Automatic filling device for microelectronic materials and using method of automatic filling device

Abstract

The invention discloses an automatic microelectronic material filling device and a using method thereof, and relates to the technical field of microelectronic materials, the automatic microelectronic material filling device comprises a machine table, a support, a filling mechanism, a cleaning mechanism and a jacking mechanism, the bottom end of the support is fixedly connected to one side of the upper surface of the machine table; the filling mechanism is arranged on the machine table and is used for filling a microelectronic material onto the circuit substrate; the cleaning mechanism is fixedly installed on the filling mechanism and used for cleaning a discharging opening of the filling mechanism. The jacking and pressing mechanism is arranged on the cleaning mechanism and used for sealing the discharging opening of the filling mechanism. A filling gun head drives an extrusion block to vertically move downwards, extrudes an extrusion groove and pushes a movable ring to rotate clockwise, a fixed disc drives a fixed column to push a connecting rod, so that the movable blocks rotate around a fixed shaft, and the multiple movable blocks rotate to the bottom end of the filling gun head to clean a discharging opening of the filling gun head; and the filling quality of the microelectronic material is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of microelectronic materials, and in particular to an automatic filling device for microelectronic materials and a use method thereof. Background Art

[0002] Microelectronics technology is a discipline that works on miniature integrated circuit systems on semiconductors. During the production and processing of integrated circuits, glue is filled on the integrated circuit board through a filling device in order to protect the integrated circuit.

[0003] When a common filling device is in operation, the molten glue flows out through the gun head and is injected into the integrated circuit board. After the integrated circuit board is filled with glue, the gun head is separated from the circuit board, and glue still remains at the filling gun head. The molten glue is prone to wire drawing, and the glue at the gun head position will adhere to the discharge port of the filling gun head after cooling, affecting the next filling operation and reducing the filling quality of microelectronic materials. Summary of the invention

[0004] The object of the present invention is to provide an automatic filling device for microelectronic materials and a method of using the same to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic filling device for microelectronic materials, comprising a machine platform; A bracket, the bottom end of which is fixedly connected to one side of the upper surface of the machine platform; It also includes a filling mechanism, a cleaning mechanism and a pressing mechanism, wherein the filling mechanism is arranged on the machine platform and is used to fill the microelectronic material onto the circuit substrate; The cleaning mechanism is fixedly mounted on the filling mechanism and is used to clean the discharge port of the filling mechanism; The pressing mechanism is arranged on the cleaning mechanism and is used to close the discharge port of the filling mechanism.

[0006] Preferably, the filling mechanism comprises: A rotating plate, the bottom of which is rotatably connected to the upper surface of the machine table via a bearing; Clamps, the clamps are fixedly mounted on the upper surface of the rotating disk, and the clamps are arranged in a rectangular array; A linear module, wherein the linear module is fixedly mounted on the bracket; A hydraulic cylinder, which is fixedly mounted on the top of the inner wall of the bracket and is transmission-connected to the linear module; A filling gun head is transmission-connected to an output end of the hydraulic cylinder.

[0007] Preferably, the cleaning mechanism comprises: A fixing ring, the fixing ring is arranged at the bottom of the filling gun head, and the inner cavity of the fixing ring is interlaced and connected with the bottom of the filling gun head; A fixing rod, the bottom end of which is fixedly connected to one side of the outer wall of the fixing ring, and the top end of which is fixedly connected to one side of the hydraulic cylinder; A movable ring, which is rotatably interlaced in the inner cavity of the fixed ring, and the movable ring is interlaced with the bottom of the filling gun head; An extrusion groove, the extrusion groove is opened on one side of the front face of the movable ring, and the bottom of the inner wall thereof is arranged in an inclined surface; A limiting groove, which is arranged on one side of the bottom of the inner wall of the extrusion groove, and is arranged vertically; An extrusion block, one end of which is fixedly connected to one side of the filling gun head and corresponds to the position of the extrusion groove.

[0008] Preferably, the cleaning mechanism further comprises: Movable grooves, the movable grooves are arranged on the inner wall of the fixed ring, and the movable grooves are arranged in a ring array; A fixed block, one end of which is fixedly connected to the outer wall of the bottom of the movable ring, and the fixed block is inserted into the inner cavity of the movable groove; A tension spring, one end of which is fixedly connected to one side of the fixed block, and the other end of which is fixedly connected to the inner wall of the movable groove; A fixed plate, the upper surface of which is fixedly connected to the bottom end of the movable ring.

[0009] Preferably, the cleaning mechanism further comprises: A mounting seat, the upper surface of which is fixedly connected to the bottom end of the fixing ring, and a through hole is formed in the middle thereof; A mounting groove, the mounting groove is formed on the inner wall of the mounting seat, and the inner cavity of the mounting groove is arranged to rotate and intersect with the fixing plate; Movable blocks are arranged in the inner cavity of the mounting groove, and the movable blocks are arranged in a ring array; A fixed shaft, the bottom end of which is fixedly connected to the bottom of the inner wall of the mounting groove, and the fixed shaft is rotatably interlaced with one end of the movable block; A connecting rod, one end of which is fixedly connected to one end of the movable block; A connecting groove, the connecting groove is opened at one end of the connecting rod; A fixing post, one end of which is fixedly connected to the lower surface of the fixing plate, and the fixing post is interlaced with the inner cavity of the connecting groove.

[0010] Preferably, the pressing mechanism comprises: A receiving groove, the receiving groove is opened at the top of one end of the movable block; A pressing block, the upper surface of which is in contact with the bottom end of the filling gun head and is interlaced with the inner cavity of the containing groove; A positioning block, the top end of which is fixedly connected to the lower surface of the top pressing block, and the positioning block and the bottom of the inner wall of the accommodating groove are interlaced.

[0011] Preferably, the pressing mechanism further comprises: An active cavity, the active cavity is arranged below the accommodating groove; A compression spring, wherein the compression spring is arranged in the inner cavity of the movable cavity, and the compression spring is arranged at the bottom end of the positioning block; The upper surface of the limit block is fixedly connected to the bottom end of the positioning block, and the lower surface of the limit block is in contact with the top end of the compression spring.

[0012] Preferably, the outer wall of the fixed block is in contact with the inner wall of the movable groove, the fixed plate is arranged above the movable block, the movable block is arranged in a fan shape, and the connecting groove is arranged in a long strip shape.

[0013] Preferably, the edge position of the top of the top pressure block is set as an inclined surface, the positioning block is set in a square block shape, the limit block is set in the inner cavity of the active cavity, the top pressure block is set in a fan shape, and the top pressure block is set in a ring array.

[0014] The present invention also provides a method for using the automatic filling device for microelectronic materials, comprising the following specific steps: Step 1: First, fix the processed circuit substrate on the fixture, and then rotate the rotating disk to drive the circuit substrate to move below the filling gun head. The operation of the linear module drives the hydraulic cylinder and the filling gun head to move horizontally. Then, the operation of the hydraulic cylinder drives the filling gun head to move vertically downward to adjust the position of the filling gun head. Step 2: Then, the extrusion block is driven to move vertically downward by the filling gun head, and the extrusion block squeezes the inner wall of the extrusion groove, pushing the movable ring to rotate clockwise in the inner cavity of the fixed ring. When the extrusion block moves to the bottom of the extrusion groove, the extrusion block slides into the inner cavity of the limit groove, and the movable ring drives the fixed block to rotate together, stretching the tension spring, and the fixed plate rotates together with the movable ring, driving multiple fixed columns to rotate clockwise together. The fixed column pushes the connecting rod, and the fixed column slides in the inner cavity of the connecting groove. The connecting rod drives the movable block to rotate and open around the fixed axis, so that the filling gun head is moved out of the inner cavity of the fixed ring, and the microelectronic material is squeezed and filled; Step three: Then, when the filling gun head moves vertically upward, the elastic effect of the tension spring is used to drive the movable ring to rotate, and the movable block is rotated and closed. The movable block drives multiple pressing blocks to rotate to the bottom of the filling gun head. The inclined surface of the pressing block presses the filling gun head. The elastic effect of the compression spring is used to push the positioning block and the pressing block upward. The upper surface of the pressing block fits tightly with the bottom end of the filling gun head, and the bottom end of the filling gun head is sealed and cleaned.

[0015] Technical effects and advantages of the present invention: (1) The present invention utilizes a configuration method in which a filling gun head, an extrusion block, a movable ring, an extrusion groove, a fixed disk, a fixed column, a connecting rod, a movable block and a fixed shaft are matched. The filling gun head drives the extrusion block to move vertically downward, and the extrusion block enters the inner cavity of the extrusion groove, and squeezes the inner wall of the extrusion groove, pushing the movable ring to rotate clockwise. The fixed disk rotates together with the movable ring, driving a plurality of fixed columns to push the connecting rod, so that the connecting rod drives the movable block to rotate around the fixed shaft. When the filling gun head enters the inner cavity of the fixed ring upward, the plurality of movable blocks rotate to the bottom end position of the filling gun head, and the discharge port position of the filling gun head is cleaned, thereby preventing the microelectronic material from being drawn at the filling gun head, thereby ensuring the quality of the microelectronic material filling; (2) The present invention utilizes a configuration in which a tension spring, a movable block, a top pressure block and a compression spring cooperate with each other. When the filling gun head moves vertically upward, the elastic action of the tension spring is utilized to drive the movable ring to rotate, and the movable block is rotated and closed. The movable block drives the plurality of top pressure blocks to rotate to the bottom of the filling gun head. The inclined surface of the top pressure block presses the filling gun head. The elastic action of the compression spring is utilized to push the positioning block and the top pressure block upward. The upper surface of the top pressure block is tightly fitted with the bottom end of the filling gun head, which facilitates the sealing and cleaning of the bottom end of the filling gun head. (3) The present invention utilizes a configuration in which a movable ring, an extrusion groove, a limiting groove and an extrusion block are matched with each other. When the extrusion block moves to the bottom of the inner wall of the extrusion groove, the extrusion block slides into the inner cavity of the limiting groove, and the extrusion block moves vertically downward along the inner cavity of the limiting groove to limit the movable ring, so that the movable ring cannot rotate, thereby ensuring the stability of the movable ring. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0017] Figure 2 It is a schematic diagram of the side structure of the rotating disk of the present invention.

[0018] Figure 3 It is a schematic diagram of the structure of the filling gun head of the present invention.

[0019] Figure 4 It is a front cross-sectional structural schematic diagram of the movable ring of the present invention.

[0020] Figure 5 It is a schematic diagram of the top view of the movable ring of the present invention.

[0021] Figure 6 It is a schematic diagram of the front structure of the movable ring of the present invention.

[0022] Figure 7 It is a structural schematic diagram of the movable block of the present invention in a closed state.

[0023] Figure 8 It is a structural schematic diagram of the unfolded state of the movable block of the present invention.

[0024] Fig. 9 It is a schematic diagram of the cross-sectional structure of the movable ring of the present invention.

[0025] Fig.10 It is a front cross-sectional structural schematic diagram of the top pressure block of the present invention.

[0026] In the figure: 1. machine table; 2. bracket; 3. filling mechanism; 31. rotating disk; 32. clamp; 33. linear module; 34. hydraulic cylinder; 35. filling gun head; 4. cleaning mechanism; 41. fixed ring; 42. fixed rod; 43. movable ring; 44. extrusion groove; 45. limit groove; 46. extrusion block; 47. movable groove; 48. fixed block; 49. tension spring; 410. fixed disk; 411. mounting seat; 412. mounting groove; 413. movable block; 414. fixed shaft; 415. connecting rod; 416. connecting groove; 417. fixed column; 5. pressing mechanism; 51. accommodating groove; 52. pressing block; 53. positioning block; 54. movable cavity; 55. compression spring; 56. limit block. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] The present invention provides Figure 1-Figure 10An automatic filling device for microelectronic materials shown in the figure includes a machine 1, a bracket 2, a filling mechanism 3, a cleaning mechanism 4 and a top pressing mechanism 5. The machine 1 plays a role of fixing and supporting. The bottom end of the bracket 2 is fixedly connected to one side of the upper surface of the machine 1. The bracket 2 is arranged in an L shape and is used to install the filling mechanism 3; the filling mechanism 3 is arranged on the machine 1, and is used to fill the microelectronic material into the circuit substrate, and the microelectronic material is filled into the circuit substrate by the filling mechanism 3; the cleaning mechanism 4 is fixedly installed on the filling mechanism 3, and is used to clean the discharge port of the filling mechanism 3, and the discharge port at the bottom end of the filling gun head 35 on the filling mechanism 3 is cleaned by the cleaning mechanism 4 to prevent the filling material from being drawn; the top pressing mechanism 5 is arranged on the cleaning mechanism 4, and is used to close the discharge port of the filling mechanism 3, and the bottom end of the filling gun head 35 is closed by the top pressing mechanism 5 to prevent the filling material from accumulating at the discharge port.

[0029] Furthermore, the filling mechanism 3 includes a rotating disk 31, the bottom of which is rotatably connected to the upper surface of the machine table 1 through a bearing, and the rotating disk 31 is used to fix a fixture 32; a fixture 32, which is fixedly installed on the upper surface of the rotating disk 31, and the fixture 32 is arranged in a rectangular array, and the fixture 32 is used to fix the circuit substrate to be processed, so that the rotating disk 31 drives the fixture 32 and the circuit substrate to rotate to the position below the filling gun head 35; a linear module 33, which is fixedly installed on the bracket 2, and the linear module 33 is electrically connected to the external power supply through an external first switch. The linear module 33 is used to drive the hydraulic cylinder 34 and the filling gun head 35 to move in the horizontal direction; the hydraulic cylinder 34 is fixedly installed on the top of the inner wall of the bracket 2, and is transmission-connected to the linear module 33. The hydraulic cylinder 34 is electrically connected to the external power supply through an external second switch, driving the filling gun head 35 to move in the vertical direction; the filling gun head 35 is transmission-connected to the output end of the hydraulic cylinder 34. The filling gun head 35 is connected to the external feeding equipment and the heating equipment, and the filling gun head 35 is used to fill the microelectronic material on the circuit substrate.

[0030] Specifically, the cleaning mechanism 4 includes a fixed ring 41, which is arranged at the bottom of the filling gun head 35, and its inner cavity is interlaced with the bottom of the filling gun head 35, and the fixed ring 41 is used to install a movable ring 43; a fixed rod 42, the bottom end of the fixed rod 42 is fixedly connected to one side of the outer wall of the fixed ring 41, and the top end is fixedly connected to one side of the hydraulic cylinder 34. The fixed ring 41 is fixedly connected to the hydraulic cylinder 34 through the fixed rod 42 to ensure the stability of the fixed ring 41; a movable ring 43, which is rotatably interlaced in the inner cavity of the fixed ring 41, and the movable ring 43 is interlaced with the bottom of the filling gun head 35, and the movable ring 43 rotates on the fixed ring 41; an extrusion groove 44, which is opened on one side of the front of the movable ring 43, and the bottom of its inner wall is The inclined surface is set, and the extrusion groove 44 cooperates with the extrusion block 46 to drive the movable ring 43 to rotate; the limiting groove 45, the limiting groove 45 is set on one side of the bottom of the inner wall of the extrusion groove 44, the limiting groove 45 is set vertically, the limiting groove 45 is used for the movement of the extrusion block 46, and the movable ring 43 is limited so that the movable ring 43 cannot rotate; the extrusion block 46, one end of the extrusion block 46 is fixedly connected to one side of the filling gun head 35, and it corresponds to the position of the extrusion groove 44, the extrusion block 46 moves in the vertical direction with the filling gun head 35, and is used to squeeze the inner wall of the extrusion groove 44 and push the movable ring 43 to rotate; the movable groove 47, the movable groove 47 is set on the inner wall of the fixed ring 41, and the movable groove 47 is set in a ring array. The movable groove 47 is used Install a fixed block 48; a fixed block 48, one end of which is fixedly connected to the outer wall at the bottom of the movable ring 43, and the fixed block 48 is inserted into the inner cavity of the movable groove 47. The fixed block 48 rotates together with the movable ring 43 and rotates in the inner cavity of the movable groove 47; a tension spring 49, one end of which is fixedly connected to one side of the fixed block 48, and the other end of which is fixedly connected to the inner wall of the movable groove 47. When the movable ring 43 drives the plurality of fixed blocks 48 to rotate clockwise, the tension spring 49 is stretched and deformed, and the elastic deformation of the tension spring 49 is used to drive the movable ring 43 to rotate; a fixed disk 410, the upper surface of the fixed disk 410 is fixedly connected to the bottom end of the movable ring 43, and the fixed disk 410 rotates together with the movable ring 43, and is used to push the movable block 413 to rotate. The mounting seat 411 is fixedly connected to the bottom end of the fixing ring 41, and a through hole is provided in the middle thereof. The mounting seat 411 is arranged in a circular ring shape for installing a movable block 413; a mounting groove 412 is arranged on the inner wall of the mounting seat 411, and its inner cavity is arranged to rotate and intersect with the fixing disk 410, and the mounting groove 412 is used for the rotation of the fixing disk 410 and the movable block 413; a movable block 413 is arranged in the inner cavity of the mounting groove 412, and the movable blocks 413 are arranged in a circular array, and four movable blocks 413 form a circular block, which is arranged below the filling gun head 35, and is used to clean the discharge port position of the filling gun head 35 to prevent the microelectronic material from drawing at the filling gun head 35;A fixed shaft 414, the bottom end of which is fixedly connected to the bottom of the inner wall of the mounting groove 412, the fixed shaft 414 and one end of the movable block 413 are arranged to be rotatably interlaced, the fixed shaft 414 is used to install the movable block 413, and the movable block 413 rotates around the fixed shaft 414; a connecting rod 415, one end of which is fixedly connected to one end of the movable block 413, and the connecting rod 415 is used to drive the movable block 413 to rotate; a connecting groove 416, the connecting groove 416 is provided at one end of the connecting rod 415, and is used to install a fixed column 417; a fixed column 417, one end of which is fixedly connected to the lower surface of the fixed disk 410, the fixed column 417 and the inner cavity of the connecting groove 416 are arranged to be interlaced, and a plurality of fixed columns 417 are fixed in a circular array. The lower surface of the fixed disk 410 rotates together with the movable ring 43 and the fixed disk 410, and the fixed column 417 is used to push the connecting rod 415 and the movable block 413 to rotate, and the extrusion block 46 is driven to move vertically downward through the filling gun head 35. The extrusion block 46 enters the inner cavity of the extrusion groove 44, squeezes the inner wall of the extrusion groove 44, and pushes the movable ring 43 to rotate clockwise. The fixed disk 410 rotates together with the movable ring 43, driving multiple fixed columns 417 to push the connecting rod 415, so that the connecting rod 415 drives the movable block 413 to rotate around the fixed shaft 414. When the filling gun head 35 enters the inner cavity of the fixed ring 41 upward, the multiple movable blocks 413 rotate to the bottom end position of the filling gun head 35, and the bottom end of the filling gun head 35 is cleaned and sealed. ;

[0031] Furthermore, the pressing mechanism 5 includes a receiving groove 51, which is opened at the top of one end of the movable block 413, and the receiving groove 51 is easy to install a pressing block 52; a pressing block 52, the upper surface of which fits with the bottom end of the filling gun head 35, and is interlaced with the inner cavity of the receiving groove 51, and the pressing block 52 moves in the vertical direction, and its upper surface fits with the bottom end of the filling gun head 35 to close the bottom end of the filling gun head 35; a positioning block 53, the top end of the positioning block 53 is fixedly connected to the lower surface of the pressing block 52, and the positioning block 53 is interlaced with the bottom of the inner wall of the receiving groove 51, and the positioning block 53 moves in the vertical direction with the pressing block 52, and prevents the pressing block 53 from being pressed. The pressure block 52 rotates; the movable cavity 54, the movable cavity 54 is arranged at the lower position of the accommodating groove 51, and the movable cavity 54 is used to install the compression spring 55; the compression spring 55, the compression spring 55 is arranged in the inner cavity of the movable cavity 54, and the compression spring 55 is arranged at the bottom end of the positioning block 53, and the elastic action of the compression spring 55 is utilized to push the limit block 56 and the top pressure block 52 upward, so that the top pressure block 52 is tightly fitted with the bottom end of the filling gun head 35; the limit block 56, the upper surface of the limit block 56 is fixedly connected to the bottom end of the positioning block 53, and the lower surface of the limit block 56 is fitted with the top end of the compression spring 55, and the limit block 56 moves together with the top pressure block 52 and the positioning block 53 to prevent the top pressure block 52 from separating from the movable block 413.

[0032] The outer wall of the fixed block 48 fits with the inner wall of the movable groove 47, the fixed plate 410 is arranged above the movable block 413, the movable block 413 is arranged in a fan shape, the connecting groove 416 is arranged in a long strip shape, the edge position of the top of the top pressure block 52 is arranged in an inclined surface, the positioning block 53 is arranged in a square block shape, the limit block 56 is arranged in the inner cavity of the movable cavity 54, the top pressure block 52 is arranged in a fan shape, and the top pressure block 52 is arranged in a ring array.

[0033] Method of use of the present invention: First, the processed circuit substrate is fixed on the fixture 32, and then the rotating disk 31 is rotated to drive the circuit substrate to move below the filling gun head 35. The operation of the linear module 33 drives the hydraulic cylinder 34 and the filling gun head 35 to move horizontally. Then, the operation of the hydraulic cylinder 34 drives the filling gun head 35 to move vertically downward, and the position of the filling gun head 35 is adjusted. Next, the extrusion block 46 is driven to move vertically downward by the filling gun head 35, and the extrusion block 46 squeezes the inner wall of the extrusion groove 44, pushing the movable ring 43 to rotate clockwise in the inner cavity of the fixed ring 41. When the extrusion block 46 moves to the bottom of the extrusion groove 44, the extrusion block 46 slides into the inner cavity of the limiting groove 45, and the movable ring 43 drives the fixed block 48 to rotate together, stretching the tension spring 49 to deform, and the fixed plate 410 rotates together with the movable ring 43, driving the multiple fixed columns 417 to rotate clockwise together, and the fixed column 417 pushes the connecting rod 415, and the fixed column 417 slides in the inner cavity of the connecting groove 416, and the connecting rod 415 drives the movable block 413 to rotate and open around the fixed shaft 414, so that the filling gun head 35 is moved out of the inner cavity of the fixed ring 41, and the microelectronic material is squeezed and filled; Then, when the filling gun head 35 moves vertically upward, the elastic effect of the tension spring 49 is used to drive the movable ring 43 to rotate, and the movable block 413 is rotated and closed. The movable block 413 drives multiple pressing blocks 52 to rotate to the bottom of the filling gun head 35. The inclined surface of the pressing block 52 presses the filling gun head 35. The elastic effect of the compression spring 55 is used to push the positioning block 53 and the pressing block 52 upward. The upper surface of the pressing block 52 fits tightly with the bottom end of the filling gun head 35, and the bottom end of the filling gun head 35 is sealed and cleaned.

[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automatic filling device for microelectronic materials, comprising: Machine (1); A bracket (2), the bottom end of the bracket (2) being fixedly connected to one side of the upper surface of the machine platform (1); It is characterized in that it also comprises a filling mechanism (3), a cleaning mechanism (4) and a pressing mechanism (5), wherein the filling mechanism (3) is arranged on the machine platform (1) and is used to fill the microelectronic material onto the circuit substrate; The cleaning mechanism (4) is fixedly mounted on the filling mechanism (3) and is used to clean the discharge port of the filling mechanism (3); The pressing mechanism (5) is arranged on the cleaning mechanism (4) and is used to close the discharge port of the filling mechanism (3).

2. The automatic filling device for microelectronic materials according to claim 1, characterized in that: The filling mechanism (3) comprises: A rotating disk (31), the bottom of the rotating disk (31) being rotatably connected to the upper surface of the machine platform (1) via a bearing; Clamps (32), the clamps (32) being fixedly mounted on the upper surface of the rotating disk (31), and the clamps (32) being arranged in a rectangular array; A linear module (33), wherein the linear module (33) is fixedly mounted on the bracket (2); A hydraulic cylinder (34), wherein the hydraulic cylinder (34) is fixedly mounted on the top of the inner wall of the bracket (2) and is transmission-connected to the linear module (33); A filling gun head (35), wherein the filling gun head (35) is drivingly connected to an output end of the hydraulic cylinder (34).

3. The automatic filling device for microelectronic materials according to claim 2, characterized in that: The cleaning mechanism (4) comprises: A fixing ring (41), the fixing ring (41) being arranged at the bottom of the filling gun head (35), and the inner cavity of the fixing ring (41) being interpenetratingly connected with the bottom of the filling gun head (35); A fixing rod (42), wherein the bottom end of the fixing rod (42) is fixedly connected to one side of the outer wall of the fixing ring (41), and the top end of the fixing rod (42) is fixedly connected to one side of the hydraulic cylinder (34); A movable ring (43), the movable ring (43) being rotatably interlaced in the inner cavity of the fixed ring (41), the movable ring (43) being interlaced with the bottom of the filling gun head (35); An extrusion groove (44), the extrusion groove (44) being provided on one side of the front surface of the movable ring (43), and the bottom of the inner wall of the extrusion groove (44) being arranged in an inclined surface; A limiting groove (45), the limiting groove (45) being arranged on one side of the bottom of the inner wall of the extrusion groove (44), and the limiting groove (45) being arranged vertically; An extrusion block (46), one end of which is fixedly connected to one side of the filling gun head (35) and corresponds to the position of the extrusion groove (44).

4. The automatic filling device for microelectronic materials according to claim 3, characterized in that: The cleaning mechanism (4) further comprises: Movable grooves (47), the movable grooves (47) being arranged on the inner wall of the fixing ring (41), and the movable grooves (47) being arranged in a ring array; a fixed block (48), one end of the fixed block (48) being fixedly connected to the outer wall of the bottom of the movable ring (43), and the fixed block (48) being inserted into the inner cavity of the movable groove (47); a tension spring (49), one end of the tension spring (49) being fixedly connected to one side of the fixed block (48), and the other end of the tension spring (49) being fixedly connected to the inner wall of the movable groove (47); A fixed plate (410), wherein the upper surface of the fixed plate (410) is fixedly connected to the bottom end of the movable ring (43).

5. The automatic filling device for microelectronic materials according to claim 4, characterized in that: The cleaning mechanism (4) further comprises: A mounting seat (411), the upper surface of the mounting seat (411) being fixedly connected to the bottom end of the fixing ring (41), and a through hole being formed in the middle thereof; A mounting groove (412), the mounting groove (412) being formed on the inner wall of the mounting seat (411), the inner cavity of the mounting groove (412) being arranged to rotate and intersect with the fixing plate (410); Movable blocks (413), the movable blocks (413) being arranged in the inner cavity of the mounting groove (412), and the movable blocks (413) being arranged in a ring array; A fixed shaft (414), the bottom end of which is fixedly connected to the bottom of the inner wall of the mounting groove (412), and the fixed shaft (414) and one end of the movable block (413) are rotatably interlaced; A connecting rod (415), one end of which is fixedly connected to one end of the movable block (413); A connecting groove (416), wherein the connecting groove (416) is formed at one end of the connecting rod (415); A fixing column (417), one end of which is fixedly connected to the lower surface of the fixing plate (410), and the fixing column (417) and the inner cavity of the connecting groove (416) are interlaced.

6. The automatic filling device for microelectronic materials according to claim 5, characterized in that: The pressing mechanism (5) comprises: A receiving groove (51), wherein the receiving groove (51) is formed at the top of one end of the movable block (413); A pressing block (52), the upper surface of which is in contact with the bottom end of the filling gun head (35), and which is interlaced with the inner cavity of the containing groove (51); A positioning block (53), the top end of which is fixedly connected to the lower surface of the pressing block (52), and the positioning block (53) and the bottom of the inner wall of the accommodating groove (51) are interlaced.

7. The automatic filling device for microelectronic materials according to claim 6, characterized in that: The pressing mechanism (5) further comprises: An active cavity (54), wherein the active cavity (54) is arranged below the accommodating groove (51); A compression spring (55), wherein the compression spring (55) is arranged in the inner cavity of the movable cavity (54), and the compression spring (55) is arranged at the bottom end of the positioning block (53); A limit block (56), wherein the upper surface of the limit block (56) is fixedly connected to the bottom end of the positioning block (53), and the lower surface of the limit block (56) is in contact with the top end of the compression spring (55).

8. The automatic filling device for microelectronic materials according to claim 7, characterized in that: The outer wall of the fixed block (48) is in contact with the inner wall of the movable groove (47); the fixed plate (410) is arranged above the movable block (413); the movable block (413) is arranged in a fan shape; and the connecting groove (416) is arranged in a long strip shape.

9. The automatic filling device for microelectronic materials according to claim 8, characterized in that: The edge position of the top of the pressing block (52) is arranged in an inclined surface, the positioning block (53) is arranged in a square block shape, the limiting block (56) is arranged in the inner cavity of the movable cavity (54), the pressing block (52) is arranged in a fan shape, and the pressing blocks (52) are arranged in a ring array.

10. The method for using the automatic filling device for microelectronic materials according to any one of claims 1 to 9, characterized in that: The specific usage steps are as follows: Step 1: First, fix the processed circuit substrate on the fixture (32), then rotate the rotating disk (31) to drive the circuit substrate to move below the filling gun head (35), use the operation of the linear module (33) to drive the hydraulic cylinder (34) and the filling gun head (35) to move in the horizontal direction, and then use the operation of the hydraulic cylinder (34) to drive the filling gun head (35) to move vertically downward, so as to adjust the position of the filling gun head (35); Step 2: Next, the extrusion block (46) is driven to move vertically downward by the filling gun head (35). The extrusion block (46) presses the inner wall of the extrusion groove (44), pushing the movable ring (43) to rotate clockwise in the inner cavity of the fixed ring (41). When the extrusion block (46) moves to the bottom of the extrusion groove (44), the extrusion block (46) slides into the inner cavity of the limit groove (45), and the movable ring (43) drives the fixed block (48) to rotate together, pulling the tension spring (49). The fixed disk (410) rotates together with the movable ring (43), driving the plurality of fixed columns (417) to rotate clockwise together, the fixed columns (417) push the connecting rods (415), the fixed columns (417) slide in the inner cavity of the connecting grooves (416), and the connecting rods (415) drive the movable blocks (413) to rotate and open around the fixed shaft (414), so that the filling gun head (35) is moved out of the inner cavity of the fixed ring (41), and the microelectronic material is squeezed and filled; Step 3: Then, when the filling gun head (35) moves vertically upward, the elastic effect of the tension spring (49) is used to drive the movable ring (43) to rotate, and the movable block (413) is rotated and closed. The movable block (413) drives multiple pressing blocks (52) to rotate to the bottom of the filling gun head (35). The inclined surface of the pressing block (52) presses the filling gun head (35). The elastic effect of the compression spring (55) is used to push the positioning block (53) and the pressing block (52) upward. The upper surface of the pressing block (52) is tightly fitted with the bottom end of the filling gun head (35), and the bottom end of the filling gun head (35) is sealed and cleaned.

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