Valve sleeve throttling square hole machining method, device and equipment based on laser and medium

Abstract

The invention provides a valve sleeve throttling square hole machining method, device and equipment based on laser and a medium. The machining method can comprise the steps that initial machining parameters related to a femtosecond laser are obtained; performing micropore simulation processing on the valve sleeve based on the initial processing parameters, and updating the initial processing parameters to obtain target processing parameters according to a deviation between a simulation processing result and an expected result; and according to the target machining parameters, laser beams provided by a femtosecond laser are used for conducting square hole machining on the valve sleeve to obtain a target valve sleeve throttling square hole.

Description

Technical Field

[0001] The present disclosure relates to the field of laser processing technology, and in particular to a method, device, equipment and medium for processing a valve sleeve throttling square hole based on laser. Background Art

[0002] As a hydraulic feedback automatic control system that uses hydraulic power as a power source and realizes signal transmission and control in an electrical manner, the hydraulic servo system plays a vital role in high-end industrial control fields such as aviation, aerospace, and robotics due to its excellent control accuracy, quick response speed, strong load capacity, and smooth transmission performance. In this system, valve sleeve parts are the core components of hydraulic valves. The geometric dimensions and morphological characteristics of the throttling square hole have a direct and significant impact on the performance indicators of the hydraulic valve, such as dead zone, overlap, hysteresis, and internal leakage.

[0003] At present, the processing of the throttling square hole of the valve sleeve mainly relies on electromachining technology. First, a small hole machine is required to process the wire hole, and then the wire-cutting equipment is used for fine finishing to ensure the accuracy and surface quality of the throttling square hole. However, this processing flow is not only complicated, but also unable to control the aperture, hole shape and inclination of the throttling square hole during the processing. In addition, it has extremely high requirements on the stability and efficiency of the pulse power supply. The electro-corrosion layer generated during the EDM and wire-cut processing will have a negative impact on the service life of the final product. Therefore, it has become an urgent need for the development of the industry to develop a new processing technology to achieve high-precision and high-efficiency processing and solve the limitations of the existing process. Summary of the invention

[0004] In view of this, the present disclosure hopes to provide a method, device, equipment and medium for processing a valve sleeve throttling square hole based on laser, which can improve the efficiency and accuracy of processing the valve sleeve throttling square hole.

[0005] The technical solution of the present disclosure is achieved as follows: In a first aspect, the present disclosure provides a method for machining a valve sleeve throttling square hole based on laser, the machining method comprising: Obtaining initial processing parameters related to the femtosecond laser; Performing micro-hole simulation processing on the valve sleeve based on the initial processing parameters, and updating the initial processing parameters to obtain target processing parameters according to the deviation between the simulation processing result and the expected result; According to the target processing parameters, a laser beam provided by a femtosecond laser is used to process a square hole on the valve sleeve to obtain a target valve sleeve throttling square hole.

[0006] In a second aspect, the present disclosure provides a laser-based valve sleeve throttling square hole processing device, the processing device comprising: an acquisition part, a simulation part and a processing part, wherein: The acquisition part is configured to acquire initial processing parameters related to the femtosecond laser; The simulation part is configured to perform micro-hole simulation processing on the valve sleeve based on the initial processing parameters, and update the initial processing parameters to obtain target processing parameters according to the deviation between the simulation processing result and the expected result; The processing part is configured to process a square hole of the valve sleeve using a laser beam provided by a femtosecond laser according to the target processing parameters to obtain a target valve sleeve throttling square hole.

[0007] In a third aspect, the present disclosure provides a computing device, comprising: a processor and a memory; the processor is used to execute instructions stored in the memory to implement the laser-based valve sleeve throttling square hole processing method described in the first aspect.

[0008] In a fourth aspect, the present disclosure provides a computer storage medium storing at least one instruction, wherein the at least one instruction is used to be executed by a processor to implement the laser-based valve sleeve throttling square hole machining method as described in the first aspect.

[0009] The present disclosure provides a method, device, equipment and medium for processing valve sleeve throttling square holes based on laser; a femtosecond laser is used as a processing light source, and the high energy density, high peak power and low heat accumulation effect of the femtosecond laser are utilized to realize precision processing of the valve sleeve, reduce the heat-affected area, and improve the surface quality and performance of the product. Before actual processing, the valve sleeve is subjected to micro-hole simulation processing using the initial processing parameters, and potential processing errors are predicted and corrected through simulation processing, thereby reducing the deviation in the processing process and improving the processing accuracy. According to the deviation between the simulation results and the expected results, the initial processing parameters are adjusted to obtain more accurate target processing parameters. According to the target processing parameters, the valve sleeve is subjected to actual throttling square hole processing using the laser beam provided by the femtosecond laser, which can realize high-precision and high-efficiency processing of the valve sleeve throttling square hole, while reducing material waste and post-processing requirements. In addition, laser processing eliminates the step of threading the wire hole before slow wire processing in electrical processing, reduces processing time, and improves processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic diagram of an exemplary valve sleeve square hole processing system composition that can be applied to the present disclosure; Figure 2 A flow chart of a method for machining a valve sleeve throttling square hole based on laser provided in the present disclosure; Figure 3 A schematic diagram of a valve sleeve square hole processing technology solution provided by the present disclosure; Figure 4A schematic diagram of thermal effects of long pulse laser processing provided by the present disclosure; Figure 5 A schematic diagram of thermal effects of ultrashort pulse laser processing provided by the present disclosure; Figure 6 A comparison chart of thermal effect results provided by the present disclosure; Figure 7 A schematic diagram of a laser processing optical path provided by the present disclosure; Figure 8 A schematic diagram of a beam processing trajectory filling provided by the present disclosure; Fig. 9 Another schematic diagram of beam processing trajectory filling provided by the present disclosure; Fig.10 A schematic diagram of filling another beam processing trajectory provided by the present disclosure; Fig.11 A focusing processing schematic diagram of a focusing mirror provided by the present disclosure; Fig.12 A schematic structural diagram of a laser-based valve sleeve throttling square hole processing device provided by the present disclosure; Fig.13 A schematic diagram of the structure of a computing device provided by the present disclosure. DETAILED DESCRIPTION

[0011] The technical solutions in the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings in the present disclosure.

[0012] As a key component of the hydraulic valve in the hydraulic servo system, the geometric dimensions and morphological characteristics of the throttling square hole of the valve sleeve have different degrees of influence on the performance of the hydraulic valve product, such as dead zone, overlap, hysteresis and internal leakage. The hydraulic valve plays the role of controlling and regulating hydraulic energy in the hydraulic servo system, and can accurately control the pressure, flow and direction of the fluid to achieve precise control of the actuator. Therefore, the machining accuracy and surface quality of the valve sleeve have a vital impact on the reliability, stability and service life of the hydraulic servo system. In order to meet the quality and accuracy requirements of precision valve sleeves in different application fields, the surface of the throttling square hole of the valve sleeve is usually finished after grinding and boring.

[0013] In the related art, electro-machining is usually used to process the throttling square hole of the valve sleeve. However, an electro-corrosion layer will be generated during the electro-machining process, which will have a negative impact on the service life of the final product. In addition, the machining process is complicated and inefficient, and it is impossible to process the throttling square hole with a diameter less than 0.1 mm.

[0014] Based on this, the present disclosure hopes to provide a laser-based valve sleeve throttling square hole processing technology solution, through which the hole type, hole diameter and R angle of the valve sleeve throttling square hole can be flexibly controlled, and no electrolytic corrosion layer is generated during the processing. It should be noted that the R angle is the inner arc angle and / or outer arc angle of the valve sleeve throttling square hole. Figure 1 , which shows a schematic diagram of an exemplary valve sleeve square hole processing system 100 that can be applied to the present disclosure. It should be noted that, Figure 1 The processing system 100 shown is for illustrative purposes only and is not intended to be limiting in any way. Figure 1As shown, the processing system 100 may include a laser source 101, an optical transmission system 102, a beam scanning module 103, a beam focusing module 104, an axis motion control system 105, and a valve sleeve square hole 106, wherein the laser source 101 includes an emission module and a focusing module, which are used to amplify the laser power and provide laser energy, and the laser beam generated by the laser source is used to perform micro-hole processing on the valve sleeve, and the micro-hole can be a circular hole, an elliptical hole, a square hole, a special-shaped hole or a conical hole. In the present disclosure, a femtosecond laser is used as the laser source 101, and the parameters involved include wavelength, pulse width, laser power, and repetition frequency, taking the throttling square hole processing of the valve sleeve as an example. The optical transmission system 102 is used to transmit the laser energy generated by the laser source 101 to the area to be processed. In order to ensure stability and accuracy during the laser transmission process, optical fibers, reflectors and other optical elements are usually included to guide and adjust the direction and shape of the laser beam, and the parameters involved include at least the beam expansion multiple and the divergence angle. Specifically, the optical transmission system 102 is used to shape, make the laser beam uniform, expand the beam, and collimate it, and then enter the beam scanning module 103 in a collimated optical path. The beam scanning module 103 is used to control the movement and scanning of the laser beam in the area to be processed, and the parameters involved include at least the scanning processing trajectory, scanning speed, single-layer feed amount, and number of layers. According to the scanning requirements, different scanning modes can be configured to achieve different scanning imaging functions, including large field of view imaging images, small field of view high-resolution imaging images, and large field of view high-resolution imaging images. The beam focusing module 104 is used to focus the laser beam on the valve sleeve to be processed to achieve precise micro-hole processing, and the parameters involved include focal length, focal depth, and focal spot size. For the realization of focusing, the focusing characteristics of the laser beam can be controlled, such as increasing the focal depth, dividing the focus into several equal focuses, or using lasers of different wavelengths to focus all on the same plane. The axis motion control system 105 is used to accurately control the mechanical movement during the valve sleeve micro-hole processing, including the movement of the linear axis and the rotary axis. For example, you can configure the speed axis and position axis process objects, and write speed control and position control programs to achieve precise position control and motion synchronization and ensure the coplanarity of the valve sleeve square hole 106. The valve sleeve square hole 106 is the final processing result, that is, the throttling square hole that needs to be processed on the valve sleeve, and the parameters involved include at least processing quality, aperture accuracy and taper. The geometric dimensions and morphological features of the valve sleeve square hole 106 have a direct impact on the performance of the hydraulic valve, so there are high requirements for processing accuracy. In addition, in some examples, air blowing and slag removal can also be included, and the parameters involved can include the air blowing method and air pressure.

[0015] Combination Figure 1 The processing system 100 shown in FIG. 1 is used to obtain a high-precision valve sleeve square hole 106. Figure 2, which shows a flow chart of a laser-based valve sleeve throttling square hole processing method provided by the present disclosure, and the processing method includes steps S201 to S203.

[0016] S201: Acquire initial processing parameters related to a femtosecond laser.

[0017] Femtosecond laser is a device that emits ultrashort pulse lasers and can produce lasers with pulse widths of femtoseconds, which enables femtosecond lasers to achieve temporal and spatial resolution when processing materials. Since the pulse energy is concentrated and released in a short period of time, it can produce extremely high peak power, which can achieve nonlinear optical effects and micron or even nanometer precision processing, such as microhole drilling, microstructure etching, and non-metallic cutting. In addition, due to the extremely short pulse duration and small heat accumulation effect, the heat-affected zone of material processing using femtosecond lasers is very small, which is suitable for the processing of heat-sensitive materials. The initial processing parameters related to femtosecond lasers include at least wavelength, pulse width, repetition frequency and average power. Among them, the wavelength of the femtosecond laser determines the characteristics of the interaction between the laser and the material. Commonly used wavelengths of femtosecond lasers include 1030nm, 515nm, 343nm and 258nm. Different wavelengths are suitable for different materials and processing requirements. The pulse width is usually between a few femtoseconds and tens of femtoseconds. This parameter directly affects the accuracy and quality of the processing. The repetition rate refers to the number of pulses emitted by the femtosecond laser per second. The adjustable range is usually from 1Hz to 1000kHz. This parameter affects the processing speed and efficiency. The average power refers to the total energy output by the femtosecond laser. For a femtosecond laser, high average power means higher energy output, which can be used for more complex processing tasks. In addition, the appropriate type of femtosecond laser, such as fiber laser or solid-state laser, can be selected according to specific application requirements, and its performance indicators, such as stability and reliability, can be considered. Combined with the working principle and parameter design of the femtosecond laser, the process parameters suitable for the processing task are preliminarily set.

[0018] S202: Performing micro-hole simulation processing on the valve sleeve based on the initial processing parameters, and updating the initial processing parameters to obtain target processing parameters according to the deviation between the simulation processing result and the expected result.

[0019] Simulation processing is a method of predicting the processing results by simulating the micro-hole processing process of the valve sleeve by a femtosecond laser in the simulation software before the actual processing. The processing results can be the groove depth, width, heat-affected zone and material removal rate. The trial-and-error cost and time in the actual processing can be reduced through simulation processing. According to the deviation between the simulation processing results and the predicted processing results, the initial processing parameters are adjusted and optimized. For example, orthogonal correlation experiments are used to obtain more accurate target processing parameters. For example, based on the relationship between the orthogonal correlation experimental results of the initial processing parameters and the simulation processing results, a multi-parameter control model is constructed. The model can be used to more accurately adjust and optimize the initial processing parameters to obtain the target processing parameters, and obtain processing results that are closer to the expected results according to the target processing parameters.

[0020] S203: According to the target processing parameters, a laser beam provided by a femtosecond laser is used to perform square hole processing on the valve sleeve to obtain a target valve sleeve throttling square hole.

[0021] By using preset target processing parameters, such as laser power, scanning speed and beam inclination, the high-energy laser beam emitted by the femtosecond laser is used to perform actual and precise square hole processing on the valve sleeve under the precise control of the optical path transmission system 102 and the beam scanning module 103. At the same time, the axis motion control system 105 is used to ensure the mechanical motion accuracy during the processing, and finally a valve sleeve square hole 106 that meets the design specifications, i.e., a target valve sleeve throttling square hole, is formed.

[0022] according to Figure 2 The technical solution shown uses a femtosecond laser as a processing light source, and utilizes the high energy density, high peak power, and low heat accumulation effect of the femtosecond laser to achieve precision processing of the valve sleeve, reduce the heat-affected area, and improve the surface quality and performance of the product. Before actual processing, the valve sleeve is simulated for micro-hole processing using the initial processing parameters, and the potential processing errors are predicted and corrected through simulation processing, thereby reducing the deviation in the processing process and improving the processing accuracy. According to the deviation between the simulation results and the expected results, the initial processing parameters are adjusted to obtain more accurate target processing parameters. According to the target processing parameters, the valve sleeve is actually processed for throttling square holes using the laser beam provided by the femtosecond laser, which can achieve high-precision and high-efficiency processing of the valve sleeve throttling square holes, while reducing material waste and post-processing requirements. In addition, laser processing eliminates the step of threading the wire hole before slow wire processing in electrical processing, reducing processing time and improving processing efficiency.

[0023] Based on the aforementioned Figure 2 The technical solution shown in the figure is to achieve precision machining of the throttling square hole of the valve sleeve, such as Figure 3As shown, it is necessary to control the recast layer of the square hole of the valve sleeve, the accuracy of the valve sleeve aperture, the position accuracy and coplanarity of the square hole of the valve sleeve, and the R angle of the square hole of the valve sleeve, wherein the control of the recast layer of the square hole of the valve sleeve utilizes the characteristics of the short pulse duration and small heat accumulation effect of the femtosecond laser, and no recast layer is generated during the material processing. The control of the aperture accuracy of the square hole of the valve sleeve is to adjust the initial processing parameters according to the deviation between the simulation results and the expected results to obtain more accurate target processing parameters, wherein the initial processing parameters include at least the emission power and focal length of the femtosecond laser, the R angle of the square hole of the valve sleeve, and the blowing method. The position accuracy and coplanarity control of the square hole of the valve sleeve is to utilize the following Figure 1 The axis motion control system 105 in the processing system 100 shown in the figure performs actual throttling square hole processing on the valve sleeve using the laser beam provided by the femtosecond laser according to the target processing parameters, so as to achieve high-precision and high-efficiency processing of the throttling square hole of the valve sleeve.

[0024] At present, the processing of the throttling square hole of the valve sleeve mainly relies on the electromachining method, which is a kind of electro-erosion processing, and uses electric sparks to remove materials. However, during the process of electro-spark or wire-cut processing, the high-temperature material surface melts and then solidifies rapidly to form a layer of material, namely the electro-erosion layer. Since the electro-erosion layer has undergone a process of melting and re-solidification, its crystal structure and physical properties are different from those of the base material, and there will be problems of residual stress and cracks, thus affecting the later service life of the valve sleeve.

[0025] For example, compared to the electrical machining method, the control of the recast layer of the square hole of the valve sleeve is carried out by ultrashort pulse laser machining, and the valve sleeve is processed by the ultrashort pulse laser provided by the femtosecond laser. The processing principle is to rely on extremely high power density to directly break the molecular bonds of the material in a very short time, destroy the micro-explosion mechanism of the surface material to achieve material removal, and generate low heat energy during the action process. Therefore, it has small thermal effect, small thermal diffusion, strong material applicability, and can achieve nano-level material removal. Compared with the electrical machining method, ultrashort pulse laser processing is a non-contact cold processing, and there is no remelting layer. Therefore, the processing efficiency is high, and there are more degrees of freedom in the material, shape and size of the processing object. It is usually suitable for automated precision processing. It should be noted that the recast layer generally refers to the surface layer formed by the material melting due to high temperature and re-solidification during the cooling process during laser cutting, laser welding or other thermal processing.

[0026] Combined with the advantages of ultrashort pulse lasers described above, see Figure 4 The thermal effects of long pulse laser processing and Figure 5The schematic diagram of thermal effects of ultrashort pulse laser processing shown in the figure shows that there are significant differences in the process and results of long pulse laser processing and ultrashort pulse laser processing. Specifically, long pulse laser processing refers to the technology of using long pulse laser beams to process materials. In long pulse laser processing, due to the long pulse width and the long interaction time between the laser and the material, more heat is generated and heat is transferred to the surrounding materials, resulting in significant thermal effects. The above thermal effects cause the molten material to be sputtered out from the molten zone, resulting in surface debris, recast layers, surface ripples and microcracks caused by shock waves, and damage to adjacent structures. Therefore, the heat-affected zone of long pulse laser processing is large, which will affect the microstructure and physical properties of the material.

[0027] Ultrashort pulse laser processing refers to the technology of using ultrashort pulse lasers for material processing, such as femtosecond laser processing, which can achieve a "cold processing" effect on the material with its extremely short pulse width and high peak power. In this processing method, the material is directly converted into a plasma state to achieve material eruption removal, with a small heat-affected area and high processing accuracy. Specifically, during the ultrashort pulse laser processing process, the electrons absorb the laser energy and quickly ionize to generate plasma or electron beams, and then the material is removed through the interaction between the plasma flow and the laser. This processing method has no melting zone, will not produce molten material, surface debris, recast layer, and no shock waves, so it will not produce microcracks and no damage to critical structures. In addition, the low thermal effect produced has minimal impact on the material and the processing quality is good. For example, in order to ensure that there is no ablation, no residue and the roughness meets the requirements, a femtosecond laser with an extremely short pulse width is used, with a wavelength of 1030nm and a pulse width of 250fs. The lower pulse energy can obtain extremely high peak power, which largely avoids the phenomenon of material melting and continuous evaporation caused by long pulse width and low intensity laser, and relies on the Coulomb force between molecules to remove materials. Due to the ultra-short pulse duration of femtosecond laser processing, the heat accumulation effect is small, so the heat-affected area is very small, which helps to maintain the original performance of the material. Then, orthogonal correlation experiments of multiple parameters are carried out within the range of several critical parameters such as repetition frequency, scanning speed, feed rate, and blowing volume to obtain a parameter combination that meets the requirements of roughness and no remelting layer.

[0028] Based on the above analysis of the long pulse laser processing and ultrashort pulse laser processing processes, it is understandable that long pulse laser processing technology, due to its strong thermal effect and poor processing quality, will produce obvious heat-affected zones, recast layers and microcracks, and cannot meet the requirements of high-quality micro-hole processing. Due to the obvious thermal effect of long pulse laser processing, it will cause thermal damage to the surface of the material and surrounding areas, such as the expansion of the heat-affected zone and changes in material properties. Ultrashort pulse laser processing can significantly reduce thermal damage and achieve high-precision and high-quality micro-processing, which is particularly suitable for the processing of precision components and fragile materials. Therefore, compared with long pulse laser processing, ultrashort pulse laser processing can more accurately control the processing process, reduce thermal effects, and provide higher processing quality. It is especially suitable for high-precision and high-demand application scenarios. Figure 6 The thermal effect comparison diagram of long pulse laser processing and ultrashort pulse laser processing is shown in the arrow direction. In ultrashort pulse laser processing, the thermal effect of processing micro-holes with apertures of 60μm and 70μm using femtosecond fs, picosecond ps, and nanosecond ns lasers increases in sequence. It can be seen that the thermal effect generated by femtosecond laser processing is the smallest and has the smallest impact on the material.

[0029] In order to meet the development of high-precision square hole technology, in some examples, micro-hole simulation processing is performed on the valve sleeve based on initial processing parameters, and the initial processing parameters are updated to obtain target processing parameters according to the deviation between the simulation processing results and the expected results. This can include obtaining a three-dimensional model of the valve sleeve throttling square hole to be processed, layering the three-dimensional model through a beam scanning module, and determining the beam processing trajectory of the femtosecond laser in each layer of the model according to the initial processing parameters; performing micro-hole simulation processing on the three-dimensional model according to the beam processing trajectory to obtain a simulation processing result; and updating the initial processing parameters to obtain the target processing parameters according to the deviation between the simulation processing results and the expected results.

[0030] For the above example, specifically, exemplarily, Figure 1The beam scanning module 103 shown is a 5D programmable beam scanning module. The 5D programmable beam scanning module has a focus spot of 10-20μm, an optical axis angle of ±7.5°, a single processing width of 2.5mm, a maximum processing accuracy of ±1μm, and a scanning speed of 600Hz. First, the three-dimensional model of the valve sleeve throttling square hole to be processed is obtained using the three-dimensional modeling software to provide the necessary geometric information for subsequent simulation processing. Then, the three-dimensional model is accurately layered using the 5D programmable beam scanning module, each layer represents a processing height, and the beam processing trajectory of the femtosecond laser in each layer is planned based on the initial processing parameters; Then, the micro-hole simulation processing is performed on the three-dimensional model according to the beam processing trajectory to generate a simulation processing result. Finally, the deviation between the simulation processing result and the expected target is compared, and the initial processing parameters are adjusted and optimized accordingly to determine the final target processing parameters to ensure processing accuracy and efficiency.

[0031] In some examples, the femtosecond laser includes an emission module, and the initial processing parameters include a blowing method and an emission power of the emission module; performing microhole simulation processing on the three-dimensional model according to the light beam processing trajectory to obtain a simulation processing result may include determining the emission power of the emission module corresponding to each position in the light beam processing trajectory; performing microhole simulation processing on the three-dimensional model according to the light beam processing trajectory, the emission power and the blowing method to obtain a simulation processing result.

[0032] For the above example, specifically, first, configure the transmitting module of the femtosecond laser, and adjust its transmitting power and blowing mode as the initial processing parameters. The transmitting power controls the energy output of the laser, while the blowing mode helps control the material removal and cooling during the processing. According to the model data of each layer, combined with the initial processing parameters, determine the beam processing trajectory of the femtosecond laser in each layer to ensure the accuracy and consistency of the beam processing trajectory. Use simulation software to perform micro-hole simulation processing on the three-dimensional model according to the determined beam processing trajectory, simulate the actual processing process, and obtain the simulation processing results.

[0033] For example, see Figure 7, which shows a schematic diagram of a laser processing optical path provided by the present invention. Specifically, a femtosecond laser with a wavelength of 1030nm, a pulse width of 250fs, a beam quality M² less than 1.2, and an exit spot roundness greater than 98% is used as a light source. The light beam is shaped, uniformed, expanded, and collimated before entering the 5D programmable beam scanning module in a collimated optical path. In detail, after the exit spot of the femtosecond laser is detected and the beam posture is adjusted through a 45° reflector, it enters the beam expander coaxially and collimated. By adjusting the magnification and divergence angle of the beam expander, the reflected light generated after the spot size is magnified by 2-3 times is collimated and propagated, and the stray light of non-wavelength is filtered through a reflective filter and an absorptive filter. The linearly polarized light is converted into circularly polarized light through a 1 / 4 wave plate and then enters the 5D programmable beam scanning module. Based on the 5D programmable beam scanning module and such Figures 8 to 10 Any of the beam processing trajectory filling diagrams shown in the figure is used to simulate the processing of the valve sleeve throttling square hole, and a charge-coupled device camera (CCD) and a laser range sensor are used to realize normal and Z-direction positioning corrections, and the material is removed by feeding layer by layer. In addition, the hole diameter accuracy and hole shape that meet the requirements are developed by combining the laser power, scanning speed, feeding method, feeding amount, defocus position and repetition frequency and other multi-process parameter control. Figures 8 to 10 As shown in the schematic diagram of light path processing trajectory filling, it can be seen that the equally spaced spiral line filling can ensure the consistency of the punching and removal effect.

[0034] It should be noted that after the 5D programmable beam scanning module is configured, a CCD camera and a laser range finder are used for positioning correction. The CCD camera is used to capture the image of the valve sleeve, identify the characteristic points of the valve sleeve through image processing technology, and achieve accurate positioning of the valve sleeve. The laser range finder is used to measure the distance from the valve sleeve surface to the laser beam, ensure that the laser beam is perpendicular to the valve sleeve surface, that is, normal positioning, and monitor the distance between the valve sleeve and the laser beam in real time during the processing process. By adjusting the Z-axis position, ensure that the laser beam is always focused on the same depth of the valve sleeve, that is, Z-direction positioning correction.

[0035] Removing material by feeding layer by layer is a layer-by-layer processing method that can accurately control the amount of material removed to ensure aperture accuracy and surface quality. Specifically, after the 3D model is imported into the 5D programmable beam scanning module, it is sliced ​​and layered, and each layer represents a processing height. On each layer, the laser beam scans according to the predetermined beam processing trajectory to remove material and form part of the hole. After each layer is processed, the workbench or valve sleeve moves to the next layer along the Z-axis direction, and the feeding process is repeated until the entire hole is processed.

[0036] In addition, during the processing, a reasonable blowing method can help reduce heat accumulation in the processing area and avoid the expansion of the heat-affected zone, thereby controlling the thermal effect. In addition, the effective application of the blowing method can improve the material removal efficiency, reduce slag and spatter during the processing process, and improve the processing quality. By precisely controlling the emission power and blowing method of the femtosecond laser, high-precision processing of the valve sleeve throttling square hole can be achieved. Through simulation processing and result analysis, the processing effect can be predicted and optimized before actual processing, reducing the trial and error cost and improving processing efficiency.

[0037] In order to achieve control of the R angle of the square hole of the valve sleeve, in some examples, the femtosecond laser includes a focusing module, and the initial processing parameters also include the focal length of the focusing module; the three-dimensional model is subjected to micro-hole simulation processing according to the light beam processing trajectory to obtain a simulation processing result, which may include adjusting the focal length of the focusing module according to the comparison between the R angle in the simulation processing result and the R angle in the expected result, wherein the R angle is the inner arc angle and / or outer arc angle of the valve sleeve hole type; the three-dimensional model is subjected to micro-hole simulation processing according to the light beam processing trajectory, the focal length and the blowing method to obtain a simulation processing result.

[0038] For the above example, specifically, first, determine the initial processing parameters of the femtosecond laser, including the blowing method and the emission power of the emission module and the focal length of the focusing module. Use the beam scanning module to perform layered processing on the three-dimensional model, and determine the beam processing trajectory of the femtosecond laser in each layer of the model according to the initial processing parameters. Perform micro-hole simulation processing on the three-dimensional model according to the beam processing trajectory to obtain a simulation processing result. According to the comparison between the R angle in the simulation processing result and the R angle in the expected result, adjust the focal length of the focusing module to optimize the processing effect of the inner arc angle and / or outer arc angle of the valve sleeve throttling square hole. Exemplarily, the factors that affect the size of the R angle are mainly the laser power and the focal length of the focusing lens. Generally speaking, the shorter the focal length of the focusing lens, the smaller the focal diameter and the smaller the R angle of the processed hole. Therefore, the use of a 60mm focusing lens with a shorter focal length can effectively reduce the R angle of the hole, such as Fig.11 As shown in the figure, the focal diameter of the left focusing mirror is larger than that of the right focusing mirror. A focusing mirror with a shorter focal length can be used in combination with multi-parameter control to achieve a processing hole R angle of less than 0.02 mm in valve sleeve processing. Micro-hole simulation processing is performed on the three-dimensional model according to the beam processing trajectory, focal length and blowing method to obtain the simulation processing results, and the processing parameters are further optimized based on the results.

[0039] For the above examples, the ultra-short pulse duration and ultra-high peak power of the femtosecond laser induce the nonlinear absorption effect of the material, and obtain a focal spot with a size far smaller than the diffraction limit, thereby greatly improving the spatial resolution of the processing. Since the pulse duration of the femtosecond laser is much shorter than the thermal relaxation time, almost no heat is generated during the processing process, commonly known as "cold" processing, which avoids overheating cracking, oxidation, melting and other phenomena, and significantly improves the processing quality. After focusing, the femtosecond laser pulse can form a focal spot of micrometer scale. The peak energy density in the center area of ​​the spot is extremely high, which can directly destroy the chemical bonds between atoms in the material and achieve material removal. By adjusting the laser incident angle in real time, the hole taper can be accurately controlled to achieve taper-free and negative taper micro-hole processing, significantly improve the installation accuracy, positioning and assembly accuracy of parts, and improve the flow efficiency of microfluids. In summary, this implementation method achieves high-precision and high-efficiency processing of the valve sleeve throttling square hole by accurately controlling the parameters and blowing method of the femtosecond laser, combined with simulation optimization, while reducing material waste and post-processing requirements, and improving product quality and performance.

[0040] In some examples, updating the initial processing parameters to obtain target processing parameters according to the deviation between the simulated processing results and the expected results may include performing square hole simulation processing on the valve sleeve based on the initial processing parameters to obtain a simulated valve sleeve throttling square hole; and updating the initial processing parameters to obtain the target processing parameters according to the deviation between the simulated valve sleeve throttling square hole and the standard valve sleeve throttling square hole.

[0041] In some examples, a square hole simulation processing is performed on a valve sleeve based on initial processing parameters to obtain a simulated valve sleeve throttling square hole, including constructing a multi-parameter control model according to the relationship between the orthogonal correlation experimental results of the initial processing parameters and the simulation processing results; and the square hole processing is performed on the valve sleeve according to the multi-parameter control model to obtain the simulated valve sleeve throttling square hole.

[0042] For the above example, first, the initial processing parameters of the femtosecond laser are set, such as laser power, scanning speed, feeding method, defocus position, blowing method, and focal length of the focusing module. According to the relationship between the orthogonal correlation experimental results of the initial processing parameters and the simulation processing results, a multi-parameter control model is constructed. The multi-parameter control model will consider the influence of multiple parameters such as laser power, repetition frequency, defocus, scanning speed and number of scans on the processing results. The square hole of the valve sleeve is simulated and processed using the constructed multi-parameter control model to obtain a simulated valve sleeve throttling square hole. According to the deviation between the simulation results and the standard, the initial processing parameters, such as the focal length, are adjusted to optimize the processing effect of the valve sleeve square hole, thereby obtaining the target processing parameters. This step requires multiple iterations until the simulation processing results meet the design requirements.

[0043] The coplanarity and position of the square hole of the valve sleeve are controlled by Figure 1The axis motion control system 105 shown in the figure is controlled to complete, specifically, it is determined by the axis precision clamping and positioning mode of the five-axis machine tool in the axis motion control system 105 and the aperture consistency of the processed hole. In some examples, according to the target processing parameters, the valve sleeve is processed by the laser beam provided by the femtosecond laser to obtain the target valve sleeve throttling square hole, which can include obtaining the valve sleeve to be processed and fixing the valve sleeve to be processed on the processing machine tool; using the camera to extract the positioning template to automatically position the valve sleeve to be processed, and obtaining the focal position of the valve sleeve to be processed on the ranging sensor through coordinate conversion; inputting the target processing parameters into the control module of the processing machine tool, and completing the processing of the valve sleeve to be processed according to the focal position using the laser beam provided by the femtosecond laser to obtain the target valve sleeve throttling square hole.

[0044] For the above example, specifically, the repeatability of the linear axis of the five-axis machine tool is less than 0.005mm, and the repeatability of the rotary axis is less than 20 arc seconds. The fixture uses a customized valve sleeve mandrel, and its axial surface is machined with a blind hole to serve as a slag discharge channel and to prevent the wall. The clamping clearance between the positioning surfaces at both ends and the inner wall of the valve sleeve is less than 0.01mm, which is between tight fit. After the valve sleeve to be processed is installed on the mandrel, it is locked with a nut and installed on the five-axis machine tool. The valve sleeve installation position is adjusted using a micrometer to ensure that the runout between the valve sleeve and the C-axis is within two threads. After the clamping is completed, the positioning template is first extracted using a high-precision camera, and the valve sleeve to be processed is automatically positioned; then the focus position is found under the distance sensor through coordinate conversion; finally, the micro-hole processing is completed under the beam scanning device. Since the holes to be processed in each row are axially symmetrical, the processing is performed by rotating 180 degrees.

[0045] Through the above examples, a high-precision camera is used to automatically locate the valve sleeve to be processed, and accurate initial positioning is achieved by extracting the positioning template. The position information of the valve sleeve to be processed is obtained quickly and effectively, providing an accurate reference for subsequent processing. The focus position is found under the distance sensor through coordinate conversion to ensure that the laser beam acts accurately on the predetermined position of the valve sleeve to be processed. This step requires accurate calibration and conversion algorithms, involving the conversion from the camera coordinate system to the processing coordinate system. The use of high-precision cameras and distance sensors in combination with accurate coordinate conversion algorithms can significantly improve the processing accuracy and flexibly respond to the processing requirements of valve sleeves of different shapes and sizes, enhancing the adaptability and flexibility of the processing process. Accurately control the processing trajectory and parameters of the laser beam. Under the beam scanning module, the laser beam provided by the femtosecond laser is used to complete the throttling square hole processing of the valve sleeve to be processed, which can reduce the thermal impact and material deformation during the processing process, improve the processing quality, and reduce the roughness of the hole wall and the heat-affected area during the processing of the valve sleeve throttling square hole. The 180-degree rotation processing method can reduce the processing time and complexity, and can significantly improve the processing efficiency when processing the valve sleeve to be processed with high symmetry requirements.

[0046] Based on the same inventive concept as the above technical solution, see Fig.12 , which shows a laser-based valve sleeve throttling square hole processing device 1200 provided by the present disclosure. The processing device 1200 may include an acquisition part 1201, a simulation part 1202 and a processing part 1203, wherein: An acquisition part 1201 is configured to acquire initial processing parameters related to a femtosecond laser; The simulation part 1202 is configured to perform micro-hole simulation processing on the valve sleeve based on the initial processing parameters, and update the initial processing parameters to obtain target processing parameters according to the deviation between the simulation processing result and the expected result; The processing part 1203 is configured to process a square hole of the valve sleeve using a laser beam provided by a femtosecond laser according to target processing parameters to obtain a target valve sleeve throttling square hole.

[0047] In some examples, the simulation portion 1202 is configured to: Obtain a three-dimensional model of the valve sleeve throttling square hole to be processed, layer the three-dimensional model through a beam scanning module, and determine the beam processing trajectory of the femtosecond laser in each layer of the model according to initial processing parameters; Perform micro-hole simulation processing on the three-dimensional model according to the beam processing trajectory to obtain the simulation processing result; According to the deviation between the simulated processing results and the expected results, the initial processing parameters are updated to obtain the target processing parameters.

[0048] In some examples, the simulation portion 1202 is configured to: Determine the transmission power of the transmission module corresponding to each position in the beam processing trajectory; According to the beam processing trajectory, emission power and blowing method, micro-hole simulation processing is performed on the three-dimensional model to obtain the simulation processing results.

[0049] In some examples, the simulation portion 1202 is configured to: According to the comparison between the R angle in the simulation processing result and the R angle in the expected result, the focal length of the focusing module is adjusted, wherein the R angle is the inner arc angle and / or the outer arc angle of the valve sleeve hole type; According to the beam processing trajectory, focal length and blowing method, micro-hole simulation processing is performed on the three-dimensional model to obtain the simulation processing results.

[0050] In some examples, processing portion 1203 is configured to: Obtaining a valve sleeve to be processed, and fixing the valve sleeve to be processed on a processing machine tool; The positioning template is extracted by using the camera to automatically position the valve sleeve to be processed, and the focal position of the valve sleeve to be processed is obtained on the distance measuring sensor through coordinate conversion; The target processing parameters are input into the control module of the processing machine tool, and the laser beam provided by the femtosecond laser is used to complete the processing of the valve sleeve to be processed according to the focal position to obtain the target valve sleeve throttling square hole.

[0051] In some examples, the simulation portion 1202 is configured to: Performing square hole simulation processing on the valve sleeve based on the initial processing parameters to obtain a simulated valve sleeve throttling square hole; According to the deviation between the simulated valve sleeve throttling square hole and the standard valve sleeve throttling square hole, the initial processing parameters are updated to obtain the target processing parameters.

[0052] In some examples, the simulation portion 1202 is configured to: According to the relationship between the orthogonal correlation experimental results of the initial processing parameters and the simulation processing results, a multi-parameter control model is constructed; According to the multi-parameter control model, the valve sleeve is processed into a square hole to obtain a simulated valve sleeve throttling square hole.

[0053] It can be understood that the exemplary technical solution of the laser-based valve sleeve throttling square hole processing device 1200 and the technical solution of the laser-based valve sleeve throttling square hole processing method belong to the same concept, therefore, the details not described in detail in the technical solution of the laser-based valve sleeve throttling square hole processing device 1200 can be referred to the description of the technical solution of the laser-based valve sleeve throttling square hole processing method. This disclosure does not elaborate on this.

[0054] Please refer to Fig.13 , which shows a schematic diagram of the hardware structure of a computing device provided by an exemplary embodiment of the present disclosure. In some examples, the computing device may be at least one of a smart phone, a smart watch, a desktop computer, a laptop, a virtual reality terminal, an augmented reality terminal, a wireless terminal, and a laptop portable computer. The computing device has a communication function and can access a wired network or a wireless network. The computing device may generally refer to one of a plurality of terminals, and those skilled in the art may know that the number of the above terminals may be more or less. In some examples, the computing device may receive data of a satellite fault diagnosis method based on wavelet convolution based on the wired network or wireless network to which it is connected. It can be understood that the computing device undertakes the calculation and processing work of the technical solution of the present disclosure, and the present disclosure does not limit this.

[0055] like Fig.13 As shown, the computing device in the present disclosure may include one or more of the following components: a processor 1310 and a memory 1320 .

[0056] Optionally, the processor 1310 uses various interfaces and lines to connect various parts within the entire computing device, and executes various functions of the computing device and processes data by running or executing instructions, programs, code sets or instruction sets stored in the memory 1320, and calling data stored in the memory 1320. Optionally, the processor 1310 can be implemented in at least one hardware form of digital signal processing (DSP), field programmable gate array (FPGA), and programmable logic array (PLA). The processor 1310 can integrate one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), a neural network processor (NPU), and a baseband chip. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing the content that needs to be displayed on the touch display; the NPU is used to implement artificial intelligence (AI) functions; and the baseband chip is used to process wireless communications. It is understandable that the above baseband chip may not be integrated into the processor 1310, but may be implemented by a separate chip.

[0057] The memory 1320 may include a random access memory (RAM) or a read-only memory (ROM). Optionally, the memory 1320 includes a non-transitory computer-readable storage medium. The memory 1320 may be used to store instructions, programs, codes, code sets, or instruction sets. The memory 1320 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above various method embodiments, etc.; the data storage area may store data created according to the use of the computing device, etc.

[0058] In addition, those skilled in the art can understand that the structure of the computing device shown in the above drawings does not constitute a limitation on the computing device, and the computing device may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently. For example, the computing device also includes a display screen, a camera assembly, a microphone, a speaker, a radio frequency circuit, an input unit, a sensor (such as an acceleration sensor, an angular velocity sensor, an optical fiber sensor, etc.), an audio circuit, a WiFi module, a power supply, a Bluetooth module and other components, which will not be described in detail here.

[0059] The present disclosure further provides a computer-readable storage medium storing at least one instruction, wherein the at least one instruction is used to be executed by a processor to implement the laser-based valve sleeve throttling square hole machining method according to the above embodiments.

[0060] The present disclosure also provides a computer program product, which includes computer instructions stored in a computer-readable storage medium; a processor of a computing device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computing device executes to implement the laser-based valve sleeve throttling square hole processing method of each of the above-mentioned embodiments.

[0061] Those skilled in the art should be aware that in one or more of the above examples, the functions described in the present disclosure can be implemented with hardware, software, firmware, or any combination thereof. When implemented using software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or codes on a computer-readable medium. Computer-readable media include computer-readable storage media and communication media, wherein the communication media includes any medium that is convenient for transmitting a computer program from one place to another. The readable storage medium can be any available medium that can be accessed by a general or special-purpose computer.

[0062] The above are only specific implementation methods of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be covered by the protection scope of the present disclosure.

Claims

1. A method for processing a valve sleeve throttling square hole based on laser, characterized in that: The processing method comprises: Obtaining initial processing parameters related to the femtosecond laser; Performing micro-hole simulation processing on the valve sleeve based on the initial processing parameters, and updating the initial processing parameters to obtain target processing parameters according to the deviation between the simulation processing result and the expected result; According to the target processing parameters, a laser beam provided by a femtosecond laser is used to process a square hole on the valve sleeve to obtain a target valve sleeve throttling square hole.

2. The processing method according to claim 1, characterized in that: The micro-hole simulation processing of the valve sleeve based on the initial processing parameters, and updating the initial processing parameters to obtain target processing parameters according to the deviation between the simulation processing result and the expected result, comprises: Acquire a three-dimensional model of the valve sleeve throttling square hole to be processed, layer the three-dimensional model through a beam scanning module, and determine the beam processing trajectory of the femtosecond laser in each layer of the model according to the initial processing parameters; Performing micro-hole simulation processing on the three-dimensional model according to the beam processing trajectory to obtain a simulation processing result; According to the deviation between the simulation processing result and the expected result, the initial processing parameters are updated to obtain target processing parameters.

3. The processing method according to claim 2, characterized in that: The femtosecond laser includes an emission module, and the initial processing parameters include an air blowing method and an emission power of the emission module; the micro-hole simulation processing is performed on the three-dimensional model according to the beam processing trajectory to obtain a simulation processing result, including: Determining the transmission power of the transmission module corresponding to each position in the beam processing trajectory; The three-dimensional model is subjected to micro-hole simulation processing according to the light beam processing trajectory, the emission power and the blowing method to obtain a simulation processing result.

4. The processing method according to claim 3, characterized in that: The femtosecond laser includes a focusing module, and the initial processing parameters also include a focal length of the focusing module; The performing micro-hole simulation processing on the three-dimensional model according to the beam processing trajectory to obtain a simulation processing result includes: According to the comparison between the R angle in the simulation processing result and the R angle in the expected result, the focal length of the focusing module is adjusted, wherein the R angle is the inner arc angle and / or the outer arc angle of the valve sleeve hole type; The three-dimensional model is subjected to micro-hole simulation processing according to the beam processing trajectory, the focal length and the blowing method to obtain a simulation processing result.

5. The processing method according to claim 1, characterized in that: According to the target processing parameters, the square hole processing of the valve sleeve is performed using a laser beam provided by a femtosecond laser to obtain a target valve sleeve throttling square hole, including: Obtaining a valve sleeve to be processed, and fixing the valve sleeve to be processed on a processing machine tool; Extracting a positioning template using a camera to automatically position the valve sleeve to be processed, and obtaining a focal position of the valve sleeve to be processed on a distance measuring sensor through coordinate conversion; The target processing parameters are input into the control module of the processing machine tool, and the valve sleeve to be processed is processed using the laser beam provided by the femtosecond laser according to the focal position to obtain the target valve sleeve throttling square hole.

6. The processing method according to claim 2, characterized in that: The processing method also includes: Performing square hole simulation processing on the valve sleeve based on the initial processing parameters to obtain a simulated valve sleeve throttling square hole; According to the deviation between the simulated valve sleeve throttling square hole and the standard valve sleeve throttling square hole, the initial processing parameters are updated to obtain target processing parameters.

7. The processing method according to claim 6, characterized in that: The method of performing square hole simulation processing on the valve sleeve based on the initial processing parameters to obtain a simulated valve sleeve throttling square hole comprises: According to the relationship between the orthogonal correlation experimental results of the initial processing parameters and the simulation processing results, a multi-parameter control model is constructed; According to the multi-parameter control model, a square hole is processed on the valve sleeve to obtain a simulated valve sleeve throttling square hole.

8. A laser-based valve sleeve throttling square hole processing device, characterized in that: The processing device comprises: an acquisition part, a simulation part and a processing part, wherein: The acquisition part is configured to acquire initial processing parameters related to the femtosecond laser; The simulation part is configured to perform micro-hole simulation processing on the valve sleeve based on the initial processing parameters, and update the initial processing parameters to obtain target processing parameters according to the deviation between the simulation processing result and the expected result; The processing part is configured to process a square hole of the valve sleeve using a laser beam provided by a femtosecond laser according to the target processing parameters to obtain a target valve sleeve throttling square hole.

9. A computing device, characterized in that The computing device includes a processor and a memory; the processor is used to execute instructions stored in the memory to implement the laser-based valve sleeve throttling square hole processing method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores at least one instruction, and the at least one instruction is used to be executed by a processor to implement the laser-based valve sleeve throttling square hole processing method according to any one of claims 1 to 7.

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