Semiconductor chip packaging process
Through the packaging process of composite printed circuit boards, solid crystals and bond wires are directly carried out, which solves the high cost problem of lead frames and injection molds in the existing process, and realizes a low-cost semiconductor chip packaging process.
Patent Information
- Application Number
- CN202510076315.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-17
- Publication Date
- 2025-05-06
AI Technical Summary
The existing semiconductor chip packaging process requires independent design of lead frame molds and injection molds, resulting in large investment in capital and a special EMC injection molding machine is required, which increases manufacturing costs.
A composite printed circuit board packaging process is adopted to form substrate units and dam units through circuit printing and window opening, and then compositely form a closed structure, directly performing crystal solidification and welding wires, eliminating the lead frame and plastic sealing steps.
There is no need to set up a lead frame and perform plastic sealing, which saves the opening cost and time of lead frame molds and injection molds, and also saves the cost of the injection molding machine, greatly reduces the manufacturing cost and increases mass production time.
Smart Images
Figure CN119947003A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductors, and in particular to a semiconductor chip packaging process. Background Art
[0002] The existing semiconductor chip packaging process generally includes the following steps: Die bonding: fix the chip to the lead frame; Wirebond: Connect the bonding pads of the die to the corresponding pins of the lead frame through metal (AuSnCuAl) wires and / or conductive resins; Plastic packaging: Injection molding protection for chips, lead frames, and metal wires; Rib cutting: Cut the ribs of the lead frame to obtain semiconductor chips.
[0003] However, the existing semiconductor chip packaging process has the following problems: 1. For different semiconductor chips, the corresponding lead frame mold needs to be independently designed and the lead frame mold needs to be opened accordingly, which requires a large capital investment; 2. A special EMC injection molding machine is required for plastic packaging, and corresponding injection molds need to be designed for different semiconductor chips, which requires a large capital investment.
[0004] In view of the existence of the above problems, it is necessary to study a semiconductor chip packaging process with low manufacturing cost. Summary of the invention
[0005] The object of the present invention is to provide a semiconductor chip packaging process with low manufacturing cost.
[0006] In order to achieve the above object, the solution of the present invention is: A semiconductor chip packaging process comprises the following steps in sequence: Step 1: Printing circuits on a blank first printed circuit board, so that the first printed circuit board forms a plurality of substrate units, each of which has a connecting circuit; Opening windows on a blank second printed circuit board, so that the second printed circuit board forms a plurality of dam units, each of which forms a cavity in the middle; Step 2: Compounding the first printed circuit board with the second printed circuit board, so that each substrate unit of the first printed circuit board is respectively connected with each dam unit of the second printed circuit board so that each substrate unit respectively closes the bottom opening of the cavity of each dam unit; Step 3: performing die bonding and wire bonding on each substrate unit so that the semiconductor wafer fits into the cavity of the dam unit and is electrically connected to the connection circuit of the substrate unit; Step 4: Compounding the third printed circuit board with the second printed circuit board, so that the multiple cover plate units of the third printed circuit board respectively close the top openings of the cavities of the respective dam units of the second printed circuit board, thereby obtaining multiple connected semiconductor chips; the semiconductor chip includes the cover plate unit, the dam unit and the substrate unit compounded in sequence from top to bottom, and a semiconductor wafer connected to the connection circuit of the substrate unit; Step 5: cutting the first printed circuit board, the second printed circuit board and the third printed circuit board to separate the semiconductor chips.
[0007] One side of the third printed circuit board is covered with an adhesive film; in step four, the third printed circuit board is compounded with the second printed circuit board by pressing the third printed circuit board with the second printed circuit board so that the adhesive film bonds the third printed circuit board with the second printed circuit board.
[0008] The adhesive film is made of PP or epoxy resin.
[0009] In step one, a window is opened on a blank second printed circuit board and then the second printed circuit board is laminated so that one side of the second printed circuit board is covered with an adhesive film; in step two, the first printed circuit board and the second printed circuit board are laminated by pressing the first printed circuit board and the second printed circuit board so that the adhesive film bonds the first printed circuit board and the second printed circuit board.
[0010] The adhesive film is made of PP or epoxy resin.
[0011] The method of performing die bonding and wire bonding on the substrate unit is: firstly fix the semiconductor wafer to the substrate unit by glue, and then electrically connect the semiconductor wafer to the connection circuit of the substrate unit by conductive wire.
[0012] The substrate unit also has pins for connecting circuit connections.
[0013] The substrate units of the first printed circuit board are arranged in an array; the dam units of the second printed circuit board are arranged in an array; and the cover units of the third printed circuit board are arranged in an array.
[0014] After adopting the above scheme, the semiconductor chip packaging process of the present invention does not need to set up a lead frame and perform plastic sealing, so that the lead frame mold and the injection mold can be eliminated, and then the mold opening cost and mold opening time of the lead frame mold and the injection mold are eliminated, and the cost of the injection molding machine is also eliminated, thereby greatly reducing the manufacturing cost and helping to increase the mass production time of semiconductor chips; in addition, the processing of the first printed circuit board and the second printed circuit board of the present invention can be based on the existing circuit board process, and the design is flexible, which can meet the design requirements of different semiconductor chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the process flow of the present invention.
[0016] Figure 2 It is a schematic structural diagram of the semiconductor chip of the present invention.
[0017] Description of labels: Semiconductor chip A, First printed circuit board 1, substrate unit 11, connecting circuit 111, pin 112, The second printed circuit board 2, the dam unit 21, the cavity 211, The third printed circuit board 3, the cover unit 31, Semiconductor wafer 4, Adhesive film 5, Adhesive film 6, Conductive thread 7. DETAILED DESCRIPTION
[0018] In order to further explain the technical solution of the present invention, the present invention is described in detail below through specific embodiments.
[0019] like Figure 1 and Figure 2 As shown, the present invention discloses a semiconductor chip packaging process, which includes the following steps in sequence: Step 1: Printing circuits on a blank first printed circuit board 1, so that the first printed circuit board 1 forms a plurality of substrate units 11, and the substrate units 11 have connecting circuits 111; Opening windows on a blank second printed circuit board 2, so that the second printed circuit board 2 forms a plurality of dam units 21, and a cavity 211 is formed in the middle of the dam unit 21; Step 2: Compounding the first printed circuit board 1 and the second printed circuit board 2, so that each substrate unit 11 of the first printed circuit board 1 and each dam unit 21 of the second printed circuit board 2 are respectively connected to each other so that each substrate unit 11 respectively closes the bottom opening of the cavity 211 of each dam unit 21; Step 3: performing die bonding and wire bonding on each substrate unit 11 , so that the semiconductor chip 4 fits into the cavity 211 of the dam unit 21 and is electrically connected to the connection circuit 111 of the substrate unit 11 ; Step 4: Compounding the third printed circuit board 3 with the second printed circuit board 2, so that the multiple cover units 31 of the third printed circuit board 3 respectively close the top openings of the cavities 211 of the respective dam units 21 of the second printed circuit board 2, thereby obtaining multiple connected semiconductor chips A; the semiconductor chip A includes the cover unit 31, the dam unit 21 and the substrate unit 11 compounded in sequence from top to bottom, and the semiconductor wafer 4 connected to the connection circuit 111 of the substrate unit 11; Step 5: cutting the first printed circuit board 1 , the second printed circuit board 2 and the third printed circuit board 3 to separate the semiconductor chips A.
[0020] From the above, it can be seen that the semiconductor chip packaging process of the present invention does not need to set up a lead frame and perform plastic sealing, so that the lead frame mold and the injection mold can be eliminated, and the mold opening cost and mold opening time of the lead frame mold and the injection mold are eliminated, and the cost of the injection molding machine is also eliminated, thereby greatly reducing the manufacturing cost and helping to increase the mass production time of the semiconductor chip A; in addition, the processing of the first printed circuit board 1 and the second printed circuit board 2 of the present invention can be based on the existing circuit board process, and the design is flexible, which can meet the design requirements of different semiconductor chips A.
[0021] In step one, when printing the circuit on the blank first printed circuit board 1, the substrate unit 11 formed by the first printed circuit board 1 also has pins 112 connected to the connecting circuit 111, so that the semiconductor chip A can be directly soldered to the circuit board, facilitating the application of the semiconductor chip A.
[0022] In step one, after opening a window on the blank second printed circuit board 2, the second printed circuit board 2 can be laminated so that one side of the second printed circuit board 2 is covered with an adhesive film 6, and the material of the adhesive film 6 can be PP or epoxy resin; and in step two, the first printed circuit board 1 and the second printed circuit board 2 are composited in the following manner: the first printed circuit board 1 and the second printed circuit board 2 are pressed together so that the adhesive film 6 bonds the first printed circuit board 1 and the second printed circuit board 2, so that the composite method of the first printed circuit board 1 and the second printed circuit board 2 is simple.
[0023] One side of the third printed circuit board 3 may be covered with an adhesive film 5, and the material of the adhesive film 5 may be PP or epoxy resin; and in step four, the third printed circuit board 3 and the second printed circuit board 2 are compounded in the following manner: the third printed circuit board 3 and the second printed circuit board 2 are pressed together, so that the adhesive film 5 bonds the third printed circuit board 3 and the second printed circuit board 2, so that the compounding method of the third printed circuit board 3 and the second printed circuit board 2 is simple.
[0024] In step three, the substrate unit 11 is bonded and wired as follows: first, the semiconductor chip 4 is fixed to the substrate unit 11 by glue, and then the semiconductor chip 4 is electrically connected to the connection circuit 111 of the substrate unit 11 by a conductive wire 7 (such as a gold wire, an aluminum wire, a copper wire or an alloy wire).
[0025] In an embodiment of the present invention, the first printed circuit board 1, the second printed circuit board 2 and the third printed circuit board 3 may specifically be BT boards; the respective substrate units 11 of the first printed circuit board 1 may be arranged in an array, the respective dam units 21 of the second printed circuit board 2 may also be arranged in an array, and the respective cover units 31 of the third printed circuit board 3 may also be arranged in an array; thus, in step five, the first printed circuit board 1, the second printed circuit board 2 and the third printed circuit board 3 may be conveniently cut horizontally and vertically to separate the respective semiconductor chips A.
[0026] The above embodiments and drawings do not limit the product form and style of the present invention. Any appropriate changes or modifications made by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the present invention.
Claims
1. A semiconductor chip packaging process, characterized in that: The steps are as follows: Step 1: Printing circuits on a blank first printed circuit board, so that the first printed circuit board forms a plurality of substrate units, each of which has a connecting circuit; Opening windows on a blank second printed circuit board, so that the second printed circuit board forms a plurality of dam units, each of which forms a cavity in the middle; Step 2: Compounding the first printed circuit board with the second printed circuit board, so that each substrate unit of the first printed circuit board is respectively connected with each dam unit of the second printed circuit board so that each substrate unit respectively closes the bottom opening of the cavity of each dam unit; Step 3: performing die bonding and wire bonding on each substrate unit so that the semiconductor wafer fits into the cavity of the dam unit and is electrically connected to the connection circuit of the substrate unit; Step 4: Compounding the third printed circuit board with the second printed circuit board, so that the multiple cover plate units of the third printed circuit board respectively close the top openings of the cavities of the respective dam units of the second printed circuit board, thereby obtaining multiple connected semiconductor chips; the semiconductor chip includes the cover plate unit, the dam unit and the substrate unit compounded in sequence from top to bottom, and a semiconductor wafer connected to the connection circuit of the substrate unit; Step 5: Cut the first printed circuit board, the second printed circuit board and the third printed circuit board to separate the semiconductor chips.
2. The semiconductor chip packaging process according to claim 1, characterized in that: One side of the third printed circuit board is covered with an adhesive film; in step four, the third printed circuit board is compounded with the second printed circuit board by pressing the third printed circuit board with the second printed circuit board so that the adhesive film bonds the third printed circuit board with the second printed circuit board.
3. The semiconductor chip packaging process according to claim 2, wherein: The adhesive film is made of PP or epoxy resin.
4. The semiconductor chip packaging process according to claim 1, wherein: In step one, a window is opened on a blank second printed circuit board and then the second printed circuit board is laminated so that one side of the second printed circuit board is covered with an adhesive film; in step two, the first printed circuit board and the second printed circuit board are laminated by pressing the first printed circuit board and the second printed circuit board so that the adhesive film bonds the first printed circuit board and the second printed circuit board.
5. The semiconductor chip packaging process according to claim 4, characterized in that: The adhesive film is made of PP or epoxy resin.
6. The semiconductor chip packaging process according to claim 1, wherein: The method of performing die bonding and wire bonding on the substrate unit is: firstly fix the semiconductor wafer to the substrate unit by glue, and then electrically connect the semiconductor wafer to the connection circuit of the substrate unit by conductive wire.
7. The semiconductor chip packaging process according to claim 1, wherein: The substrate unit also has pins for connecting circuit connections.
8. The semiconductor chip packaging process according to claim 1, wherein: The substrate units of the first printed circuit board are arranged in an array; the dam units of the second printed circuit board are arranged in an array; and the cover units of the third printed circuit board are arranged in an array.