Automatic silicon wafer grinding system and grinding method

Abstract

The invention discloses an automatic silicon wafer grinding system and method, and the system comprises a loop line cutting machine which is suitable for cutting a silicon single crystal rod to obtain a to-be-ground sample wafer; the automatic silicon wafer grinding equipment comprises a bottom frame; the workbench is arranged on the bottom frame, and a sample wafer groove used for containing a sample wafer to be ground is formed in the workbench; the first linear moving assembly is in transmission connection with the workbench so as to drive the workbench to move in the first direction; the second linear moving assembly comprises two driving devices arranged on the two sides of the moving track of the workbench, grinding heads are arranged at the output ends of the two driving devices correspondingly, and the two driving devices are suitable for driving the grinding heads to be close to or away from the sample piece to be ground so that one face or two faces of the sample piece to be ground can be ground; the invention discloses a carbon and oxygen detector, which is suitable for detecting a sample ground and processed by automatic silicon wafer grinding equipment. Sample cutting can be automatically completed, then the sample is subjected to grinding treatment and carbon and oxygen detection, and unmanned sample detection is achieved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of semiconductor silicon wafer processing, and in particular to a system and a grinding method capable of realizing automatic loading, unloading and automatic grinding. Background Art

[0002] In the field of solar monocrystalline silicon rod production and testing, the oxygen and carbon content index is directly related to the efficiency and fragmentation rate of the downstream factory cells, so it has become an important standard for many cell manufacturers when purchasing silicon rods and silicon wafers. The higher the oxygen content in the silicon material, the lower the conversion efficiency of the cell, and the higher the carbon content, the greater the stress and the easier it is to fragment. In order to control the oxygen and carbon content parameters of the single crystal, samples need to be cut at the head and tail of the long crystal rod when the single crystal is cut, and the oxygen and carbon content is obtained by analysis through the oxygen and carbon tester, so as to grade and sort the single crystal. The samples used for oxygen and carbon detection need to be polished and prepared at the specified position. Since the oxygen and carbon tester has high requirements for the integrity, thickness and polishing brightness of the samples, it has been difficult to break through the sample grinding and polishing technology.

[0003] In the related technology, the sample polishing method is to prepare manually using handheld equipment, which has high labor costs and low grinding efficiency, affecting product turnover, restricting the release of production capacity, and failing to meet the needs of automated production lines. The introduction of large-scale grinding equipment also has problems such as large equipment procurement investment and high maintenance costs. Summary of the invention

[0004] In order to solve the above technical problems, the embodiments of the present disclosure provide a silicon wafer automatic grinding system and grinding method, which can automatically complete sample cutting, and then grind the sample and perform carbon oxygen detection, thereby realizing unmanned sample detection.

[0005] According to the inventive concept of one aspect of the present disclosure, there is provided a silicon wafer automatic grinding system, comprising:

[0006] Loop wire cutting machine, suitable for cutting single crystal silicon rods to obtain samples to be ground;

[0007] Automatic silicon wafer grinding equipment, including:

[0008] chassis;

[0009] A workbench, arranged on the base frame, wherein the workbench is provided with a sample slot for holding the sample to be ground;

[0010] A first linear motion component, drivingly connected to the workbench to drive the workbench to move in a first direction;

[0011] The second linear moving assembly includes two driving devices arranged on both sides of the moving track of the workbench, the output ends of the two driving devices are respectively provided with grinding heads, and the two driving devices are suitable for driving the grinding heads to approach / move away from the sample to be ground, so as to grind one side or both sides of the sample to be ground;

[0012] The carbon oxygen detector is suitable for detecting samples after being ground by the silicon wafer automatic grinding equipment.

[0013] According to some embodiments of the present disclosure, the automatic silicon wafer grinding system further includes:

[0014] A conveyor line is arranged between the loop wire cutting machine and the automatic silicon wafer grinding equipment, and the conveyor line is suitable for transmitting the sample to be ground to the automatic silicon wafer grinding equipment.

[0015] According to some embodiments of the present disclosure, the automatic silicon wafer grinding system further includes:

[0016] A robot arm is arranged adjacent to the automatic silicon wafer grinding device, and the robot arm is suitable for grabbing and transferring the sample to be ground or the sample after grinding.

[0017] According to some embodiments of the present disclosure, the conveyor line is an electric monorail transmission device suspended in the air.

[0018] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment also includes a clamping assembly, which includes sample clamping members arranged on both sides of the moving track of the workbench, and the two sample clamping members can move toward / backward synchronously to clamp or release the sample to be ground.

[0019] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment further includes:

[0020] A cooling water pipe, with a water outlet arranged above the base frame and facing the grinding processing area, and the cooling water pipe is suitable for water cooling the sample during the grinding process.

[0021] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment further includes:

[0022] The wind knife is arranged on the base frame. The wind knife is arranged adjacent to the upper / lower material port of the automatic silicon wafer grinding equipment. The wind knife is suitable for drying the sample after the grinding operation is completed.

[0023] According to some embodiments of the present disclosure, the grinding head comprises:

[0024] a bottom plate connected to the output end of the driving device; and

[0025] A plurality of abrasives are arranged in an array on the bottom plate, wherein a sewage drain is provided between two adjacent abrasives to discharge waste water and grinding debris generated by grinding.

[0026] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment further includes:

[0027] A processing flow collection device is arranged adjacent to the third driving device, and the processing collection device is suitable for obtaining the grinding flow information.

[0028] According to another aspect of the invention disclosed herein, there is provided a method for automatic grinding of silicon wafers, using the automatic grinding system for silicon wafers as described above, the grinding method comprising:

[0029] Cutting the single crystal silicon rod to obtain samples to be ground;

[0030] The sample to be ground is transported to an automatic silicon wafer grinding device;

[0031] Detect the quality of the grinding head, and if the preset requirements are met, move the sample to be ground to the processing area;

[0032] Clamping and fixing the sample to be ground, and grinding one side or both sides of the sample to be ground by a grinding head;

[0033] Blow dry the ground samples;

[0034] The dried samples are transported to the carbon oxygen detector for testing; and

[0035] Record data, sort samples and return them.

[0036] According to the silicon wafer automatic grinding system and grinding method of the embodiments of the present invention, a single crystal silicon rod is cut by a loop cutter to obtain a sample to be ground, the silicon wafer automatic grinding equipment grinds the sample to be ground, and a carbon oxygen detection machine performs carbon oxygen detection on the ground sample. This can reduce manual intervention, standardize maintenance and operations, stabilize the polishing effect, improve detection accuracy, open up the entire process automation process, realize unmanned sample detection, and eliminate labor costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a structural schematic diagram of a grinding state of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure;

[0038] Figure 2 is a structural schematic diagram of a non-grinding state of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure;

[0039] Figure 3is a schematic structural diagram from another perspective of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure;

[0040] Figure 4 is an enlarged schematic diagram of a grinding surface of a grinding head of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure; and

[0041] Figure 5 It is a schematic flow chart of a method for automatic grinding of silicon wafers according to an exemplary embodiment of the present disclosure.

[0042] In the above drawings, the meanings of the reference numerals are as follows:

[0043] 1- Workbench;

[0044] 2- Samples;

[0045] 3- Sample slot;

[0046] 4- first driving device;

[0047] 5- Sample top fastener;

[0048] 7- second driving device;

[0049] 8- grinding head;

[0050] 9- third driving device;

[0051] 10- bottom frame;

[0052] 11-Cooling water pipe;

[0053] 12-Working cabin;

[0054] 13-upper / lower feed port;

[0055] 14- Wind knife;

[0056] 15-Flexible pad;

[0057] 16-grinding motor;

[0058] 17- Abrasives; and

[0059] 18-Sewage drain. DETAILED DESCRIPTION

[0060] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0061] However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, the description of the known technology is omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0062] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The term "comprising" used herein indicates the existence of features, steps, operations, but does not exclude the existence or addition of one or more other features.

[0063] In the case of using expressions such as "at least one of A, B, and C, etc.", it should generally be interpreted in accordance with the meaning of the expression generally understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.). In the case of using expressions such as "at least one of A, B, or C, etc.", it should generally be interpreted in accordance with the meaning of the expression generally understood by those skilled in the art (for example, "a system having at least one of A, B, or C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0064] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0065] Figure 1 is a structural schematic diagram of a grinding state of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure; Figure 2 is a structural schematic diagram of a non-grinding state of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure; Figure 3 1 is a schematic structural diagram from another perspective of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure.

[0066] According to an embodiment of one aspect of the present disclosure, there is provided a silicon wafer automatic grinding system, comprising: a loop wire cutter, a silicon wafer automatic grinding device, and a carbon oxygen detector. The loop wire cutter is suitable for cutting a single crystal silicon rod to obtain a sample to be ground. The silicon wafer automatic grinding device is suitable for automatically grinding the sample to be ground. The carbon oxygen detector is suitable for detecting the sample after grinding by the silicon wafer automatic grinding device.

[0067] In this embodiment, the single crystal silicon rod is cut by a circular wire cutter to obtain the sample to be ground, the silicon wafer automatic grinding equipment grinds the sample to be ground, and the carbon oxygen detection machine performs carbon oxygen detection on the ground sample. This can reduce manual intervention, standardize maintenance and operations, stabilize the polishing effect, improve detection accuracy, open up the entire process automation process, realize unmanned sample detection, and eliminate labor costs.

[0068] According to some embodiments of the present disclosure, Figure 1 to Figure 3 As shown, the automatic silicon wafer grinding equipment includes: a base frame 10, a workbench 1, a first linear motion component and a second linear motion component.

[0069] According to some embodiments of the present disclosure, the base frame 10 is a supporting structure of the automatic silicon wafer grinding equipment, such as a frame structure, a box-type structure, etc., which provides support and installation positions for other functional components.

[0070] According to some embodiments of the present disclosure, a workbench 1 is disposed on a base frame 10 , and a sample slot 3 for holding a sample 2 to be ground is provided on the workbench 1 .

[0071] According to some embodiments of the present disclosure, the workbench 1 is in the shape of a cube, a cuboid or a cylinder.

[0072] According to some embodiments of the present disclosure, a sample slot 3 is provided in the middle of the workbench 1 along the first direction. Optionally, the sample slot 3 is an arc-shaped slot, and its curvature is adapted to the sample to be ground. Furthermore, a flared guide portion is provided at the top of the sample slot 3 to facilitate the placement of the sample to be ground.

[0073] According to some embodiments of the present disclosure, the first linear motion assembly is in transmission connection with the workbench 1 to drive the workbench 1 to move in a first direction. Optionally, the first linear motion assembly includes a first drive device 4 including an electric cylinder, a pneumatic cylinder, a hydraulic cylinder, a linear motor, etc.

[0074] According to some embodiments of the present disclosure, the workbench 1 includes two working areas: a grinding processing area and a loading and unloading area. The first driving device 4 drives the workbench 1 to move between the two areas, wherein the grinding processing area is used to grind the samples loaded on the workbench 1, and the loading and unloading area is suitable for placing the samples to be ground into the sample slot 3 through a loading and unloading device (for example, a robot), or taking the ground samples out of the sample slot 3 to enter the next process.

[0075] According to some optional embodiments of the present disclosure, the first linear motion assembly includes a rodless cylinder, which is disposed on a base frame 10 , and the rodless cylinder includes a slide that can move along a first direction, wherein the workbench 1 is mounted on the slide.

[0076] According to some embodiments of the present disclosure, the second linear motion assembly includes two driving devices (for example, a second driving device 7 and a third driving device 9) arranged on both sides of the moving track of the workbench 1, and the output ends of the two driving devices are respectively provided with grinding heads 8. The two driving devices are suitable for driving the grinding heads 8 to approach / move away from the sample piece 2 to be ground, so as to grind one side or both sides of the sample piece 2 to be ground.

[0077] In this embodiment, one grinding head 8 can be started as needed, while the other grinding head is not started and only serves as a support, so as to grind one side of the sample 2; both grinding heads can also be started as needed to grind both sides of the sample 2 at the same time.

[0078] According to some embodiments of the present disclosure, the two driving devices include an electric cylinder, a pneumatic cylinder, a hydraulic cylinder, a linear motor, etc.

[0079] According to some embodiments of the present disclosure, the automatic silicon wafer grinding device further includes a grinding motor 16, which is disposed on the output end of the third driving device 9, and the grinding motor 16 is transmission-connected to the grinding head 8 to drive the grinding head 8 to rotate.

[0080] According to some embodiments of the present disclosure, the automatic silicon wafer grinding system also includes a conveyor line, which is arranged between the loop wire cutting machine and the automatic silicon wafer grinding equipment, and the conveyor line is suitable for transferring the sample 2 to be ground to the automatic silicon wafer grinding equipment.

[0081] According to some optional embodiments of the present disclosure, the conveyor line is an electrical monorail system (EMS) suspended in the air.

[0082] According to some alternative embodiments of the present disclosure, the conveyor line is a conveyor belt transmission line.

[0083] According to some embodiments of the present disclosure, the automatic silicon wafer grinding system also includes a manipulator, which is arranged adjacent to the automatic silicon wafer grinding equipment. The manipulator is suitable for grabbing, transferring, and moving samples to be ground or samples after grinding.

[0084] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment also includes a clamping assembly, which includes a sample clamping member 5 arranged on both sides of the moving track of the workbench, and the two sample clamping members 5 can move toward / backward synchronously to clamp or release the sample to be ground.

[0085] According to some optional embodiments of the present disclosure, two sample clamping members 5 are connected to a linear drive device, and the two sample clamping members 5 move synchronously under the drive of the linear drive device, so as to fix the sample 2 in the grinding processing area to prevent the sample from vibrating, shaking, and shifting during the grinding process, thereby causing the grinding process to fail.

[0086] According to some embodiments of the present disclosure, the clamping assembly includes a pneumatic clamp, which includes two pneumatic clamping parts arranged on both sides of the moving trajectory of the workbench 1. The two pneumatic clamping parts move toward each other in response to the application of air pressure, and move back to back in response to the release of air pressure.

[0087] According to some embodiments of the present disclosure, the clamping assembly further includes a flexible pad 15, which is disposed on two opposite clamping surfaces of the two pneumatic clamping parts to reduce damage to the sample.

[0088] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment also includes a cooling water pipe 11, the outlet of the cooling water pipe 11 is arranged above the base frame 10 and faces the grinding processing area, and the cooling water pipe 11 is suitable for water cooling the sample 2 during the grinding process.

[0089] According to some embodiments of the present disclosure, a drainage groove is provided on the base frame 10. When the sample is ground, the cooling water pipe 11 sprays cooling water toward the grinding area to cool it down, and the cooling water takes away the ground debris through the drainage groove.

[0090] According to some embodiments of the present disclosure, the automatic silicon wafer grinding device further includes a working cabin 12, which is covered on the base frame 10 to form a sealed grinding space to reduce the possibility of splashing of grinding debris and reduce the noise of the grinding operation. An upper / lowering port 13 is provided on the working cabin 12 at a position intersecting with the moving track of the workbench 1.

[0091] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment also includes a wind knife 14, which is arranged on the base frame 10. The wind knife 14 is arranged adjacent to the upper / lower material port 13 of the automatic silicon wafer grinding equipment. The wind knife 14 is suitable for blowing dry the sample after the grinding operation is completed.

[0092] In this embodiment, after the sample is ground in the grinding processing area, it is moved to the upper / lower material port 13 through the workbench 1, and the air knife 14 is started to blow dry the sample so as to enter the next step.

[0093] Figure 4 It is an enlarged schematic diagram of a grinding surface of a grinding head of a silicon wafer automatic grinding device of a silicon wafer automatic grinding system according to an exemplary embodiment of the present disclosure.

[0094] According to some embodiments of the present disclosure, Figure 4 As shown, the grinding head 8 includes: a bottom plate and a plurality of abrasives 17. The bottom plate is connected to the output end of the driving device. The plurality of abrasives 17 are arranged in an array on the bottom plate, wherein a sewage drain trough 18 is provided between two adjacent abrasives 17 for discharging wastewater and grinding debris generated by grinding.

[0095] According to some embodiments of the present disclosure, the automatic silicon wafer grinding equipment further includes a processing flow acquisition device, which is disposed adjacent to the second linear moving component, and is adapted to acquire grinding flow information. The grinding flow information includes determining whether there are defects on the grinding surface of the grinding head 8 (e.g., abnormal wear, protrusions, or blockage of the sewage tank, etc.). For example, the processing flow acquisition device includes an image acquisition device and an image processing device, which acquire images of the grinding surface before, during, and after grinding, and analyzes and determines whether the images meet the requirements. If the images meet the requirements, the next step is entered. If the images do not meet the requirements, a reminder message is issued to facilitate replacement of the grinding head.

[0096] Figure 5 It is a schematic flow chart of a method for automatic grinding of silicon wafers according to an exemplary embodiment of the present disclosure.

[0097] According to another aspect of the invention disclosed herein, a method for automatically grinding a silicon wafer is provided, using the automatic grinding system for a silicon wafer as described above. Figure 5 As shown, the grinding method includes operations S101 to S109.

[0098] According to some embodiments of the present disclosure, operation S101 includes: cutting a single crystal silicon rod to obtain a sample to be ground.

[0099] According to some embodiments of the present disclosure, operation S102 includes: transporting the sample to be ground to an automatic silicon wafer grinding device.

[0100] According to some embodiments of the present disclosure, operation S103 includes: detecting the quality of the grinding head, and if the quality meets the preset requirements, proceeding to operation S105; if the quality does not meet the preset requirements, proceeding to operation S104.

[0101] According to some embodiments of the present disclosure, operation S104 includes: replacing the grinding head and returning to operation S103 for re-detection.

[0102] According to some embodiments of the present disclosure, operation S105 includes: moving the sample to be ground to a processing area.

[0103] According to some embodiments of the present disclosure, operation S106 includes: clamping and fixing the sample to be ground, and grinding one side or both sides of the sample to be ground by a grinding head.

[0104] According to some embodiments of the present disclosure, operation S107 includes: performing a blow-drying operation on the ground sample.

[0105] According to some embodiments of the present disclosure, operation S108 includes: transporting the blow-dried sample to a carbon oxygen detector for detection.

[0106] According to some embodiments of the present disclosure, operation S109 includes: recording data, sorting samples and returning them.

[0107] In this embodiment, the sample is taken by the loop cutter, the obtained sample is transported by the EMS crane, the robot grabs the sample for transfer, the silicon wafer automatic grinding equipment connects the wafer, the grinding head clamps the sample for polishing, the workbench is transferred to the unloading port, the air knife blows the sample dry, the robot grabs the sample for transfer, the carbon oxygen instrument connects the material for testing, and the sample is automatically returned. Through the above process, the sample can be fully automatically ground and tested without manual intervention. The invented device can meet the processing requirements of 247 / 295 sample specifications, and the maximum grinding thickness is less than 2mm.

[0108] According to the silicon wafer automatic grinding system and method of the embodiment of the present disclosure, the loading and unloading management of the sample is completed through the workbench, the sample is fixed in the grinding area with the support component, and the automatic grinding of the sample is completed by the support plate and the grinding head, which has the following technical effects:

[0109] (1) Reduce the number of people involved. Develop fully automatic grinding equipment and its supporting equipment to open up the entire process automation process, realize unmanned sample testing, and eliminate labor costs;

[0110] (2) Standardization, reducing manual intervention, standardizing maintenance and operations, stabilizing polishing effects, and improving detection accuracy;

[0111] (3) Technological breakthrough - thin slice grinding: The minimum grinding thickness is 1.5mm, which can meet the thickness requirements of mainstream oxygen and carbon instruments in the market, and also supports a variety of sample grinding processes such as φ295 / φ247;

[0112] (4) Technological breakthrough - grinding effect: glossiness up to 300GU, 50 pieces can be processed continuously.

[0113] So far, the embodiments of the present disclosure have been described in detail in conjunction with the accompanying drawings. It should be noted that the implementation methods not shown or described in the drawings or the body of the specification are all forms known to ordinary technicians in the relevant technical field and are not described in detail. In addition, the above definitions of each component are not limited to the various specific structures, shapes or methods mentioned in the embodiments, and ordinary technicians in the field can simply change or replace them.

[0114] It should also be noted that, in the specific embodiments of the present disclosure, unless otherwise indicated, the numerical parameters in the present specification and the appended claims are approximate values ​​and can be changed according to the desired characteristics obtained through the content of the present disclosure. Specifically, all numbers used in the specification and claims to express the size, range conditions, etc. of the composition should be understood to be modified by the term "about" in all cases. In general, the meaning of the expression refers to the change of ±10% in some embodiments, ±5% in some embodiments, ±1% in some embodiments, and ±0.5% in some embodiments by a specific number.

[0115] It will be appreciated by those skilled in the art that the features described in the various embodiments and / or claims of the present disclosure may be combined and / or combined in a variety of ways, even if such combinations and / or combinations are not explicitly described in the present disclosure. In particular, the features described in the various embodiments and / or claims of the present disclosure may be combined and / or combined in a variety of ways without departing from the spirit and teachings of the present disclosure. All of these combinations and / or combinations fall within the scope of the present disclosure.

[0116] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present disclosure. It should be understood that the above description is only a specific embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure.

Claims

1. A silicon wafer automatic grinding system, characterized in that: include: Loop wire cutting machine, suitable for cutting single crystal silicon rods to obtain samples to be ground; Automatic silicon wafer grinding equipment, including: chassis; A workbench, arranged on the base frame, wherein the workbench is provided with a sample slot for holding the sample to be ground; A first linear motion component, drivingly connected to the workbench to drive the workbench to move in a first direction; The second linear moving assembly includes two driving devices arranged on both sides of the moving track of the workbench, the output ends of the two driving devices are respectively provided with grinding heads, and the two driving devices are suitable for driving the grinding heads to approach / move away from the sample to be ground, so as to grind one side or both sides of the sample to be ground; The carbon oxygen detector is suitable for detecting samples after being ground by the silicon wafer automatic grinding equipment.

2. The automatic silicon wafer grinding system according to claim 1, characterized in that: Also includes: A conveyor line is arranged between the loop wire cutting machine and the automatic silicon wafer grinding equipment, and the conveyor line is suitable for transmitting the sample to be ground to the automatic silicon wafer grinding equipment.

3. The automatic silicon wafer grinding system according to claim 2, characterized in that: Also includes: A robot arm is arranged adjacent to the automatic silicon wafer grinding device, and the robot arm is suitable for grabbing and transferring the sample to be ground or the sample after grinding.

4. The automatic silicon wafer grinding system according to claim 2, characterized in that: The conveyor line is an electric monorail transmission device suspended in the air.

5. The automatic silicon wafer grinding system according to claim 1, characterized in that: The automatic silicon wafer grinding equipment also includes a clamping assembly, which includes sample clamping members arranged on both sides of the moving track of the workbench. The two sample clamping members can move toward / backward synchronously to clamp or release the sample to be ground.

6. The automatic silicon wafer grinding system according to claim 1, characterized in that: The automatic silicon wafer grinding equipment also includes: A cooling water pipe, with a water outlet arranged above the base frame and facing the grinding processing area, and the cooling water pipe is suitable for water cooling the sample during the grinding process.

7. The automatic silicon wafer grinding system according to claim 6, characterized in that: The automatic silicon wafer grinding equipment also includes: The wind knife is arranged on the base frame. The wind knife is arranged adjacent to the upper / lower material port of the automatic silicon wafer grinding equipment. The wind knife is suitable for drying the sample after the grinding operation is completed.

8. The automatic silicon wafer grinding system according to claim 1, characterized in that: The grinding head comprises: a bottom plate connected to the output end of the driving device; and A plurality of abrasives are arranged in an array on the bottom plate, wherein a sewage drain is provided between two adjacent abrasives to discharge waste water and grinding debris generated by grinding.

9. The automatic silicon wafer grinding system according to claim 1, characterized in that: The automatic silicon wafer grinding equipment also includes: A processing flow collection device is arranged adjacent to the third driving device, and the processing collection device is suitable for obtaining the grinding flow information.

10. A method for automatic silicon wafer grinding, using the automatic silicon wafer grinding system according to any one of claims 1 to 9, characterized in that: Grinding methods include: Cutting the single crystal silicon rod to obtain samples to be ground; The sample to be ground is transported to an automatic silicon wafer grinding device; Detect the quality of the grinding head, and if the preset requirements are met, move the sample to be ground to the processing area; Clamping and fixing the sample to be ground, and grinding one side or both sides of the sample to be ground by a grinding head; Blow dry the ground samples; The dried samples are transported to the carbon oxygen detector for testing; and Record data, sort samples and return them.

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