Uncovering process, rigid-flex board production process and rigid-flex board
By pre-opening the flexible substrate layer and filling the adhesive with the combined laser cutting technology, the problem of waste residue during the uncovering of the soft and hard-to-use board is solved, achieving a more efficient production process and lower labor costs.
Patent Information
- Application Number
- CN202510094819.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2025-04-25
AI Technical Summary
In the prior art, the soft and hard bonding plate produces more waste residues during the uncovering process, especially in narrow areas, which are difficult to remove, resulting in product damage, and increase labor costs and reduce production efficiency.
The flexible substrate layer is pre-windowed by a laser to form a first window, and a adhesive is filled between the intermediate layer and the flexible substrate layer, as well as between the flexible substrate layer and the soft plate layer, to form a soft and hard bonding plate through a press. Then, the second soft and hard bonding plate is cut and uncovered based on the first window to form a second window to ensure the accuracy of the uncover area and reduce the residual glue.
By increasing the area of the pre-opened window in the non-opened cover area, the overflow glue is prevented from adhering to theopened cover area during theopened cover operation, thereby reducing waste residue, reducing labor costs and improving production efficiency.
Smart Images
Figure CN119893850A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of printed circuit boards, and in particular to a cover-lifting process, a rigid-flexible board production process, and a rigid-flexible board. Background Art
[0002] In the prior art, there are a variety of methods for removing the covers of rigid-flex boards, but a large amount of waste residue will be generated during the removal process. In the traditional process, it is difficult to remove the residual waste in a narrow area, which may cause damage to the product. At the same time, the removal of the residual waste is usually done manually, which increases labor costs and reduces production efficiency. Summary of the invention
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a cover-lifting process, a rigid-flexible board production process and a rigid-flexible board, which can reduce or even avoid the residue of waste, thereby reducing labor costs and improving production efficiency.
[0004] The uncovering process of the first aspect of the present application includes:
[0005] Performing a pre-windowing operation on the flexible substrate layer by a laser to form a first window on the flexible substrate layer, wherein the flexible substrate layer includes a uncovering area and a non-uncovering area, the first window includes a first rectangle and a second rectangle, the first rectangle is located in the uncovering area, the second rectangle is located in the non-uncovering area, the first rectangle is equal to the second rectangle in length, and the width of the first rectangle is greater than the width of the second rectangle;
[0006] An intermediate layer, the flexible substrate layer and a soft board layer are stacked in sequence, and the intermediate layer, the flexible substrate layer and the soft board layer are pressed by a pressing machine to obtain a first rigid-flexible board, wherein a first adhesive is filled between the intermediate layer and the flexible substrate layer, and a first adhesive is also filled between the flexible substrate layer and the soft board layer;
[0007] The first rigid-flexible board and the rigid board layer are stacked in sequence, and the first rigid-flexible board and the rigid board layer are pressed together by the pressing machine to obtain a second rigid-flexible board;
[0008] Based on the first window, the second rigid-flexible board is cut and uncovered by the laser to form a second window on the second rigid-flexible board, wherein the second window is located directly above the first window;
[0009] Based on the second window, a cover-uncovering operation is performed on the second rigid-flexible board after the cutting and cover-uncovering operation.
[0010] According to the uncovering process of the embodiment of the present application, at least the following beneficial effects are achieved: by increasing the area of the pre-opened window in the non-uncovering area, it is convenient to keep the overflow glue in the non-uncovering area in the first rectangle, avoiding excessive first adhesive overflowing to the uncovering area during lamination, so that the uncovering area is stuck by the overflow glue when uncovering, resulting in residual waste. By filling the first adhesive between the middle layer and the flexible substrate layer, and between the flexible substrate layer and the soft board layer, it is convenient to make the connection between the middle layer, the flexible substrate layer and the soft board layer more firmly, the second window is located directly above the first window to ensure the accuracy of processing, and the cutting operation is performed after the uncovering position is cut out, which makes the uncovering operation easier. In this way, the uncovering process of the present application mainly increases the area of the pre-opened window set in the non-uncovering area, thereby avoiding the overflow glue from adhering to the uncovering area during the uncovering operation, thereby avoiding the residual waste.
[0011] According to some embodiments of the present application, the laminating operation of the intermediate layer, the flexible substrate layer and the soft board layer by a laminating machine to obtain a first hard-soft board and the sequentially stacking of the first hard-soft board and the hard board layer to obtain a second hard-soft board further includes:
[0012] Based on the first window, pre-cutting the first rigid-flex board by the laser;
[0013] When the laser completely cuts through the soft board layer, the pre-cutting operation is stopped to form a third window on the soft board layer, wherein the third window is located directly above the first window.
[0014] According to some embodiments of the present application, the step of performing a pre-windowing operation on the flexible substrate layer by a laser to form a first window on the flexible substrate layer includes:
[0015] Identifying a boundary line between the uncovering area and the non-uncovering area;
[0016] The laser is used to perform the pre-windowing operation at the boundary line to obtain the first window, wherein the lengths of the first rectangle and the second rectangle are equal, and the widths of the first rectangle and the second rectangle differ by 0.1 mm to 0.2 mm.
[0017] According to some embodiments of the present application, the first window has a plurality of windows, and based on the first window, the second rigid-flexible board is cut and uncovered by the laser to form a second window on the second rigid-flexible board, including:
[0018] Dividing the second rigid-flex board into a valid area and a waste area;
[0019] Presetting different cutting parameters for the effective area and the waste area;
[0020] Based on the cutting parameters, adjusting the laser;
[0021] The effective area and the waste area are cut and uncovered by multiple lasers at the same time to obtain a second window, wherein there are multiple second windows, and the multiple second windows correspond one-to-one to the multiple first windows. The second windows are located directly above the corresponding first windows, a part of the second windows are located in the effective area, and another part of the second windows are located in the waste area.
[0022] According to some embodiments of the present application, adjusting the laser based on the cutting parameters includes:
[0023] Based on the cutting parameters, adjusting the cutting depth and cutting rate of the laser;
[0024] Increase the number of cutting beams of the laser.
[0025] According to some embodiments of the present application, the intermediate layer, the flexible substrate layer and the soft board layer are stacked in sequence, and the intermediate layer, the flexible substrate layer and the soft board layer are pressed by a pressing machine to obtain a first hard-flex board, including:
[0026] Cleaning the intermediate layer, the flexible substrate layer and the soft board layer by a cleaning device;
[0027] Placing the cleaned intermediate layer horizontally and applying the first adhesive;
[0028] Laminating the cleaned flexible substrate layer onto the side of the intermediate layer coated with the first adhesive, and applying the first adhesive to the side of the flexible substrate layer away from the intermediate layer;
[0029] Laminating the cleaned soft board layer onto the cleaned flexible substrate layer to obtain a first composite board;
[0030] Preheating the first combined plate by a preheating device;
[0031] When the preheating temperature reaches the first preset temperature value, the first combined board is pressed by the pressing machine to obtain the first rigid-flexible board.
[0032] According to some embodiments of the present application, the first rigid-flexible board and the hard board layer are sequentially stacked, and the first rigid-flexible board and the hard board layer are pressed by the pressing machine to obtain a second rigid-flexible board, including:
[0033] Cleaning the first rigid-flex board and the rigid board layer by using the cleaning device;
[0034] Place the cleaned first rigid-flex board horizontally and apply a second adhesive;
[0035] Laminating the cleaned hard board layer onto the side of the first hard-flex board coated with the second adhesive to obtain a second composite board;
[0036] Preheating the second combined plate by a preheating device;
[0037] When the preheating temperature reaches the second preset temperature value, the second combined board is pressed by the pressing machine to obtain the second rigid-flexible board.
[0038] According to some embodiments of the present application, after the second rigid-flex board is uncovered after the cutting uncovering operation based on the second window, the method further includes:
[0039] Cleaning the second rigid-flexible board after the cover-lifting operation by the cleaning device;
[0040] The cleaned second rigid-flexible board is dried by the drying device.
[0041] According to the second aspect of the present application, a rigid-flexible board production process includes:
[0042] The first aspect of the embodiment of the present application is a cover-lifting process.
[0043] According to the third aspect of the present application, a rigid-flexible board includes:
[0044] It is prepared by the production process of the hard-flex board combined board according to the second aspect of the present application.
[0045] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0046] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0047] Figure 1 A flowchart of the steps of the cover-lifting process according to an embodiment of the present application;
[0048] Figure 2 A schematic diagram of a pre-window opening operation of a flexible substrate layer according to an embodiment of the present application;
[0049] Figure 3A schematic diagram of a first rigid-flex board stacking structure according to an embodiment of the present application;
[0050] Figure 4 A schematic diagram of a pre-cutting operation according to an embodiment of the present application;
[0051] Figure 5 A schematic diagram of the cutting and uncovering operation of an embodiment of the present application;
[0052] Figure 6 This is a schematic diagram of the pre-cutting operation of a six-layer rigid-flex board according to an embodiment of the present application;
[0053] Figure 7 This is a schematic diagram of the cutting and uncovering operations of the six-layer rigid-flex board in an embodiment of the present application. DETAILED DESCRIPTION
[0054] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0055] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0056] In the description of this application, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0057] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.
[0058] At present, in the existing technology, there are many methods for removing the covers of soft and hard combination boards, but a lot of waste residues will be generated during the removal process. In the traditional process flow, it is difficult to remove the residual waste in a narrow area, which may cause damage to the product. At the same time, the removal of the residual waste is usually done manually, which increases labor costs and reduces production efficiency.
[0059] Based on this, the present application proposes a voltage converter uncovering process, a rigid-flexible board production process and a rigid-flexible board, aiming to reduce or even avoid the residue of waste after the uncovering operation, thereby reducing labor costs and improving production efficiency.
[0060] The first embodiment of the present application proposes a cover-lifting process. Figure 1 , Figure 1 Flow chart of the steps of the cover-lifting process according to an embodiment of the present application. Figure 1 The illustrated process steps include but are not limited to steps S101 to S105.
[0061] Step S101, performing a pre-windowing operation on the flexible substrate layer by a laser to form a first window on the flexible substrate layer, wherein the flexible substrate layer includes a uncovering area and a non-uncovering area, the first window includes a first rectangle and a second rectangle, the first rectangle is located in the uncovering area, the second rectangle is located in the non-uncovering area, the lengths of the first rectangle and the second rectangle are equal, and the width of the first rectangle is greater than the width of the second rectangle.
[0062] Step S102, stacking the intermediate layer, the flexible substrate layer and the soft board layer in sequence, and pressing the intermediate layer, the flexible substrate layer and the soft board layer by a pressing machine to obtain a first hard-soft board, wherein the first adhesive is filled between the intermediate layer and the flexible substrate layer, and the first adhesive is also filled between the flexible substrate layer and the soft board layer.
[0063] Step S103 , stacking the first rigid-flexible board and the rigid board layer in sequence, and performing a laminating operation on the first rigid-flexible board and the rigid board layer by a laminating machine to obtain a second rigid-flexible board.
[0064] Step S104, based on the first window, the second rigid-flexible board is cut and uncovered by a laser to form a second window on the second rigid-flexible board, wherein the second window is located directly above the first window.
[0065] Step S105 , based on the second window, performing a cover-off operation on the second rigid-flex board after the cutting cover-off operation.
[0066] In the steps S101 to S105 shown in this embodiment, in this embodiment, the material of the flexible substrate layer is polyimide, the hard board layer is copper foil, the soft board layer is composed of polyimide, copper foil and copper plating stacked in sequence, the middle layer is composed of polyimide, base copper and copper plating stacked in sequence, the hard board layer is used to protect the circuit board, the soft board layer makes the circuit board have good flexibility, the flexible substrate layer is used to connect the soft board layer and the middle layer, and the middle layer is used for the transmission of partial circuit signals of the circuit board, the uncovering area is the area where the hard board layer, soft board layer and flexible substrate layer need to be removed to expose the middle layer, and the non-uncovering area is the area other than the uncovering area In the field, by pre-windowing the flexible substrate layer, and the position of the pre-windowing is located in a larger area in the non-uncovering area, during the lamination process, even if the first adhesive filled on both sides of the flexible substrate layer overflows, it will only remain in the first rectangle of the non-uncovering area, and will not affect the part of the uncovering area, so as to prevent the overflowed adhesive from sticking to the uncovering area when the uncovering area is subsequently uncovered, resulting in waste residue in the uncovering area. The second window is located directly above the first window, which ensures the accuracy of cutting, so that the second soft-hard combination board can be cut along the first window obtained by the pre-windowing, so as to ensure that the uncovering area can realize the uncovering operation without residual waste.
[0067] According to the uncovering process of the embodiment of the present application, at least the following beneficial effects are achieved: by increasing the area of the pre-opened window in the non-uncovering area, it is convenient to keep the overflow glue in the non-uncovering area in the first rectangle, avoiding excessive first adhesive overflowing to the uncovering area during lamination, so that the uncovering area is stuck by the overflow glue when uncovering, resulting in residual waste. By filling the first adhesive between the middle layer and the flexible substrate layer, and between the flexible substrate layer and the soft board layer, it is convenient to make the connection between the middle layer, the flexible substrate layer and the soft board layer more firm, the second window is located just above the first window to ensure the accuracy of processing, and the cutting operation is performed after the uncovering position is cut out, which makes the uncovering operation easier. In this way, the uncovering process of the present application mainly increases the area of the pre-opened window set in the non-uncovering area, thereby avoiding the overflow glue from adhering to the uncovering area during the uncovering operation, thereby avoiding the residue in the waste area.
[0068] In some embodiments, reference Figure 2 , step S101 may include but is not limited to steps S201 to S202.
[0069] Step S201, identifying the boundary between the uncovering area and the non-uncovering area.
[0070] Step S202, performing a pre-windowing operation on the boundary line by the laser to obtain a first window, wherein the lengths of the first rectangle and the second rectangle are equal, and the widths of the first rectangle and the second rectangle differ by 0.1 mm to 0.2 mm.
[0071] In step S201 of some embodiments, a boundary line between the uncovering area and the non-uncovering area is found according to a pre-designed design.
[0072] In step S202 of some embodiments, referring to Figure 2 The width of the first rectangle differs from that of the second rectangle by 0.1 mm to 0.2 mm. At the dividing line, a first window is obtained by a laser pre-windowing operation. The first window includes the first rectangle and the second rectangle.
[0073] In the steps S201 to S202 shown in the embodiment of the present application, the width of the first rectangle differs from the width of the second rectangle by 0.1mm to 0.2mm during pre-window opening, so that the first window area of the non-opening area of the flexible substrate layer is larger than the first window area of the opening area, so that when the overflow glue in the non-opening area produced by lamination flows to the first window, it will remain in the first rectangular part of the non-opening area and will not adhere to the opening area. Therefore, the impact on the opening area is small, thereby ensuring that no waste material remains in the opening area when the cover is opened. At the same time, the area of the first rectangle is only slightly larger than the area of the second rectangle, thereby ensuring that no waste material remains and no excessive waste is caused.
[0074] In some embodiments, step S102 may include but is not limited to steps S301 to S306.
[0075] Step S301 , cleaning the intermediate layer, the flexible substrate layer and the soft board layer by using a cleaning device.
[0076] Step S302, placing the cleaned intermediate layer horizontally and applying a first adhesive.
[0077] Step S303 , laminating the cleaned flexible substrate layer onto the side of the middle layer coated with the first adhesive, and applying the first adhesive to the side of the flexible substrate layer away from the middle layer.
[0078] Step S304 , laminating the cleaned soft board layer onto the cleaned flexible substrate layer to obtain a first composite board.
[0079] Step S305: preheating the first combined plate by using a preheating device.
[0080] Step S306: When the preheating temperature reaches the first preset temperature value, the first composite board is pressed by a pressing machine to obtain a first rigid-flexible board.
[0081] In step S301 of some embodiments, a simple cleaning process is performed on the intermediate layer, the flexible substrate layer and the soft board layer by a cleaning device to remove attached pollutants.
[0082] In step S302 of some embodiments, the cleaned intermediate layer is placed horizontally, and then the first adhesive is evenly applied to the intermediate layer, wherein the first adhesive may be an adhesive such as acrylic adhesive, epoxy resin, etc.
[0083] In step S303 of some embodiments, the pre-windowed flexible substrate layer is laminated to the side of the intermediate layer coated with the first adhesive, and the first adhesive is also evenly coated on the other side of the flexible substrate layer, ie, the side away from the intermediate layer.
[0084] In step S304 of some embodiments, referring to Figure 3 The cleaned soft board layer is laminated on the flexible substrate layer to obtain a first composite board, so as to realize a structure in which the first adhesive is filled between the soft board layer and the flexible substrate layer and between the flexible substrate layer and the intermediate layer.
[0085] In step S305 of some embodiments, the first composite board is preheated by a preheating device such as a heat press.
[0086] In step S306 of some embodiments, a first preset temperature value for preheating is preset according to the required first adhesive material, and when the preheating device preheats the temperature to the first preset temperature value, a pressing operation can be performed to obtain a first rigid-flexible board.
[0087] Steps S301 to S306 shown in the embodiment of the present application remove dust, oil and other pollutants on each layer of the board through cleaning operations so that the first adhesive can fully infiltrate, which is more conducive to its bonding effect, thereby reducing the generation of overflow glue and thus reducing waste generation. Preheating before lamination can accelerate the curing process of the first adhesive and reduce the generation of overflow glue. At the same time, preheating can also reduce thermal stress during lamination, reducing the risk of deformation of each layer of the board.
[0088] In some embodiments, steps between step S102 and step S103 may include but are not limited to step S401 to step S402.
[0089] Step S401: Based on the first window, a first rigid-flex board is pre-cut by a laser.
[0090] Step S402, when the laser completely cuts through the soft board layer, the pre-cutting operation is stopped, and a third window is formed on the soft board layer, wherein the third window is located directly above the first window.
[0091] In step S401 of some embodiments, based on the position of the first window of the flexible substrate layer, a pre-cutting operation is performed on the soft board layer of the first rigid-flex board by a laser directly above the first window.
[0092] In step S402 of some embodiments, the laser cuts into the soft board layer corresponding to the position directly above the first window, and stops when the laser completely cuts through the soft layer, thereby forming a third window on the soft board layer, which is also directly above the first window.
[0093] Steps S401 to S402 shown in the embodiment of the present application refer to Figure 4 By pre-cutting the first rigid-flex board, the soft board layer is cut in advance to prevent the first adhesive from overflowing during subsequent lamination, causing the soft board layer to stick together and resulting in waste residue when the cover is removed.
[0094] In some embodiments, step S103 may include but is not limited to steps S501 to S505.
[0095] Step S501 , cleaning the first rigid-flex board and the rigid board layer by using a cleaning device.
[0096] Step S502 , placing the cleaned first rigid-flex board horizontally and applying a second adhesive thereon.
[0097] Step S503 , laminating the cleaned hard board layer onto the side of the first rigid-flex board coated with the second adhesive to obtain a second composite board.
[0098] Step S504: preheating the second combined plate by using a preheating device.
[0099] Step S505, when the preheating temperature reaches the second preset temperature value, the second composite board is pressed by a pressing machine to obtain a second rigid-flexible board.
[0100] In step S501 of some embodiments, a simple cleaning process is performed on the first rigid-flex board and the rigid board layer by a cleaning device to remove attached contaminants.
[0101] In step S502 of some embodiments, the first rigid-flexible board after cleaning is placed horizontally, and then the second adhesive is evenly applied to the first rigid-flexible board, wherein the second adhesive is a prepreg material.
[0102] In step S503 of some embodiments, the cleaned hard board layer is laminated onto the first hard-flex board to obtain a second composite board, so as to achieve a structure in which a second adhesive is filled between the hard board layer and the first hard-flex board.
[0103] In step S504 of some embodiments, the second composite board is preheated by a preheating device such as a heat press.
[0104] In step S505 of some embodiments, a second preset temperature value for preheating is preset according to the required second adhesive material, and when the preheating device preheats the temperature to the second preset temperature value, a pressing operation can be performed to obtain a second rigid-flexible board.
[0105] The present application implements steps S501 to S505, and through cleaning operations, dust, oil and other pollutants on each layer of the board are removed so that the second adhesive can fully infiltrate, which is more conducive to its bonding effect, thereby reducing the generation of overflow glue, thereby reducing the generation of waste. Preheating before lamination can accelerate the curing process of the second adhesive and reduce the generation of overflow glue. At the same time, preheating can also reduce thermal stress during lamination, reducing the risk of deformation of each layer of the board. At the same time, the second adhesive uses prepreg material, which can play a role in insulation and support for the soft board layer and the hard board layer.
[0106] In some embodiments, step S104 may include but is not limited to steps S601 to S604.
[0107] Step S601, dividing the second rigid-flex board into a valid area and a waste area.
[0108] Step S602, presetting different cutting parameters for the effective area and the waste area.
[0109] Step S603: adjusting the laser based on the cutting parameters.
[0110] Step S604, using multiple lasers to simultaneously perform cutting and uncovering operations on the effective area and the waste area to obtain a second window, wherein there are multiple second windows, the multiple second windows correspond one-to-one to the multiple first windows, the second windows are located directly above the corresponding first windows, a part of the second windows are located in the effective area, and another part of the second windows are located in the waste area.
[0111] In step S601 of some embodiments, the portion carrying circuit elements and functional regions is divided into a valid region, and the portion not carrying circuit elements and functional regions is divided into a waste region.
[0112] In step S602 of some embodiments, different cutting parameters are set for the effective area and the waste area, respectively. The cutting parameters include cutting depth and cutting rate. The cutting depth of the waste area is deeper than that of the effective area, and the cutting rate of the waste area is faster than that of the effective area.
[0113] In step S603 of some embodiments, the cutting depth and cutting rate of the laser are adjusted based on the cutting parameters.
[0114] In step S604 of some embodiments, the uncovering position is the area to be uncovered by the uncovering operation, and a laser is provided in each of the effective area and the waste area to perform the uncovering operation, and then the operation is performed synchronously. Figure 5 The cutting and uncovering position is to cut along the boundary of the area to be uncovered until the hard board layer is completely cut off, and then continue to cut down a distance to prevent the soft board layer from being completely cut off during pre-cutting, so as to obtain the second window. The second window is located directly above the third window, and the middle layer is not damaged in this process.
[0115] In steps S601 to S604 shown in the embodiment of the present application, different cutting parameters are set in the effective area and the waste area, so that the cutting efficiency of the waste area is improved, thereby improving the overall cutting efficiency. A plurality of lasers are provided to perform cutting operations on the effective area and the waste area simultaneously, further improving the cutting efficiency. The second window is located directly above the third window, which is convenient for the cutting and uncovering operation to be performed along the previously pre-cut position, making the cutting more precise. Through the operation of the uncovering position, the boundary of the required uncovering area is cut, so that the subsequent uncovering operation is easier.
[0116] In some embodiments, step S603 may include but is not limited to steps S701 to S702.
[0117] Step S701, adjusting the cutting depth and cutting rate of the laser based on the cutting parameters.
[0118] Step S702, increasing the number of laser cutting beams.
[0119] In step S701 of some embodiments, the cutting depth and cutting speed of the laser are adjusted according to the cutting parameters.
[0120] In step S702 of some embodiments, reference Figure 4 and Figure 5 , the number of pre-cutting and pre-windowing beams is increased to three during the cutting and uncovering operation.
[0121] In the step S701 to step S702 shown in the embodiment of the present application, by increasing the number of laser cutting beams during the cutting and uncovering operation, the cutting width is increased, thereby improving the cutting effect, making the uncovering operation easier, and reducing the residual waste.
[0122] It should be noted that the cutting depth of the laser will be different depending on the medium of the second rigid-flexible board.
[0123] In step S105 of some embodiments, the robot slowly performs the uncovering operation along the uncovering position, thereby ensuring the uncovering operation while preventing the uncovering operation from being too fast and causing waste residue.
[0124] In some embodiments, step S105 may also include but is not limited to steps S801 to S802.
[0125] Step S801, cleaning the second rigid-flex board after the cover-opening operation by using a cleaning device.
[0126] Step S802 , drying the cleaned second rigid-flex board by using a drying device.
[0127] In step S801 of some embodiments, the second rigid-flex board is cleaned by a plasma cleaning machine after the cover-lifting operation.
[0128] In step S802 of some embodiments, the cleaned second rigid-flex board is placed in a drying machine for drying.
[0129] In steps S801 to S802 shown in the embodiment of the present application, the contaminants on the second rigid-flexible board after the cover is removed are removed by cleaning, and then the moisture that may exist on the second rigid-flexible board is dried by a dryer to ensure its stability.
[0130] The following is a specific process implementation process based on the cover removal process of this application:
[0131] In this embodiment, reference Figure 2 , Figure 6 and Figure 7Finally, the second rigid-flexible board to be obtained is a six-layer rigid-flexible board, in which L1 and L6 are hard board layers, L2 and L5 are soft board layers, L3 and L4 are middle layers, and the PI (polyimide) layer is a flexible substrate layer. There are two PI layers, which are respectively arranged between L2 and L3 and between L4 and L5. First, pre-open windows for two PI layers respectively, and the width of the first rectangle differs from that of the second rectangle by 0.1mm to 0.2mm. Then, clean the two PI layers, L2, L3, L4 and L5, and stack L5, the first PI layer, L4, L3, the second PI layer and L2 in sequence in a horizontal position to obtain a first composite board, wherein both sides of each PI layer are filled with a first adhesive. Then, preheat the first composite board by a hot press, and perform a pressing operation after preheating to a first preset temperature value to obtain a first rigid-flexible board. The first rigid-flexible board is operated from L2 and L5 by a laser at the same time, and the first rigid-flexible board is pre-cut along the first window. When the laser completely cuts off L2 and L5, stop the cutting operation of the laser to obtain a third window. The third window is vertically aligned with the second window. Then, stack L6, the first rigid-flexible board and L1 in sequence in a horizontal position to obtain a rigid-flexible board. A second combination board, wherein a second adhesive is filled between L1 and the first rigid-flexible board, and a second adhesive is also filled between L6 and the rigid-flexible board. Then, the second combination board is preheated by a hot press, and after being preheated to a second preset temperature value, a pressing operation is performed to obtain a second rigid-flexible board. The second rigid-flexible board is divided into an effective area and a waste area according to whether electronic components and functional areas exist. Then, a cover-opening position cutting operation is performed on the effective area and the waste area simultaneously by multiple lasers, wherein the cutting depth of the waste area is deeper than that of the effective area, and the cutting rate of the waste area is faster than that of the effective area. The number of laser cutting beams during the cover-opening position cutting operation is increased to three, while the number of laser cutting beams during the pre-window opening operation and the pre-cutting operation is one. Then, the cover-opening area is covered along the cut cover-opening position. Finally, the rigid-flexible board after covering is cleaned and dried to obtain a second rigid-flexible board with a complete cover-opening and less or even no waste residue.
[0132] According to the production process of a rigid-flexible board according to the second aspect of the present application, the process includes the uncovering process according to the first aspect of the present application.
[0133] The production process of the rigid-flexible board of the second embodiment of the present application has at least the following beneficial effects: by increasing the area of the pre-opened window in the non-uncovering area, it is convenient to keep the overflow glue in the non-uncovering area in the first rectangle, avoiding excessive first adhesive overflow to the uncovering area during lamination, so that the uncovering area is stuck by the overflow glue when uncovering, resulting in the residue of waste. By filling the first adhesive between the middle layer and the flexible substrate layer, and between the flexible substrate layer and the soft board layer, it is convenient to connect the middle layer, the flexible substrate layer and the soft board layer more firmly, the second window is located just above the first window to ensure the accuracy of processing, and the operation of cutting after cutting the uncovering position is performed, which makes the uncovering operation easier. In this way, the uncovering process of the present application mainly increases the area of the pre-opened window set in the non-uncovering area, thereby avoiding the adhesion of the overflow glue to the uncovering area during the uncovering operation, thereby avoiding the residue of waste. By introducing the uncovering process of the present application, the hard-flex board produced by the hard-flex board of the present application has no waste residue, eliminating the process of manual waste removal, saving labor and also improving the production efficiency of the hard-flex board.
[0134] According to the hard-flex board of the third embodiment of the present application, the hard-flex board is prepared by the hard-flex board production process of the second embodiment.
[0135] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.
[0136] Those skilled in the art will appreciate that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.
[0137] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0138] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.
[0139] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0140] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.
[0141] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.
[0142] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0143] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.
[0144] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store programs.
[0145] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.
Claims
1. A lid-lifting process, characterized in that: The process comprises: Performing a pre-windowing operation on the flexible substrate layer by a laser to form a first window on the flexible substrate layer, wherein the flexible substrate layer includes a uncovering area and a non-uncovering area, the first window includes a first rectangle and a second rectangle, the first rectangle is located in the uncovering area, the second rectangle is located in the non-uncovering area, the first rectangle is equal to the second rectangle in length, and the width of the first rectangle is greater than the width of the second rectangle; An intermediate layer, the flexible substrate layer and a soft board layer are stacked in sequence, and the intermediate layer, the flexible substrate layer and the soft board layer are pressed by a pressing machine to obtain a first rigid-flexible board, wherein a first adhesive is filled between the intermediate layer and the flexible substrate layer, and a first adhesive is also filled between the flexible substrate layer and the soft board layer; The first rigid-flexible board and the rigid board layer are stacked in sequence, and the first rigid-flexible board and the rigid board layer are pressed together by the pressing machine to obtain a second rigid-flexible board; Based on the first window, the second rigid-flexible board is cut and uncovered by the laser to form a second window on the second rigid-flexible board, wherein the second window is located directly above the first window; Based on the second window, a cover-uncovering operation is performed on the second rigid-flexible board after the cutting and cover-uncovering operation.
2. The uncovering process according to claim 1, characterized in that: The laminating operation of laminating the intermediate layer, the flexible substrate layer and the soft board layer by a laminating machine to obtain a first hard-soft board and the laminating operation of laminating the first hard-soft board and the hard board layer in sequence to obtain a second hard-soft board further comprises: Based on the first window, pre-cutting the first rigid-flex board by the laser; When the laser completely cuts through the soft board layer, the pre-cutting operation is stopped to form a third window on the soft board layer, wherein the third window is located directly above the first window.
3. The uncovering process according to claim 1, characterized in that: The method of performing a pre-window opening operation on the flexible substrate layer by a laser to form a first window on the flexible substrate layer comprises: Identifying a boundary line between the uncovering area and the non-uncovering area; The laser is used to perform the pre-windowing operation at the boundary line to obtain the first window, wherein the width of the first rectangle differs from the width of the second rectangle by 0.1 mm to 0.2 mm.
4. The uncovering process according to claim 1, characterized in that: The first window has a plurality of windows, and based on the first window, the second rigid-flexible board is cut and uncovered by the laser to form a second window on the second rigid-flexible board, including: Dividing the second rigid-flex board into a valid area and a waste area; Presetting different cutting parameters for the effective area and the waste area; Based on the cutting parameters, adjusting the laser; The effective area and the waste area are cut and uncovered by multiple lasers at the same time to obtain a second window, wherein there are multiple second windows, and the multiple second windows correspond one-to-one to the multiple first windows. The second windows are located directly above the corresponding first windows, a part of the second windows are located in the effective area, and another part of the second windows are located in the waste area.
5. The cover-lifting process according to claim 4, characterized in that: The step of adjusting the laser based on the cutting parameters comprises: Based on the cutting parameters, adjusting the cutting depth and cutting rate of the laser; Increase the number of cutting beams of the laser.
6. The cover-lifting process according to claim 1, characterized in that: The intermediate layer, the flexible substrate layer and the soft board layer are stacked in sequence, and the intermediate layer, the flexible substrate layer and the soft board layer are pressed by a pressing machine to obtain a first hard-flex board, comprising: Cleaning the intermediate layer, the flexible substrate layer and the soft board layer by a cleaning device; Placing the cleaned intermediate layer horizontally and applying the first adhesive; Laminating the cleaned flexible substrate layer onto the side of the intermediate layer coated with the first adhesive, and applying the first adhesive to the side of the flexible substrate layer away from the intermediate layer; Laminating the cleaned soft board layer onto the cleaned flexible substrate layer to obtain a first composite board; Preheating the first combined plate by a preheating device; When the preheating temperature reaches the first preset temperature value, the first combined board is pressed by the pressing machine to obtain the first rigid-flexible board.
7. The cover-lifting process according to claim 1, characterized in that: The first rigid-flexible board and the rigid board layer are sequentially stacked, and the first rigid-flexible board and the rigid board layer are pressed by the pressing machine to obtain a second rigid-flexible board, comprising: Cleaning the first rigid-flex board and the rigid board layer by using the cleaning device; Place the cleaned first rigid-flex board horizontally and apply a second adhesive; Laminating the cleaned hard board layer onto the side of the first hard-flex board coated with the second adhesive to obtain a second composite board; Preheating the second combined plate by a preheating device; When the preheating temperature reaches the second preset temperature value, the second combined board is pressed by the pressing machine to obtain the second rigid-flexible board.
8. The cover-lifting process according to claim 1, characterized in that: After the second rigid-flex board is uncovered after the cutting and uncovering operation based on the second window, the method further includes: Cleaning the second rigid-flexible board after the cover-lifting operation by the cleaning device; The cleaned second rigid-flexible board is dried by the drying device.
9. A process for producing a rigid-flex board, characterized in that: include: The lid-lifting process according to any one of claims 1 to 8.
10. A rigid-flex board, characterized in that: include: The rigid-flex board is prepared by the rigid-flex board production process described in claim 9.