Method for enhancing binding force of metal-polymer composite membrane material in coating process

Abstract

The invention relates to a method for enhancing binding force of a metal-polymer composite film material in a film coating process. The method comprises the following steps: S1, carrying out punching pretreatment on the to-be-coated surface of a polymer substrate layer / each metal coating layer; and S2, the temperature of circulating water in the coating roller is regulated and controlled, so that the to-be-coated temperature of the metal coating is gradually increased along with the increase of the evaporation frequency. According to the invention, the binding force between the first surface of the polymer substrate layer and the adjacent metal coating layer and the binding force between the interfaces of the adjacent metal coating layers can be respectively improved from two directions. Specifically, before evaporation of each evaporation source, the to-be-coated surface of the polymer substrate layer / each metal coating is subjected to punching pretreatment, the circulating water temperature of a coating roller is adjusted, and the bonding performance between the adjacent metal coatings is improved. The diffusion and migration of the evaporated metal particles in the metal coating of the composite membrane material and in the composite membrane material are facilitated, and the interface bonding performance of the composite membrane material is improved.

Description

Technical Field

[0001] The invention relates to the technical field of film coating, and in particular to a method for enhancing the bonding force of a metal-polymer composite film material during the film coating process. Background Art

[0002] Composite copper foil is based on polymer materials, with a certain thickness (such as 500-3000nm) of metal copper deposited on the surface of the polymer material. It has the dual advantages of polymer materials and metal materials, so it has the potential to replace traditional copper foil current collectors and can effectively improve the energy density and safety of lithium-ion batteries.

[0003] Composite copper foil is usually prepared by physical vapor deposition combined with water electroplating. However, because the two preparation methods are completely different, the vacuum environment of the composite copper foil will be destroyed during the process. It will be transferred through the atmosphere, which will have a harmful effect on the performance of the composite copper foil. In addition, water electroplating has problems such as environmental pollution. For this reason, composite copper foil is currently directly prepared by only using physical vapor deposition, that is, directly using a vacuum winding evaporation coating method, by setting up multiple groups of evaporation sources in a vacuum chamber for continuous deposition to directly deposit a certain thickness of metal copper layer on the surface of the polymer substrate, thereby meeting the requirements of lithium-ion battery current collectors.

[0004] However, the existing physical vapor deposition method can prepare composite copper foil that meets the requirements of the current collector, eliminate the water electroplating link, and reduce environmental pollution. However, this method also has certain disadvantages. Due to the use of multiple continuous evaporation coating methods, and the base layer is a polymer substrate layer made of polymer material in contact with the coating roller, that is, the evaporation coating is deposited on the polymer substrate layer through the evaporation source to form a metal coating. In each evaporation coating process, the metal coating is always deposited on the surface of the previous metal coating. At the same time, due to the cooling effect of the circulating water in the coating roller and the heat effect of the evaporation particles and the evaporation source, the metal coating formed by the evaporation deposition at different stages will have obvious stratification, which in turn affects the interface bonding performance of the composite copper foil, and ultimately affects the application of the composite copper foil in lithium-ion batteries. Summary of the invention

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a method for enhancing the bonding strength of a metal-polymer composite film during the coating process.

[0006] In order to achieve the above object, the main technical solutions adopted by the present invention include:

[0007] The present invention provides a method for enhancing the bonding strength of a metal-polymer composite film material during a coating process, and the method is based on:

[0008] A flexible polymer substrate layer is provided, wherein the polymer substrate layer has a first surface and a second surface that are arranged opposite to each other, and the first surface is close to a first evaporation source; when the polymer substrate layer passes through the first evaporation source, a first metal coating layer is deposited on the first surface under the evaporation action of the first evaporation source, and the first metal coating layer has a surface to be coated that is close to the second evaporation source, and the first metal coating layer can be sequentially passed through the next evaporation source for multiple evaporation depositions to form a composite film material;

[0009] S1, performing a pretreatment of punching on the first surface of the polymer substrate layer / the surface to be plated of each metal coating layer;

[0010] S2. Regulate the temperature of the circulating water in the coating roller so that the temperature of the composite film material gradually increases with the increase in the number of evaporation times. When the temperature of the circulating water in the coating roller gradually rises to room temperature, the temperature of the circulating water in the coating roller remains unchanged.

[0011] According to a preferred embodiment of the present invention, in S1, the punching preprocessing comprises the following steps:

[0012] S11, installing a punching device before each evaporation source, so that during the coating process, the first surface of the polymer substrate layer / the surface to be coated of each metal coating layer is punched by the punching device on the first surface of the polymer substrate layer / the surface to be coated of each metal coating layer;

[0013] S12. During the punching process of S11, a plurality of holes arranged in an array can be formed on the first surface of the polymer substrate layer / the surface to be plated of each metal-plated layer.

[0014] According to a preferred embodiment of the present invention, in the process of S12, the hole can be arranged at an angle with the plane where the metal plating layer is located, and the angle ranges from 10° to 90°.

[0015] According to a preferred embodiment of the present invention, the diameter of the holes ranges from 10 nm to 200 nm.

[0016] According to a preferred embodiment of the present invention, the distance between adjacent holes ranges from 100 nm to 1000 nm.

[0017] According to a preferred embodiment of the present invention, the height of the holes ranges from 1 nm to 300 nm.

[0018] According to a preferred embodiment of the present invention, the hole height of each metal coating layer on the surface of the coating to be coated gradually changes with the increase of the number of evaporation sources and the number of deposition times;

[0019] Assume the height of the hole is h n(unit: nm), the total number of evaporation sources is M 蒸镀源总数 , the total thickness of the coating to be plated is H 镀层总厚度 (unit: nm);

[0020] The formula for the change of the hole height with the number of evaporation deposition times is:

[0021]

[0022] Among them, δ is a coefficient related to the properties of the evaporation material, n is the nth evaporation source, and h n The hole height indicates that the polymer substrate layer / each metal coating layer needs to be pre-treated before the nth evaporation.

[0023] According to a preferred embodiment of the present invention, the total thickness of the coating to be plated is H 镀层总厚度 , the H 镀层总厚度 The range is 500nm-3000nm.

[0024] According to a preferred embodiment of the present invention, in the subsequent deposition process of S2, the temperature adjustment formula of the circulating water in the coating roller is as follows:

[0025]

[0026] In this formula, n is the nth evaporation process, which can also be expressed as the nth evaporation source, T n-1 It is expressed as the temperature of the circulating water of the coating roller during the n-1th evaporation, T n represents the temperature of the circulating water of the coating roller during the nth evaporation, M 蒸镀源总数 Indicates the total number of evaporation sources contained, H 镀层总厚度 is the total thickness of the coating to be prepared (in nm), and α is a coefficient related to the total coating thickness and material properties.

[0027] According to a preferred embodiment of the present invention, the composite film material is any one of composite copper foil, composite aluminum foil or composite nickel foil.

[0028] Compared with the prior art, the bonding force between the first surface of the polymer substrate layer and the adjacent metal coating layer and the interface between the adjacent metal coating layers can be improved from two directions.

[0029] The technical effects of the present invention mainly include:

[0030] (1) The present invention performs a pre-treatment of punching holes on the surface of the polymer substrate layer / each metal coating layer to be coated before evaporation from each evaporation source, thereby improving the bonding performance between adjacent metal coating layers.

[0031] (2) By further regulating the temperature of the circulating water of the coating roller, on the one hand, the temperature of the metal coating of the composite film material can be increased, which is beneficial to the diffusion and migration of the evaporated metal particles in the metal coating of the composite film material and within it, thereby improving the interface bonding performance of the composite film material and on the other hand, helping to reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 The present invention is a process flow chart for enhancing the bonding strength of the metal-polymer composite film material during the coating process. DETAILED DESCRIPTION

[0033] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below in conjunction with specific implementation methods.

[0034] Example 1

[0035] This embodiment provides a method for enhancing the bonding strength of a metal-polymer composite film during a coating process, and the method is based on:

[0036] A flexible polymer substrate layer is provided, wherein the polymer substrate layer has a first surface and a second surface that are arranged opposite to each other, and the first surface is close to a first evaporation source; when the polymer substrate layer passes through the first evaporation source, a first metal coating layer is deposited on the first surface under the evaporation action of the first evaporation source, and the first metal coating layer has a surface to be coated that is close to the second evaporation source, and the first metal coating layer can be sequentially passed through the next evaporation source for multiple evaporation depositions to deposit multiple layers of metal coating layers, and the multiple layers of metal coating layers and the polymer substrate layer together form a composite film material.

[0037] Here, in this embodiment, it is applicable to the case of preparing composite copper foils of different thicknesses by continuous evaporation from multiple evaporation sources, but it can also be expanded to be applicable to the preparation process of metal-polymer composite film materials such as composite aluminum foils, composite nickel foils, etc. of different thicknesses.

[0038] The method comprises the following steps:

[0039] S1. Performing a pretreatment of punching on the first surface of the polymer substrate layer / the surface to be plated of each metal coating layer.

[0040] S2. Regulate the temperature of the circulating water in the coating roller so that the temperature of the composite film material gradually increases with the increase in the number of evaporation times. When the temperature of the circulating water in the coating roller gradually rises to room temperature, the temperature of the circulating water in the coating roller remains unchanged.

[0041] Further, in S1, the punching preprocessing includes the following steps:

[0042] S11, installing a punching device before each evaporation source, so that during the coating process, the first surface of the polymer substrate layer / the surface to be coated of each metal coating layer is punched by the punching device before coating. Specifically, the punching device is a plasma etching device in this embodiment.

[0043] S12. During the punching process of S11, a plurality of holes arranged in an array can be formed on the surface of the to-be-plated film of the polymer substrate layer / each layer of the metal plating layer.

[0044] Specifically, in this embodiment, a plasma etching device is installed before each evaporation source, so that during the coating process, the first surface of the polymer substrate layer / the surface of the metal coating of each layer to be coated can be pre-treated by an ion etching method before the current coating. The purpose of this is to prepare holes with a certain angle, a certain depth, and a certain array structure on the first surface of the polymer substrate layer / the surface of the metal coating of each layer to be coated, thereby improving the interfacial bonding strength of the composite copper foil, wherein the distance and diameter between the holes are only related to the properties of the evaporation material.

[0045] Specifically, in the process of S12, the hole can be arranged at an angle with the plane where the metal plating layer is located, and the angle range is 60°. The diameter range of the hole is 150nm. The distance range between adjacent holes is 500nm.

[0046] Furthermore, the height of the holes ranges from 1 nm to 300 nm.

[0047] Furthermore, the hole height of each layer of the metal coating will gradually change as the number of evaporation sources and the number of deposition times increase;

[0048] Assume the height of the hole is h n (unit: nm), the total number of evaporation sources is M 蒸镀源总数 , the total thickness of the coating to be plated is H 镀层总厚度 (unit: nm); further, the total thickness of the coating to be plated is H 镀层总厚度 , the H 镀层总厚度 The range of H is 500nm-3000nm. In this embodiment, the thickness of the copper metal layer evaporated is 1300nm, that is, H 镀层总厚度 The preferred parameter δ in formula (1) is 0.0981. In formula (2), i.e., the temperature control formula of the coating roller circulating water, the temperature of the coating roller circulating water during the first evaporation is preferably -28°C, i.e., T1 = -28°C. The preferred parameter α is 0.1125.

[0049] The formula (1) for the height of the hole changing with the number of evaporation depositions is:

[0050]

[0051] Among them, δ is a coefficient related to the properties of the evaporation material, n is the nth evaporation source, and h n The hole height indicates that the polymer substrate layer / each metal coating layer needs to be pre-treated before the nth evaporation.

[0052] Furthermore, in the subsequent deposition process of S2, the temperature regulation formula (2) of the circulating water in the coating roller is as follows:

[0053]

[0054] In this formula, n is the nth evaporation process, which can also be expressed as the nth evaporation source, T n-1 It is expressed as the temperature of the circulating water of the coating roller during the n-1th evaporation, T n represents the temperature of the circulating water of the coating roller during the nth evaporation, M 蒸镀源总数 Indicates the total number of evaporation sources contained, H 镀层总厚度 is the total thickness of the coating to be prepared (in nm), and α is a coefficient related to the total thickness of the coating, material properties, etc.

[0055] It should be noted that during the evaporation coating process, the composite film material (i.e., composite copper foil) formed by the polymer substrate layer and the multi-layer metal coating layer will be subjected to thermal radiation from the evaporation source, deposition heat from the evaporated particles, and other thermal effects. Therefore, to ensure that the performance of the composite film material is not affected, the heat balance on both sides of the composite film material must be achieved. Therefore, currently, the back of the composite film material formed by the polymer substrate layer and the multi-layer metal coating layer is cooled by circulating water in the coating roller to make the heat balance on both sides of the composite film material. Usually, the temperature of the existing coating roller circulating water is between -5°C and -45°C, which is a fixed value, that is, the coating rollers at all evaporation sources are at the same temperature and remain unchanged during the coating process. However, this method has disadvantages. For example, when the cooling capacity of the composite film is higher than the heat effect, it becomes difficult for the deposited particles to diffuse on the first surface of the polymer substrate layer / the surface to be coated of the metal coating of each layer and the inside of both, which results in an increase in defects in the copper layer, affecting the performance of the composite copper foil; and when the cooling capacity of the composite film is lower than the heat effect, the first surface of the polymer substrate layer / the surface to be coated of the metal coating of the composite copper foil (including the formed hole part) will have wrinkles, holes and other defects, affecting the product performance. In addition, the circulating water in the coating roller is always kept at a low temperature, which will also increase the production cost of the product. In the subsequent deposition process, since the metal coating has been deposited on the polymer, the probability of the composite film being deformed by heat will be significantly reduced. Therefore, the temperature of the circulating water of the coating roller can be appropriately increased, which can not only reduce the production cost, but also help to ensure that the composite film (composite copper foil) before deposition maintains a higher temperature, thereby improving the migration and diffusion of metal particles in the subsequent deposition process, and further enhancing the interface bonding performance of the composite copper foil.

[0056] In this embodiment, there are two evaporation sources. The process parameters are adjusted, and the method of this embodiment is used. The film material is pre-treated before the first evaporation and the second evaporation, and the prepared hole depths are 33.66nm and 67.53nm. The temperatures of the circulating water of the coating roller during the first evaporation and the second evaporation are -28°C and -19.30°C, respectively. The interface bonding strength between the prepared composite copper foil metal coating (metal coating thickness is 1300nm) and the polymer base film is 165MPa, the longitudinal yield strength of the composite copper foil is 230MPa, and the elongation at break is 62%.

[0057] Comparative Example 1

[0058] This example provides a common existing method for the coating process of a metal-polymer composite film material, wherein for a device for preparing a composite copper foil with two evaporation sources, the coating parameters before adjustment are that the temperature of the circulating water of the coating roller is fixed at -28°C, and the interface bonding strength between the prepared composite copper foil metal coating (metal coating thickness is 1300nm) and the polymer base film is 146MPa, the longitudinal yield strength of the composite copper foil is 192MPa, and the elongation at break is 51%.

[0059] Comparative Example 2

[0060] When only the process parameters of the punching equipment are adjusted, the surface of the film to be plated is pre-treated before the first and second evaporation, respectively, and the prepared hole depth is 33.66nm and 67.53nm. The temperature of the circulating water of the coating roller remains unchanged, that is, fixed at -28°C. The interface bonding strength between the prepared composite copper foil metal coating (metal coating thickness is 1300nm) and the polymer base film is 161MPa, the longitudinal yield strength of the composite copper foil is 210MPa, and the elongation at break is 57%.

[0061] Comparative Example 3

[0062] When only the circulating water parameters of the coating roller were adjusted without preparing holes, the temperatures of the circulating water of the coating roller during the first and second evaporation were -28°C and -19.30°C, respectively. The interface bonding strength between the metal coating of the prepared composite copper foil (the thickness of the metal coating was 1300nm) and the polymer base film was 150MPa, the longitudinal yield strength of the composite copper foil was 195MPa, and the elongation at break was 53%.

[0063] Example 2

[0064] This embodiment provides a method for enhancing the bonding force of a metal-polymer composite film during the coating process, and the steps are as follows: The difference from Example 1 is that there are five evaporation sources in this embodiment. The process parameters are adjusted, and the film material is pre-treated before the first, second, third, fourth, and fifth evaporation, and the prepared hole depths are 13.46nm, 27.01nm, 35.18nm, 41.02nm, and 45.69nm, respectively. The temperatures of the circulating water of the coating roller during the first, second, third, fourth, and fifth evaporation are -28°C, -24.52°C, -19.12°C, -11.3°C, and 1.25°C, respectively. The interface bonding strength of the prepared composite copper foil metal coating (the thickness of the metal coating is 1300nm) and the polymer base film is 191MPa, the longitudinal yield strength of the composite copper foil is 262MPa, and the elongation at break is 80%.

[0065] Comparative Example 4

[0066] The present embodiment provides a commonly available method for the coating process of a metal-polymer composite film material, wherein for a device for preparing a composite copper foil with 5 evaporation sources, the coating parameters before adjustment are that the temperature of the circulating water of the coating roller is fixed at -28°C, and the interface bonding strength between the prepared composite copper foil metal coating (the thickness of the metal coating is 1300nm) and the polymer base film is 158MPa, the longitudinal yield strength of the composite copper foil is 221MPa, and the elongation at break is 60%.

[0067] Comparative Example 5

[0068] When only the process parameters are adjusted, the film material is pre-treated before the first, second, third, fourth and fifth evaporation, and the prepared hole depths are 13.46nm, 27.01nm, 35.18nm, 41.02nm and 45.69nm respectively. The temperature of the circulating water of the coating roller remains unchanged, that is, fixed at -28°C. The interface bonding strength between the prepared composite copper foil metal coating (metal coating thickness is 1300nm) and the polymer base film is 181MPa, the longitudinal yield strength of the composite copper foil is 249MPa, and the elongation at break is 74%.

[0069] Comparative Example 6

[0070] When only the circulating water parameters of the coating roller are adjusted without preparing holes, the temperatures of the circulating water of the coating roller during the first, second, third, fourth and fifth evaporation are -28°C, -24.52°C, -19.12°C, -11.3°C and 1.25°C respectively. The interface bonding strength between the metal coating of the prepared composite copper foil (the thickness of the metal coating is 1300nm) and the polymer base film is 162MPa, the longitudinal yield strength of the composite copper foil is 234MPa, and the elongation at break is 65%.

[0071] Comparative Example 7

[0072] This embodiment provides a method for enhancing the bonding strength of a metal-polymer composite film during the coating process, and the steps are as follows: the process parameters are adjusted, and the film material is pre-treated before the first, second, third, fourth, and fifth evaporation, and the prepared hole depth is always 13.46nm. The temperature of the circulating water of the coating roller during the first, second, third, fourth, and fifth evaporation is -28°C, -24.52°C, -19.12°C, -11.3°C, and 1.25°C, respectively. The interface bonding strength of the prepared composite copper foil metal coating (the thickness of the metal coating is 1300nm) and the polymer base film is 186MPa, the longitudinal yield strength of the composite copper foil is 254MPa, and the elongation at break is 77%.

[0073] It can be seen that in Comparative Example 7, holes with the same depth are opened on the lower surface of each layer of the metal coating to be plated. Compared with Example 2, the bonding strength is significantly reduced, and the elongation at break is also reduced. For this reason, the holes are stepped and become deeper, which can better improve the interface bonding between adjacent metal coatings.

[0074] Example 3

[0075] This embodiment provides a method for enhancing the bonding strength of a metal-polymer composite film material during the coating process. Different from Embodiment 1, in the process of S12, the hole can be set at an angle with the plane where the metal coating is located, and the angle range is 90°.

[0076] In this embodiment, the interface bonding strength between the prepared composite copper foil metal coating (the thickness of the metal coating is 1300 nm) and the polymer base film is 157 Pa, the longitudinal yield strength of the composite copper foil is 208 MPa, and the elongation at break is 54.9%.

[0077] Example 4

[0078] This embodiment provides a method for enhancing the bonding strength of a metal-polymer composite film material during the coating process. Different from Embodiment 1, in the process of S12, the hole can be set at an angle with the plane where the metal coating is located, and the angle range is 30°.

[0079] In this embodiment, the interface bonding strength between the metal coating of the prepared composite copper foil (the thickness of the metal coating is 1300 nm) and the polymer base film is 150 MPa, the longitudinal yield strength of the composite copper foil is 200 MPa, and the elongation at break is 52.6%.

[0080] Example 5

[0081] This embodiment provides a method for enhancing the bonding strength of a metal-polymer composite film material during the coating process. Different from Embodiment 1, in the process of S12, the hole can be set at an angle with the plane where the metal coating is located, and the angle range is 10°.

[0082] In this embodiment, the interface bonding strength between the prepared composite copper foil metal coating (the thickness of the metal coating is 1300 nm) and the polymer base film is 148 MPa, the longitudinal yield strength of the composite copper foil is 196 MPa, and the elongation at break is 51.7%.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for enhancing the bonding strength of a metal-polymer composite film during a coating process, the method being based on: Providing a flexible polymer substrate layer, wherein the polymer substrate layer has a first surface and a second surface disposed opposite to each other, and the first surface is close to a first evaporation source; When the polymer substrate layer passes through the first evaporation source, a first metal coating layer is deposited on the first surface under the evaporation effect of the first evaporation source, and the first metal coating layer has a surface to be coated close to the second evaporation source, and the first metal coating layer can be sequentially passed through the next evaporation source for multiple evaporation depositions to form a composite film material; It is characterized in that The method comprises the following steps: S1, performing a pretreatment of punching holes on the first surface of the polymer substrate layer / the surface to be plated of each metal coating layer; S2. Regulate the temperature of the circulating water in the coating roller so that the temperature of the composite film material gradually increases with the increase in the number of evaporation times. When the temperature of the circulating water in the coating roller gradually rises to room temperature, the temperature of the circulating water in the coating roller remains unchanged.

2. The method for enhancing the bonding strength of a metal-polymer composite film during coating according to claim 1, characterized in that: In S1, the punching preprocessing comprises the following steps: S11, installing a punching device before each evaporation source, so that during the coating process, the first surface of the polymer substrate layer / the surface to be coated of each metal coating layer is punched by the punching device on the first surface of the polymer substrate layer / the surface to be coated of each metal coating layer; S12. During the punching process of S11, a plurality of holes arranged in an array can be formed on the first surface of the polymer substrate layer / the surface to be plated of each metal-plated layer.

3. The method for enhancing the bonding strength of a metal-polymer composite film during coating according to claim 2, characterized in that: In the process of S12, the hole can be arranged at an angle with the surface of the metal coating to be plated where the hole is located, and the angle ranges from 10° to 90°.

4. The method for enhancing the bonding strength of a metal-polymer composite film during coating according to claim 2, characterized in that: The diameter of the pores ranges from 10 nm to 200 nm.

5. The method for enhancing the bonding strength of a metal-polymer composite film during coating according to claim 2, characterized in that: The distance between adjacent holes ranges from 100 nm to 1000 nm.

6. The method for enhancing the bonding strength of a metal-polymer composite film during coating according to claim 2, characterized in that: The height of the holes ranges from 1 nm to 300 nm.

7. The method for enhancing the bonding strength of a metal-polymer composite film during coating according to claim 6, characterized in that: The hole height on the surface of each metal coating to be coated will gradually change with the increase of the number of evaporation sources and the number of deposition times; Assume the height of the hole is h n (unit: nm), the total number of evaporation sources is M 蒸镀源总数 , the total thickness of the coating to be plated is H 镀层总厚度 (unit: nm); The formula for the change of the hole height with the number of evaporation deposition times is: Among them, δ is a coefficient related to the properties of the evaporation material, n is the nth evaporation source, and h n The height of the holes indicates that the first surface of the polymer substrate layer / the surface to be coated of each metal coating layer needs to be pre-treated before the nth evaporation.

8. The method for enhancing the bonding strength of a metal-polymer composite film during coating according to claim 7, characterized in that: The total thickness of the coating to be plated is H 镀层总厚度 , the H 镀层总厚度 The range is 500nm-3000nm.

9. The method for enhancing the bonding strength of a metal-polymer composite film during coating according to claim 1, characterized in that: In the subsequent deposition process of S2, the temperature regulation formula of the circulating water in the coating roller is as follows: In this formula, n is the nth evaporation process, which can also be expressed as the nth evaporation source, T n-1 It is expressed as the temperature of the circulating water of the coating roller during the n-1th evaporation, T n represents the temperature of the circulating water of the coating roller during the nth evaporation, M 蒸镀源总数 Indicates the total number of evaporation sources contained, H 镀层总厚度 is the total thickness of the coating to be prepared (in nm), and α is a coefficient related to the total thickness of the coating and the material properties.

10. The method for enhancing the bonding strength of a metal-polymer composite film during coating according to claim 1, characterized in that: The composite film material is any one of composite copper foil, composite aluminum foil or composite nickel foil.

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