cannot meet the processing requirements of the processing chamber 9 for the wafer 5 to be calibrated. For example: in the processing chamber of the PVA Tepla AutoWafer300 machine, when the suction cup in the processing chamber sucks the wafer, the wafer and the suction cup may not be concentric, and there is a risk of the wafer being thrown away and colliding when the wafer rotates eccentrically.

[0044] The wafer 5 to be calibrated refers to a silicon wafer used for manufacturing silicon semiconductor integrated circuits. Various circuit element structures can be processed on the silicon wafer. The shape of the wafer 5 to be calibrated is round. The material of the wafer 5 to be calibrated is silicon. The wafer 5 to be calibrated itself is a non-transparent structure.

[0045] During the use of the semiconductor equipment 1000, in order to avoid the risk of flying and colliding when the wafer 5 to be calibrated rotates eccentrically, the placement position of the wafer 5 to be calibrated needs to be adjusted using the robot arm 2. The operator can only observe the concentricity of the wafer 5 to be calibrated and the processing suction cup 1 with the naked eye, and repeatedly adjust the position of the robot arm 2, and the operator repeats the steps of observing, adjusting, and observing.

[0046] Since the wafer 5 to be calibrated is a non-transparent structure, when the wafer 5 to be calibrated is placed in the processing chamber 9, the wafer 5 to be calibrated blocks the processing suction cup 1. Figure 2 , Figure 3 , Figure 4 As shown, the positional relationship between the center of the wafer 5 to be calibrated and the center of the processing suction cup 1 cannot be observed from the top view, the upward view and the side view, and it is impossible to ensure that the wafer 5 to be calibrated and the processing suction cup 1 are in a concentric state in the processing chamber 9. This requires repeated adjustments by the robot arm 2, which is inefficient, causing long equipment downtime and affecting equipment production capacity. In addition, in this way, the adjustment accuracy of the robot arm 2 for the placement position of the wafer 5 to be calibrated is low, and the concentricity of the wafer 5 to be calibrated and the processing suction cup 1 cannot be guaranteed.

[0047] Based on this, Figure 5As shown, the present invention provides a wafer position calibration fixture and a semiconductor device using the wafer position calibration fixture. By setting the position of the wafer position calibration fixture 4, the adjustment parameters of the robot arm 2 are obtained to align the center of the wafer 5 to be calibrated with the center of the processing suction cup 1, so as to solve the problems of position offset of the wafer 5 to be calibrated, large offset error between the center of the wafer 5 to be calibrated and the center of the processing suction cup 1, and low alignment efficiency of the center of the wafer 5 to be calibrated and the center of the processing suction cup 1 caused by the wafer 5 to be calibrated blocking the processing suction cup 1, thereby improving the calibration effect and improving the calibration efficiency of the robot arm 2.

[0048] like Figure 5 As shown, the wafer position calibration fixture 4 is applied to a semiconductor device 1000, and the semiconductor device 1000 includes a robot arm 2 and a processing suction cup 1 for clamping a wafer 5 to be calibrated. Figure 8 As shown, the wafer position calibration fixture 4 includes a transparent area 41 and a non-transparent area 43, the non-transparent area 43 is located outside the transparent area 41, and the center 40 of the wafer position calibration fixture 4 is located in the transparent area 41; the transparent area 41 is provided with a position mark w around the center 40 of the wafer position calibration fixture 4; the shape and size of the wafer position calibration fixture 4 are the same as the shape and size of the wafer 5 to be calibrated.

[0049] The wafer position calibration fixture 4 is used to obtain the adjustment parameters of the robot arm 2 so as to align the center of the wafer 5 to be calibrated with the center of the processing suction cup 1 .

[0050] In some embodiments, Figure 5 As shown, the shape and size of the wafer position calibration fixture 4 are the same as the shape and size of the wafer 5 to be calibrated. For example, the shape of the wafer position calibration fixture 4 is circular, and the diameter of the wafer position calibration fixture 4 is equal to the diameter of the wafer 5 to be calibrated.

[0051] Exemplarily, the wafer position calibration fixture 4 has the same shape and size as the wafer 5 to be calibrated. If the diameter of the wafer 5 to be calibrated is 300 mm, then the diameter of the wafer position calibration fixture 4 is also set to 300 mm; if the thickness of the wafer 5 to be calibrated is 0.775 mm, then the thickness of the wafer position calibration fixture 4 is set to 0.775 mm; the semiconductor device 1000 can directly obtain adjustment parameters according to the position setting of the wafer position calibration fixture 4, thereby placing the wafer 5 to be calibrated.

[0052] The wafer position calibration fixture 4 can be used as a substitute for the wafer 5 to be calibrated. According to the different sizes of the wafer 5 to be calibrated, the corresponding wafer position calibration fixture 4 is manufactured. The wafer position calibration fixture 4 is consistent with the shape and size of the wafer 5 to be calibrated, which can avoid the situation where the wafer position calibration fixture 4 and the wafer 5 to be calibrated have different shapes and sizes, and the feedback to the robot 2 has errors in the adjustment parameters, thereby causing errors between the center of the wafer 5 to be calibrated and the center of the processing suction cup 1. When the wafer position calibration fixture 4 and the wafer 5 to be calibrated have the same shape and size, the position calibration of the wafer 5 to be calibrated can be made more accurate and the error can be reduced.

[0053] To clearly describe the purpose of the wafer position calibration fixture 4, the structure of the semiconductor device 1000 is first introduced below. Figure 5 As shown, the semiconductor equipment 1000 includes: a processing suction cup 1, a robot arm 2, a controller 3, a wafer position calibration fixture 4 and a pre-alignment device 8.

[0054] The processing suction cup 1 is used to carry the wafer position calibration fixture 4 or the wafer 5 to be calibrated, and the processing suction cup 1 can clamp the wafer position calibration fixture 4 or the wafer 5 to be calibrated; the robotic arm 2 is used to transfer the wafer position calibration fixture 4 or the wafer 5 to be calibrated; the controller 3 is electrically connected to the robotic arm 2, and the controller 3 can control the movement of the robotic arm 2; the pre-alignment device 8 is used to obtain the center position of the wafer position calibration fixture 4 or the wafer 5 to be calibrated.

[0055] like Figure 6 As shown, the robot arm 2 includes a base 21, a rotating shaft 23 and a gripping portion 25, the gripping portion 25 is connected to the rotating shaft 23, and the gripping portion 25 is located at the rear end of the rotating shaft 23. The rotating shaft 23 includes a plurality of connecting segments 231 connected in sequence, and the entire structure is a bending structure, and the orientations of the plurality of connecting segments 231 can be changed arbitrarily, thereby improving the flexibility of the robot arm 2 and better gripping the wafer 5 to be calibrated; the rotating shaft 23 is arranged above the base 21, which increases the stability of the robot arm 2 and prevents the wafer 5 to be calibrated from shaking and falling when gripping it.

[0056] A grabbing suction cup 24 is provided on the grabbing part 25. The grabbing suction cup 24 is a circular structure. When the robot arm 2 grabs the wafer 5 to be calibrated, the wafer to be calibrated is placed above the grabbing part 25. The grabbing suction cup 24 is a vacuum suction cup, which can suck the wafer 5 to be calibrated. Negative air pressure is generated in the grabbing suction cup 24, thereby firmly sucking the wafer 5 to be calibrated to prevent the wafer 5 to be calibrated from falling. When the robot arm 2 is working, the grabbing part 25 can drive the wafer 5 to be calibrated to move when the robot arm 2 moves.

[0057] In some embodiments, Figure 5 As shown, the controller 3 controls the robot arm 2 to align the center of the wafer position calibration fixture 4 with the center of the robot arm 2 according to the center position of the wafer position calibration fixture 4 .

[0058] In some embodiments, Figure 5 As shown, the rotating shaft 23 is connected to the base 21 , and the wafer position calibration fixture 4 is placed on the pre-alignment device 8 through the robot arm 2 . The pre-alignment device 8 obtains the center position of the wafer position calibration fixture 4 and feeds it back to the controller 3 .

[0059] The robot 2 controls the movement of the rotating shaft 23 according to the center position of the wafer position calibration fixture 4 fed back by the controller 3, and aligns the center of the gripping portion 25 with the position coordinate of the center of the wafer position calibration fixture 4 fed back by the controller 3; the robot 2 grabs the wafer position calibration fixture 4 from the pre-alignment device 8. At this time, the orthographic projection of the center of the wafer position calibration fixture 4 on the gripping portion 25 coincides with the center of the gripping portion 25 of the robot 2.

[0060] The robot arm 2 can grab the wafer position calibration fixture 4 multiple times. The robot arm 2 aligns the center of the wafer position calibration fixture 4 with the center of the gripping part 25 of the robot arm 2 through high-precision positioning, thereby avoiding the wafer position calibration fixture 4 from falling off during work due to the center of the wafer position calibration fixture 4 being not concentric with the center of the gripping part 25 of the robot arm 2, thereby affecting the work efficiency. At the same time, when the robot arm 2 places the wafer position calibration fixture 4, it can more accurately place the wafer position calibration fixture 4 at the specified position coordinates, thereby avoiding the deviation in the placement position of the wafer position calibration fixture 4 due to the non-concentricity between the wafer position calibration fixture 4 and the gripping part 25.

[0061] In some embodiments, in combination Figure 5 , Figure 6 , Fig. 9 , wherein the wafer position calibration fixture 4 is placed on the processing suction cup 1 by the robot arm 2, and the offset 6 between the center 40 of the wafer position calibration fixture 4 and the center of the processing suction cup 1 is obtained by observing the transparent area 41 of the wafer position calibration fixture 4; the adjustment parameters of the robot arm 2 are obtained according to the offset 6; and the position of the wafer 5 to be calibrated is calibrated based on the adjustment parameters.

[0062] In some embodiments, Figure 5As shown, the robot 2 is capable of grasping, transferring and placing an object 45 to be grasped. The robot 2 adjusts the moving path according to the set parameters to transfer the object 45 from one position to another. The parameters of the robot 2 include the position coordinates when grasping the object 45 to be grasped and the position coordinates when placing the object 45 to be grasped; illustratively, the position coordinates when grasping the object 45 to be grasped and the position coordinates when placing the object 45 to be grasped are position coordinates with the center 22 of the base as the reference point. The object 45 to be grasped includes a wafer position calibration fixture 4 and a wafer 5 to be calibrated. The robot 2 is also configured to transfer the wafer 5 to be calibrated to the processing suction cup 1 according to the adjustment parameters to align the center of the wafer 5 to be calibrated with the center of the processing suction cup 1. The adjustment parameters of the robot 2 are the adjustment amounts of the parameters of the robot 2.

[0063] By clarifying the parameters of the robot arm 2 (for example, the initial position coordinates when placing the object 45 to be picked up) and the adjustment parameters of the robot arm, the adjusted position coordinates when placing the object 45 to be picked up can be obtained. The robot arm 2 can accurately grab the object 45 to be picked up at the first designated position, and accurately transfer the object 45 to be picked up to the second designated position, and place the object 45 to be picked up at the second designated position.

[0064] The robot arm 2 grabs the wafer position calibration fixture 4 and places it on the processing suction cup 1. Since the wafer position calibration fixture 4 includes: a transparent area 41, the center of the wafer position calibration fixture 4 is located in the transparent area 41, so that the operator can directly observe the position relationship between the center 40 of the wafer position calibration fixture 4 and the center of the processing suction cup 1 according to the transparent area 41, and can read the offset 6 between the center 40 of the wafer position calibration fixture 4 and the center of the processing suction cup 1 according to the position mark w on the surface of the wafer position calibration fixture 4. The controller 3 obtains the offset 6 and obtains the adjustment parameters of the robot arm 2 according to the offset 6; that is, the controller 3 can adjust the position coordinates of the robot arm 2 when placing the object 45 to be picked up, so that the position coordinates are consistent with the position coordinates of the center of the processing suction cup 1.

[0065] The robot arm 2 grabs the wafer 5 to be calibrated, and places the wafer 5 to be calibrated on the processing suction cup 1 according to the adjustment parameters of the robot arm 2, that is, the robot arm 2 transfers the wafer 5 to be calibrated to the adjusted position coordinates for placing the object 45 to be picked up, so that the center of the wafer 5 to be calibrated is aligned with the center of the processing suction cup 1. At this time, the center of the wafer 5 to be calibrated coincides with the center of the processing suction cup 1 in the orthographic projection of the processing suction cup 1.

[0066] By using the wafer position calibration fixture 4, the operator can perform center calibration more quickly and efficiently, realize rapid calibration of the wafer 5 to be calibrated, and make the wafer 5 to be calibrated and the processing suction cup 1 in a concentric state, so as to ensure the accuracy and convenience of placing the wafer 5 to be calibrated, avoid the inability to determine the positional relationship between the center of the wafer 5 to be calibrated and the center of the processing suction cup 1 due to the obstruction of the wafer 5 to be calibrated itself, and also avoid repetitive and mechanical work of the robot arm 2, thereby improving work efficiency.

[0067] like Figure 3 , Figure 5 , Figure 7 As shown, the processing suction cup 1 is a circular structure, which is fixedly arranged in the processing chamber 9. The robot arm 2 grabs the wafer 5 to be calibrated and places it above the processing suction cup 1. The processing suction cup 1 is a vacuum suction cup, which can suck the wafer 5 to be calibrated. Negative air pressure is generated in the processing suction cup 1, so as to firmly suck the wafer 5 to be calibrated to prevent the wafer 5 to be calibrated from falling. When the processing chamber 9 is working, the processing suction cup 1 rotates at a high speed and drives the wafer 5 to be calibrated to rotate.

[0068] There are multiple concave spots 12 on the processing suction cup 1. The setting of the concave spots 12 facilitates better sealing between the processing suction cup 1 and the wafer 5 to be calibrated, so that the processing suction cup 1 can fully fit the wafer 5 to be calibrated, and the processing suction cup 1 and the contact part will not leak, avoiding the loss caused by the wafer 5 to be calibrated falling.

[0069] like Figure 8 As shown, the transparent area 41 is a circular structure. For example, the transparent area 41 is made of glass and is a transparent structure. The operator observes the positional relationship between the center 40 of the wafer position calibration fixture 4 and the center of the processing chuck 1 according to the transparent area 41, and determines whether the center 40 of the wafer position calibration fixture 4 and the center of the processing chuck 1 are in a concentric state, and determines the offset 6 between the center 40 of the wafer position calibration fixture 4 and the center of the processing chuck 1, thereby improving work efficiency and avoiding a large amount of repetitive work.

[0070] In some embodiments, Fig. 9 , Fig.10 As shown, the position mark w includes a first scale line x and a second scale line y, the first scale line x and the second scale line y intersect, and the intersection coincides with the center of the wafer position calibration fixture 4.

[0071] Exemplarily, the first scale line x and the second scale line y are perpendicular, and the first scale line x passes through the center 40 of the wafer position calibration fixture 4 and penetrates the transparent area 41 along its extension direction; the second scale line y passes through the center 40 of the wafer position calibration fixture 4 and penetrates the transparent area 41 along its extension direction.

[0072] When the position mark w includes the first scale line x and the second scale line y, the offset 6 includes: a first offset 61 and a second offset 62, the first offset 61 is the scale value corresponding to the orthographic projection of the processing suction cup center point 11 on the first scale line x; the second offset 62 is the orthographic projection scale value of the processing suction cup center point 11 on the second scale line y; the processing suction cup center point 11 is the orthographic projection of the center of the processing suction cup 1 on the surface of the wafer position calibration fixture 4.

[0073] When the operator reads the offset 6 between the center of the wafer position calibration fixture 4 and the center of the processing chuck 1 according to the position mark w, as shown in FIG. Fig.10 As shown, a coordinate system A can be set on the surface of the wafer position calibration fixture 4, and the coordinate system A includes: an origin O, a first coordinate axis X and a second coordinate axis Y, the origin O is the center of the wafer position calibration fixture 4, the first scale line x is located on the first coordinate axis X, and the second scale line y is located on the second coordinate axis Y; the first offset 61 is the scale value of the processing suction cup center point 11 on the first coordinate axis X in the coordinate system A; the second offset 62 is the scale value of the processing suction cup center point 11 on the second coordinate axis Y in the coordinate system A.

[0074] Exemplarily, the first scale line x and the second scale line y divide the transparent area 41 into four areas, and the four areas correspond to the first quadrant, the second quadrant, the third quadrant, and the fourth quadrant of the coordinate system A. The offset 6 includes the scale value of the first scale line x and the scale value of the second scale line y corresponding to the center point 11 of the machining chuck, and also includes the area where the center point 11 of the machining chuck is located.

[0075] Exemplarily, the minimum unit of the length scale of the first scale line x and the second scale line y is 1 mm, which is convenient for operators to observe. The operators can directly read the first offset 61 and the second offset 62 .

[0076] In some embodiments, Figure 8 As shown, the transparent area 41 includes a measuring area 410 and a non-measuring area 413, and the non-measuring area 413 is located outside the measuring area 410; the position mark w also includes a third scale line n; the shape of the measuring area 410 is circular, and the third scale line n is set on the boundary line of the measuring area 410. The third scale line n is an arc.

[0077] The ratio of the radius of the measurement area 410 to the radius of the wafer position calibration fixture 4 is 0.3 to 0.6. The ratio of the radius of the measurement area 410 to the radius of the wafer position calibration fixture 4 can be: 0.3, 0.4 or 0.35. For example: when the diameter of the wafer position calibration fixture 4 is set to 300 mm, the radius of the wafer position calibration fixture 4 is 150 mm, and the radius of the measurement area 410 can be set to 45 mm, 60 mm or 52.5 mm.

[0078] In some instances, such as Fig. 9 As shown, the first scale line x and the second scale line y are located in the measurement area 410, that is, the first scale line x passes through the center 40 of the wafer position calibration fixture 4 and penetrates the measurement area 410 along its extension direction; the second scale line y passes through the center 40 of the wafer position calibration fixture 4 and penetrates the measurement area 410 along its extension direction.

[0079] It should be noted that the offset range between the wafer 5 to be calibrated and the processing chuck 1 is small, so there is no need to set the position mark w in the entire transparent area 41 of the wafer position calibration fixture 4, and only the position mark w needs to be set in the measurement area 410 to obtain the offset 6. In other examples, the position mark w can also be set in the non-measurement area 413 to apply to the case where the offset between the wafer 5 to be calibrated and the processing chuck 1 is large.

[0080] like Fig. 9 As shown, the offset 6 also includes: a third offset 63 is a scale value corresponding to the intersection of a line 7 connecting the center 40 of the wafer position calibration fixture 4 and the center point 11 of the processing suction cup and a third scale line n.

[0081] Exemplarily, the third scale line n is an arc scale, and the minimum unit of the third scale line n is 1°, which is convenient for an operator to observe, and the operator can directly read the third offset 63 .

[0082] like Fig. 9 , Fig.10 As shown, the center point 11 of the processing suction cup is located in the upper right area of ​​the transparent area 41, corresponding to the first quadrant of the coordinate system A. The offset 6 of the processing suction cup 1 is (x1, y1, n1) + the area. For example, the offset 6 of the processing suction cup 1 is (7, 5, 10) + the upper right area.

[0083] In some embodiments, Fig. 9 As shown, the measuring area 410 includes a first measuring area 411 and a second measuring area 412. The first measuring area 411 is circular in shape, and the shape and size of the first measuring area 411 are the same as those of the processing suction cup 1; the second measuring area 412 is annular in shape, and the second measuring area 412 is located outside the first measuring area 411.

[0084] The first measuring area 411 is connected to the second measuring area 412, and the overall shape of the measuring area 410 is circular. The shape and size of the first measuring area 411 are equal to the shape and size of the processing chuck 1. The operator can more intuitively know the alignment degree of the wafer position calibration fixture 4 and the processing chuck 1 through the overlap of the boundary line of the first measuring area 411 and the contour line of the processing chuck 1.

[0085] For example, when the boundary line of the first measurement area 411 completely coincides with the contour line of the processing chuck 1, the wafer position calibration fixture 4 is aligned with the processing chuck 1; when the boundary line of the first measurement area 411 is misaligned with the contour line of the processing chuck 1, the wafer position calibration fixture 4 is offset relative to the processing chuck 1. According to different diameters of the processing chuck 1, the corresponding first measurement area 411 is divided, so that the operator can better observe the positional relationship between the processing chuck 1 and the first measurement area 411.

[0086] like Figure 8 , Fig. 9 As shown, the first measurement area 411, the second measurement area 412 and the non-measurement area 413 are connected in sequence, and the overall shape of the transparent area 41 is circular. The setting of the transparent area 41 is convenient for the operator to observe, and the operator can clearly judge the position offset 6 between the wafer position calibration fixture 4 and the processing suction cup 1, and obtain the adjustment parameters of the robot arm 2 according to the offset 6. The operator adjusts the robot arm 2 according to the adjustment parameters, so that the position setting of the wafer 5 to be calibrated is in a concentric state with the position setting of the processing suction cup 1, avoiding the operator from repeating work and improving the operator's work efficiency.

[0087] In some examples, the measuring area 410, the non-measuring area 413 and the non-transparent area 43 are connected in sequence. The ratio of the radius of the measuring area 410, the radius of the transparent area 41 and the radius of the wafer position calibration fixture 4 is 1:2:3.

[0088] Exemplarily, the non-transparent area 43 is black; the pre-alignment device 8 includes: a laser sensor 81, the laser sensor 81 is used to scan the wafer position calibration fixture 4, and calculate the relative position of the center of the wafer position calibration fixture 4 on the pre-alignment device 8.

[0089] The laser sensor 81 scans the wafer position calibration fixture 4 on the pre-alignment device 8. The surface of the non-transparent area 43 of the wafer position calibration fixture 4 is black. The laser sensor 81 scans the black non-transparent area 43, and uses the center 22 of the base as a reference point to calculate the relative position of the center of the wafer position calibration fixture 4 on the pre-alignment device 8, and determines the position coordinates of the wafer position calibration fixture 4 on the pre-alignment device 8 and the position coordinates of the center of the wafer position calibration fixture 4. The laser sensor 81 feeds back the position coordinates of the wafer position calibration fixture 4 to the controller 3, and the controller 3 controls the robot arm 2 to grab the wafer position calibration fixture 4.

[0090] Exemplarily, the surface of the non-transparent area 43 of the wafer position calibration fixture 4 can be provided with a black coating or black tape; the black surface of the non-transparent area 43 can enable the laser sensor 81 to better distinguish the transparent area 41 from the non-transparent area 43, and can enable the laser sensor 81 to better identify the position coordinates of the wafer position calibration fixture 4, thereby facilitating the calculation of the relative position of the center of the wafer position calibration fixture 4 on the pre-alignment device 8.

[0091] In some embodiments, Figure 2 As shown, the ratio of the diameter of the transparent area 41 to the diameter of the wafer position calibration fixture 4 is 0.6-0.7.

[0092] Exemplarily, the diameter of the transparent area 41 is set to two-thirds of the diameter of the wafer position calibration fixture 4, the diameter of the wafer position calibration fixture 4 is set to 300 mm, and the diameter of the transparent area 41 is set to 200 mm. The non-transparent area 43 of the wafer position calibration fixture 4 occupies a larger area than the transparent area 41, which makes it easier for the operator to observe the offset 6 of the wafer position calibration fixture 4.

[0093] In some embodiments, Figure 5 As shown, the semiconductor device 1000 further includes a wafer box 10 , and the wafer box 10 is used to store the wafer 5 to be calibrated and the wafer position calibration fixture 4 .

[0094] Exemplarily, a plurality of wafer boxes 10 are provided, and the wafer boxes 10 include: a first wafer box 101 and a second wafer box 102. The first wafer box 101 is used to store the wafer 5 to be calibrated, and the second wafer box 102 is used to store the wafer position calibration fixture 4. The wafer 5 to be calibrated and the wafer position calibration fixture 4 are placed separately to facilitate grasping by the robot arm 2 and prevent the robot arm 2 from grasping the wrong wafer, which leads to increased workload.

[0095] like Fig.11 As shown, in another aspect, a wafer position calibration method is applied to a semiconductor device 1000, and the wafer position calibration method includes:

[0096] S1. Place the wafer position calibration fixture 4 on the processing suction cup 1 through the robot arm 2.

[0097] The robot 2 has initial parameters, including the initial position coordinates of the robot 2 grabbing the object 45 to be picked up and the initial position coordinates of the robot 2 placing the object 45 to be picked up. According to the initial parameters of the robot 2, the robot 2 grabs the wafer position calibration fixture 4 from the second wafer box 102, transfers it, and places it on the processing suction cup 1. At this time, the wafer position calibration fixture 4 is at the initial position coordinates of the robot 2 placing the object 45 to be picked up, and the wafer position calibration fixture 4 is not completely aligned with the processing suction cup 1. Exemplarily, the initial position coordinates of the robot 2 placing the object 45 to be picked up are (x1, y1, n1).

[0098] S2. Obtain the offset 6 between the center of the wafer position calibration fixture 4 and the center of the processing suction cup 1 by observing the transparent area 41 of the wafer position calibration fixture 4.

[0099] Referring to the above description, a coordinate system A is provided in the transparent area 41, and the coordinate system A includes: an origin O, a first coordinate axis X and a second coordinate axis Y, and is marked with a first scale line x, a second scale line y and a third scale line n. The operator reads the indication of the position mark w by observation and obtains the offset 6 between the center 40 of the wafer position calibration fixture 4 and the center of the processing chuck 1. For example, the offset 6 is (x2, y2, n2).

[0100] S3. Obtain adjustment parameters of the robot arm 2 according to the offset 6.

[0101] For example, refer to Fig. 9 , the position of the wafer position calibration fixture 4 is deviated relative to the processing chuck 1, and the wafer position calibration fixture 4 should be moved x2 units along the positive direction of the first coordinate axis X and y2 units along the positive direction of the second coordinate axis Y. According to the offset 6 (x2, y2, n2) between the center 40 of the wafer position calibration fixture 4 and the center of the processing chuck 1, the adjustment parameters of the robot 2 are obtained to align the center 40 of the wafer position calibration fixture 4 with the center of the processing chuck 1. According to the adjustment parameters of the robot 2, and the initial position coordinates of the robot 2 for placing the object 45 to be picked up are (x1, y1, n1), the adjusted position coordinates of the robot 2 for placing the object 45 to be picked up are (x1+x2, y1+y2, n1+n2).

[0102] S4. Calibrate the position of the wafer 5 to be calibrated based on the adjustment parameters.

[0103] like Fig.12 As shown, in some embodiments, calibrating the position of the wafer 5 to be calibrated based on the adjustment parameters includes:

[0104] S4-1, grab the wafer 5 to be calibrated by the robot arm 2 and place it on the pre-alignment device 8;

[0105] S4-2, obtaining the relative position of the center of the wafer 5 to be calibrated on the pre-alignment device 8 through the pre-alignment device 8, and feeding it back to the controller 3;

[0106] S4-3, the controller 3 controls the center of the robot arm 2 to align with the center of the wafer 5 to be calibrated, and places the wafer 5 to be calibrated on the processing suction cup 1 according to the adjustment parameters, so that the center of the wafer 5 to be calibrated is aligned with the center of the processing suction cup 1.

[0107] The robot arm 2 grabs the wafer 5 to be calibrated, and places the wafer 5 to be calibrated on the processing suction cup 1 according to the adjustment parameters. At this time, the center of the wafer 5 to be calibrated is aligned with the center of the processing suction cup 1.

[0108] Through the wafer position calibration method, the wafer position calibration fixture 4 is used to replace the wafer 5 to be calibrated, and the robot arm 2 grabs the wafer position calibration fixture 4, and the wafer position calibration fixture 4 is transferred and placed on the processing suction cup 1. The operator observes the positional relationship between the center of the wafer position calibration fixture 4 and the center of the processing suction cup 1 according to the transparent area 41, and observes the offset 6 between the center of the wafer position calibration fixture 4 and the center of the processing suction cup 1, and obtains the adjustment parameters of the robot arm 2 according to the offset 6.

[0109] According to the adjustment parameters, the robot arm 2 grabs the wafer 5 to be calibrated and places it on the processing suction cup 1, so that the center of the wafer 5 to be calibrated is aligned with the center of the processing suction cup 1. At this time, the center of the wafer 5 to be calibrated and the center of the processing suction cup 1 are on a vertical line perpendicular to the horizontal ground.

[0110] By using the wafer position calibration fixture 4, the wafer 5 to be calibrated can be quickly calibrated, so that the wafer 5 to be calibrated and the processing suction cup 1 are in a concentric state, so as to ensure the accuracy and convenience of placing the wafer 5 to be calibrated, avoid the wafer 5 to be calibrated The positional relationship between the center of the wafer 5 to be calibrated and the center of the processing suction cup 1 cannot be determined due to its own occlusion, and at the same time, it also avoids repeated and mechanical work of the robot arm 2, thereby improving work efficiency. Fig.13 As shown, in some embodiments, after obtaining the adjustment parameters of the robot arm 2 according to the offset 6, the wafer position calibration method further includes:

[0111] S3-1. Grab the wafer position calibration fixture 4 from the processing suction cup 1 through the robot arm 2.

[0112] S3-2, the controller adjusts the moving path of the robot arm 2 according to the adjustment parameters, and places the wafer position calibration fixture 4 on the processing suction cup 1 again.

[0113] S3 - 3 . By observing the transparent area 41 of the wafer position calibration fixture 4 , verify whether the center of the wafer position calibration fixture 4 and the center of the processing suction cup 1 are aligned.

[0114] If it is verified that the center of the wafer position calibration fixture 4 and the center of the processing suction cup 1 are not aligned, the wafer position calibration fixture 4 is re-grabbed and placed on the processing suction cup 1 again through the robot arm 2, and adjusted multiple times until the center of the wafer position calibration fixture 4 and the center of the processing suction cup 1 are aligned.

[0115] In the transparent area 41 of the wafer position calibration fixture 4, the operator can visually see whether the center of the wafer position calibration fixture 4 and the center of the processing suction cup 1 are aligned, thereby avoiding the situation where the center of the wafer position calibration fixture 4 and the center of the processing suction cup 1 are not concentric, and can more clearly define the position coordinates of the wafer 5 to be calibrated, thereby preventing the center of the wafer 5 to be calibrated from being not concentric with the center of the processing suction cup 1, resulting in eccentric movement of the wafer 5 to be calibrated during operation or the wafer 5 to be calibrated being thrown away. By determining the position coordinates of the wafer position calibration fixture 4 and the position coordinates of the wafer 5 to be calibrated, the operator's work efficiency can be improved and multiple movements of the wafer 5 to be calibrated for alignment can be avoided.

[0116] like Fig.14 As shown, in some embodiments, before the wafer position calibration fixture 4 is placed on the processing suction cup 1 by the robot arm 2, the wafer position calibration method further includes:

[0117] S11, placing the wafer position calibration fixture 4 on the pre-alignment device 8 through the robot arm 2;

[0118] S12, obtaining the relative position of the center of the wafer position calibration fixture 4 on the pre-alignment device 8 through the pre-alignment device 8, and feeding back to the controller 3;

[0119] S13 , the controller 3 controls the center of the robot arm 2 to align with the center of the wafer position calibration fixture 4 , so as to grab the wafer position calibration fixture 4 from the pre-alignment device 8 .

[0120] Before transferring the wafer position calibration fixture 4 to the processing suction cup 1, the center 40 of the wafer position calibration fixture 4 is first aligned with the center of the gripping part 25 of the robot 2 through the pre-alignment device 8 to ensure that the centers of the wafer position calibration fixture 4 and the gripping part 25 are concentric, so that the wafer position calibration fixture 4 can be more firmly adsorbed on the gripping suction cup 24, which facilitates the transfer of the wafer position calibration fixture 4. At the same time, when the robot 2 places the wafer position calibration fixture 4, the wafer position calibration fixture 4 can be placed more accurately on the specified position coordinates to avoid the deviation in the placement position of the wafer position calibration fixture 4 due to the non-concentricity of the wafer position calibration fixture 4 and the gripping part 25.

[0121] It can be understood that before the robot 2 transfers the wafer 5 to be calibrated to the processing suction cup 1, it also includes the step of first aligning the center of the wafer 5 to be calibrated with the gripping part 25 of the robot 2 through the pre-alignment device 8, ensuring that the wafer 5 to be calibrated and the gripping part 25 are concentric, which can ensure the firmness of the wafer 5 to be calibrated during the transfer process. When the robot 2 places the wafer 5 to be calibrated, it can more accurately place the wafer 5 to be calibrated at the specified position coordinates, avoiding the deviation of the placement position of the wafer 5 to be calibrated due to the non-concentricity of the wafer 5 to be calibrated and the gripping part 25, thereby ensuring that the wafer 5 to be calibrated is concentric with the gripping part 25.

[0122] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A wafer position calibration fixture, characterized in that: The wafer position calibration fixture includes a transparent area and a non-transparent area, the non-transparent area is located at the periphery of the transparent area, and the center of the wafer position calibration fixture is located at the transparent area; the transparent area is provided with a position mark surrounding the center of the wafer position calibration fixture; the shape and size of the wafer position calibration fixture are the same as the shape and size of the wafer to be calibrated.

2. The wafer position calibration fixture according to claim 1, characterized in that: The position mark includes a first scale mark and a second scale mark; The first scale line and the second scale line intersect, and an intersection point where the first scale line and the second scale line intersect coincides with a center of the wafer position calibration fixture.

3. The wafer position calibration fixture according to claim 2, characterized in that: The transparent area includes a measuring area and a non-measuring area, and the non-measuring area is located outside the measuring area; The position mark also includes a third scale line; The shape of the measuring area is circular, and the third scale line is arranged on the boundary line of the measuring area.

4. The wafer position calibration fixture according to any one of claims 1 to 3, characterized in that: The ratio of the diameter of the transparent area to the diameter of the wafer position calibration fixture is 0.6 to 0.

7.

5. A semiconductor device, characterized in that: include: The wafer position calibration fixture as claimed in any one of claims 1 to 4; A pre-alignment device for obtaining the center position of the calibration fixture or wafer; a processing suction cup for carrying the calibration fixture or wafer; A robotic arm for transferring the calibration fixture or wafer; A controller is electrically connected to the robotic arm.

6. The semiconductor device according to claim 5, characterized in that The transparent area of ​​the wafer position calibration fixture includes a measuring area and a non-measuring area, and the non-measuring area is located outside the measuring area; The measuring area includes: a first measuring area and a second measuring area located outside the first measuring area, and the shape and size of the second measuring area are the same as those of the processing suction cup.

7. A wafer position calibration method, characterized in that: The wafer position calibration method is applied to the semiconductor device according to claim 5 or 6, and the wafer position calibration method comprises: Placing the wafer position calibration fixture onto the processing suction cup by the robotic arm; Obtaining an offset between a center of the wafer position calibration fixture and a center of the processing chuck by observing the transparent area of ​​the wafer position calibration fixture; Acquiring adjustment parameters of the robotic arm according to the offset; The position of the wafer to be calibrated is calibrated based on the adjustment parameters.

8. The wafer position calibration method according to claim 7, characterized in that: After obtaining the adjustment parameters of the robot arm according to the offset, the wafer position calibration method further includes: Grasping the wafer position calibration fixture from the processing suction cup by the robot arm; The controller adjusts the moving path of the robot arm according to the adjustment parameters, and places the wafer position calibration fixture on the processing suction cup again; By observing the transparent area of ​​the wafer position calibration jig, it is verified whether the center of the wafer position calibration jig and the center of the processing chuck are aligned.

9. The wafer position calibration method according to claim 7, characterized in that: Before placing the wafer position calibration fixture on the processing suction cup by the robot arm, the wafer position calibration method further includes: Placing the wafer position calibration fixture on a pre-alignment device by means of the robotic arm; The relative position of the center of the wafer position calibration fixture on the pre-alignment device is obtained by the pre-alignment device, and fed back to the controller; The controller controls the center of the robot arm to align with the center of the wafer position calibration fixture to grab the wafer position calibration fixture from the pre-alignment device.

10. The wafer position calibration method according to any one of claims 7 to 9, characterized in that: Calibrating the position of the wafer to be calibrated based on the adjustment parameter includes: Grabbing the wafer to be calibrated by the robotic arm and placing it on the pre-alignment device; The relative position of the center of the wafer to be calibrated on the pre-alignment device is obtained by the pre-alignment device, and fed back to the controller; The controller controls the center of the robot arm to align with the center of the wafer to be calibrated, and places the wafer to be calibrated on the processing suction cup according to the adjustment parameters so that the center of the wafer to be calibrated is aligned with the center of the processing suction cup.

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