Precise environment control and adjustment method for chip semiconductor

Abstract

The invention provides a precision environment control adjustment method for a chip semiconductor, and belongs to the field of precision environment regulation, and the method comprises the following steps: arranging an environment data collection sensor and an environment regulation unit at a boundary point of a preset space, the method comprises the following steps: regularly monitoring environmental parameters in a preset space through an environmental data acquisition sensor, carrying out regional division on the monitored space, carrying out array segmentation in each region, and adjusting the array segmentation number according to the adjustment precision; an environment correlation detection point is calibrated in an area divided by each array, the environment correlation detection point normalizes data collected by an environment data collection sensor and an environment regulation and control unit, and the distance between each environment correlation detection point and the environment data collection sensor is calculated; and feeding back the relative position data of each environment associated detection point and the data acquisition sensor and the environment parameters acquired by the data acquisition sensor to the background server.

Description

Technical Field

[0001] The present invention belongs to the field of precision environmental control, and in particular relates to a precision environmental control and adjustment method for chip semiconductors. Background Art

[0002] In the modern semiconductor industry, chip manufacturing has extremely stringent environmental requirements, especially in the wafer manufacturing and packaging process, where environmental factors such as temperature, humidity and cleanliness directly affect the performance and yield of the chip. With the advancement of technology, the size of chips continues to shrink and the integration continues to increase, resulting in higher and higher requirements for the control accuracy of the manufacturing environment. However, the environmental control technology currently used in the chip semiconductor manufacturing process still has many shortcomings and urgently needs improvement and innovation.

[0003] Traditional environmental control systems often use relatively simple temperature and humidity control methods, and this technology seems to be unable to cope with complex production environments. Many existing systems lack sufficient flexibility and cannot be dynamically adjusted according to the specific needs of the production line. For example, at different stages of production, the required temperature and humidity conditions are completely different. It is difficult for traditional systems to respond to these changes quickly, resulting in reduced equipment operating efficiency and even product defects. Secondly, existing environmental control technologies have problems in terms of accuracy and stability. Many traditional control systems have lags in the regulation of temperature and humidity, and cannot reflect real-time environmental data in a timely and accurate manner, resulting in fluctuations in the chip manufacturing process. This fluctuation not only affects production efficiency, but more importantly, it has a direct impact on the quality of the final product. In addition, traditional environmental monitoring equipment often relies on a single sensor and lacks multi-dimensional data collection and comprehensive analysis capabilities, resulting in the inability to take effective measures in a timely manner when the environment changes, increasing production risks.

[0004] The chip manufacturing process has extremely high requirements for cleanliness, and the existing technology has limited capabilities in clean room environmental control. Many traditional clean room systems are not scientifically designed in terms of filtration and air circulation, which can easily lead to the inability to completely filter tiny particles in the air, thereby affecting the yield rate of the product. In addition, the existing environmental control methods often lack intelligence and automation, and the monitoring and control processes rely on manual operations, which are prone to human errors and reduce the reliability of overall production. Finally, with the increasingly stringent environmental regulations, traditional environmental control methods also face challenges in energy efficiency and environmental protection. Many existing systems have high energy consumption during operation, which makes it difficult to meet the requirements of sustainable development, bringing additional cost burdens to enterprises. Therefore, the development of a precision environmental control adjustment method for chip semiconductors can overcome the shortcomings of the existing technology by introducing advanced sensor technology, intelligent data analysis and automated control methods, and achieve precise control of environmental factors such as temperature, humidity and cleanliness. This new method can not only improve the flexibility and response speed of the production process, but also ensure the high quality and efficiency of chip manufacturing, and provide strong technical support for the sustainable development of the semiconductor industry. Therefore, there is an urgent need for a precision environmental control adjustment method for chip semiconductors. Summary of the invention

[0005] The present invention proposes a precision environment control and adjustment method for chip semiconductors, which solves the problems of real-time and accuracy in environmental parameter monitoring and regulation. Through area division, environment-related detection point calibration and distance attenuation table generation, precise adjustment of environmental parameters is achieved to ensure that environmental conditions in the chip manufacturing process meet high standards.

[0006] The technical solution of the present invention is implemented as follows: a method for precise environmental control and adjustment of chip semiconductors, the method comprising the following steps:

[0007] Environmental data collection sensors and environmental control units are deployed at the boundary points of the preset space, and the environmental parameters in the preset space are regularly monitored through the environmental data collection sensors. The monitored space is divided into regions, and array segmentation is performed in each region, and the number of array segmentation is adjusted according to the adjustment accuracy;

[0008] In each array segmented area, an environment-related detection point is calibrated, and the environment-related detection point regularizes the data collected by the environment data acquisition sensor and the environment control unit, and calculates the distance between each environment-related detection point and the environment data acquisition sensor, and feeds back the relative position data of each environment-related detection point and the data acquisition sensor and the environmental parameters collected by the data acquisition sensor to the background server;

[0009] Pre-store the environmental requirement parameters of the chip semiconductors stored or processed in the preset space in the background server, match the specific location of the storage or processing with the environment-related detection point, and connect the environmental requirement parameters of the chip semiconductors in the matching area with the environment-related detection point, and record the environmental parameter change value of the environment-related detection point after the corresponding connection;

[0010] The background server has a built-in environmental parameter attenuation table generated according to the distance between the environment-related detection point and the environmental data collection sensor, and sends control instructions to the environmental control unit in real time according to the environmental parameter attenuation table. The environmental parameters in the preset space are fine-tuned through the environmental control unit, and at the same time, an environmental parameter data change ratio table for adjacent environment-related detection points is established. The environmental control unit selects the midpoint balance parameter for output control according to the environmental parameter data change ratio table.

[0011] By arranging environmental data collection sensors and environmental control units in the preset space, a comprehensive monitoring and control network is formed to ensure real-time monitoring and dynamic adjustment of environmental parameters, while traditional methods often rely on a single sensor and lack integrity. This solution flexibly sets the monitoring range according to the adjustment accuracy through regional division and array segmentation, allowing refined management of different areas. This flexibility is relatively rare in existing technologies. In addition, the calibration and data regularization mechanism of environmental associated detection points can perform more precise control based on the distance effect between the sensor and the detection point. Traditional technologies usually ignore this key factor, resulting in delayed or inaccurate environmental parameter control. The pre-storage and matching function of environmental demand parameters on the background server enables the system to perform personalized control according to specific chip processing requirements, improving the intelligent level of environmental control, while existing technologies often lack pertinence and adaptability. By establishing an environmental parameter data change ratio table and a midpoint balance parameter output mechanism, the coordination of the environment of adjacent areas is ensured, and the volatility of environmental parameter adjustment is reduced. Traditional methods are relatively insufficient in this regard, resulting in environmental instability and reduced production efficiency.

[0012] As a preferred embodiment, after the array is divided in the area, the center point of the divided space is used as the calibrated environment-related detection point, and when the environmental data acquisition sensor is deployed, at least one environmental data acquisition sensor is deployed in each row and column of the array-divided area.

[0013] As a preferred implementation, when the environment-related detection point regularizes the data collected by the environment data acquisition sensor and the environment control unit, the relative position distance between each environment-related detection point is measured in advance, and any environment-related detection point is selected as a standard point, and the environmental parameter data of the standard point collected by the environment data acquisition sensor is used as the standard value, and the standard spacing difference is set according to the data difference of the environment-related detection points adjacent to the standard point, and the regularization threshold is set according to the standard spacing difference. When the detection difference data of two adjacent environment-related detection points exceeds the set regularization threshold, repeated monitoring is performed, and when the detection difference data of two adjacent environment-related detection points is within the set regularization threshold, the data is adopted and fed back to the background server.

[0014] As a preferred implementation, after matching the specific location of storage or processing with the environment-related detection points, an area of ​​semiconductor storage of the chip to be stored or processed is selected, and all environment-related detection points in the area are matched as a whole.

[0015] As a preferred embodiment, before the environmental parameter attenuation table is generated, the background server pre-records the data collection range of the environmental data collection sensor, selects any position within the collection range as a reference point, sets another environmental data collection sensor within the collection range, and sets a comparison point in the collection range of the environmental data collection sensor for comparison, records the distance between the reference point and the comparison point, obtains the environmental data of the reference point and the comparison point, records the correlation data between the difference and the distance, repeats several times, obtains the weight assignment of the distance and the difference data, and generates the environmental parameter attenuation table according to the weight assignment.

[0016] After adopting the above technical scheme, the beneficial effect of the present invention is that by arranging environmental data acquisition sensors and environmental control units at the boundary points of the preset space, comprehensive monitoring of environmental parameters can be achieved. Real-time monitoring ensures the accuracy of environmental data, so that the environmental conditions in different regions can be fully understood during the chip semiconductor production process, which is crucial to ensuring the stability of the production process and the quality of the final product. In the method, the monitoring space is divided into regions, and the number of array segmentations is adjusted according to the adjustment accuracy, so that the accuracy of environmental monitoring can be refined according to actual needs. This hierarchical monitoring method enables flexible adjustments under different environmental conditions, improving the flexibility and response speed of environmental control. The environmental association detection points in each area can effectively regularize the data and calculate the distance between the environmental data acquisition sensors. This precise feedback of the spatial position can help the background server better understand the impact of environmental changes, and then formulate a more accurate control strategy.

[0017] The backend server pre-stores the environmental requirement parameters of the stored or processed chip semiconductors and matches them with the environment-related detection points, which enhances the system's understanding and adaptability to environmental requirements. By dynamically matching environmental requirement parameters with environment-related detection points, environmental parameters can be adjusted in a timely manner during the production process to ensure the best environmental conditions for each link, thereby improving the production yield and quality of semiconductor chips. Recording the environmental parameter change values ​​of the environment-related detection points also provides data support for subsequent analysis and optimization, allowing the system to be continuously improved and optimized in subsequent production.

[0018] In the application of the environmental parameter attenuation table, the background server can generate an accurate environmental parameter attenuation table in real time based on the distance between the environmental associated detection point and the environmental data acquisition sensor. This function enables the system to flexibly send control instructions and adjust the corresponding environmental parameters in response to environmental changes in different regions. This data-driven fine-tuning mechanism not only improves the accuracy of environmental control, but also can quickly respond to environmental changes and avoid production instability caused by environmental fluctuations. The environmental parameter data change ratio table of adjacent environmental associated detection points established by the environmental control unit during the fine-tuning process provides a data basis for environmental coordination in adjacent areas, so that environmental control between different areas can achieve a better balance and avoid overall environmental imbalance caused by local adjustments.

[0019] The precision environmental control adjustment method significantly improves the environmental control capability in the chip semiconductor production process through comprehensive monitoring, flexible regional division, dynamic environmental parameter matching and precise fine-tuning mechanism, ensuring an efficient and stable production environment. These beneficial effects not only improve production efficiency and product quality, but also lay the foundation for the intelligent and automated semiconductor manufacturing in the future, and promote the development and application of related technologies. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 The figure is a flow chart of the method of the present invention. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Example:

[0024] like Figure 1 As shown, a precision environment control and adjustment method for chip semiconductors, the method comprises the following steps:

[0025] Environmental data collection sensors and environmental control units are deployed at the boundary points of the preset space, and the environmental parameters in the preset space are regularly monitored through the environmental data collection sensors. The monitored space is divided into regions, and array segmentation is performed in each region, and the number of array segmentation is adjusted according to the adjustment accuracy;

[0026] In each array segmented area, an environment-related detection point is calibrated, and the environment-related detection point regularizes the data collected by the environment data acquisition sensor and the environment control unit, and calculates the distance between each environment-related detection point and the environment data acquisition sensor, and feeds back the relative position data of each environment-related detection point and the data acquisition sensor and the environmental parameters collected by the data acquisition sensor to the background server;

[0027] Pre-store the environmental requirement parameters of the chip semiconductors stored or processed in the preset space in the background server, match the specific location of the storage or processing with the environment-related detection point, and connect the environmental requirement parameters of the chip semiconductors in the matching area with the environment-related detection point, and record the environmental parameter change value of the environment-related detection point after the corresponding connection;

[0028] The background server has a built-in environmental parameter attenuation table generated according to the distance between the environment-related detection point and the environmental data collection sensor, and sends control instructions to the environmental control unit in real time according to the environmental parameter attenuation table. The environmental parameters in the preset space are fine-tuned through the environmental control unit, and at the same time, an environmental parameter data change ratio table for adjacent environment-related detection points is established. The environmental control unit selects the midpoint balance parameter for output control according to the environmental parameter data change ratio table.

[0029] The working principle and operation steps of this precision environmental control and adjustment method for chip semiconductors cover a series of refined monitoring and control processes, aiming to provide stable environmental conditions for the storage and processing of chip semiconductors. First, the system deploys environmental data acquisition sensors and environmental control units at the boundary points of the preset space. This preliminary layout is the basis for ensuring full coverage of environmental monitoring. By regularly monitoring the environmental parameters in the preset space through environmental data acquisition sensors, key environmental factors such as temperature, humidity, and air pressure can be obtained in real time. The layout of these sensors is precisely calculated and covers the entire production area to ensure that there are no dead ends. At the same time, the system divides the monitored space into regions and performs array segmentation in each region. This design enables each region to perform independent environmental monitoring and regulation. The number of array segmentations is determined according to the required adjustment accuracy, further improving the degree of refinement of environmental monitoring.

[0030] In each array segmented area, the calibration of environmental correlation detection points is to establish an effective data collection and processing system. The environmental correlation detection points integrate the data collected by the environmental data acquisition sensors and the environmental control unit, and calculate the distance between these detection points and the sensors. This process not only provides the relative position data of each monitoring point, but also analyzes potential interference sources according to changes in environmental parameters and feeds back to the background server. This design ensures the accuracy and effectiveness of the data, so that subsequent environmental control can be based on real monitoring data.

[0031] In the background server, the environmental requirement parameters of the chip semiconductors stored or processed in the preset space are pre-stored, and the system will match these requirement parameters with the environment-related detection points. This matching process ensures the consistency between the actual environmental conditions and the chip processing requirements, and any differences can be adjusted through subsequent control measures. The corresponding connection between the environmental requirement parameters of the chip semiconductors in the matching area and the environment-related detection points provides a data basis for real-time control. After completing the corresponding connection, the system will record the change values ​​of the environmental parameters of the environment-related detection points, which provides the necessary historical data for subsequent analysis and optimization.

[0032] The background server also has a built-in environmental parameter attenuation table generated based on the distance between the environmental correlation detection point and the environmental data collection sensor. This table can reflect the impact of changes in environmental factors on sensor data in real time, and provide a basis for the environmental control unit to issue control instructions. By real-time monitoring and analysis of environmental parameter attenuation, the system can fine-tune the environmental parameters in the preset space. This dynamic control mechanism significantly improves the accuracy of environmental control and ensures that environmental conditions are always in the best state.

[0033] While making adjustments, the system establishes a table of environmental parameter data changes for adjacent environmental correlation detection points. This table provides the environmental control unit with the environmental change relationship of adjacent areas. By analyzing this data, the system can select the midpoint balance parameter for output control, thereby achieving more refined environmental management. This method ensures that the environmental conditions between areas remain consistent and prevents overall instability caused by local adjustments.

[0034] This precision environmental control and adjustment method provides a highly stable environment support for chip semiconductor production through a systematic monitoring and control mechanism, combined with environmental data collection, real-time feedback and intelligent analysis. It not only improves production efficiency, but also reduces product defect rates caused by environmental fluctuations, and promotes the chip manufacturing process to develop in an intelligent and refined direction. The implementation of this method can significantly improve the quality and reliability of chip semiconductor production and has broad application prospects.

[0035] After the array segmentation is performed in the area, the center point of the segmented space is used as a calibrated environment-related detection point. When the environmental data acquisition sensor is deployed, at least one environmental data acquisition sensor is deployed in each row and column of the array segmented area.

[0036] Based on the reasonable division of the monitoring area, the system divides the entire monitoring area into multiple small areas, forming a grid layout through array segmentation. This segmentation method ensures that each small area can be monitored independently, thereby improving the coverage and accuracy of monitoring. The center point of each segmented space is used as the calibrated environmental association detection point to ensure that the environmental status of the area can be effectively reflected in actual monitoring. The selection of the center point means that each monitoring point can represent the environmental characteristics of the area where it is located, avoiding environmental data distortion caused by the deviation of the monitoring point position.

[0037] When laying out environmental data collection sensors, at least one sensor is laid out in each row and column. This design further ensures the density of monitoring and the comprehensiveness of the data. By setting up sensors in each segmented area, the system can collect environmental parameters such as temperature, humidity, air pressure, and gas composition in real time. This layout can not only provide good coverage in the horizontal and vertical directions, but also effectively capture local changes in the area, thereby providing more detailed environmental data. For example, if the environmental parameters in a certain area change abnormally, the laid sensors can capture these changes in the first place and feed them back to the data processing center.

[0038] The reasons for this operation setting are mainly reflected in the following aspects. First, through array segmentation and center point calibration, the system can achieve detailed monitoring of the environment and ensure the accuracy and reliability of the data. Traditional monitoring methods often rely on fewer monitoring points, resulting in incomplete data coverage and affecting the assessment of the overall environment. This detailed monitoring method can reflect environmental changes at a higher resolution and detect potential problems in a timely manner. Sensors arranged in rows and columns ensure the uniformity and comprehensiveness of monitoring. By setting sensors in each segmented area, the system can avoid blind spots caused by the failure to monitor some areas. This design is particularly suitable for application scenarios with rapid environmental changes or high environmental requirements, such as chip manufacturing, pharmaceutical production and other industries, and can provide real-time and accurate environmental data support. The design of array segmentation makes data management and analysis more efficient. By associating the data of each monitoring point with its corresponding regional characteristics, the system can quickly identify abnormal data and classify it. This mechanism not only improves the efficiency of data processing, but also provides a basis for subsequent intelligent analysis and decision-making, and supports the implementation of automated control systems.

[0039] This layout and operation mode provides a basis for future expansion and upgrading. In the context of the continuous development of equipment and technology, the system can add more monitoring points or sensors as needed to further optimize the monitoring network. This flexibility and scalability are important features of modern environmental monitoring systems, allowing the system to adapt to changing environments and needs.

[0040] As a preferred implementation, when the environment-related detection point regularizes the data collected by the environment data acquisition sensor and the environment control unit, the relative position distance between each environment-related detection point is measured in advance, and any environment-related detection point is selected as a standard point, and the environmental parameter data of the standard point collected by the environment data acquisition sensor is used as the standard value, and the standard spacing difference is set according to the data difference of the environment-related detection points adjacent to the standard point, and the regularization threshold is set according to the standard spacing difference. When the detection difference data of two adjacent environment-related detection points exceeds the set regularization threshold, repeated monitoring is performed, and when the detection difference data of two adjacent environment-related detection points is within the set regularization threshold, the data is adopted and fed back to the background server.

[0041] In this environmental monitoring system, the design and operation process of environmental correlation detection points are aimed at ensuring the accuracy and consistency of environmental data, thereby providing a reliable basis for environmental regulation. Based on the pre-measurement of the relative position spacing between each environmental correlation detection point. This pre-measurement step lays the foundation for subsequent data regularization, ensuring that the system can accurately evaluate the differences in environmental parameters between each detection point. The purpose of selecting any environmental correlation detection point as a standard point is to establish a unified reference framework so that the data of other detection points can be compared with the standard value. This flexibility of selection allows the system to dynamically adjust the standard point according to actual conditions, enhancing the adaptability of the system.

[0042] During the data regularization process, the system will use the environmental parameter data of the standard point collected by the environmental data collection sensor as the baseline value. Based on this standard value, the system will calculate the difference in data between the environmental-related detection points adjacent to the standard point and set the standard spacing difference. This standard spacing difference is a key indicator for evaluating the data consistency between each detection point. By setting the regularization threshold, the system can effectively distinguish between normal detection differences and abnormal deviations. When the detection difference data of two adjacent environmental-related detection points exceeds the set regularization threshold, the system will trigger a repeated monitoring mechanism. The purpose of this design is to ensure that all environmental data is strictly verified, especially in situations where environmental factors change greatly. Repeated monitoring can help identify potential faults or anomalies, thereby improving data reliability.

[0043] If the difference data between two adjacent environmental detection points is within the set regularization threshold, the system will use the data and feed it back to the backend server. This feedback mechanism ensures the validity of real-time data and allows the backend system to make environmental monitoring and control decisions. By uploading qualified data to the backend, the system can achieve centralized management and analysis of data, providing support for subsequent environmental control.

[0044] The reasons for this setup and operation are mainly reflected in the following aspects. By pre-measuring and setting standard points, the system establishes a unified reference framework, which improves the effectiveness and accuracy of data comparison. Traditional environmental monitoring systems often lack such a standardization process, resulting in insufficient data reliability. The design of standard spacing difference and regularization threshold allows the system to flexibly respond to environmental changes and dynamically adjust the detection data. This flexibility is particularly important in a rapidly changing environment, and can detect and correct potential problems in a timely manner.

[0045] The introduction of a repeated monitoring mechanism enhances the security and reliability of the system. By re-verifying the detection data that exceeds the threshold, the system can effectively reduce the false alarm rate and ensure that only data that has been strictly verified can be used for decision-making. By feeding qualified data back to the backend server in a timely manner, the system realizes rapid data processing and response, supports real-time environmental monitoring and control, and enables the entire system to operate efficiently.

[0046] After matching the specific location of storage or processing with the environment-related detection points, the area of ​​semiconductor storage of the chip to be stored or processed is selected, and all the environment-related detection points in the area are matched accordingly as a whole.

[0047] At the beginning of the system, the system will identify and collect environmental related detection points, which can be sensor data of various environmental factors such as temperature, humidity, vibration, static electricity, etc. These detection points are used to monitor environmental changes around storage or processing equipment to ensure that the equipment can operate under suitable environmental conditions during semiconductor storage and processing.

[0048] After completing the setting of environmental detection points, the system will associate and match the storage or processing equipment with these environmental detection points. At this point, the system will analyze and identify the environmental factors related to the storage or processing equipment, and ensure that the equipment is always in a safe environment during operation through data analysis. Next, a specific area for chip semiconductor storage is selected. This step is to focus on the most critical part inside the equipment and ensure that the environmental conditions in this area are strictly controlled.

[0049] Once the storage area is determined, the system will match all the environment-related detection points in the area as a whole. This means that when the system performs environmental monitoring, it not only focuses on the status of a single detection point, but also considers the environmental data of all detection points in the area as a whole. This overall matching method helps to comprehensively evaluate the environmental status of the storage area and ensure that the environmental factors of each detection point are within a reasonable range, thereby reducing the potential risks caused by local environmental changes.

[0050] The reason for this setting and operation is that semiconductor storage and processing require extremely high environmental stability. Any slight environmental change will cause the performance of the memory to degrade or be damaged. By treating all environmental detection points as a whole, the system can achieve a more comprehensive monitoring and feedback mechanism. In addition, this operation method is conducive to data analysis and troubleshooting afterwards, which can help technicians quickly locate the source of the problem and improve the maintenance efficiency of the system.

[0051] Before generating the environmental parameter attenuation table, the background server pre-records the data collection range of the environmental data collection sensor, selects any position within the collection range as a reference point, sets another environmental data collection sensor within the collection range, and sets a comparison point in the collection range of the environmental data collection sensor for comparison, records the distance between the reference point and the comparison point, obtains the environmental data of the reference point and the comparison point, records the correlation data between the difference and the distance, repeats this process several times, obtains the weight assignment of the distance and the difference data, and generates the environmental parameter attenuation table according to the weight assignment.

[0052] Before generating the attenuation table, the backend server will first record the collection range of the required environmental data collection sensor in advance. This range is determined to ensure that subsequent data collection can be carried out in an effective and controllable environment to avoid affecting the accuracy and reliability of the data due to unstable environmental factors.

[0053] Next, the system will select an arbitrary position within the selected acquisition range as a reference point. The selection of this reference point is crucial because it will serve as the basis for subsequent data comparison. Subsequently, the system will set up another environmental data acquisition sensor within the same acquisition range for comparison. These two sensors are located at the reference point and the comparison point respectively. By comparing their collected data under the same environmental conditions, changes in environmental parameters can be better understood and analyzed. When setting the comparison point, the system will record the distance between the reference point and the comparison point. This information is crucial for subsequent data analysis. By obtaining the environmental data of the reference point and the comparison point, the system can calculate the difference between the two points. It is worth noting that this process needs to be repeated several times to ensure the accuracy and representativeness of the data. Through multiple acquisitions, the system can obtain more reliable distance and difference data.

[0054] To further analyze this data, the system records the correlation data between the difference and the distance. This correlation data can help understand the attenuation of environmental parameters at different distances. By performing statistical analysis on the data collected multiple times, the system can obtain the weight assignment of distance and difference data. This weight assignment process is to identify which data is more important in the overall attenuation model, so as to ensure a more accurate reflection of the actual environmental changes when generating the environmental parameter attenuation table.

[0055] Finally, through the above data collection and analysis process, the system generates an environmental parameter attenuation table. This table can not only be used to monitor environmental changes in real time, but also provide important data support for future environmental management and optimization. The reason for this setting and operation is that the attenuation of environmental parameters is usually affected by multiple factors, and a single data point often cannot accurately reflect the changing trend of the overall environment. Through comparative analysis and weight assignment, the system can establish a more scientific and systematic attenuation model, thereby providing more reliable data basis in practical applications.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A precision environment control and adjustment method for chip semiconductors, characterized in that: The method comprises the following steps: Environmental data collection sensors and environmental control units are deployed at the boundary points of the preset space, and the environmental parameters in the preset space are regularly monitored through the environmental data collection sensors. The monitored space is divided into regions, and array segmentation is performed in each region, and the number of array segmentation is adjusted according to the adjustment accuracy; In each array segmented area, an environment-related detection point is calibrated, and the environment-related detection point regularizes the data collected by the environment data acquisition sensor and the environment control unit, and calculates the distance between each environment-related detection point and the environment data acquisition sensor, and feeds back the relative position data of each environment-related detection point and the data acquisition sensor and the environmental parameters collected by the data acquisition sensor to the background server; Pre-store the environmental requirement parameters of the chip semiconductors stored or processed in the preset space in the background server, match the specific location of the storage or processing with the environment-related detection point, and connect the environmental requirement parameters of the chip semiconductors in the matching area with the environment-related detection point, and record the environmental parameter change value of the environment-related detection point after the corresponding connection; The background server has a built-in environmental parameter attenuation table generated according to the distance between the environment-related detection point and the environmental data collection sensor, and sends control instructions to the environmental control unit in real time according to the environmental parameter attenuation table. The environmental parameters in the preset space are fine-tuned through the environmental control unit, and at the same time, an environmental parameter data change ratio table for adjacent environment-related detection points is established. The environmental control unit selects the midpoint balance parameter for output control according to the environmental parameter data change ratio table.

2. The method for precise environmental control and adjustment for chip semiconductors as claimed in claim 1, characterized in that: After the array segmentation is performed in the area, the center point of the segmented space is used as a calibrated environment-related detection point. When the environmental data acquisition sensor is deployed, at least one environmental data acquisition sensor is deployed in each row and column of the array segmented area.

3. The method for precise environmental control and adjustment for chip semiconductors as claimed in claim 1, characterized in that: When the environment-related detection point regularizes the data collected by the environment data acquisition sensor and the environment control unit, the relative position distance between each environment-related detection point is measured in advance, and any environment-related detection point is selected as a standard point, and the environmental parameter data of the standard point collected by the environment data acquisition sensor is used as the standard value, and the standard spacing difference is set according to the data difference of the environment-related detection points adjacent to the standard point, and the regularization threshold is set according to the standard spacing difference. When the detection difference data of two adjacent environment-related detection points exceeds the set regularization threshold, repeated monitoring is performed, and when the detection difference data of two adjacent environment-related detection points is within the set regularization threshold, the data is adopted and fed back to the background server.

4. The method for precise environmental control and adjustment for chip semiconductors as claimed in claim 1, characterized in that: After matching the specific location of storage or processing with the environment-related detection points, the area of ​​semiconductor storage of the chip to be stored or processed is selected, and all the environment-related detection points in the area are matched accordingly as a whole.

5. The method for precise environmental control and adjustment for chip semiconductors as claimed in claim 1, characterized in that: Before generating the environmental parameter attenuation table, the background server pre-records the data collection range of the environmental data collection sensor, selects any position within the collection range as a reference point, sets another environmental data collection sensor within the collection range, and sets a comparison point in the collection range of the environmental data collection sensor for comparison, records the distance between the reference point and the comparison point, obtains the environmental data of the reference point and the comparison point, records the correlation data between the difference and the distance, repeats this process several times, obtains the weight assignment of the distance and the difference data, and generates the environmental parameter attenuation table according to the weight assignment.

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