Microwave power amplifier circuit board mixed-pressing laminated structure and microwave power amplifier circuit board manufacturing method
By adopting a multi-layer circuit layer structure and cross-section copper connection design in the microwave amplifier circuit board, the problem of difficulty in taking into account high integration and efficient heat dissipation in the prior art is solved, and low loss transmission and efficient heat dissipation of microwave signals are achieved.
Patent Information
- Application Number
- CN202510166079.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-14
- Publication Date
- 2025-05-06
AI Technical Summary
Existing microwave high-power amplifier products are difficult to take into account high integration and efficient heat dissipation. Especially in scenarios where the frequency exceeds 10GHz, it is difficult to achieve high integration in the design of double-sided laminates, and the stacked mixed circuit board needs to consider the transmission continuity and efficient heat dissipation of microwave signals.
A multi-layer circuit layer structure is adopted that is stacked from top to bottom in sequence, with a dielectric layer between each two layers, the thermal expansion coefficients of the dielectric layer are the same or similar, and the edge of the circuit layer is connected through cross-sectional copper. This structure combines the copper depositing and electroplating processes for surface treatment to ensure the transmission and heat dissipation of microwave signals.
It achieves a balance between high integration and efficient heat dissipation, reduces the loss of microwave signal, and simplifies the processing process of the circuit board.
Smart Images
Figure CN119946984A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of microwave power amplifiers, and in particular to a microwave power amplifier circuit board mixed-pressure laminated structure and a method for manufacturing the microwave power amplifier circuit board. Background Art
[0002] RF microwave signal power amplifier is one of the core components of radar and communication systems, and is widely used in satellite communication, microwave point-to-point communication, electronic countermeasures and other fields. With the development of new generation communication and radar systems, the system integration requirements are getting higher and higher, and the requirements for high integration of RF microwave power amplifiers are also becoming more stringent.
[0003] After years of development, the existing microwave high-power amplifier product circuit boards still use standard finished PTFE double-sided laminates for circuit processing, especially for microwave power amplifier products with operating frequencies above 10GHz. It is difficult to achieve the high integration requirements of the product by using double-sided laminates for circuit board design. In addition, if a laminated (multi-layer) mixed-pressure circuit board is used for microwave high-power amplifier design, the transmission continuity and efficient heat dissipation of the microwave signal need to be considered. It can be seen that when designing microwave power amplifier products, their high integration and efficient heat dissipation requirements run counter to each other, and it is difficult to take both into account in the existing technology. Summary of the invention
[0004] The purpose of the present invention is to provide a microwave power amplifier circuit board mixed pressure laminated structure and a microwave power amplifier circuit board manufacturing method. The microwave power amplifier circuit board mixed pressure laminated structure has high integration, the manufactured microwave power amplifier circuit board has good heat dissipation effect, small microwave transmission signal loss and is easy to process.
[0005] In order to achieve the above-mentioned purpose, on the one hand, the present invention provides a microwave power amplifier circuit board mixed pressure laminated structure, which includes a plurality of circuit layers stacked in sequence from top to bottom, a dielectric layer is provided between every two adjacent circuit layers, the thermal expansion coefficient of each dielectric layer is the same or similar, and the outermost edges of all circuit layers except the first layer are connected by cross-section copper.
[0006] Preferably, the multi-layer circuit layer includes a top circuit layer, a second circuit layer, a third circuit layer and a bottom circuit layer, and the dielectric layer between adjacent circuit layers includes a first dielectric layer, a second dielectric layer and a third dielectric layer.
[0007] Preferably, the top circuit layer, the first dielectric layer and the second circuit layer are standard finished PTFE double-sided laminates.
[0008] Preferably, the third circuit layer, the third dielectric layer and the bottom circuit layer are standard finished FR-4 epoxy glass cloth double-sided laminates.
[0009] Preferably, the thickness of the first dielectric layer is greater than or equal to the thickness of the third dielectric layer.
[0010] Preferably, the second circuit layer, the third circuit layer and the bottom circuit layer are connected via cross-sectional copper.
[0011] Preferably, the thickness of the cross-section copper is 0.5-2Oz.
[0012] Preferably, the second dielectric layer is FR-4 epoxy glass cloth.
[0013] On the other hand, the present invention provides a method for manufacturing a microwave power amplifier circuit board, which includes using the mixed-pressure laminated structure of the microwave power amplifier circuit board as described above to perform circuit board layout and wiring, wherein components with low power consumption are placed on the upper surface of the laminated board, and components with high power consumption and radio frequency microwave mode conversion passive components are placed on the upper surface of the double-layer board; at the same time, devices that generate high heat are placed in an area with fewer layers of the circuit board, and devices that generate low heat are placed in an area with more layers of the circuit board.
[0014] Preferably, the cross-sectional copper in the hybrid laminated structure of the microwave power amplifier circuit board is surface treated by a process combining copper deposition and copper electroplating, and all surface copper leakage areas on the hybrid laminated structure of the microwave power amplifier circuit board are surface treated by gold deposition or gold plating.
[0015] According to the above technical scheme, the present invention connects the outermost edges of the circuit layers in the multi-layer circuit layers stacked from top to bottom through cross-section copper. The copper plating process can avoid the microwave signal transmission problem after the microwave power amplifier circuit board is mixed and stacked, and effectively solves the problem of very large signal loss. At the same time, when the circuit board is laid out and wired with the mixed and stacked structure of the microwave power amplifier circuit board, the device with high heat generation is placed in the area with fewer layers of the circuit board to shorten its heat dissipation path so that the heat generated by it can be dissipated as quickly as possible. In addition, placing the device with high heat generation in the area with fewer layers of the circuit board can also avoid the discontinuity of microwave transmission and eliminate the influence on the signal. It can be seen that the present invention takes into account both high integration and efficient heat dissipation, and also achieves the technical effect of low signal loss in microwave transmission. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a structural schematic diagram of a mixed-pressure laminated structure of a microwave power amplifier circuit board provided by the present invention;
[0017] Figure 2 It is a schematic diagram of a mixed-pressure laminated structure PCB of a microwave power amplifier circuit board provided according to the present invention.
[0018] Description of Reference Numerals
[0019] 1- Top circuit layer 2- First dielectric layer
[0020] 3- Second circuit layer 4- Second dielectric layer
[0021] 5- The third circuit layer 6- The third dielectric layer
[0022] 7- Bottom circuit layer 8- Cross-section copper DETAILED DESCRIPTION
[0023] The specific implementation of the present invention is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present invention, and is not used to limit the present invention.
[0024] In the present invention, unless otherwise stated, directional words such as "up, down, top, bottom, inside, outside" contained in the terms merely represent the orientation of the terms in normal usage, or are common names understood by those skilled in the art, and should not be regarded as limitations on the terms.
[0025] See also Figure 1 The present invention provides a microwave power amplifier circuit board mixed pressure laminated structure, which includes multiple circuit layers stacked in sequence from top to bottom, a dielectric layer is provided between every two adjacent circuit layers, the thermal expansion coefficient of each dielectric layer is the same or similar, and the outermost edges of all the circuit layers except the first layer are connected by a cross-section copper 8.
[0026] In a specific embodiment, the multiple circuit layers preferably include a top circuit layer 1, a second circuit layer 3, a third circuit layer 5 and a bottom circuit layer 7, and the dielectric layers between adjacent circuit layers include a first dielectric layer 2, a second dielectric layer 4 and a third dielectric layer 6. The embodiment of the invention is not limited to four circuit layers, and may be six circuit layers, eight circuit layers, or more circuit layers, which can be selected and designed as needed.
[0027] In this embodiment, preferably, the top circuit layer 1, the first dielectric layer 2 and the second circuit layer 3 are standard finished PTFE double-sided laminates. Specifically, the standard finished PTFE double-sided laminates can be RO3003, RO4350, or RS300.
[0028] In this embodiment, preferably, the third circuit layer 5, the third dielectric layer 6 and the bottom circuit layer 7 are standard finished FR-4 epoxy glass cloth double-sided laminated boards. Specifically, the standard finished FR-4 epoxy glass cloth double-sided laminated boards may be S1000-2M.
[0029] In this embodiment, the thickness of the first dielectric layer 2 and the third dielectric layer 6 of the mixed pressure laminate structure is kept consistent as much as possible, and the general cut-off thickness is 10 mil, 20 mil or 30 mil. If the thickness of the first dielectric layer 2 and the third dielectric layer 6 cannot be consistent, the thickness of the third dielectric layer 6 must be thinner than the first dielectric layer 2.
[0030] In this embodiment, the second circuit layer 3, the third circuit layer 5 and the bottom circuit layer 7 are connected by the cross-sectional copper 8. Meanwhile, the thickness of the cross-sectional copper 8 is 0.5-2Oz, and in practical applications, 0.5Oz, 1Oz, 1.5Oz or 2Oz can be selected.
[0031] In this embodiment, preferably, the second dielectric layer 4 is FR-4 epoxy glass cloth. Specifically, the FR-4 epoxy glass cloth may be S1000-2.
[0032] The present invention further provides a method for manufacturing a microwave power amplifier circuit board based on the above-mentioned microwave power amplifier circuit board mixed pressure laminated structure, and the method for manufacturing a microwave power amplifier circuit board includes using the above-mentioned microwave power amplifier circuit board mixed pressure laminated structure to perform circuit board layout and wiring. Figure 2 As shown, during layout and routing, components with low power consumption are placed on the upper surface of the laminate, components with high power consumption and RF microwave mode conversion passive components are placed on the upper surface of the double-layer board; at the same time, devices that generate high heat are placed in areas with fewer layers of the circuit board, and devices that generate low heat are placed in areas with more layers of the circuit board.
[0033] In addition, the cross-sectional copper 8 in the hybrid laminated structure of the microwave power amplifier circuit board is surface treated by a process combining copper deposition and copper electroplating, and all surface copper leakage areas on the hybrid laminated structure of the microwave power amplifier circuit board are surface treated by gold deposition or gold plating.
[0034] Through the above technical scheme, the outermost edges of the circuit layers in the multi-layer circuit layers stacked from top to bottom are connected by cross-section copper. The copper plating process can avoid the microwave signal transmission problem after the microwave power amplifier circuit board is mixed and stacked, and effectively solves the problem of very large signal loss. At the same time, when the circuit board is laid out and wired with the mixed and stacked structure of the microwave power amplifier circuit board, the device with high heat generation is placed in the area with fewer layers of the circuit board to shorten its heat dissipation path so that the heat generated by it can be dissipated as quickly as possible. In addition, placing the device with high heat generation in the area with fewer layers of the circuit board can also avoid the discontinuity of microwave transmission and eliminate the influence on the signal. It can be seen that the present invention takes into account both high integration and efficient heat dissipation, and also achieves the technical effect of low microwave transmission signal loss.
[0035] The preferred embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited thereto. Within the technical concept of the present invention, the technical solution of the present invention can be subjected to a variety of simple modifications, including the combination of various specific technical features in any suitable manner. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations. However, these simple modifications and combinations should also be regarded as the contents disclosed by the present invention and belong to the protection scope of the present invention.
Claims
1. A microwave power amplifier circuit board mixed pressure laminated structure, characterized in that: The microwave power amplifier circuit board mixed pressure laminated structure comprises a plurality of circuit layers stacked in sequence from top to bottom, a dielectric layer is provided between every two adjacent circuit layers, the thermal expansion coefficients of each dielectric layer are the same or similar, and the outermost edges of all the circuit layers except the first layer are connected by cross-section copper (8).
2. The microwave power amplifier circuit board mixed pressure laminate structure according to claim 1 is characterized in that: The multiple circuit layers include a top circuit layer (1), a second circuit layer (3), a third circuit layer (5) and a bottom circuit layer (7), and the dielectric layers between adjacent circuit layers include a first dielectric layer (2), a second dielectric layer (4) and a third dielectric layer (6).
3. The microwave power amplifier circuit board mixed pressure laminate structure according to claim 2, characterized in that: The top circuit layer (1), the first dielectric layer (2) and the second circuit layer (3) are standard finished PTFE double-sided laminates.
4. The microwave power amplifier circuit board mixed pressure laminate structure according to claim 3 is characterized in that: The third circuit layer (5), the third dielectric layer (6) and the bottom circuit layer (7) are standard finished FR-4 epoxy glass cloth double-sided laminates.
5. The microwave power amplifier circuit board mixed pressure laminate structure according to any one of claims 2 to 4, characterized in that: The thickness of the first dielectric layer (2) is greater than or equal to the thickness of the third dielectric layer (6).
6. The microwave power amplifier circuit board mixed pressure laminate structure according to any one of claims 2 to 4, characterized in that: The second circuit layer (3), the third circuit layer (5) and the bottom circuit layer (7) are connected via the cross-sectional copper (8).
7. The microwave power amplifier circuit board mixed pressure laminate structure according to claim 6, characterized in that: The thickness of the cross-section copper (8) is 0.5-2Oz.
8. The microwave power amplifier circuit board mixed pressure laminate structure according to any one of claims 2 to 4, characterized in that: The second dielectric layer (4) is FR-4 epoxy glass cloth.
9. A method for manufacturing a microwave power amplifier circuit board, characterized in that: The method for manufacturing a microwave power amplifier circuit board includes using the mixed-pressure laminated structure of the microwave power amplifier circuit board as described in any one of claims 1 to 8 to perform circuit board layout and wiring, wherein components with low power consumption are placed on the upper surface of the laminated board, and components with high power consumption and radio frequency microwave mode conversion passive components are placed on the upper surface of the double-layer board; at the same time, devices that generate high heat are placed in an area with fewer layers of the circuit board, and devices that generate low heat are placed in an area with more layers of the circuit board.
10. The method for manufacturing a microwave power amplifier circuit board according to claim 9, characterized in that: The cross-section copper (8) in the microwave power amplifier circuit board mixed pressure laminated structure is surface treated by a process combining copper deposition and copper electroplating, and all surface copper leakage areas on the microwave power amplifier circuit board mixed pressure laminated structure are surface treated by gold deposition or gold plating.