A monitoring device and lifetime test system suitable for micro thermoelectric devices

Abstract

The application discloses a monitoring device and a life test system suitable for micro thermoelectric devices. The monitoring device utilizes a thermocouple fixing plate elastically connected with a positioning guide mechanism to tightly contact each thermocouple element with a corresponding sample, so that the interface thermal resistance is reduced, real-time and accurate measurement of the cold face temperature of multiple samples can be simultaneously realized, and the situation that some samples are not compressed due to the existence of a tolerance zone and thus inaccurate temperature measurement is avoided. The probe provided by the application is flexible and elastic. When a multi-station design is performed, the extension and retraction amount of the probe can overcome the height difference between different stations caused by machining precision, and normal power supply and electric signal measurement can still be ensured. The application firstly integrates current, voltage and temperature tests into one device, so that the tests and temperature characterization can be completed in one monitoring device, and the monitoring efficiency is greatly improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor refrigeration chip testing, and particularly relates to a monitoring device and a life test system suitable for micro thermoelectric devices. BACKGROUND

[0002] Semiconductor modules based on thermoelectric effect can realize the mutual conversion of heat and electricity. On the one hand, they can utilize temperature difference to generate electricity, and on the other hand, they can pump heat by passing electricity to achieve precise temperature control of targets, and are widely used in communication, aerospace, biological medicine and other fields. Due to the constraints of heat conduction process, thermoelectric devices are difficult to be redundantly designed, but in actual use requirements, their life is often required to be not less than the life of the subsystem module, and they need to work stably for tens of thousands or even hundreds of thousands of hours, which puts extremely high requirements on their reliability. Therefore, it is crucial to clearly grasp the failure rate function of thermoelectric devices under a specific process flow.

[0003] In order to evaluate the life of thermoelectric devices through reasonable stress acceleration means and acceleration model, the industry has developed test methods by applying external stress such as temperature stress or electric stress. In order to obtain the life information of thermoelectric devices through these methods, it is necessary to ensure that the device maintains good circuit connection under the relevant requirements, and to monitor the state of the device to obtain the key performance of the device in real time. However, the current life test system is only suitable for thermoelectric devices with larger size (more than 10mm*10mm), and the life test system only applies a single stress to the device, such as single-side constant temperature long-time power-on, double-side constant temperature difference, on-off power cycle and positive and negative power cycle, etc. Complete life evaluation needs to use multiple life test systems. The general life test equipment has large mechanical size and is difficult to put into the environmental test chamber to change the temperature and humidity conditions. The monitoring of the key performance of the device (such as internal resistance and maximum temperature difference) needs to be transferred to the corresponding test equipment for measurement after the stress is applied, so that the process of "stress application-release-test" needs to be repeated multiple times in each life test cycle of the device, which is complicated to operate.

[0004] For micro-devices with a working surface area reduced to a few square millimeters and an electrode area of ​​less than 1mm × 1mm, it is almost impossible to test them using conventional device life testing systems. First, establishing the most basic circuit connections requires soldering under a microscope, and soldering four wires on such small electrodes for voltage monitoring is virtually impossible, with a high probability of causing direct short-circuit failure. Second, miniature devices are easily warped by the force of the leads, requiring a fixing structure to maintain good thermal contact with the heat sink. Directly clamping the thermocouple between the pressure head and the cooling surface increases system thermal resistance. Furthermore, with the reduced size, the temperature sensing junction is almost not in contact with the device surface when the thermocouple is clamped within the thermal interface layer. The actual temperature measured is not the temperature of the cooling surface of the miniature device, but rather the temperature of the thermal interface at a certain distance from the surface, resulting in unmeasurable testing errors. Additionally, life testing requires simultaneous testing of multiple miniature devices from the same batch. For miniature devices with a thickness of no more than 2mm, a dimensional error of 0.01mm can cause abnormal thermal contact and failure. Therefore, the commonly used strategy for simultaneous testing is to use multiple single-station testing systems, which is complex and has low utilization. Therefore, conducting life tests on multiple micro thermoelectric devices simultaneously, monitoring current, voltage, and temperature status in real time, and performing integrated measurements of key device performance are common challenges faced by the industry, and there is a lack of suitable life testing equipment. Summary of the Invention

[0005] This invention provides a monitoring device suitable for micro thermoelectric devices, which can simultaneously and accurately monitor the current, voltage and temperature of multiple micro thermoelectric devices.

[0006] This invention provides a monitoring device suitable for miniature thermoelectric devices, comprising:

[0007] A base, wherein a base groove is provided on the base;

[0008] A heat-conducting and heat-dissipating component is located in the groove of the base, and a thermocouple is installed in the heat-conducting and heat-dissipating component. The thermocouple is used to detect the temperature of the heating surface of the sample.

[0009] The sample carrier plate includes a sample fixing plate for loading a sample, the sample fixing plate being located on the heat dissipation assembly, and the sample fixing plate having at least one groove for fixing the sample;

[0010] The probe and thermocouple fixing plate includes a first positioning plate, a probe fixing plate, and multiple thermocouple fixing plates.

[0011] The probe fixing plate is fixed on the second positioning plate, and a probe array unit with an extension mechanism is arranged, each probe array unit is aligned with a corresponding sample piece, and is used for detecting the current and voltage of the sample piece.

[0012] The thermocouple fixing plate is elastically connected to the probe fixing plate, a thermocouple guide tube and a thermocouple element are arranged on the thermocouple fixing plate, the thermocouple element is fixed in the thermocouple guide tube, the thermocouple element is aligned with a corresponding cold surface of a sample piece, and is used for detecting the temperature of the cold surface of the sample piece.

[0013] A positioning guide mechanism is fixedly connected with the second positioning plate and the sample piece loading plate respectively, and is used for pressing the probe and the thermocouple fixing plate, and aligning and pressing the probe array unit and the thermocouple element with the corresponding sample piece.

[0014] Preferably, the heat conduction and heat dissipation component comprises a heat dissipation assembly and a heat conduction interface material, the heat conduction interface material is located between the heat dissipation assembly and the sample piece loading plate, is used for transmitting heat of the heat generation surface of the sample piece to the heat dissipation assembly, and the heat dissipation assembly is used for transmitting heat to the outside.

[0015] Further preferably, the heat dissipation assembly is a water cooling plate, a fan and a heat dissipation fin with a flat plate, a semiconductor refrigeration sheet or a combination of a semiconductor refrigeration sheet and a water cooling plate, a semiconductor refrigeration sheet and a fan and a heat dissipation fin with a flat plate.

[0016] Further preferably, the heat dissipation assembly is a fan, and the groove of the base is further provided with an air duct.

[0017] Further preferably, the heat dissipation assembly is a water cooling plate, and the groove of the base is further provided with a water pipe groove.

[0018] Further preferably, the water cooling plate and the heat dissipation fin are made of gold, silver, copper, red copper or aluminum alloy, or are plated with gold on the outer surface of the copper / red copper / aluminum alloy block.

[0019] Further preferably, the heat conduction interface material is a heat conduction silica gel plate, a heat conduction graphite paper or a heat conduction PVDF-based boron nitride composite material, and the thickness of the heat conduction interface material needs to ensure that the thermal contact between the bottom surface of the TEC to be measured and the heat dissipation plate meets the relevant test requirements.

[0020] Preferably, the sample piece loading plate is composed of multiple plates, and at least one groove for fixing a sample piece is arranged in each plate.

[0021] The present application can arbitrarily combine different specifications of grooves in each plate to meet the testing requirements of different specifications of sample pieces at the same time, the sample piece loading plate is further provided with a fixing hole, a pin hole or a positioning structure matched with the base or the heat dissipation assembly, and the material of the sample piece loading plate is metal, heat insulation material or anti-static material.

[0022] Preferably, the sample carrier further comprises a first positioning plate connected with the sample fixing plate and the positioning guide mechanism, the positioning guide mechanism comprising a positioning guide column and a motor, wherein the first positioning plate is detachably fixed with the sample carrier, used for fixing the sample carrier, the first positioning plate is fixed at the bottom of the positioning guide column, the second positioning plate passes through the positioning guide column and is above the first positioning plate, a probe and a thermocouple fixing plate are detachably fixed above the second positioning plate, and the motor is connected with the second positioning plate, used for controlling the Z-direction movement of the second positioning plate.

[0023] The probe and the thermocouple fixing plate are detachably fixed above the second positioning plate, so that the probe and the thermocouple fixing plate can be replaced according to the change of the sample carrier.

[0024] The first positioning plate and the positioning guide column are used to constrain the sample carrier in the Z-direction, and the groove in the sample carrier is used to constrain the sample in the X and Y directions, so that the position of the sample is constrained, the second positioning plate is used to fix the probe and the thermocouple fixing plate, so that the X and Y directions of the probe array unit and the thermocouple element are constrained, the positioning guide column is used to constrain the Z-direction of the probe array unit and the thermocouple element, so that the position of the probe array unit and the thermocouple element is constrained, and the alignment of the probe array unit, the thermocouple element and the corresponding sample is realized by adjusting the positioning guide mechanism.

[0025] Preferably, when the thermocouple element is a thermocouple wire, the thermocouple wire is fixed in the thermocouple guide tube, and the temperature of the cold surface of the sample is measured by the thermocouple wire.

[0026] Alternatively, when the thermocouple element is a thermocouple film, the thermocouple film is fixed at the end of the thermocouple guide tube, and the temperature of the cold surface of the sample is measured by the thermocouple film.

[0027] Compared with the thermocouple wire, the thermocouple film can be arranged on the horizontal plane more easily, and the temperature of the cold surface of the specified sample can be measured and multi-point array measurement can be realized, for example, the temperature of the upper surface of a 2mm*2mm sample to be measured can be measured by one thermocouple wire. The thermocouple film can be arranged with a resolution of microns, that is, 5 temperature measurement points can be arranged in a 2mm*2mm area.

[0028] Preferably, the probe array unit comprises four probes, two of which are aligned with the positive electrode of the corresponding sample, and the other two are aligned with the negative electrode of the corresponding sample.

[0029] The application supplies power to the micro device by the probe, does not need to weld the wire, and measures the voltage by the four-probe method, so that the test result is more accurate, and the product after welding by the traditional method only has positive and negative lead wires, so that the error caused by the resistance of the lead wires is introduced when the same method is used for testing. In addition, the probe technology designed in the application can be arranged in an array, exists in a module unit, and can be batch processed at the same time, which is also an improvement compared with the prior art.

[0030] The application also provides a micro device test system, which comprises:

[0031] The sample feeding and discharging module is used for loading the sample on the carrier plate, conveying the sample carrier plate to the detection area, and feeding the sample to the detected area after detection is completed.

[0032] The micro thermoelectric device monitoring device is used for receiving the sample, and aligning and pressing the probe array unit and the thermocouple element with the corresponding sample based on the instruction, so as to obtain the current, voltage and temperature signals of the sample during the test process.

[0033] The safety protection module is used for early warning monitoring of the circuit connection, current overload and sample temperature abnormity of the sample based on the preset safety protection program.

[0034] The program control module is used for controlling the micro thermoelectric device monitoring device to perform the direct current or alternating current test on the circuit of the sample based on the preset test program, so as to realize the set test based on the set power-on system, and archive and automatically generate the report after data processing of the obtained current, voltage and temperature signals.

[0035] The sensing and information acquisition module is used for transmitting the current, voltage and temperature signals to the program control module.

[0036] The traditional technical means needs to individually pack each TEC into a module, and the module is assembled in batches to be tested, so that the TEC can be removed from the module after the life test system works for a period of time, and is transferred to the test system for characterization test, and the TEC is assembled again after the test is completed, and the process is repeated. Compared with the traditional scheme, the micro device test system provided by the application can monitor the element state in real time, the traditional technology needs to interrupt the test at a fixed time point, take out the sample to the test platform for characterization test, the micro thermoelectric device monitoring device provided by the application integrates the test and characterization, so that the test efficiency is greatly improved. The patent can realize automatic setting of the parameters such as direct current / alternating current power-on mode, power-on time, static time, current direction, on-off time, cycle number, and pressure, can automatically complete the life test pause, static, test, report formation and storage at the preset time point, and realizes one-key completion of the life test.

[0037] The micro device testing system provided by the application connects with an automatic production line, and the intelligent system for automatic sampling, testing and feedback of results is realized, and the mode of traditional manual sampling, assembling, monitoring, testing and reporting is abandoned.

[0038] Compared with the prior art, the application has the following beneficial effects:

[0039] In the pressing process of the positioning guide mechanism, the thermocouple fixing plate elastically connected with the positioning guide mechanism tightly contacts each thermocouple element and the corresponding sample, so that the interface thermal resistance is reduced, real-time and accurate measurement of the cold surface temperature of multiple samples can be realized, multi-point temperature measurement is realized, and the situation that some samples are not pressed tightly due to the existence of the tolerance band and thus the temperature measurement is inaccurate is avoided.

[0040] The probe provided by the application has telescopic elasticity, and when multi-station design is performed, the telescopic amount of the probe can overcome the height difference between different stations caused by machining precision, and normal power supply and electrical signal measurement can still be ensured, the current, voltage and temperature test are integrated into one device for the first time, so that the test and temperature characterization can be completed in one monitoring device, and the monitoring efficiency is greatly improved.

[0041] Compared with the prior art, the monitoring device provided by the application has a smaller size, and therefore can be matched with an environmental test chamber to perform experiments in other temperature and humidity environments. BRIEF DESCRIPTION OF DRAWINGS

[0042] Figure 1 The schematic view of the monitoring device suitable for the micro thermoelectric device provided by the embodiment of the application is shown in the figure.

[0043] Figure 2 The front view of the monitoring device suitable for the micro thermoelectric device provided by the embodiment of the application is shown in the figure.

[0044] Figure 3 The schematic view of the probe and the thermocouple fixing plate provided by the embodiment of the application is shown in the figure.

[0045] Figure 4 The schematic view of the micro device testing system provided by the embodiment of the application is shown in the figure.

[0046] EMBODIMENT MODE

[0047] The application will be further described in detail below with reference to the embodiment of the drawings

[0048] In order to realize the integration of the current voltage test and temperature test of the micro thermoelectric device for accurate testing, the embodiment of the application provides a monitoring device suitable for the micro thermoelectric device, as shown in Figure 1and Figure 2 As shown, including the base 011, heat conduction and heat dissipation component 012, sample carrier plate 013, probe and thermocouple fixed plate and positioning guide mechanism, the heat conduction and heat dissipation component 012 provided by the application is located in the base groove of the base 011, and the height is higher than the base groove, the sample carrier plate 013 is located on the heat conduction and heat dissipation component 012, the temperature of the heating surface of the sample loaded by the sample carrier plate 013 is exported through the heat conduction and heat dissipation component 012, the probe and thermocouple fixed plate is located on the upper part of the sample carrier plate 013, the probe and thermocouple fixed plate is provided with a probe fixed plate and a thermocouple fixed plate 014 and a second positioning plate 015, the probe fixed plate is fixed on the second positioning plate 015, the thermocouple fixed plate is elastically connected to the second positioning plate 015, the probe fixed plate is provided with a probe array unit with a telescopic mechanism, the thermocouple element is arranged on the thermocouple fixed plate, the probe array unit and the thermocouple element are aligned with the corresponding sample, the probe and thermocouple fixed plate are pressed down through the positioning guide mechanism, so that the sample carrier plate 013 and the probe and thermocouple fixed plate are pressed tightly, so that the probe array unit is accurately connected to the positive and negative electrodes of the corresponding sample, and the thermocouple element is pressed on the cold surface of the corresponding sample, so that the current, voltage and cold surface temperature of the corresponding sample are measured simultaneously and in real time, and because the thermocouple fixed plate is elastically connected to the second positioning plate 015, and the probes in the probe array unit all have telescopic mechanisms, therefore, when the heights of different stations caused by precision are different, the current, voltage and temperature signals of the sample can still be accurately measured in batches, and the probe includes an energized probe and a measurement probe.

[0049] The base 011 is provided with a base groove for fixing the heat dissipation assembly, the height of the base groove is lower than the height of the heat dissipation assembly, and the base 011 is also provided with a support, so that the sample carrier plate 013 and the heat conduction interface material can be tightly attached to the surface of the heat dissipation assembly, in a specific embodiment, the heat dissipation assembly is accurately positioned in the base groove through the positioning structure or the positioning pin, and the relative position change of the sample carrier plate 013, the heat dissipation assembly and the base 011 is not more than 0.005 mm before and after the heat conduction interface material is ensured to be better.

[0050] The heat conduction and heat dissipation component is provided with a thermocouple, which can measure the temperature of the heating surface of the sample, the heat conduction and heat dissipation component includes a heat dissipation assembly and a heat conduction interface material, the heat conduction interface material is located between the heat dissipation assembly and the sample carrier plate, and is used for transmitting the heat of the heating surface of the sample to the heat dissipation assembly, and the heat dissipation assembly is used for transmitting the heat to the outside.

[0051] The heat dissipation assembly provided by the embodiment of the present application is a water-cooled plate, a fan, a heat dissipation fin with a flat plate, a semiconductor refrigeration sheet, or a combination of the semiconductor refrigeration sheet and the water-cooled plate, the semiconductor refrigeration sheet and the heat dissipation fin with the flat plate, and the fan.

[0052] The heat dissipation assembly provided by the embodiment of the present application is provided with a fan, and the groove of the base is further provided with an air duct.

[0053] The heat dissipation assembly provided by the embodiment of the present application is a water-cooled plate, and the groove of the base is further provided with a water pipe groove.

[0054] The water-cooled plate and the heat dissipation fin provided by the embodiment of the present application are made of gold, silver, copper, red copper, or aluminum alloy, or are plated with gold on the outer surface of a copper / red copper / aluminum alloy block.

[0055] The heat-conducting interface material provided by the embodiment of the present application is a heat-conducting silica gel plate, a heat-conducting graphite paper, or a heat-conducting PVDF-based boron nitride composite material, and the thickness of the heat-conducting interface material needs to ensure that the thermal contact between the bottom surface of the TEC to be tested and the heat dissipation plate meets the relevant test requirements.

[0056] In an embodiment, the heat-conducting and heat-dissipating component includes a water-cooled heat dissipation plate and a silica gel heat-conducting interface material, the heat-conducting interface material itself has slight adhesion and is tightly attached to the surface of the water-cooled heat dissipation plate, and the silica gel heat-conducting interface material is compressed and fixed in position through the screwing of the sample carrier plate 013 and the base 011.

[0057] The sample carrier plate 013 provided by the embodiment of the present application includes a sample fixing plate and a first positioning plate, the first positioning plate is detachably fixedly connected with the sample fixing plate and is used for fixing the sample carrier plate, the sample fixing plate is located on the heat dissipation assembly, and at least one groove for fixing a sample is arranged on the sample fixing plate.

[0058] In an embodiment, the sample fixing plate can be a whole plate formed by splicing multiple plates, so that different specifications of grooves can be combined at will to meet the testing requirements of different specifications of samples, and the sample fixing plate is further provided with fixing holes, pin holes, or positioning structures matched with the base or the heat dissipation assembly, and the material can be metal, heat insulation material, or anti-static material.

[0059] The probe and thermocouple fixing plate provided by the embodiment of the present application includes a first positioning plate, a probe fixing plate, and multiple thermocouple fixing plates, wherein, for example, Figure 3As shown, the probe fixing plate 0141 is fixed on the second positioning plate 0142, and the probe array unit 01411 with a telescopic mechanism is arranged, each probe array unit is aligned with a corresponding sample piece, used for inputting current to the sample piece, and detecting the voltage of the sample piece, the thermocouple fixing plate 0142 is elastically connected to the probe fixing plate 0141, the thermocouple guide pipe 01421 and the thermocouple element 01422 are arranged on the thermocouple fixing plate 0142, the thermocouple element 01422 is fixed in the thermocouple guide pipe 01421, and the thermocouple element 01422 is aligned with a corresponding sample piece cold surface, used for detecting the temperature of the sample piece cold surface.

[0060] The array distribution of the probe array unit arranged on the probe fixing plate and the array distribution of the thermocouple element arranged on the thermocouple fixing plate are aligned with the sample pieces arranged on the sample piece carrier plate, current, voltage and temperature of the array distributed sample pieces are measured at the same time, it can be understood that the alignment of the probe, the thermocouple element and the sample piece provided by the embodiment of the application can be (probe / thermocouple / carrier plate)*n alignment structure, and can also be (probe*n / thermocouple*n / carrier*n) alignment structure, then no matter how many stations, the alignment structure unit provided by the embodiment of the application contains the embodiment of the application. Different specifications (probe / thermocouple / carrier) unit groups are allowed to be assembled, the specifications here are their internal structures, the external structure is a unified interface, and multiple specifications can be measured at the same time.

[0061] The probe fixing plate provided by the embodiment of the application can be composed of multiple plates of different specifications to realize one-to-one correspondence with the sample piece carrier plate, the probe array unit provided by the embodiment of the application includes four probes, ensuring that the positive and negative electrodes of each sample piece are contacted by two probes, realizing circuit conduction and four-probe measurement, in a specific embodiment, the four probes are respectively and alternately dropped on the positive and negative electrodes of the sample piece to be measured, wherein one probe of the positive electrode is connected to the positive electrode of the power supply 018, and the other probe is connected to the voltage acquisition card, one probe of the negative electrode is connected to the current acquisition card, and the other probe is connected to the voltage acquisition card, the other side of the current acquisition card is connected to the relay control circuit, and then the negative electrode of the power supply 018 is connected to form a loop, the relay circuit is controlled by the upper computer software, and is responsible for the on-off of the circuit of each station and the adjustment of the current. The thermocouple is also connected to the temperature acquisition card, and all acquisition card signals are transmitted to the upper computer through the USB / RS-485 converter.

[0062] Each probe provided by the embodiment of the application has a telescopic mechanism, which can ensure that the sample pieces in multiple stations can be accurately contacted with the electrodes of each sample piece after being pressed down, in a specific embodiment, the spring inside the probe can ensure that all probes can normally contact the sample piece electrodes when the Z direction of all probes exists not more than 0.3 mm.

[0063] The thermocouple fixing plate provided by the embodiment of the present application is elastically connected to the second fixing plate through a fastening screw and a spring structure, the thermocouple guide pipe is located on the thermocouple fixing plate, and the thermocouple element is fixed to one end of the thermocouple guide pipe, so that the thermocouple element is aligned with the corresponding sample piece.

[0064] When the thermocouple element is a thermocouple wire, the thermocouple wire passes through the thermocouple guide pipe, is contracted in a ring direction to make the caliber of the guide pipe smaller than the hot junction of the thermocouple wire, then the thermocouple wire passes through the positioning column to be taut, and the hot junction of the thermocouple wire is strictly constrained at the caliber of the guide pipe. When the thermocouple fixing plate is pressed down, the spring force of the thermocouple fixing plate presses the hot junction of the thermocouple wire on the surface of the sample piece to be measured, and the sample piece is pressed to make the sample piece and the heat dissipation assembly have good thermal contact. Alternatively, the relative position between the hot junction of the thermocouple wire and the thermocouple guide pipe can be fixed in advance, then the guide pipe is filled with glue such as epoxy resin, and the hot junction of the thermocouple wire and the thermocouple guide pipe are bonded under low vacuum conditions.

[0065] In one embodiment, the thermocouple guide pipe provided by the embodiment is a rigid metal needle cylinder, the thermoelectric junction is located at one end of the rigid metal needle cylinder, the size of the junction is at least Φ50μm, the thermocouple needle cylinder is pressed down along with the pressing down of the test upper pressing plate 015, and finally is pressed on the test surface of the device to be measured. The spring force makes the device to be measured and the interface heat conduction material be pressed tightly, and good thermal contact is formed with the heat dissipation plate.

[0066] When the thermocouple element is a thermocouple wire, the thermocouple wire is fixed in the thermocouple guide pipe by filling a fixing glue into the thermocouple guide pipe. The temperature of the cold surface of the sample piece is measured by the thermocouple wire. Since the thermocouple wire is low in cost and can be used in batches, only low-precision detection can be achieved.

[0067] When the thermocouple element is a thermocouple film, at least one thermocouple film can be fixed at the end of the thermocouple guide pipe. It can be understood that the end of the thermocouple guide pipe is a sealed structure, and the thermocouple film is fixed on the end face of the seal, so that the thermocouple film is in contact with the cold surface of the sample piece. Compared with the thermocouple wire, the thermocouple film can be arranged on the horizontal plane more easily, and the temperature of the cold surface of the sample piece can be measured more accurately.

[0068] The positioning guide mechanism provided by the embodiment of the present application comprises a positioning guide column 016 and a motor 017. The first positioning plate is fixed at the bottom of the positioning guide column 016, the second positioning plate 015 passes through the positioning guide column 016 and is located above the first positioning plate, a probe fixing plate is detachably fixed above the second positioning plate 015, the motor 017 is connected with the second positioning plate 015 and is used for controlling the Z-direction movement of the second positioning plate 015, and the motor 017 is a linear motor.

[0069] The embodiment of the present application also provides a micro device testing system, which comprises a sample feeding and discharging module, a monitoring device 01 of a micro thermoelectric device, a safety protection module, a program control module and a sensing and information collecting module 042, and the specific operation process is as shown in the figure. Figure 4

[0070] The sample feeding and discharging module comprises a transfer module 041, a to-be-tested sample bin 042, a sample storage bin, a driving transmission mechanism, a positioning mechanism, an image recognition module, a sample discharging transmission mechanism and a tested sample bin 043.

[0071] Since the heat surface of the to-be-tested sample needs to be in good thermal contact with the heat sink during testing, the to-be-tested sample is placed on a heat-conducting interface material on the testing carrier plate, and the carrier plate cannot be used under some production processes, and therefore it is needed to determine whether the production sample carrier plate is consistent with the testing sample carrier plate, and if not, the sample is loaded into the transfer module 041, and then the testing sample on the production carrier plate is transferred to the testing carrier plate by the transfer module 41, positioned by a CCD camera and transferred by a vacuum suction nozzle, and the transferred to-be-tested sample is stored in the to-be-tested sample bin 042, and then the testing table is allocated according to the size and the life test system. The testing carrier plate is sent to the designated testing table by the transmission mechanism, and on the testing table, the sample carrier plate is installed and fixed on the base to complete the actual position correction, so as to ensure that the testing carrier plate and the probe plate are perfectly matched, and the image recognition module recognizes the sample number of each position of the to-be-tested sample 00, and transmits the to-be-tested sample identity information to the host computer software, and the host computer collects and records the information.

[0072] The driving testing module completes the pressing of the upper pressing plate, and realizes the circuit conduction of the to-be-tested sample by the circuit conduction and current-voltage monitoring module.

[0073] The safety protection module provided by the embodiment of the present application controls the power supply 018 protection and adjustment circuit based on the safety protection program 052, realizes the monitoring of whether the circuit is connected, whether the current is overloaded, whether the cold surface temperature is abnormally high and the like.

[0074] ​The program control module according to the embodiment of the present application controls the power supply 018 to perform DC / AC test according to the test program 051, and controls the water cooling machine 032 connected with the water cooling plate of the heat dissipation assembly 012, so as to control the constant temperature of the surface of the heat dissipation assembly by adjusting the output temperature and water flow of the water cooling machine. The constant temperature control is generally completed by the PID control program. The current, voltage and temperature signals transmitted to the host computer software are used to record the initial performance of the workpiece in each station, such as AC resistance, maximum temperature difference, maximum working current and maximum working voltage. Then, the set test is performed according to the power-on system designed in the test program, which includes life test, fixed-point test, constant high temperature test or constant temperature and humidity test, and the circuit is turned on and off by the test module controlled by the test program. The test data are recorded in real time by the test program, and the original data are archived and processed by the data collection and processing program 053 to automatically generate a report. At the same time, the sample conveying mechanism sends the tested sample to the tested warehouse.

[0075] The sensing and information collection module according to the embodiment of the present application is used to transmit the current, voltage and temperature signals to the data collection and processing program 053 of the program control module for processing.

[0076] The sensing and information collection module according to the embodiment of the present application includes a current collection module, a voltage collection module and a temperature collection module. The current collection module is a multi-channel collection card. In a single collection circuit, the "+" connection point of the current collection card is connected with the positive electrode of the power supply, the "-" connection point of the current collection card is connected with the positive electrode probe of the probe plate, and the negative electrode probe of the probe plate is connected with the safety protection. The "+" connection point of the voltage collection card is connected with the positive electrode test probe of the probe plate, and the "-" connection point is connected with the negative electrode test probe 0154 of the probe plate. The positive and negative electrodes of the thermocouple wire are connected with the "+" and "-" connection points of the temperature collection module, and the data of each collection module is transmitted to the host computer through the converter.

[0077] Embodiment 1

[0078] This embodiment introduces the life test of a plurality of micro devices with the electrode size of 1mm*1mm and long-time power-on

[0079] 1. Customized sample carrier plate and probe fixing plate matched with the device to be tested. The length-width ratio of the sample groove of the sample carrier plate is 0.003-0.005mm larger than that of the device to be tested, so as to ensure that the electrodes of the device to be tested are accurately constrained. Each measuring electrode on the probe fixing plate is provided with two gold-plated spring needles. The diameter of the needle end of the measuring needle is 0.3mm, and the diameter of the needle end of the conductive needle is 0.5mm. The relative position relationship between the probe and the device to be tested is constrained by the tolerance of not more than 0.003mm shaft hole.

[0080] 0.003mm.

[0081] 2. The heat conducting and dissipating component 012 is composed of a copper water-cooled plate, a conventional TEC and a silica gel heat conducting material. The sample carrier plate 013 is connected to the base 011 and clamps the heat conducting and dissipating component. The T-shaped thermocouple sensors are uniformly distributed in the silica gel layer for monitoring and feeding back the constant temperature end temperature. The water-cooled machine and the conventional TEC are controlled by the host computer software to maintain the accurate temperature control of the constant temperature end.

[0082] 3. The device to be tested is placed in the sample groove of the sample carrier plate in sequence. The probe pressing plate is pressed down through the quick pressing structure and locked by the buckle. The host computer software is used to check the on-off state of the circuit of each station to ensure that the circuit connection is correct. After the long time power-on life test program (1.2A / 100h+0A / 1h+key performance test) x 5 is set, the host computer program controls the power supply to output a rated current of 1.2A to each station. The real-time current, voltage and temperature values of each station are collected through the sensing and information acquisition module and fed back to the host computer software. A table is stored and a time-key performance curve graph is drawn for visual observation. When the power-on time reaches the set time, it is static. After the static ends, the test program is started. The program-controlled power supply outputs 60s, 0.2A direct current and 60s, 5000Hz, 0.28A alternating current according to the host computer program setting, and calculates the alternating current resistance of each station sample

[0083] ACR, dimensionless quality factor Z and response time constant t.

[0084] 4. After the test is completed, the failure rate function is obtained according to the preset failure rule, the key performance decay curve is output, and the reliability analysis report is output.

[0085] Example 2

[0086] This example introduces the life test of a plurality of micro devices with an electrode size of 1mm x 1mm under simultaneous forward and reverse power-on cycles in a room temperature environment

[0087] 1. Customized sample carrier plate and probe fixing plate matching the device to be tested. The length-width ratio of the sample groove of the sample carrier plate is 0.003-0.005mm larger than that of the device to be tested, so as to ensure that the electrodes of the device to be tested are accurately constrained. Each measuring electrode on the probe fixing plate is provided with two gold-plated spring needles. The diameter of the measuring needle end is 0.3mm, and the diameter of the conductive needle end is 0.5mm. The relative position relationship between the probe and the device to be tested is constrained by a tolerance of not more than

[0088] 0.003mm shaft hole.

[0089] 2. The heat conducting and dissipating component 012 is composed of a copper water-cooled plate, a conventional TEC and silica gel heat conducting material. The sample carrier plate 013 is connected to the base 011 and clamps the heat conducting and dissipating component. The T-shaped thermocouple sensors are uniformly distributed in the pre-buried holes of the copper water-cooled plate, used for monitoring and feeding back the constant temperature end temperature. The output of the water-cooled machine and the conventional TEC is controlled by the upper computer software to maintain the accurate temperature control of the constant temperature end.

[0090] 3. The device to be tested is placed in the sample groove of the sample carrier plate in sequence. The probe pressing plate is pressed down through the quick pressing structure and locked by the buckle. The upper computer software is used to check the on-off state of the circuit of each station to ensure that the circuit connection is correct. The forward and reverse power-on cycle life test program is set as (on 1.2A / 4.5min + off 0A / 1.5min) x 1000 + 0A / 2h key performance test) x 5. After clicking start, the upper computer program controls the power supply to output a pulse current of 1.2A to each station. The real-time current, voltage and temperature values of each station are collected through the sensing and information acquisition module and fed back to the upper computer software. The table is stored and the time-key performance curve graph is drawn for visual observation. When the cycle number reaches the set value, it is static. First, the environment around the sample is changed to room temperature test environment and maintained for more than one hour. After the static state ends, the test program is started. The program-controlled power supply outputs 60s, 0.2A direct current and 60s, 5000Hz, 0.28A alternating current according to the upper computer program setting. The alternating current resistance ACR, dimensionless quality factor Z and response time constant t of each station sample are calculated.

[0091] 4. After the test is completed, the failure rate function is obtained according to the preset failure rule. The key performance decay curve is output and the reliability analysis report is output.

[0092] Example 3

[0093] This example introduces the simultaneous forward and reverse power-on cycle life test of a plurality of micro devices with an electrode size of 1mm x 1mm in a high temperature and high humidity environment of 85℃ / 85%.

[0094] 1. Customized sample carrier plate and probe fixing plate matching the device to be tested. The length-width ratio of the sample groove of the sample carrier plate is 0.003-0.005mm larger than that of the device to be tested, ensuring that the electrodes of the device to be tested are accurately constrained. Each measuring electrode on the probe fixing plate is provided with two gold-plated spring needles. The diameter of the measuring needle tip is 0.3mm, and the diameter of the conductive needle tip is 0.5mm. The relative position relationship between the probe and the device to be tested is constrained by the tolerance of not more than 0.003mm shaft hole.

[0095]

[0096] ​2. The heat conducting and dissipating component 012 is composed of a copper water-cooled plate (except for the sample carrier plate surface which is sprayed with protective paint), a conventional TEC, and silica gel heat conducting material. The sample carrier 013 is connected to the base 011 and clamps the heat conducting and dissipating component. The contact surface is sealed with inorganic glue to prevent the copper plate from being eroded. The base, quick pressure structure, fixed plate, and guide structure are made of stainless steel with a surface sprayed with anti-corrosion coating. The thermal expansion size of the probe and the sample carrier alignment structure is the same in a high temperature environment. A 5mm thick layer of adiabatic zero moisture expansion resin-based fiber reinforced composite material is added to the contact surface of the heat conducting and dissipating component 012 and the base 011. T-type thermocouple sensors are uniformly distributed in the pre-buried holes of the copper water-cooled plate to monitor and feedback the constant temperature end temperature. The output of the water-cooled machine and the conventional TEC is controlled by the upper computer software to maintain accurate temperature control of the constant temperature end.

[0097] 3. The device to be tested is placed in the sample groove of the sample carrier in turn. The probe pressing plate is pressed down through the quick pressure structure and locked with the buckle. The upper computer software checks the on-off state of each circuit to ensure that the circuit connection is correct. After setting the forward and reverse power cycle life test program as (forward 1.2A / 6s + reverse 1.2A / 3s) x 1000 + 0A / 2h key performance test) x 5, the upper computer program controls the power supply to output a pulse current of 1.2A to each station. The current direction is reversed through the program-controlled relay, and the real-time current, voltage, and temperature values of each station are collected through the sensing and information acquisition module and fed back to the upper computer software to form a table for storage and draw a time-key performance curve graph for visual observation. When the cycle number reaches the set value, it is static. First, the sample carrier is changed to a room temperature test environment and maintained for more than one hour. After the static state ends, the test program is started. The program-controlled power supply outputs 60s, 0.2A direct current and 60s

[0098] 5000Hz, 0.28A alternating current according to the upper computer program setting, and calculates the alternating current resistance ACR, dimensionless quality factor Z, and response time constant t of each station sample.

[0099] 4. After the test is completed, the failure rate function is obtained according to the preset failure rule, the key performance decay curve is output, and the reliability analysis report is output.

Claims

1. A monitoring device suitable for miniature thermoelectric devices, characterized in that, include: A base, wherein a base groove is provided on the base; A heat-conducting and heat-dissipating component is located in the groove of the base, and a thermocouple is installed in the heat-conducting and heat-dissipating component. The thermocouple is used to detect the temperature of the heating surface of the sample. The sample carrier plate includes a sample fixing plate for loading a sample, the sample fixing plate being located on the heat dissipation assembly, and the sample fixing plate having at least one groove for fixing the sample; A probe and thermocouple fixing plate, comprising a first positioning plate, a probe fixing plate, and a thermocouple fixing plate; the probe fixing plate is fixed to a second positioning plate and is provided with a probe array unit with a telescopic mechanism, each probe array unit being aligned with a corresponding sample for detecting the current and voltage of the sample; the thermocouple fixing plate is elastically connected to the probe fixing plate, and the thermocouple fixing plate is provided with a thermocouple conduit and a thermocouple element, the thermocouple element being fixed inside the thermocouple conduit and aligned with the cold surface of the corresponding sample for detecting the temperature of the cold surface of the sample; The positioning and guiding mechanism is fixedly connected to the second positioning plate and the sample carrier plate respectively, and is used to press down the probe and thermocouple fixing plate to align and press the probe array unit and thermocouple element with the corresponding sample.

2. The monitoring device for micro thermoelectric devices according to claim 1, characterized in that, The heat-conducting and heat-dissipating components include a heat dissipation assembly and a heat-conducting interface material. The heat-conducting interface material is located between the heat dissipation assembly and the sample carrier plate, and is used to transfer the heat from the heat-generating surface of the sample to the heat dissipation assembly. The heat dissipation assembly is used to transfer the heat to the outside.

3. The monitoring device for micro thermoelectric devices according to claim 2, characterized in that, The heat dissipation component is a water-cooled plate, a fan and heat dissipation fins with flat plates, a thermoelectric cooler, or a combination of a thermoelectric cooler and a water-cooled plate, a thermoelectric cooler and heat dissipation fins with flat plates and a fan.

4. The monitoring device for micro thermoelectric devices according to claim 2, characterized in that, The thermal interface material is a thermally conductive silicone plate, a thermally conductive graphite paper, or a thermally conductive PVDF-based boron nitride composite material.

5. The monitoring device for micro thermoelectric devices according to claim 1, characterized in that, The sample carrier plate consists of multiple plates, each plate having at least one groove for fixing the sample.

6. The monitoring device for miniature thermoelectric devices according to claim 1, characterized in that, The sample carrier plate also includes a first positioning plate, which is connected to the sample fixing plate and the positioning guide mechanism respectively. The positioning and guiding mechanism includes a positioning guide post and a motor. The first positioning plate is detachably and fixedly connected to the sample carrier plate for fixing the sample carrier plate. The first positioning plate is fixed at the bottom of the positioning guide post. The second positioning plate passes through the positioning guide post and is located above the first positioning plate. A probe and a thermocouple fixing plate are detachably fixed above the second positioning plate. The motor is connected to the second positioning plate for controlling the movement of the second positioning plate in the Z direction.

7. The monitoring device for miniature thermoelectric devices according to claim 1, characterized in that, When the thermocouple element is a thermocouple wire, the thermocouple wire is fixed inside the thermocouple conduit, and the temperature of the cold surface of the sample is measured through the thermocouple wire; Alternatively, when the thermocouple element is a thermocouple film, the thermocouple film is fixed to the end of the thermocouple conduit, and the temperature of the cold surface of the sample is measured at multiple points through the thermocouple film.

8. The monitoring device for miniature thermoelectric devices according to claim 1, characterized in that, The probe array unit includes four probes, two of which are aligned with the positive electrode of the corresponding sample, and the other two probes are aligned with the negative electrode of the corresponding sample.

9. A micro-device lifetime testing system, characterized in that, include: The sample delivery module is used for loading the sample onto the carrier plate, transferring the sample carrier plate to the inspection area, and sending the sample to the inspected area after the inspection is completed. The monitoring device for the micro thermoelectric device as described in any one of claims 1-8 is used to receive a sample and, based on instructions, align and press the probe array unit and thermocouple element with the corresponding sample, and obtain the current, voltage and temperature signals of the sample during the test. The safety protection module is used to provide early warning and monitoring of the circuit connection, current overload and abnormal temperature of the sample based on the preset safety protection program; The program control module is used to control the monitoring device of the micro thermoelectric device to perform DC or AC tests on the sample based on a preset test program, so as to realize the set test based on the set power-on system, process the obtained current, voltage and temperature signals, archive them and automatically generate reports. The sensing and information acquisition module is used to transmit current, voltage, and temperature signals to the program control module.

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