Radio frequency pin structure and packaging structure

Abstract

The invention relates to the technical field of communication, and particularly discloses a radio frequency contact pin structure and a packaging structure, and the radio frequency contact pin structure comprises a radio frequency connector, a contact pin connected with the radio frequency connector, and an insulating supporting part used for fixing the contact pin. The invention also discloses a packaging structure which comprises a packaging shell with a packaging cavity, a radio frequency connector I, the radio frequency pin structure, a radio frequency connector II and components which are arranged corresponding to the radio frequency connector I, the radio frequency pin structure and the radio frequency connector II and are respectively connected with the radio frequency connector I, the radio frequency pin structure and the radio frequency connector II. The TR module can solve the problem that an existing TR module cannot meet the requirements of high integration, miniaturization and the like at the same time.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and more specifically, to a radio frequency pin structure and a packaging structure. Background Art

[0002] In phased array radar / communication systems, radio frequency transceiver modules (TR modules) are constantly developing towards miniaturization and high integration. The size of TR modules is also being continuously compressed. Traditional brick-type modules and tile-type modules will face the problem of high-density design.

[0003] Traditional brick-type modules and tile-type modules are implemented using microstrip lines, strip lines, etc. When the module integration is high, the length of the microstrip line and strip line is often relatively long, resulting in greater loss and occupying more structural dimensions, making it difficult to design a highly integrated module. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a radio frequency pin structure and a packaging structure to solve the problem that the existing TR module cannot simultaneously meet the requirements of high integration and miniaturization;

[0005] The solution adopted by the present invention to solve the technical problem is:

[0006] on the one hand:

[0007] A radio frequency pin structure comprises a radio frequency connector, a pin connected to the radio frequency connector, and an insulating support for fixing the pin.

[0008] In some possible implementations, the pin is cylindrical and made of a metal conductor.

[0009] In some possible implementations, a cylindrical hole welded to a radio frequency connector is provided at one end of the pin; and the radio frequency connector is coaxially arranged with the pin.

[0010] In some possible implementations, the pin includes a copper pillar in a cylindrical shape and a gold layer plated on the outside of the copper pillar.

[0011] In some possible implementations, the insulating support is made of polytetrafluoroethylene, glass or ceramic medium.

[0012] In some possible implementations, the insulating support members are at least one group and are arranged along the axial direction of the pin.

[0013] on the other hand:

[0014] A packaging structure includes a packaging shell with a packaging cavity, a radio frequency connector 1, the radio frequency pin structure as described above, a radio frequency connector 2, and components corresponding to and respectively connected to the radio frequency connector 1, the radio frequency pin structure, and the radio frequency connector 2.

[0015] In some possible embodiments, two groups of parallel substrates 1 and 2 are arranged in the packaging cavity; substrate 1 and substrate 2 are close to each other on one side to form a channel, and the RF pin structure is located in the channel and connected to the components installed on the top surface of substrate 2; RF connector 1 is located above substrate 1 and connected to the components installed on substrate 1; RF connector 2 is located below substrate 2 and connected to the components installed at the bottom of substrate 2.

[0016] In some possible implementations, the length of the first substrate along the length direction of the radio frequency pin structure is smaller than the length of the second substrate along the length direction of the radio frequency pin structure.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The radio frequency pin structure in the present invention is more suitable for highly integrated and miniaturized application scenarios, improves system integration and reliability, and saves size.

[0019] The present invention adopts a pin, a radio frequency connector and a closed cavity to form a coaxial line structure, which is more conducive to the vertical transmission of radio frequency signals and reduces losses.

[0020] The packaging structure in the present invention has a smaller size and better performance, and can solve the problem that some highly integrated and miniaturized application scenarios cannot achieve low-loss transmission of radio frequency signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the radio frequency connection structure in the present invention;

[0022] Figure 2 It is a schematic diagram of the local structure of the packaging structure in the present invention;

[0023] Figure 3 It is a schematic diagram of the internal structure of the packaging structure in the present invention;

[0024] Among them: 1. RF connector;

[0025] 2. Insert the pin;

[0026] 3. Insulation support;

[0027] 4. Encapsulation shell;

[0028] 41. Substrate 1;

[0029] 42. Substrate 2;

[0030] 43. Packaging cavity;

[0031] 5. RF connector 1;

[0032] 6. RF connector 2;

[0033] 10. Components. DETAILED DESCRIPTION

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. The "first", "second" and similar words mentioned in this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, "one" or "one" and other similar words do not indicate a quantity restriction, but indicate the existence of at least one. In the implementation of this application, "and / or" describes the association relationship of the associated objects, indicating that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more. For example, multiple positioning columns refer to two or more positioning columns. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] The present invention is described in detail below.

[0036] like Figure 1-Figure 3 As shown;

[0037] on the one hand:

[0038] A radio frequency pin structure comprises a radio frequency connector 1, a pin 2 connected to the radio frequency connector 1, and an insulating support member 3 for fixing the pin 2.

[0039] Specifically, the RF connector 1 is used to connect coaxial cables, microstrip lines and other transmission lines to achieve low-loss transmission of RF signals, and can use SMP series, SSMP series and glass insulators.

[0040] The insulating support 3 is used to fix the position of the plug pin 2 and has good insulation performance to prevent the plug pin 2 from short-circuiting after being assembled in the packaging cavity 43. It can be made of polytetrafluoroethylene, glass or ceramic medium. Specifically, when the insulating support 3 is glass, it is sintered; when the insulating support 3 is a ceramic medium, it is co-fired by HTCC / LTCC process;

[0041] The insulating support 3 made of the above material has the advantages of high processing accuracy, stable physical and chemical properties, and flexible processing patterns. It can be customized into the required shape according to the actual application scenario. One or more insulating support members 3 are used and arranged along the axial direction of the pin 2.

[0042] In some possible implementations, the pin 2 is cylindrical and made of a metal conductor;

[0043] The plug pin 2 includes a cylindrical copper column and a gold layer plated on the outside of the copper column; the plug pin 2 is a copper-gold-plated cylindrical conductor, one end of which is welded to the glass pin of the RF connector 1, and after being assembled with the packaging cavity 43, a coaxial line structure is formed to transmit signals.

[0044] In some possible implementations, in order to effectively realize the welding of the pin 2 and the glass pin of the RF connector 1, a cylindrical hole for welding to the RF connector 1 is provided at one end of the pin 2; and the RF connector 1 and the pin 2 are coaxially arranged.

[0045] on the other hand:

[0046] A packaging structure includes a packaging shell 4 with a packaging cavity 43, a radio frequency connector 1 5, the radio frequency pin structure as described above, a radio frequency connector 2 6, and components corresponding to and connected to the radio frequency connector 1 5, the radio frequency pin structure, and the radio frequency connector 2 6.

[0047] In some possible embodiments, two groups of parallel substrates 1 41 and 2 42 are arranged in the packaging cavity 43; the substrates 1 41 and 2 42 are close to each other to form a channel, the RF pin structure is located in the channel and connected to the components installed on the top surface of the substrate 2 42 (the surface close to the side of the substrate 1 41); the RF connector 1 5 is located above the substrate 1 41 and connected to the components installed on the surface of the substrate 1 41 away from the side of the substrate 2 42; the RF connector 2 6 is located below the substrate 2 42 and connected to the components installed on the bottom of the substrate 2 42 (the surface away from the side of the substrate 1 41).

[0048] In some possible implementations, the length of the substrate 1 41 along the length direction of the RF pin structure is less than the length of the substrate 2 42 along the length direction of the RF pin structure, so that a mounting surface for mounting components can be formed on the substrate 2 42. By arranging the RF pin structure at this position, it is ensured that the components on the substrate 2 42 are connected, so that the RF signal can be transmitted with low loss.

[0049] Specifically, the connection between the pin 2 and the components in the radio frequency pin structure can be achieved through a microstrip line or a stripline.

[0050] like Figure 2 , Figure 3 As shown, the substrate 1 41 and the substrate 2 42 divide the packaging cavity 43 into three chambers: the substrate 1 41 and the substrate 42 are integrally formed with the packaging shell 4;

[0051] Specifically, the RF connector 1 5 is connected to the components located in the upper chamber of the substrate 1 41;

[0052] The second RF connector 6 is connected to the components located in the lower chamber of the second substrate 42;

[0053] The RF connection structure is located in the channel (in the chamber) formed by the substrate 1 41 and the substrate 2 42; wherein the RF connector 1 is located in the packaging shell 4; the pin 2 is located in the channel and supported and fixed by the insulating support 3 so that the pin 2 does not come into contact with the substrate 1 41 and the substrate 2 42;

[0054] The end of the pin 2 away from the RF connector 1 will be connected to the components on the second substrate 42; this packaging structure can realize the arrangement of three groups of RF transceiver links;

[0055] Compared with the traditional TR module, the present invention increases the middle-layer transceiver link so that the TR module that can only accommodate two sets of transceiver links of the upper layer and the lower layer is added;

[0056] The packaging module using the radio frequency pin structure of the present invention has a higher degree of integration, is compatible with more and more complex functions, and can effectively reduce the hardware cost of the TR module.

[0057] In the present invention, the RF connector 1, the RF connector 1 5 and the RF connector 2 6 are existing components, and their internal structures are not described in detail here.

[0058] The present invention is not limited to the above-mentioned specific embodiments, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. A radio frequency pin structure, characterized in that: It includes a radio frequency connector, a plug pin connected to the radio frequency connector, and an insulating support for fixing the plug pin.

2. The radio frequency pin structure according to claim 1, characterized in that: The plug pin is cylindrical and is made of a metal conductor.

3. The radio frequency pin structure according to claim 1, characterized in that: A cylindrical hole welded to the radio frequency connector is arranged at one end of the plug pin; the radio frequency connector is arranged coaxially with the plug pin.

4. The radio frequency pin structure according to claim 2, characterized in that: The pin includes a copper column in a cylindrical shape and a gold layer plated on the outside of the copper column.

5. The radio frequency pin structure according to claim 1, characterized in that: The insulating support is made of polytetrafluoroethylene, glass or ceramic medium.

6. The radio frequency pin structure according to claim 5, characterized in that: The insulating support members are at least one group and are arranged along the axial direction of the pin.

7. A packaging structure, characterized in that: It includes a packaging shell with a packaging cavity, a radio frequency connector 1, a radio frequency pin structure according to any one of claims 1 to 6, a radio frequency connector 2, and components that are arranged corresponding to and respectively connected to the radio frequency connector 1, the radio frequency pin structure, and the radio frequency connector 2.

8. A packaging structure according to claim 7, characterized in that: Two groups of parallel substrates, one and two, are arranged in the packaging cavity; the substrates one and two are close to each other on one side to form a channel, the RF pin structure is located in the channel and is connected to the components installed on the top surface of the substrate two; the RF connector one is located above the substrate one and is connected to the components installed on the substrate one; the RF connector two is located below the substrate two and is connected to the components installed at the bottom of the substrate two.

9. A packaging structure according to claim 8, characterized in that: The length of the substrate 1 along the length direction of the radio frequency pin structure is smaller than the length of the substrate 2 along the length direction of the radio frequency pin structure.

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