Automatic film pasting process for flexible circuit board

Abstract

The invention relates to the technical field of circuit board processing, and particularly discloses an automatic film pasting process for a flexible circuit board, which comprises the steps of positioning feeding of the flexible circuit board, film pasting pretreatment and automatic film pasting processing. By adopting distributed positioning operation, accurate positioning of the flexible circuit board can be achieved, the flexible circuit board is calibrated and centralized at the center position of the top of the lifting plate, deviation and shaking of the flexible circuit board in the feeding process are effectively avoided, the feeding precision and stability are improved, and the production efficiency is improved. The stability of the flexible circuit board in the positioning process is further enhanced in cooperation with a multi-point adsorption mode, the flexible circuit board can keep the fixed position and posture in the film pasting machining process, the film pasting accuracy and completeness are guaranteed, meanwhile, due to the fact that the clamping blocks can move to the periphery of the bottom of the flexible circuit board when not carrying out clamping action, the clamping blocks can move to the periphery of the bottom of the flexible circuit board, and the clamping efficiency is improved. The film pasting process is not interfered, the smoothness of the film pasting process is ensured, and film pasting defects or process interruption caused by a positioning structure are avoided.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to an automatic film pasting process for a flexible circuit board. Background Art

[0002] With the rapid development of the electronic technology industry, the design requirements of circuit boards are becoming more and more high-precision and high-density. Flexible circuit boards are favored for their excellent properties such as light weight, thin thickness, and free bending and folding. As a result, the production and processing requirements of flexible circuit boards have become more and more stringent, and automated production and processing machinery has become an inevitable trend in industrial development. In the production process of flexible circuit boards, the pasting of insulating film on flexible circuit boards is an indispensable process step. The insulating film forms the base layer of the circuit, which can provide a protective covering for the flexible circuit board, isolating the flexible circuit board from dust and moisture, and can reduce the stress of the flexible circuit board during flexure.

[0003] Traditional film lamination processes mostly rely on manual operation or semi-automatic equipment. This method is not only inefficient and difficult to meet the needs of large-scale production, but also has obvious deficiencies in film lamination accuracy and quality consistency. For example, it is difficult to accurately control the position, pressure and angle of the film during manual lamination, which can easily lead to problems such as loose fit between the film material and the circuit board, bubbles or wrinkles. These defects will seriously affect the electrical performance, reliability and service life of the flexible circuit board. In addition, when faced with flexible circuit boards of different sizes, shapes and materials, the adaptability of traditional processes is poor, and it is often necessary to frequently adjust equipment parameters or replace tooling fixtures, further reducing production efficiency and increasing production costs.

[0004] To this end, we proposed an automated lamination process for flexible circuit boards. Summary of the invention

[0005] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides an automatic film lamination process for a flexible circuit board, in order to solve the above-mentioned technical defects.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: an automatic film lamination process for a flexible circuit board, comprising the following steps:

[0007] S1, positioning and feeding: by placing the flexible circuit board on the top of the lifting plate, the linear slide rail 1 inside the limiting groove on all sides controls the micro-electric cylinder to slide, and at the same time, the driving end of the micro-electric cylinder controls the clamping block to push upward, and pushes the clamping block from the inside of the limiting groove to the top of the lifting plate, and then controls the clamping block to approach the side of the flexible circuit board through the linear slide rail 1, and uses the clamping blocks on all sides to clamp and position the flexible circuit board on the top of the lifting plate, and at the same time, according to the position adjustment of the clamping blocks on all sides, calibrate and straighten the flexible circuit board at the center position of the top of the lifting plate, and then the bottom of the flexible circuit board is adsorbed and positioned by the adsorption block pair set at the center position of the top of the lifting plate, and then the micro-electric cylinder driving end at the bottom of the clamping blocks on all sides is reset, and then the linear slide rail 1 is cooperated to drive the clamping block to move to the four sides of the bottom of the flexible circuit board, and the driving end of the micro-electric cylinder is used to control the clamping block to move upward until the top of the clamping block contacts the bottom of the flexible circuit board, and the adsorption block 2 set on the top of several clamping blocks is used to adsorb and position the four sides of the bottom of the flexible circuit board, and the adsorption block pair is used to synchronously adsorb and position the center position of the bottom of the flexible circuit board;

[0008] S2, pre-film treatment: the unloading rack with the flexible circuit board placed inside is driven by the conveying rack to move to the bottom of the closed rack, and the closed rack is controlled to move downward by the electric slide until the sealing protrusion at the bottom of the closed rack and the sealing groove at the top of the unloading rack are matched and connected, and then the lifting plate is controlled to move upward by the driving end of the servo electric cylinder inside the unloading rack, so that the film surface of the flexible circuit board on the top of the lifting plate is respectively between the blowing port of the blowing rack and the suction port of the suction rack. At this time, the blowing rack is used to blow air to the film surface of the flexible circuit board, and the dust on the film surface of the flexible circuit board is sucked by the suction rack;

[0009] When the blowing rack and the suction rack are used to clean the film surface of the flexible circuit board, the linear slide rails 2 on the left and right sides are used to drive the sliding rack 1 to slide back and forth above the flexible circuit board, and the ultraviolet lamp inside the sliding rack 1 is used to irradiate the film surface of the flexible circuit board, so that the organic molecules on the surface of the flexible circuit board undergo photochemical reactions;

[0010] After the film surface of the flexible circuit board is cleaned and photochemically treated, the driving ends of the four servo electric cylinders are used to control the downward movement of the hot pressing plate, and the electric heating wire inside the hot pressing plate is used to generate heat to control the hot pressing temperature of the hot pressing plate. The four servo electric cylinders are used to control the hot pressing and leveling pressure of the flexible circuit board to perform hot pressing and leveling on the film surface of the flexible circuit board.

[0011] S3. Automatic film pasting: The driving end of the servo electric cylinder 1 controls the lifting plate to lift upward, and the lifting plate drives the flexible circuit board to pass through the film pasting hole at the bottom of the fixed frame until the film pasting surface of the flexible circuit board contacts the bottom surface of the film material. At this time, the linear slide rail 3 drives the film pasting head to slide above the film material, and the driving end of the servo electric cylinder 3 controls the film pasting head to move downward. The film pasting head is used to automatically apply the film material to the film pasting surface of the flexible circuit board. Finally, the laser generator inside the mounting frame automatically cuts the film material according to the edge of the flexible circuit board.

[0012] Furthermore, an automated film laminating process for a flexible circuit board also includes: a processing frame, a conveying frame rotatably arranged inside the processing frame, and a plurality of connecting protrusions are fixedly arranged on the top of the conveying frame, a plurality of material discharge components are movably arranged on the top of the conveying frame, a pretreatment component is arranged on the left side of the processing frame, and a film laminating component is also arranged in the middle of the processing frame.

[0013] Furthermore, the material discharge assembly includes a material discharge rack, the material discharge rack is movably arranged on the top of the conveying rack, and connecting grooves matching with connecting protrusions are arranged on both sides of the bottom of the material discharge rack, a high temperature resistant pad is arranged on the top surface of the material discharge rack, an electromagnet is arranged inside the connecting protrusion, and a metal sheet is arranged on the top of the inner wall of the connecting groove.

[0014] Furthermore, a servo electric cylinder 1 is fixedly provided on all four sides of the lower interior of the material unloading rack, and a lifting plate is movably provided inside the material unloading rack, limiting grooves are provided on all four sides of the interior of the lifting plate, and a linear slide rail 1 is fixedly provided on the bottom of the inner walls of the limiting grooves on all four sides, a micro electric cylinder is slidably provided on the top of the linear slide rail 1, and a clamping block is fixedly provided on the top of the micro electric cylinder, an adsorption block 1 is fixedly provided in the middle of the top of the lifting plate, and adsorption blocks 2 are fixedly provided on the tops of several clamping blocks.

[0015] Furthermore, the pretreatment component includes a closed frame, two electric slides are fixedly arranged on the front and rear sides of the left side inside the processing frame, and a closed frame is slidably arranged between the opposite sides of the four electric slides at the front and rear, a sealing protrusion is arranged at the bottom of the closed frame, and a sealing groove matching the sealing protrusion is arranged at the top of the discharge rack, a blowing frame and a suction frame are fixedly arranged below the left and right side walls of the closed frame, respectively, and the interior of the blowing frame is connected to the output end of the blowing pump through a spring air guide pipe, and the interior of the suction frame is connected to the input end of the dust suction pump through a spring air guide pipe.

[0016] Furthermore, the left and right side walls of the closed frame are fixedly provided with linear slide rails 2, and a sliding frame 1 is slidably provided between the two opposite sides of the two linear slide rails 2, a mounting groove is provided at the bottom of the sliding frame 1, and an ultraviolet lamp is fixedly provided inside the mounting groove.

[0017] Furthermore, a hot press plate is movably arranged inside the closed frame, and servo electric cylinders 2 are fixedly arranged around the top of the closed frame, and the bottom ends of the driving ends of the servo electric cylinders 2 are fixedly connected to the top of the hot press plate on all sides respectively. A heating wire is arranged inside the hot press plate, and a high-temperature resistant pad is also arranged at the bottom of the hot press plate.

[0018] Furthermore, the film sticking assembly includes a fixing frame and a mounting frame, a fixing frame is fixedly arranged in the middle part of the processing frame, and a mounting frame is fixedly arranged on the top of the fixing frame by a bolt group, a driving frame is fixedly arranged on the top of the inner wall of the mounting frame, and an adjusting frame is slidably arranged on the bottom of the driving frame by an electric slider, and a laser generator is slidably arranged on the bottom of the adjusting frame by an electric slider.

[0019] Furthermore, a film sticking through hole is arranged at the bottom inside the fixing frame, fixing plates are fixedly arranged on the front and rear sides inside the fixing frame, and connecting plates are fixedly arranged on the tops of the two fixing plates by bolt groups, and a film collecting roller and a film placing roller are rotatably arranged on the left and right sides inside the fixing frame respectively, and the front and rear ends of the film collecting roller and the film placing roller are rotatably arranged inside the fixing plates on the front and rear sides respectively, and the rear ends of the film placing roller and the film collecting roller are rotationally driven by a servo motor.

[0020] Furthermore, linear slide rails three are fixedly provided on opposite sides of the two connecting plates on the front and rear sides, and a sliding frame two is slidably provided between opposite sides of the two linear slide rails three, a film laminating head is movably provided at the bottom of the sliding frame two, servo electric cylinders three are fixedly provided on the front and rear sides of the top of the sliding frame two, and driving ends of the two servo electric cylinders three are fixedly connected to the top of the film laminating head, and the film laminating head consists of an upper and lower layer structure of a pressure regulating layer and a laminating layer.

[0021] The beneficial effects achieved by the present invention using the above structure are as follows:

[0022] 1. In the present invention, the conveying frame rotatably arranged inside the processing frame can realize the continuous movement of multiple unloading components inside the processing frame. This rotating conveying method can make the process more compact and orderly, reduce the floor space of the equipment, and improve the utilization rate of the production space. At the same time, the continuously moving unloading component can realize the uninterrupted feeding of the flexible circuit board, which is helpful to improve the overall production efficiency, avoid the waiting time in the traditional intermittent feeding process, and enable the film laminating process to be carried out continuously; the connecting protrusion on the top of the conveying frame cooperates with the connecting groove at the bottom of the unloading frame to realize the active connection of the unloading frame on the conveying frame; the connecting protrusion The internal electromagnet and the metal sheet on the top of the inner wall of the connecting groove are adsorbed and cooperated, which not only ensures the connection stability of the unloading rack during the conveying process and prevents it from being displaced or falling off due to vibration or other external factors, but also the electromagnetic adsorption connection method facilitates the rapid installation and disassembly of the unloading rack; when the unloading rack needs to be replaced or the equipment needs to be maintained, the unloading rack can be easily removed or installed from the conveying rack, which improves the operability and maintenance convenience of the equipment; at the same time, the snap connection between the connecting protrusion and the connecting groove further enhances the reliability of the connection, so that the unloading rack can accurately remain on the predetermined track during the movement, ensuring the accuracy and stability of the feeding.

[0023] 2. By combining the servo electric cylinders arranged around the lower part of the unloading rack with the movable lifting plate, the vertical position of the lifting plate can be accurately controlled. During the feeding process of the flexible circuit board, the height of the lifting plate can be adjusted according to different process requirements. When placing the flexible circuit board on the lifting plate, the lifting plate can be lowered to a suitable height, which is convenient for operators or automated equipment to place the flexible circuit board on it; during the film processing, the lifting plate can be lifted to a height matching the film assembly to ensure the smooth progress of the film process. This height-adjustable design increases the adaptability of the equipment to flexible circuit boards of different thicknesses and different process steps, and improves the versatility and flexibility of the equipment.

[0024] 3. By adopting distributed positioning operations, the flexible circuit board can be accurately positioned, and it is calibrated and straightened at the center position of the top of the lifting plate, which effectively avoids the deviation and shaking of the flexible circuit board during the feeding process, and improves the accuracy and stability of the feeding. Moreover, the adsorption block 2 at the top of the clamping block cooperates with the adsorption block 1 in the middle of the top of the lifting plate to comprehensively adsorb and position the bottom of the flexible circuit board. The adsorption block 1 adsorbs the center position of the bottom of the flexible circuit board, and the adsorption block 2 adsorbs the surrounding areas of the bottom. This multi-point adsorption method further enhances the stability of the flexible circuit board during the positioning process, so that it can maintain a fixed position and posture during the film pasting process, ensuring the accuracy and integrity of the film pasting. At the same time, since the clamping block can be moved to the surrounding areas of the bottom of the flexible circuit board when no clamping action is performed, it will not interfere with the film pasting process, ensuring the smoothness of the film pasting process and avoiding film pasting defects or process interruptions caused by the positioning structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0026] Figure 1 This is a flow chart of an automatic film laminating process for a flexible circuit board according to an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of a processing frame structure according to an embodiment of the present invention;

[0028] Figure 3 It is a schematic diagram of a conveying frame and a connecting protrusion structure according to an embodiment of the present invention;

[0029] Figure 4 It is a schematic diagram of the internal structure of the material unloading rack according to an embodiment of the present invention;

[0030] Figure 5 It is a schematic diagram of a material placing rack and a connecting groove structure according to an embodiment of the present invention;

[0031] Figure 6 It is a schematic diagram of the unloading rack and the lifting plate structure of an embodiment of the present invention;

[0032] Figure 7 It is a schematic diagram of the unloading rack and the closed rack structure of an embodiment of the present invention;

[0033] Figure 8 A schematic diagram of the internal structure of a closed frame according to an embodiment of the present invention;

[0034] Fig. 9 A schematic diagram of the internal structure of a fixing frame according to an embodiment of the present invention;

[0035] Fig.10It is a schematic diagram of the structure of a driving frame, an adjusting frame and a laser generator according to an embodiment of the present invention.

[0036] In the figure, 1, processing frame; 2, conveying frame; 3, connecting protrusion; 4, unloading frame; 5, lifting plate; 6, servo electric cylinder 1; 7, linear slide rail 1; 8, micro electric cylinder; 9, clamping block; 10, adsorption block 1; 11, adsorption block 2; 12, limiting groove; 13, connecting groove; 14, electric slide; 15, closing frame; 16, blowing frame; 17, suction frame; 18, linear slide rail 2; 19, sliding frame 1; 20, ultraviolet lamp; 21, servo electric cylinder 2; 22, hot pressing plate; 23, fixed frame; 24, mounting frame; 25, driving frame; 26, adjusting frame; 27, laser generator; 28, fixed plate; 29, connecting plate; 30, film unloading roller; 31, film collecting roller; 32, linear slide rail 3; 33, sliding frame 2; 34, servo electric cylinder 3; 35, film sticking head. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] Embodiment 1:

[0040] See also Figures 1 to 10 As shown, an automatic film lamination process for a flexible circuit board includes the following steps:

[0041] S1. Positioning and feeding: The flexible circuit board is placed on the top of the lifting plate 5, and the linear slide rail 7 inside the limiting groove 12 around it controls the micro-electric cylinder 8 to slide. At the same time, the driving end of the micro-electric cylinder 8 controls the clamping block 9 to push upward, and pushes the clamping block 9 from the inside of the limiting groove 12 to the top of the lifting plate 5. Then, the linear slide rail 7 controls the clamping block 9 to approach the side of the flexible circuit board, and the clamping blocks 9 around it are used to clamp and position the flexible circuit board on the top of the lifting plate 5. At the same time, according to the position adjustment of the clamping blocks 9 around it, the flexible circuit board is calibrated and straightened at the center position of the top of the lifting plate 5. At this time, the bottom of the flexible circuit board is adsorbed and positioned by the adsorption block 10 set at the top center position of the lifting plate 5, and then the driving end of the micro-electric cylinder 8 at the bottom of the clamping block 9 around it is reset, and then the clamping block 9 is driven to move to the surroundings of the bottom of the flexible circuit board in cooperation with the linear slide rail 7, and the clamping block 9 is controlled to move upward by the driving end of the micro-electric cylinder 8 until the top of the clamping block 9 contacts the bottom of the flexible circuit board, and the adsorption blocks 11 set on the top of the clamping block 9 are used to adsorb and position the surroundings of the bottom of the flexible circuit board, and the adsorption block 10 is used to synchronously adsorb and position the center position of the bottom of the flexible circuit board;

[0042] S2, pre-film treatment: the unloading rack 4 with the flexible circuit board placed inside is driven by the conveying rack 2 to move to the bottom of the closed rack 15, and the closed rack 15 is controlled to move downward by the electric slide 14 until the sealing protrusion at the bottom of the closed rack 15 and the sealing groove at the top of the unloading rack 4 are matched and connected, and then the lifting plate 5 is controlled to move upward by the driving end of the servo electric cylinder 16 inside the unloading rack 4, so that the film-pasting surface of the flexible circuit board on the top of the lifting plate 5 is respectively located between the blowing port of the blowing rack 16 and the suction port of the suction rack 17. At this time, the blowing rack 16 is used to blow air to the film-pasting surface of the flexible circuit board, and the dust on the film-pasting surface of the flexible circuit board is sucked by the suction rack 17;

[0043] When the film-attached surface of the flexible circuit board is cleaned by using the blowing rack 16 and the suction rack 17, the linear slide rails 18 on the left and right sides drive the sliding rack 19 to slide back and forth above the flexible circuit board, and the ultraviolet lamp 20 inside the sliding rack 19 irradiates the film-attached surface of the flexible circuit board, so that the organic molecules on the surface of the flexible circuit board undergo photochemical reaction;

[0044] After the film surface of the flexible circuit board is cleaned and photochemically treated, the driving ends of the four servo electric cylinders 21 are used to control the hot pressing plate 22 to move downward, and the electric heating wire inside the hot pressing plate 22 is used to generate heat to control the hot pressing temperature of the hot pressing plate 22. The four servo electric cylinders 21 are used to control the hot pressing and flattening pressure of the flexible circuit board to perform hot pressing and flattening on the film surface of the flexible circuit board.

[0045] S3, automatic film pasting: the lifting plate 5 is lifted upward by the driving end of the servo electric cylinder 6, so that the lifting plate 5 drives the flexible circuit board to pass through the film pasting through hole at the bottom of the fixing frame 23 until the film pasting surface of the flexible circuit board contacts the bottom surface of the film material. At this time, the film pasting head 35 is driven to slide above the film material by the linear slide rail 32, and the film pasting head 35 is controlled to move downward by the driving end of the servo electric cylinder 34. The film pasting head 35 is used to automatically apply the film material to the film pasting surface of the flexible circuit board. Finally, the laser generator 27 inside the mounting frame 24 is used to automatically cut the film material according to the edge of the flexible circuit board.

[0046] Embodiment 2:

[0047] See also Figures 1 to 6 As shown, an automated film laminating process for a flexible circuit board also includes: a processing frame 1, a conveying frame 2 is rotatably arranged inside the processing frame 1, and a plurality of connecting protrusions 3 are fixedly arranged on the top of the conveying frame 2, a plurality of material discharge components are movably arranged on the top of the conveying frame 2, a pre-treatment component is arranged on the left side inside the processing frame 1, and a film laminating component is also arranged in the middle of the processing frame 1;

[0048] It should be noted that when the flexible circuit board is subjected to automated film lamination processing, the conveyor rack 2 drives several discharge components to move continuously inside the processing frame 1, and cooperates with several discharge components to position and feed the flexible circuit board. Before the flexible circuit board is subjected to film lamination processing, the pretreatment component arranged on the left side of the processing frame 1 is used to perform pre-film lamination treatment on the processing surface of the flexible circuit board inside the discharge component, thereby improving the bonding effect between the surface of the flexible circuit board and the film material.

[0049] Specifically, the material discharging assembly includes a material discharging rack 4, the top of the conveying rack 2 is movably provided with the material discharging rack 4, and both sides of the bottom of the material discharging rack 4 are provided with connecting grooves 13 matched with the connecting protrusions 3, the top surface of the material discharging rack 4 is provided with a high temperature resistant pad, the inside of the connecting protrusion 3 is provided with an electromagnet, and the top of the inner wall of the connecting groove 13 is provided with a metal sheet. When connecting the material discharging rack 4 and the conveying rack 2, the two connecting grooves 13 at the bottom of the material discharging rack 4 and the two connecting protrusions 3 at the top of the conveying rack 2 are matched and connected, and the electromagnet inside the connecting protrusion 3 and the metal sheets inside the two connecting grooves 13 are used for adsorption and matching, and at the same time, the two connecting protrusions 3 and the two connecting grooves 13 are engaged and connected to complete the active cooperation connection of the unloading rack 4 on the top of the conveying rack 2; the servo electric cylinder 6 is fixedly arranged on the four sides of the lower part of the unloading rack 4, and the lifting plate 5 is also movably arranged inside the unloading rack 4, and the limiting grooves 12 are arranged on the four sides inside the lifting plate 5, and the bottom of the inner wall of the limiting grooves 12 around the four sides is fixedly arranged with a linear slide rail 7, the top of the linear slide rail 7 is slidably arranged with a micro electric cylinder 8, and the top of the micro electric cylinder 8 is fixedly arranged with a clamping block 9, the middle part of the top of the lifting plate 5 is fixedly arranged with an adsorption block 10, and the tops of several clamping blocks 9 are fixedly arranged with adsorption blocks 2 11.

[0050] It should be noted that when positioning and feeding the flexible circuit board, the flexible circuit board is placed on the top of the lifting plate 5, and the linear slide rail 7 inside the limiting grooves 12 on all sides controls the micro-electric cylinder 8 to slide. At the same time, the driving end of the micro-electric cylinder 8 controls the clamping block 9 to push upward, and pushes the clamping block 9 from the inside of the limiting groove 12 to the top of the lifting plate 5, and then the linear slide rail 7 is used to control the clamping block 9 to approach the side of the flexible circuit board, and the clamping blocks 9 on all sides are used to clamp and position the flexible circuit board on the top of the lifting plate 5. At the same time, according to the position adjustment of the clamping blocks 9 on all sides, the flexible circuit board is calibrated and straightened at the center position of the top of the lifting plate 5. At this time, the adsorption block 10 set at the center position of the top of the lifting plate 5 is used to align the flexible circuit board The bottom of the clamping block 9 is adsorbed and positioned, and then the driving end of the micro-electric cylinder 8 at the bottom of the surrounding clamping blocks 9 is reset, and then the linear slide rail 7 is used to drive the clamping block 9 to move to the surroundings of the bottom of the flexible circuit board, and the driving end of the micro-electric cylinder 8 is used to control the clamping block 9 to move upward until the top of the clamping block 9 contacts the bottom of the flexible circuit board, and the adsorption blocks 2 11 set on the top of the clamping blocks 9 are used to adsorb and position the surroundings of the bottom of the flexible circuit board, and the adsorption block 10 is used to synchronously adsorb and position the center position of the bottom of the flexible circuit board, thereby largely ensuring the stability of the flexible circuit board during the film pasting process. At the same time, the positioning of the flexible circuit board will not interfere with the film pasting process, thereby ensuring the integrity and smoothness of the film pasting process of the flexible circuit board.

[0051] In a specific embodiment, the present invention can realize continuous movement of multiple unloading components inside the processing frame 1 by rotating the conveying frame 2 inside the processing frame 1. This rotating conveying method can make the process more compact and orderly, reduce the floor space of the equipment, and improve the utilization rate of the production space. At the same time, the continuously moving unloading component can realize uninterrupted feeding of the flexible circuit board, which helps to improve the overall production efficiency, avoids the waiting time in the traditional intermittent feeding process, and enables the film laminating process to be carried out continuously; the connection protrusion 3 on the top of the conveying frame 2 cooperates with the connection groove 13 at the bottom of the unloading frame 4, so as to realize the movable connection of the unloading frame 4 on the conveying frame 2; The electromagnet inside the connecting protrusion 3 and the metal sheet on the top of the inner wall of the connecting groove 13 are adsorbed and cooperated, which can not only ensure the connection stability of the unloading rack 4 during the conveying process and prevent it from being displaced or falling off due to vibration or other external factors, but also facilitate the rapid installation and disassembly of the unloading rack 4 by this electromagnetic adsorption connection mode; when the unloading rack 4 needs to be replaced or the equipment is maintained, the unloading rack 4 can be easily removed or installed from the conveying rack 2, which improves the operability and maintenance convenience of the equipment; at the same time, the snap connection between the connecting protrusion 3 and the connecting groove 13 further enhances the reliability of the connection, so that the unloading rack 4 can be accurately kept on the predetermined track during the movement, ensuring the accuracy and stability of feeding;

[0052] At the same time, by combining the servo electric cylinder 6 arranged around the lower part of the unloading rack 4 with the movable lifting plate 5, the vertical position of the lifting plate 5 can be accurately controlled. During the feeding process of the flexible circuit board, the height of the lifting plate 5 can be adjusted according to different process requirements. When the flexible circuit board is placed on the lifting plate 5, the lifting plate 5 can be lowered to a suitable height, which is convenient for operators or automated equipment to place the flexible circuit board thereon; and during the film pasting process, the lifting plate 5 can be lifted to a height matching the film pasting component to ensure the smooth progress of the film pasting process. This height-adjustable design increases the adaptability of the equipment to flexible circuit boards of different thicknesses and different process steps, and improves the versatility and flexibility of the equipment.

[0053] The linear slide rail 7 at the bottom of the inner wall of the limiting groove 12 around the lifting plate 5 provides a precise sliding track for the micro-electric cylinder 8, so that the micro-electric cylinder 8 can drive the clamping block 9 to move stably and accurately in the horizontal direction; in the positioning process of the flexible circuit board, the linear slide rail 7 is first used to control the micro-electric cylinder 8 to push the clamping block 9 from the inside of the limiting groove 12 to the top of the lifting plate 5, and then the clamping block 9 is controlled to approach the side of the flexible circuit board, and the flexible circuit board is clamped and positioned by using the clamping blocks 9 around. This distributed positioning operation can realize the precise positioning of the flexible circuit board, calibrate and straighten it at the center position of the top of the lifting plate 5, effectively avoid the deviation and shaking of the flexible circuit board during the feeding process, and improve the feeding accuracy. The multi-point adsorption method further enhances the stability of the flexible circuit board during the positioning process, so that it can maintain a fixed position and posture during the film pasting process, thereby ensuring the accuracy and integrity of the film pasting. At the same time, since the clamping block 9 can be moved to the surroundings of the bottom of the flexible circuit board when no clamping action is performed, it will not interfere with the film pasting process, thereby ensuring the smoothness of the film pasting process and avoiding film pasting defects or process interruptions caused by the positioning structure.

[0054] See also Figure 7 and 8 As shown, specifically, the pretreatment component includes a closed frame 15, two electric slides 14 are fixedly arranged at the front and rear sides of the left side inside the processing frame 1, and a closed frame 15 is slidably arranged between the opposite sides of the four electric slides 14 at the front and rear, and a sealing protrusion is arranged at the bottom of the closed frame 15, and a sealing groove matched with the sealing protrusion is arranged at the top of the discharge rack 4. When the closed frame 15 is used to seal the inside of the discharge rack 4, the sealing protrusion at the bottom of the closed frame 15 and the sealing groove at the top of the discharge rack 4 are matched and connected, so that a relatively sealed space is formed between the interiors of the closed frame 15 and the discharge rack 4, thereby improving the pretreatment effect of the flexible circuit board; a blowing frame 16 and a suction frame 17 are fixedly arranged below the left and right side walls of the closed frame 15, respectively, and the interior of the blowing frame 16 is connected to the output end of the blowing pump through a spring air guide pipe, and the interior of the suction frame 17 is connected to the input end of the dust suction pump through a spring air guide pipe;

[0055] It should be noted that when the film surface of the flexible circuit board is cleaned, the feed rack 4 with the flexible circuit board placed inside is driven by the conveying rack 2 to move to the bottom of the closing rack 15, and the electric slide 14 is used to control the closing rack 15 to move downward until the sealing protrusion at the bottom of the closing rack 15 and the sealing groove at the top of the feed rack 4 are matched and connected, and then the lifting plate 5 is controlled to move upward by the driving end of the servo electric cylinder 16 inside the feed rack 4, so that the film surface of the flexible circuit board on the top of the lifting plate 5 is respectively located between the blowing port of the blowing rack 16 and the suction port of the suction rack 17. At this time, air is blown to the film surface of the flexible circuit board through the blowing rack 16, and the dust on the film surface of the flexible circuit board is sucked by the suction rack 17, so as to realize the cleaning of the film surface of the flexible circuit board and ensure the quality of the automated film processing of the flexible circuit board.

[0056] Furthermore, in order to further improve the film processing quality of the flexible circuit board, while cleaning the film surface of the flexible circuit board, the left and right side walls of the closed frame 15 are fixedly provided with linear slide rails 18, and a sliding frame 19 is slidably provided between the two opposite sides of the two linear slide rails 18, and a mounting groove is provided at the bottom of the sliding frame 19, and an ultraviolet lamp 20 is fixedly provided inside the mounting groove;

[0057] It should be noted that when the blowing rack 16 and the suction rack 17 are used to clean the film surface of the flexible circuit board, the linear slide rails 18 on the left and right sides are used to drive the sliding rack 19 to slide back and forth above the flexible circuit board. The ultraviolet lamp 20 inside the sliding rack 19 is used to irradiate the film surface of the flexible circuit board, so that the organic molecules on the surface of the flexible circuit board undergo a photochemical reaction to produce polar groups. The polar groups increase the hydrophilicity and chemical reaction activity of the film surface of the flexible circuit board, which is beneficial to the adhesion of the film material and further improves the film processing quality of the flexible circuit board.

[0058] Furthermore, a hot pressing plate 22 is movably arranged inside the closed frame 15, and servo electric cylinders 21 are fixedly arranged around the top of the closed frame 15, and the bottom ends of the driving ends of the servo electric cylinders 21 are fixedly connected to the top of the hot pressing plate 22 on all sides, respectively. A heating wire is arranged inside the hot pressing plate 22, and a high temperature resistant pad is also arranged at the bottom of the hot pressing plate 22;

[0059] After the film surface of the flexible circuit board is cleaned and photochemically treated, the driving ends of the four servo electric cylinders 21 are used to control the hot pressing plate 22 to move downward, and the heating wire inside the hot pressing plate 22 is used to generate heat to control the hot pressing temperature of the hot pressing plate 22. The four servo electric cylinders 21 are used to control the hot pressing and leveling pressure of the flexible circuit board to ensure the flatness of the film surface of the flexible circuit board.

[0060] In a specific embodiment, the present invention can accurately control the lifting and lowering movement of the closed frame 15 by processing the four electric slides 14 on the front and rear left sides of the frame 1. When the sealing protrusion at the bottom of the closed frame 15 is connected with the sealing groove at the top of the unloading frame 4, a relatively sealed space is formed inside the two. The advantage of this sealing design is that when pre-treating the flexible circuit board, it can effectively isolate the interference of the external environment, such as dust, impurities, etc., so that the pre-treatment process can be carried out in a relatively clean and stable environment, thereby significantly improving the pre-treatment effect of the flexible circuit board. When performing air cleaning and dust collection operations, the sealed space can prevent dust from escaping, ensuring the maximization of the dust collection effect, while preventing external dust from contaminating the cleaned circuit board surface again, providing a cleaner foundation for the subsequent film laminating process;

[0061] By arranging the blowing rack 16 and the suction rack 17 below the left and right side walls of the closed rack 15 respectively, when cleaning the film surface of the flexible circuit board, the height of the lifting plate 5 is adjusted by the servo electric cylinder 16 inside the unloading rack 4, so that the film surface of the flexible circuit board is between the blowing port and the suction port, and the blowing pump supplies air to the blowing rack 16 through the spring air guide pipe, so that the gas is blown to the surface of the circuit board to blow up loose pollutants such as dust. At the same time, the dust suction pump cooperates with the suction rack 17 through the spring air guide pipe to suck up the blown dust in time. This coordinated method of blowing and suction can efficiently remove tiny impurities such as dust and fibers on the film surface of the flexible circuit board, thereby ensuring the quality of the automatic film processing of the flexible circuit board. Compared with a single cleaning method, this combined cleaning method can more thoroughly remove pollutants and reduce the poor film phenomenon caused by residual impurities, such as bubbles and loose bonding.

[0062] The linear slide rail 2 18 drives the sliding frame 19 to slide back and forth above the flexible circuit board. The ultraviolet lamp 20 installed in the mounting groove at the bottom of the sliding frame 19 irradiates the film surface of the flexible circuit board during the cleaning process. The ultraviolet irradiation causes the organic molecules on the surface of the flexible circuit board to undergo photochemical reactions, generating polar groups such as hydroxyl groups and carboxyl groups. These polar groups can improve the hydrophilicity and chemical reaction activity of the surface, which is beneficial to the adhesion of the film material. This design further optimizes the surface performance of the flexible circuit board without increasing too much processing time and complex processes, making the bonding between the film material and the circuit board surface tighter and firmer, thereby further improving the film processing quality of the flexible circuit board and reducing the risk of film shedding or poor lamination after film lamination. This is of great significance, especially for some application scenarios with high requirements for film adhesion, such as flexible circuit boards used in high temperature, high humidity or frequent vibration environments.

[0063] The servo electric cylinders 21 around the top of the closed frame 15 can accurately control the lifting and lowering of the hot pressing plate 22. After cleaning and photochemical treatment, the hot pressing plate 22 moves downward under the drive of the servo electric cylinder 21. The electric heating wire inside the hot pressing plate 22 generates heat, and the hot pressing temperature can be controlled as needed. Combined with the hot pressing and leveling pressure controlled by the servo electric cylinder 21, the surface of the flexible circuit board film is hot pressed and leveled. This is very effective for flexible circuit boards that may be slightly warped or deformed during the processing process, and can restore them to a flat state. A flat circuit board surface helps the film material to fit evenly, avoiding problems such as uneven film thickness and bubble generation caused by an uneven surface, thereby ensuring the flatness of the film surface of the flexible circuit board, improving the overall quality of the film and the reliability of the product, and enabling the flexible circuit board to better exert its electrical and mechanical properties in the subsequent use process, reducing potential problems such as signal transmission interference or mechanical stress concentration caused by an uneven surface.

[0064] See also Fig. 9 and Fig.10 As shown, specifically, the film sticking assembly includes a fixing frame 23 and a mounting frame 24, the fixing frame 23 is fixedly arranged in the middle of the processing frame 1, and the mounting frame 24 is fixedly arranged on the top of the fixing frame 23 through a bolt group, a driving frame 25 is fixedly arranged on the top of the inner wall of the mounting frame 24, and an adjusting frame 26 is slidably arranged at the bottom of the driving frame 25 through an electric slider, and a laser generator 27 is slidably arranged at the bottom of the adjusting frame 26 through an electric slider;

[0065] It should be noted that the electric slider at the bottom of the driving frame 25 enables the adjusting frame 26 to move flexibly in the X-axis direction. At the same time, the electric slider at the bottom of the adjusting frame 26 gives the laser generator 27 the ability to move in the Y-axis direction. This design allows the position of the laser generator 27 on the horizontal plane to be accurately adjusted according to the size of the flexible circuit board and the film pasting requirements, and can cover circuit board areas of different sizes and shapes. The laser technology is used to perform film cutting operations. Laser cutting has extremely high precision and can achieve complex shape film cutting. Whether it is a straight line, a curve or various special-shaped contours, it can be accurately cut according to the shape of the flexible circuit board to ensure that the film material is perfectly matched with the edge of the circuit board, avoiding edge burrs and inaccurate cutting problems that may occur in traditional mechanical cutting methods.

[0066] Furthermore, a film pasting through hole is provided at the bottom of the fixing frame 23, fixing plates 28 are fixedly provided on the front and rear sides of the fixing frame 23, and connecting plates 29 are fixedly provided on the tops of the two fixing plates 28 by bolt groups, and film collecting rollers 31 and film putting rollers 30 are rotatably provided on the left and right sides of the fixing frame 23 respectively, and the front and rear ends of the film collecting rollers 31 and the film putting rollers 30 are rotatably provided inside the fixing plates 28 on the front and rear sides respectively, and the rear ends of the film putting rollers 30 and the film collecting rollers 31 are rotationally driven by servo motors, and the film material is unwound by the film putting rollers 30, and the film material is wound up in cooperation with the film collecting rollers 31, thereby realizing automatic winding and unwinding operations of the film material, and combining with the continuously conveyed flexible circuit board, realizing continuous automatic film pasting processing of the flexible circuit board.

[0067] Furthermore, a linear slide rail 3 32 is fixedly provided on one side opposite to the two connecting plates 29 on the front and rear sides, and a sliding frame 2 33 is slidably provided between the two linear slide rails 32 on the opposite sides, a film-laminating head 35 is movably provided at the bottom of the sliding frame 2 33, a servo electric cylinder 3 34 is fixedly provided on the front and rear sides of the top of the sliding frame 2 33, and the driving ends of the two servo electric cylinders 34 are fixedly connected to the top of the film-laminating head 35, and the film-laminating head 35 is composed of an upper and lower layer structure of a pressure regulating layer and a bonding layer. The pressure regulating layer adjusts the film-laminating pressure by air pressure, and the bonding layer is made of silicone material. During the film-laminating process, the bonding of the silicone material The layer can be in close contact with the surface of the flexible circuit board and the film material, effectively avoiding scratches on the film material and the circuit board. At the same time, its softness helps to fill the tiny unevenness on the surface of the circuit board, so that the film material can better fit on the circuit board, further improving the quality and integrity of the film. The pressure regulating layer adjusts the film laminating pressure through air pressure and cooperates with the silicone laminating layer to achieve the optimization of the film laminating pressure and laminating effect under different process conditions, making the entire film laminating process more stable and reliable, adapting to diverse film laminating needs, improving the versatility and flexibility of the equipment, and being able to meet various complex flexible circuit board film laminating process requirements.

[0068] It should be noted that when the automatic film pasting process of the flexible circuit board is carried out, the lifting plate 5 is controlled to be lifted upward by the driving end of the servo electric cylinder 6, so that the lifting plate 5 drives the flexible circuit board to pass through the film pasting through hole at the bottom of the fixing frame 23 until the film pasting surface of the flexible circuit board contacts the bottom surface of the film material. At this time, the film pasting head 35 is driven by the linear slide rail 32 to slide above the film material, and the driving end of the servo electric cylinder 34 controls the film pasting head 35 to move downward. The film pasting head 35 is used to automatically apply the film material to the film pasting surface of the flexible circuit board. Finally, the laser generator 27 inside the mounting frame 24 is used to automatically cut the film material according to the edge of the flexible circuit board.

[0069] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0070] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0071] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the attached claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0072] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An automatic film laminating process for a flexible circuit board, characterized in that: The following steps are involved: S1. Positioning and feeding: The flexible circuit board is placed on the top of the lifting plate (5), and the micro-electric cylinder (8) is controlled to slide by the linear slide rail (7) inside the limiting grooves (12) around it. At the same time, the driving end of the micro-electric cylinder (8) controls the clamping block (9) to push upward, and pushes the clamping block (9) from the inside of the limiting groove (12) to the top of the lifting plate (5). Then, the linear slide rail (7) controls the clamping block (9) to approach the side of the flexible circuit board, and the clamping blocks (9) around it are used to clamp and position the flexible circuit board on the top of the lifting plate (5). At the same time, according to the position adjustment of the clamping blocks (9) around it, the flexible circuit board is adjusted to the center position of the top of the lifting plate (5). After the flexible circuit board is aligned, the bottom of the flexible circuit board is positioned by the adsorption block 1 (10) arranged at the top center of the lifting plate (5), and then the driving end of the micro-electric cylinder (8) at the bottom of the clamping blocks (9) around it is reset, and then the clamping blocks (9) are driven to move to the four sides of the bottom of the flexible circuit board in cooperation with the linear guide rail 1 (7), and the clamping blocks (9) are controlled to move upward by the driving end of the micro-electric cylinder (8) until the top of the clamping blocks (9) and the bottom of the flexible circuit board are in contact, and the four sides of the bottom of the flexible circuit board are positioned by the adsorption blocks 2 (11) arranged at the top of the clamping blocks (9), and the center of the bottom of the flexible circuit board is synchronously positioned by the adsorption block 1 (10); S2, pre-film treatment: the feeding rack (4) with the flexible circuit board placed inside is driven by the conveying rack (2) to move to the bottom of the closing rack (15), and the electric slide (14) is used to control the closing rack (15) to move downward until the sealing protrusion at the bottom of the closing rack (15) and the sealing groove at the top of the feeding rack (4) are matched and connected, and then the lifting plate (5) is controlled to move upward by the driving end of the servo electric cylinder 1 (6) inside the feeding rack (4), so that the film surface of the flexible circuit board on the top of the lifting plate (5) is respectively located between the blowing port of the blowing rack (16) and the suction port of the suction rack (17), and at this time, the blowing rack (16) is used to blow air to the film surface of the flexible circuit board, and the dust on the film surface of the flexible circuit board is sucked by the suction rack (17); When the film-attached surface of the flexible circuit board is cleaned by using the air blowing frame (16) and the air suction frame (17), the linear slide rails (18) on the left and right sides are used to drive the sliding frame (19) to slide back and forth above the flexible circuit board, and the ultraviolet light (20) inside the sliding frame (19) is used to irradiate the film-attached surface of the flexible circuit board, so that the organic molecules on the surface of the flexible circuit board undergo a photochemical reaction; After the film-attached surface of the flexible circuit board is cleaned and photochemically treated, the driving ends of the four servo electric cylinders (21) are used to control the hot pressing plate (22) to move downward, and the electric heating wire inside the hot pressing plate (22) is used to generate heat to control the hot pressing temperature of the hot pressing plate (22), and the four servo electric cylinders (21) are used to control the hot pressing and flattening pressure of the flexible circuit board to perform hot pressing and flattening on the film-attached surface of the flexible circuit board; S3, automatic film pasting: the lifting plate (5) is lifted upward by controlling the driving end of the servo electric cylinder 1 (6), so that the lifting plate (5) drives the flexible circuit board to pass through the film pasting hole at the bottom of the fixing frame (23) until the film pasting surface of the flexible circuit board contacts the bottom surface of the film material. At this time, the film pasting head (35) is driven by the linear slide rail 3 (32) to slide above the film material, and the driving end of the servo electric cylinder 3 (34) controls the film pasting head (35) to move downward. The film pasting head (35) is used to automatically apply the film material to the film pasting surface of the flexible circuit board. Finally, the laser generator (27) inside the mounting frame (24) is used to automatically cut the film material according to the edge of the flexible circuit board.

2. The automatic film laminating process for a flexible circuit board according to claim 1, characterized in that: Also includes: A processing frame (1) is provided with a conveying frame (2) rotatably disposed inside the processing frame (1), and a plurality of connecting protrusions (3) are fixedly disposed on the top of the conveying frame (2), a plurality of material discharge components are movably disposed on the top of the conveying frame (2), a pretreatment component is disposed on the left side inside the processing frame (1), and a film sticking component is also disposed in the middle part of the processing frame (1).

3. The automatic film laminating process for a flexible circuit board according to claim 2, characterized in that: The material discharging assembly comprises a material discharging rack (4), the material discharging rack (4) is movably arranged on the top of the conveying rack (2), and connecting grooves (13) matching with the connecting protrusions (3) are arranged on both sides of the bottom of the material discharging rack (4), a high temperature resistant pad is arranged on the top surface of the material discharging rack (4), an electromagnet is arranged inside the connecting protrusion (3), and a metal sheet is arranged on the top of the inner wall of the connecting groove (13).

4. The automatic film laminating process for a flexible circuit board according to claim 3, characterized in that: A servo electric cylinder (6) is fixedly arranged on all four sides of the lower part of the material discharging rack (4), and a lifting plate (5) is movably arranged on the inside of the material discharging rack (4), and a limiting groove (12) is arranged on all four sides of the inside of the lifting plate (5), and a linear slide rail (7) is fixedly arranged on the bottom of the inner wall of the limiting groove (12) on all four sides, and a micro electric cylinder (8) is slidably arranged on the top of the linear slide rail (7), and a clamping block (9) is fixedly arranged on the top of the micro electric cylinder (8), and an adsorption block (10) is fixedly arranged in the middle of the top of the lifting plate (5), and adsorption blocks (11) are fixedly arranged on the top of a plurality of clamping blocks (9).

5. The automatic film laminating process for a flexible circuit board according to claim 2, characterized in that: The pretreatment component comprises a closed frame (15), two electric slides (14) are fixedly arranged at the front and rear sides of the left side of the interior of the processing frame (1), and a closed frame (15) is slidably arranged between the opposite sides of the four electric slides (14) at the front and rear sides, a sealing protrusion is arranged at the bottom of the closed frame (15), and a sealing groove matching the sealing protrusion is arranged at the top of the discharge frame (4), and a blowing frame (16) and a suction frame (17) are fixedly arranged below the left and right side walls of the closed frame (15), respectively, and the interior of the blowing frame (16) is connected to the output end of the blowing pump through a spring air guide pipe, and the interior of the suction frame (17) is connected to the input end of the dust suction pump through a spring air guide pipe.

6. The automatic film laminating process for a flexible circuit board according to claim 5, characterized in that: The left and right side walls of the closed frame (15) are both fixedly provided with linear slide rails 2 (18), and a sliding frame 1 (19) is slidably provided between the two opposite sides of the two linear slide rails 2 (18), and a mounting groove is provided at the bottom of the sliding frame 1 (19), and an ultraviolet lamp (20) is fixedly provided inside the mounting groove.

7. The automatic film laminating process for a flexible circuit board according to claim 5, characterized in that: A hot pressing plate (22) is also movably arranged inside the closed frame (15), and servo electric cylinders (21) are fixedly arranged around the top of the closed frame (15), and the bottom ends of the driving ends of the servo electric cylinders (21) are fixedly connected to the top of the hot pressing plate (22) around the four sides, respectively. A heating wire is arranged inside the hot pressing plate (22), and a high temperature resistant pad is also arranged at the bottom of the hot pressing plate (22).

8. The automatic film laminating process for a flexible circuit board according to claim 2, characterized in that: The film sticking assembly comprises a fixing frame (23) and a mounting frame (24); the fixing frame (23) is fixedly arranged in the middle of the processing frame (1); the mounting frame (24) is fixedly arranged on the top of the fixing frame (23) via a bolt group; a driving frame (25) is fixedly arranged on the top of the inner wall of the mounting frame (24); an adjusting frame (26) is slidably arranged on the bottom of the driving frame (25) via an electric slider; and a laser generator (27) is slidably arranged on the bottom of the adjusting frame (26) via an electric slider.

9. The automatic film laminating process for a flexible circuit board according to claim 8, characterized in that: A film sticking through hole is arranged at the bottom of the fixing frame (23), a fixing plate (28) is fixedly arranged on the front and rear sides of the fixing frame (23), and a connecting plate (29) is fixedly arranged on the top of the two fixing plates (28) by a bolt group, and a film collecting roller (31) and a film placing roller (30) are rotatably arranged on the left and right sides of the fixing frame (23), and the front and rear ends of the film collecting roller (31) and the film placing roller (30) are rotatably arranged inside the fixing plates (28) on the front and rear sides, respectively, and the rear ends of the film placing roller (30) and the film collecting roller (31) are rotatably arranged. The rear ends of the film placing roller (30) and the film collecting roller (31) are both driven to rotate by a servo motor.

10. The automatic film laminating process for a flexible circuit board according to claim 9, characterized in that: A linear slide rail three (32) is fixedly arranged on the opposite sides of the two connecting plates (29) on the front and rear sides, and a sliding frame two (33) is slidably arranged between the opposite sides of the two linear slide rails three (32). A film sticking head (35) is movably arranged at the bottom of the sliding frame two (33). A servo electric cylinder three (34) is fixedly arranged on the front and rear sides of the top of the sliding frame two (33), and the driving ends of the two servo electric cylinders three (34) are fixedly connected to the top of the film sticking head (35). The film sticking head (35) consists of an upper and lower layer structure of a pressure regulating layer and a bonding layer.

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