Detector protection mechanism and semiconductor detection equipment

Abstract

The invention discloses a detector protection mechanism and semiconductor detection equipment, the semiconductor detection equipment comprises an emission device, a detector and the detector protection mechanism, the emission device is used for emitting electron beams of various beam currents; the detector is used for receiving the signal particles reflected by the object to be detected; the detector protection mechanism is arranged between the detector and the object to be detected, the detector protection mechanism comprises a driving assembly and a protection plate, the driving assembly is connected with the protection plate to drive the protection plate to be movably arranged in the first direction intersecting with the path of the electron beam, and the protection plate is provided with a through hole allowing the electron beam to penetrate through; wherein the driving assembly can drive the protection plate to move in the positive direction of the first direction, and the protection plate blocks signal particles from being emitted to the detector while the electron beams are emitted to the to-be-detected object; or the driving assembly can drive the protection plate to move in the opposite direction of the first direction, and the detector receives the signal particles while the electron beams are emitted to the to-be-detected object.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor detection technology, and in particular, relates to a detector protection mechanism and semiconductor detection equipment. Background Art

[0002] For semiconductor products with high precision requirements, such as wafers, electron beams are generally used to bombard the wafer surface to achieve imaging for dimensional measurement, defect detection or other inspection operations.

[0003] The imaging system generally uses a small beam to scan the wafer to obtain a higher resolution image to detect microscopic size or microscopic defects. However, the small beam has the defects of low detection efficiency and poor signal-to-noise ratio, which need to be improved. In the related technology, some detection equipment can stimulate large beam and small beam respectively to meet different detection needs.

[0004] Among them, a small beam needs to be equipped with a detector to receive reflected electrons to achieve imaging, while a large beam does not require a separate detector to receive reflected electrons. In addition, as a high-precision component, the detector usually cannot withstand the bombardment of a large beam. Therefore, a separate working chamber needs to be set up and the detection needs to be completed separately, which is not conducive to controlling the detection cost and improving the detection efficiency. Summary of the invention

[0005] An embodiment of the present application provides a detector protection mechanism and a semiconductor detection device. The semiconductor detection device is provided with a detector protection mechanism. The detector protection mechanism can allow signal particles to be emitted to the detector or block signal particles from being emitted to the detector while the electron beam is emitted to the object to be detected, so that electron beams with different beam intensities can be integrated in the same chamber for detection operations.

[0006] In a first aspect, an embodiment of the present application provides a semiconductor detection device, including an emitting device, a detector and a detector protection mechanism, wherein the emitting device is used to emit electron beams of multiple beam currents; the detector is used to receive signal particles reflected by an object to be tested; the detector protection mechanism is arranged between the detector and the object to be tested, and the detector protection mechanism includes a driving component and a protection plate, the driving component is connected to the protection plate to drive the protection plate to be movably arranged in a first direction intersecting with the electron beam path, and the protection plate is provided with a through hole for the electron beam to pass through; wherein the driving component can drive the protection plate to move in a positive direction of the first direction, so that when the electron beam is emitted to the object to be tested, the protection plate blocks the signal particles from being emitted to the detector; or, the driving component can drive the protection plate to move in a reverse direction of the first direction, so that the protection plate is away from the movement path of the signal particles, thereby allowing the detector to receive the signal particles while the electron beam is emitted to the object to be tested.

[0007] In some embodiments, the detector protection mechanism also includes an adapter assembly, which includes an adapter block and a sliding rod. The adapter block is connected to the driving assembly, the sliding rod is connected to the protective plate, and the output shaft of the sliding rod and the driving assembly are arranged on both sides of the adapter block along the first direction.

[0008] In some embodiments, the driving assembly includes a driving motor and an adapter clamping block, the output end of the driving motor is clamped between the adapter clamping block and the adapter block along the beam direction, and the adapter clamping block and the adapter block are connected by bolts.

[0009] In some embodiments, the adapter assembly further includes a slide bar clamping block, the slide bar is clamped between the adapter block and the slide bar clamping block along the beam direction, and the adapter block and the slide bar clamping block are connected by bolts.

[0010] In some embodiments, the detector protection mechanism further includes a guide structure extending perpendicular to the beam direction, and the guide structure is sleeved on the slide bar and slidably matched to filter the displacement of the slide bar in the beam direction.

[0011] In some embodiments, the adapter assembly also includes a sealing structure, which includes a sealing seat and a bellows. A shoulder is provided at the end of the slide rod away from the adapter block. The two ends of the bellows are respectively connected to the sealing seat and the shoulder. The driving assembly drives the slide rod to move back and forth through the adapter block, and the slide rod drives the bellows to extend or shorten through the shoulder.

[0012] In some embodiments, the detector protection mechanism also includes a mounting frame, through which the protection plate is connected to the driving assembly, the mounting frame includes a spacer portion extending along the beam direction and a supporting portion parallel to the protection plate, the protection plate is detachably connected to the supporting portion, and the supporting portion is detachably connected to the driving assembly through the spacer portion.

[0013] In some embodiments, the protective plate includes a shielding portion and a mounting portion, the through hole is opened in the shielding portion, the shielding portion is arranged in a circular shape, the mounting portion is arranged around the circumference of the shielding portion, and the shielding portion is detachably connected to the supporting portion through the mounting portion.

[0014] In some embodiments, the mounting portion is provided with an avoidance gap, which is provided along the circumference of the mounting portion and the central angle corresponding to the avoidance gap is less than 180°, and the avoidance gap is located on a side of the mounting portion away from the spacing portion.

[0015] In a second aspect, an embodiment of the present application provides a detector protection mechanism, which is arranged between the detector and the object to be detected, and the detector protection mechanism includes:

[0016] a drive assembly having an output end movable in a first direction intersecting the electron beam path;

[0017] The protective plate is provided with a through hole for the electron beam to pass through. The protective plate is connected to the output end of the driving component. The driving component drives the protective plate to move in the positive direction of the first direction so that when the electron beam is emitted from the through hole to the object to be tested, the protective plate blocks the signal particles from being emitted to the detector; or the driving component drives the protective plate to move in the opposite direction of the first direction so that the protective plate is away from the movement path of the signal particles, thereby allowing the detector to receive the signal particles when the electron beam is emitted to the object to be tested.

[0018] The semiconductor detection equipment of the embodiment of the present application can be used for dimensional measurement or defect detection of semiconductor products. The semiconductor detection equipment is provided with a detector protection mechanism between the detector and the object to be tested, and the driving component can drive the protection plate to move to adapt to the working environment of different electron beams, so that a variety of electron beam detection can be completed in the same chamber, which helps to improve the integration of the equipment and control the detection cost, while improving the detection efficiency. Specifically, the protection plate can move in the positive direction of the first direction so that the electron beam is shot toward the object to be tested through the through hole and the signal particles reflected by the object to be tested are shot toward the protection plate, so as to prevent the detector from being bombarded; the protection plate can also move in the opposite direction of the first direction so that the small beam of electron beam is shot toward the object to be tested and the signal particles reflected by the object to be tested are shot toward the detector to achieve imaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0020] Figure 1 It is a schematic diagram of the working state of the semiconductor detection equipment of some embodiments of the present application, wherein the emission device emits a small beam of electron beam;

[0021] Figure 2 It is a schematic diagram of the working state of the semiconductor detection equipment of some embodiments of the present application, wherein the emission device emits a large beam current electron beam;

[0022] Figure 3 A schematic diagram of the structure of the detector protection mechanism of some embodiments of the present application;

[0023] Figure 4 for Figure 3 A schematic cross-sectional view of the detector protection mechanism shown;

[0024] Figure 5 for Figure 4 A schematic diagram of the structure of the adapter assembly and the sealing structure in the detector protection mechanism is shown.

[0025] The reference numerals in the specific implementation manner are as follows:

[0026] 100, transmitting device; 101, large beam current electron beam; 102, small beam current electron beam; 200, detector; 300, object to be tested;

[0027] 400, detector protection mechanism; 410, drive assembly; 411, drive motor; 412, adapter clamping block; 420, protection plate; 421, shielding portion; 4211, through hole; 422, mounting portion; 4221, avoidance gap; 430, mounting frame; 440, adapter assembly; 441, adapter block; 4411, partition; 4412, first positioning portion; 4413, second positioning portion; 442, slide bar; 4421, shoulder; 443, slide bar clamping block; 450, guide structure; 460, sealing structure; 461, sealing seat; 462, bellows; 470, fixing seat;

[0028] First direction X; first direction positive direction X 1 ; First direction opposite direction X 2 . DETAILED DESCRIPTION

[0029] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0031] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0032] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0034] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0035] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0036] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0037] For semiconductor products with high precision requirements, scanning imaging is involved many times during the processing, such as using a scanning electron microscope to achieve microscopic size measurement or surface defect detection of semiconductor products.

[0038] Taking a scanning electron microscope as an example, the imaging system generally uses a small beam to scan the wafer to obtain higher resolution images to meet the imaging accuracy requirements. However, small beam imaging still has defects such as low detection efficiency and poor signal-to-noise ratio that are difficult to overcome. In related technologies, some detection equipment is separately equipped with a large beam electron beam to obtain detection images with better contrast and clarity. The large beam electron beam generally does not need to be used in conjunction with a detector, and the signal particles reflected after the large beam electron beam bombards the wafer will damage the detector, resulting in defects such as reduced detector accuracy, which in turn affects the imaging accuracy under the small beam electron beam.

[0039] In this regard, some equipment is equipped with two different vacuum chambers to meet the separate operations of large beam current electron beam and small beam current electron beam. However, on the one hand, the design of two chambers directly leads to the large and redundant structure of the detection equipment, which increases the space requirements for the operation site; on the other hand, the wafer needs to be transferred between two different chambers to complete the detection operation, which greatly affects the detection efficiency and operation cost.

[0040] In order to solve the problems in the prior art, the embodiments of the present application provide a detector protection mechanism and a semiconductor detection device. The semiconductor detection device provided by the embodiments of the present application is first introduced below.

[0041] In a first aspect, the present application provides a semiconductor testing device, see Figures 1 to 3 The semiconductor detection device includes an emission device 100, a detector 200 and a detector protection mechanism.

[0042] 400, the emitting device 100 is used to emit electron beams of multiple beam currents, the detector 200 is located between the emitting device 100 and the object to be tested 300, and the detector 200 is used to receive signal particles of the small beam current electron beam 102 after being reflected by the object to be tested 300; the detector protection mechanism 400 is arranged between the detector 200 and the object to be tested 300, and the detector protection mechanism 400 includes a driving component 410 and a protection plate 420, and the driving component 410 is connected to the protection plate 420 to drive the protection plate 420 to be movably arranged along a first direction (for example, the X direction in the figure), and the first direction intersects with the path of the electron beam, and the protection plate 420 is also provided with a through hole 4211 for the electron beam to pass through.

[0043] The driving assembly 410 can drive the protective plate 420 to move in the positive direction of the first direction (eg, X in the figure). 1 The protection plate 420 can move in a direction opposite to the first direction (for example, X in the figure) so that when the electron beam is directed to the object to be tested 300, the protection plate 420 blocks the signal particles from being directed to the detector 200; or the driving component 410 can drive the protection plate 420 to move in a direction opposite to the first direction (for example, X in the figure) 2 direction) to keep the protection plate 420 away from the moving path of the signal particles, thereby allowing the detector 200 to receive the signal particles while the electron beam is irradiated toward the object to be tested 300.

[0044] Signal particles include secondary electrons and backscattered electrons, as well as other sample particles that may be excited during the electrical scanning process, such as scattered electrons, transmitted electrons, etc.

[0045] Optionally, the protection plate 420 moves closer to or away from the electron beam by rotating, and the first direction is the rotational direction of the protection plate 420 .

[0046] Optionally, the first direction and the beam direction are arranged at an angle greater than 0 and less than or equal to 90°, and the protective plate 420 moves in the positive direction of the first direction to block signal particles directed toward the detector 200 .

[0047] Further optionally, the first direction is set perpendicular to the beam direction. In other words, the driving component 410 drives the protective plate 420 to move back and forth in a direction perpendicular to the beam to prevent the signal particles reflected by the object to be tested 300 from bombarding the detector 200 or to allow the signal particles to be received by the detector 200, thereby reducing the movement range of the protective plate 420.

[0048] It can be understood that in addition to the above-mentioned possible first direction, in some embodiments, the driving component 410 can also drive the protective plate 420 to move in a combination of linear motion and rotational motion to get closer to or away from the electron beam, and this form of movement also falls within the scope of protection of the present application.

[0049] Optionally, in some embodiments, the emitting device includes a plurality of emitting units, and the plurality of emitting units are used to emit electron beams of a plurality of beam currents.

[0050] Optionally, in other embodiments, the emitting device is provided with an emitting unit capable of emitting electron beams of multiple beam currents.

[0051] For ease of understanding, the following embodiments are described by assuming that one emitting unit emits two electron beams with different beam current intensities, and the first direction is perpendicular to the beam direction, wherein the beam with higher beam current intensity is called a large beam current electron beam 101, and the beam with lower beam current intensity is called a small beam current electron beam 102.

[0052] Therefore, when the semiconductor detection equipment adopts a small-beam electron beam 102 for imaging, the driving component 410 drives the protective plate 420 to move in the opposite direction of the first direction, and the protective plate 420 retracts relative to the cavity wall to stay away from the movement path of the signal particles. The small-beam electron beam 102 is directly emitted to the object to be tested 300 and allows the signal particles reflected by the object to be tested 300 to be emitted to the detector 200 to achieve imaging; when the semiconductor detection equipment adopts a large-beam electron beam 101 for detection, the driving component 410 drives the protective plate 420 to move in the positive direction of the first direction, and the protective plate 420 extends relative to the cavity wall. The large-beam electron beam 101 passes through the through hole 4211 of the protective plate 420 and is emitted to the object to be tested 300 and the reflected signal particles are blocked by the protective plate 420 to prevent the detector 200 from being bombarded by the large-beam signal particles. By providing the detector protection mechanism 400, large-beam electron beam 101 detection and small-beam electron beam 102 detection can be completed in the same vacuum chamber, which not only saves the time for transferring the object to be tested 300 between different chambers and improves the operating efficiency of semiconductor product testing; it also improves the equipment integration and realizes multi-mode imaging detection without significantly increasing the equipment footprint.

[0053] See also Figures 3 to 5 According to some embodiments of the present application, the detector protection mechanism 400 also includes an adapter assembly 440, the adapter assembly 440 includes an adapter block 441 and a slide rod 442, the adapter block 441 is connected to the drive assembly 410, the slide rod 442 is connected to the protection plate 420, and the slide rod 442 and the output shaft of the drive assembly 410 are arranged on both sides of the adapter block 441 along the first direction.

[0054] Optionally, see Figure 5 The adapter block 441 has a partition 4411 and a first positioning portion 4412 and a second positioning portion 4413 arranged on both sides of the partition 4411 along the first direction. The driving component 410 is relatively fixed to the adapter block 441 through the partition 4411 and the first positioning portion 4412, and the sliding rod 442 is relatively fixed to the adapter block 441 through the partition 4411 and the second positioning portion 4413.

[0055] Thus, the output end of the driving component 410 pushes the adapter block 441 along the positive direction of the first direction, and then the adapter block 441 pushes the slide bar 442, and the slide bar 442 drives the protective plate 420 to move so that the protective plate 420 approaches the large beam current electron beam 101 to shield the signal particles emitted to the detector 200.

[0056] According to some embodiments of the present application, the output end of the driving assembly 410 and the axis direction of the sliding rod 442 are parallel to each other and are arranged at intervals in the beam direction.

[0057] Thus, the slide rod 442 is staggered with the driving assembly 410 through the adapter block 441, and the adapter block 441 can be used to adjust the relative relationship between the output direction of the driving assembly 410 and the moving direction of the protective plate 420 to improve the movement accuracy of the protective plate 420, thereby improving the alignment between the electron beam and the through hole 4211 of the protective plate 420, so that the detector protection mechanism 400 can meet the beam penetration requirements of the large beam current electron beam 101.

[0058] See also Figure 4 or Figure 5 According to some embodiments of the present application, the adapter assembly 440 includes a slide bar clamping block 443, and the slide bar 442 is clamped between the adapter block 441 and the slide bar clamping block 443 along the beam direction.

[0059] Specifically, see Figure 5 The slide bar 442 is clamped between the slide bar clamping block 443 and the first positioning portion 4412 along the beam direction. The slide bar clamping block 443 is detachably connected to the first positioning portion 4412 of the adapter block 441 to facilitate the installation or removal of the slide bar 442.

[0060] Optionally, the slide bar clamping block 443 and the adapter block 441 are connected by bolts to adjust the tightness of the connection between the slide bar clamping block 443 and the adapter block 441, thereby adjusting the movement consistency between the adapter block 441 and the slide bar 442.

[0061] Therefore, the adapter assembly 440 realizes a fixed connection between the adapter block 441 and the slide bar 442 through the slide bar clamping block 443, so as to improve the driving accuracy of the adapter block 441 for the slide bar 442 and the protective plate 420, which helps to improve the centering accuracy of the through hole 4211 of the protective plate 420 and the electron beam under a large beam current electron beam 101 and the shielding effect of the protective plate 420 on the signal particles.

[0062] According to some embodiments of the present application, the driving assembly 410 includes a driving motor 411 and an adapter clamping block 412, the output end of the driving motor 411 is clamped between the adapter clamping block 412 and the adapter block 441 along the beam direction, and the adapter clamping block 412 and the slide rod clamping block 443 are arranged on both sides of the adapter block 441 along the beam direction.

[0063] Specifically, see Figure 4 The output end of the driving motor 411 is clamped between the adapter clamping block 412 and the second positioning portion 4413 along the beam direction. The adapter clamping block 412 and the second positioning portion 4413 of the adapter block 441 are detachably connected to facilitate the installation or removal of the output end of the driving assembly 410.

[0064] Optionally, the adapter clamping block 412 is connected to the adapter block 441 by bolts to adjust the tightness of the connection between the adapter block 441 and the adapter clamping block 412, thereby adjusting the movement consistency between the output end of the drive component 410 and the adapter block 441.

[0065] Optionally, in some embodiments, the drive motor 411 is a linear motor, and the output end of the linear motor is clamped between the adapter clamping block 412 and the adapter block 441 along the beam direction. It can be understood that the stroke of the output end of the linear motor is consistent with the stroke of the protective plate 420, and the feeding accuracy of the linear motor can be adjusted according to actual use requirements.

[0066] Optionally, in other embodiments, the drive motor 411 is a stepper motor, and the output end of the stepper motor rotates to drive the slide bar 442 and the protective plate 420 to move along the first direction. It can be understood that in these embodiments, the adapter block 441 is used to convert the angular velocity of the stepper motor into the linear velocity of the slide bar 442. Exemplarily, the adapter block 441 is connected to the output end of the stepper motor through a worm gear mechanism, or the adapter block 441 is connected to the slide bar 442 through a worm gear mechanism.

[0067] Therefore, the output end of the drive motor 411, the adapter block 441 and the slide bar 442 are relatively fixed in the beam direction through the adapter clamping block 412 and the slide bar 443, so that the output end of the drive motor 411, the adapter block 441 and the slide bar 442 move synchronously in the first direction intersecting with the beam direction, thereby improving the centering accuracy of the through hole 4211 of the protective plate 420 and the shielding effect of the protective plate 420.

[0068] See also Figure 3 and Figure 4 The detector protection mechanism 400 further includes a guide structure 450 , which extends perpendicular to the beam direction and slidably cooperates with the slide bar 442 to filter the displacement of the slide bar 442 in the beam direction.

[0069] It can be understood that, in some embodiments, the first direction forms an angle with the extension direction of the guide structure 450, the output end of the driving assembly 410 moves back and forth along the first direction and drives the slide rod 442 to move perpendicular to the beam direction through the adapter block 441, and the guide structure 450 can limit the movement direction of the slide rod 442 and thus limit the movement direction of the protective plate 420.

[0070] Optionally, the guide structure 450 adopts a linear bearing, and the slide bar 442 is inserted into the linear bearing to limit the moving direction of the slide bar 442 and the protective plate 420 .

[0071] Optionally, the guide structure 450 is configured in the form of a guide block, and a guide groove extending along the first direction is correspondingly provided on the slide rod 442, and the guide block extends into the guide groove and slides in the guide groove.

[0072] Therefore, the guide structure 450 can limit the moving direction of the slide bar 442, thereby filtering the possible jump of the driving assembly 410 along the beam direction, so that the protective plate 420 and the object to be tested 300 maintain a fixed distance to improve the stability of the shielding effect of the protective plate 420 on signal particles.

[0073] According to some embodiments of the present application, the adapter assembly 440 further includes a sealing structure 460 .

[0074] Optionally, see Figure 4 or Figure 5 The sealing structure 460 includes a sealing seat 461 and a bellows 462. A shoulder 4421 is provided at the end of the slide rod 442 away from the adapter block 441. The two ends of the bellows 462 are respectively connected to the sealing seat 461 and the shoulder 4421. The driving component 410 drives the slide rod 442 to reciprocate through the adapter block 441, and the slide rod 442 drives the bellows 462 to extend or shorten through the shoulder 4421.

[0075] Further optionally, the bellows 462 can be folded or unfolded in the first direction to achieve a change in length, and then adapt to the reciprocating movement of the slide rod 442 in the first direction through its own telescoping.

[0076] Further optionally, the bellows 462 is configured as a multi-stage sleeve, which can be nested and slid in a first direction to achieve a length change, thereby accommodating the reciprocating movement of the slide rod 442 in the first direction.

[0077] Optionally, the sealing structure 460 includes a sealing seat and a blocking member, the blocking member is fixed by the sealing seat and slidably cooperates with the slide bar 442, and the blocking member is used to isolate the atmospheric environment and the vacuum environment on both sides. Exemplarily, the blocking member is set as an isolation valve.

[0078] Therefore, the detector protection mechanism 400 can achieve switching between the atmospheric environment and the vacuum environment through the sealing structure 460, so as to reduce the damage caused by the movement of the protection plate 420 to the vacuum working environment of the electron beam imaging chamber, and reduce the negative impact on the imaging accuracy and detection efficiency of the semiconductor detection equipment.

[0079] According to some embodiments of the present application, the detector protection mechanism 400 further includes a fixing seat 470, which is used to adjust the installation position of the detector protection mechanism 400 in the semiconductor testing device to avoid other components in the semiconductor testing device, thereby improving the integration of the semiconductor testing device. Figure 4 , the sealing seat 461 is connected to the fixing seat 470 .

[0080] See also Figure 3 or Figure 4 According to some embodiments of the present application, the detector protection mechanism 400 also includes a mounting frame 430, and the protection plate 420 is connected to the driving assembly 410 through the mounting frame 430. The mounting frame 430 includes a spacer portion extending along the beam direction and a supporting portion parallel to the protection plate 420. The protection plate 420 is installed on the supporting portion to connect to the driving assembly 410.

[0081] Optionally, the supporting portion is detachably connected to the driving assembly 410 through the spacer, so that the detector protection mechanism 400 can adjust the distance between the protection plate 420 and the object to be detected 300 in the beam direction by replacing the mounting frame 430, thereby adjusting the blocking range of the signal particles when the protection plate 420 is extended. Exemplarily, the supporting portion is detachably connected to the driving assembly 410 through a bolt connector.

[0082] Optionally, the protective plate 420 is detachably connected to the supporting portion, so that the protective plate 420 can be adjusted according to the detection requirements of wafers of different specifications to meet the use requirements of blocking signal particles from shooting toward the detector 200. Exemplarily, the protective plate 420 is detachably connected to the supporting portion by a bolt connector.

[0083] Therefore, the protective plate 420 improves the stability of the connection with the driving assembly 410 through the mounting bracket 430, and the mounting bracket 430 can adjust the spacing distance between the protective plate 420 and the object to be tested 300 in the beam direction, thereby adjusting the shielding effect of the protective plate 420 on the signal particles reflected by the object to be tested 300, so as to enhance the protection effect of the detector protection mechanism 400 on the detector 200.

[0084] See also Figure 3 According to some embodiments of the present application, the protective plate 420 includes a shielding portion 421 and a mounting portion 422, the through hole 4211 is opened in the shielding portion 421, and the mounting portion 422 is arranged around the circumference of the shielding portion 421, and the shielding portion 421 is detachably connected to the supporting portion through the mounting portion 422.

[0085] Optionally, the shielding portion 421 is set in a circular shape. It should be understood that the circle referred to here includes a perfect circle and a substantially circular shape, such as an elliptical shape. The range of signal particles reflected by a substantially circular wafer is also substantially circular, so setting the shielding portion 421 in a circular shape can block as many signal particles reflected by the object to be tested 300 from being emitted to the detector 200 as possible.

[0086] It can be understood that the through hole 4211 is opened at the center of the shielding portion 421 . When the driving component 410 drives the protective plate 420 to extend, the shielding portion 421 is coaxial with the electron beam so that the large beam current electron beam 101 can pass through the through hole 4211 and shoot toward the object 300 to be tested.

[0087] Further optionally, the radius of the shielding portion 421 is greater than the radius of the wafer to be measured, or the radius of the shielding portion 421 is equal to the radius of the wafer to be measured.

[0088] Further optionally, the mounting portion 422 is annularly arranged outside the shielding portion 421 , so that the shielding portion 421 is exposed toward a side of the object to be detected 300 and is used to block signal particles from being emitted to the detector 200 .

[0089] Further optionally, the shielding portion 421 is coated with a conductive coating on one side facing the object to be tested 300 to improve the absorption of signal particles, such as backscattered electrons or secondary electrons, so as to reduce the signal particles from repeatedly moving between the protective plate 420 and the object to be tested 300 and damaging the object to be tested 300. Exemplarily, the conductive coating is a metal coating, or the conductive coating is made of a carbon fiber composite material.

[0090] Optionally, the mounting portion 422 is connected to the supporting portion via bolts.

[0091] Therefore, the constraint plate can be replaced individually through the mounting portion 422 to meet the detection requirements of wafers of different specifications. At the same time, the mounting portion 422 can supplement the shielding portion 421 to further block the signal particles reflected by the wafer to be tested, thereby improving the protection effect of the detector 200.

[0092] See also Figure 3 According to some embodiments of the present application, the mounting portion 422 is provided with an avoidance notch 4221 , which is provided along the circumference of the mounting portion 422 and is disposed on a side of the mounting portion 422 away from the spacing portion.

[0093] Optionally, the avoidance notch 4221 is arranged to penetrate along the radial direction of the mounting portion 422 to further shorten the moving stroke of the protective plate 420 in the first direction.

[0094] Optionally, the central angle corresponding to the avoidance gap 4221 is set to be less than or equal to 180° to reduce the probability of signal particles being emitted from the avoidance gap 4221 to the detector 200. Exemplarily, the central angle corresponding to the avoidance gap 4221 is one of 60°, 90°, 120°, and 150°.

[0095] Further optionally, the central angle corresponding to the avoidance gap 4221 is set to be greater than or equal to 45°.

[0096] Therefore, the opening of the avoidance gap 4221 can shorten the moving distance of the protective plate 420 in the first direction, thereby reducing the space occupied by the protective structure of the detector 200 in the radial direction of the electron beam, which is beneficial to reducing the chamber space to control the overall volume and floor space of the detection equipment and expand the application scenarios of the detection equipment.

[0097] Second, see Figures 3 to 5 The embodiment of the present application provides a detector protection mechanism 400, which is arranged between the detector 200 and the object to be tested 300. The detector protection mechanism 400 includes a driving component 410 and a protection plate 420. The driving component 410 has an output end that can move along a first direction intersecting with the beam direction. The protection plate 420 is provided with a through hole 4211 through which the electron beam can pass. The protection plate 420 is connected to the output end of the driving component 410. The driving component 410 drives the protection plate 420 to move along the positive direction of the first direction, so that when the electron beam is emitted from the through hole 4211 to the object to be tested 300, the protection plate 420 blocks the signal particles from being emitted to the detector 200; or, the driving component 410 drives the protection plate 420 to move along the reverse direction of the first direction, so that the protection plate 420 blocks the moving path of the signal particles, thereby allowing the signal particles to be received by the detector 200 while the electron beam is emitted to the object to be tested 300.

[0098] It is understandable that the detector protection mechanism 400 provided in the embodiment of the present application can be used not only in semiconductor detection equipment to shield signal particles directed toward the detector 200, but also in other semiconductor processing equipment to shield other substances reflected by the object to be tested 300. Exemplarily, the detector protection mechanism 400 can also be used in laser welding equipment to shield the object to be tested 300 from splashing caused by the welding laser being directed toward the object to be tested 300.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A semiconductor testing device, characterized in that: include: An emitting device (100) for emitting electron beams of various beam currents; A detector (200), the detector (200) being used to receive signal particles reflected by the object to be detected (300); A detector protection mechanism (400) is arranged between the detector (200) and the object to be detected (300), the detector protection mechanism (400) comprising a driving component (410) and a protection plate (420), the driving component (410) being connected to the protection plate (420) so as to drive the protection plate (420) to be movably arranged in a first direction intersecting with the electron beam path, the protection plate (420) being provided with a through hole (4211) capable of allowing the electron beam to pass through; The driving component (410) is capable of driving the protective plate (420) to move in a positive direction of the first direction, so that when the electron beam is emitted to the object to be tested (300), the protective plate (420) blocks the signal particles from being emitted to the detector (200); or, the driving component (410) is capable of driving the protective plate (420) to move in a reverse direction of the first direction, so that the protective plate (420) is away from the moving path of the signal particles, thereby allowing the detector (200) to receive the signal particles when the electron beam is emitted to the object to be tested (300).

2. The semiconductor testing device according to claim 1, characterized in that: The detector protection mechanism (400) also includes a conversion assembly (440), the conversion assembly (440) includes a conversion block (441) and a slide rod (442), the conversion block (441) is connected to the driving assembly (410), the slide rod (442) is connected to the protection plate (420), and the slide rod (442) and the output shaft of the driving assembly (410) are arranged on both sides of the conversion block (441) along the first direction.

3. The semiconductor testing device according to claim 2, characterized in that: The driving assembly (410) comprises a driving motor (411) and a switching clamping block (412); the output end of the driving motor (411) is clamped between the switching clamping block (412) and the switching block (441) along the beam direction; and the switching clamping block (412) and the switching block (441) are connected by bolts.

4. The semiconductor testing device according to claim 2, characterized in that: The adapter assembly (440) further comprises a slide bar clamping block (443), the slide bar (442) being clamped between the adapter block (441) and the slide bar clamping block (443) along the beam direction, and the adapter block (441) and the slide bar clamping block (443) being connected by bolts.

5. The semiconductor testing device according to claim 2, characterized in that: The detector protection mechanism (400) further comprises a guide structure (450) extending perpendicularly to the beam direction, wherein the guide structure (450) is sleeved on the slide bar (442) and slidably matched to filter the displacement of the slide bar (442) in the beam direction.

6. The semiconductor testing device according to claim 2, characterized in that: The adapter assembly (440) also includes a sealing structure (460), and the sealing structure (460) includes a sealing seat (461) and a bellows (462). The end of the slide rod (442) away from the adapter block (441) is provided with a shoulder (4421), and the two ends of the bellows (462) are respectively connected to the sealing seat (461) and the shoulder (4421). The driving assembly (410) drives the slide rod (442) to reciprocate through the adapter block (441), and the slide rod (442) drives the bellows (462) to extend or shorten through the shoulder (4421).

7. The semiconductor testing device according to claim 1, characterized in that: The detector protection mechanism (400) also includes a mounting frame (430), and the protection plate (420) is connected to the driving assembly (410) via the mounting frame (430), and the mounting frame (430) includes a spacer portion extending along the beam direction and a supporting portion parallel to the protection plate (420), and the protection plate (420) is detachably connected to the supporting portion, and the supporting portion is detachably connected to the driving assembly (410) via the spacer portion.

8. The semiconductor testing device according to claim 7, characterized in that: The protective plate (420) comprises a shielding portion (421) and a mounting portion (422); the through hole (4211) is provided in the shielding portion (421); the shielding portion (421) is arranged in a circular shape; the mounting portion (422) is arranged around the circumference of the shielding portion (421); and the shielding portion (421) is detachably connected to the supporting portion via the mounting portion (422).

9. The semiconductor testing device according to claim 8, characterized in that: The mounting portion (422) is provided with an avoidance notch (4221), the avoidance notch (4221) is provided along the circumference of the mounting portion (422) and the central angle corresponding to the avoidance notch (4221) is less than 180°, and the avoidance notch (4221) is located on a side of the mounting portion (422) away from the spacing portion.

10. A detector protection mechanism, characterized in that: Arranged between the detector (200) and the object to be detected (300), the detector protection mechanism (400) comprises: A drive assembly (410) having an output end movable in a first direction intersecting the electron beam path; A protective plate (420) is provided with a through hole (4211) through which the electron beam can pass. The protective plate (420) is connected to the output end of the driving component (410). The driving component (410) can drive the protective plate (420) to move in the positive direction of the first direction, so that when the electron beam is emitted from the through hole (4211) to the object to be detected (300), the protective plate (420) blocks the signal particles from being emitted to the detector (200); or, the driving component (410) can drive the protective plate (420) to move in the opposite direction of the first direction, so that the protective plate (420) is away from the movement path of the signal particles, thereby allowing the detector (200) to receive the signal particles when the electron beam is emitted to the object to be detected (300).

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