Substrate positioning structure and substrate positioning method
By designing a substrate positioning structure including a fixed ring, a limiting ring and a positioning member, the challenges of substrate positioning and warping limit in plasma etching process are solved, and effective positioning and warping limit of substrates of different thicknesses are achieved, thereby improving process efficiency and reliability.
Patent Information
- Application Number
- CN202311461248.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-06
- Publication Date
- 2025-05-06
AI Technical Summary
In the semiconductor chip manufacturing process, the plasma etching process challenges the positioning and warping limit of the substrate, especially when the substrate thickness is reduced, it is difficult for the prior art to effectively position without destroying the substrate.
A substrate positioning structure is designed, including a fixing ring, a limiting ring and a plurality of positioning members. The limit ring is connected to the fixed ring through a floating range, allowing positioning and limiting on substrates of different thicknesses.
Effective positioning and warping limit of substrates of different thicknesses are achieved, and the occurrence of substrate edge warping during plasma etching is avoided, while the substrate is not damaged, which improves the process efficiency and reliability.
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Figure CN119943731A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a substrate positioning structure and a substrate positioning method, and in particular to a substrate positioning structure and a substrate positioning method for a plasma etching device. Background Art
[0002] Plasma etching plays a very important role in today's semiconductor chip manufacturing industry, and its technology is also very mature. However, as the demand for wafer or substrate thickness reduction increases, the positioning or warping prevention of the plasma etching process is becoming more and more important. How to position or limit the wafer or substrate efficiently without damaging it is a goal that the relevant industry urgently needs to work on. Summary of the invention
[0003] The substrate positioning structure and substrate positioning method provided by the present disclosure can be used to limit substrates to be positioned with different thicknesses through the floating range configured between the fixing ring and the limiting ring.
[0004] According to an embodiment of the present disclosure, a substrate positioning structure is provided, comprising a fixed ring, a limiting ring and a plurality of positioning members. The fixed ring can be vertically displaced on a carrier. The limiting ring is coaxially arranged above the fixed ring and protrudes from a central opening of the fixed ring toward a center of the limiting ring. The positioning member is used to position the limiting ring on the fixed ring so that the limiting ring can be vertically displaced relative to the fixed ring within a floating range.
[0005] According to the substrate positioning structure of the embodiment described in the previous paragraph, the limiting ring includes an annular connecting portion and an annular positioning portion. The annular connecting portion is connected to the fixing ring. The annular positioning portion is integrally connected to the annular connecting portion, wherein the annular positioning portion extends from the annular connecting portion toward the center of the limiting ring and protrudes from the central opening of the fixing ring.
[0006] According to the substrate positioning structure of the implementation mode described in the previous paragraph, the fixing ring includes a plurality of locking holes; the limiting ring also includes a plurality of through holes, and the through holes are arranged in the annular connecting portion; each positioning member includes a locking portion, wherein each positioning member passes through each through hole and is locked in each locking hole through the locking portion.
[0007] According to the substrate positioning structure of the implementation mode described in the previous paragraph, each positioning member also includes a floating bolt portion; when each positioning member passes through each through hole and is locked in each locking hole through the locking portion, each floating bolt portion is located in each through hole, and a diameter of each floating bolt portion is smaller than a hole diameter of each through hole.
[0008] According to the substrate positioning structure of the embodiment described in the previous paragraph, a height of the floating bolt portion of each positioning member is greater than a thickness of the annular connecting portion of the limiting ring.
[0009] According to the substrate positioning structure of the embodiment described in the previous paragraph, the annular positioning portion has a holding bottom surface and an inclined surface, wherein an angle is formed between the inclined surface and the holding bottom surface, and the angle is between 0 degrees and 60 degrees.
[0010] According to the substrate positioning structure of the embodiment described in the previous paragraph, the fixing ring includes an outer ring body and an inner ring body, wherein a thickness of the inner ring body is smaller than a thickness of the outer ring body, thereby forming a first step difference portion.
[0011] According to the substrate positioning structure of the embodiment described in the previous paragraph, a thickness of the annular connecting portion of the limiting ring is smaller than a thickness of the annular positioning portion, thereby forming a second step difference portion. The first step difference portion corresponds to the second step difference portion.
[0012] According to the substrate positioning structure of the embodiment described in the previous paragraph, the floating range is between 0.5 mm and 1.1 mm.
[0013] According to another embodiment of the present disclosure, a substrate positioning method is provided, comprising driving a substrate positioning structure to vertically rise in a direction away from a carrier. A substrate to be positioned is placed on the carrier. The substrate positioning structure is driven to vertically descend toward the substrate to be positioned. When a fixing ring of the substrate positioning structure is vertically displaced to the carrier, a limiting ring of the substrate positioning structure is pressed against an edge of the substrate to be positioned. The limiting ring can vertically displace relative to the fixing ring within a floating range. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is a three-dimensional schematic diagram showing a substrate positioning structure provided according to an embodiment of the present disclosure;
[0015] Figure 2 It shows that according to Figure 1 An exploded view of the substrate positioning structure in the embodiment;
[0016] Figure 3 It shows that according to Figure 1 A cross-sectional view of a substrate positioning structure in an embodiment;
[0017] Figure 4 It shows that according to Figure 1 A three-dimensional schematic diagram of the substrate positioning structure of the embodiment in another state;
[0018] Figure 5 It shows that according to Figure 4 A cross-sectional view of a substrate positioning structure in an embodiment; and
[0019] Figure 6 FIG. 4 is a flowchart showing the steps of a substrate positioning method provided according to another embodiment of the present disclosure.
[0020] Explanation of symbols
[0021] 100: Substrate positioning structure
[0022] 110: Fixed ring
[0023] 111: Outer ring
[0024] 112: Inner ring
[0025] 113: Locking hole
[0026] 114: Connection hole
[0027] 120: Limiting ring
[0028] 121: Ring connection
[0029] 122: Ring positioning unit
[0030] 1221: Press the bottom surface
[0031] 1222: Inclined surface
[0032] 123: Perforation
[0033] 130: Positioning piece
[0034] 131: Locking part
[0035] 132: Floating bolt
[0036] 133: Stop end
[0037] 210: Carrier
[0038] 220: Lifting rod
[0039] 230: Connectors
[0040] T1: The thickness of the annular connection part of the limiting ring
[0041] T2: Height of the floating bolt of the positioning piece
[0042] G: Angle
[0043] A: Substrate to be positioned
[0044] S1, S2: gap
[0045] S10: Substrate positioning method
[0046] S11, S12, S13, S14: Steps DETAILED DESCRIPTION
[0047] Please refer to Figure 1 , which shows a three-dimensional schematic diagram of a substrate positioning structure 100 provided according to an embodiment of the present disclosure, wherein Figure 1The substrate positioning structure 100 is raised and the substrate A to be positioned (indicated at Figure 4 and Figure 5 ) status. Figure 1 It can be seen that the substrate positioning structure 100 can be applied to plasma etching equipment. It can be vertically displaced on a carrier 210 through a plurality of lifting rods 220, and the carrier 210 is used to place the substrate A to be positioned for plasma etching. When the substrate positioning structure 100 descends to the carrier 210, it can be pressed against the edge of the substrate A to be positioned, thereby limiting the edge of the substrate A to be positioned, thereby avoiding warping at the edge of the substrate A to be positioned due to thinning during the plasma etching process.
[0048] Please refer to Figure 2 and Figure 3 ,in Figure 2 It shows that according to Figure 1 An exploded view of the substrate positioning structure 100 in the embodiment, Figure 3 It shows that according to Figure 1 The cross-sectional view of the substrate positioning structure 100 in the embodiment. Figures 1 to 3 It can be seen that the substrate positioning structure 100 includes a fixed ring 110, a limiting ring 120 and a plurality of positioning members 130. The fixed ring 110 can be vertically displaced on the carrier 210, and the limiting ring 120 is coaxially arranged above the fixed ring 110 and protrudes from a central opening of the fixed ring 110 toward a center of the limiting ring 120. The positioning member 130 is used to position the limiting ring 120 on the fixed ring 110 so that the limiting ring 120 can be vertically displaced within a floating range relative to the fixed ring 110. In other words, the limiting ring 120 is connected to the fixed ring 110, and the fixed ring 110 is connected and positioned with the lifting rod 220 through a plurality of connecting members 230 via the connecting holes 114 thereon. Therefore, during operation, the limiting ring 120 will be synchronously displaced up and down along the direction vertical to the carrier 210 with the fixed ring 110. Since the limiting ring 120 protrudes from the central opening of the fixing ring 110, when the limiting ring 120 and the fixing ring 110 are synchronously lowered on the stage 210, the limiting ring 120 protruding from the central opening of the fixing ring 110 can be limited to the edge of the substrate A to be positioned. The limiting ring 120 is connected to the fixing ring 110 in a vertically displaceable manner, and thus is not limited to positioning the substrate A to be positioned with a fixed thickness.
[0049] Specifically, the limiting ring 120 may include an annular connection portion 121 and an annular positioning portion 122. The annular connection portion 121 is connected to the fixing ring 110, and the annular positioning portion 122 is integrally connected to the annular connection portion 121, wherein the annular positioning portion 122 extends from the annular connection portion 121 toward the center of the limiting ring 120 and protrudes from the central opening of the fixing ring 110; that is, the limiting ring 120 is used to press and limit the substrate A to be positioned through the annular positioning portion 122.
[0050] The fixing ring 110 includes a plurality of locking holes 113, and the limiting ring 120 further includes a plurality of through holes 123, which are disposed on the annular connecting portion 121 of the limiting ring 120, wherein the locking holes 113 and the through holes 123 correspond to each other. Each positioning member 130 includes a locking portion 131, a floating bolt portion 132, and a stopper end portion 133, wherein each positioning member 130 passes through each through hole 123 and is locked in each locking hole 113 through the locking portion 131. When each positioning member 130 is locked in each locking hole 113, each floating bolt portion 132 is located in each through hole 123, and a diameter of each floating bolt portion 132 is smaller than a hole diameter of each through hole 123. A diameter of each stopper end portion 133 is larger than a hole diameter of each through hole 123, thereby ensuring that the limiting ring 120 will not be separated from the positioning member 130.
[0051] Specifically, since the locking portion 131 of each positioning member 130 is locked in the locking holes 113 of the fixing ring 110, the fixing ring 110 cannot be displaced relative to the positioning member 130, and the diameter of the stop end 133 of each positioning member 130 is larger than the aperture of each through hole 123 of the limiting ring 120, so that the limiting ring 120 can be limited between the fixing ring 110 and the stop end 133 of each positioning member 130. The diameter of the floating bolt portion 132 of each positioning member 130 is smaller than the aperture of each through hole 123 of the limiting ring 120, that is, when each positioning member 130 is locked in the locking holes 113 of the fixing ring 110 through each through hole 123, the space between each positioning member 130 and the inner wall of each through hole 123 of the limiting ring 120 enables each positioning member 130 and the limiting ring 120 to move relative to each other. Figure 3 It can be seen that the thickness of the annular connecting portion 121 of the limiting ring 120 is T1, the height of the floating bolt portion 132 of the positioning member 130 is T2, and T2 is greater than T1. The height of T2 minus T1 is the aforementioned floating range, that is, the limiting ring 120 can be vertically displaced relative to the fixing ring 110 within this floating range.
[0052] Please refer to Figure 4 and Figure 5 ,in Figure 4 It shows that according to Figure 1 A three-dimensional schematic diagram of the substrate positioning structure 100 of the embodiment in another state, Figure 5 It shows that according to Figure 4 The cross-sectional view of the substrate positioning structure 100 in the embodiment is shown in FIG. Figure 4 and Figure 5 The substrate positioning structure 100 is lowered to the stage 210 and positions the substrate A to be positioned. Figure 4 and Figure 5It can be seen that when the substrate positioning structure 100 descends to the stage 210, the fixing ring 110 contacts the surface of the stage 210, and the limiting ring 120 presses the edge of the substrate A to be positioned with the annular positioning portion 122. Figure 5 It can be seen that, since the thickness of the substrate A to be positioned slightly protrudes from the surface of the carrier 210, a gap S1 is generated between the annular positioning portion 122 of the limiting ring 120 pressed thereon and the fixing ring 110, and a gap S2 is also generated between the annular connecting portion 121 of the limiting ring 120 and the fixing ring 110. The elastic space provided by the floating range between the limiting ring 120 and the fixing ring 110 can ensure that the substrate A to be positioned whose thickness slightly protrudes from the carrier 210 can be pressed and limited but will not be damaged by excessive pressure. In this way, when the plasma etching equipment is to perform plasma etching operations with substrates A to be positioned of different thicknesses, when the thickness of the substrate A to be positioned exceeds the carrier 210 and falls within the floating range, there is no need to replace the substrate positioning structure 100, and there is no need to worry about the substrate positioning structure 100 crushing the substrate A to be positioned whose thickness protrudes from the surface of the carrier 210. Figure 5 In an embodiment, the floating range may be between 0.5 mm and 1.1 mm, but the present disclosure is not limited thereto.
[0053] Furthermore, the annular positioning portion 122 of the stop ring 120 has a holding bottom surface 1221 and an inclined surface 1222, wherein an angle G is formed between the inclined surface 1222 and the holding bottom surface 1221, and the angle G is between 0 and 60 degrees. By configuring the inner edge of the annular positioning portion 122 of the stop ring 120 as the inclined surface 1222, it is possible to avoid the etching effect around the substrate A to be positioned being affected by the stop ring 120 during etching, which may result in poor etching effect.
[0054] Please refer to Figure 2 , Figure 3 as well as Figure 5 , the fixing ring 110 includes an outer ring body 111 and an inner ring body 112. The inner ring body 112 and the outer ring body 111 are integrally formed. The thickness of the inner ring body 112 is less than the thickness of the outer ring body 111, thereby forming a first step difference portion (not otherwise indicated in the figure). The thickness of the annular connecting portion 121 of the limiting ring 120 is less than the thickness of the annular positioning portion 122, thereby forming a second step difference portion (not otherwise indicated in the figure). The first step difference portion corresponds to the second step difference portion. Through the connection in which the first step difference portion and the second step difference portion are matched, the overall thickness required for the substrate positioning structure 100 can be reduced, and the materials required for the manufacture of the substrate positioning structure 100 can be reduced, which can effectively reduce the manufacturing cost.
[0055] In addition, in the substrate positioning structure 100 provided by the present disclosure, the materials of the fixing ring 110 and the limiting ring 120 can be but are not limited to ceramics, so as to reduce the influence of the plasma etching process.
[0056] Please refer to Figure 6 , which shows a flow chart of the steps of a substrate positioning method S10 provided according to another embodiment of the present disclosure. Figures 1 to 5 The substrate positioning structure 100 provided in the embodiment illustrates the following steps, but the substrate positioning method provided in the present disclosure is not limited to only applying Figures 1 to 5 The disclosed substrate positioning structure 100. Figure 6 It can be seen that the substrate positioning method S10 includes step S11, driving the substrate positioning structure 100 to rise vertically in a direction away from the carrier 210; step S12, placing the substrate A to be positioned on the carrier 210; step S13, driving the substrate positioning structure 100 to descend vertically toward the substrate A to be positioned; step S14, when the fixed ring 110 of the substrate positioning structure 100 is vertically displaced to the carrier 210, the limiting ring 120 of the substrate positioning structure 100 is pressed against an edge of the substrate A to be positioned, thereby limiting the edge of the substrate A to be positioned, in addition to positioning the substrate A to be positioned, the extent of the edge warping can also be limited. The limiting ring 120 can be vertically displaced relative to the fixed ring 110 within the floating range, so that it can cooperate to position the substrate A to be positioned with different thicknesses. Further details of substrate positioning can be combined with the description of the aforementioned embodiment, which will not be repeated here.
[0057] Although the present disclosure has been disclosed as above by way of embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various changes and modifications without departing from the concept and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the claims.
Claims
1. A substrate positioning structure, characterized in that: Include: A fixed ring, which can be vertically displaced and arranged on a carrier; a limiting ring, coaxially disposed above the fixing ring and protruding from a central opening of the fixing ring toward a center of the limiting ring; and A plurality of positioning members are used to position the limiting ring on the fixing ring so that the limiting ring can vertically move relative to the fixing ring within a floating range.
2. The substrate positioning structure according to claim 1, characterized in that: The limit ring includes: an annular connecting portion connected to the fixing ring; and An annular positioning portion is integrally connected to the annular connecting portion, wherein the annular positioning portion extends from the annular connecting portion toward the center of the limiting ring and protrudes from the central opening of the fixing ring.
3. The substrate positioning structure according to claim 2, characterized in that: The fixing ring comprises a plurality of locking holes; The limiting ring further comprises a plurality of through holes, which are arranged on the annular connecting portion; and Each of the positioning members includes a locking portion, wherein each of the positioning members passes through each of the through holes and is locked in each of the locking holes through the locking portion.
4. The substrate positioning structure according to claim 3, characterized in that: Each positioning member also includes a floating bolt portion; when each positioning member passes through each through hole and is locked in each locking hole through the locking portion, each floating bolt portion is located in each through hole, and a diameter of each floating bolt portion is smaller than a hole diameter of each through hole.
5. The substrate positioning structure according to claim 4, characterized in that: A height of the floating bolt portion of each positioning member is greater than a thickness of the annular connecting portion of the limiting ring.
6. The substrate positioning structure according to claim 2, characterized in that: The annular positioning portion has a pressing bottom surface and an inclined surface, wherein an angle is formed between the inclined surface and the pressing bottom surface, and the angle is between 0 degrees and 60 degrees.
7. The substrate positioning structure according to claim 2, characterized in that: The fixing ring includes an outer ring body and an inner ring body, wherein a thickness of the inner ring body is smaller than a thickness of the outer ring body, thereby forming a first step difference portion.
8. The substrate positioning structure according to claim 7, characterized in that: A thickness of the annular connecting portion of the limiting ring is smaller than a thickness of the annular positioning portion, thereby forming a second step difference portion; The first step difference portion corresponds to the second step difference portion.
9. The substrate positioning structure according to claim 1, characterized in that: The floating range is between 0.5mm and 1.1mm.
10. A substrate positioning method, characterized in that: Include: Driving a substrate positioning structure to vertically rise in a direction away from a carrier; Placing a substrate to be positioned on the carrier; Driving the substrate positioning structure to vertically descend toward the substrate to be positioned; as well as When a fixing ring of the substrate positioning structure is vertically displaced to the carrier, a limiting ring of the substrate positioning structure is pressed against an edge of the substrate to be positioned; The limiting ring can be vertically displaced relative to the fixing ring within a floating range.