Film coating method and device of flexible circuit board, electronic equipment and storage medium

Abstract

The invention discloses a film coating method and device of a flexible circuit board, electronic equipment and a storage medium, and relates to the technical field of battery energy, and the method comprises the steps: firstly controlling a welding module to weld a nickel sheet to the flexible circuit board; controlling a film pasting module to paste a protective film to the end face of the flexible circuit board; the carrying module is controlled to sequentially carry the first auxiliary material, the base plate, the flexible circuit board, the oil absorption paper and the second auxiliary material to the lower mold plate to form a composite body, the flexible circuit board is pressed and heated through the upper mold plate and the lower mold plate, the scaling powder in the end face of the flexible circuit board is melted and overflows to the oil absorption paper, the oil absorption paper absorbs the scaling powder, and the composite body is formed. And meanwhile, the connection between the protective film and the end face of the flexible circuit board can be reinforced. According to the flexible circuit board laminating device, automatic laminating of the flexible circuit board is achieved, the soldering flux is absorbed through the oil absorption paper in the laminating treatment process, ultrasonic cleaning and manual wiping are not needed, and the production efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the field of battery energy technology, and in particular to a lamination method and device for a flexible circuit board, an electronic device, and a storage medium. Background Art

[0002] In the battery energy industry, the flexible circuit board in the power battery module is generally electrically connected to other components through a nickel sheet. For example, the flexible circuit board on the battery cell is electrically connected to the bus through a nickel sheet. Therefore, it is necessary to first weld the nickel sheet to the flexible circuit board, and then cover the surface of the flexible circuit board with a protective film to protect the copper foil circuit of the flexible circuit board from oxidation and damage, and to avoid the adverse effects of the external environment (such as moisture, dust, mechanical damage, etc.) on the copper foil circuit. In the related art, since flux is required when welding the flexible circuit board and the nickel sheet, the flux will cause pollution to the flexible circuit board and the nickel sheet. In order to remove the pollution, the flexible circuit board needs to be ultrasonically cleaned before lamination, and then the flexible circuit board is manually wiped. After the flux is removed, the lamination is performed, and the production efficiency is very low. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a laminating method, device, electronic device and storage medium for a flexible circuit board, wherein the laminating process does not require ultrasonic cleaning and manual wiping, thereby achieving automatic laminating and improving production efficiency.

[0004] The laminating method of a flexible circuit board according to the first aspect of the present application is applied to a laminating device, wherein the laminating device includes a welding module, a laminating module, a pressing module, a conveying module, a separating module and a curing module; the pressing module includes an upper mold, a lower mold, an upper mold driving assembly, an upper mold heating assembly and a lower mold heating assembly;

[0005] The method comprises:

[0006] Controlling the welding module to weld the nickel sheet to the flexible circuit board;

[0007] Controlling the film sticking module to stick the protective film to the end surface of the flexible circuit board;

[0008] Control the transport module to place the first auxiliary material on the end surface of the lower template, control the transport module to place the pad on the end surface of the first auxiliary material, control the transport module to place the oil-absorbing paper on the end surface of the pad, control the transport module to place the flexible circuit board on the end surface of the oil-absorbing paper, and the side of the flexible circuit board provided with the protective film is away from the oil-absorbing paper, and control the transport module to place the second auxiliary material on the end surface of the flexible circuit board to obtain a composite;

[0009] Controlling the upper mold heating assembly to heat the upper mold so that the temperature of the upper mold reaches a first preset temperature, and controlling the lower mold heating assembly to heat the lower mold so that the temperature of the lower mold reaches the first preset temperature;

[0010] Controlling the upper mold driving assembly to drive the upper mold plate to perform a pressing process on the composite body;

[0011] Controlling the separation module to separate the flexible circuit board from the complex;

[0012] The curing module is controlled to heat and cure the flexible circuit board.

[0013] According to some embodiments of the first aspect of the present application, the controlling the separation module to separate the flexible circuit board from the complex includes:

[0014] Controlling the upper mold driving assembly to drive the upper mold plate to descend, so that the upper mold plate contacts the second auxiliary material in the composite body, and the upper mold plate continuously applies a first preset pressure to the second auxiliary material within a first preset time period;

[0015] After the first preset time period, the upper mold driving assembly is controlled to drive the upper mold plate to continuously apply a second preset pressure to the second auxiliary material within a second preset time period; wherein the second preset time period is greater than the first preset time period, and the second preset pressure is greater than the first preset pressure.

[0016] According to some embodiments of the first aspect of the present application, the welding module includes a welding platform, a welding assembly, a flux nozzle, a clamping assembly, a first driving assembly, and a first clamping assembly;

[0017] The controlling the welding module to weld the nickel sheet to the flexible circuit board comprises:

[0018] Controlling the first driving component to drive the first clamping component to move the flexible circuit board to the pad platform;

[0019] Controlling the first driving assembly to drive the first clamping assembly to move the nickel sheet to the end surface of the flexible circuit board;

[0020] Controlling the pressing assembly to press the nickel sheet against the flexible circuit board;

[0021] The flux nozzle is controlled to spray flux at the connection between the flexible circuit board and the nickel sheet, and the welding assembly is controlled to weld the nickel sheet and the flexible circuit board.

[0022] According to some embodiments of the first aspect of the present application, the film pasting module includes a film pasting platform, an unwinding assembly, a cutting assembly, a second driving assembly, a second clamping assembly, a third driving assembly, a suction assembly, a suction driving assembly, and a third clamping assembly;

[0023] The controlling the film attaching module to attach the protective film to the end surface of the flexible circuit board includes:

[0024] Controlling the second driving assembly to drive the second clamping assembly to clamp the flexible circuit board from the welding platform, and to move the flexible circuit board to the film laminating platform, with the side of the flexible circuit board with the circuit facing upward;

[0025] Controlling the unwinding assembly to release the protective film, and when the protective film is released to a preset length, controlling the unwinding assembly to stop releasing, and controlling the suction driving assembly to drive the suction assembly to approach and suck one side of the protective film;

[0026] Controlling the cutting assembly to cut the protective film so that the protective film is separated from the unwinding assembly;

[0027] Controlling the third driving assembly to drive the third clamping assembly to clamp the release paper on the side of the protective film away from the suction assembly, and controlling the third driving assembly to drive the third clamping assembly away from the protective film, so that the release paper is separated from the protective film;

[0028] The suction driving assembly is controlled to drive the suction assembly to attach the side of the protective film that is not provided with the release paper to the end surface of the flexible circuit board.

[0029] According to some embodiments of the first aspect of the present application, the separation module includes a material taking mechanical arm, a clamping assembly, a separation platform, a fourth clamping assembly, a fourth driving assembly, a fifth clamping assembly and a fifth driving assembly;

[0030] The controlling the separation module to separate the flexible circuit board from the complex comprises:

[0031] Controlling the material taking mechanical arm to move the composite body from the lower template to the separation platform;

[0032] Controlling the pressing component to extend into between the second auxiliary material in the composite body and the backing plate, and controlling the pressing component to contact the backing plate to press the backing plate against the separation platform;

[0033] Controlling the fourth driving assembly to drive the fourth clamping assembly to extend into between the second auxiliary material and the backing plate in the complex, and controlling the fourth clamping assembly to clamp both sides of the flexible circuit board;

[0034] Controlling the fifth driving assembly to drive the fifth clamping assembly to clamp the second auxiliary material, and controlling the fifth driving assembly to drive the fifth clamping assembly to drive the second auxiliary material away from the flexible circuit board;

[0035] The fourth driving assembly is controlled to drive the fourth clamping assembly to drive the flexible circuit board away from the pad.

[0036] According to some embodiments of the first aspect of the present application, the controlling the separation module to separate the flexible circuit board from the complex includes:

[0037] detecting the temperature of the composite body by a temperature sensor;

[0038] When it is detected that the temperature of the composite body is greater than a second preset temperature, controlling the separation module to separate the flexible circuit board from the composite body;

[0039] When it is detected that the temperature of the composite body is lower than the second preset temperature, the upper mold heating assembly is controlled to heat the upper mold plate, and the lower mold heating assembly is controlled to heat the lower mold plate, so that the temperature of the composite body is higher than the second preset temperature.

[0040] According to some embodiments of the first aspect of the present application, the curing module includes a heating box;

[0041] The controlling the curing module to heat and cure the flexible circuit board includes:

[0042] Controlling the fourth driving assembly to drive the fourth clamping assembly to move the flexible circuit board to the heating box;

[0043] The heating box is controlled to heat the flexible circuit board, the heating temperature is 150 degrees Celsius, and the heating time is 60 minutes.

[0044] In a second aspect, the present application provides a laminating device for a flexible circuit board, which is applied to a laminating device, wherein the laminating device includes a welding module, a laminating module, a pressing module, a conveying module, a separating module and a curing module; the pressing module includes an upper mold, a lower mold, an upper mold driving assembly, an upper mold heating assembly and a lower mold heating assembly;

[0045] The device comprises:

[0046] A welding unit, used for controlling the welding module to weld the nickel sheet to the flexible circuit board;

[0047] A laminating unit, used for controlling the laminating module to laminate the protective film onto the end surface of the flexible circuit board;

[0048] A conveying unit, used to control the conveying module to place the first auxiliary material on the end surface of the lower template, control the conveying module to place the pad on the end surface of the first auxiliary material, control the conveying module to place the oil-absorbing paper on the end surface of the pad, control the conveying module to place the flexible circuit board on the end surface of the oil-absorbing paper, and control the conveying module to place the second auxiliary material on the end surface of the flexible circuit board, to obtain a composite body;

[0049] A heating unit, used to control the upper mold heating assembly to heat the upper mold plate so that the temperature of the upper mold plate reaches a first preset temperature, and to control the lower mold heating assembly to heat the lower mold plate so that the temperature of the lower mold plate reaches the first preset temperature;

[0050] A pressing unit, used for controlling the upper mold driving assembly to drive the upper mold plate to perform a pressing process on the composite body;

[0051] A separation unit, used for controlling the separation module to separate the flexible circuit board from the complex;

[0052] The curing unit is used to control the curing module to heat and cure the flexible circuit board.

[0053] A third aspect of the present application provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the method for laminating a flexible circuit board as described in any one of the first aspect embodiments is implemented.

[0054] The fourth aspect of the present application provides a computer-readable storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the method for laminating a flexible circuit board as described in any one of the first aspect of the present application is implemented.

[0055] The laminating method, device, electronic device and storage medium of the flexible circuit board of the embodiment of the present application first control the welding module to weld the nickel sheet to the flexible circuit board, and use flux in the welding process; control the film laminating module to adhere the protective film to the end face of the flexible circuit board; after laminating, control the conveying module to convey the first auxiliary material, the pad, the flexible circuit board, the oil-absorbing paper and the second auxiliary material to the lower template in sequence to form a composite body, and then control the upper mold heating component and the lower mold heating component to heat so that the temperature of the upper template and the lower template both reach the first preset temperature, and then control the upper mold driving component to drive the upper template to press the composite body During the lamination process, the upper and lower templates are used to press and heat the flexible circuit board, so that the flux in the end face of the flexible circuit board melts and overflows to the oil-absorbing paper. The oil-absorbing paper absorbs the flux and can strengthen the connection between the protective film and the end face of the flexible circuit board. The pad is used to support the flexible circuit board so that the connection between the flexible circuit board and the nickel sheet remains flat during the lamination process. After the lamination process, the separation module is controlled to separate the flexible circuit board from the complex. The curing module is controlled to heat and cure the flexible circuit board so that the protective film is fixed to the end face of the flexible circuit board. In this way, the lamination of the flexible circuit board is automatically completed, and the flux is absorbed by the oil-absorbing paper during the lamination process, which can prevent the nickel sheet or the flexible circuit board from being contaminated by the flux, and there is no need for ultrasonic cleaning and manual wiping, which can improve production efficiency.

[0056] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0058] Figure 1 A schematic diagram of the steps of the laminating method for a flexible circuit board according to an embodiment of the present application;

[0059] Figure 2 A schematic diagram of the structure of a pressing module according to an embodiment of the present application;

[0060] Figure 3 A schematic diagram of the structure of a welding module according to an embodiment of the present application;

[0061] Figure 4 A schematic diagram of the structure of a film-sticking module according to an embodiment of the present application;

[0062] Figure 5 A schematic diagram of the structure of a separation module according to an embodiment of the present application;

[0063] Figure 6 A schematic structural diagram of a laminating device for a flexible circuit board according to an embodiment of the present application;

[0064] Figure 7 A schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0065] Reference numerals:

[0066] Upper mold fixing plate 210; upper mold plate 220; upper mold heating assembly 230; lower mold fixing plate 240; lower mold plate 250; lower mold heating assembly 260; thermal insulation layer 270; upper mold driving assembly 280; first driving assembly 310; first clamping assembly 320; welding platform 330; pressing assembly 340; pressing driving assembly 350; flux nozzle 360; welding assembly 370; film pasting platform 410; second clamping assembly 420; second driving assembly 430; third clamping assembly 440; third driving assembly 450; suction assembly 460; suction driving assembly 470; unwinding assembly 480; cutting assembly 490; separation platform 510; fifth clamping assembly 520; fifth driving assembly 530; pressing assembly 540; fourth clamping assembly 550; fourth driving assembly 560. DETAILED DESCRIPTION

[0067] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0068] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0069] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0070] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0071] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0072] The first embodiment of the present application provides a laminating method for a flexible circuit board, which is applied to a laminating device, wherein the laminating device includes a welding module, a laminating module, a pressing module, a conveying module, a separating module and a curing module; the pressing module includes an upper mold plate 220, a lower mold plate 250, an upper mold driving assembly 280, an upper mold heating assembly 230 and a lower mold heating assembly 260. Figure 1 , Figure 1 The schematic diagram of the process flow of the flexible circuit board laminating method according to the embodiment of the present application is shown in FIG. The flexible circuit board laminating method may include but is not limited to steps S110 to S170.

[0073] Step S110, controlling the welding module to weld the nickel sheet to the flexible circuit board;

[0074] In one embodiment, the flexible circuit board is a flexible circuit board in the field of battery energy technology, for example, it can be a flexible circuit board on a battery cell, on which a circuit is provided for monitoring the operating status of the battery cell. The flexible circuit board needs to be electrically connected to a bus through a nickel sheet. The bus is a key component, and its main function is to connect multiple battery cells inside the battery in parallel to realize the collection and transmission of electrical energy.

[0075] It should be noted that when soldering the nickel sheet to the flexible circuit board, in order to ensure the welding quality, flux needs to be injected into the connection between the nickel sheet and the flexible circuit board. Therefore, after the welding is completed, flux will remain on the end surface of the flexible circuit board and the nickel sheet.

[0076] Step S120, controlling the film laminating module to laminar the protective film onto the end surface of the flexible circuit board;

[0077] In one embodiment, the protective film is a PI film, and by attaching the PI film to the end surface of the flexible circuit board, the copper foil circuit on the end surface of the flexible circuit board can be protected to prevent the external environment (such as moisture, dust, mechanical damage, etc.) from causing adverse effects on the copper foil circuit. In addition, the shape of the PI film matches the shape of the flexible circuit board and the nickel sheet, and the protective film is provided with a window, which is used to electrically connect the nickel sheet to other circuits.

[0078] Step S130, controlling the transport module to place the first auxiliary material on the end surface of the lower template, controlling the transport module to place the pad on the end surface of the first auxiliary material, controlling the transport module to place the oil-absorbing paper on the end surface of the pad, controlling the transport module to place the flexible circuit board on the end surface of the oil-absorbing paper, with the side of the flexible circuit board provided with the protective film facing away from the oil-absorbing paper, and controlling the transport module to place the second auxiliary material on the end surface of the flexible circuit board to obtain a composite body;

[0079] In one embodiment, referring to Figure 2 , Figure 2 The schematic diagram of the brief structure of the pressing module of the embodiment of the present application. The control and handling module also includes an upper mold fixing plate 210 and a lower mold fixing plate 240. The upper mold fixing plate 210 is connected to an upper mold driving assembly 280. The upper mold 220 is mounted on the upper mold fixing plate 210, and a heat insulation layer 270 is provided between the upper mold 220 and the upper mold fixing plate 210; the lower mold 250 is mounted on the lower mold fixing plate 240, and a heat insulation layer 270 is provided between the lower mold 250 and the lower mold fixing plate 240. The upper mold heating assembly 230 is installed inside the upper mold 220, and the lower mold heating assembly 260 is installed inside the lower mold 250. Both the upper mold 220 and the lower mold 250 are sintered iron plates, and both the upper mold heating assembly 230 and the lower mold heating assembly 260 are heating rods, which are heated when powered on.

[0080] In one embodiment, a silicon-aluminum foil is provided on a surface of the upper template 220 opposite to the lower template 250, and a silicon-aluminum foil is provided on a surface of the lower template 250 opposite to the upper template 220. The silicon-aluminum foil is used to transfer heat.

[0081] In one embodiment, the first auxiliary material is a thin fiber cloth, and the second auxiliary material is a TPX adhesive film. In the subsequent lamination process, the TPX adhesive film is used to prevent the glue and soldering flux in the protective film from overflowing and contaminating the upper template 220, and the thin fiber cloth has good thermoplasticity and is used to transfer heat.

[0082] In one embodiment, the backing plate is FR4, and during the subsequent lamination process, the backing plate is used to support the flexible circuit board so that the connection between the flexible circuit board and the nickel sheet remains flat during the lamination process.

[0083] Step S140, controlling the upper mold heating assembly to heat the upper mold plate so that the temperature of the upper mold plate reaches a first preset temperature, and controlling the lower mold heating assembly to heat the lower mold plate so that the temperature of the lower mold plate reaches the first preset temperature;

[0084] In one embodiment, the first preset temperature is 180 degrees Celsius. Those skilled in the art can set the first preset temperature based on actual conditions.

[0085] Step S150, controlling the upper mold driving assembly to drive the upper mold plate to perform a pressing process on the composite body;

[0086] Step S160, controlling the separation module to separate the flexible circuit board from the complex;

[0087] Step S170, controlling the curing module to heat and cure the flexible circuit board.

[0088] The laminating method of the flexible circuit board of the embodiment of the present application, through the above steps S110 to S170, first controls the welding module to weld the nickel sheet to the flexible circuit board, and uses flux during the welding process; controls the laminating module to attach the protective film to the end face of the flexible circuit board; after laminating, controls the conveying module to convey the first auxiliary material, the pad, the flexible circuit board, the oil-absorbing paper, and the second auxiliary material to the lower template 250 in sequence to form a composite body, and then controls the upper mold heating component 230 and the lower mold heating component 260 to heat, so that the temperature of the upper template 220 and the lower template 250 both reach the first preset temperature, and then controls the upper mold driving component 280 to drive the upper template 220 to heat the composite body. Lamination process: During the lamination process, the upper template 220 and the lower template 250 are used to press and heat the flexible circuit board, so that the flux in the end face of the flexible circuit board melts and overflows to the oil-absorbing paper. The oil-absorbing paper absorbs the flux and can strengthen the connection between the protective film and the end face of the flexible circuit board, so that the protective film fits tightly to the end face of the flexible circuit board. The pad is used to support the flexible circuit board, so that during the lamination process, the connection between the flexible circuit board and the nickel sheet remains flat. After the lamination process, the separation module is controlled to separate the flexible circuit board from the composite. The curing module is controlled to heat and cure the flexible circuit board so that the protective film is fixed to the end face of the flexible circuit board. In this way, the lamination of the flexible circuit board is automatically completed, and the flux is absorbed by the oil-absorbing paper during the lamination process, which can prevent the nickel sheet or the flexible circuit board from being contaminated by the flux, and there is no need for ultrasonic cleaning and manual wiping, which can improve production efficiency.

[0089] In one embodiment, step S150 may include but is not limited to step S151 and step S152.

[0090] Step S151, controlling the upper mold driving assembly to drive the upper mold plate to descend, so that the upper mold plate contacts the second auxiliary material in the composite body, and the upper mold plate continuously applies a first preset pressure to the second auxiliary material within a first preset time period;

[0091] It is worth noting that the process of step S151 is only a pre-pressing process. Within the first preset time period, since the temperature of the upper template 220 and the lower membrane plate is the first preset temperature, the flexible circuit board is heated, so that the flux on the flexible circuit board and the nickel sheet is melted and squeezed, and the flux flows from the end surface of the flexible circuit board to the oil-absorbing paper, and the oil-absorbing paper absorbs the flux.

[0092] In one embodiment, the first preset time length is 10 seconds, and the first preset pressure is 49N. Those skilled in the art may set the first preset time length and the first preset pressure according to actual conditions.

[0093] Step S152, after the first preset time, control the upper mold driving assembly to drive the upper mold plate to continuously apply a second preset pressure to the second auxiliary material within a second preset time; wherein the second preset time is greater than the first preset time, and the second preset pressure is greater than the first preset pressure.

[0094] It is worth noting that during step S152 , the upper template 220 continuously applies a second preset pressure to the second auxiliary material within a second preset time period, so that the protective film can be closely attached to the end surface of the flexible circuit board.

[0095] In one embodiment, the second preset time length is 200 seconds, and the second preset pressure is 98N. Those skilled in the art may set the first preset time length and the first preset pressure according to actual conditions.

[0096] The embodiment of the present application, through steps S151 to S152, first melts the flux and squeezes it out from between the end face of the flexible circuit board and the protective film, absorbs the flux through oil-absorbing paper, and then makes the protective film fit tightly to the end face of the flexible circuit board, thereby removing the flux without ultrasonic cleaning and manual wiping, and can improve production efficiency.

[0097] In one embodiment, referring to Figure 3 , Figure 3 The schematic diagram of the simplified structure of the welding module of the embodiment of the present application is shown in FIG. The welding module includes a welding platform 330, a welding assembly 370, a flux nozzle 360, a clamping assembly 340, a first driving assembly 310 and a first clamping assembly 320; the first driving assembly 310 is a mechanical arm capable of moving in multiple directions, capable of driving the first clamping assembly 320 to move in multiple directions; the first clamping assembly 320 is provided with two clamping arms and a cylinder, and the cylinder is used to drive the two clamping arms to move closer to or away from each other. The welding module also includes a clamping driving assembly 350, and the structure of the clamping driving assembly 350 is the same as that of the first driving assembly 310. The welding assembly 370 can be a laser welding device, or other welding equipment in the prior art.

[0098] Step S110 may include but is not limited to the following steps:

[0099] Step S111, controlling the first driving assembly to drive the first clamping assembly to move the flexible printed circuit board to the pad platform;

[0100] Step S112, controlling the first driving assembly to drive the first clamping assembly to move the nickel sheet to the end surface of the flexible circuit board;

[0101] In one embodiment, the laminating device further includes a first storage tray (not shown in the figure) and a second storage tray (not shown in the figure), and the first storage tray and the second storage tray are arranged on one side of the welding platform 330; the first storage tray is used to store the flexible circuit board, and the second storage tray is used to store the nickel sheet. The first driving component 310 first drives the first clamping component 320 to clamp the flexible circuit board from the first storage tray, and drives the first clamping component 320 to move the flexible circuit board from the first storage tray to the pad platform; then controls the first driving component 310 to drive the first clamping component 320 to clamp the nickel sheet from the second storage tray, and move the nickel sheet to the end face of the flexible circuit board, and the nickel sheet contacts the pad on the end face of the flexible circuit board, so as to facilitate subsequent welding.

[0102] Step S113, controlling the pressing assembly to press the nickel sheet against the flexible circuit board;

[0103] In one embodiment, the clamping assembly 340 includes a clamping part and a clamping driving part. The clamping driving part is a mechanical arm that can move in multiple directions and can drive the clamping part to move in multiple directions. The clamping driving part drives the clamping part to abut against the nickel sheet, thereby pressing the nickel sheet against the flexible circuit board to avoid shaking between the nickel sheet and the flexible circuit board during subsequent welding.

[0104] Step S114, controlling the flux nozzle to spray flux on the connection between the flexible circuit board and the nickel sheet, and controlling the welding assembly to weld the nickel sheet and the flexible circuit board.

[0105] In one embodiment, the flux nozzle 360 ​​is connected to a nozzle driver, which is a robotic arm that can move in multiple directions. The nozzle driver is used to drive the flux nozzle 360 ​​close to the nickel sheet and the flexible circuit board. The flux nozzle 360 ​​then sprays flux to the connection between the flexible circuit board and the nickel sheet, and controls the welding assembly 370 to weld the nickel sheet and the flexible circuit board. The flux can improve the welding quality.

[0106] In one embodiment, referring to Figure 4 , Figure 4 The following is a schematic diagram of the structure of the film pasting module of the embodiment of the present application. The film pasting module includes a film pasting platform 410, an unwinding assembly 480, a cutting assembly 490, a second driving assembly 430, a second clamping assembly 420, a third driving assembly 450, a suction assembly 460, a suction driving assembly 470 and a third clamping assembly 440; it is worth noting that the suction driving assembly 470, the second driving assembly 430 and the third driving assembly 450 are all mechanical arms that can move in multiple directions. The second clamping assembly 420 includes two clamping arms and a cylinder for driving the two clamping arms to move closer to or away from each other. The third clamping assembly 440 has the same structure as the second clamping assembly 420.

[0107] Step S120 may include but is not limited to the following steps:

[0108] Step S121, controlling the second driving assembly to drive the second clamping assembly to clamp the flexible circuit board from the welding platform, and moving the flexible circuit board to the film laminating platform, with the side of the flexible circuit board with the circuit facing upward;

[0109] Step S122, controlling the unwinding assembly to release the protective film, and when the protective film is released to a preset length, controlling the unwinding assembly to stop releasing, and controlling the suction driving assembly to drive the suction assembly to approach and suck one side of the protective film;

[0110] It is worth noting that the suction component 460 includes a plurality of suction nozzles, and the protective film can be adsorbed by the plurality of suction nozzles so as to make the protective film relatively fixed.

[0111] In one embodiment, the film sticking module is provided with a color sensor (not shown in the figure). When the color sensor senses a preset color, it indicates that the protective film is released to a preset length. At this time, the unwinding component 480 is controlled to stop releasing, and the suction drive component 470 is controlled to drive the suction component 460 to approach and suck one side of the protective film.

[0112] Step S123, controlling the cutting assembly to cut the protective film so that the protective film is separated from the unwinding assembly;

[0113] Step S124, controlling the third driving assembly to drive the third clamping assembly to clamp the release paper on the side of the protective film away from the suction assembly, and controlling the third driving assembly to drive the third clamping assembly away from the protective film, so that the release paper is separated from the protective film;

[0114] In one embodiment, the main body of the protective film is a polyimide (PI) material, and release paper is provided on both sides of the PI material. A convex portion is provided on one side of the release paper, and the convex portion is located on one side of the protective film main body. The third driving component 450 is controlled to drive the third clamping component 440 to clamp the convex portion of the release paper, and then the third driving component 450 is controlled to drive the third clamping component 440 away from the main body of the protective film, so as to tear off the release paper on one side of the protective film.

[0115] Step S125 , controlling the suction driving assembly to drive the suction assembly to attach the side of the protective film without the release paper to the end surface of the flexible circuit board.

[0116] It is worth noting that the suction drive component 470 is first controlled to drive the suction component 460 to drive the protective film, so that the protective film is located directly above the flexible circuit board, and the protective film is parallel to the flexible circuit board, and the side of the protective film with the release paper torn off is opposite to the flexible circuit board, and then the suction drive component 470 is controlled to drive the suction component 460 to drive the protective film to descend, so that the side of the protective film without the release paper is attached to the end face of the flexible circuit board.

[0117] The embodiment of the present application implements the steps S121 to S125 to first cut the protective film from the unwinding component 480, then separate the release paper on one side of the protective film from the protective film, and adhere the side of the protective film without the release paper to the end face of the flexible circuit board, thereby implementing an automated film laminating operation and improving production efficiency.

[0118] In one embodiment, referring to Figure 5 , Figure 5 The schematic diagram of the simple structure of the separation module of the embodiment of the present application. The separation module includes a material picking robot arm (not shown in the figure), a clamping assembly 540, a separation platform 510, a fourth clamping assembly 550, a fourth drive assembly 560, a fifth clamping assembly 520 and a fifth drive assembly 530; the fourth drive assembly 560 and the fifth drive assembly 530 are both robot arms that can move in multiple directions. The fourth clamping assembly 550 includes two long clamping arms and a cylinder for driving the two long clamping arms to move closer to or away from each other. The fifth clamping assembly 520 has the same structure as the third clamping assembly 440.

[0119] Step S160 may include the following steps:

[0120] Step S161, controlling the material taking robot arm to move the composite body from the lower template to the separation platform;

[0121] Step S162, controlling the pressing component to extend into between the second auxiliary material in the composite body and the backing plate, and controlling the pressing component 540 to contact the backing plate, so as to press the backing plate against the separation platform;

[0122] Step S163, controlling the fourth driving assembly to drive the fourth clamping assembly to extend into between the second auxiliary material and the backing plate in the complex, and controlling the fourth clamping assembly to clamp both sides of the flexible circuit board;

[0123] It is worth noting that the sizes of the second auxiliary material, the first auxiliary material and the pad are all larger than the sizes of the flexible circuit board. Therefore, the fourth driving component 560 can be controlled to drive the fourth clamping component 550 to extend between the second auxiliary material and the pad, thereby controlling the fourth clamping component 550 to clamp both sides of the circuit board.

[0124] Step S164, controlling the fifth driving assembly to drive the fifth clamping assembly to clamp the second auxiliary material, and controlling the fifth driving assembly to drive the fifth clamping assembly to drive the second auxiliary material away from the flexible circuit board;

[0125] Step S165, controlling the fourth driving assembly to drive the fourth clamping assembly to drive the flexible printed circuit board away from the pad.

[0126] In the embodiment of the present application, through steps S161 to S165, the flexible circuit board is separated from the composite body, so as to facilitate the subsequent heating and curing of the flexible circuit board.

[0127] In one embodiment, step S160 further includes the following steps:

[0128] Step S166, detecting the temperature of the complex by a temperature sensor;

[0129] Step S167, when it is detected that the temperature of the composite body is greater than the second preset temperature, controlling the separation module to separate the flexible circuit board from the composite body;

[0130] Step S168, when it is detected that the temperature of the composite body is lower than the second preset temperature, the upper mold heating assembly 230 is controlled to heat the upper mold plate, and the lower mold heating assembly is controlled to heat the lower mold plate, so that the temperature of the composite body is higher than the second preset temperature.

[0131] It is understandable that if the separation is performed when the temperature of the composite is lower than the second preset temperature, the protective film may be damaged. Therefore, through steps S166 to S168, the separation module is controlled to separate the flexible circuit board from the composite only when the temperature of the composite reaches the second preset temperature. If the temperature of the composite is lower than the second preset temperature, the upper mold heating assembly 230 is controlled to heat the upper mold plate 220, and the lower mold heating assembly 260 is controlled to heat the lower mold plate 250, so that the temperature of the composite is higher than the second preset temperature.

[0132] In one embodiment, the temperature sensor is an infrared temperature sensor.

[0133] In one embodiment, the curing module includes a heating box (not shown);

[0134] Step S170 includes the following steps:

[0135] Step S171, controlling the fourth driving assembly 560 to drive the fourth clamping assembly 550 to move the flexible printed circuit board to the heating box;

[0136] Step S172, controlling the heating box to heat the flexible printed circuit board, the heating temperature is 150 degrees Celsius, and the heating time is 60 minutes.

[0137] Specifically, the protective film is a PI film, which has good thermosetting properties. By heating the flexible circuit board and the protective film through step S171 to step S172, the strength and stability of the protective film can be enhanced.

[0138] The second aspect of the present application provides a coating device for a flexible circuit board, which is applied to the above-mentioned coating equipment; Figure 6 , Figure 6 Schematic diagram of the structure of the laminating device for the flexible circuit board according to the embodiment of the present application.

[0139] The device includes:

[0140] The welding unit 610 is used to control the welding module to weld the nickel sheet to the flexible circuit board;

[0141] The laminating unit 620 is used to control the film laminating module to laminat the protective film onto the end surface of the flexible circuit board;

[0142] The conveying unit 630 is used to control the conveying module to place the first auxiliary material on the end surface of the lower template 250, control the conveying module to place the pad on the end surface of the first auxiliary material, control the conveying module to place the oil-absorbing paper on the end surface of the pad, control the conveying module to place the flexible circuit board on the end surface of the oil-absorbing paper, and control the conveying module to place the second auxiliary material on the end surface of the flexible circuit board, so as to obtain a composite body;

[0143] The heating unit 640 is used to control the upper mold heating assembly 230 to heat the upper mold plate 220 so that the temperature of the upper mold plate 220 reaches a first preset temperature, and control the lower mold heating assembly 260 to heat the lower mold plate 250 so that the temperature of the lower mold plate 250 reaches the first preset temperature;

[0144] The pressing unit 650 is used to control the upper mold driving assembly 280 to drive the upper mold plate 220 to press the composite body;

[0145] A separation unit 660, used to control the separation module to separate the flexible circuit board from the complex;

[0146] The curing unit 670 is used to control the curing module to heat and cure the flexible circuit board.

[0147] The laminating device for a flexible circuit board of an embodiment of the present application is used to execute the laminating method for a flexible circuit board of an embodiment of the first aspect of the present application. When executing the laminating method, the welding module is first controlled to weld the nickel sheet to the flexible circuit board, and flux is used during the welding process; the laminating module is controlled to adhere the protective film to the end face of the flexible circuit board; after laminating, the conveying module is controlled to convey the first auxiliary material, the pad, the flexible circuit board, the oil-absorbing paper, and the second auxiliary material to the lower template 250 in sequence to form a composite body, and then the upper mold heating component 230 and the lower mold heating component 260 are controlled to heat so that the temperature of the upper template 220 and the lower template 250 both reach the first preset temperature, and then the upper mold driving component is controlled 280 drives the upper template 220 to perform a lamination process on the composite body. During the lamination process, the upper template 220 and the lower template 250 are used to press and heat the flexible circuit board, so that the flux in the end face of the flexible circuit board melts and overflows to the oil-absorbing paper. The oil-absorbing paper absorbs the flux and can strengthen the connection between the protective film and the end face of the flexible circuit board. The pad is used to support the flexible circuit board so that the connection between the flexible circuit board and the nickel sheet remains flat during the lamination process. After the lamination process, the separation module is controlled to separate the flexible circuit board from the composite body. The curing module is controlled to heat and cure the flexible circuit board so that the protective film is fixed to the end face of the flexible circuit board. In this way, the lamination of the flexible circuit board is automatically completed, and the flux is absorbed by the oil-absorbing paper during the lamination process, which can prevent the nickel sheet or the flexible circuit board from being contaminated by the flux, and there is no need for ultrasonic cleaning and manual wiping, which can improve production efficiency.

[0148] It should be noted that the specific implementation of the coating device for the flexible circuit board is basically the same as the specific implementation of the coating method for the flexible circuit board described above, and will not be repeated here. On the premise of meeting the requirements of the embodiments of the present application, the coating device for the flexible circuit board can also be provided with other functional units to implement the coating method for the flexible circuit board in the above embodiments.

[0149] The third aspect of the present application provides an electronic device, the electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the lamination method of the flexible circuit board of any one of the first aspect embodiments when executing the computer program. The electronic device can be any smart terminal including a tablet computer, a car computer, etc.

[0150] Reference Figure 7 , Figure 7 FIG. 1 is a schematic diagram of the structure of an electronic device according to an embodiment of the present invention. The electronic device includes:

[0151] The processor 701 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0152] The memory 702 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 702 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 702, and the processor 701 calls and executes the lamination method of the flexible circuit board of the embodiment of the present application;

[0153] Input / output interface 703, used to implement information input and output;

[0154] Communication interface 704, used to realize communication interaction between the device and other devices, which can be realized through wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.);

[0155] A bus 705 that transmits information between the various components of the device (e.g., the processor 701, the memory 702, the input / output interface 703, and the communication interface 704);

[0156] The processor 701 , the memory 702 , the input / output interface 703 and the communication interface 704 are connected to each other in communication within the device via a bus 705 .

[0157] A fourth aspect of the present application provides a computer-readable storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the method for laminating a flexible circuit board of any one of the first aspect embodiments is implemented.

[0158] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0159] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0160] Those skilled in the art will appreciate that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0161] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0162] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0163] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0164] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the mapping relationship of the mapping objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next mapping objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0165] In the several embodiments provided in the present application, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system embodiments described above are merely schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0166] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0167] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0168] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store programs.

[0169] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A method for laminating a flexible circuit board, characterized in that: Applied to laminating equipment, the laminating equipment includes a welding module, a film pasting module, a pressing module, a conveying module, a separation module and a curing module; the pressing module includes an upper mold, a lower mold, an upper mold driving component, an upper mold heating component and a lower mold heating component; The method comprises: Controlling the welding module to weld the nickel sheet to the flexible circuit board; Controlling the film sticking module to stick the protective film to the end surface of the flexible circuit board; Control the transport module to place the first auxiliary material on the end surface of the lower template, control the transport module to place the pad on the end surface of the first auxiliary material, control the transport module to place the oil-absorbing paper on the end surface of the pad, control the transport module to place the flexible circuit board on the end surface of the oil-absorbing paper, and the side of the flexible circuit board provided with the protective film is away from the oil-absorbing paper, and control the transport module to place the second auxiliary material on the end surface of the flexible circuit board to obtain a composite; Controlling the upper mold heating assembly to heat the upper mold so that the temperature of the upper mold reaches a first preset temperature, and controlling the lower mold heating assembly to heat the lower mold so that the temperature of the lower mold reaches the first preset temperature; Controlling the upper mold driving assembly to drive the upper mold plate to perform a pressing process on the composite body; Controlling the separation module to separate the flexible circuit board from the complex; The curing module is controlled to heat and cure the flexible circuit board.

2. The method for laminating a flexible circuit board according to claim 1, characterized in that: The controlling the separation module to separate the flexible circuit board from the complex comprises: Controlling the upper mold driving assembly to drive the upper mold plate to descend, so that the upper mold plate contacts the second auxiliary material in the composite body, and the upper mold plate continuously applies a first preset pressure to the second auxiliary material within a first preset time period; After the first preset time period, the upper mold driving assembly is controlled to drive the upper mold plate to continuously apply a second preset pressure to the second auxiliary material within a second preset time period; wherein the second preset time period is greater than the first preset time period, and the second preset pressure is greater than the first preset pressure.

3. The method for laminating a flexible circuit board according to claim 1, characterized in that: The welding module includes a welding platform, a welding assembly, a flux nozzle, a pressing assembly, a first driving assembly and a first clamping assembly; The controlling the welding module to weld the nickel sheet to the flexible circuit board comprises: Controlling the first driving component to drive the first clamping component to move the flexible circuit board to the pad platform; Controlling the first driving assembly to drive the first clamping assembly to move the nickel sheet to the end surface of the flexible circuit board; Controlling the pressing assembly to press the nickel sheet against the flexible circuit board; The flux nozzle is controlled to spray flux at the connection between the flexible circuit board and the nickel sheet, and the welding assembly is controlled to weld the nickel sheet and the flexible circuit board.

4. The method for laminating a flexible circuit board according to claim 3, characterized in that: The film pasting module includes a film pasting platform, a reeling assembly, a cutting assembly, a second driving assembly, a second clamping assembly, a third driving assembly, a suction assembly, a suction driving assembly and a third clamping assembly; The controlling the film attaching module to attach the protective film to the end surface of the flexible circuit board includes: Controlling the second driving assembly to drive the second clamping assembly to clamp the flexible circuit board from the welding platform, and to move the flexible circuit board to the film laminating platform, with the side of the flexible circuit board with the circuit facing upward; Controlling the unwinding assembly to release the protective film, and when the protective film is released to a preset length, controlling the unwinding assembly to stop releasing, and controlling the suction driving assembly to drive the suction assembly to approach and suck one side of the protective film; Controlling the cutting assembly to cut the protective film so that the protective film is separated from the unwinding assembly; Controlling the third driving assembly to drive the third clamping assembly to clamp the release paper on the side of the protective film away from the suction assembly, and controlling the third driving assembly to drive the third clamping assembly away from the protective film, so that the release paper is separated from the protective film; The suction driving assembly is controlled to drive the suction assembly to attach the side of the protective film that is not provided with the release paper to the end surface of the flexible circuit board.

5. The laminating method for a flexible circuit board according to claim 1, characterized in that: The separation module includes a material taking mechanical arm, a clamping assembly, a separation platform, a fourth clamping assembly, a fourth driving assembly, a fifth clamping assembly and a fifth driving assembly; The controlling the separation module to separate the flexible circuit board from the complex comprises: Controlling the material taking mechanical arm to move the composite body from the lower template to the separation platform; Controlling the pressing component to extend into between the second auxiliary material in the composite body and the backing plate, and controlling the pressing component to contact the backing plate to press the backing plate against the separation platform; Controlling the fourth driving assembly to drive the fourth clamping assembly to extend into between the second auxiliary material and the backing plate in the complex, and controlling the fourth clamping assembly to clamp both sides of the flexible circuit board; Controlling the fifth driving assembly to drive the fifth clamping assembly to clamp the second auxiliary material, and controlling the fifth driving assembly to drive the fifth clamping assembly to drive the second auxiliary material away from the flexible circuit board; The fourth driving assembly is controlled to drive the fourth clamping assembly to drive the flexible circuit board away from the pad.

6. The method for laminating a flexible circuit board according to claim 1, characterized in that: The controlling the separation module to separate the flexible circuit board from the complex comprises: detecting the temperature of the composite body by a temperature sensor; When it is detected that the temperature of the composite body is greater than a second preset temperature, controlling the separation module to separate the flexible circuit board from the composite body; When it is detected that the temperature of the composite body is lower than the second preset temperature, the upper mold heating assembly is controlled to heat the upper mold plate, and the lower mold heating assembly is controlled to heat the lower mold plate, so that the temperature of the composite body is higher than the second preset temperature.

7. The method for laminating a flexible circuit board according to claim 5, characterized in that: The curing module includes a heating box; The controlling the curing module to heat and cure the flexible circuit board includes: Controlling the fourth driving assembly to drive the fourth clamping assembly to move the flexible circuit board to the heating box; The heating box is controlled to heat the flexible circuit board, the heating temperature is 150 degrees Celsius, and the heating time is 60 minutes.

8. A laminating device for a flexible circuit board, characterized in that: Applied to laminating equipment, the laminating equipment includes a welding module, a film pasting module, a pressing module, a conveying module, a separation module and a curing module; the pressing module includes an upper mold, a lower mold, an upper mold driving component, an upper mold heating component and a lower mold heating component; The device comprises: A welding unit, used for controlling the welding module to weld the nickel sheet to the flexible circuit board; A laminating unit, used for controlling the laminating module to laminate the protective film onto the end surface of the flexible circuit board; A conveying unit, used to control the conveying module to place the first auxiliary material on the end surface of the lower template, control the conveying module to place the pad on the end surface of the first auxiliary material, control the conveying module to place the oil-absorbing paper on the end surface of the pad, control the conveying module to place the flexible circuit board on the end surface of the oil-absorbing paper, and control the conveying module to place the second auxiliary material on the end surface of the flexible circuit board, to obtain a composite body; A heating unit, used to control the upper mold heating assembly to heat the upper mold plate so that the temperature of the upper mold plate reaches a first preset temperature, and to control the lower mold heating assembly to heat the lower mold plate so that the temperature of the lower mold plate reaches the first preset temperature; A pressing unit, used for controlling the upper mold driving assembly to drive the upper mold plate to perform a pressing process on the composite body; A separation unit, used for controlling the separation module to separate the flexible circuit board from the complex; The curing unit is used to control the curing module to heat and cure the flexible circuit board.

9. An electronic device, characterized in that: The electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the flexible circuit board lamination method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the flexible circuit board lamination method according to any one of claims 1 to 7 is implemented.

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