Optical isolation solid relay and manufacturing method

Abstract

The invention provides an optical isolation solid-state relay and a manufacturing method, and relates to the technical field of solid-state relays, the optical isolation solid-state relay comprises an input circuit, an isolation driving circuit, an overcurrent protection circuit and an output power circuit, the input circuit emits an optical signal to the isolation driving circuit under the condition of electrification, and the output power circuit outputs the optical signal to the isolation driving circuit; the isolation driving circuit receives the optical signal and converts the optical signal into a target electric signal; the isolation driving circuit is connected with the output power circuit and is used for driving the output power circuit; the overcurrent protection circuit is connected between the isolation driving circuit and the output power circuit, and the overcurrent protection circuit is set to control the output power circuit to be disconnected when the output current of the output power circuit is larger than or equal to a preset current threshold value and control the output power circuit to be connected when the output current is smaller than the preset current threshold value. By implementing the technical scheme provided by the invention, the purpose of overcurrent protection is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of solid-state relays, and in particular to an optically isolated solid-state relay and a manufacturing method thereof. Background Art

[0002] As an important electronic component, solid-state relays are widely used in modern electronic products, and their performance and reliability are highly valued. The application of ceramic packaging technology and optical isolation technology can not only effectively reduce the size of the product, but also improve its anti-interference ability and safety. However, existing solid-state relays usually only have basic switching functions, which are difficult to meet the multifunctional requirements of the new generation of equipment or products.

[0003] Although existing solid-state relays have been able to achieve miniaturization and high reliability to a certain extent, there are still some shortcomings in practical applications. For example, the lack of an effective overcurrent protection mechanism is a significant problem, especially for application scenarios that require long-term stable operation. When the relay works under overload conditions, it is easy to cause damage to internal components, thereby affecting the normal operation of the entire system. Therefore, how to add overcurrent protection function while ensuring miniaturization and high reliability has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0004] In order to solve the above problems, the present application provides an optically isolated solid-state relay and a manufacturing method.

[0005] In the first aspect, the present application provides an optically isolated solid-state relay, comprising: an input circuit, an isolation drive circuit, an overcurrent protection circuit and an output power circuit, wherein the input circuit sends an optical signal to the isolation drive circuit when powered on, and the isolation drive circuit receives the optical signal and converts the optical signal into a target electrical signal; the isolation drive circuit is connected to the output power circuit, and the isolation drive circuit is used to drive the output power circuit; the overcurrent protection circuit is connected between the isolation drive circuit and the output power circuit, wherein the overcurrent protection circuit is configured to control the output power circuit to be disconnected when the output current of the output power circuit is greater than or equal to a preset current threshold, and to control the output power circuit to be turned on when the output current is less than the preset current threshold.

[0006] By adopting the above technical solution, the input circuit sends an optical signal to the isolation drive circuit when powered on, achieving optical isolation and improving anti-interference ability. The isolation drive circuit receives the optical signal and converts it into a target electrical signal, further driving the output power circuit to ensure the accuracy and stability of signal transmission. The overcurrent protection circuit is connected between the isolation drive circuit and the output power circuit. When the output current of the output power circuit exceeds the preset current threshold, the output power circuit is automatically disconnected to prevent damage to internal components caused by overload, thereby extending the service life of the equipment and improving system safety; when the output current returns to normal levels, the overcurrent protection circuit automatically restores the conduction state of the output power circuit to ensure the continuity and reliability of the equipment. The optical isolation solid-state relay achieves the purpose of overcurrent protection while maintaining miniaturization and high reliability.

[0007] Optionally, the isolation drive circuit includes a first photocell chip and a second photocell chip, the first photocell chip is used to convert the optical signal into a first electrical signal, and the second photocell chip is used to convert the optical signal into a second electrical signal, wherein the target electrical signal includes the first electrical signal and the second electrical signal; the output power circuit includes a first MOS tube and a first resistor, the first output end of the first photocell chip is electrically connected to the gate of the first MOS tube through the first resistor, the second output end of the first photocell chip is electrically connected to the source of the first MOS tube, and the drain of the first MOS tube serves as the positive output end of the optical isolation solid state relay; the overcurrent protection circuit includes a first transistor and a second resistor, the first output end of the second photocell chip is electrically connected to the base of the first transistor, the second output end of the second photocell chip is electrically connected to the emitter of the first transistor, the collector of the first transistor is electrically connected to the first output end of the first photocell chip, the base of the first transistor is electrically connected to the source of the first MOS tube, the source of the first MOS tube is electrically connected to the emitter of the first transistor through the second resistor, and the emitter of the first transistor serves as the negative output end of the optical isolation solid state relay.

[0008] By adopting the above technical solution, the first photocell chip and the second photocell chip convert the optical signal into the first electrical signal and the second electrical signal respectively, the first electrical signal is used to drive the output power circuit, and the second electrical signal is used to provide current to the base of the first transistor. The design of the first MOS tube and the first resistor in the output power circuit, and the configuration of the first transistor and the second resistor in the overcurrent protection circuit can disconnect the output power circuit in time when the output current exceeds the preset current threshold, preventing damage to internal components due to overcurrent, thereby improving the safety and life of the relay.

[0009] Optionally, the overcurrent protection circuit also includes a first Schottky diode and a second Schottky diode, and the base of the first transistor is electrically connected to the source of the first MOS tube through the first Schottky diode and the second Schottky diode, wherein the base of the first transistor is electrically connected to the anode of the first Schottky diode, the cathode of the first Schottky diode is electrically connected to the anode of the second Schottky diode, and the cathode of the second Schottky diode is electrically connected to the source of the first MOS tube.

[0010] By adopting the above technical solution, the first Schottky diode and the second Schottky diode in the overcurrent protection circuit can effectively reduce the voltage drop of the second resistor when performing overcurrent protection, which is beneficial to reducing power consumption. At the same time, when the output current exceeds the preset current threshold, the output power circuit can be quickly cut off to prevent damage to components in the case of overcurrent, thereby improving the safety and reliability of the system. By reasonably adding the first Schottky diode and the second Schottky diode, the structure of the overcurrent protection circuit is optimized to make it more compact and efficient, which helps to reduce the cost and complexity of the circuit, while improving the overall performance and reliability of the relay.

[0011] Optionally, the input circuit includes a first light-emitting diode chip and a second light-emitting diode chip, and the cathode of the first light-emitting diode chip is electrically connected to the anode of the second light-emitting diode chip, wherein the anode of the first light-emitting diode chip serves as the positive input terminal of the optically isolated solid-state relay, and the cathode of the second light-emitting diode chip serves as the negative input terminal of the optically isolated solid-state relay.

[0012] By adopting the above technical solution, the series connection of two light-emitting diode chips can increase the intensity of the optical signal, ensure that the isolation driving circuit can receive sufficient optical signals, and thus improve the reliability of signal transmission; through a simple series connection method, the design of the input circuit can be simplified, the number of external components can be reduced, and the manufacturing cost and complexity can be reduced.

[0013] Optionally, the above-mentioned optically isolated solid relay also includes: a circuit substrate, a tube seat and a cover plate, wherein the input circuit is located on the circuit substrate, and the isolation drive circuit, the overcurrent protection circuit and the output power circuit are all located on the tube seat; the optically isolated solid relay adopts a double-layer structure, the upper layer is the circuit substrate, and the lower layer is the tube seat, the light-emitting diode chipset on the circuit substrate and the photocell chipset on the tube seat are vertically aligned and physically isolated, wherein the light-emitting diode chipset includes a first light-emitting diode chip and a second light-emitting diode chip, and the photocell chipset includes a first photocell chip and a second photocell chip; the optically isolated solid relay adopts a parallel sealing welding process to hermetically seal the cover plate and the tube seat.

[0014] By adopting the above technical solutions, the circuit layout is optimized: by placing the input circuit on the circuit substrate, and placing the isolation drive circuit, overcurrent protection circuit and output power circuit on the tube holder, a double-layer structure is formed, which effectively reduces the overall size and makes the relay more compact. Physical isolation is enhanced: the vertical alignment and physical isolation design between the light-emitting diode chipset on the circuit substrate and the photovoltaic chipset on the tube holder ensures the high efficiency and stability of optical signal transmission and reduces the impact of electromagnetic interference. Packaging process improvement: the cover plate and the tube holder are hermetically sealed by a parallel sealing process, which further improves the moisture and dust resistance of the relay, extends its service life, and enhances its overall reliability.

[0015] In a second aspect, the present application also provides a method for manufacturing an optically isolated solid-state relay, which is used to manufacture the aforementioned optically isolated solid-state relay, comprising: installing a group of components on corresponding areas of an original circuit substrate and an original tube holder, respectively, wherein the group of components comprises a first light-emitting diode chip, a second light-emitting diode chip, a first photocell chip, a second photocell chip, a first MOS tube, a first triode, a first resistor, a second resistor, a first Schottky diode and a second Schottky diode; electrically connecting each component in the group of components to corresponding areas on the original circuit substrate and the original tube holder to obtain a circuit substrate and a tube holder; assembling the circuit substrate and the tube holder, and sealing the entire assembly to obtain an optically isolated solid-state relay, wherein the light-emitting diode chip group on the circuit substrate is aligned with the photocell chip group on the tube holder.

[0016] By adopting the above technical scheme, the light-emitting diode chipset on the circuit substrate is aligned with the photocell chipset on the tube socket, thereby ensuring the effective transmission and conversion of the optical signal and improving the stability and reliability of the signal; a double-layer structure design is adopted, with the upper layer being the circuit substrate and the lower layer being the tube socket, thereby achieving vertical alignment and physical isolation between the light-emitting diode chipset and the photocell chipset, thereby enhancing the anti-interference capability and improving the safety of the equipment; a parallel sealing process is used to hermetically seal the cover plate and the tube socket, thereby effectively preventing the influence of the external environment on the internal circuit and extending the service life of the relay; a group of components are respectively installed in the corresponding areas of the original circuit substrate and the original tube socket, and the reflow process and the gold wire ball bonding process are used for electrical connection, thereby ensuring the stable and reliable electrical connection between the components and improving the production efficiency and product quality.

[0017] Optionally, a group of components are respectively installed in corresponding areas of the original circuit substrate and the original tube socket, including: installing the first light-emitting diode chip and the second light-emitting diode chip in corresponding areas on the original circuit substrate, and installing other components in corresponding areas of the original tube socket, wherein the other components are components in a group of components other than the first light-emitting diode chip and the second light-emitting diode chip, and each pin of each component in a group of components corresponds to a metallized area on the original circuit substrate or the original tube socket.

[0018] By adopting the above technical solution, the precise installation and positioning of each component in the manufacturing process of the optical isolation solid state relay is realized. Specifically, the first light-emitting diode chip and the second light-emitting diode chip are installed in the corresponding area on the original circuit substrate to ensure the correct layout of the input circuit; at the same time, other components (such as the first photocell chip, the second photocell chip, the first MOS tube, the first triode, the first resistor, the second resistor, the first Schottky diode and the second Schottky diode) are installed in the corresponding area of ​​the original tube holder to ensure the reasonable distribution of the isolation drive circuit, the overcurrent protection circuit and the output power circuit. This layout method not only improves the assembly efficiency, but also ensures the electrical connection reliability and mechanical stability between the circuits, thereby improving the overall performance and reliability of the optical isolation solid state relay.

[0019] Optionally, a group of components are respectively installed on corresponding areas of the original circuit substrate and the original tube socket, including: using solder paste to bond first-type devices to corresponding metallized areas on the original tube socket, wherein the first-type devices include a first MOS tube and a second resistor; using conductive glue to bond second-type devices to corresponding metallized areas on the original circuit substrate, wherein the second-type devices include a first light-emitting diode chip and a second light-emitting diode chip; and using conductive glue to bond third-type devices to corresponding metallized areas on the original tube socket, wherein the third-type devices include a first photocell chip, a second photocell chip, a first transistor, a first resistor, a first Schottky diode and a second Schottky diode.

[0020] By adopting the above technical solution, the first type of devices (first MOS tube and second resistor) are respectively bonded to the corresponding metallized areas on the original tube holder by solder paste, ensuring the fixation and good electrical contact of these devices, and improving the assembly efficiency and reliability. The second type of devices (first light-emitting diode chip and second light-emitting diode chip) are bonded to the corresponding metallized areas on the original circuit substrate by conductive glue, ensuring the stability and electrical performance of these devices, while avoiding the thermal damage that may be caused by high-temperature welding. The third type of devices (first photocell chip, second photocell chip, first triode, first resistor, first Schottky diode and second Schottky diode) are respectively bonded to the corresponding metallized areas on the original tube holder by conductive glue, further enhancing the stability of these key devices and ensuring the functional reliability and long-term stability of the entire circuit. The purpose of accurately installing different types of components in the corresponding areas on the original circuit substrate and the original tube holder is achieved.

[0021] Optionally, each component in a group of components is electrically connected to corresponding areas on the circuit substrate and the tube seat, including: using a reflow soldering process to weld the pins of the first MOS tube and the second resistor to the corresponding metallized areas; using a gold wire ball bonding process to electrically connect the metallized areas corresponding to the associated pins, wherein the associated pins are used to represent multiple pins that are electrically connected to the second type of device and the third type of device.

[0022] By adopting the above technical solution, the pins of the first MOS tube and the second resistor are welded to the corresponding metallized areas, ensuring a firm connection between the pins of these key components and the original tube socket, enhancing the mechanical strength and electrical performance of the device, and reducing the failure rate caused by poor contact. The metallized areas corresponding to the associated pins are electrically connected to achieve precise electrical connection between the second type of devices (such as the first light-emitting diode chip and the second light-emitting diode chip) and the third type of devices (such as the first photovoltaic cell chip, the second photovoltaic cell chip, the first transistor, the first resistor, the first Schottky diode and the second Schottky diode), improving the reliability and efficiency of signal transmission, and further improving the overall performance of the optical isolation solid-state relay. This method ensures reliable electrical connection between the components and improves the manufacturing accuracy and stability of the optical isolation solid-state relay.

[0023] Optionally, the circuit substrate and the tube holder are assembled, and the entire assembly is sealed to obtain an optically isolated solid relay, including: using conductive glue to fix the circuit substrate and a preset area on the tube holder, wherein the preset area is a protruding area on the tube holder, so that the circuit substrate and the photovoltaic cell chipset on the tube holder are vertically aligned and physically isolated; and using a parallel sealing process to hermetically seal the cover plate and the tube holder to obtain an optically isolated solid relay.

[0024] By adopting the above technical solution, the precise alignment and physical isolation between the circuit substrate and the tube holder can be ensured, thereby effectively avoiding the risk of signal crosstalk and short circuit, and improving the reliability and stability of the optical isolation solid state relay. At the same time, the use of conductive glue for fixed connection can enhance the overall mechanical strength of the component and prevent loosening due to vibration or impact. The parallel sealing process is used for hermetic packaging, which further improves the sealing and moisture resistance of the product and extends its service life.

[0025] In summary, one or more technical solutions provided in this application have at least the following technical effects or advantages: 1. When the output current of the output power circuit exceeds the preset current threshold, the output power circuit is automatically disconnected to prevent damage to internal components caused by overload, thereby extending the service life of the equipment and improving system safety; when the output current returns to normal levels, the overcurrent protection circuit automatically restores the conduction state of the output power circuit to ensure the continuity and reliability of the equipment; 2. The low forward voltage drop characteristic of Schottky diode can reduce energy loss in the circuit and improve the efficiency of the overall circuit while maintaining the compactness and miniaturization design of the circuit; 3. The double-layer structure effectively reduces the overall size and makes the relay more compact; the vertical alignment and physical isolation design between the LED chipset and the photovoltaic chipset ensures the high efficiency and stability of optical signal transmission and reduces the impact of electromagnetic interference; the parallel sealing process is used for hermetic packaging, which further improves the moisture and dust resistance of the relay, extends its service life, and enhances its overall reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a structural block diagram of an optically isolated solid-state relay provided in an embodiment of the present application; Figure 2 This is a circuit diagram of an optically isolated solid-state relay provided in an embodiment of the present application; Figure 3 is a circuit diagram of another optically isolated solid-state relay provided in an embodiment of the present application; Figure 4 is a schematic diagram of an input isolation circuit provided in an embodiment of the present application; Figure 5 is a schematic diagram of an output power circuit provided in an embodiment of the present application; Figure 6 is a schematic diagram of an overcurrent protection circuit provided in an embodiment of the present application; Figure 7 It is a schematic diagram of a circuit core seat provided in an embodiment of the present application; Figure 8 It is a product assembly structure diagram provided by an embodiment of the present application; Fig. 9 It is a schematic diagram of the product appearance provided by the embodiment of the present application; Fig.10 This is a schematic diagram of the bonding and welding of the socket chip provided in the embodiment of the present application; Fig.11 It is a schematic diagram of bonding a circuit substrate provided in an embodiment of the present application; Fig.12 It is a schematic diagram of gold wire bonding provided in an embodiment of the present application; Fig.13 It is an assembly schematic diagram provided by an embodiment of the present application; Fig.14 It is a schematic diagram of the configuration method provided in the embodiment of the present application.

[0027] Description of reference numerals: V1-first light-emitting diode chip, V2-second light-emitting diode chip, V3-first photocell chip, V4-second photocell chip, V5-first transistor, V6-first Schottky diode, V7-second Schottky diode, V8-first MOS tube, R1-first resistor, R2-second resistor. DETAILED DESCRIPTION

[0028] In order to enable technicians in this field to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments.

[0029] In the description of the embodiments of the present application, words such as "for example" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "for example" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "for example" or "for example" is intended to present related concepts in a specific way.

[0030] In the description of the embodiments of the present application, the term "plurality" means two or more. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0031] The present application provides an optically isolated solid-state relay, such as Figure 1 As shown, Figure 1: is a structural block diagram of an optical isolation solid-state relay provided in an embodiment of the present application, including: an input circuit, an isolation drive circuit, an overcurrent protection circuit and an output power circuit, wherein: The input circuit sends an optical signal to the isolation driving circuit when powered on, and the isolation driving circuit receives the optical signal and converts the optical signal into a target electrical signal; The isolation driving circuit is connected to the output power circuit, and the isolation driving circuit is used to drive the output power circuit; The overcurrent protection circuit is connected between the isolation drive circuit and the output power circuit, wherein the overcurrent protection circuit is configured to control the output power circuit to be disconnected when the output current of the output power circuit is greater than or equal to a preset current threshold, and to control the output power circuit to be turned on when the output current is less than the preset current threshold.

[0032] In the above embodiment, the input circuit sends an optical signal to the isolation drive circuit when powered on, thereby achieving optical isolation and improving anti-interference capability. The isolation drive circuit receives the optical signal and converts it into a target electrical signal, further driving the output power circuit to ensure the accuracy and stability of signal transmission. The overcurrent protection circuit is connected between the isolation drive circuit and the output power circuit. When the output current of the output power circuit exceeds the preset current threshold, the output power circuit is automatically disconnected to prevent damage to internal components caused by overload, thereby extending the service life of the equipment and improving system safety; when the output current returns to normal levels, the overcurrent protection circuit automatically restores the conduction state of the output power circuit to ensure the continuity and reliability of the equipment. The optical isolation solid-state relay achieves the purpose of overcurrent protection while maintaining miniaturization and high reliability.

[0033] Existing solid-state relays usually only have basic switching functions, which are difficult to meet the needs of new generation equipment or products for multifunctionality. The optically isolated solid-state relay adds additional functions by integrating an overcurrent protection circuit, thereby improving the application value of the product. In application scenarios where the solid-state relay works stably for a long time, the internal components of the solid-state relay are easily damaged due to overload, affecting the normal operation of the system. The optically isolated solid-state relay in this embodiment effectively solves this problem by designing a special overcurrent protection circuit. The optically isolated solid-state relay in this embodiment is designed with an overcurrent protection circuit. When the output current of the output power circuit exceeds the preset current threshold, the relay can automatically disconnect, effectively preventing component damage and system failure caused by overload, thereby improving the safety of the product; while maintaining the basic switching function, an overcurrent protection function is added, so that the solid-state relay can be applied to more application scenarios that require complex control and protection mechanisms; the optically isolated solid-state relay in this embodiment adopts the application of ceramic packaging technology and optical isolation technology. The relay can achieve the above functions while maintaining miniaturization, that is, without sacrificing the miniaturization and high reliability of the solid-state relay, the integration of the overcurrent protection function is realized, which meets the trend of modern electronic products for multifunctionality and high performance.

[0034] In an optional embodiment, if Figure 2 As shown, the isolation driving circuit includes a first photocell chip V3 and a second photocell chip V4, the first photocell chip V3 is used to convert the optical signal into a first electrical signal, and the second photocell chip V4 is used to convert the optical signal into a second electrical signal, wherein the target electrical signal includes the first electrical signal and the second electrical signal; the output power circuit includes a first MOS tube V8 and a first resistor R1, the first output end of the first photocell chip V3 is electrically connected to the gate of the first MOS tube V8 through the first resistor R1, the second output end of the first photocell chip V3 is electrically connected to the source of the first MOS tube V8, and the drain of the first MOS tube V8 serves as an optical isolation solid The positive output terminal of the relay; the overcurrent protection circuit includes a first transistor V5 and a second resistor R2, the first output terminal of the second photocell chip V4 is electrically connected to the base of the first transistor V5, the second output terminal of the second photocell chip V4 is electrically connected to the emitter of the first transistor V5, the collector of the first transistor V5 is electrically connected to the first output terminal of the first photocell chip V3, the base of the first transistor V5 is electrically connected to the source of the first MOS tube V8, the source of the first MOS tube V8 is electrically connected to the emitter of the first transistor V5 through the second resistor R2, and the emitter of the first transistor V5 serves as the negative output terminal of the optical isolation solid state relay.

[0035] In the above embodiment, the first photocell chip V3 and the second photocell chip V4 convert the optical signal into a first electrical signal and a second electrical signal respectively. The first electrical signal is used to drive the output power circuit, and the second electrical signal is used to provide current to the base of the first transistor V5. The design of the first MOS tube V8 and the first resistor R1 in the output power circuit, and the configuration of the first transistor V5 and the second resistor R2 in the overcurrent protection circuit can disconnect the output power circuit in time when the output current exceeds the preset current threshold, thereby preventing damage to internal components due to overcurrent, thereby improving the safety and life of the relay.

[0036] like Figure 2 As shown, in this embodiment, by setting an overcurrent protection circuit composed of a first transistor V5 and a second resistor R2, when it is detected that the output current exceeds the preset current threshold, the first transistor V5 is turned on, so that the gate voltage of the first MOS tube V8 is reduced, thereby cutting off the output and preventing damage to the components under overload conditions. For example, when the output current is large, when the voltage drop of the second resistor R2 reaches the turn-on voltage of the first transistor V5, the first transistor V5 is turned on, which will pull down the drive signal of the first photocell chip V3, the gate voltage of the first MOS tube V8 is reduced, and the first MOS tube V8 will be turned off, thereby disconnecting the output power circuit; when the output current decreases, the voltage drop of the second resistor R2 will decrease. When the voltage drop of the second resistor R2 does not reach the turn-on voltage of the first transistor V5, the first transistor V5 is turned off, and the first photocell chip V3 outputs a drive signal (such as the above-mentioned first electrical signal). At this time, the first MOS tube V8 is turned on, and the output power circuit can be automatically restored to the on state. The problem that manual restart may be required in the related art is avoided. In addition, by using the first MOS tube V8 as an output control element and adjusting the gate voltage through the first resistor R1, accurate control of the output power can be achieved, which can ensure that the output port can provide stable current or voltage output under various load conditions, thereby improving the accuracy and controllability of the output. By integrating the first MOS tube V8 and the first resistor R1, as well as the first triode V5 and the second resistor R2, the circuit design can be simplified, the need for external components can be reduced, and the miniaturization of the relay can be achieved; due to the fast response characteristics of the photocell chip and the MOS tube, the design can improve the response speed of the circuit, so that the relay can quickly respond to overcurrent conditions and protect the circuit in time. By adjusting the values ​​of the first resistor R1 and the second resistor R2, the working state of the first MOS tube V8 and the first triode V5 can be adjusted to adapt to different working conditions and protection requirements.

[0037] In an optional embodiment, if Figure 3As shown, the overcurrent protection circuit also includes a first Schottky diode V6 and a second Schottky diode V7, and the base of the first triode V5 is electrically connected to the source of the first MOS tube V8 through the first Schottky diode V6 and the second Schottky diode V7, wherein the base of the first triode V5 is electrically connected to the anode of the first Schottky diode V6, the cathode of the first Schottky diode V6 is electrically connected to the anode of the second Schottky diode V7, and the cathode of the second Schottky diode V7 is electrically connected to the source of the first MOS tube V8.

[0038] In the above embodiment, if Figure 3 As shown, the first Schottky diode V6 and the second Schottky diode V7 in the overcurrent protection circuit can effectively reduce the voltage drop of the second resistor R2 when performing overcurrent protection, which is beneficial to reducing power consumption. At the same time, when the output current exceeds the preset current threshold, the output power circuit can be quickly cut off to prevent damage to components in the case of overcurrent, thereby improving the safety and reliability of the system. By reasonably adding the first Schottky diode V6 and the second Schottky diode V7, the structure of the overcurrent protection circuit is optimized to make it more compact and efficient, which helps to reduce the cost and complexity of the circuit, while improving the overall performance and reliability of the relay.

[0039] This embodiment utilizes the unidirectional conductive characteristics of the Schottky diode to effectively prevent the impact of reverse current on the circuit, especially in the fast switching process, avoiding possible reverse voltage damage to the transistor and other components. Through the series connection of the Schottky diode, the false triggering of the overcurrent protection circuit by noise and interference can be reduced, ensuring the accuracy and reliability of the overcurrent protection; the fast switching characteristics of the Schottky diode enable the overcurrent protection circuit to respond quickly to the overcurrent event, cut off the output in time, protect the internal components from overload damage, and improve the overall safety of the system; the unidirectional conductive characteristics of the Schottky diode can effectively prevent the impact of the reverse current on the circuit, especially when the output port is suddenly disconnected or short-circuited, the Schottky diode can quickly block the reverse current and protect the transistor and other components from damage. The low forward voltage drop characteristics of the Schottky diode can reduce the energy loss in the circuit, such as reducing the power consumption of the second resistor R2, improving the efficiency of the overall circuit, while maintaining the compactness and miniaturization design of the circuit. The low forward voltage drop characteristics of the Schottky diode can reduce energy loss and improve the efficiency of the overcurrent protection circuit, especially in high current applications.

[0040] It should be noted that the first Schottky diode V6 and the second Schottky diode V7 connected in series between the base of the first transistor V5 and the source of the first MOS tube V8 are only used as an example. In practical applications, only one Schottky diode may be provided as needed, or the first Schottky diode V6 and the second Schottky diode V7 may be replaced by other resistors or other components, which is not limited in the embodiments of the present application.

[0041] In an optional embodiment, if Figure 2 and Figure 3 As shown, the input circuit includes a first light-emitting diode chip V1 and a second light-emitting diode chip V2, and the cathode of the first light-emitting diode chip V1 is electrically connected to the anode of the second light-emitting diode chip V2, wherein the anode of the first light-emitting diode chip V1 serves as the positive input terminal of the optically isolated solid-state relay, and the cathode of the second light-emitting diode chip V2 serves as the negative input terminal of the optically isolated solid-state relay.

[0042] In the above embodiment, the series connection of two light-emitting diode chips can increase the intensity of the optical signal, ensuring that the isolation driving circuit can receive sufficient optical signals, thereby improving the reliability of signal transmission; through a simple series connection method, the design of the input circuit can be simplified, the number of external components can be reduced, and the manufacturing cost and complexity can be reduced.

[0043] The first light-emitting diode chip V1 and the second light-emitting diode chip V2 are used as light sources, and their luminous efficiency and stability are crucial to the optical isolation effect. By adopting high-quality light-emitting diode chips and reasonably designing their connection methods, the optical isolation effect can be improved, thereby further improving the performance and reliability of the relay. In addition, different application scenarios may require different input voltage ranges. By adopting series-connected light-emitting diode chips, the input circuit can adjust the input voltage range to a certain extent, making it more adaptable to different application scenarios. By configuring two light-emitting diode chips, this embodiment can improve the intensity and stability of the optical signal, thereby improving the transmission efficiency of the optical signal from the input circuit to the isolation drive circuit. It should be noted that the design of using the first light-emitting diode chip V1 and the second light-emitting diode chip V2 in series in the above-mentioned input circuit is only an example, and only one light-emitting diode chip may be used, or three or more light-emitting diode chips may be used. In actual applications, it can be selected as needed.

[0044] In an optional embodiment, the above-mentioned optically isolated solid-state relay also includes: a circuit substrate, a tube socket and a cover plate, wherein the input circuit is located on the circuit substrate, and the isolation drive circuit, the overcurrent protection circuit and the output power circuit are all located on the tube socket; the optically isolated solid-state relay adopts a double-layer structure, the upper layer is the circuit substrate, and the lower layer is the tube socket, the light-emitting diode chip group on the circuit substrate and the photocell chip group on the tube socket are vertically aligned and physically isolated, wherein the light-emitting diode chip group includes a first light-emitting diode chip V1 and a second light-emitting diode chip V2, and the photocell chip group includes a first photocell chip V3 and a second photocell chip V4; the optically isolated solid-state relay adopts a parallel sealing welding process to hermetically seal the cover plate and the tube socket.

[0045] In the above embodiment, the circuit layout is optimized: by placing the input circuit on the circuit substrate, and placing the isolation drive circuit, overcurrent protection circuit and output power circuit on the tube holder, a double-layer structure is formed, which effectively reduces the overall size and makes the relay more compact. Physical isolation is enhanced: the vertical alignment and physical isolation design between the light-emitting diode chipset on the circuit substrate and the photovoltaic chipset on the tube holder ensures the high efficiency and stability of optical signal transmission and reduces the impact of electromagnetic interference. Packaging process improvement: the cover plate and the tube holder are hermetically sealed by a parallel sealing process, which further improves the moisture and dust resistance of the relay, extends its service life, and enhances its overall reliability.

[0046] This embodiment improves the accuracy and stability of signal transmission through the double-layer structure design of the circuit substrate and the tube seat, the vertical alignment and physical isolation between the light-emitting diode chipset and the photovoltaic cell chipset; the parallel sealing process is used to hermetically seal the cover plate and the tube seat, which provides high airtightness and structural stability, and can prevent the external environment (such as humidity, dust, etc.) from affecting the internal circuit, which is crucial to improving the reliability and durability of the relay; the double-layer structure design helps to reduce electromagnetic interference and improve the anti-interference ability of the circuit, especially in applications under complex electromagnetic environments; the double-layer structure design helps to achieve miniaturization and integration of relays, which is particularly important for application scenarios with limited space. The double-layer structure design allows the circuit substrate and the tube seat to be produced and tested separately, and then assembled, which simplifies the production and assembly process and improves production efficiency.

[0047] The present application also provides a method for manufacturing an optically isolated solid-state relay, which is used to manufacture the aforementioned optically isolated solid-state relay, comprising the following steps: Step S1, respectively installing a group of components on the corresponding areas of the original circuit substrate and the original tube holder, wherein the group of components includes a first light-emitting diode chip V1, a second light-emitting diode chip V2, a first photocell chip V3, a second photocell chip V4, a first MOS tube V8, a first triode V5, a first resistor R1, a second resistor R2, a first Schottky diode V6 and a second Schottky diode V7; Step S2, electrically connecting each component in a group of components to corresponding areas on the original circuit substrate and the original tube holder to obtain a circuit substrate and a tube holder; Step S3, assembling the circuit substrate and the tube holder, and sealing the entire assembly to obtain an optically isolated solid-state relay, wherein the light-emitting diode chip group on the circuit substrate is aligned with the photovoltaic cell chip group on the tube holder.

[0048] In the above embodiment, by aligning the light-emitting diode chipset on the circuit substrate with the photocell chipset on the tube socket, the effective transmission and conversion of the optical signal is ensured, and the stability and reliability of the signal are improved; a double-layer structure design is adopted, with the upper layer being the circuit substrate and the lower layer being the tube socket, so that the vertical alignment and physical isolation between the light-emitting diode chipset and the photocell chipset are achieved, the anti-interference ability is enhanced, and the safety of the equipment is improved; the cover plate and the tube socket are hermetically sealed by a parallel sealing process, which effectively prevents the influence of the external environment on the internal circuit and extends the service life of the relay; by installing a group of components in the corresponding areas of the original circuit substrate and the original tube socket respectively, and using the reflow soldering process and the gold wire ball bonding process for electrical connection, it is ensured that the electrical connection between the components is stable and reliable, and the production efficiency and product quality are improved.

[0049] This embodiment ensures the accuracy of assembly by clearly installing a group of components in the corresponding areas of the original circuit substrate and the original tube holder. At the same time, this step-by-step assembly method also improves the efficiency of assembly and reduces rework and cost waste caused by assembly errors. During the assembly process, by aligning the light-emitting diode chipset on the circuit substrate and the photocell chipset on the tube holder, the effective transmission of the optical signal is ensured, and the optical isolation effect and the reliability of signal transmission are improved. By electrically connecting each component to the corresponding area on the circuit substrate and the tube holder, the method ensures the stability and reliability of the connection. After the assembly is completed, the entire assembly is sealed to ensure the sealing integrity of the optical isolation solid relay. This sealing method can effectively prevent interference and damage from the external environment and extend the service life of the relay. The entire assembly is sealed to effectively prevent the influence of the external environment on the internal circuit and ensure the stability and reliability of the relay during long-term operation. Through the manufacturing method of this embodiment, the controllability and repeatability of the manufacturing process are improved through clear steps and processes, which helps to ensure that each batch of optical isolation solid relays produced has consistent performance and quality, and reduces the variability and uncertainty in the production process. In this embodiment, the components are mounted on the circuit substrate and the tube holder respectively, and then assembled and sealed, which simplifies the manufacturing process, improves production efficiency, and reduces manufacturing costs. Through precise manufacturing and high-quality packaging, the overall performance and quality of the product are ensured, and the market competitiveness of the product is enhanced.

[0050] It should be noted that the above-mentioned original circuit substrate and circuit substrate refer to substrates without components installed and substrates with corresponding components installed respectively; similarly, the above-mentioned original tube socket and tube socket refer to tube shells (or shells) without components installed and substrates with corresponding components installed respectively.

[0051] In an optional embodiment, a group of components are respectively installed in corresponding areas of the original circuit substrate and the original tube socket, including: installing the first light-emitting diode chip V1 and the second light-emitting diode chip V2 in corresponding areas on the original circuit substrate, and installing other components in corresponding areas of the original tube socket, wherein the other components are components in the group of components other than the first light-emitting diode chip V1 and the second light-emitting diode chip V2, and each pin of each component in the group of components corresponds to a metallized area on the original circuit substrate or the original tube socket.

[0052] In the above embodiment, the precise installation and positioning of each component in the manufacturing process of the optical isolation solid state relay is realized. Specifically, the first light emitting diode chip V1 and the second light emitting diode chip V2 are installed in the corresponding area on the original circuit substrate to ensure the correct layout of the input circuit; at the same time, other components (such as the first photocell chip V3, the second photocell chip V4, the first MOS tube V8, the first triode V5, the first resistor R1, the second resistor R2, the first Schottky diode V6 and the second Schottky diode V6) are installed in the corresponding area of ​​the original tube holder to ensure the reasonable distribution of the isolation drive circuit, the overcurrent protection circuit and the output power circuit. This layout method not only improves the assembly efficiency, but also ensures the electrical connection reliability and mechanical stability between the circuits, thereby improving the overall performance and reliability of the optical isolation solid state relay.

[0053] In the manufacturing process of the optical isolation solid-state relay of this embodiment, it is crucial to ensure that the pins of each component can be accurately aligned to the corresponding metallized area on the circuit substrate or the tube holder. Inaccurate alignment may cause poor contact between the pins and the metallized area, thereby affecting the connection and performance of the circuit. By clearly installing the first light-emitting diode chip V1 and the second light-emitting diode chip V2 in the corresponding area on the circuit substrate, and installing other components in the corresponding area of ​​the tube holder, while ensuring that the pins of each component have a corresponding metallized area on the circuit substrate or the tube holder, the accuracy of the pin alignment is greatly improved. This precise alignment helps to ensure good circuit connection and performance. The pins of each component form a good electrical connection with the corresponding metallized area, reducing problems such as poor contact and cold soldering, and improving the reliability and performance of the product. By installing different components on the circuit substrate and the tube holder respectively, the installation process is simplified, the production efficiency is improved, and the manufacturing cost is reduced. Through precise installation and reliable electrical connection, the defective product rate in the manufacturing process is reduced, the production yield rate is improved, and the quality and consistency of the product are ensured. Through precise installation and high-quality electrical connections, the normal operation of each component is ensured, improving the overall performance and reliability of the optical isolation solid state relay.

[0054] In an optional embodiment, a group of components are respectively installed on the corresponding areas of the original circuit substrate and the original tube socket, including: using solder paste to bond the first type of devices to the corresponding metallized areas on the original tube socket, wherein the first type of devices include the first MOS tube V8 and the second resistor R2; using conductive glue to bond the second type of devices to the corresponding metallized areas on the original circuit substrate, wherein the second type of devices include the first light-emitting diode chip V1 and the second light-emitting diode chip V2; and using conductive glue to bond the third type of devices to the corresponding metallized areas on the original tube socket, wherein the third type of devices include the first photocell chip V3, the second photocell chip V4, the first triode V5, the first resistor R1, the first Schottky diode V6 and the second Schottky diode V7.

[0055] In the above embodiment, the first type of devices (first MOS tube V8 and second resistor R2) are respectively bonded to the corresponding metallized areas on the original tube holder by solder paste, which ensures the fixation and good electrical contact of these devices, and improves the assembly efficiency and reliability. The second type of devices (first light-emitting diode chip V1 and second light-emitting diode chip V2) are bonded to the corresponding metallized areas on the original circuit substrate by conductive glue, which ensures the stability and electrical performance of these devices, and avoids the thermal damage that may be caused by high-temperature welding. The third type of devices (first photocell chip V3, second photocell chip V4, first triode V5, first resistor R1, first Schottky diode V6 and second Schottky diode V7) are respectively bonded to the corresponding metallized areas on the original tube holder by conductive glue, which further enhances the stability of these key devices and ensures the functional reliability and long-term stability of the entire circuit. The purpose of accurately installing different types of components in the corresponding areas on the original circuit substrate and the original tube holder is achieved.

[0056] Different types of components may require different installation methods to ensure the best electrical and mechanical connection. By using solder paste and conductive glue, the most suitable bonding material can be selected according to the characteristics of the components to improve the efficiency of the installation process; both solder paste and conductive glue have good electrical conductivity, which can ensure good electrical connection between components and metallized areas, reduce problems such as poor contact and cold soldering, and improve the electrical performance of the product; solder paste has good conductivity and adhesion, and is suitable for the connection of devices such as the first MOS tube V8 and the second resistor R2; while conductive glue has better flexibility and heat resistance, and is suitable for the connection of devices such as light-emitting diode chips and photovoltaic cells. This optimization selection helps to improve the adaptability and durability of the connection. Through precise bonding and reliable electrical connection, the defective product rate in the manufacturing process is reduced, the production yield rate is improved, and the quality and consistency of the product are ensured. Optionally, the first resistor R1 in this embodiment can be a resistor chip, the second resistor R2 can be a chip resistor, the first triode V5 and the first MOS tube V8 are both chips, and the first Schottky diode V6 and the second Schottky diode V7 are also chips.

[0057] In an optional embodiment, each component in a group of components is electrically connected to the corresponding area on the circuit substrate and the tube seat, including: using a reflow soldering process to weld the pins of the first MOS tube V8 and the second resistor R2 to the corresponding metallized area; using a gold wire ball bonding process to electrically connect the metallized areas corresponding to the associated pins, wherein the associated pins are used to represent multiple pins that are electrically connected to the second type of device and the third type of device.

[0058] In the above embodiment, the pins of the first MOS tube V8 and the second resistor R2 are welded to the corresponding metallized areas, ensuring a firm connection between the pins of these key components and the original tube socket, enhancing the mechanical strength and electrical performance of the device, and reducing the failure rate caused by poor contact. The metallized areas corresponding to the associated pins are electrically connected to achieve precise electrical connection between the second type of devices (such as the first light-emitting diode chip V1 and the second light-emitting diode chip V2) and the third type of devices (such as the first photovoltaic cell chip V3, the second photovoltaic cell chip V4, the first transistor V5, the first resistor R1, the first Schottky diode V6 and the second Schottky diode V7), improving the reliability and efficiency of signal transmission, and further improving the overall performance of the optical isolation solid state relay. This method ensures reliable electrical connection between the components and improves the manufacturing accuracy and stability of the optical isolation solid state relay.

[0059] By adopting the reflow soldering process to weld the pins of components such as MOS tubes and resistors to the corresponding metallized areas, and by adopting the gold wire ball bonding process to electrically connect the metallized areas corresponding to multiple pins in an electrically connected relationship, a high-precision and high-reliability electrical connection between components and circuit substrates / tube sockets is achieved. This connection method not only ensures good electrical contact, but also improves the mechanical strength of the connection, and enhances the working stability and reliability of the relay. In the optical isolation solid relay of this embodiment, the first MOS tube V8 and the second resistor R2 are welded by the reflow soldering process, and other components are electrically connected by the gold wire ball bonding process. The reflow soldering process is suitable for components such as MOS tubes and resistors with relatively simple pin structures and large sizes; while the gold wire ball bonding process is suitable for components with small pin spacing and high precision requirements, such as light-emitting diode chips, photovoltaic cell chips, etc. This optimization selection helps to improve the adaptability and durability of the connection. By adopting a suitable connection process, the connection steps are simplified and the manufacturing efficiency is improved. At the same time, since the selection of the connection process is more reasonable, the rework and cost waste caused by poor connection are also reduced.

[0060] In an optional embodiment, the circuit substrate and the tube holder are assembled, and the entire assembly is sealed to obtain an optically isolated solid-state relay, including: using conductive glue to fix the circuit substrate and a preset area on the tube holder, wherein the preset area is a protruding area on the tube holder, so that the circuit substrate and the photovoltaic cell chipset on the tube holder are vertically aligned and physically isolated; and using a parallel sealing process to hermetically seal the cover plate and the tube holder to obtain an optically isolated solid-state relay.

[0061] In the above embodiment, the precise alignment and physical isolation between the circuit substrate and the tube holder can be ensured, thereby effectively avoiding the risk of signal crosstalk and short circuit, and improving the reliability and stability of the optical isolation solid state relay. At the same time, the use of conductive glue for fixed connection can enhance the overall mechanical strength of the component and prevent loosening due to vibration or impact. The parallel sealing process is used for hermetic packaging, which further improves the sealing and moisture resistance of the product and extends its service life.

[0062] By using conductive glue to fix the circuit substrate and the preset area (protruding area) on the tube holder, the accurate assembly between the circuit substrate and the tube holder is ensured. This fixing method not only improves the accuracy of assembly, but also enhances the stability of connection, so that the photovoltaic cell chipset and the light-emitting diode chip can be vertically aligned and physically isolated, thereby ensuring the accuracy of the optical path. The use of conductive glue for fixed connection not only ensures the firm fixation between the circuit substrate and the tube holder, but also provides good conductive performance, reduces contact resistance, and improves the reliability of electrical connection. The cover plate and the tube holder are hermetically sealed by a parallel sealing process, which effectively prevents external factors such as dust and moisture from damaging the internal components of the relay. This packaging method not only improves the sealing of the relay, but also enhances its protection, so that the relay can work stably in various harsh environments. This embodiment simplifies the assembly process, improves production efficiency, reduces manufacturing costs, and improves production yield by using conductive glue and parallel sealing processes.

[0063] It should be noted that the above-described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application will be described in detail below in conjunction with specific embodiments.

[0064] The present application embodiment provides an optical isolation solid-state relay with overcurrent protection, the product circuit block diagram is as follows Figure 1 As shown, it consists of an input circuit, an isolation drive circuit, an overcurrent protection circuit and an output power circuit. The specific circuit is as follows Figure 3 As shown, the input circuit is composed of a first light-emitting diode chip V1 and a second light-emitting diode chip V2; the isolation drive circuit is composed of a first photocell chip V3 and a second photocell chip V4, and physical isolation is achieved by vertical irradiation; the first triode V5, the first Schottky diode V6, the second Schottky diode V7 and the second resistor R2 constitute an overcurrent protection circuit; the first MOS tube V8 (or called a field effect tube chip) and the first resistor R1 constitute an output power circuit, and a ceramic airtight package is realized by a parallel sealing process, and all internal components can be domestically produced.

[0065] (1) Input isolation circuit Input isolation circuit such as Figure 4 As shown, the input end adopts the method of connecting the first light-emitting diode chip V1 and the second light-emitting diode chip V2 in series to provide suitable photocurrent for isolating the first photocell chip V3 and the second photocell chip V4, and the light-emitting diode chip and the photocell chip are vertically aligned to achieve physical isolation of the product input and output ends.

[0066] (2) Output power circuit like Figure 5As shown, the output power circuit is composed of a first resistor R1 and a first MOS tube V8. After receiving light, the photocell chip outputs a driving signal to drive the first MOS tube V8 to conduct.

[0067] (3) Overcurrent protection circuit like Figure 6 As shown, the overcurrent protection circuit is mainly composed of a first transistor V5, a first Schottky diode V6, a second Schottky diode V7 and a second resistor R2. When the voltage drop of the second resistor R2, the first Schottky diode V6 and the second Schottky diode V7 reaches the turn-on voltage of the first transistor V5, the first transistor V5 is turned on, the driving signal of the photocell is pulled down, and the first MOS tube V8 is turned off. After the first MOS tube V8 is turned off, the voltage drop of the second resistor R2, the first Schottky diode V6 and the second Schottky diode V7 is lower than the turn-on voltage of the first transistor V5, the first transistor V5 is turned off, the photocell chip outputs the driving signal, and the first MOS tube V8 is turned on. The above process is repeated continuously, and the output loop current can be limited to a certain fixed value to achieve the overcurrent protection function.

[0068] 2. Shell design The shell is made of black alumina ceramic, and multiple metallized areas are set inside for chip bonding and adhesion. In order to reduce the complexity of the structure, there is a certain interconnection between the internal metallized areas, which are connected by the electroplating lines inside the shell.

[0069] 3. Structure: It adopts a double-layer structure design, with the upper layer being the input circuit substrate and the lower layer being the isolation driver, overcurrent protection circuit, and output power circuit. The physical isolation of the internal circuit is achieved by utilizing the height difference between the light-receiving surface of the light-emitting diode chip and the photovoltaic chip. Figure 7-Figure 9 As shown. Among them, Figure 7 The circuit core seat is a schematic diagram of a circuit core seat, which means that a chip (or component) has been installed on the tube seat, and the circuit core seat corresponds to the aforementioned tube seat; Figure 8 It is the product assembly structure diagram, that is, the circuit substrate and the circuit core seat are assembled as required; Fig. 9 This is a schematic diagram of the product appearance. Figure 8 After assembly, a cover is added to the outside to seal the entire assembly to form a complete solid-state relay.

[0070] 4. Product production process: There are multiple metallized areas inside the tube holder (or tube shell). The components involved in the circuit principle are fixed in the corresponding metallized areas by bonding and reflow soldering. The photovoltaic cell chip, Schottky diode chip, triode chip, and resistor chip are bonded to the corresponding metallized areas by conductive adhesive bonding. The MOSFET chip and chip resistor are welded to the corresponding metallized areas by reflow soldering. Fig.10 .

[0071] The first light emitting diode chip V1 and the second light emitting diode chip V2 are bonded to the designated metallized area of ​​the circuit substrate. Fig.11 .

[0072] The gold wire ball bonding process is used to connect each component to the corresponding pad. The black line in the figure represents the gold wire used for bonding. Fig.12 .

[0073] Assemble the circuit substrate and the tube holder so that the light-emitting part of the light-emitting diode chip is aligned with the light-receiving area of ​​the photovoltaic chip. Fig.13 It should be noted that after assembly, Fig.13 The first photovoltaic cell chip V3 and the second photovoltaic cell chip V4 in the tube holder of the middle and lower layer have been blocked by the circuit substrate of the upper layer.

[0074] Finally, the product is packaged into a finished product through a parallel sealing and welding process.

[0075] At the same time, this product can adopt the standard 8-lead package, and the output can be realized with over-current protection or without over-current protection, two usage modes, see Fig.14 , you can choose the wiring configuration according to different needs when using it.

[0076] With the development of miniaturization, lightweight and intelligentization of weapons and equipment, solid-state relays, as core switching devices, have become the main research focus in terms of miniaturization and intelligence. Ceramic packaging and optical isolation can minimize the volume of products. Therefore, in order to meet the needs of a new generation of weapons and equipment, it is urgent to increase functionality. The optically isolated solid-state relay provided in the embodiment of the present application has an overcurrent protection function, adopts a ceramic housing, and has a size of 9.7mm×7.4mm×3.1mm. At present, there is no optically isolated solid-state relay of this size and with overcurrent protection at home and abroad.

[0077] It should be noted that: when the device provided in the above embodiment realizes its function, only the division of the above functional modules is used as an example. In actual application, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. In addition, the device and method embodiments provided in the above embodiment belong to the same concept, and the specific implementation process is detailed in the method embodiment, which will not be repeated here.

[0078] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0079] The above is only an exemplary embodiment of the present disclosure and cannot be used to limit the scope of the present disclosure. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the disclosure of the specification, those skilled in the art will easily think of other embodiments of the present disclosure.

[0080] This application is intended to cover any modifications, uses or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary technical means in the technical field not recorded in the present disclosure.

Claims

1. An optically isolated solid-state relay, characterized in that: include: Input circuit, isolation drive circuit, overcurrent protection circuit and output power circuit, among which, The input circuit sends an optical signal to the isolation driving circuit when powered on, and the isolation driving circuit receives the optical signal and converts the optical signal into a target electrical signal; The isolation driving circuit is connected to the output power circuit, and the isolation driving circuit is used to drive the output power circuit; The overcurrent protection circuit is connected between the isolation drive circuit and the output power circuit, wherein the overcurrent protection circuit is configured to control the output power circuit to be disconnected when the output current of the output power circuit is greater than or equal to a preset current threshold, and to control the output power circuit to be turned on when the output current is less than the preset current threshold.

2. The optical isolation solid state relay according to claim 1, characterized in that: The isolation driving circuit includes a first photocell chip and a second photocell chip, wherein the first photocell chip is used to convert the optical signal into a first electrical signal, and the second photocell chip is used to convert the optical signal into a second electrical signal, wherein the target electrical signal includes the first electrical signal and the second electrical signal; The output power circuit includes a first MOS tube and a first resistor, the first output end of the first photocell chip is electrically connected to the gate of the first MOS tube through the first resistor, the second output end of the first photocell chip is electrically connected to the source of the first MOS tube, and the drain of the first MOS tube serves as the positive output end of the optical isolation solid relay; The overcurrent protection circuit includes a first transistor and a second resistor, the first output end of the second photocell chip is electrically connected to the base of the first transistor, the second output end of the second photocell chip is electrically connected to the emitter of the first transistor, the collector of the first transistor is electrically connected to the first output end of the first photocell chip, the base of the first transistor is electrically connected to the source of the first MOS tube, the source of the first MOS tube is electrically connected to the emitter of the first transistor through the second resistor, and the emitter of the first transistor serves as the negative output end of the optical isolation solid state relay.

3. The optical isolation solid state relay according to claim 2, characterized in that: The overcurrent protection circuit also includes a first Schottky diode and a second Schottky diode, and the base of the first transistor is electrically connected to the source of the first MOS tube through the first Schottky diode and the second Schottky diode, wherein the base of the first transistor is electrically connected to the anode of the first Schottky diode, the cathode of the first Schottky diode is electrically connected to the anode of the second Schottky diode, and the cathode of the second Schottky diode is electrically connected to the source of the first MOS tube.

4. The optical isolation solid state relay according to claim 2 or 3, characterized in that: The input circuit includes a first light-emitting diode chip and a second light-emitting diode chip, wherein the cathode of the first light-emitting diode chip is electrically connected to the anode of the second light-emitting diode chip, wherein the anode of the first light-emitting diode chip serves as the positive input terminal of the optically isolated solid-state relay, and the cathode of the second light-emitting diode chip serves as the negative input terminal of the optically isolated solid-state relay.

5. The optical isolation solid state relay according to claim 4, characterized in that: The optical isolation solid state relay further comprises: a circuit substrate, a tube base and a cover plate, wherein: The input circuit is located on the circuit substrate, and the isolation drive circuit, the overcurrent protection circuit and the output power circuit are all located on the tube seat; The optical isolation solid state relay adopts a double-layer structure, the upper layer is the circuit substrate, and the lower layer is the tube holder. The light-emitting diode chip group on the circuit substrate and the photocell chip group on the tube holder are vertically aligned and physically isolated, wherein the light-emitting diode chip group includes the first light-emitting diode chip and the second light-emitting diode chip, and the photocell chip group includes the first photocell chip and the second photocell chip; The optical isolation solid state relay adopts a parallel sealing welding process to hermetically seal the cover plate and the tube seat.

6. A method for manufacturing an optically isolated solid-state relay, characterized in that: For manufacturing the optical isolation solid state relay according to claim 5, comprising: Installing a group of components on the corresponding areas of the original circuit substrate and the original tube holder respectively, wherein the group of components includes the first light-emitting diode chip, the second light-emitting diode chip, the first photocell chip, the second photocell chip, the first MOS tube, the first triode, the first resistor, the second resistor, the first Schottky diode and the second Schottky diode; Electrically connecting each component in the group of components to the corresponding areas on the original circuit substrate and the original tube holder to obtain the circuit substrate and the tube holder; The circuit substrate is assembled with the tube holder, and the whole assembly is sealed to obtain the optical isolation solid state relay, wherein the light emitting diode chip group on the circuit substrate is aligned with the photocell chip group on the tube holder.

7. The method for manufacturing an optically isolated solid-state relay according to claim 6, characterized in that: A group of components are mounted on the corresponding areas of the original circuit substrate and the original tube holder, including: The first light-emitting diode chip and the second light-emitting diode chip are mounted on corresponding areas on the original circuit substrate, and other components are mounted on corresponding areas of the original tube socket, wherein the other components are components other than the first light-emitting diode chip and the second light-emitting diode chip in the group of components, and each pin of each component in the group of components corresponds to a metallized area on the original circuit substrate or the original tube socket.

8. The method for manufacturing an optically isolated solid-state relay according to claim 6, characterized in that: A group of components are mounted on the corresponding areas of the original circuit substrate and the original tube holder, including: Using solder paste to bond first-type devices to corresponding metallized areas on the original tube holder, wherein the first-type devices include the first MOS tube and the second resistor; The second type of devices are bonded to the corresponding metallized areas on the original circuit substrate using conductive glue, wherein the second type of devices include the first light-emitting diode chip and the second light-emitting diode chip; and the third type of devices are bonded to the corresponding metallized areas on the original tube holder using conductive glue, wherein the third type of devices include the first photocell chip, the second photocell chip, the first transistor, the first resistor, the first Schottky diode and the second Schottky diode.

9. The method for manufacturing an optically isolated solid-state relay according to claim 8, characterized in that: Electrically connecting each component in the group of components to the circuit substrate and the corresponding area on the tube holder, comprising: Using a reflow process to weld the pins of the first MOS tube and the second resistor to corresponding metallized areas; The metallized areas corresponding to the associated pins are electrically connected by using a gold ball bonding process, wherein the associated pins are used to represent a plurality of pins in an electrically connected relationship between the second type of device and the third type of device.

10. The method for manufacturing an optically isolated solid-state relay according to claim 6, characterized in that: Assembling the circuit substrate and the tube holder, and sealing the entire assembly to obtain the optical isolation solid state relay, comprising: The circuit substrate is fixedly connected to a preset area on the tube holder by using conductive glue, wherein the preset area is a protruding area on the tube holder, so that the circuit substrate and the photovoltaic cell chipset on the tube holder are vertically aligned and physically isolated; The cover plate and the tube seat are hermetically packaged by adopting a parallel sealing welding process to obtain the optical isolation solid state relay.

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