Scribing machine for wet cutting of wafer

Abstract

The invention discloses a wafer scribing machine for wet cutting of wafers in the technical field of wafer scribing, which comprises a mounting frame, a guide groove is formed in the mounting frame, an alternating mechanism is arranged in the mounting frame, two second racks are fixedly connected to the mounting frame, two workbenches are mounted on the alternating mechanism, a storage groove and a slag discharge groove are formed in the workbenches, and the storage groove and the slag discharge groove are fixedly connected to the mounting frame. A material pushing mechanism is installed in the working table, a material placing disc is installed on the material pushing mechanism and located in the working table, a speed regulating box is installed on the working table and is in transmission connection with the closing mechanism and the material pushing mechanism, a moving mechanism is arranged in the working table, and the moving mechanism is in transmission connection with the speed regulating box. And the moving mechanism is movably meshed with the second rack, the cleaning mechanism is arranged in the workbench, and the scribing assembly is mounted on the mounting frame, so that the cleanliness of the material after scribing is effectively guaranteed, the manual cleaning step is reduced, and the equipment is higher in machining efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of wafer dicing, and in particular to a wafer dicing machine for wet cutting. Background Art

[0002] Wafer refers to the chip used in the production of semiconductor integrated circuits. Due to its round shape, it is called a wafer; various circuit element structures can be processed on the wafer. Wafers are crystals, including polycrystalline and single crystals. In recent years, silicon-based materials have gradually been used in high-speed optical communications. In the wafer processing technology, you first need to obtain single-crystal silicon rods, then cut the silicon rods to obtain wafers, and then cut the edges and corners of the wafers and grind and thin them as a whole to finally get the wafer. Wafer chips are the basic materials for manufacturing semiconductor chips. Various circuit element structures can be processed on wafer chips to become IC products with specific electrical functions. At present, there are two main ways to cut wafer chips. One is cutting with a diamond grinding wheel, and the other is cutting with a laser. The grinding wheel dicing machine is a precision CNC equipment that integrates water-gas electricity, air static pressure high-speed spindle, precision mechanical transmission, sensors and automatic control technologies. During the processing of wafers, in order to separate each chip on the wafer, the wafer is usually cut by a dicing machine. However, traditional dicing machines use liquid to moisten the wafer during the cutting process to prevent the material from breaking and cracking during the cutting process. However, liquid will be produced on the surface of the wafer during the cutting and dicing process, and impurities produced during the cutting process will mix with the liquid, resulting in a rough and unclean surface of the material. After the material is cut, it needs to be manually cleaned and dried, which results in poor cleaning efficiency when the equipment is in use.

[0003] Based on this, the present invention designs a wafer wet cutting saw to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a wafer wet cutting dicing machine to solve the problem in the above background technology that the surface of the material is not clean after dicing and needs to be cleaned and dried manually with low efficiency.

[0005] To achieve the above object, the present invention provides the following technical solutions: A dicing machine for wet cutting of wafers comprises a mounting frame, the mounting frame is provided with a guide groove, the mounting frame is provided with an alternating mechanism, the mounting frame is fixedly connected with two second racks, the alternating mechanism is provided with two workbenches, the workbench is provided with a receiving groove and a slag discharge groove, the receiving groove is located on the upper side of the slag discharge groove, a pushing mechanism is installed in the workbench, a discharge tray is installed on the pushing mechanism, the discharge tray is located in the workbench, two closing mechanisms are installed on one side of the workbench, the two closing mechanisms are transmission connected, a drying fan is installed on the closing mechanism, a speed regulating box is installed on the workbench, the speed regulating box is transmission connected with the closing mechanism and the pushing mechanism respectively, a moving mechanism is provided in the workbench, the moving mechanism is transmission connected with the speed regulating box, the moving mechanism and the second rack are movably meshed, a cleaning mechanism is provided in the workbench, and a dicing assembly is installed on the mounting frame.

[0006] As a further solution of the present invention, the alternating mechanism includes a driving motor, a first gear, a movable frame, a telescopic frame, a first rack and a guide wheel. The mounting frame is equipped with a driving motor, and two first gears are installed at the output end of the driving motor. The mounting frame is slidably connected with the movable frame and the telescopic frame, and the movable frame and the telescopic frame are fixedly connected with the first rack. The first rack is meshingly connected with the first gear. The telescopic frame is equipped with a guide wheel, and the guide wheel is slidably connected in the guide groove.

[0007] As a further solution of the present invention, the pushing mechanism includes a rotating sleeve, a screw rod and a limit rod. The rotating sleeve is rotatably connected inside the workbench, the screw rod is threadedly connected inside the rotating sleeve, and a limit rod is provided between the screw rod and the workbench.

[0008] As a further solution of the present invention, the closing mechanism includes an outer shell, a gear ring, a closing plate, a pull rod, a rotating column and a second gear. The workbench is installed with an outer shell, a gear ring is rotatably connected in the outer shell, a plurality of closing plates are rotatably connected in the outer shell, a pull rod is provided between the closing plate and the gear ring, a rotating column is rotatably connected in the outer shell, a second gear is installed on the rotating column, and the second gear is meshingly connected to the gear ring.

[0009] As a further solution of the present invention, the moving mechanism is located in the storage groove, and the moving mechanism includes a threaded rod, a slider, water-absorbing sponge, a first torsion spring, a second torsion spring and a third gear. Two threaded rods are rotatably connected in the workbench, and the two threaded rods are transmission connected. A slider is threadedly connected between the two threaded rods. The slider is slidably connected in the storage groove, and the water-absorbing sponge is rotatably connected between the two sliders. The water-absorbing sponge and the discharge tray are movably connected. First torsion springs are provided on both sides of the water-absorbing sponge, one of the threaded rods is provided with a second torsion spring, and one of the threaded rods is installed with a third gear, and the third gear is a one-way wheel.

[0010] As a further solution of the present invention, an extrusion assembly is installed inside the storage groove, and the extrusion assembly includes two arc-shaped plates, and the water-absorbing sponge is movably connected between the two arc-shaped plates.

[0011] As a further solution of the present invention, the cleaning mechanism includes a pump, an infusion tube and a nozzle. The pump is installed on the workbench, one end of the pump is connected to the infusion tube, and a plurality of nozzles are connected to the infusion tube. The nozzles are located inside the workbench, and the plurality of nozzles are arranged in a ring.

[0012] As a further solution of the present invention, a drainage pipe is connected through the lower side of the workbench, and one end of the drainage pipe is connected to a collection box.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention places the material to be sliced ​​on two workbenches, at which time the material is fixed on the material discharge tray, and then controls the alternating mechanism to work. Since the third gear in the moving mechanism is a one-way wheel, when the workbench moves to the side of the slicing component, the third gear does not rotate. When the slicing component completes the slicing of the material, the alternating mechanism controls the two workbenches to move alternately, so that when the equipment is working, the slicing efficiency of the material can be accelerated, so that one piece of material can be processed, and another piece of material can be taken out and put in again, and this is repeated to ensure the working efficiency of the equipment.

[0014] 2. When the workbench is away from the dicing assembly, the second rack controls the moving mechanism to move, and at the same time the cleaning mechanism sprays liquid to rinse the surface of the material, thereby ensuring the cleanliness of the material surface. At the same time, the pushing mechanism pushes the material up through the discharge tray, so that the discharge tray is away from the bottom surface of the inner wall of the workbench, and the material is moved to one side of the slag discharge trough. At this time, the absorbent sponge in the moving mechanism moves to absorb the liquid on the surface of the material, and at the same time cleans the residue on the surface into the slag discharge trough, thereby ensuring the cleanliness of the material surface and avoiding a large amount of liquid on the surface of the material.

[0015] 3. When the moving mechanism moves, the moving mechanism controls the closing mechanism to open through the speed regulating box. At this time, the airflow generated by the drying fan acts on the surface of the material, so that the material can be dried quickly. When the moving mechanism and the second rack are disengaged, the moving mechanism is reset. At this time, the extrusion component squeezes out the liquid in the absorbent sponge, so that the absorbent sponge can be used multiple times to ensure the use effect of the equipment. At the same time, when the closing mechanism and the pushing mechanism are reset again, people can take out the material and put the unprocessed material in again, and repeat this process, which can effectively ensure the working efficiency of the equipment and make the equipment more convenient at work, reduce manual cleaning, avoid unclean materials, thereby affecting the use of the equipment, and further improve the practicability and convenience of use of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the structure of the present invention from a front side perspective; Figure 2 This is a schematic diagram of the rear side viewing angle structure of the present invention; Figure 3 It is a schematic diagram of the structure of the present invention from the left side viewing angle; Figure 4 It is a schematic diagram of the structure of the present invention from a local upper side perspective; Figure 5 It is a schematic diagram of the structure of the present invention from a local bottom side perspective; Figure 6 It is a schematic diagram of the cross-sectional structure of the present invention from a local right side perspective; Figure 7 It is a schematic diagram of the internal structure of the closing mechanism of the present invention.

[0018] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Mounting frame; 2. Guide groove; 3. Alternating mechanism; 4. Driving motor; 5. First gear; 6. Moving frame; 7. Telescopic frame; 8. First rack; 9. Guide wheel; 10. Second rack; 11. Workbench; 12. Storage groove; 13. Slag discharge groove; 14. Pushing mechanism; 15. Rotating sleeve; 16. Screw rod; 17. Limit rod; 18. Discharging tray; 19. Closing mechanism; 20. Housing; 21. Gear ring; 22. Closing mechanism Clamp; 23. Pull rod; 24. Rotating column; 25. Second gear; 26. Drying fan; 27. Speed ​​regulating box; 28. Moving mechanism; 29. ​​Threaded rod; 30. Sliding block; 31. Water-absorbing sponge; 32. First torsion spring; 33. Second torsion spring; 34. Third gear; 35. Cleaning mechanism; 36. Pump; 37. Infusion tube; 38. Nozzle; 39. Drain pipe; 40. Collecting box; 41. Slicing assembly; 42. Extrusion assembly. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] See also Figure 1-Figure 7 , the present invention provides a technical solution: A wafer wet cutting dicing machine comprises a mounting frame 1, a guide groove 2 is provided on the mounting frame 1, an alternating mechanism 3 is provided in the mounting frame 1, two second racks 10 are fixedly connected to the mounting frame 1, two workbenches 11 are installed on the alternating mechanism 3, a receiving groove 12 and a slag discharge groove 13 are provided in the workbenches 11, the receiving groove 12 is located on the upper side of the slag discharge groove 13, a pushing mechanism 14 is installed in the workbenches 11, a material discharge tray 18 is installed on the pushing mechanism 14, the material discharge tray 18 is located in the workbenches 11, and the workbenches 11 are provided with a plurality of guide grooves 2 and an alternating mechanism 3. Two closing mechanisms 19 are installed on one side of the table 11, and the two closing mechanisms 19 are transmission-connected. A drying fan 26 is installed on the closing mechanism 19. A speed regulating box 27 is installed on the workbench 11, and the speed regulating box 27 is transmission-connected with the closing mechanism 19 and the pushing mechanism 14 respectively. A moving mechanism 28 is provided in the workbench 11, and the moving mechanism 28 is transmission-connected with the speed regulating box 27. The moving mechanism 28 is movably meshed with the second rack 10. A cleaning mechanism 35 is provided in the workbench 11, and a dicing assembly 41 is installed on the mounting frame 1; During operation, the material to be sliced ​​is placed on the two workbenches 11. At this time, the material is fixed on the discharge tray 18, and then the alternating mechanism 3 is controlled to work. Since the third gear 34 in the moving mechanism 28 is a one-way wheel, when the workbench 11 moves to the side of the slicing component 41, the third gear 34 does not rotate. When the slicing component 41 completes the slicing of the material, the alternating mechanism 3 controls the two workbenches 11 to move alternately, so that when the equipment is working, the slicing efficiency of the material can be accelerated, so that the material can be processed for one piece of material, and the other piece of material can be taken out and put in again, and this is repeated to ensure the working efficiency of the equipment. When the workbench 11 is away from the slicing component 41, the second rack 10 controls the moving mechanism 28 to move, and at the same time the cleaning mechanism 35 sprays liquid to rinse the surface of the material, thereby ensuring the cleanliness of the surface of the material. At the same time, the pushing mechanism 14 pushes the material up through the discharge tray 18, so that the discharge tray 18 is away from the bottom surface of the inner wall of the workbench 11, and at the same time the material is moved to one side of the slag discharge trough 13. At this time, the water-absorbing sponge 31 in the moving mechanism 28 The moving mechanism 28 moves so that the absorbent cotton 31 absorbs liquid from the surface of the material and cleans the residue on the surface into the slag discharge groove 13, thereby ensuring the cleanliness of the surface of the material and avoiding a large amount of liquid on the surface of the material. When the moving mechanism 28 moves, the moving mechanism 28 controls the closing mechanism 19 to open through the speed regulating box 27. At this time, the airflow generated by the drying fan 26 acts on the surface of the material, so that the material can be dried quickly. When the moving mechanism 28 and the second rack 10 are disengaged, the moving mechanism 28 is reset. At this time, the extrusion component 42 squeezes out the liquid in the absorbent cotton 31, so that the absorbent cotton 31 can be used multiple times to ensure the use effect of the equipment. At the same time, when the closing mechanism 19 and the pushing mechanism 14 are reset again, people can take out the material and put the unprocessed material in again, and repeat this process, which can effectively ensure the working efficiency of the equipment and make the equipment more convenient at work, reduce manual cleaning, avoid unclean materials, thereby affecting the use of the equipment, and further improve the practicability and convenience of use of the equipment.

[0021] As a further solution of the present invention, the alternating mechanism 3 includes a driving motor 4, a first gear 5, a mobile frame 6, a telescopic frame 7, a first rack 8 and a guide wheel 9. The mounting frame 1 is installed with a driving motor 4, and two first gears 5 are installed at the output end of the driving motor 4. The mounting frame 1 is slidably connected with the mobile frame 6 and the telescopic frame 7. The mobile frame 6 and the telescopic frame 7 are fixedly connected with the first rack 8. The first rack 8 and the first gear 5 are meshed and connected. The telescopic frame 7 is installed with a guide wheel 9, and the guide wheel 9 is slidably connected in the guide groove 2; During operation, when the driving motor 4 works, the first gear 5 starts to rotate. When the first gear 5 rotates, the first gear 5 controls the first rack 8 to move. When the first rack 8 moves, the movable frame 6 and the telescopic frame 7 move at the same time. When the telescopic frame 7 moves, the guide wheel 9 on the telescopic frame 7 moves in the guide groove 2, and the telescopic frame 7 shortens following the shape of the guide groove 2, so that the two workbenches 11 can be alternated and re-located on the same horizontal plane, thereby facilitating the unloading and feeding of materials, making the equipment more efficient at work, and further improving the working efficiency of the equipment.

[0022] As a further solution of the present invention, the push mechanism 14 includes a rotating sleeve 15, a screw rod 16 and a limit rod 17. The rotating sleeve 15 is rotatably connected to the workbench 11, the screw rod 16 is threadedly connected to the rotating sleeve 15, and a limit rod 17 is provided between the screw rod 16 and the workbench 11; During operation, when the alternating mechanism 3 moves, the moving mechanism 28 and the second rack 10 engage, and at this time the speed regulating box 27 works under the drive of the moving mechanism 28, so that the rotating sleeve 15 rotates, and when the rotating sleeve 15 rotates, the limiting rod 17 limits the screw rod 16, so that the screw rod 16 moves, and when the screw rod 16 moves, the screw rod 16 pushes the discharge tray 18 upward, so that a gap is formed between the discharge tray 18 and the ground of the workbench 11, and at the same time, the discharge tray 18 can be moved to one side of the slag discharge trough 13, thereby ensuring the slag discharge of the equipment, and at the same time accelerating the drainage of the equipment, ensuring the cleanliness of the material.

[0023] As a further solution of the present invention, the closing mechanism 19 includes a housing 20, a gear ring 21, a closing plate 22, a pull rod 23, a rotating column 24 and a second gear 25. The housing 20 is installed on the workbench 11. The gear ring 21 is rotatably connected in the housing 20. A plurality of closing plates 22 are rotatably connected in the housing 20. A pull rod 23 is provided between the closing plate 22 and the gear ring 21. A rotating column 24 is rotatably connected in the housing 20. The second gear 25 is installed on the rotating column 24. The second gear 25 is meshed and connected with the gear ring 21. When working, the initial state of the equipment is a closed state, and the multiple closing plates 22 are mutually protected, thereby effectively preventing liquid from entering the drying fan 26, ensuring the sealing of the drying fan 26, and when the speed regulating box 27 is working, the speed regulating box 27 controls the rotation of the rotating column 24, and then the second gear 25 drives the gear ring 21 to rotate. At this time, the gear ring 21 controls the multiple closing plates 22 to move away from each other through the pull rod 23, and then the closing mechanism 19 is in an open state. At this time, the airflow of the drying fan 26 can act on the surface of the material through the gap, thereby making the surface of the equipment dry faster, further improving the cleaning efficiency of the equipment.

[0024] As a further solution of the present invention, the moving mechanism 28 is located in the storage groove 12, and the moving mechanism 28 includes a threaded rod 29, a slider 30, a water-absorbing sponge 31, a first torsion spring 32, a second torsion spring 33 and a third gear 34. Two threaded rods 29 are rotatably connected in the workbench 11, and the two threaded rods 29 are transmission-connected. A slider 30 is threadedly connected between the two threaded rods 29. The slider 30 is slidably connected in the storage groove 12, and the water-absorbing sponge 31 is rotatably connected between the two sliders 30. The water-absorbing sponge 31 and the discharge tray 18 are movably connected. First torsion springs 32 are provided on both sides of the water-absorbing sponge 31, and a second torsion spring 33 is sleeved on one of the threaded rods 29. A third gear 34 is installed on one of the threaded rods 29, and the third gear 34 is a one-way wheel; During operation, when the workbench 11 is away from the slicing assembly 41, the second rack 10 drives the third gear 34 to rotate, and at this time the third gear 34 drives the threaded rod 29 to rotate. When the threaded rod 29 rotates, the slider 30 moves at the same time, and the absorbent sponge 31 installed on the slider 30 moves. When the absorbent sponge 31 moves, since the first torsion spring 32 is provided on both sides of the absorbent sponge 31, the torsion of the first torsion spring 32 keeps the absorbent sponge 31 in contact with the upper side of the material, thereby absorbing the liquid on the surface of the material and sweeping the residue on the material into the residue discharge groove 13. When the second rack 10 and the third gear 34 are disengaged, the second torsion spring 33 controls the threaded rod 29 to rotate in the opposite direction. At this time, the absorbent sponge 31 is flushed and moved into the storage groove 12, and then the liquid on the surface of the material can be absorbed, avoiding excessive liquid on the surface of the material, thereby affecting the subsequent use of the material. At the same time, the absorbent sponge 31 can replace manpower to absorb liquid on the material, ensuring the cleanliness and dryness of the material.

[0025] As a further solution of the present invention, a squeezing assembly 42 is installed inside the storage tank 12, and the squeezing assembly 42 includes two arc-shaped plates, and the absorbent cotton 31 is movably connected between the two arc-shaped plates; During operation, when the absorbent sponge 31 is reset, it moves between the two arc-shaped plates. At this time, the extrusion force of the arc-shaped plates cooperates with the movement of the threaded rod 29 to squeeze out the liquid in the absorbent sponge 31 and discharge it from the drain pipe 39, thereby ensuring the drying of the absorbent sponge 31 and allowing the absorbent sponge 31 to be repeatedly used, further improving the practicality and ease of use of the equipment.

[0026] As a further solution of the present invention, the cleaning mechanism 35 includes a pump 36, a liquid infusion tube 37 and a nozzle 38. The pump 36 is installed on the workbench 11, one end of the pump 36 is connected to the liquid infusion tube 37, and the liquid infusion tube 37 is connected to a plurality of nozzles 38. The nozzles 38 are located inside the workbench 11, and the plurality of nozzles 38 are arranged in a ring. During operation, when the workbench 11 is away from the dicing assembly 41, the pump 36 sucks out the liquid and transports it to the nozzle 38 through the infusion tube 37. At this time, the nozzle 38 rinses the surface of the material, causing the impurities to gradually move to the edge of the material. Finally, the moving mechanism 28 can discharge the material, thereby effectively ensuring the cleanliness of the material and reducing manual cleaning and drying.

[0027] As a further solution of the present invention, a drain pipe 39 is connected through the lower side of the workbench 11, and one end of the drain pipe 39 is connected to a collection box 40; During operation, when the liquid enters the slag discharge groove 13, the impurities and liquid enter the discharge pipe 39 through the slag discharge groove 13, and finally enter the collection box 40, thereby completing the collection of the liquid and impurities, preventing the overflow of impurities, and facilitating the collection of impurities.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer wet dicing machine, comprising a mounting frame (1), characterized in that: The mounting frame (1) is provided with a guide groove (2), an alternating mechanism (3) is provided in the mounting frame (1), two second racks (10) are fixedly connected to the mounting frame (1), two workbenches (11) are installed on the alternating mechanism (3), a receiving groove (12) and a slag discharge groove (13) are provided in the workbenches (11), the receiving groove (12) is located on the upper side of the slag discharge groove (13), a pushing mechanism (14) is installed in the workbenches (11), a discharge tray (18) is installed on the pushing mechanism (14), the discharge tray (18) is located in the workbenches (11), and a Two closing mechanisms (19), the two closing mechanisms (19) are transmission-connected, a drying fan (26) is installed on the closing mechanism (19), a speed regulating box (27) is installed on the workbench (11), the speed regulating box (27) is transmission-connected to the closing mechanism (19) and the pushing mechanism (14) respectively, a moving mechanism (28) is provided in the workbench (11), the moving mechanism (28) and the speed regulating box (27) are transmission-connected, the moving mechanism (28) and the second rack (10) are movably meshed, a cleaning mechanism (35) is provided in the workbench (11), and a slicing assembly (41) is installed on the mounting frame (1).

2. A wafer wet cutting dicing machine according to claim 1, characterized in that: The alternating mechanism (3) comprises a driving motor (4), a first gear (5), a movable frame (6), a telescopic frame (7), a first rack (8) and a guide wheel (9); the mounting frame (1) is mounted with a driving motor (4); two first gears (5) are mounted on the output end of the driving motor (4); the movable frame (6) and the telescopic frame (7) are slidably connected to the mounting frame (1); the movable frame (6) and the telescopic frame (7) are both fixedly connected with a first rack (8); the first rack (8) and the first gear (5) are meshingly connected; the telescopic frame (7) is mounted with a guide wheel (9); the guide wheel (9) is slidably connected in the guide groove (2).

3. The wafer wet cutting dicing machine according to claim 1, characterized in that: The push mechanism (14) comprises a rotating sleeve (15), a screw rod (16) and a limit rod (17); the rotating sleeve (15) is rotatably connected inside the workbench (11); the screw rod (16) is internally threadedly connected to the rotating sleeve (15); and a limit rod (17) is provided between the screw rod (16) and the workbench (11).

4. The wafer wet cutting dicing machine according to claim 1, characterized in that: The closing mechanism (19) comprises a housing (20), a gear ring (21), a closing plate (22), a pull rod (23), a rotating column (24) and a second gear (25); the housing (20) is mounted on the workbench (11); the gear ring (21) is rotatably connected inside the housing (20); a plurality of closing plates (22) are rotatably connected inside the housing (20); a pull rod (23) is provided between the closing plates (22) and the gear ring (21); a rotating column (24) is rotatably connected inside the housing (20); a second gear (25) is mounted on the rotating column (24); the second gear (25) and the gear ring (21) are meshingly connected.

5. The wafer wet cutting dicing machine according to claim 1, characterized in that: The moving mechanism (28) is located in the storage groove (12). The moving mechanism (28) comprises a threaded rod (29), a slider (30), a water-absorbing sponge (31), a first torsion spring (32), a second torsion spring (33) and a third gear (34). Two threaded rods (29) are rotatably connected in the workbench (11). The two threaded rods (29) are transmission-connected. A slider (30) is threadedly connected between the two threaded rods (29). The slider (30) is slidably connected in the storage groove (12). A water-absorbing sponge (31) is rotatably connected between the two sliders (30). The water-absorbing sponge (31) and the discharge tray (18) are movably connected. First torsion springs (32) are provided on both sides of the water-absorbing sponge (31). A second torsion spring (33) is sleeved on one of the threaded rods (29). A third gear (34) is mounted on one of the threaded rods (29). The third gear (34) is a one-way wheel.

6. The wafer wet cutting dicing machine according to claim 5, characterized in that: An extrusion assembly (42) is installed inside the storage groove (12), the extrusion assembly (42) comprising two arc-shaped plates, and the water-absorbing sponge (31) is movably connected between the two arc-shaped plates.

7. The wafer wet cutting dicing machine according to claim 1, characterized in that: The cleaning mechanism (35) comprises a pump (36), an infusion tube (37) and a nozzle (38); the pump (36) is mounted on the workbench (11); one end of the pump (36) is connected to the infusion tube (37); a plurality of nozzles (38) are connected to the infusion tube (37); the nozzles (38) are located inside the workbench (11); and the plurality of nozzles (38) are arranged in a ring shape.

8. The wafer wet cutting dicing machine according to claim 1, characterized in that: A drainage pipe (39) is connected through the lower side of the workbench (11), and one end of the drainage pipe (39) is connected to a collection box (40).

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