Heat dissipation assembly and electronic equipment

Abstract

The invention provides a heat dissipation assembly and electronic equipment. The heat dissipation assembly provided by the embodiment of the invention comprises a flexible heat transfer layer; the first cooling fin is attached to one side of the flexible heat transfer layer, the first cooling fin comprises a first shell and a first phase change material, the first shell is provided with a first containing cavity, the first phase change material is located in the first containing cavity, and the first shell is provided with a second containing cavity; and the phase change temperature T1 of the first phase change material is more than or equal to 30 DEG C and less than or equal to 45 DEG C. When the heat dissipation assembly is applied to the electronic equipment, the temperature rise of the electronic equipment can be delayed, and the transient temperature rise of the electronic equipment is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of electronics, and in particular to a heat dissipation component and an electronic device. Background Art

[0002] For non-foldable electronic devices (also known as candy-bar phones), heat dissipation can be achieved by using a vapor chamber (VC) and a heat pipe. However, vapor chambers and heat pipes cannot withstand long-term bending. Therefore, when they are used in foldable electronic devices (also known as folding phones), there is a huge temperature difference between the upper and lower middle frames or the left and right middle frames of the folding phone. As a result, the heat dissipation area of ​​the folding phone is sharply reduced. Therefore, the temperature rise of the folding phone is significantly worse than that of a candy-bar phone. Summary of the invention

[0003] In a first aspect, an embodiment of the present application provides a heat dissipation assembly, comprising:

[0004] a flexible heat transfer layer; and

[0005] A first heat sink is arranged in contact with one side of the flexible heat transfer layer, the first heat sink comprises a first shell and a first phase change material, the first shell has a first receiving cavity, the first phase change material is located in the first receiving cavity, and the phase change temperature T1 of the first phase change material is in the range of 30°C≤T1≤45°C.

[0006] In a second aspect, an embodiment of the present application provides an electronic device, comprising:

[0007] A display screen, wherein the display screen has a display surface;

[0008] The heat dissipation component described in the embodiment of the present application is arranged on a side of the display screen away from the display surface;

[0009] A middle frame, the middle frame being arranged on a side of the heat dissipation component away from the display screen;

[0010] A central processing unit, wherein the central processing unit is carried by the middle frame, and the orthographic projection of the central processing unit on the surface of the heat dissipation component facing the middle frame falls within the range of the first heat sink. The heat dissipation component is used to dissipate heat for the electronic device. The central processing unit is electrically connected to the display screen for controlling the display screen to display.

[0011] The heat dissipation component of the present application includes a flexible heat transfer layer and a first heat sink, the first heat sink is arranged in contact with one side of the flexible heat transfer layer, the first heat sink includes a first phase change material, and the phase change temperature T1 of the first phase change material is in the range of: 30°C ≤ T1 ≤ 45°C; in this way, when the heat dissipation component is applied to electronic equipment, the first phase change material can absorb heat through phase change and keep its own temperature unchanged, thereby delaying the temperature rise of the electronic equipment and effectively improving the transient temperature rise of the electronic equipment. In addition, the flexible heat transfer layer can further quickly diffuse the temperature of the first heat sink to the plane of the entire electronic equipment, thereby playing a role in balancing the temperature to a certain extent, and expanding the heat dissipation area of ​​the heat dissipation component, thereby further improving the heat dissipation effect of the heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 It is a schematic structural diagram of a heat dissipation component according to an embodiment of the present application.

[0014] Figure 2 It is a structural schematic diagram of a heat dissipation component of another embodiment of the present application.

[0015] Figure 3 It is a schematic structural diagram of a first heat sink according to an embodiment of the present application.

[0016] Figure 4 It is a structural schematic diagram of the first shell of an embodiment of the present application.

[0017] Figure 5 It is a structural schematic diagram of a heat dissipation component of another embodiment of the present application.

[0018] Figure 6 It is a structural schematic diagram of a heat dissipation component of another embodiment of the present application.

[0019] Figure 7 It is a structural schematic diagram of a heat dissipation component of another embodiment of the present application.

[0020] Figure 8 It is a structural schematic diagram of a heat dissipation component of another embodiment of the present application.

[0021] Fig. 9 It is a schematic structural diagram of a second heat sink according to an embodiment of the present application.

[0022] Fig.10It is a structural schematic diagram of the second shell of an embodiment of the present application.

[0023] Fig.11 It is a temperature rise test curve diagram of Example 1 and Comparative Example 1 of the present application.

[0024] Fig.12 It is a temperature rise test curve chart of Examples 2 to 4 of the present application and Comparative Example 2.

[0025] Fig.13 It is a schematic diagram of the structure of an electronic device according to an embodiment of the present application.

[0026] Fig.14 It is a schematic cross-sectional structural diagram of an electronic device according to an embodiment of the present application.

[0027] Fig.15 It is a circuit block diagram of an electronic device according to an embodiment of the present application.

[0028] Description of reference numerals:

[0029] 100-heat dissipation component, 10-flexible heat transfer layer, 30-first heat sink, 30a-first heat storage part, 30b-first heat equalization part, 31-first shell, 311-first receiving cavity, 312-second receiving cavity, 313-first outer frame part, 3131-first outer frame sub-part, 3133-second outer frame sub-part, 314-first plate body part, 315-second plate body part, 316-third plate body part, 32-first phase change material, 33-first liquid absorbent core, 50-second heat sink, 50a-second heat storage part, 50b-second heat equalization part Points, 51-second shell, 511-third receiving cavity, 512-fourth receiving cavity, 513-second outer frame portion, 5131-third outer frame sub-portion, 5133-fourth outer frame sub-portion, 514-fourth plate body portion, 515-fifth plate body portion, 516-sixth plate body portion, 52-second phase change material, 53-second liquid absorbent core, 200-electronic device, 210-display screen, 220-middle frame, 221-first middle frame, 222-rotating shaft, 223-second middle frame, 230-central processing unit, 250-memory, 270-camera module. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0032] The technical solutions in the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0033] It should be noted that, for the convenience of explanation, in the embodiments of the present application, the same figure marks represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0034] When the heat dissipation solution of non-foldable electronic devices (also known as candy-bar phones) is applied to foldable electronic devices, the temperature difference between the two middle frames of the foldable electronic devices is extremely large, and the heat dissipation area of ​​the foldable electronic devices is sharply reduced. Therefore, the temperature rise of the whole device is significantly worse than that of a candy-bar phone.

[0035] See also Figure 1 The embodiment of the present application provides a heat dissipation component 100, which includes a flexible heat transfer layer 10 and a first heat sink 30. The first heat sink 30 is arranged to adhere to one side of the flexible heat transfer layer 10. The first heat sink 30 includes a first shell 31 and a first phase change material 32 (not shown). The first shell 31 has a first receiving cavity 311. The first phase change material 32 is located in the first receiving cavity 311. The phase change temperature T1 of the first phase change material 32 is in the range of: 30℃≤T1≤45℃.

[0036] The heat dissipation component 100 of the embodiment of the present application can be applied to foldable electronic devices such as foldable mobile phones, foldable tablet computers, and foldable e-readers to dissipate heat from the foldable electronic devices to prevent the temperature of the foldable electronic devices from rising suddenly and affecting the user experience. In the embodiment of the present application, the foldable electronic device is illustrated and described using a foldable mobile phone as an example, which should not be understood as a limitation on the application scenario of the heat dissipation component 100 of the present application, nor should it be understood as a limitation on the foldable electronic device of the present application. In addition, it should be noted that the heat dissipation component 100 of the present application can also be used for non-foldable electronic devices.

[0037] It should be noted that after the first phase change material 32 reaches or is heated to the phase change temperature, it can absorb heat, undergo phase change, store the heat, and maintain a constant temperature.

[0038] It can be understood that the first receiving chamber 311 is a sealed chamber.

[0039] It should be noted that when the heat dissipation assembly 100 of the present application is applied to an electronic device (a foldable electronic device or a non-foldable electronic device), the heat dissipation assembly 100 is disposed adjacent to the main heat source of the electronic device, such as a central processing unit (CPU for short). The first heat sink 30 is closer to the main heat source of the electronic device than the flexible heat transfer layer 10.

[0040] It should be noted that the area of ​​the flexible heat transfer layer 10 is greater than the area of ​​the first heat sink 30. It can be understood that the orthographic projection of the first heat sink 30 on the surface of the flexible heat transfer layer 10 facing the first heat sink 30 falls within the range of the surface of the flexible heat transfer layer 10 facing the first heat sink 30. It can also be understood that along the stacking direction perpendicular to the flexible heat transfer layer 10 and the first heat sink 30, the flexible heat transfer layer 10 protrudes from the first heat sink 30. It can also be understood that the orthographic projection of the first heat sink 30 on the surface of the flexible heat transfer layer 10 facing the first heat sink 30 covers part of the flexible heat transfer layer 10. When the heat dissipation assembly 100 is applied to a foldable electronic device, the first heat sink 30 is located in one of the middle frames of the foldable electronic device, and the flexible heat transfer layer 10 extends to the position of the rotation axis and the other middle frame of the foldable electronic device.

[0041] Optionally, the phase change temperature T1 of the first phase change material 32 may be, but is not limited to, 30°C, 32°C, 34°C, 36°C, 38°C, 40°C, 42°C, 44°C, 45°C, etc. If the phase change temperature of the first phase change material 32 is too high, the first phase change material 32 of the first heat sink 30 will only undergo phase change when the temperature rises to a higher level, which will make the user feel uncomfortable and affect the user experience of the electronic device using the heat dissipation component 100; if the first phase change temperature is too low, the first phase change material 32 will completely undergo phase change at room temperature, causing the first phase change material 32 to lose its heat storage capacity. When applied to electronic equipment, it cannot dissipate heat or prevent the temperature of the electronic equipment from rising suddenly.

[0042] Furthermore, the phase change temperature T1 of the first phase change material 32 is in the range of 34°C≤T1≤40°C. In this way, the heat dissipation component 100 can undergo phase change at a temperature that is more comfortable for the user, thereby improving the user experience of the electronic device using the heat dissipation component 100, and can dissipate the heat of the electronic device well and store the heat, which can effectively delay the rapid temperature rise of the electronic device and effectively improve the transient temperature rise of the electronic device.

[0043] Furthermore, the phase change temperature T1 of the first phase change material 32 is in the range of 36°C≤T1≤38°C. In this way, the heat dissipation component 100 can undergo phase change at a temperature that is more comfortable for the user, thereby improving the user experience of the electronic device using the heat dissipation component 100, and can dissipate the heat of the electronic device well and store the heat, which can effectively delay the rapid temperature rise of the electronic device and effectively improve the transient temperature rise of the electronic device.

[0044] The heat dissipation component 100 of the present application includes a flexible heat transfer layer 10 and a first heat sink 30, wherein the first heat sink 30 is arranged in contact with one side of the flexible heat transfer layer 10, and the first heat sink 30 includes a first phase change material 32, and the phase change temperature T1 of the first phase change material 32 is in the range of 30°C≤T1≤45°C; in this way, when the heat dissipation component 100 is applied to electronic equipment, the first phase change material 32 can absorb heat through phase change and keep its own temperature unchanged, thereby delaying the temperature rise of the electronic equipment and effectively improving the transient temperature rise of the electronic equipment. In addition, the flexible heat transfer layer 10 can further quickly diffuse the temperature of the first heat sink 30 to the plane of the entire electronic equipment, thereby playing a role in balancing the temperature to a certain extent, and expanding the heat dissipation area of ​​the heat dissipation component 100, thereby further improving the heat dissipation effect of the heat dissipation component 100.

[0045] In some embodiments, the thermal conductivity λ of the flexible heat transfer layer 10 is in the range of 500W / mK≤λ≤1950W / mK. Specifically, the thermal conductivity λ of the flexible heat transfer layer 10 may be, but is not limited to, 500W / mK, 600W / mK, 700W / mK, 800W / mK, 900W / mK, 1000W / mK, 1100W / mK, 1200W / mK, 1300W / mK, 1400W / mK, 1500W / mK, 1600W / mK, 1700W / mK, 1800W / mK, 1900W / mK, 1950W / mK, etc. If the thermal conductivity λ of the flexible heat transfer layer 10 is too small, it is not conducive to the heat transfer and heat dissipation effect of the heat dissipation component 100; if the thermal conductivity λ of the flexible heat transfer layer 10 is too large, it can improve the heat transfer and heat dissipation effect of the heat dissipation component 100, but the requirements for materials are increased, which increases the cost.

[0046] Optionally, the flexible heat transfer layer 10 may be, but is not limited to, at least one of flexible graphene, flexible graphite, flexible boron nitride, a flexible temperature homogenizing plate, and the like.

[0047] Optionally, the thickness of the flexible heat transfer layer 10 may be 25 μm to 200 μm. Specifically, the thickness of the flexible heat transfer layer 10 may be, but is not limited to, 25 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 120 μm, 140 μm, 160 μm, 180 μm, 200 μm, etc. If the thickness of the flexible heat transfer layer 10 is too thin, the thermal conductivity is high, but the thermal resistance increases, which is not conducive to the heat transfer of the flexible heat transfer layer 10; the thickness of the flexible heat transfer layer 10 increases, and the heat transfer effect is improved. However, when the thickness of the flexible heat transfer layer 10 is too thick, the bending performance of the flexible heat transfer layer 10 is reduced, and it is easy to break when bending, and it is not conducive to the thinness of the heat dissipation component 100.

[0048] Furthermore, the thickness of the flexible heat transfer layer 10 may be 50 μm to 90 μm. When the thickness of the flexible heat transfer layer 10 is within this range, the flexible heat transfer layer 10 can have good heat transfer capability and good bending performance.

[0049] Furthermore, the thickness of the flexible heat transfer layer 10 may be 60 μm to 80 μm. When the thickness of the flexible heat transfer layer 10 is within this range, the flexible heat transfer layer 10 can have good heat transfer capability and good bending performance.

[0050] Optionally, the flexible heat transfer layer 10 can withstand bending times of more than 100,000 times. In other words, the flexible heat transfer layer 10 can withstand bending times of at least more than 100,000 times without breaking. Further, the flexible heat transfer layer 10 can withstand bending times of more than 130,000 times. Further, the flexible heat transfer layer 10 can withstand bending times of more than 150,000 times. Further, the flexible heat transfer layer 10 can withstand bending times of more than 180,000 times. Further, the flexible heat transfer layer 10 can withstand bending times of more than 200,000 times.

[0051] In some embodiments, along the stacking direction of the flexible heat transfer layer 10 and the first heat sink 30, the height d1 of the first receiving cavity 311 is in the range of 30 μm ≤ d1 ≤ 500 μm. Specifically, along the stacking direction of the flexible heat transfer layer 10 and the first heat sink 30, the height d1 of the first receiving cavity 311 may be, but is not limited to, 30 μm, 50 μm, 70 μm, 100 μm, 150 μm, 180 μm, 200 μm, 230 μm, 250 μm, 280 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, etc. If the height d1 of the first receiving cavity 311 is too small, the amount of the first phase change material 32 that can be accommodated is reduced, and the total heat storage amount of the heat dissipation component 100 is too small. When applied to electronic equipment, it is not conducive to delaying the temperature rise of the electronic equipment and improving the transient temperature rise of the electronic equipment; increasing the height d1 of the first receiving cavity 311 can increase the heat storage amount of the heat dissipation component 100, but if the height d1 of the first receiving cavity 311 is too large, it is not conducive to the ultra-thinness of the heat dissipation component 100, and even makes the space of the electronic equipment insufficient, or needs to be made thicker, which is not conducive to the thinness and lightness of the electronic equipment.

[0052] Furthermore, along the stacking direction of the flexible heat transfer layer 10 and the first heat sink 30, the height d1 of the first receiving cavity 311 is in the range of 80 μm ≤ d1 ≤ 400 μm. When the height of the first receiving cavity 311 is in this range, the first heat sink 30 can store enough heat and be relatively light and thin.

[0053] Furthermore, along the stacking direction of the flexible heat transfer layer 10 and the first heat sink 30, the height d1 of the first receiving cavity 311 is in the range of 180 μm ≤ d1 ≤ 250 μm. When the height of the first receiving cavity 311 is in this range, the first heat sink 30 can store enough heat and be relatively light and thin.

[0054] Optionally, the first phase change material 32 may fill 90% to 97% of the volume of the first receiving cavity 311, for example, it may fill but is not limited to filling 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, etc. of the first receiving cavity 311. If the volume filled by the first phase change material 32 is too small, the space of the first receiving cavity 311 is wasted, the height of the heat dissipation component 100 is increased, and it is not conducive to the ultra-thinness of the heat dissipation component 100; if the volume filled by the first phase change material 32 is too large, there is no expansion space reserved for the first phase change material 32, which easily causes the heat dissipation component 100 to swell during the phase change process.

[0055] In the embodiments of the present application, when a numerical value ranges from a to b is involved, unless otherwise specified, it means that the numerical value can be any numerical value between a and b, including the endpoint numerical value a and the endpoint numerical value b.

[0056] In some embodiments, the enthalpy value H1 of the first phase change material 32 is in the range of 100 J / g≤H1≤1000 J / g. Specifically, the enthalpy value H1 of the first phase change material 32 is in the range of 100 J / g, 150 J / g, 180 J / g, 200 J / g, 220 J / g, 240 J / g, 260 J / g, 280 J / g, 300 J / g, 400 J / g, 500 J / g, 600 J / g, 700 J / g, 800 J / g, 900 J / g, 1000 J / g, etc. If the enthalpy value H1 of the first phase change material 32 is too small, the heat storage capacity of the first phase change material 32 is too small, which is not conducive to the heat dissipation component 100 to delay the temperature rise of the electronic device and is not conducive to improving the transient temperature rise of the electronic device; the larger the enthalpy value of the first phase change material 32, the better, which is more conducive to delaying the temperature rise of the electronic device and improving the transient temperature rise of the electronic device, but the requirements for the first phase change material 32 are high, which increases the cost of the heat dissipation component 100 and may even make it impossible to obtain.

[0057] Furthermore, the enthalpy value H1 of the first phase change material 32 is in the range of 150 J / g≤H1≤320 J / g. When the enthalpy value of the first phase change material 32 is in this range, the temperature rise of the electronic device can be better delayed, the transient temperature rise of the electronic device can be improved, the cost of the first phase change material 32 can be reduced, and the packaging process is more gradual and easy to implement.

[0058] Furthermore, the enthalpy value H1 of the first phase change material 32 is in the range of 200 J / g≤H1≤280 J / g. When the enthalpy value of the first phase change material 32 is in this range, the temperature rise of the electronic device can be better delayed, the transient temperature rise of the electronic device can be improved, the cost of the first phase change material 32 can be reduced, and the packaging process is more gradual and easy to implement.

[0059] Furthermore, the enthalpy value H1 of the first phase change material 32 is in the range of 220 J / g≤H1≤260 J / g. When the enthalpy value of the first phase change material 32 is in this range, the temperature rise of the electronic device can be better delayed, the transient temperature rise of the electronic device can be improved, the cost of the first phase change material 32 can be reduced, and the packaging process is more gradual and easy to implement.

[0060] Optionally, the first phase change material 32 includes paraffin (C n H 2n+2 ), at least one of polyols, hydrated salts, liquid metals, etc.

[0061] Alternatively, the paraffin wax may be, but is not limited to, a C18 to C22 alkane, such as n-octadecane, n-nonadecane, n-eicosane, n-heneicosane, n-docosane, and the like.

[0062] Optionally, the polyol may be, but is not limited to, at least one of pentaerythritol, neopentyl glycol, and the like.

[0063] Optionally, the hydrated salt may be but is not limited to at least one of Na2SO4·10H2O, Mn(NO3)2·6H2O, and the like.

[0064] Optionally, the liquid metal may be, but is not limited to, at least one of a gallium-based alloy, a bismuth-based alloy, and the like.

[0065] Optionally, the first phase change material 32 may be solid or liquid, which is not specifically limited in the present application. When the first phase change material 32 is solid, it absorbs heat when it melts from solid to liquid, and releases heat when it changes from liquid to solid; when the first phase change material 32 is liquid, it absorbs heat when it changes from liquid to gas, and releases heat when it changes from gas to liquid.

[0066] In a specific embodiment, the first phase change material 32 is solid paraffin. When the temperature of the electronic device reaches the phase change temperature of the solid paraffin, the solid paraffin absorbs heat and melts to become liquid paraffin. When the temperature of the electronic device decreases or the heat is gradually dissipated to the outside of the electronic device, the liquid paraffin gradually releases heat and becomes solid paraffin.

[0067] See also Figure 2 In some embodiments, the first shell 31 also has a second receiving cavity 312, which is adjacent to the first receiving cavity 311 and arranged along the stacking direction of the flexible heat transfer layer 10 and the first heat sink 30, and the first receiving cavity 311 is located between the flexible heat transfer layer 10 and the second receiving cavity 312; the first heat sink 30 also includes a first liquid absorbent core 33 and a first working fluid (not shown), and the first liquid absorbent core 33 and the first working fluid are both arranged in the second receiving cavity 312.

[0068] It can be understood that the first receiving cavity 311 is arranged closer to the flexible heat transfer layer 10 than the second receiving cavity 312. It can also be understood that the second receiving cavity 312 is located on the side of the first receiving cavity 311 away from the flexible heat transfer layer 10. It can also be understood that along the stacking direction of the flexible heat transfer layer 10 and the first heat sink 30, the flexible heat transfer layer 10, the first receiving cavity 311 and the second receiving cavity 312 are arranged in sequence.

[0069] It should be noted that the second receiving chamber 312 is a sealed chamber. The first liquid wick 33 and the first working medium fill part of the second receiving chamber 312, and the second receiving chamber 312 is in a negative pressure state.

[0070] Optionally, the boiling point of the first working fluid is greater than the phase change temperature of the first phase change material 32 .

[0071] Optionally, the first working fluid may be but is not limited to at least one of water and ethanol.

[0072] See also Figure 3 It can be understood that the first shell 31 and the second receiving cavity 312 defined by it, the first liquid absorption core 33 and the first working fluid constitute the first heat equalization part 30b. Through the evaporation and condensation of the first working fluid, when applied to electronic equipment, the heat generated by the main heat source can be quickly transferred to the entire heat dissipation component 100, thereby achieving the function and effect of dispersing heat and preventing the local temperature of the electronic equipment from being too high, causing discomfort to the user; the first shell 31 and the first receiving cavity 311 and the first phase change material 32 defined by it are the first heat storage part 30a. When the heat of the heat dissipation component 100 reaches the phase change temperature of the first phase change material 32, the first phase change material 32 absorbs heat through phase change to maintain the temperature of the heat dissipation component 100 near the phase change temperature of the first phase change material 32, preventing the temperature of the heat dissipation component 100 from continuing to rise and causing discomfort to the user. It can be understood that the first heat sink 30 includes a first heat storage part 30a and a first heat equalizing part 30b which are stacked. The first heat equalizing part 30b is farther away from the flexible heat transfer layer 10 than the first heat storage part 30a. When applied to an electronic device, the first heat equalizing part 30b is closer to the main heat source than the first heat storage part 30a, and the first heat storage part 30a is closer to the display screen of the electronic device than the first heat equalizing part 30b.

[0073] Optionally, when the heat dissipation assembly 100 is applied to an electronic device, the first heat sink 30 is thermally connected to the middle frame of the electronic device. Optionally, the first heat sink 30 is thermally connected to the middle frame of the electronic device through a thermal conductive coating (also known as thermal interface material, TIM).

[0074] In this embodiment, by setting the second receiving chamber 312, the first liquid wick 33 and the first working fluid are set in the second receiving chamber 312. When the heat dissipation assembly 100 is applied to an electronic device, the heat generated by the main heat source of the electronic device causes the first working fluid to evaporate into gas (such as water vapor) by heat, and the gas flows to a position far away from the main heat source in the second receiving chamber 312. The gas is cooled and condensed into the first working fluid, releasing a large amount of heat. The condensed first working fluid returns to the main heat source of the electronic device corresponding to the second receiving chamber 312 through the first liquid wick 33. In this cycle, the heat is quickly transferred to the large surface of the entire electronic device through the gas generated by the first working fluid. At the same time, the heat released by the condensation of the gas is conducted to the first phase change material 32 in the first receiving chamber 311. When the temperature reaches the phase change temperature (such as the melting point) of the first phase change material 32, the first phase change material 32 undergoes a phase change to absorb heat, and maintains the temperature near the phase change temperature, thereby maintaining the electronic device at a comfortable temperature. In addition, the heat absorbed by the first phase change material 32 can be transferred to the entire heat transfer layer through the flexible heat transfer layer 10, so that the heat is transferred to the entire heat dissipation component 100, thereby achieving a uniform heat distribution effect, which can effectively delay the temperature rise of the electronic device and improve the transient temperature rise of the electronic device. When the main heat source of the electronic device is working, the temperature drops below the phase change temperature (such as the melting point) of the first phase change material 32, and the first phase change material 32 undergoes a reverse phase change, releases heat, and returns to the initial state, so that the main heat source can absorb heat normally when it works again.

[0075] When the first heat sink 30 only includes the first heat storage part 30a (i.e., the part of the first phase change material 32), due to the relatively low thermal conductivity of the first phase change material 32, when absorbing heat, the part of the first phase change material 32 close to the main heat source melts first, and the part far from the main heat source melts slowly or even does not melt, which greatly affects the heat storage performance of the first phase change material 32. When the first heat sink 30 includes the first heat storage part 30a and the first heat equalization part 30b (i.e., the first liquid absorbent core 33 and the first working fluid) at the same time, after the first heat equalization part 30b absorbs heat, it can quickly and evenly disperse the heat to the entire first heat sink 30, so that the first phase change material 32 at each position of the first heat sink 30 can absorb the heat generated by the main heat source in time, thereby having a better heat equalization effect and better exerting the heat storage function of the first phase change material 32, so that the heat dissipation component 100 has a better heat dissipation effect.

[0076] Optionally, along the stacking direction of the flexible heat transfer layer 10 and the first heat sink 30, the range of the height d2 of the second receiving cavity 312 is: 180μm≤d2≤400μm. Specifically, the height d2 of the second receiving cavity 312 can be, but is not limited to, 180μm, 190μm, 200μm, 210μm, 220μm, 230μm, 240μm, 250μm, 280μm, 300μm, 320μm, 350μm, 380μm, 400μm, etc. If the height d2 of the second receiving cavity 312 is too small, the resistance of the gas after the first working fluid evaporates is too large, the effective thermal conductivity is reduced, and the heat equalization effect is reduced; increasing the height d2 of the second receiving cavity 312 is conducive to reducing the resistance of the gas after the first working fluid evaporates and improving the heat equalization effect. However, if the height d2 of the second receiving cavity 312 is too large, it is not conducive to the ultra-thinness of the heat dissipation component 100.

[0077] Furthermore, along the stacking direction of the flexible heat transfer layer 10 and the first heat sink 30, the height d2 of the second receiving cavity 312 is in the range of 180 μm ≤ d2 ≤ 300 μm. This can better reduce the gas resistance after the first working fluid evaporates, so that the first heat sink 30 has a better heat distribution effect and makes the first heat sink 30 lighter and thinner.

[0078] Furthermore, along the stacking direction of the flexible heat transfer layer 10 and the first heat sink 30, the height d2 of the second receiving cavity 312 is in the range of 200 μm ≤ d2 ≤ 250 μm. This can better reduce the gas resistance after the first working fluid evaporates, so that the first heat sink 30 has a better heat distribution effect and makes the first heat sink 30 lighter and thinner.

[0079] See also Figure 4 Optionally, the first shell 31 includes a first outer frame 313, a first plate body 314, a second plate body 315 and a third plate body 316; the first plate body 314, the second plate body 315 and the third plate body 316 are stacked in sequence and arranged in sequence, the first outer frame 313 is arranged around the periphery of the first plate body 314, the second plate body 315 and the third plate body 316, and the first outer frame 313 is respectively connected to the first plate body 314, the second plate body 315 and the third plate body 316. The first plate body 314, the second plate body 315 and the first outer frame 313 define a first receiving cavity 311, and the second plate body 315, the third plate body 316 and the first outer frame 313 define a second receiving cavity 312.

[0080] Exemplarily, the first outer frame portion 313 includes a first outer frame sub-portion 3131 and a second outer frame sub-portion 3133 which are connected to each other. The first outer frame sub-portion 3131 is located between the first plate body portion 314 and the second plate body portion 315, and the opposite ends of the first outer frame sub-portion 3131 are respectively connected to the first plate body portion 314 and the second plate body portion 315. The second outer frame sub-portion 3133 is located between the second plate body portion 315 and the third plate body portion 316, and the opposite ends of the second outer frame sub-portion 3133 are respectively connected to the second plate body portion 315 and the third plate body portion 316. In some embodiments, the first outer frame sub-portion 3131 and the first plate body portion 314 are an integral structure, and the second outer frame sub-portion 3133 and the third plate body portion 316 are an integral structure. During preparation, the first liquid absorbent core 33 and the first working fluid can be first arranged in the second receiving cavity 312 defined by the second outer frame sub-portion 3133 and the third plate body portion 316, and then the second plate body portion 315 is covered, and the second plate body portion 315 and the second outer frame sub-portion 3133 are welded by brazing or laser welding to obtain the first heat equalizing portion 30b; the first phase change material 32 is arranged in the first receiving cavity 311 enclosed by the first outer frame sub-portion 3131 and the first plate body portion 314, the first heat equalizing portion 30b is overlapped, and the second plate body portion 315 and the first outer frame sub-portion 3131 are welded by brazing or laser welding to obtain the first heat sink 30 having the first heat equalizing portion 30b and the first heat storage portion 30a arranged in a stacked manner. It should be noted that the preparation process of the first heat sink 30 of the present application is only one of the feasible preparation processes thereof and should not be construed as a limitation on the first heat sink 30 of the present application.

[0081] Optionally, the thickness of the first plate body 314 ranges from 20 μm to 100 μm. Specifically, the thickness of the first plate body 314 may be, but is not limited to, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. If the thickness of the first plate body 314 is too thin, the mechanical strength of the first heat sink 30 is affected; if the thickness of the first plate body 314 is too thick, it is not conducive to the thinness of the first heat sink 30.

[0082] Optionally, the thickness of the second plate body 315 ranges from 20 μm to 100 μm. Specifically, the thickness of the second plate body 315 may be, but is not limited to, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. If the thickness of the second plate body 315 is too thin, the mechanical strength of the first heat sink 30 will be affected; if the thickness of the second plate body 315 is too thick, it will be disadvantageous to the thinness of the first heat sink 30.

[0083] Optionally, the thickness of the third plate body 316 ranges from 20 μm to 100 μm. Specifically, the thickness of the third plate body 316 may be, but is not limited to, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. If the thickness of the third plate body 316 is too thin, the mechanical strength of the first heat sink 30 is affected; if the thickness of the third plate body 316 is too thick, it is not conducive to the thinness of the first heat sink 30.

[0084] Optionally, the material of the first shell 31 may include at least one of metal, resin, etc. Optionally, the metal includes at least one of copper alloy, stainless steel, titanium alloy, aluminum alloy, etc. The resin includes at least one of polyimide (PI), polyethylene terephthalate (PET), polyetheretherketone (PEEK), etc.

[0085] See also Figure 5 and Figure 6 The heat dissipation assembly 100 also includes a second heat sink 50. The first heat sink 30 and the second heat sink 50 are spaced apart and arranged on the same side of the flexible heat transfer layer 10. The second heat sink 50 includes a second shell 51 and a second phase change material 52. The second shell 51 has a third receiving cavity 511. The second phase change material 52 is located in the third receiving cavity 511.

[0086] It can be understood that the first heat sink 30 and the second heat sink 50 are arranged in the same layer. The orthographic projection of the first heat sink 30 on the surface of the flexible heat transfer layer 10 facing the first heat sink 30 covers part of the flexible heat transfer layer 10, and the orthographic projection of the second heat sink 50 on the surface of the flexible heat transfer layer 10 facing the second heat sink 50 covers part of the flexible heat transfer layer 10. It can also be understood that the first heat sink 30 and the second heat sink 50 are arranged on the same surface of the flexible heat transfer layer 10 at intervals, the first heat sink 30 is located at one end of the flexible heat transfer layer 10, and the second heat sink 50 is located at the other end of the flexible heat transfer layer 10 and is arranged at intervals from the first heat sink 30.

[0087] Optionally, four sides of the flexible heat transfer layer 10 protrude from the first heat sink 30 and the second heat sink 50 .

[0088] When the heat dissipation assembly 100 of this embodiment is applied to a foldable electronic device, the foldable electronic device includes a rotating shaft, a first middle frame and a second middle frame which are arranged on opposite sides of the rotating shaft and are rotatably connected to the rotating shaft, respectively, and the foldable electronic device also includes a main heat source (such as a CPU) arranged in the first middle frame, and the first heat sink 30 is arranged in contact with the first middle frame, and the second heat sink 50 is arranged in contact with the second middle frame. The flexible heat transfer layer 10 between the first heat sink 30 and the second heat sink 50 is located at the rotating shaft of the foldable electronic device. It can be understood that the first heat sink 30 is arranged in contact with the main heat source with a large heat generation, and the second heat sink 50 is arranged near a position without a main heat source. It can also be understood that the first heat sink 30 and the second heat sink 50 are respectively located on opposite sides of the rotating shaft of the foldable electronic device.

[0089] In this embodiment, a second heat sink 50 is provided, and the second heat sink 50 includes a second shell 51 and a second phase change material 52. The second shell 51 has a third receiving cavity 511, and the second phase change material 52 is located in the third receiving cavity 511. In this way, when the heat dissipation component 100 is applied to electronic equipment, the heat generated by the main heat source is conducted to the second heat sink 50 through the first heat sink 30 and the flexible heat transfer layer 10. When the temperature of the second heat sink 50 increases to the phase change temperature of the second phase change material 52, the second phase change material 52 absorbs heat and undergoes a phase change, so that the heat storage function of the second phase change material 52 is more fully utilized, thereby improving the heat storage capacity of the heat dissipation component 100, which can better delay the temperature rise of the electronic equipment and effectively improve the transient temperature rise of the electronic equipment.

[0090] In some embodiments, the phase change temperature T1 of the first phase change material 32 is greater than the phase change temperature T2 of the second phase change material 52. In this way, the second phase change material 52 can undergo phase change at a relatively low temperature to store heat; in this way, when the heat dissipation component 100 is applied to electronic equipment, the first heat sink 30 and the second heat sink 50 can have a certain temperature, which is more conducive to the transfer of heat from the first heat sink 30 to the second heat sink 50, so as to better dissipate heat for the electronic equipment, improve the heat dissipation capacity of the heat dissipation component 100, and prevent the local temperature of the electronic equipment from being too high.

[0091] In some embodiments, the difference between the phase change temperature T1 of the first phase change material 32 and the phase change temperature T2 of the second phase change material 52 is in the range of: 2°C ≤ T1-T2 ≤ 10°C. Specifically, the difference between the phase change temperature T1 of the first phase change material 32 and the phase change temperature T2 of the second phase change material 52 may be, but is not limited to, 2°C, 3°C, 4°C, 5°C, 6°C, 7°C, 8°C, 9°C, 10°C, etc. The difference between the phase change temperature T1 of the first phase change material 32 and the phase change temperature T2 of the second phase change material 52 is too small, the temperature gradient between the first heat sink 30 and the second heat sink 50 is low, the power of heat conduction is low, the improvement of the heat dissipation capacity of the heat dissipation component 100 is limited, and the heat storage performance of the second phase change material 52 is affected; if the difference between the phase change temperature T1 of the first phase change material 32 and the phase change temperature T2 of the second phase change material 52 is too large, then in order to maintain the heat dissipation component 100 as a whole at a temperature that is more comfortable for the human body, the phase change temperature of the second phase change material 52 is too low, which may cause the second phase change material 52 to absorb heat and undergo phase change at room temperature, making the heat storage capacity of the second phase change material 52 ineffective.

[0092] In some embodiments, the phase change temperature T2 of the second phase change material 52 is in the range of 28° C. ≤ T2 ≤ 43° C. Specifically, the phase change temperature T2 of the second phase change material 52 may be, but is not limited to, 28° C., 30° C., 31° C., 32° C., 33° C., 34° C., 35° C., 36° C., 37° C., 38° C., 39° C., 41° C., 43° C., etc. If the temperature of the second phase change material 52 is too high, the second phase change material 52 of the second heat sink 50 will not undergo phase change until the temperature rises to a higher temperature, which will make the user feel uncomfortable and affect the user experience of the electronic device using the heat dissipation component 100. In addition, the phase change temperature of the first phase change material 32 is too close to the phase change temperature of the second phase change material 52, the temperature gradient between the first heat sink 30 and the second heat sink 50 is low, the power of heat conduction is low, and the improvement of the heat dissipation capacity of the heat dissipation component 100 is limited, which affects the heat storage performance of the second phase change material 52. If the temperature of the second phase change is too low, the second phase change material 52 has completely undergone phase change at room temperature, causing the second phase change material 52 to lose its heat storage capacity. When used in electronic equipment, it cannot dissipate heat or prevent the temperature of the electronic equipment from rising suddenly.

[0093] In some embodiments, along the stacking direction of the flexible heat transfer layer 10 and the second heat sink 50, the range of the height d3 of the third receiving cavity 511 is: 30μm≤d3≤500μm. Specifically, along the stacking direction of the flexible heat transfer layer 10 and the second heat sink 50, the height d3 of the third receiving cavity 511 can be, but is not limited to, 30μm, 50μm, 70μm, 100μm, 150μm, 180μm, 200μm, 230μm, 250μm, 280μm, 300μm, 350μm, 400μm, 450μm, 500μm, etc. If the height d3 of the third receiving cavity 511 is too small, the amount of the first phase change material 32 that can be accommodated is reduced, and the total heat storage amount of the heat dissipation component 100 is too small. When applied to electronic equipment, it is not conducive to delaying the temperature rise of the electronic equipment and improving the transient temperature rise of the electronic equipment; increasing the height d3 of the third receiving cavity 511 can increase the heat storage amount of the heat dissipation component 100, but the height d3 of the third receiving cavity 511 is too large, which is not conducive to the ultra-thinness of the heat dissipation component 100, and even makes the space of the electronic equipment insufficient, or needs to be made thicker, which is not conducive to the thinness and lightness of the electronic equipment.

[0094] Furthermore, along the stacking direction of the flexible heat transfer layer 10 and the second heat sink 50, the height d3 of the third receiving cavity 511 is in the range of 80 μm ≤ d3 ≤ 400 μm. When the height of the third receiving cavity 511 is in this range, the second heat sink 50 can store sufficient heat and be relatively light and thin.

[0095] Furthermore, along the stacking direction of the flexible heat transfer layer 10 and the second heat sink 50, the height d3 of the third receiving cavity 511 is in the range of 180 μm ≤ d3 ≤ 250 μm. When the height of the third receiving cavity 511 is in this range, the second heat sink 50 can store enough heat and be relatively light and thin.

[0096] Optionally, the second phase change material 52 may fill 90% to 97% of the volume of the third receiving cavity 511, for example, it may fill but is not limited to filling 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, etc. of the third receiving cavity 511. If the volume filled by the second phase change material 52 is too small, the space of the third receiving cavity 511 is wasted, the height of the heat dissipation component 100 is increased, and it is not conducive to the ultra-thinness of the heat dissipation component 100; if the volume filled by the second phase change material 52 is too large, no expansion space is reserved for the second phase change material 52, which easily causes the heat dissipation component 100 to swell during the phase change process.

[0097] In some embodiments, the enthalpy value H2 of the second phase change material 52 is in the range of 100 J / g≤H2≤1000 J / g. Specifically, the enthalpy value H2 of the second phase change material 52 is in the range of 100 J / g, 150 J / g, 180 J / g, 200 J / g, 220 J / g, 240 J / g, 260 J / g, 280 J / g, 300 J / g, 400 J / g, 500 J / g, 600 J / g, 700 J / g, 800 J / g, 900 J / g, 1000 J / g, etc. If the enthalpy value H2 of the second phase change material 52 is too small, the heat storage capacity of the second phase change material 52 is too small, which is not conducive to the heat dissipation component 100 to delay the temperature rise of the electronic device and is not conducive to improving the transient temperature rise of the electronic device; the larger the enthalpy value of the second phase change material 52, the better, which is more conducive to delaying the temperature rise of the electronic device and improving the transient temperature rise of the electronic device, but the requirements for the second phase change material 52 are high, which increases the cost of the heat dissipation component 100 and may even make it impossible to obtain.

[0098] Furthermore, the enthalpy value H2 of the second phase change material 52 is in the range of 150 J / g≤H2≤320 J / g. When the enthalpy value of the second phase change material 52 is in this range, the temperature rise of the electronic device can be better delayed, the transient temperature rise of the electronic device can be improved, the cost of the second phase change material 52 can be reduced, and the packaging process is more gradual and easy to implement.

[0099] Furthermore, the enthalpy value H2 of the second phase change material 52 is in the range of 200 J / g≤H2≤280 J / g. When the enthalpy value of the second phase change material 52 is in this range, the temperature rise of the electronic device can be better delayed, the transient temperature rise of the electronic device can be improved, the cost of the second phase change material 52 can be reduced, and the packaging process is more gradual and easy to implement.

[0100] Furthermore, the enthalpy value H2 of the second phase change material 52 is in the range of 220 J / g≤H2≤260 J / g. When the enthalpy value of the second phase change material 52 is in this range, the temperature rise of the electronic device can be better delayed, the transient temperature rise of the electronic device can be improved, the cost of the second phase change material 52 can be reduced, and the packaging process is more gradual and easy to implement.

[0101] Optionally, the second phase change material 52 includes paraffin (C n H 2n+2 ), at least one of polyols, hydrated salts, liquid metals, etc.

[0102] Alternatively, the paraffin wax may be, but is not limited to, a C18 to C22 alkane, such as n-octadecane, n-nonadecane, n-eicosane, n-heneicosane, n-docosane, and the like.

[0103] Optionally, the polyol may be, but is not limited to, at least one of pentaerythritol, neopentyl glycol, and the like.

[0104] Optionally, the hydrated salt may be but is not limited to at least one of Na2SO4·10H2O, Mn(NO3)2·6H2O, and the like.

[0105] Optionally, the liquid metal may be, but is not limited to, at least one of a gallium-based alloy, a bismuth-based alloy, and the like.

[0106] Optionally, the second phase change material 52 may be solid or liquid, which is not specifically limited in the present application. When the second phase change material 52 is solid, it absorbs heat when it melts from solid to liquid, and releases heat when it changes from liquid to solid; when the second phase change material 52 is liquid, it absorbs heat when it changes from liquid to gas, and releases heat when it changes from gas to liquid.

[0107] In a specific embodiment, the second phase change material 52 is solid paraffin. When the temperature of the electronic device reaches the phase change temperature of the solid paraffin, the solid paraffin absorbs heat and melts to become liquid paraffin. When the temperature of the electronic device decreases or the heat is gradually dissipated to the outside of the electronic device, the liquid paraffin gradually releases heat and becomes solid paraffin.

[0108] See also Figure 7 and Figure 8 In some embodiments, the second shell 51 further has a fourth receiving cavity 512, and the fourth receiving cavity 512 is arranged adjacent to the third receiving cavity 511 and arranged along the stacking direction of the flexible heat transfer layer 10 and the second heat sink 50, and the third receiving cavity 511 is located between the flexible heat transfer layer 10 and the fourth receiving cavity 512; the second heat sink 50 also includes a second liquid absorbent core 53 and a second working fluid (not shown), and the second liquid absorbent core 53 and the second working fluid are both arranged in the fourth receiving cavity 512.

[0109] It can be understood that the third receiving cavity 511 is arranged closer to the flexible heat transfer layer 10 than the fourth receiving cavity 512. It can also be understood that the fourth receiving cavity 512 is located on the side of the third receiving cavity 511 away from the flexible heat transfer layer 10. It can also be understood that along the stacking direction of the flexible heat transfer layer 10 and the second heat sink 50, the flexible heat transfer layer 10, the third receiving cavity 511 and the fourth receiving cavity 512 are arranged in sequence.

[0110] It should be noted that the fourth receiving chamber 512 is a sealed chamber. The second liquid wick 53 and the second working medium fill part of the fourth receiving chamber 512, and the fourth receiving chamber 512 is in a negative pressure state.

[0111] Optionally, the boiling point of the second working fluid is greater than the phase change temperature of the second phase change material 52 .

[0112] Optionally, the second working fluid may be but is not limited to at least one of water and ethanol.

[0113] See also Fig. 9 It can be understood that the second shell 51 and the fourth receiving cavity 512 defined by it, the second liquid absorbent core 53 and the second working fluid constitute the second heat equalization part 50b. Through the evaporation and condensation of the second working fluid, when applied to electronic equipment, the heat generated by the secondary heat source (such as a battery) of the electronic equipment away from the main heat source end can be quickly transferred to the entire heat dissipation component 100, thereby achieving the function and effect of dispersing heat and preventing the local temperature of the electronic equipment from being too high, causing discomfort to the user; the second shell 51 and the third receiving cavity 511 and the second phase change material 52 defined by it are the second heat storage part 50a. When the heat of the heat dissipation component 100 reaches the phase change temperature of the second phase change material 52, the second phase change material 52 absorbs heat through phase change to maintain the temperature of the heat dissipation component 100 near the phase change temperature of the second phase change material 52, preventing the temperature of the heat dissipation component 100 from continuing to rise and causing discomfort to the user. It can be understood that the second heat sink 50 includes a second heat storage part 50a and a second heat equalizing part 50b which are stacked. The second heat equalizing part 50b is farther away from the flexible heat transfer layer 10 than the second heat storage part 50a. When applied to an electronic device, the second heat equalizing part 50b is closer to the main heat source than the second heat storage part 50a, and the second heat storage part 50a is closer to the display screen of the electronic device than the second heat equalizing part 50b.

[0114] Optionally, when the heat dissipation assembly 100 is applied to an electronic device, the second heat sink 50 is thermally connected to the middle frame of the electronic device. Optionally, the second heat sink 50 is thermally connected to the middle frame of the electronic device through a thermal conductive coating (also known as thermal interface material, TIM).

[0115] The main heat source of the electronic device with high heat generation, such as the CPU, is usually arranged near one side. Although the first heat sink 30 is arranged near the main heat source, the other side of the electronic device usually also includes a secondary heat source with a smaller heat generation. In this embodiment, by setting the fourth receiving chamber 512, the second liquid wick 53 and the second working fluid are arranged in the fourth receiving chamber 512. When the heat dissipation assembly 100 is applied to the electronic device, the heat generated by the secondary heat source of the electronic device causes the second working fluid to evaporate into gas (such as water vapor) under heat, and the gas flows to a position far away from the secondary heat source in the fourth receiving chamber 512. The gas is cooled and condensed into the second working fluid, releasing a large amount of heat. The condensed second working fluid returns to the secondary heat source of the electronic device corresponding to the fourth receiving chamber 512 through the second liquid wick 53. In this cycle, the heat is quickly transferred to the large surface of the entire electronic device through the gas generated by the second working fluid. At the same time, the heat released by the condensation of the gas is transferred to the second phase change material 52 in the third receiving cavity 511. When the temperature reaches the phase change temperature (such as the melting point) of the second phase change material 52, the second phase change material 52 undergoes a phase change to absorb heat and maintains the temperature near the phase change temperature, thereby maintaining the electronic device at a comfortable temperature. In addition, the heat absorbed by the second phase change material 52 can be transferred to the entire surface of the flexible heat transfer layer 10 through the flexible heat transfer layer 10, so that the heat is transferred to the entire heat dissipation component 100, thereby achieving a uniform heat effect, which can effectively delay the temperature rise of the electronic device and improve the transient temperature rise of the electronic device. When the secondary heat source of the electronic device is in the working gap, the temperature drops below the phase change temperature (such as the melting point) of the second phase change material 52, and the second phase change material 52 undergoes a reverse phase change, releases heat, and returns to the initial state, so that the secondary heat source can absorb heat normally when it works again.

[0116] When the second heat sink 50 only includes the second heat storage part 50a (i.e., the part of the second phase change material 52), due to the relatively low thermal conductivity of the second phase change material 52, when absorbing heat, the part of the second phase change material 52 close to the main heat source melts first, and the part far away from the main heat source melts slowly or even does not melt, which greatly affects the heat storage performance of the second phase change material 52. When the second heat sink 50 also includes the second heat storage part 50a and the second heat equalizing part 50b (i.e., the second liquid absorbent core 53 and the second working fluid), after the second heat equalizing part 50b absorbs heat, it can quickly and evenly disperse the heat to the entire second heat sink 50, so that the second phase change material 52 at each position of the second heat sink 50 can absorb the heat generated by the main heat source in time, thereby having a better heat equalizing effect and better exerting the heat storage function of the second phase change material 52, so that the heat dissipation component 100 has a better heat dissipation effect.

[0117] Optionally, along the stacking direction of the flexible heat transfer layer 10 and the second heat sink 50, the range of the height d4 of the fourth receiving cavity 512 is: 180μm≤d4≤400μm. Specifically, the height d4 of the fourth receiving cavity 512 can be, but is not limited to, 180μm, 190μm, 200μm, 210μm, 220μm, 230μm, 240μm, 250μm, 280μm, 300μm, 320μm, 350μm, 380μm, 400μm, etc. If the height d4 of the fourth receiving cavity 512 is too small, the resistance of the gas after the second working fluid evaporates is too large, the effective thermal conductivity is reduced, and the heat equalization effect is reduced; increasing the height d4 of the fourth receiving cavity 512 is conducive to reducing the resistance of the gas after the second working fluid evaporates and improving the heat equalization effect, but if the height d4 of the fourth receiving cavity 512 is too large, it is not conducive to the ultra-thinness of the heat dissipation component 100.

[0118] Furthermore, along the stacking direction of the flexible heat transfer layer 10 and the second heat sink 50, the height d4 of the fourth receiving cavity 512 is in the range of 180 μm ≤ d4 ≤ 300 μm. This can better reduce the gas resistance after the second working fluid evaporates, so that the second heat sink 50 has a better heat distribution effect and is relatively light and thin.

[0119] Furthermore, along the stacking direction of the flexible heat transfer layer 10 and the second heat sink 50, the range of the height d4 of the fourth receiving cavity 512 is: 200μm≤d4≤250μm. In this way, the gas resistance after the second working fluid evaporates can be better reduced, so that the second heat sink 50 has a better heat distribution effect and is relatively light and thin.

[0120] See also Fig.10 Optionally, the second shell 51 includes a second outer frame 513, a fourth plate body 514, a fifth plate body 515 and a sixth plate body 516; the fourth plate body 514, the fifth plate body 515 and the sixth plate body 516 are stacked in sequence and arranged in sequence, the second outer frame 513 is arranged around the outer periphery of the fourth plate body 514, the fifth plate body 515 and the sixth plate body 516, and the second outer frame 513 is respectively connected to the fourth plate body 514, the fifth plate body 515 and the sixth plate body 516. The fourth plate body 514, the fifth plate body 515 and the second outer frame 513 define a third receiving cavity 511, and the fifth plate body 515, the sixth plate body 516 and the second outer frame 513 define a fourth receiving cavity 512.

[0121] Exemplarily, the second outer frame portion 513 includes a third outer frame sub-portion 5131 and a fourth outer frame sub-portion 5133 that are connected, the third outer frame sub-portion 5131 is located between the fourth plate body portion 514 and the fifth plate body portion 515, and the opposite ends of the third outer frame sub-portion 5131 are respectively connected to the fourth plate body portion 514 and the fifth plate body portion 515, the fourth outer frame sub-portion 5133 is located between the fifth plate body portion 515 and the sixth plate body portion 516, and the opposite ends of the fourth outer frame sub-portion 5133 are respectively connected to the fifth plate body portion 515 and the sixth plate body portion 516. In some embodiments, the third outer frame sub-portion 5131 and the fourth plate body portion 514 are an integral structure, and the fourth outer frame sub-portion 5133 and the sixth plate body portion 516 are an integral structure. During preparation, the second liquid absorbent core 53 and the second working fluid can be first arranged in the second receiving cavity 312 defined by the fourth outer frame sub-portion 5133 and the sixth plate body portion 516, and then the fifth plate body portion 515 is covered, and the fifth plate body portion 515 and the fourth outer frame sub-portion 5133 are welded by brazing or laser welding to obtain the second heat equalizing portion 50b; the second phase change material 52 is arranged in the first receiving cavity 311 enclosed by the third outer frame sub-portion 5131 and the fourth plate body portion 514, the second heat equalizing portion 50b is overlapped, and the fifth plate body portion 515 and the third outer frame sub-portion 5131 are welded by brazing or laser welding to obtain the second heat sink 50 having a stacked second heat equalizing portion 50b and a second heat storage portion 50a. It should be noted that the preparation process of the second heat sink 50 of the present application is only one of the feasible preparation processes thereof and should not be understood as a limitation on the second heat sink 50 of the present application.

[0122] Optionally, the thickness of the fourth plate body 514 ranges from 20 μm to 100 μm. Specifically, the thickness of the fourth plate body 514 may be, but is not limited to, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. If the thickness of the fourth plate body 514 is too thin, the mechanical strength of the second heat sink 50 will be affected; if the thickness of the fourth plate body 514 is too thick, it will be disadvantageous for the second heat sink 50 to be thin and light.

[0123] Optionally, the thickness of the fifth plate body 515 ranges from 20 μm to 100 μm. Specifically, the thickness of the fifth plate body 515 may be, but is not limited to, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. If the thickness of the fifth plate body 515 is too thin, the mechanical strength of the second heat sink 50 will be affected; if the thickness of the fifth plate body 515 is too thick, it will be disadvantageous for the second heat sink 50 to be thin and light.

[0124] Optionally, the thickness of the sixth plate body 516 ranges from 20 μm to 100 μm. Specifically, the thickness of the sixth plate body 516 may be, but is not limited to, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc. If the thickness of the sixth plate body 516 is too thin, the mechanical strength of the second heat sink 50 will be affected; if the thickness of the sixth plate body 516 is too thick, it will be disadvantageous for the second heat sink 50 to be thin and light.

[0125] Optionally, the material of the second shell 51 may include at least one of metal, resin, etc. Optionally, the metal includes at least one of copper alloy, stainless steel, titanium alloy, aluminum alloy, etc. The resin includes at least one of polyimide (PI), polyethylene terephthalate (PET), polyetheretherketone (PEEK), etc.

[0126] It should be noted that the materials of the first shell 31 and the second shell 51 can be the same or different, and this application does not make any specific limitation.

[0127] The heat dissipation assembly 100 of the present application is further described below through specific embodiments.

[0128] The foldable electronic device of the following embodiments and comparative examples includes a foldable middle frame and a flexible display screen, wherein the foldable middle frame is used to carry the flexible display screen. The foldable middle frame includes a first middle frame, a rotating shaft, and a second middle frame, wherein the first middle frame is rotatably connected to the rotating shaft, the first middle frame carries a central processing unit (i.e., a main heat source), and the second middle frame is rotatably connected to the rotating shaft.

[0129] Example 1

[0130] The heat dissipation component 100 of this embodiment includes a flexible graphene layer (i.e., a flexible heat transfer layer 10) and a first heat sink 30. The first heat sink 30 is arranged to adhere to one side of the flexible graphene layer. The first heat sink 30 includes a first heat storage part 30a and a first heat equalizing part 30b that are stacked. The first heat storage part 30a is arranged between the first heat equalizing part 30b and the flexible graphene layer. The first heat storage part 30a uses paraffin as the first phase change material 32.

[0131] The heat dissipation component 100 is arranged between the foldable middle frame and the flexible display screen of the foldable electronic device, and the first heat sink 30 is arranged closer to the foldable middle frame than the flexible graphene layer. The first heat sink 30 is arranged in contact with the first middle frame, and the flexible graphene layer extends from the first middle frame to the shaft and the second middle frame in sequence, and is arranged in contact with the second middle frame.

[0132] Comparative Example 1

[0133] The heat dissipation assembly 100 of this comparative example includes a flexible graphene layer and a temperature averaging plate, and the temperature averaging plate is arranged to adhere to one side of the flexible graphene layer. In this embodiment, the temperature averaging plate covers one side of the flexible graphene layer.

[0134] The heat dissipation component 100 is arranged between the foldable middle frame and the flexible display screen of the foldable electronic device, and the temperature equalizing plate is arranged closer to the foldable middle frame than the flexible graphene layer. The temperature equalizing plate is arranged in contact with the first middle frame, and the flexible graphene layer extends from the first middle frame to the shaft and the second middle frame in sequence, and is arranged in contact with the second middle frame.

[0135] The same foldable electronic device is used to perform temperature rise tests on the heat dissipation components 100 of Example 1 and Comparative Example 1 (where the ambient temperature is 25° C. and the power consumption is 3 W), and the temperature rise curves are shown in FIG. Fig.11 As shown. Fig.11 It can be seen that in the first 10 minutes of the temperature rise test, the temperature of the foldable electronic device using the heat dissipation assembly 100 of Example 1 is always lower than the temperature of the foldable electronic device using the heat dissipation assembly 100 of Comparative Example 1. Compared with the heat dissipation assembly 100 of Comparative Example 1, Example 1 is up to 4°C lower. This shows that compared with the temperature vapor chamber, the heat dissipation assembly 100 of Example 1 of the present application has a better heat dissipation effect, can delay the rapid temperature rise in the time dimension, and effectively improve the transient temperature rise of the electronic device.

[0136] Example 2

[0137] The heat dissipation assembly 100 of this embodiment includes a flexible graphene layer (i.e., a flexible heat transfer layer 10), a first heat sink 30, and a second heat sink 50. The first heat sink 30 and the second heat sink 50 are spaced and attached to the same side of the flexible graphene layer. The first heat sink 30 includes a first heat storage portion 30a and a first heat equalization portion 30b that are stacked. The first heat storage portion 30a is disposed between the first heat equalization portion 30b and the flexible graphene layer. The first heat storage portion 30a uses paraffin as the first phase change material 32. The second heat sink 50 includes a second heat equalization portion 50b.

[0138] The heat dissipation component 100 is arranged between the foldable middle frame and the flexible display screen of the foldable electronic device, and the first heat sink 30 and the second heat sink 50 are arranged closer to the foldable middle frame than the flexible graphene layer, the first heat sink 30 is arranged in contact with the first middle frame, and the second heat sink 50 is arranged in contact with the second middle frame, and the flexible graphene layer between the first heat sink 30 and the second heat sink 50 is stacked at the position of the rotating shaft.

[0139] Example 3

[0140] The heat dissipation assembly 100 of this embodiment includes a flexible graphene layer (i.e., a flexible heat transfer layer 10), a first heat sink 30, and a second heat sink 50. The first heat sink 30 and the second heat sink 50 are spaced and attached to the same side of the flexible graphene layer. The first heat sink 30 includes a first heat storage portion 30a, and the first heat storage portion 30a uses paraffin as the first phase change material 32. The second heat sink 50 includes a second heat storage portion 50a, and the second heat storage portion 50a uses paraffin as the second phase change material 52.

[0141] The heat dissipation component 100 is arranged between the foldable middle frame and the flexible display screen of the foldable electronic device, and the first heat sink 30 and the second heat sink 50 are arranged closer to the foldable middle frame than the flexible graphene layer, the first heat sink 30 is arranged in contact with the first middle frame, and the second heat sink 50 is arranged in contact with the second middle frame, and the flexible graphene layer between the first heat sink 30 and the second heat sink 50 is stacked at the position of the rotating shaft.

[0142] Example 4

[0143] The heat dissipation assembly 100 of this embodiment includes a flexible graphene layer (i.e., a flexible heat transfer layer 10), a first heat sink 30, and a second heat sink 50. The first heat sink 30 and the second heat sink 50 are spaced and attached to the same side of the flexible graphene layer. The first heat sink 30 includes a first heat storage portion 30a and a first heat equalization portion 30b which are stacked. The first heat storage portion 30a is disposed between the first heat equalization portion 30b and the flexible graphene layer. The first heat storage portion 30a uses paraffin as the first phase change material 32. The second heat sink 50 includes a second heat storage portion 50a and a second heat equalization portion 50b which are stacked. The second heat storage portion 50a is disposed between the second heat equalization portion 50b and the flexible graphene layer. The second heat storage portion 50a uses paraffin as the second phase change material 52.

[0144] The heat dissipation component 100 is arranged between the foldable middle frame and the flexible display screen of the foldable electronic device, and the first heat sink 30 and the second heat sink 50 are arranged closer to the foldable middle frame than the flexible graphene layer, the first heat sink 30 is arranged in contact with the first middle frame, and the second heat sink 50 is arranged in contact with the second middle frame, and the flexible graphene layer between the first heat sink 30 and the second heat sink 50 is stacked at the position of the rotating shaft.

[0145] Comparative Example 2

[0146] The heat dissipation assembly 100 of this comparative example includes a flexible graphene layer and two temperature averaging plates, and the two temperature averaging plates are attached to the same side of the flexible graphene layer at an interval.

[0147] The heat dissipation component 100 is arranged between the foldable middle frame and the flexible display screen of the foldable electronic device, and the temperature averaging plate is arranged closer to the foldable middle frame than the flexible graphene layer, one temperature averaging plate is arranged in contact with the first middle frame, and the other temperature averaging plate is arranged in contact with the second middle frame, and the flexible graphene layer between the two temperature averaging plates is stacked at the hinge position.

[0148] The same foldable electronic device is used to perform temperature rise tests on the heat dissipation components 100 of Examples 2 to 4 and Comparative Example 2 (where the ambient temperature is 25° C. and the power consumption is 3 W), and the temperature rise curves are shown in FIG. Fig.12 As shown. Fig.12 It can be seen that in the first 10 minutes of the temperature rise test, the temperature of the foldable electronic device using the heat dissipation assembly 100 of Examples 2 to 4 is always lower than the temperature of the foldable electronic device using the heat dissipation assembly 100 of Comparative Example 2. The heat dissipation assembly 100 of Examples 2 to 4 of the present application has better heat dissipation effect, can delay the rapid temperature rise in the time dimension, and effectively improve the transient temperature rise of the electronic device.

[0149] See also Figures 13 to 15 The embodiment of the present application also provides an electronic device 200, which includes: a display screen 210, the heat dissipation component 100 described in the embodiment of the present application, a middle frame 220 and a central processing unit 230. The display screen 210 has a display surface; the heat dissipation component 100 is arranged on the side of the display screen 210 away from the display surface; the middle frame 220 is arranged on the side of the heat dissipation component 100 away from the display screen 210; the central processing unit 230 is carried by the middle frame 220, and the orthographic projection of the central processing unit 230 on the surface of the heat dissipation component 100 facing the middle frame 220 falls within the range of the first heat sink 30, the heat dissipation component 100 is used to dissipate heat for the electronic device 200, and the central processing unit 230 is electrically connected to the display screen 210, and is used to control the display screen 210 to display.

[0150] For a detailed description of the heat dissipation assembly 100 , please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0151] Optionally, the electronic device 200 of the present application may be a foldable electronic device 200 or a non-foldable electronic device 200. In the drawings and descriptions of the present application, the electronic device 200 is mostly described by taking the foldable electronic device 200 as an example, which should not be understood as a limitation on the electronic device 200 and the heat dissipation assembly 100 of the present application.

[0152] Optionally, the foldable electronic device 200 may be, but is not limited to, a foldable mobile phone, a foldable tablet computer, a foldable e-reader, or other foldable electronic device 200. The non-foldable electronic device 200 may be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, a desktop computer, a smart bracelet, a smart watch, an e-reader, a game console, or other portable electronic device 200.

[0153] Optionally, the display screen 210 may be, but is not limited to, one or more of a liquid crystal display screen, a light emitting diode display screen (LED display screen), a micro light emitting diode display screen (Micro LED display screen), a sub-millimeter light emitting diode display screen (Mini LED display screen), an organic light emitting diode display screen (OLED display screen), etc.

[0154] Optionally, the CPU 230 is used to execute various types of digitally stored instructions, such as software or firmware programs stored in the memory 250, which enables the computing device to provide a wide variety of services.

[0155] When the electronic device 200 is a foldable electronic device 200, the display screen 210 is a flexible display screen 210, and the middle frame 220 is a foldable middle frame 220. The foldable middle frame 220 includes a first middle frame 221, a rotating shaft 222, and a second middle frame 223 that are rotatably connected in sequence; the first middle frame 221, the rotating shaft 222, and the second middle frame 223 are used to carry the flexible display screen 210 and drive the flexible display screen 210 to be folded or flattened; the foldable middle frame 220 has a flattened state and a folded state. When the foldable middle frame 220 is in the flattened state, the first middle frame 221, the connecting member, and the second middle frame 223 form a planar structure; when the foldable middle frame 220 is in the folded state, the first middle frame 221 overlaps with the second middle frame 223, and drives the flexible display screen 210 to be folded.

[0156] Optionally, the electronic device 200 of the present application further includes a memory 250. The memory 250 is electrically connected to the central processor 230 and is used to store program codes required for the processor to run, program codes required for controlling the display screen 210, display content of the display screen 210, and the like.

[0157] Optionally, the memory 250 may include a volatile memory (Volatile Memory), such as a random access memory (Random Access Memory, RAM); the memory 250 may also include a non-volatile memory (NVM), such as a read-only memory (Read-Only Memory, ROM), a flash memory (FlasDOL Memory, FM), a hard disk (DOLard Disk Drive, DOLDD) or a solid-state drive (SSD). The memory 250 may also include a combination of the above-mentioned types of memory 250.

[0158] In some embodiments, the electronic device 200 of the embodiment of the present application further includes a camera module 270, which is carried by the foldable middle frame 220. The camera module 270 is electrically connected to the central processor 230, and is used to shoot under the control of the central processor 230.

[0159] Optionally, the camera module 270 may be a rear camera module 270 or a front camera module 270. This application does not make any specific limitation.

[0160] It can be understood that the electronic device 200 described in this embodiment is merely a form of electronic device 200 used by the heat dissipation component 100, and should not be understood as a limitation on the electronic device 200 provided in this application, nor should it be understood as a limitation on the heat dissipation component 100 provided in each embodiment of this application.

[0161] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, if there is no contradiction between them.

[0162] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A heat dissipation component, characterized in that: include: Flexible heat transfer layer; as well as A first heat sink is arranged in contact with one side of the flexible heat transfer layer, the first heat sink comprises a first shell and a first phase change material, the first shell has a first receiving cavity, the first phase change material is located in the first receiving cavity, and the phase change temperature T1 of the first phase change material is in the range of 30°C≤T1≤45°C.

2. The heat dissipation assembly according to claim 1, characterized in that: The first shell also has a second receiving cavity, which is arranged adjacent to the first receiving cavity and arranged along the stacking direction of the flexible heat transfer layer and the first heat sink, and the first receiving cavity is located between the flexible heat transfer layer and the second receiving cavity; the first heat sink also includes a first liquid absorbent core and a first working fluid, and the first liquid absorbent core and the first working fluid are both arranged in the second receiving cavity.

3. The heat dissipation assembly according to claim 1 or 2, characterized in that: The heat dissipation assembly also includes a second heat sink, and the first heat sink and the second heat sink are spaced apart and arranged on the same side of the flexible heat transfer layer; the second heat sink includes a second shell and a second phase change material, the second shell has a third receiving cavity, and the second phase change material is located in the third receiving cavity.

4. The heat dissipation assembly according to claim 3, characterized in that: The phase change temperature of the first phase change material is greater than the phase change temperature of the second phase change material.

5. The heat dissipation assembly according to claim 4, characterized in that: The difference between the phase change temperature T1 of the first phase change material and the phase change temperature T2 of the second phase change material is in the range of 2°C≤T1-T2≤10°C.

6. The heat dissipation assembly according to claim 3, characterized in that: The phase change temperature T2 of the second phase change material is in the range of 28°C≤T2≤43°C.

7. The heat dissipation assembly according to claim 3, characterized in that: The second shell also has a fourth receiving cavity, which is adjacent to the third receiving cavity and arranged along the stacking direction of the flexible heat transfer layer and the second heat sink, and the third receiving cavity is located between the flexible heat transfer layer and the fourth receiving cavity; the second heat sink also includes a second liquid absorbent core and a second working fluid, and the second liquid absorbent core and the second working fluid are both arranged in the fourth receiving cavity.

8. The heat dissipation assembly according to claim 1, characterized in that: The enthalpy value H1 of the first phase change material is in the range of 100 J / g≤H1≤1000 J / g.

9. The heat dissipation assembly according to claim 3, characterized in that: The enthalpy value H2 of the second phase change material is in the range of 100 J / g≤H2≤1000 J / g.

10. The heat dissipation assembly according to claim 2, characterized in that: Along the stacking direction of the flexible heat transfer layer and the first heat sink, the range of the height d1 of the first receiving cavity is: 30 μm≤d1≤500 μm; the range of the height d2 of the second receiving cavity is: 180 μm≤d2≤400 μm.

11. The heat dissipation assembly according to claim 7, characterized in that: Along the stacking direction of the flexible heat transfer layer and the second heat sink, the range of the height d3 of the third receiving cavity is: 30 μm≤d3≤500 μm; the range of the height d4 of the fourth receiving cavity is: 180 μm≤d4≤400 μm.

12. The heat dissipation assembly according to any one of claims 1-2 and 4-11, characterized in that: The thermal conductivity λ of the flexible heat transfer layer is in the range of 500 W / mK≤λ≤1950 W / mK.

13. An electronic device, characterized in that: include: A display screen, wherein the display screen has a display surface; The heat dissipation component according to any one of claims 1 to 12, wherein the heat dissipation component is arranged on a side of the display screen facing away from the display surface; A middle frame, the middle frame being arranged on a side of the heat dissipation component away from the display screen; A central processing unit, wherein the central processing unit is carried by the middle frame, and the orthographic projection of the central processing unit on the surface of the heat dissipation component facing the middle frame falls within the range of the first heat sink. The heat dissipation component is used to dissipate heat for the electronic device. The central processing unit is electrically connected to the display screen for controlling the display screen to display.

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