Detector protection mechanism and semiconductor testing equipment

Abstract

The present application discloses a detector protection mechanism and a semiconductor detection device, wherein the semiconductor detection device includes an emitting device, a detector and a detector protection mechanism, wherein the emitting device is used to emit electron beams of multiple beam currents; the detector is used to receive signal particles reflected by an object to be detected; the detector protection mechanism is arranged between the detector and the object to be detected, and the detector protection mechanism includes a driving component and a protection plate, wherein the driving component is connected to the protection plate to drive the protection plate to be movably arranged in a first direction intersecting with the electron beam path, and the protection plate is provided with a through hole for the electron beam to pass through; wherein the driving component can drive the protection plate to move in the positive direction of the first direction, and the electron beam is emitted to the object to be detected while the protection plate blocks the signal particles from being emitted to the detector; or, the driving component can drive the protection plate to move in the opposite direction of the first direction, and the electron beam is emitted to the object to be detected while the detector receives the signal particles.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor detection technology, and in particular relates to a detector protection mechanism and semiconductor detection equipment. Background Art

[0002] For semiconductor products with high precision requirements, such as wafers, electron beams are generally used to bombard the wafer surface to achieve imaging for dimensional measurement, defect detection, or other inspection operations.

[0003] Imaging systems typically use a small beam to scan wafers, acquiring higher-resolution images and enabling the detection of microscopic defects. However, small beams suffer from low detection efficiency and poor signal-to-noise ratio, which need improvement. Some related technologies offer the ability to generate both large and small beams to meet different inspection requirements.

[0004] Among them, small beams require detectors to receive reflected electrons to achieve imaging, while large beams do not require separate detectors to receive reflected electrons. Moreover, detectors, as high-precision components, usually cannot withstand the bombardment of large beams. Therefore, separate working chambers need to be set up and detection must be completed separately, which is not conducive to controlling detection costs and improving detection efficiency. Summary of the Invention

[0005] An embodiment of the present application provides a detector protection mechanism and a semiconductor detection device. The semiconductor detection device is provided with a detector protection mechanism. The detector protection mechanism can allow signal particles to be emitted toward the detector or block signal particles from being emitted toward the detector while the electron beam is emitted toward the object to be tested, so that electron beams with different beam intensities can be integrated in the same chamber for detection operations.

[0006] In a first aspect, an embodiment of the present application provides a semiconductor detection device, comprising an emitting device, a detector and a detector protection mechanism, wherein the emitting device is used to emit electron beams of multiple beam currents; the detector is used to receive signal particles reflected by the object to be tested; the detector protection mechanism is arranged between the detector and the object to be tested, and the detector protection mechanism includes a driving component and a protection plate, the driving component is connected to the protection plate to drive the protection plate to be movably set in a first direction intersecting with the electron beam path, and the protection plate is provided with a through hole for the electron beam to pass through; wherein the driving component can drive the protection plate to move in the positive direction of the first direction, so that when the electron beam is shot toward the object to be tested, the protection plate blocks the signal particles from being shot toward the detector; or, the driving component can drive the protection plate to move in the opposite direction of the first direction, so that the protection plate is away from the movement path of the signal particles, thereby allowing the detector to receive the signal particles while the electron beam is shot toward the object to be tested.

[0007] In some embodiments, the detector protection mechanism also includes an adapter assembly, the adapter assembly includes an adapter block and a sliding rod, the adapter block is connected to the drive assembly, the sliding rod is connected to the protective plate, and the output shaft of the sliding rod and the drive assembly are arranged on both sides of the adapter block along the first direction.

[0008] In some embodiments, the driving assembly includes a driving motor and an adapter clamping block, the output end of the driving motor is clamped between the adapter clamping block and the adapter block along the beam direction, and the adapter clamping block and the adapter block are connected by bolts.

[0009] In some embodiments, the adapter assembly further includes a slide rod clamping block, the slide rod is clamped between the adapter block and the slide rod clamping block along the beam direction, and the adapter block and the slide rod clamping block are connected by bolts.

[0010] In some embodiments, the detector protection mechanism further includes a guide structure extending perpendicular to the beam direction, the guide structure being sleeved on the slide bar and slidingly engaged to filter the displacement of the slide bar in the beam direction.

[0011] In some embodiments, the adapter assembly also includes a sealing structure, which includes a sealing seat and a bellows. A shoulder is provided at the end of the sliding rod away from the adapter block. The two ends of the bellows are respectively connected to the sealing seat and the shoulder. The driving assembly drives the sliding rod to move back and forth through the adapter block, and the sliding rod drives the bellows to extend or shorten through the shoulder.

[0012] In some embodiments, the detector protection mechanism also includes a mounting frame, the protective plate is connected to the driving assembly through the mounting frame, the mounting frame includes a spacer extending along the beam direction and a supporting portion parallel to the protective plate, the protective plate is detachably connected to the supporting portion, and the supporting portion is detachably connected to the driving assembly through the spacer portion.

[0013] In some embodiments, the protective plate includes a shielding portion and a mounting portion, the through hole is opened in the shielding portion, the shielding portion is arranged in a circular shape, the mounting portion is arranged around the circumference of the shielding portion, and the shielding portion is detachably connected to the supporting portion through the mounting portion.

[0014] In some embodiments, the mounting portion is provided with an avoidance notch, which is provided along the circumference of the mounting portion and has a central angle corresponding to the avoidance notch that is less than 180°. The avoidance notch is located on a side of the mounting portion away from the spacing portion.

[0015] In a second aspect, an embodiment of the present application provides a detector protection mechanism disposed between a detector and an object to be detected, the detector protection mechanism comprising:

[0016] a drive assembly having an output movable in a first direction intersecting the electron beam path;

[0017] The protective plate is provided with a through hole for the electron beam to pass through. The protective plate is connected to the output end of the driving component. The driving component drives the protective plate to move in the positive direction of the first direction so that when the electron beam is emitted from the through hole to the object to be tested, the protective plate blocks the signal particles from being emitted to the detector; alternatively, the driving component drives the protective plate to move in the opposite direction of the first direction so that the protective plate is away from the movement path of the signal particles, thereby allowing the detector to receive the signal particles while the electron beam is emitted to the object to be tested.

[0018] The semiconductor detection equipment of the embodiment of the present application can be used for dimensional measurement or defect detection of semiconductor products. The semiconductor detection equipment is provided with a detector protection mechanism between the detector and the object to be tested, and the driving component can drive the protection plate to move to adapt to the working environment of different electron beams, so that a variety of electron beam detection can be completed in the same chamber, which helps to improve the integration of the equipment and control the detection cost, while improving the detection efficiency. Specifically, the protection plate can move in the positive direction of the first direction so that the electron beam is shot toward the object to be tested through the through hole and the signal particles reflected by the object to be tested are shot toward the protection plate, thereby preventing the detector from being bombarded; the protection plate can also move in the opposite direction of the first direction so that the small beam of electron beam is shot toward the object to be tested and the signal particles reflected by the object to be tested are shot toward the detector to achieve imaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0020] Figure 1 This is a schematic diagram of the working state of a semiconductor inspection device according to some embodiments of the present application, wherein the emitting device emits a small electron beam;

[0021] Figure 2 This is a schematic diagram of the working state of a semiconductor inspection device according to some embodiments of the present application, wherein the emitting device emits a large-current electron beam;

[0022] Figure 3 This is a schematic diagram of the structure of the detector protection mechanism in some embodiments of the present application;

[0023] Figure 4 for Figure 3 A schematic cross-sectional view of the detector protection mechanism shown;

[0024] Figure 5 for Figure 4 Schematic diagram of the structure of the adapter component and sealing structure in the detector protection mechanism shown.

[0025] The accompanying drawings in the specific implementation manner are as follows:

[0026] 100, transmitter; 101, high-current electron beam; 102, low-current electron beam; 200, detector; 300, object to be tested;

[0027] 400, detector protection mechanism; 410, drive assembly; 411, drive motor; 412, adapter clamping block; 420, protective plate; 421, shielding portion; 4211, through hole; 422, mounting portion; 4221, avoidance gap; 430, mounting bracket; 440, adapter assembly; 441, adapter block; 4411, partition; 4412, first positioning portion; 4413, second positioning portion; 442, slide bar; 4421, shoulder; 443, slide bar clamping block; 450, guide structure; 460, sealing structure; 461, sealing seat; 462, bellows; 470, fixing seat;

[0028] The first direction X; the positive direction of the first direction X1; the negative direction of the first direction X2. DETAILED DESCRIPTION

[0029] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0031] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0032] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0034] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0035] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0036] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0037] For semiconductor products with high precision requirements, scanning imaging is involved many times during the processing, such as using a scanning electron microscope to achieve micro-dimensional measurement or surface defect detection of semiconductor products.

[0038] Taking a scanning electron microscope as an example, the imaging system generally uses a small beam to scan the wafer to obtain higher-resolution images to meet the imaging accuracy requirements. However, small-beam imaging still has defects such as low detection efficiency and poor signal-to-noise ratio that are difficult to overcome. In related technologies, some detection equipment is separately equipped with a large-beam electron beam to obtain detection images with better contrast and clarity. Large-beam electron beams generally do not need to be used in conjunction with detectors, and the signal particles reflected after the large-beam electron beam bombards the wafer can damage the detector, resulting in defects such as reduced detector accuracy, which in turn affects the imaging accuracy of the small-beam electron beam.

[0039] To address this, some equipment is equipped with two separate vacuum chambers to accommodate separate operations for high- and low-current electron beams. However, this dual-chamber design leads to bulky and redundant inspection equipment, increasing the space required for the workspace. Furthermore, wafers must be transferred between the two chambers to complete inspection, significantly impacting inspection efficiency and operating costs.

[0040] In order to solve the problems of the prior art, the embodiments of the present application provide a detector protection mechanism and a semiconductor detection device. The semiconductor detection device provided by the embodiments of the present application is first introduced below.

[0041] In the first aspect, the present invention provides a semiconductor testing device. Figures 1 to 3 The semiconductor testing device includes an emitting device 100, a detector 200 and a detector protection mechanism.

[0042] 400, the emitting device 100 is used to emit electron beams of multiple beam currents, the detector 200 is located between the emitting device 100 and the object to be tested 300, and the detector 200 is used to receive signal particles of the small beam electron beam 102 after being reflected by the object to be tested 300; the detector protection mechanism 400 is set between the detector 200 and the object to be tested 300, and the detector protection mechanism 400 includes a driving component 410 and a protection plate 420. The driving component 410 is connected to the protection plate 420 to drive the protection plate 420 to be movably set along a first direction (for example, the X direction in the figure), and the first direction intersects with the path of the electron beam. The protection plate 420 also has a through hole 4211 for the electron beam to pass through.

[0043] In which, the driving component 410 can drive the protective plate 420 to move in the positive direction of the first direction (for example, the X1 direction in the figure) so that when the electron beam is emitted to the object to be tested 300, the protective plate 420 blocks the signal particles from being emitted to the detector 200; or, the driving component 410 can drive the protective plate 420 to move in the opposite direction of the first direction (for example, the X2 direction in the figure) so that the protective plate 420 is away from the movement path of the signal particles, thereby allowing the detector 200 to receive signal particles while the electron beam is emitted to the object to be tested 300.

[0044] Signal particles include secondary electrons and backscattered electrons, as well as other sample particles that may be excited during the electrical scanning process, such as scattered electrons, transmitted electrons, etc.

[0045] Optionally, the protective plate 420 moves closer to or away from the electron beam by rotating, and the first direction is the rotational direction of the protective plate 420 .

[0046] Optionally, the first direction is set to form an angle greater than 0 and less than or equal to 90° with the beam direction, and the protection plate 420 moves in the positive direction of the first direction to block the signal particles emitted to the detector 200.

[0047] Further optionally, the first direction is set perpendicular to the beam direction. In other words, the drive assembly 410 drives the protective plate 420 to move back and forth in a direction perpendicular to the beam to prevent signal particles reflected by the object to be tested 300 from bombarding the detector 200 or to allow the signal particles to be received by the detector 200, thereby reducing the movement range of the protective plate 420.

[0048] It can be understood that in addition to the possible first direction mentioned above, in some embodiments, the drive component 410 can also drive the protective plate 420 to move in a combination of linear motion and rotational motion to move closer to or away from the electron beam, and this form of movement also falls within the scope of protection of this application.

[0049] Optionally, in some embodiments, the emitting device includes a plurality of emitting units, and the plurality of emitting units are used to emit electron beams of multiple beam currents.

[0050] Optionally, in other embodiments, the emitting device is provided with an emitting unit capable of emitting electron beams of multiple beam currents.

[0051] For ease of understanding, the following embodiments are described by assuming that one emitting unit emits two electron beams with different beam intensities, and the first direction is perpendicular to the beam direction. The beam with higher beam intensity is called a large beam electron beam 101, and the beam with lower beam intensity is called a small beam electron beam 102.

[0052] Therefore, when the semiconductor detection equipment adopts a small-beam electron beam 102 for imaging, the driving component 410 drives the protective plate 420 to move in the opposite direction of the first direction, and the protective plate 420 retracts relative to the cavity wall to stay away from the movement path of the signal particles. The small-beam electron beam 102 is directly shot at the object to be tested 300 and allows the signal particles reflected by the object to be tested 300 to be shot at the detector 200 to achieve imaging; when the semiconductor detection equipment adopts a large-beam electron beam 101 for detection, the driving component 410 drives the protective plate 420 to move in the positive direction of the first direction, and the protective plate 420 extends relative to the cavity wall. The large-beam electron beam 101 passes through the through hole 4211 of the protective plate 420 and is shot at the object to be tested 300, and the reflected signal particles are blocked by the protective plate 420 to prevent the detector 200 from being bombarded by the large-beam signal particles. By setting up the detector protection mechanism 400, the large-beam electron beam 101 detection and the small-beam electron beam 102 detection can be completed in the same vacuum chamber, which not only saves the time of transferring the object to be tested 300 between different chambers and improves the operational efficiency of semiconductor product testing; but also improves the equipment integration and realizes multi-mode imaging detection without significantly increasing the equipment footprint.

[0053] See also Figures 3 to 5 According to some embodiments of the present application, the detector protection mechanism 400 also includes an adapter assembly 440, the adapter assembly 440 includes an adapter block 441 and a slide rod 442, the adapter block 441 is connected to the drive assembly 410, the slide rod 442 is connected to the protective plate 420, and the slide rod 442 and the output shaft of the drive assembly 410 are arranged on both sides of the adapter block 441 along the first direction.

[0054] Optionally, see Figure 5 The adapter block 441 has a partition 4411 and a first positioning portion 4412 and a second positioning portion 4413 arranged on both sides of the partition 4411 along the first direction. The driving component 410 is relatively fixed to the adapter block 441 through the partition 4411 and the first positioning portion 4412, and the sliding rod 442 is relatively fixed to the adapter block 441 through the partition 4411 and the second positioning portion 4413.

[0055] Thus, the output end of the driving component 410 pushes the adapter block 441 along the positive direction of the first direction, and then the adapter block 441 pushes the slide bar 442, and the slide bar 442 drives the protective plate 420 to move so that the protective plate 420 approaches the large beam electron beam 101 to shield the signal particles emitted to the detector 200.

[0056] According to some embodiments of the present application, the output end of the driving assembly 410 and the axis direction of the sliding rod 442 are parallel to each other and are spaced apart in the beam direction.

[0057] Therefore, the slide rod 442 is staggered with the driving assembly 410 through the adapter block 441, and the adapter block 441 can be used to adjust the relative relationship between the output direction of the driving assembly 410 and the moving direction of the protective plate 420 to improve the movement accuracy of the protective plate 420, thereby improving the alignment of the electron beam and the through hole 4211 of the protective plate 420, so that the detector protection mechanism 400 can meet the beam penetration requirements of the large beam current electron beam 101.

[0058] See also Figure 4 or Figure 5 According to some embodiments of the present application, the adapter assembly 440 includes a slide rod clamping block 443, and the slide rod 442 is clamped between the adapter block 441 and the slide rod clamping block 443 along the beam direction.

[0059] Specifically, see Figure 5 The sliding rod 442 is clamped between the sliding rod clamping block 443 and the first positioning portion 4412 along the beam direction. The sliding rod clamping block 443 is detachably connected to the first positioning portion 4412 of the adapter block 441 to facilitate the installation or removal of the sliding rod 442.

[0060] Optionally, the slide bar clamping block 443 and the adapter block 441 are connected by bolts to facilitate adjustment of the tightness of the connection between the slide bar clamping block 443 and the adapter block 441 , thereby adjusting the movement consistency between the adapter block 441 and the slide bar 442 .

[0061] Therefore, the adapter assembly 440 realizes a fixed connection between the adapter block 441 and the slide bar 442 through the slide bar clamping block 443, so as to improve the driving accuracy of the adapter block 441 for the slide bar 442 and the protective plate 420, which helps to improve the centering accuracy of the through hole 4211 of the protective plate 420 and the electron beam under the large beam current electron beam 101 and the shielding effect of the protective plate 420 on the signal particles.

[0062] According to some embodiments of the present application, the driving assembly 410 includes a driving motor 411 and a switching clamping block 412. The output end of the driving motor 411 is clamped between the switching clamping block 412 and the switching block 441 along the beam direction. The switching clamping block 412 and the slide rod clamping block 443 are arranged on both sides of the switching block 441 along the beam direction.

[0063] Specifically, see Figure 4 The output end of the driving motor 411 is clamped between the adapter clamping block 412 and the second positioning portion 4413 along the beam direction. The adapter clamping block 412 and the second positioning portion 4413 of the adapter block 441 are detachably connected to facilitate the installation or removal of the output end of the driving assembly 410.

[0064] Optionally, the adapter clamping block 412 and the adapter block 441 are connected by bolts to facilitate adjustment of the tightness of the connection between the adapter block 441 and the adapter clamping block 412, thereby adjusting the movement consistency between the output end of the drive assembly 410 and the adapter block 441.

[0065] Optionally, in some embodiments, the drive motor 411 is a linear motor, and the output end of the linear motor is clamped along the beam direction between the adapter clamping block 412 and the adapter block 441. It is understood that the stroke of the output end of the linear motor is consistent with the stroke of the protective plate 420, and the feed accuracy of the linear motor can be adjusted according to actual usage requirements.

[0066] Alternatively, in some other embodiments, the drive motor 411 is a stepper motor, and the output end of the stepper motor rotates to drive the slide bar 442 and the protective plate 420 to move in the first direction. It will be appreciated that in these embodiments, the adapter block 441 is used to convert the angular velocity of the stepper motor into the linear velocity of the slide bar 442. Exemplarily, the adapter block 441 is connected to the output end of the stepper motor via a worm gear mechanism, or the adapter block 441 is connected to the slide bar 442 via a worm gear mechanism.

[0067] Therefore, the output end of the drive motor 411, the adapter block 441 and the slide bar 442 are relatively fixed in the beam direction through the adapter clamping block 412 and the slide bar 443, so that the output end of the drive motor 411, the adapter block 441 and the slide bar 442 move synchronously in the first direction intersecting with the beam direction, thereby improving the centering accuracy of the through hole 4211 of the protective plate 420 and the shielding effect of the protective plate 420.

[0068] See also Figure 3 and Figure 4 The detector protection mechanism 400 further includes a guide structure 450 , which extends perpendicular to the beam direction and slidably cooperates with the slide bar 442 to filter the displacement of the slide bar 442 in the beam direction.

[0069] It can be understood that in some embodiments, the first direction forms an angle with the extension direction of the guide structure 450, the output end of the driving assembly 410 moves back and forth along the first direction and drives the slide rod 442 to move perpendicular to the beam direction through the adapter block 441, and the guide structure 450 can limit the movement direction of the slide rod 442 and thus limit the movement direction of the protective plate 420.

[0070] Optionally, the guide structure 450 adopts a linear bearing, and the sliding rod 442 is passed through the linear bearing to limit the moving direction of the sliding rod 442 and the protective plate 420.

[0071] Optionally, the guide structure 450 is configured as a guide block, and a guide groove extending along the first direction is correspondingly provided on the slide rod 442 , and the guide block extends into the guide groove and slides in the guide groove.

[0072] Therefore, the guide structure 450 can limit the moving direction of the slide bar 442, thereby filtering the possible jump of the driving component 410 along the beam direction, so that the protective plate 420 maintains a fixed distance from the object to be tested 300 to improve the stability of the protective plate 420's shielding effect on signal particles.

[0073] According to some embodiments of the present application, the adapter assembly 440 further includes a sealing structure 460 .

[0074] Optionally, see Figure 4 or Figure 5 The sealing structure 460 includes a sealing seat 461 and a bellows 462. The end of the sliding rod 442 away from the adapter block 441 is provided with a shoulder 4421. The two ends of the bellows 462 are respectively connected to the sealing seat 461 and the shoulder 4421. The driving component 410 drives the sliding rod 442 to move back and forth through the adapter block 441, and the sliding rod 442 drives the bellows 462 to extend or shorten through the shoulder 4421.

[0075] Further optionally, the bellows 462 can be folded or unfolded in the first direction to achieve a change in length, and then adapt to the reciprocating movement of the slide rod 442 in the first direction through its own expansion and contraction.

[0076] Further optionally, the bellows 462 is configured as a multi-stage sleeve, which can be nested and slid in the first direction to achieve length changes, thereby accommodating the reciprocating movement of the slide rod 442 in the first direction.

[0077] Optionally, the sealing structure 460 includes a sealing seat and a blocking member, wherein the blocking member is fixed by the sealing seat and slidably cooperates with the slide rod 442, and the blocking member is used to isolate the atmospheric environment and the vacuum environment on both sides.

[0078] Therefore, the detector protection mechanism 400 can achieve switching between the atmospheric environment and the vacuum environment through the sealing structure 460, so as to reduce the damage caused by the movement of the protection plate 420 to the vacuum working environment of the electron beam imaging chamber, and reduce the negative impact on the imaging accuracy and detection efficiency of the semiconductor detection equipment.

[0079] According to some embodiments of the present application, the detector protection mechanism 400 further includes a fixing base 470, which is used to adjust the installation position of the detector protection mechanism 400 in the semiconductor testing equipment to avoid other components in the semiconductor testing equipment, thereby improving the integration of the semiconductor testing equipment. Figure 4 , the sealing seat 461 is connected to the fixing seat 470 .

[0080] See also Figure 3 or Figure 4 According to some embodiments of the present application, the detector protection mechanism 400 also includes a mounting bracket 430, and the protective plate 420 is connected to the driving assembly 410 through the mounting bracket 430. The mounting bracket 430 includes a spacer extending along the beam direction and a supporting portion parallel to the protective plate 420. The protective plate 420 is installed on the supporting portion to connect to the driving assembly 410.

[0081] Optionally, the support portion is detachably connected to the drive assembly 410 via a spacer, so that the detector protection mechanism 400 can adjust the distance between the protection plate 420 and the object under test 300 in the beam direction by replacing the mounting bracket 430, thereby adjusting the blocking range of signal particles by the protection plate 420 when extended. Exemplarily, the support portion is detachably connected to the drive assembly 410 via a bolted connection.

[0082] Optionally, the protective plate 420 is detachably connected to the supporting portion, so that the protective plate 420 can be adjusted according to the detection requirements of wafers of different specifications to meet the use requirements of blocking signal particles from being emitted to the detector 200. Exemplarily, the protective plate 420 is detachably connected to the supporting portion by a bolt connection.

[0083] Therefore, the protective plate 420 improves the stability of the connection with the driving assembly 410 through the mounting bracket 430. The mounting bracket 430 can adjust the spacing distance between the protective plate 420 and the object to be tested 300 in the beam direction, thereby adjusting the shielding effect of the protective plate 420 on the signal particles reflected by the object to be tested 300, so as to enhance the protection effect of the detector protection mechanism 400 on the detector 200.

[0084] See also Figure 3 According to some embodiments of the present application, the protective plate 420 includes a shielding portion 421 and a mounting portion 422, the through hole 4211 is opened in the shielding portion 421, and the mounting portion 422 is arranged around the circumference of the shielding portion 421, and the shielding portion 421 is detachably connected to the supporting portion through the mounting portion 422.

[0085] Optionally, the shielding portion 421 is circular. It should be understood that the term "circular" herein includes both a true circle and a substantially circular shape, such as an ellipse. The range of signal particles reflected by a substantially circular wafer is also substantially circular. Therefore, configuring the shielding portion 421 in a circular shape can minimize the amount of signal particles reflected by the object under test 300 from reaching the detector 200.

[0086] It can be understood that the through hole 4211 is opened at the center of the shielding portion 421. When the driving component 410 drives the protective plate 420 to extend, the shielding portion 421 is coaxial with the electron beam so that the large beam current electron beam 101 can pass through the through hole 4211 and be emitted to the object to be tested 300.

[0087] Further optionally, the radius of the shielding portion 421 is greater than the radius of the wafer to be measured, or the radius of the shielding portion 421 is equal to the radius of the wafer to be measured.

[0088] Further optionally, the mounting portion 422 is annularly arranged outside the shielding portion 421 , so that the shielding portion 421 is exposed toward a side of the object to be tested 300 and is used to block signal particles from being emitted to the detector 200 .

[0089] Further optionally, the side of the shielding portion 421 facing the object under test 300 is coated with a conductive coating to enhance absorption of signal particles, such as backscattered electrons or secondary electrons, thereby reducing the risk of signal particles repeatedly moving between the protective plate 420 and the object under test 300 and damaging the object under test 300. Exemplarily, the conductive coating is a metal coating, or the conductive coating is made of a carbon fiber composite material.

[0090] Optionally, the mounting portion 422 is connected to the supporting portion via bolts.

[0091] Therefore, the constraint plate can be replaced individually through the mounting portion 422 to meet the detection requirements of wafers of different specifications. At the same time, the mounting portion 422 can supplement the shielding portion 421 to further block the signal particles reflected by the wafer to be tested, thereby improving the protection effect of the detector 200.

[0092] See also Figure 3 According to some embodiments of the present application, the mounting portion 422 is provided with an avoidance notch 4221 , which is provided along the circumference of the mounting portion 422 and is disposed on a side of the mounting portion 422 away from the spacer portion.

[0093] Optionally, the avoidance notch 4221 is provided along the radial direction of the mounting portion 422 to further shorten the movement stroke of the protective plate 420 in the first direction.

[0094] Optionally, the central angle of the avoidance gap 4221 is set to be less than or equal to 180° to reduce the probability of signal particles being emitted from the avoidance gap 4221 to the detector 200. Exemplarily, the central angle of the avoidance gap 4221 is one of 60°, 90°, 120°, and 150°.

[0095] Further optionally, the central angle corresponding to the avoidance gap 4221 is set to be greater than or equal to 45°.

[0096] Therefore, the opening of the avoidance gap 4221 can shorten the moving distance of the protective plate 420 in the first direction, thereby reducing the space occupied by the protective structure of the detector 200 in the radial direction of the electron beam, which is conducive to reducing the chamber space to control the overall volume and floor space of the detection equipment, and expand the application scenarios of the detection equipment.

[0097] Second, see Figures 3 to 5 The embodiment of the present application provides a detector protection mechanism 400, which is disposed between the detector 200 and the object to be tested 300. The detector protection mechanism 400 includes a drive assembly 410 and a protection plate 420. The drive assembly 410 has an output end that can move along a first direction intersecting the beam direction. The protection plate 420 defines a through hole 4211 through which the electron beam can pass. The protection plate 420 is connected to the output end of the drive assembly 410. The drive assembly 410 drives the protection plate 420 to move in the positive direction of the first direction so that when the electron beam is emitted from the through hole 4211 toward the object to be tested 300, the protection plate 420 blocks signal particles from being emitted toward the detector 200. Alternatively, the drive assembly 410 drives the protection plate 420 to move in the opposite direction of the first direction so that the protection plate 420 blocks the movement path of the signal particles, thereby allowing the electron beam to be emitted toward the object to be tested 300 while the detector 200 receives signal particles.

[0098] It is understood that the detector protection mechanism 400 provided in the embodiments of the present application can be used not only in semiconductor testing equipment to shield signal particles directed toward the detector 200, but is also applicable to other semiconductor processing equipment to shield other materials reflected by the object under test 300. For example, the detector protection mechanism 400 can also be used in laser welding equipment to shield the object under test 300 from spatter caused by the welding laser being directed toward the object under test 300.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A semiconductor testing device, characterized in that: include: An emitting device (100) for emitting electron beams of various beam currents; A detector (200), the detector (200) being used to receive signal particles reflected by the object to be detected (300); A detector protection mechanism (400) is provided between the detector (200) and the object to be detected (300), the detector protection mechanism (400) comprising a driving assembly (410), a mounting frame (430) and a protection plate (420), the protection plate (420) being connected to the driving assembly (410) via the mounting frame (430), the driving assembly (410) being connected to the protection plate (420) so as to drive the protection plate (420) to be movably arranged in a first direction intersecting with the electron beam path, the protection plate (420) being provided with a through hole (4211) capable of allowing the electron beam to pass through, the protection plate (420) comprising a shielding portion (421) and a mounting portion (422), the through hole (4211) being provided in the shielding portion (421), the shielding portion (421) being detachably connected to the mounting frame (430) via the mounting portion (422); The driving component (410) is capable of driving the protective plate (420) to move in a positive direction of a first direction, so that when the electron beam is projected toward the object to be tested (300), the protective plate (420) blocks the signal particles from being projected toward the detector (200); or, the driving component (410) is capable of driving the protective plate (420) to move in a reverse direction of the first direction, so that the protective plate (420) is away from the movement path of the signal particles, thereby allowing the detector (200) to receive the signal particles when the electron beam is projected toward the object to be tested (300).

2. The semiconductor testing device according to claim 1, wherein: The detector protection mechanism (400) further includes a transfer assembly (440), the transfer assembly (440) including a transfer block (441) and a slide bar (442), the transfer block (441) being connected to the drive assembly (410), the slide bar (442) being connected to the protection plate (420), and the slide bar (442) and the output shaft of the drive assembly (410) being arranged on both sides of the transfer block (441) along the first direction.

3. The semiconductor testing device according to claim 2, wherein: The driving assembly (410) comprises a driving motor (411) and a switching and clamping block (412); the output end of the driving motor (411) is clamped between the switching and clamping block (412) and the switching block (441) along the beam direction; and the switching and clamping block (412) and the switching block (441) are connected by bolts.

4. The semiconductor testing device according to claim 2, wherein: The adapter assembly (440) further includes a slide bar clamping block (443), the slide bar (442) is clamped between the adapter block (441) and the slide bar clamping block (443) along the beam direction, and the adapter block (441) and the slide bar clamping block (443) are connected by bolts.

5. The semiconductor testing device according to claim 2, wherein: The detector protection mechanism (400) further includes a guide structure (450) extending perpendicular to the beam direction. The guide structure (450) is sleeved on the slide bar (442) and slidably matched to filter the displacement of the slide bar (442) in the beam direction.

6. The semiconductor testing device according to claim 2, wherein: The adapter assembly (440) also includes a sealing structure (460), which includes a sealing seat (461) and a bellows (462). The end of the slide rod (442) away from the adapter block (441) is provided with a shoulder (4421), and the two ends of the bellows (462) are respectively connected to the sealing seat (461) and the shoulder (4421). The driving assembly (410) drives the slide rod (442) to move back and forth through the adapter block (441), and the slide rod (442) drives the bellows (462) to extend or shorten through the shoulder (4421).

7. The semiconductor testing device according to claim 1, wherein: The mounting frame (430) includes a spacer portion extending along the beam direction and a supporting portion parallel to the protective plate (420); the protective plate (420) is detachably connected to the supporting portion; and the supporting portion is detachably connected to the driving assembly (410) via the spacer portion.

8. The semiconductor testing device according to claim 7, wherein: The shielding portion (421) is arranged in a circular shape, and the mounting portion (422) is arranged around the circumference of the shielding portion (421).

9. The semiconductor testing device according to claim 8, wherein: The mounting portion (422) is provided with an avoidance notch (4221), the avoidance notch (4221) is provided along the circumference of the mounting portion (422) and the central angle corresponding to the avoidance notch (4221) is less than 180°, and the avoidance notch (4221) is located on a side of the mounting portion (422) away from the spacer portion.

10. A detector protection mechanism, characterized in that: Arranged between the detector (200) and the object to be detected (300), the detector protection mechanism (400) comprises: a drive assembly (410) having an output end movable in a first direction intersecting the electron beam path; A protective plate (420) is provided with a through hole (4211) capable of allowing the electron beam to pass through, the protective plate (420) being connected to the output end of the driving component (410), and the driving component (410) being capable of driving the protective plate (420) to move in a positive direction of the first direction, so that when the electron beam is emitted from the through hole (4211) toward the object to be tested (300), the protective plate (420) blocks the signal particles from being emitted toward the detector (200); or, the driving component (410) is capable of driving the protective plate (420) to move in a reverse direction of the first direction, so that the protective plate (420) is away from the motion path of the signal particles, thereby allowing the detector (200) to receive the signal particles when the electron beam is emitted toward the object to be tested (300); a mounting frame (430), wherein the protective plate (420) is connected to the driving assembly (410) via the mounting frame (430); The protective plate (420) comprises a shielding portion (421) and a mounting portion (422), the through hole (4211) is opened in the shielding portion (421), and the shielding portion (421) is detachably connected to the mounting frame (430) via the mounting portion (422).

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