Wafer alignment processing method, wafer alignment processing device, electronic equipment and wafer alignment processing system
By pre-establishing an alignment condition database that meets the preset assessment conditions, and automatically selecting and applying appropriate alignment conditions, the matrix damage and photoresist loss caused by reworking treatment when wafer alignment fails, and improving processing efficiency and wafer yield.
Patent Information
- Application Number
- CN202311412759.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-27
- Publication Date
- 2025-04-29
AI Technical Summary
In the event of wafer alignment failure, the reworking process results in increased wafer matrix damage and photoresist loss, and low processing efficiency.
By obtaining the target alignment condition database that meets the preset assessment conditions in advance, the appropriate alignment conditions are automatically called to align the alignment wafer. If the preset conditions are not met, other conditions are called to avoid reworking.
It reduces matrix damage and photoresist loss when wafer alignment fails, improves the processing efficiency of wafer failure, and improves wafer yield.
Smart Images
Figure CN119902416A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of integrated circuit manufacturing technology, and in particular to a wafer alignment processing method, device, electronic equipment and system. Background Art
[0002] Photolithography machine alignment is a key step in obtaining a good exposure pattern, and the alignment conditions need to meet the set assessment conditions before exposure can be performed. During the process, the alignment conditions are not applicable to all wafers, resulting in wafer alignment failure, which in turn causes the wafer to fail to be exposed. At present, for abnormal wafers (i.e. wafers with failed alignment), rework is directly adopted to remove the photoresist on the abnormal wafer, analyze the cause of the alignment failure, and then re-apply the photoresist and try new alignment conditions. In the process of removing the photoresist, the wafer substrate will be damaged to varying degrees, which is a potential risk to the wafer yield and also increases the loss of photoresist.
[0003] Therefore, how to solve the above technical problems should be the focus of technical personnel in this field. Summary of the invention
[0004] The purpose of the present application is to provide a wafer alignment processing method, device, electronic equipment and system to reduce damage to the wafer and photoresist loss, and improve the processing efficiency of wafers with failed alignment.
[0005] In order to solve the above technical problems, the present application provides a wafer alignment processing method, comprising:
[0006] Obtaining an alignment condition database; the alignment condition database includes target alignment conditions that meet preset assessment conditions;
[0007] Determine whether aligning the wafer to be aligned using the target alignment condition satisfies a preset alignment condition;
[0008] If the preset alignment condition is met, calling the target alignment condition to align the wafer to be aligned;
[0009] If the preset alignment condition is not met, other alignment conditions are called to align the wafer to be aligned to meet the preset alignment condition.
[0010] Optionally, the alignment condition database includes at least two of the target alignment conditions and assessment scores corresponding to the target alignment conditions;
[0011] Determining whether aligning the wafer to be aligned using the target alignment condition satisfies a preset alignment condition; if the preset alignment condition is satisfied, calling the target alignment condition to align the wafer to be aligned; if the preset alignment condition is not satisfied, calling other alignment conditions to align the wafer to be aligned, so as to satisfy the preset alignment condition includes:
[0012] Determine whether aligning the wafer to be aligned using the first target alignment condition satisfies the preset alignment condition; the first target alignment condition is the target alignment condition with the highest assessment score;
[0013] If aligning the wafer to be aligned using the first target alignment condition satisfies the preset alignment condition, calling the first target alignment condition to align the wafer to be aligned;
[0014] If the alignment of the wafer to be aligned using the first target alignment condition does not satisfy the preset alignment condition, determining whether the alignment of the wafer to be aligned using the second target alignment condition satisfies the preset alignment condition; the second target alignment condition is the target alignment condition with the second highest assessment score;
[0015] If aligning the wafer to be aligned using the second target alignment condition satisfies the preset alignment condition, calling the second target alignment condition to align the wafer to be aligned;
[0016] If aligning the wafer to be aligned using the second target alignment condition does not satisfy the preset alignment condition, then calling other alignment conditions to align the wafer to be aligned to satisfy the preset alignment condition is performed.
[0017] Optionally, after aligning the wafer to be aligned, the method further includes:
[0018] After the wafer to be aligned is exposed, an overlay error of the wafer to be aligned is obtained;
[0019] Determining whether the overlay error is within a preset error range;
[0020] If the overlay error is not within the preset error range, then determining the influencing factors of the overlay error not being within the preset error range.
[0021] Optionally, obtaining an alignment condition database includes:
[0022] Evaluate the wafer that has failed alignment and determine a plurality of alignment conditions; each alignment condition includes a combination of a light source and an alignment mark;
[0023] Obtain alignment assessment data corresponding to each alignment condition;
[0024] Determine whether the alignment assessment data meets the preset assessment conditions;
[0025] If the alignment assessment data meets the preset assessment condition, determining the assessment score corresponding to the alignment condition;
[0026] Establishing an alignment database with all the alignment conditions and the assessment scores that satisfy the preset assessment conditions;
[0027] If the alignment assessment data does not meet the preset assessment conditions, the corresponding alignment conditions are deleted.
[0028] Optionally, the alignment assessment data includes any one or any combination of a multiple correlation coefficient, a wafer alignment mark signal strength, and an alignment mark signal deviation;
[0029] Determining whether the alignment assessment data meets the preset assessment conditions includes:
[0030] Determine whether each parameter in the alignment assessment data satisfies the corresponding preset assessment condition;
[0031] If the alignment assessment data meets the preset assessment condition, determining the assessment score corresponding to the alignment condition includes:
[0032] If each parameter satisfies the corresponding preset assessment condition, the assessment score corresponding to the alignment condition is determined.
[0033] Optionally, calling other alignment conditions to align the wafer to be aligned to meet the preset alignment condition includes:
[0034] evaluating the wafer to be aligned and determining customized alignment conditions for the wafer to be aligned;
[0035] The customized alignment condition is called to align the wafer to be aligned to meet the preset alignment condition.
[0036] Optionally, determining whether aligning the wafer to be aligned using the target alignment condition satisfies a preset alignment condition includes:
[0037] Using the target alignment conditions to align with the marks on the wafer to be aligned respectively;
[0038] determining a number of markers that can be aligned using the target alignment condition;
[0039] Determining whether the quantity reaches a preset quantity threshold;
[0040] If the preset alignment condition is met, calling the target alignment condition to align the wafer to be aligned includes:
[0041] If the number reaches the preset number threshold, calling the target alignment condition to align the wafer to be aligned;
[0042] If the preset alignment condition is not met, calling other alignment conditions to align the wafer to be aligned, so as to meet the preset alignment condition includes:
[0043] If the number does not reach the preset number threshold, other alignment conditions are called to align the wafer to be aligned to meet the preset alignment condition.
[0044] The present application also provides a wafer alignment processing device, comprising:
[0045] An acquisition module, used to acquire an alignment condition database; the alignment condition database includes target alignment conditions that meet preset assessment conditions;
[0046] A first judgment module is used to judge whether the alignment of the wafer to be aligned using the target alignment condition meets the preset alignment condition;
[0047] A first alignment module, configured to call the target alignment condition to align the wafer to be aligned if the preset alignment condition is met;
[0048] The second alignment module is used to call other alignment conditions to align the wafer to be aligned if the preset alignment condition is not met, so as to meet the preset alignment condition.
[0049] The present application also provides an electronic device, including:
[0050] Memory for storing computer programs;
[0051] A processor is used to implement the steps of any one of the above-mentioned wafer alignment processing methods when executing the computer program.
[0052] The present application also provides a wafer alignment processing system, comprising:
[0053] The electronic device mentioned above;
[0054] A photolithography machine connected to the electronic device.
[0055] A wafer alignment processing method provided in the present application includes: obtaining an alignment condition database; the alignment condition database includes target alignment conditions that meet preset assessment conditions; judging whether aligning a wafer to be aligned using the target alignment conditions meets the preset alignment conditions; if the preset alignment conditions are met, calling the target alignment conditions to align the wafer to be aligned; if the preset alignment conditions are not met, calling other alignment conditions to align the wafer to be aligned to meet the preset alignment conditions.
[0056] It can be seen that in this application, the target alignment conditions that meet the preset assessment conditions are obtained in advance. For the wafer to be aligned, the target alignment conditions are used for alignment and it is determined whether the preset alignment conditions are met. If they are met, the target alignment conditions are called for alignment processing. If they are not met, other alignment conditions are called for alignment processing. This method can realize automatic calling of alignment conditions to align the wafer to be aligned, thereby improving the efficiency of wafer alignment; and it can avoid reworking of wafers with abnormal alignment within the process time limit, reduce damage to the wafer substrate, improve wafer yield, and reduce photoresist loss.
[0057] In addition, the present application also provides a device, an electronic device and a system having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS
[0058] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0059] Figure 1 A process of a wafer alignment processing method provided in an embodiment of the present application Figure 1 ;
[0060] Figure 2 A flowchart of obtaining an alignment condition database provided in an embodiment of the present application;
[0061] Figure 3 A process of a wafer alignment processing method provided in an embodiment of the present application Figure 2 ;
[0062] Figure 4 A process of a wafer alignment processing method provided in an embodiment of the present application Figure 3 ;
[0063] Figure 5 A structural block diagram of a wafer alignment processing device provided in an embodiment of the present application;
[0064] Figure 6 A structural block diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION
[0065] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0066] As mentioned in the background technology section, currently, abnormal wafers are directly reworked to remove the photoresist on the abnormal wafers, analyze the cause of alignment failure, and then re-apply the photoresist and try new alignment conditions, which can easily damage the wafers and increase the loss of photoresist.
[0067] In view of this, the present application provides a wafer alignment processing method, please refer to Figure 1 , the method comprising:
[0068] Step S101: obtaining an alignment condition database; the alignment condition database includes target alignment conditions that meet preset assessment conditions.
[0069] It should be noted that the present application does not limit the number of target alignment conditions in the alignment condition database, which can be one or more than two.
[0070] As an implementation option, please refer to Figure 2 , obtain the alignment condition database including:
[0071] Step S1011: Evaluate the wafer that has failed alignment and determine a plurality of alignment conditions; each alignment condition includes a combination of a light source and an alignment mark.
[0072] When evaluating wafers that have failed alignment, different light sources and different alignment marks are arranged and combined, and the best combination is selected as the alignment condition. The specific evaluation process is well known to those skilled in the art.
[0073] A wafer with misalignment can identify multiple alignment conditions. There are usually multiple alignment marks on the wafer and mask, and a single wafer with misalignment can identify multiple alignment conditions through different combinations.
[0074] The combination of light source and alignment mark corresponds to an alignment condition.
[0075] Step S1012: Obtain alignment assessment data corresponding to each alignment condition.
[0076] The alignment assessment data includes at least one parameter, for example, the alignment assessment data includes but is not limited to any one or any combination of a multi-correction coefficient (MCC), a wafer alignment mark signal strength (wafer quality, WQ), and an alignment mark signal deviation (Delta shift). Among them, the wafer alignment mark signal strength represents the light intensity reception signal of the wafer alignment mark.
[0077] Step S1013: Determine whether the alignment assessment data meets preset assessment conditions.
[0078] As an implementable embodiment, when the alignment assessment data includes at least two parameters, determining whether the alignment assessment data meets the preset assessment conditions includes:
[0079] Determine whether each parameter in the alignment assessment data satisfies the corresponding preset assessment conditions.
[0080] Each parameter corresponds to a preset assessment condition, which is not specifically limited in this application and depends on the circumstances.
[0081] For example, for the multiple correlation coefficient, the preset assessment condition is that the multiple correlation coefficient value is greater than 0.1. The larger the value of the multiple correlation coefficient, the better.
[0082] For the wafer alignment mark signal strength, the preset assessment condition is that the value of the wafer alignment mark signal strength is greater than 0.8. The larger the value of the wafer alignment mark signal strength, the better.
[0083] For alignment mark signal deviation, for SPM type alignment marks (scribeline prime marks use dense lines with periods of 8 microns and 8.8 microns), the preset condition is that the offset of the mark light intensity peaks of the two periods is less than 300nm. The smaller the offset, the better.
[0084] Step S1014: If the alignment assessment data meets the preset assessment condition, the assessment score corresponding to the alignment condition is determined.
[0085] The assessment score is obtained by evaluating each parameter in the assessment data. For example, the assessment score can be obtained by drawing a multidimensional coordinate graph based on the multiple correlation coefficient, the wafer alignment mark signal strength, and the alignment mark signal deviation, and the value with the largest multiple correlation coefficient, the largest wafer alignment mark signal strength, and the smallest alignment mark signal deviation is selected.
[0086] It should be pointed out that the specific parameters to be selected, the proportion of each parameter and the size of the score can be set according to needs and are not specifically limited in this application.
[0087] When the alignment assessment data includes at least two parameters, if the alignment assessment data meets the preset assessment condition, determining the assessment score corresponding to the alignment condition includes:
[0088] If each parameter satisfies the corresponding preset assessment condition, the assessment score corresponding to the alignment condition is determined.
[0089] Step S1015: All the alignment conditions and the assessment scores that satisfy the preset assessment conditions are established to form an alignment database.
[0090] Each alignment condition corresponds to an alignment assessment data and an assessment score.
[0091] Step S1016: If the alignment assessment data does not meet the preset assessment conditions, the corresponding alignment conditions are deleted.
[0092] It can be understood that as long as there is a parameter in the alignment assessment data that does not meet the corresponding preset assessment condition, the alignment condition corresponding to the alignment assessment data does not meet the preset assessment condition and cannot be used as the target alignment condition.
[0093] In this application, wafers that have failed alignment are evaluated, wafer data is collected and analyzed in situ, and an alignment database is established, which helps engineers to efficiently optimize alignment conditions.
[0094] Step S102: Determine whether aligning the wafer to be aligned using the target alignment condition satisfies a preset alignment condition.
[0095] The wafer to be aligned is aligned using the target alignment conditions, that is, the combination of the light source and the alignment mark in the target alignment conditions is aligned with the mark on the wafer to be aligned.
[0096] There are multiple marks on the wafer to be aligned, and the preset alignment condition can be the minimum number of combinations of the light source and the alignment mark that can be aligned with the marks on the wafer to be aligned. For example, assuming that there are 56 marks on the wafer to be aligned, the preset condition is that the number of combinations of the light source and the alignment mark that can be aligned with the marks on the wafer to be aligned is at least 30.
[0097] Step S103: If the preset alignment condition is met, the target alignment condition is called to align the wafer to be aligned.
[0098] When the number of combinations of the light source and the alignment mark that can be aligned with the marks on the wafer to be aligned reaches a set number threshold, it is determined that the target alignment condition meets the preset alignment condition and the target alignment condition can be used for alignment.
[0099] Step S104: If the preset alignment condition is not satisfied, other alignment conditions are called to align the wafer to be aligned so as to satisfy the preset alignment condition.
[0100] When the number of combinations of light sources and alignment marks that can be aligned with the marks on the wafer to be aligned does not reach the set number threshold, it is determined that the target alignment condition does not meet the preset alignment condition and the target alignment condition cannot be used to align the wafer to be aligned.
[0101] As an implementable method, calling other alignment conditions to align the wafer to be aligned to meet the preset alignment condition includes:
[0102] evaluating the wafer to be aligned and determining customized alignment conditions for the wafer to be aligned;
[0103] The customized alignment condition is called to align the wafer to be aligned to meet the preset alignment condition.
[0104] The wafer to be aligned is evaluated, the alignment conditions of the wafer to be aligned are personalized, and the customized alignment conditions suitable for itself are determined, that is, a suitable combination of light source and alignment mark is determined so that the number of marks on the wafer to be aligned that can be aligned with the customized alignment conditions reaches a quantity threshold.
[0105] In this embodiment, the target alignment conditions that meet the preset assessment conditions are obtained in advance. For the wafer to be aligned, the target alignment conditions are used for alignment and it is determined whether the preset alignment conditions are met. If they are met, the target alignment conditions are called for alignment processing. If they are not met, other alignment conditions are called for alignment processing. This method can realize automatic calling of alignment conditions to align the wafer to be aligned, thereby improving the efficiency of wafer alignment; and it can avoid reworking of wafers with abnormal alignment within the process time limit, reduce damage to the wafer substrate, improve the wafer yield, and reduce photoresist loss.
[0106] Please refer to Figure 3 Based on the above embodiments, in one embodiment of the present application, a wafer alignment processing method includes:
[0107] Step S201: obtaining an alignment condition database; the alignment condition database includes target alignment conditions that meet preset assessment conditions.
[0108] Step S202: using the target alignment conditions to align with the marks on the wafer to be aligned respectively.
[0109] There are multiple marks on the wafer to be aligned, and alignment is performed using a combination of a light source and alignment marks in the target alignment conditions and the marks on the wafer to be aligned.
[0110] Step S203: Determine the number of markers that can be aligned using the target alignment condition.
[0111] Step S204: Determine whether the quantity reaches a preset quantity threshold.
[0112] The preset number threshold is not limited in this application and can be set by oneself. For example, when there are 56 marks on the wafer to be aligned, the preset number threshold can be 30.
[0113] Step S205: If the number reaches the preset number threshold, the target alignment condition is called to align the wafer to be aligned.
[0114] Step S206: If the number does not reach the preset number threshold, other alignment conditions are called to align the wafers to be aligned to meet the preset alignment conditions.
[0115] Please refer to Figure 4 Based on any of the above embodiments, in one embodiment of the present application, a wafer alignment processing method includes:
[0116] Step S301: obtaining an alignment condition database; when the alignment condition database includes at least two of the target alignment conditions and assessment scores corresponding to the target alignment conditions.
[0117] Step S302: determining whether aligning the wafer to be aligned using the first target alignment condition satisfies the preset alignment condition;
[0118] The first target alignment condition is the target alignment condition with the highest assessment score.
[0119] The higher the assessment score, the better the corresponding target alignment conditions.
[0120] Determine whether aligning the wafer to be aligned using the first target alignment condition meets the preset alignment condition, that is, determine whether the number of combinations of the light source and alignment mark in the first target alignment condition and the marks on the wafer to be aligned that can be aligned reaches a set number threshold.
[0121] Step S303: If aligning the wafer to be aligned using the first target alignment condition satisfies the preset alignment condition, the first target alignment condition is called to align the wafer to be aligned.
[0122] The wafer to be aligned is aligned using the first target alignment condition to meet the preset alignment condition, that is, the number of combinations of the light source and the alignment mark in the first target alignment condition and the marks on the wafer to be aligned that can be aligned reaches a set number threshold.
[0123] Step S304: if aligning the wafer to be aligned using the first target alignment condition does not satisfy the preset alignment condition, determining whether aligning the wafer to be aligned using the second target alignment condition satisfies the preset alignment condition;
[0124] The second target alignment condition is the target alignment condition with the second highest assessment score.
[0125] Aligning the wafer to be aligned using the first target alignment condition does not meet the preset alignment condition, that is, the number of combinations of the light source and the alignment mark in the first target alignment condition and the marks on the wafer to be aligned that can be aligned does not reach the set number threshold.
[0126] It is determined whether the alignment of the wafer to be aligned using the second target alignment condition meets the preset alignment condition, that is, it is determined whether the number of combinations of the light source and the alignment mark in the second target alignment condition and the marks on the wafer to be aligned that can be aligned reaches a set number threshold.
[0127] Step S305: If aligning the wafer to be aligned using the second target alignment condition satisfies the preset alignment condition, the second target alignment condition is called to align the wafer to be aligned.
[0128] The wafer to be aligned is aligned using the second target alignment condition to meet the preset alignment condition, that is, the number of combinations of the light source and the alignment mark in the second target alignment condition and the marks on the wafer to be aligned that can be aligned reaches a set number threshold.
[0129] Step S306: If aligning the wafer to be aligned using the second target alignment condition does not satisfy the preset alignment condition, then executing the step of calling other alignment conditions to align the wafer to be aligned to satisfy the preset alignment condition.
[0130] Aligning the wafer to be aligned using the second target alignment condition does not meet the preset alignment condition, that is, the number of combinations of the light source and the alignment mark in the second target alignment condition and the marks on the wafer to be aligned that can be aligned does not reach the set number threshold.
[0131] In this embodiment, when the first target alignment condition and the second target alignment condition both fail to meet the preset alignment condition, the alignment condition of the wafer to be aligned is customized. In addition, when the target alignment conditions corresponding to the top three or top four assessment scores in the alignment condition database all fail to meet the preset alignment condition, the alignment condition of the wafer to be aligned is customized. Alternatively, when all target alignment conditions in the quasi-condition database fail to meet the preset alignment condition, the alignment condition of the wafer to be aligned is customized.
[0132] Based on any of the above implementations, in one embodiment of the present application, after aligning the wafer to be aligned, the wafer alignment processing method may further include:
[0133] After the wafer to be aligned is exposed, an overlay error of the wafer to be aligned is obtained;
[0134] Determining whether the overlay error is within a preset error range;
[0135] If the overlay error is not within the preset error range, then determining the influencing factors of the overlay error not being within the preset error range.
[0136] The exposure is performed after calling the target alignment condition to align the wafer to be aligned, or after calling other alignment conditions to align the wafer to be aligned.
[0137] The preset error range is not limited in this application and can be set by yourself.
[0138] If the overlay error is not within the preset error range, it is necessary to analyze whether it is caused by alignment. If the overlay error is within the preset error range, no processing is required.
[0139] The wafer alignment processing device provided in an embodiment of the present application is introduced below. The wafer alignment processing device described below and the wafer alignment processing method described above can be referenced to each other.
[0140] Figure 5 The structural block diagram of the wafer alignment processing device provided in the embodiment of the present application is shown in FIG. Figure 5 The wafer alignment process may include:
[0141] An acquisition module 100 is used to obtain an alignment condition database; the alignment condition database includes target alignment conditions that meet preset assessment conditions;
[0142] The first judgment module 200 is used to judge whether the alignment of the wafer to be aligned using the target alignment condition satisfies the preset alignment condition;
[0143] A first alignment module 300 is used to call the target alignment condition to align the wafer to be aligned if the preset alignment condition is met;
[0144] The second alignment module 400 is used to call other alignment conditions to align the wafer to be aligned if the preset alignment condition is not met, so as to meet the preset alignment condition.
[0145] The wafer alignment processing device of the present embodiment is used to implement the aforementioned wafer alignment processing method. Therefore, the specific implementation method of the wafer alignment processing device can be seen in the embodiment part of the wafer alignment processing method in the previous text. For example, the acquisition module 100, the first judgment module 200, the first alignment module 300, and the second alignment module 400 are respectively used to implement steps S101, S102, S103 and S104 in the above-mentioned wafer alignment processing method. Therefore, its specific implementation method can refer to the description of the corresponding various parts of the embodiment, which will not be repeated here.
[0146] As an implementable embodiment, the alignment condition database includes at least two of the target alignment conditions and assessment scores corresponding to the target alignment conditions. The first judgment module 200, the first alignment module 300 and the second alignment module 400 are used to implement:
[0147] Determine whether aligning the wafer to be aligned using the first target alignment condition satisfies the preset alignment condition; the first target alignment condition is the target alignment condition with the highest assessment score;
[0148] If aligning the wafer to be aligned using the first target alignment condition satisfies the preset alignment condition, calling the first target alignment condition to align the wafer to be aligned;
[0149] If the alignment of the wafer to be aligned using the first target alignment condition does not satisfy the preset alignment condition, determining whether the alignment of the wafer to be aligned using the second target alignment condition satisfies the preset alignment condition; the second target alignment condition is the target alignment condition with the second highest assessment score;
[0150] If aligning the wafer to be aligned using the second target alignment condition satisfies the preset alignment condition, calling the second target alignment condition to align the wafer to be aligned;
[0151] If aligning the wafer to be aligned using the second target alignment condition does not satisfy the preset alignment condition, then calling other alignment conditions to align the wafer to be aligned to satisfy the preset alignment condition is performed.
[0152] As an implementation method, the wafer alignment processing device may further include:
[0153] An acquisition module, used for acquiring the overlay error of the wafer to be aligned;
[0154] A second judging module, used to judge whether the overlay error is within a preset error range;
[0155] The determination module is used to determine the influencing factor that the overlay error is not within the preset error range if the overlay error is not within the preset error range.
[0156] As an implementable embodiment, the obtaining module 100 includes:
[0157] A first determination unit is used to evaluate the wafer that has failed alignment and determine a plurality of alignment conditions; each alignment condition includes a combination of a light source and an alignment mark;
[0158] An acquisition unit, used to acquire alignment assessment data corresponding to each alignment condition;
[0159] A first judging unit, used to judge whether the alignment assessment data meets a preset assessment condition;
[0160] A second determining unit, configured to determine an assessment score corresponding to the alignment condition if the alignment assessment data meets the preset assessment condition;
[0161] An establishing unit, configured to establish an alignment database from all the alignment conditions and the assessment scores that satisfy the preset assessment conditions;
[0162] A deleting unit is used to delete the corresponding alignment condition if the alignment assessment data does not meet the preset assessment condition.
[0163] As an implementable method, when the alignment assessment data includes any one or any combination of a multiple correlation coefficient, a wafer alignment mark signal strength, and an alignment mark signal deviation, the first judgment unit is specifically used to: judge whether each parameter in the alignment assessment data satisfies the corresponding preset assessment condition;
[0164] The second determination unit is specifically used to: if each parameter satisfies the corresponding preset assessment condition, determine the assessment score corresponding to the alignment condition.
[0165] As an implementable embodiment, the second alignment module 400 includes:
[0166] A customization unit, configured to evaluate the wafer to be aligned and determine customized alignment conditions for the wafer to be aligned;
[0167] The first alignment unit is used to call the customized alignment condition to align the wafer to be aligned to meet the preset alignment condition.
[0168] As an implementable embodiment, the first determination module 200 includes:
[0169] A second alignment unit, used to align with the marks on the wafer to be aligned respectively by using the target alignment conditions;
[0170] A third determining unit, configured to determine the number of marks that can be aligned through the target alignment condition;
[0171] A second judgment unit is used to judge whether the quantity reaches a preset quantity threshold;
[0172] The first alignment module 300 is specifically used to: if the number reaches the preset number threshold, call the target alignment condition to align the wafer to be aligned;
[0173] The second alignment module 400 is specifically used for: if the number does not reach the preset number threshold, calling other alignment conditions to align the wafers to be aligned to meet the preset alignment conditions.
[0174] The electronic device provided in the embodiment of the present application is introduced below. The electronic device described below and the wafer alignment processing method described above can be referenced to each other.
[0175] Please refer to Figure 6 , an electronic device, comprising:
[0176] A memory 11, used for storing computer programs;
[0177] The processor 12 is used to implement the steps of any one of the above-mentioned wafer alignment processing methods when executing the computer program.
[0178] The present application also provides a wafer alignment processing system, comprising:
[0179] The electronic device described in the above embodiment;
[0180] A photolithography machine connected to the electronic device.
[0181] The computer-readable storage medium provided in the embodiment of the present application is introduced below. The computer-readable storage medium described below and the wafer alignment processing method described above can be referenced to each other.
[0182] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the wafer alignment processing method described in any of the above embodiments are implemented.
[0183] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.
[0184] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.
[0185] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
[0186] The wafer alignment processing method, device, electronic device and system provided by the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.
Claims
1. A wafer alignment processing method, characterized in that: include: obtaining an alignment condition database; The alignment condition database includes target alignment conditions that meet preset assessment conditions; Determine whether aligning the wafer to be aligned using the target alignment condition satisfies a preset alignment condition; If the preset alignment condition is met, calling the target alignment condition to align the wafer to be aligned; If the preset alignment condition is not met, other alignment conditions are called to align the wafer to be aligned to meet the preset alignment condition.
2. The wafer alignment processing method according to claim 1, characterized in that: The alignment condition database includes at least two of the target alignment conditions and assessment scores corresponding to the target alignment conditions; Determine whether aligning the wafer to be aligned using the target alignment condition satisfies a preset alignment condition; if the preset alignment condition is satisfied, call the target alignment condition to align the wafer to be aligned; If the preset alignment condition is not met, calling other alignment conditions to align the wafer to be aligned, so as to meet the preset alignment condition includes: Determine whether aligning the wafer to be aligned using the first target alignment condition satisfies the preset alignment condition; the first target alignment condition is the target alignment condition with the highest assessment score; If aligning the wafer to be aligned using the first target alignment condition satisfies the preset alignment condition, calling the first target alignment condition to align the wafer to be aligned; If the alignment of the wafer to be aligned using the first target alignment condition does not satisfy the preset alignment condition, determining whether the alignment of the wafer to be aligned using the second target alignment condition satisfies the preset alignment condition; the second target alignment condition is the target alignment condition with the second highest assessment score; If aligning the wafer to be aligned using the second target alignment condition satisfies the preset alignment condition, calling the second target alignment condition to align the wafer to be aligned; If aligning the wafer to be aligned using the second target alignment condition does not satisfy the preset alignment condition, then calling other alignment conditions to align the wafer to be aligned to satisfy the preset alignment condition is performed.
3. The wafer alignment processing method according to claim 1, characterized in that: After aligning the wafer to be aligned, it also includes: After the wafer to be aligned is exposed, an overlay error of the wafer to be aligned is obtained; Determining whether the overlay error is within a preset error range; If the overlay error is not within the preset error range, then determining the influencing factors of the overlay error not being within the preset error range.
4. The wafer alignment processing method according to claim 1, characterized in that: Access to the Alignment Conditions Database includes: Evaluate the wafer that has failed alignment and determine a plurality of alignment conditions; each alignment condition includes a combination of a light source and an alignment mark; Obtain alignment assessment data corresponding to each alignment condition; Determine whether the alignment assessment data meets the preset assessment conditions; If the alignment assessment data meets the preset assessment condition, determining the assessment score corresponding to the alignment condition; Establishing an alignment database with all the alignment conditions and the assessment scores that satisfy the preset assessment conditions; If the alignment assessment data does not meet the preset assessment conditions, the corresponding alignment conditions are deleted.
5. The wafer alignment processing method according to claim 4, characterized in that: The alignment assessment data includes any one or any combination of a multiple correlation coefficient, a wafer alignment mark signal strength, and an alignment mark signal deviation; Determining whether the alignment assessment data meets the preset assessment conditions includes: Determine whether each parameter in the alignment assessment data satisfies the corresponding preset assessment condition; If the alignment assessment data meets the preset assessment condition, determining the assessment score corresponding to the alignment condition includes: If each parameter satisfies the corresponding preset assessment condition, the assessment score corresponding to the alignment condition is determined.
6. The wafer alignment processing method according to claim 1, characterized in that: The calling of other alignment conditions to align the wafer to be aligned to meet the preset alignment condition includes: evaluating the wafer to be aligned and determining customized alignment conditions for the wafer to be aligned; The customized alignment condition is called to align the wafer to be aligned to meet the preset alignment condition.
7. The wafer alignment processing method according to any one of claims 1 to 6, characterized in that: Determining whether aligning the wafer to be aligned using the target alignment condition satisfies a preset alignment condition includes: Using the target alignment conditions to align with the marks on the wafer to be aligned respectively; determining a number of markers that can be aligned using the target alignment condition; Determining whether the quantity reaches a preset quantity threshold; If the preset alignment condition is met, calling the target alignment condition to align the wafer to be aligned includes: If the number reaches the preset number threshold, calling the target alignment condition to align the wafer to be aligned; If the preset alignment condition is not met, calling other alignment conditions to align the wafer to be aligned, so as to meet the preset alignment condition includes: If the number does not reach the preset number threshold, other alignment conditions are called to align the wafer to be aligned to meet the preset alignment condition.
8. A wafer alignment processing device, characterized in that: include: An acquisition module, used for acquiring an alignment condition database; The alignment condition database includes target alignment conditions that meet preset assessment conditions; A first judgment module is used to judge whether the alignment of the wafer to be aligned using the target alignment condition meets the preset alignment condition; A first alignment module, configured to call the target alignment condition to align the wafer to be aligned if the preset alignment condition is met; The second alignment module is used to call other alignment conditions to align the wafer to be aligned if the preset alignment condition is not met, so as to meet the preset alignment condition.
9. An electronic device, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the wafer alignment processing method according to any one of claims 1 to 7 when executing the computer program.
10. A wafer alignment processing system, characterized in that: include: The electronic device as claimed in claim 9; A photolithography machine connected to the electronic device.