A simulation device and method for the heating conditions of a heat exchange equipment
By designing a heating condition simulation device for heat exchange equipment including shell, runner plate, working fluid runner and heating plate, the problem of poor simulation accuracy in the prior art is solved, and more accurate heat transfer simulation and a more stable structure are achieved to meet the simulation needs of high temperature and high pressure.
Patent Information
- Application Number
- CN202510352246.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2045-03-25
AI Technical Summary
The simulation accuracy of existing heat exchange equipment has poor simulation structures, which affects the design and development of final heat exchange equipment.
A heat-generating condition simulation device for heat exchange equipment including a shell, a runner plate, a working fluid flow channel and a heating plate is designed. Heat is transferred to the runner plate through the heating plate, and then heat is transferred to the working fluid in the working fluid flow channel through the runner plate, simulating the heat exchange function of the heat exchange device.
It improves the accuracy of the heat transfer simulation results, enhances the structural stability of the device, meets the experimental needs of high temperature and high pressure, and extends the service life of the device.
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Figure CN119880489B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the technical field of heat exchange equipment research, and specifically relates to a heat generation condition simulation device and method for heat exchange equipment. Background Art
[0002] In industrial fields such as refrigeration, power generation, and high-performance computing, heat exchange equipment has always been a key research area. Currently, a heat exchange equipment is generally simulated through an electric heating simulation device to support the design and research and development of the heat exchange equipment. However, the existing simulation structure has poor simulation accuracy, which affects the final design and research and development of the heat exchange equipment. Summary of the Invention
[0003] The present invention aims to solve at least one of the technical problems existing in the prior art or related technologies.
[0004] To this end, a first aspect of the present invention provides a heat generation condition simulation device for heat exchange equipment.
[0005] A second aspect of the present invention provides a heat loss simulation method.
[0006] In view of this, according to a first aspect of the embodiments of the present application, a heat generation condition simulation device for heat exchange equipment is proposed, including:
[0007] A housing, which is a hollow cavity with openings at both ends;
[0008] A flow channel plate, which is arranged in the housing along the length direction of the housing;
[0009] A working fluid flow channel, which penetrates the flow channel plate along the length direction of the flow channel plate, and the cross-section of the working fluid flow channel is rectangular;
[0010] A heating plate, which is arranged between two adjacent flow channel plates along the length direction of the flow channel plate, and the heating plate is embedded in the flow channel plate.
[0011] In a feasible implementation manner, the heat generation condition simulation device for heat exchange equipment further includes:
[0012] Fasteners, which are arranged perpendicular to the flow channel plate, and the flow channel plate is fixed in the housing through the fasteners.
[0013] In a feasible implementation manner, the heat generation condition simulation device for heat exchange equipment further includes:
[0014] An external copper plate, the first end of which is connected to the heating plate, and the second end of which passes through the housing and extends to the outside of the housing.
[0015] In a feasible implementation manner, the heat generation condition simulation device for heat exchange equipment further includes:
[0016] The first thermocouple is arranged on the heating plate;
[0017] The second thermocouple is arranged on the flow channel plate, and the second thermocouple is located between the heating plate and the working fluid flow channel.
[0018] In a feasible implementation manner, the first thermocouple is arranged on the end face of the heating plate, and the first thermocouple is located at the central position of the end face of the heating plate;
[0019] The second thermocouple is arranged on the end face of the flow channel plate, the second thermocouple is located on the center line of the flow channel plate, and the second thermocouple and the first thermocouple are located at the same horizontal position.
[0020] In a feasible implementation manner, the heating plate includes:
[0021] Plates, which are stacked;
[0022] An insulating layer is arranged on the outer surface of the plates to electrically isolate the plates.
[0023] In a feasible implementation manner, the resistivity of the plates is different, and the plates are connected by welding.
[0024] In a feasible implementation manner, the first thermocouple is arranged on the end face of the plate, and the first thermocouple is located between two adjacent plates.
[0025] According to the second aspect of the embodiments of the present application, a heat loss simulation method is provided. Heat simulation is performed by using the heat generation condition simulation device of the heat exchange equipment according to any of the above technical solutions, including:
[0026] Customize the heating power of the working fluid flow channel and customize the heating power of the heating plate;
[0027] Heat the heating plate;
[0028] Monitor the temperatures of the flow channel plate and the heating plate;
[0029] Obtain the heat loss.
[0030] In a feasible implementation manner, the steps of customizing the heating power of the working fluid flow channel and customizing the heating power of the heating plate include:
[0031] Select the type and flow rate of the working fluid in the working fluid flow channel;
[0032] Select the material of the plates.
[0033] The heat generation condition simulation device and method of the heat exchange equipment of the present application, compared with the prior art, have the beneficial effects as follows:
[0034] The heat generation condition simulation device of the heat exchange equipment provided by the embodiment of the present application includes a housing, a flow channel plate, a working medium flow channel, and a heating plate; the heating plate is adjacent to the flow channel plate and the heating plate is embedded in the flow channel plate. A cuboid working medium flow channel is arranged in the flow channel plate for the working medium to flow through. After the heating plate generates heat, the heating plate transfers heat to the flow channel plate, and then transfers heat to the working medium in the working medium flow channel through the flow channel plate; when the working medium flows in the working medium flow channel, it exchanges heat with the heating plate to achieve heat transfer and simulate the heat exchange function of the heat exchange equipment. By arranging the flow channel plate in the housing, the housing wraps the flow channel plate to restrict the flow channel plate, so as to prevent the flow channel plate from deforming under the action of the high-pressure working medium pressure, ensure the structural reliability of the flow channel plate, and further ensure that the working medium flow channel does not deform under the action of the working medium pressure, which is beneficial to improving the accuracy of the heat transfer simulation result, improving the overall structural stability of the device, meeting the simulation experiment requirements of high temperature and high pressure, and extending the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to limit the present application. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:
[0036] Figure 1 It is a schematic structural diagram of the heat generation condition simulation device of the heat exchange equipment provided by an embodiment of the present application from the first angle;
[0037] Figure 2 It is a schematic structural diagram of the heat generation condition simulation device of the heat exchange equipment provided by an embodiment of the present application from the second angle;
[0038] Figure 3 It is a schematic structural diagram of the heating plate of the heat generation condition simulation device of the heat exchange equipment provided by an embodiment of the present application;
[0039] Figure 4 It is a schematic structural diagram of the installation position of the thermocouple of the heat generation condition simulation device of the heat exchange equipment provided by an embodiment of the present application;
[0040] Figure 5 It is a schematic step flow chart of the heat generation condition simulation method of the heat exchange equipment provided by an embodiment of the present application;
[0041] Figure 6 It is a schematic diagram of the layout position of the temperature monitoring points of the second heating plate of the heat generation condition simulation device of the heat exchange equipment provided by an embodiment of the present application;
[0042] Figure 7The heat transfer temperature trend graph of the second heating plate of a heat exchange equipment heating condition simulation device provided by this application;
[0043] Among them, Figures 1 to 7 The corresponding relationship between the reference numerals and the component names in
[0044] 11. Outer shell; 12. Flow channel plate; 13. Working medium flow channel; 14. Heating plate; 15. Fastener; 16. External copper plate; 17. First thermocouple; 18. Second thermocouple;
[0045] 141. First plate; 142. Second plate. Detailed implementation mode
[0046] In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.
[0047] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality" means two or more, unless otherwise specifically defined.
[0048] In this application, unless otherwise clearly defined and limited, the terms "install", "connect", "connection", "fix", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0049] The following describes the preferred embodiments of this application with reference to the drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain this application and are not used to limit this application.
[0050] Such as Figure 1 And Figure 2As shown in the figure, according to the first aspect of the embodiments of the present application, a simulation device for the heating conditions of a heat exchange device is proposed, including: a housing 11, a flow channel plate 12, a working fluid flow channel 13, and a heating plate 14; the housing 11 is a hollow cavity with openings at both ends; the flow channel plate 12 is arranged in the housing 11 along the length direction of the housing 11; the working fluid flow channel 13 penetrates the flow channel plate 12 along the length direction of the flow channel plate 12, and the cross-section of the working fluid flow channel 13 is rectangular; the heating plate 14 is arranged between two adjacent flow channel plates 12 along the length direction of the flow channel plate 12, and the heating plate 14 is embedded in the flow channel plate 12.
[0051] The simulation device for the heating conditions of the heat exchange device provided by the embodiments of the present application includes a housing 11, a flow channel plate 12, a working fluid flow channel 13, and a heating plate 14; the heating plate 14 is adjacent to the flow channel plate 12 and the heating plate 14 is embedded in the flow channel plate 12. A rectangular working fluid flow channel 13 is arranged in the flow channel plate 12 for the working fluid to flow through. After the heating plate 14 generates heat, the heating plate 14 transfers heat to the flow channel plate 12, and then transfers heat to the working fluid in the working fluid flow channel 13 through the flow channel plate 12; when the working fluid flows in the working fluid flow channel 13, it exchanges heat with the heating plate 14 to achieve heat transfer and simulate the heat exchange function of the heat exchange device. By arranging the flow channel plate 12 in the housing 11, the housing 11 wraps the flow channel plate 12 to restrict the flow channel plate 12, so as to prevent the flow channel plate 12 from deforming under the action of the high-pressure working fluid pressure, ensure the structural reliability of the flow channel plate 12, and further ensure that the working fluid flow channel 13 does not deform under the action of the working fluid pressure, which is beneficial to improving the accuracy of the simulated heat transfer result, enhancing the overall structural stability of the device, meeting the simulation experiment requirements of high temperature and high pressure, and extending the service life of the device.
[0052] Furthermore, the heating plates 14 are symmetrically arranged on the flow channel plate 12 to uniformly heat the flow channel plate 12 through the heating plates 14. The working fluid flow channels 13 are symmetrically arranged on the flow channel plate 12 to uniformly conduct heat to the working fluid in the working fluid flow channels 13 through the flow channel plate 12. The heating plates 14 do not directly contact the working fluid and indirectly transfer heat through the flow channel plate 12, thereby improving the uniformity of the working fluid temperature, reducing the temperature difference inside the flow channel plate 12 and the temperature difference of the working fluid, which is beneficial to improving the accuracy of calculating the heat transfer loss of the subsequent calculation device. The boundary geometry of the working fluid flow channels 13 of the flow channel plate 12 is rectangular. The rectangular working fluid flow channels 13 are simple to process, have strong symmetry, and the coupled heat transfer between the rectangular working fluid flow channels 13 and the calculation of the flow distribution between different working fluid flow channels 13 are simple, which can effectively reduce the difficulty of calculating the subsequent heat loss, facilitate the rapid acquisition of simulated result data, and improve the efficiency of the simulation experiment.
[0053] Further, a plurality of flow channel plates 12 are provided. The size and quantity of the flow channel plates 12 can be adjusted according to simulation design to facilitate the simulation of internal heat sources in different heat exchange devices, thereby facilitating the experimental verification, design, and research and development of heat exchange devices. An independent working medium flow channel 13 is provided in each flow channel plate 12, and a heating plate 14 is provided between two flow channel plates 12 to heat the flow channel plate 12 by means of the heating plate 14, and then heat the working medium by the flow channel plate 12, so as to improve the uniformity of the temperature rise of the working medium.
[0054] Further, the working medium inlets of the plurality of flow channel plates 12 are communicated with the same working medium input port, and the working medium outlets of the plurality of flow channel plates 12 are communicated with the same working medium output port, so that the medium can enter the plurality of working medium flow channels 13 evenly.
[0055] It should be noted that the working medium is a medium substance that realizes the mutual conversion of thermal energy and mechanical energy. The working medium relies on state changes (such as expansion) in a heat engine to obtain work, and at the same time transfers thermal energy through the flow of the working medium. The working medium is in a high-pressure environment. When the working medium flows in the working medium flow channel 13 of the flow channel plate 12, the flow channel plate 12 bears the pressure of the working medium, and the boundary of the working medium flow channel 13 is prone to deformation; by providing a housing 11 outside the flow channel plate 12, the pressure-bearing capacity of the flow channel plate 12 is improved, preventing the flow channel plate 12 and the working medium flow channel 13 from deforming, so as to more accurately calculate the heat loss of each working medium flow channel 13 to achieve accurate measurement of the rectangular multi-channel structure.
[0056] Further, the flow channel plate 12 is made into an integral structure by a casting process, so that there are no connection points inside the flow channel plate 12 to ensure the strength of the flow channel plate 12, and then a rectangular working medium flow channel 13 is machined in the flow channel plate 12 by a wire cutting process.
[0057] As Figure 1 and Figure 2 shown, in a feasible implementation manner, the heat generation condition simulation device of the heat exchange device further includes: a fastener 15, the fastener 15 is arranged perpendicular to the flow channel plate 12, and the flow channel plate 12 is fixed in the housing 11 by the fastener 15.
[0058] In this technical solution, the flow channel plate 12 is arranged in the housing 11, and the housing 11 is the first-stage pressure-bearing structure of the flow channel plate 12; the fastener 15 is arranged perpendicular to the stacking direction of the flow channel plates 12, and the fastening force of the fastener 15 on the flow channel plate 12 is the second-stage pressure-bearing structure of the flow channel plate 12. By setting the two-stage pressure-bearing structure, the probability of deformation of the flow channel plate 12 and the working medium flow channel 13 is further reduced, which is beneficial to improving the accuracy and effectiveness of the calculation results of the heat loss of the working medium flow channel 13.
[0059] In this technical solution, the heating plate 14 is placed between two adjacent flow channel plates 12. Through the fastening force of the housing 11 and the fastener 15, the fastening and positioning of the heating plate 14 can be achieved, improving the stability of the heating plate 14.
[0060] As Figure 1 and Figure 3 shown, in a feasible implementation, the heat generation condition simulation device of the heat exchange equipment further includes: an external copper plate 16. The first end of the external copper plate 16 is connected to the heating plate 14, and the second end of the external copper plate 16 passes through the housing 11 and extends to the outside of the housing 11.
[0061] In this technical solution, by providing the external copper plate 16 on the heating plate 14, the connection point between the heating plate 14 and the power supply can be led out to the outside of the housing 11 by using the external copper plate 16. While simulating the internal heat source of the heat exchange equipment, it is ensured that the power supply is located outside the housing. The external power supply does not affect the structures of the flow channel plate 12 and the working medium flow channel 13. Then, the heating plate 14 converts electrical energy into heat energy, conducts heat to the flow channel plate 12 to heat the working medium, and effectively simulates the internal heat source of the heat exchange equipment through a simple structural arrangement.
[0062] Furthermore, the heating plate 14 generates heat by direct current energization. The heat generated by the heating plate 14 follows Joule's law, that is , where Q is the heat, I is the current, R is the resistance, and t is the energization time.
[0063] It can be understood that the external copper plate 16 is made of metal copper. The resistance of metal copper is small. Compared with the resistance of the heating plate 14, the heat generation power of the external copper plate 16 can be ignored to reduce the difficulty of calculating heat loss.
[0064] As Figure 4 shown, in a feasible implementation, the heat generation condition simulation device of the heat exchange equipment further includes: a first thermocouple 17 and a second thermocouple 18; the first thermocouple 17 is arranged on the heating plate 14; the second thermocouple 18 is arranged on the flow channel plate 12, and the second thermocouple 18 is located between the heating plate 14 and the working medium flow channel 13.
[0065] In this technical solution, the first thermocouple 17 monitors the temperature of the heating plate 14, and the second thermocouple 18 monitors the temperature of the flow channel plate 12. Taking the temperature of the heating plate 14 as the initial temperature, by monitoring the temperatures of the flow channel plates 12 on both sides of the heating plate 14, the temperature change after heat transfer is monitored. Then, through the temperature difference between the flow channel plate 12 and the heating plate 14, the heat flux density is calculated, and based on the heat flux density, the true heat entering the working medium is further calculated, and then the heat loss is calculated.
[0066] As Figure 4As shown, in a feasible implementation, the first thermocouple 17 is disposed on the end face of the heating plate 14, and the first thermocouple 17 is located at the center position of the end face of the heating plate 14; the second thermocouple 18 is disposed on the end face of the flow channel plate 12, the second thermocouple 18 is located on the center line of the flow channel plate 12, and the second thermocouple 18 and the first thermocouple 17 are located at the same horizontal position.
[0067] In this technical solution, the first thermocouple 17 is disposed on the end face of the heating plate 14 and detects the temperature of the center point of the end face of the detection plate. By disposing the second thermocouple 18 on the end face of the flow channel plate 12, the second thermocouple 18 is located on the center line of the flow channel plate 12, and the second thermocouple 18 and the first thermocouple 17 are located at the same horizontal position, so as to facilitate calculating the distance between the second thermocouple 18 and the first thermocouple 17, or calculating the distance between two second thermocouples 18.
[0068] It can be understood that the second thermocouple 18 and the first thermocouple 17 are arranged on the vertical line passing through the center of the heating plate 14. The distance between the second thermocouple 18 and the first thermocouple 17 is the absolute value of the height difference between the second thermocouple 18 and the first thermocouple 17, and the distance between the second thermocouple 18 and the second thermocouple 18 is the absolute value of the height difference between the two second thermocouples 18.
[0069] Furthermore, two second thermocouples 18 are provided between the heating plate 14 and the flow channel plate 12 on one side, so as to calculate the heat flux density transferred from the heating plate 14 to the corresponding flow channel plate 12 on one side through the distance between the two second thermocouples 18 and the temperature difference between the two thermocouples.
[0070] In a feasible implementation, the heating plate 14 includes: a plate and an insulating layer; the plates are stacked; the insulating layer is disposed on the outer surface of the plates to perform electrical isolation on the plates.
[0071] In this technical solution, at least two plates are provided. By selecting different plates, different power distributions can be simulated, and two-way heat transfer of different power heat sources can be realized, so as to improve the adjustable range of the simulation device and improve the practicability; by disposing an insulating layer on the surface of the plates, electrical isolation is performed between two adjacent plates to prevent conductive contact between the two plates, so as to ensure that each plate works independently, ensure the heating efficiency of the plates, prevent heat concentration, and thus ensure uniform heating of the heating plate 14; at the same time, electrical isolation is also formed between the plates and the flow channel plate 12 to prevent conductive contact between the plates and the flow channel plate 12, prevent current from flowing from the heating plate 14 to the flow channel plate 12, avoid short-circuit phenomena, and improve the electrical safety and reliability of the device.
[0072] Furthermore, after the plates are stacked, they are fixedly connected to ensure the structural stability of the heating plate 14.
[0073] In some examples, such as Figure 3 and Figure 4 , the heating plate 14 includes a first plate 141 and a second plate 142, and the first plate 141 is disposed above the second plate 142.
[0074] As a preferred solution, the insulating layer is a sprayed coating, and the outer surface of the plate needs to be made into a ceramic insulating layer by a ceramic spraying method.
[0075] In a feasible implementation manner, the resistivity of the plates is different, and the plates are connected by welding.
[0076] In this technical solution, at the same current intensity, the heating powers of the plates with different resistivities are different. By combining the plates with different resistivities to form the heating plate 14, the simulation of different power distributions is realized, and then the bidirectional heat transfer of different power heat sources is realized, so that the heating powers of the heating plate 14 on both sides of the flow channel plate 12 are different, thereby simulating different heating devices.
[0077] Furthermore, the sizes of the plates are kept consistent, and the resistivity of the heating plate 14 is adjusted by making the materials of the plates different.
[0078] Furthermore, the powers of the heating plates 14 are different, and by assembling the heating plates 14 with different powers at different positions, the specific power distribution of the simulation device is realized.
[0079] Such as Figure 4 shown, in a feasible implementation manner, the first thermocouple 17 is disposed on the end face of the plate, and the first thermocouple 17 is located between two adjacent plates.
[0080] In this technical solution, the first thermocouple 17 is located between two adjacent plates to ensure that the heating power of the plate on the corresponding side of the flow channel plate 12 can be accurately calculated.
[0081] Such as Figure 5 shown, according to the second aspect of the present application, a heat loss simulation method is proposed. Using the heat exchange equipment heating condition simulation device in any one of the above technical solutions for heat simulation, including:
[0082] Step 100: Customize the heating power of the working fluid flow channel 13 and customize the heating power of the heating plate 14; by customizing the heating powers of the working fluid flow channel 13 and the heating plate 14, different heat exchange devices are simulated;
[0083] Step 200: Heat the heating plate 14 to generate heat;
[0084] Step 300: Monitor the temperatures of the flow channel plate 12 and the heating plate 14 to calculate the heat flux density transferred from the heating plate 14 to the flow channel plate 12 through the temperature difference;
[0085] Step 400: Obtain the heat loss, calculate the real heat through the heat flux density, and obtain the heat loss percentage by the ratio of the real heat to the heating power.
[0086] The heat loss simulation method provided by the embodiment of the present application is applied to the heating condition simulation device of the heat exchange equipment in any of the above technical solutions. Therefore, this heat loss simulation method has all the beneficial effects of the heating condition simulation device of the heat exchange equipment in the above technical solutions, which will not be elaborated here.
[0087] Through the heat loss simulation method provided by the embodiment of the present application, customize the heating power of the working fluid flow channel 13 and the heating plate 14 to simulate the heating and heat exchange conditions of different heat exchange equipment. Then, according to the detected temperatures of the flow channel plate 12 and the heating plate 14, calculate the heat flux density, and then calculate the actual heat entering the working fluid according to the heat flux density. Finally, obtain the heat loss percentage through the ratio of the actual heat to the heating power; the heating plate 14 is adjacent to the flow channel plate 12 and the heating plate 14 is embedded in the flow channel plate 12. A cuboid working fluid flow channel 13 is arranged in the flow channel plate 12 for the working fluid to flow through. When the heating plate 14 generates heat, the heating plate 14 transfers heat to the flow channel plate 12, and then transfers heat to the working fluid in the working fluid flow channel 13 through the flow channel plate 12; when the working fluid flows in the working fluid flow channel 13, it exchanges heat with the heating plate 14 to achieve heat transfer and simulate the heat exchange function of the heat exchange equipment. By arranging the flow channel plate 12 in the housing 11, the housing 11 wraps the flow channel plate 12 to restrict the flow channel plate 12 to prevent the flow channel plate 12 from deforming under the action of the high-pressure working fluid pressure, ensure the structural reliability of the flow channel plate 12, and further ensure that the working fluid flow channel 13 does not deform under the action of the working fluid pressure, which is beneficial to improving the accuracy of the heat transfer simulation results, improving the overall structural stability of the device, meeting the simulation experiment requirements of high temperature and high pressure, and extending the service life of the device.
[0088] In a feasible implementation manner, the steps of customizing the heating power of the working fluid flow channel 13 and customizing the heating power of the heating plate 14 include:
[0089] Select the type and flow rate of the working fluid in the working fluid flow channel 13;
[0090] Select the plate material of the heating plate 14.
[0091] In this technical solution, select the type and flow rate of the working fluid in the working fluid flow channel 13 to simulate different heat exchange equipment media and their flow rates; select the plate material of the heating plate 14 to simulate the heating conditions of the heat exchange equipment, and then simulate the heat exchange effect of the heating equipment through the operation of the device.
[0092] Example:
[0093] Such as Figure 4, taking the simulation device composed of 4 flow channel plates and 3 heating plates as an example, the steps for customizing the power of rectangular multi-channels and the steps for evaluating heat loss are as follows:
[0094] Power customization distribution
[0095] Each flow channel plate is provided with a working fluid flow channel, that is, the simulation device has a total of 4 working fluid flow channels. Among them, the 4 working fluid flow channels can be designed into 4 different power distribution forms, which are the first working fluid flow channel, the second working fluid flow channel, the third working fluid flow channel, and the fourth working fluid flow channel from top to bottom. Each heating plate is composed of a first plate and a second plate. There are three heating plates with A 1 +B 1 、A 2 +B 2 、A 3 +B 3 There are three power forms. A first heating plate A 1 +B 1 is arranged between the first working fluid flow channel and the second working fluid flow channel, a second heating plate A 2 +B 2 is arranged between the second working fluid flow channel and the third working fluid flow channel, and a third heating plate A 3 +B 3 is arranged between the third working fluid flow channel and the fourth working fluid flow channel. Among them, the first heating plate A 1 +B 1 affects the first working fluid flow channel and the second working fluid flow channel, the second heating plate A 2 +B 2 affects the second working fluid flow channel and the third working fluid flow channel, and the third heating plate A 3 +B 3 affects the third working fluid flow channel and the fourth working fluid flow channel.
[0096] When the electric heating plate is heated by direct current, the resistivity of the external copper plate is relatively small (10% or less) compared with the material of the heating plate, and the resistance of the external copper plate can be ignored. The electric potentials at the welding joints of the external copper plate with the first plate and the welding joints of the external copper plate with the second plate are equal. Therefore, for the heating plate composed of the first plate and the second plate, the voltage U before and after the heating plate is equal. The electric heating powers of the first plate and the second plate of the heating plate are respectively: 、 ,wherein, R a is the resistance of the first plate, and R b is the resistance of the second plate.
[0097] When realizing the customized power arrangement, by using plates of different metal materials (the resistivity of this metal material should be much greater than that of the external copper plate), during direct current heating, the electric powers of the three heating plates are respectively 、 、 , where R a1 is the resistance of the first plate in the first heating plate, and R b1 is the resistance of the second plate in the first heating plate; R a2 is the resistance of the first plate in the second heating plate, and R b2 is the resistance of the second plate in the second heating plate; R a3 is the resistance of the first plate in the third heating plate, and R b3 is the resistance of the second plate in the third heating plate.
[0098] Heat loss assessment:
[0099] As Figure 6 , taking the second heating plate with power form A 2 + B 2 as an example, the heat loss assessment method is as follows:
[0100] Install a first thermocouple between the first plate and the second plate of the second heating plate, install two second thermocouples after drilling holes in the second flow channel plate, and install two second thermocouples after drilling holes in the third flow channel plate to obtain the temperatures at five points T a1 , T a2 , T 0 , T b1 , T b2 of the second heating plate. Based on the thermal conductivity σ of the metal material of the flow channel plate,
[0101] The calculation formula for the heat flux density transferred from the second heating plate to the second working fluid flow channel is as follows:
[0102]
[0103] where x 1 is the distance between point T a1 and point T a2 .
[0104] The calculation formula for the heat flux density transferred from the second heating plate to the third working fluid flow channel is as follows:
[0105]
[0106] where x 2 is the distance between point T b1 and point T b2 .
[0107] Although the second heating plate A 2 + B 2 is located between the second working fluid flow channel and the third working fluid flow channel, due to the different resistances of the first plate and the second plate of the second heating plate under the same voltage condition, the heat generation is different, resulting in , inconsistent, that is, the two-way heat transfer of the second heating plate is uneven, and its temperature trend is as Figure 7 shown.
[0108] The heat generated by energizing the second heating plate is , and the heat flux density entering the working fluid channel is , . Assuming that the contact area between the second heating plate and the second working fluid channel and the third working fluid channel is S, the calculation formula for the true heat entering the working fluid is as follows:
[0109] + S
[0110] Therefore, the calculation formula for the heat loss percentage of the second heating plate is as follows:
[0111]
[0112] Calculate the heat loss of each heating plate according to the heat loss calculation method of the second heating plate and then sum them up. The heat loss during the heat exchange of the entire simulation device obtained is the heat loss of the simulated heat exchange equipment. Through the simulation device, accurate power customization and heat loss evaluation of the heat loss of the designed heat exchange equipment are carried out to quickly and effectively determine whether the heat exchange equipment meets the requirements.
[0113] It is easy for those skilled in the art to understand that, on the premise of no conflict, the above embodiments can be freely combined and superimposed.
[0114] The above are only the preferred embodiments of the present application, and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application. The above is only the preferred implementation manner of the present application. It should be noted that for those of ordinary skill in the art in this technical field, several improvements and variations can be made without departing from the technical principle of the present application, and these improvements and variations should also be regarded as the protection scope of the present application.
Claims
1. A device for simulating heating conditions of a heat exchanger, characterized in that: The heat exchange equipment heating condition simulation device comprises: A shell, wherein the shell is a hollow cavity with openings at both ends; A flow channel plate, the flow channel plate is arranged in the shell along the length direction of the shell; A working fluid flow channel, wherein the working fluid flow channel penetrates the flow channel plate along the length direction of the flow channel plate, and the cross section of the working fluid flow channel is rectangular; A heating plate, wherein the heating plate is disposed between two adjacent flow channel plates along the length direction of the flow channel plates, and the heating plate is embedded in the flow channel plates; a first thermocouple, wherein the first thermocouple is disposed on the heating plate; The heating plate comprises: Plates, the plates are stacked; An insulating layer is disposed on the outer surface of the plate to electrically isolate the plate.
2. A heat exchange equipment heating condition simulation device according to claim 1, characterized in that: The heat exchange equipment heating condition simulation device also includes: A fastener is arranged perpendicular to the flow channel plate, and the flow channel plate is fixed in the shell through the fastener.
3. The device for simulating heating conditions of heat exchange equipment according to claim 1, characterized in that: The heat exchange equipment heating condition simulation device also includes: An external copper plate, a first end of which is connected to the heating plate, and a second end of which passes through the shell and extends to the outside of the shell.
4. The device for simulating heating conditions of heat exchange equipment according to claim 1, characterized in that: The heat exchange equipment heating condition simulation device also includes: A second thermocouple is provided on the flow channel plate, and the second thermocouple is located between the heating plate and the working medium flow channel.
5. The device for simulating heating conditions of heat exchange equipment according to claim 4, characterized in that: The first thermocouple is arranged on the end surface of the heating plate, and the first thermocouple is located at the center of the end surface of the heating plate; The second thermocouple is arranged on the end surface of the flow channel plate, the second thermocouple is located on the center line of the flow channel plate, and the second thermocouple and the first thermocouple are located at the same horizontal position.
6. The device for simulating heating conditions of heat exchange equipment according to claim 1, characterized in that: The plates have different resistivities and are connected by welding.
7. The device for simulating heating conditions of heat exchange equipment according to claim 1, characterized in that: The first thermocouple is arranged on the end surface of the plate, and the first thermocouple is located between two adjacent plates.
8. A heat loss simulation method, characterized in that: The heat simulation is performed using the heat exchange equipment heating condition simulation device as claimed in any one of claims 1 to 7, comprising: Customize the heating power of the working fluid channel and the heating power of the heating plate; heating the heating plate; Monitoring the temperature of the flow channel plate and the heating plate; Get heat loss.
9. A heat loss simulation method according to claim 8, characterized in that: The steps of customizing the heating power of the working fluid flow channel and the heating power of the heating plate include: Selecting the type and flow rate of the working fluid in the working fluid flow channel; Select the material of the plate.
Citation Information
Patent Citations
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