Heat dissipation plate, preparation method of heat dissipation plate, heat dissipation device and electronic equipment

Abstract

The embodiment of the invention provides a heat dissipation plate, a preparation method of the heat dissipation plate, a heat dissipation device and electronic equipment. Relates to the technical field of heat dissipation. The heat dissipation plate comprises a substrate and a heat dissipation piece. The substrate has a mounting hole. Part of the heat dissipation piece extends into the mounting hole, and the heat dissipation piece is riveted with the hole wall of the mounting hole. The preparation method of the heat dissipation plate comprises the following steps: providing a substrate; forming a mounting hole in the substrate; providing a heat dissipation piece; and riveting a part of the heat dissipation piece in the mounting hole. The substrate is responsible for effectively conducting heat generated by the heat source to the heat dissipation piece. The heat dissipation piece is used for increasing the surface area of the heat dissipation plate, so that the heat dissipation efficiency is improved. According to the preparation method of the heat dissipation plate provided by the embodiment of the invention, the substrate and the heat dissipation piece can be connected by directly processing and forming the mounting hole in the substrate and riveting the part of the heat dissipation piece in the mounting hole, the heat dissipation plate is prepared without forging and heat treatment process steps, the preparation process of the heat dissipation plate is simplified, and the production efficiency is improved. The complexity of the heat dissipation plate preparation process is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation plate, a method for preparing a heat dissipation plate, a heat dissipation device and an electronic device. Background Art

[0002] A heat sink is a component used to manage and dissipate heat.

[0003] In the related art, the heat sink includes a substrate and a heat sink column. The heat sink preparation process includes forging, needle cutting, edge cutting, heat treatment, computer numerical control, marking, electroplating, arc pressing, etc.

[0004] However, the existing heat sink has the problem of complicated manufacturing process. Summary of the invention

[0005] The embodiments of the present application provide a heat sink, a method for preparing a heat sink, a heat sink device, and an electronic device, which simplify the preparation process of the heat sink, reduce the complexity of the heat sink preparation process, and improve the production efficiency of the heat sink.

[0006] In a first aspect, an embodiment of the present application provides a heat dissipation plate, which includes a substrate and a heat dissipation element.

[0007] The base plate has a mounting hole.

[0008] Part of the heat sink extends into the mounting hole, and the heat sink located in the mounting hole is riveted to the hole wall of the mounting hole.

[0009] In some embodiments of the present application, the heat sink and the mounting hole are interference fit.

[0010] In some embodiments of the present application, a dimension of the heat sink along a direction perpendicular to the extension direction is larger than an opening dimension of the mounting hole.

[0011] In some embodiments of the present application, the heat sink has a mounting portion, and the mounting portion is located in the mounting hole.

[0012] In some embodiments of the present application, the peripheral side wall of the mounting portion has a first groove.

[0013] In some embodiments of the present application, a first protrusion is provided on a side wall of the mounting hole, and the first protrusion is embedded in the first groove.

[0014] In some embodiments of the present application, the first groove is an annular groove, and the first groove is arranged around the outer circumference of the mounting portion.

[0015] In some embodiments of the present application, the first protrusion is an annular protrusion, and the first protrusion is arranged around the inner peripheral side wall of the mounting hole.

[0016] In some embodiments of the present application, there are multiple first grooves, and the multiple first grooves are arranged at intervals along the circumference of the mounting portion.

[0017] In some embodiments of the present application, there are multiple first protrusions, and the multiple first protrusions are arranged at intervals along the circumference of the mounting hole.

[0018] In some embodiments of the present application, a plurality of first protrusions are embedded in a plurality of first grooves in a one-to-one correspondence.

[0019] In some embodiments of the present application, a second protrusion is provided on the peripheral side wall of the mounting portion.

[0020] In some embodiments of the present application, a side wall of the mounting hole has a second groove, and the second protrusion is embedded in the second groove.

[0021] In some embodiments of the present application, the second protrusion is an annular protrusion, and the second protrusion is arranged around the outer circumference of the mounting portion.

[0022] In some embodiments of the present application, the second groove is an annular groove, and the second groove is arranged around the inner peripheral side wall of the mounting hole.

[0023] In some embodiments of the present application, there are multiple second protrusions, and the multiple second protrusions are arranged at intervals along the circumference of the mounting portion.

[0024] In some embodiments of the present application, there are multiple second grooves, and the multiple second grooves are arranged at intervals along the circumference of the mounting hole.

[0025] In some embodiments of the present application, a plurality of second protrusions are embedded in a plurality of second grooves in a one-to-one correspondence.

[0026] In some embodiments of the present application, the peripheral side wall of the mounting portion has a first groove, and the peripheral side wall of the mounting portion is provided with a second protrusion.

[0027] In some embodiments of the present application, the side wall of the mounting hole has a second groove, and the side wall of the mounting hole is provided with a first protrusion; the first protrusion is embedded in the first groove, and the second protrusion is embedded in the second groove.

[0028] In some embodiments of the present application, the first groove is an annular groove, and the first groove is arranged around the outer circumference of the mounting portion.

[0029] In some embodiments of the present application, the second protrusion is an annular protrusion, and the second protrusion is arranged around the outer circumference of the mounting portion.

[0030] In some embodiments of the present application, the second groove is an annular groove, and the second groove is arranged around the inner peripheral side wall of the mounting hole.

[0031] In some embodiments of the present application, the first protrusion is an annular protrusion, and the first protrusion is arranged around the inner peripheral side wall of the mounting hole.

[0032] In some embodiments of the present application, there are multiple first grooves, and the multiple first grooves are arranged at intervals along the circumference of the mounting portion.

[0033] In some embodiments of the present application, there are multiple second protrusions; and the multiple second protrusions are arranged at intervals along the circumference of the mounting portion.

[0034] In some embodiments of the present application, a plurality of first grooves and a plurality of second protrusions are alternately arranged along the circumference of the mounting portion.

[0035] In some embodiments of the present application, there are multiple second grooves, and the multiple second grooves are arranged at intervals along the circumference of the mounting hole.

[0036] In some embodiments of the present application, there are multiple first protrusions, and the multiple first protrusions are arranged at intervals along the circumference of the mounting hole.

[0037] In some embodiments of the present application, a plurality of second grooves and a plurality of first protrusions are alternately arranged along the circumference of the mounting hole.

[0038] In some embodiments of the present application, there are multiple mounting holes, and the multiple mounting holes are arranged in an array on the substrate.

[0039] In some embodiments of the present application, there are multiple heat sinks, and the multiple heat sinks are arranged in an array on the substrate.

[0040] In some embodiments of the present application, a plurality of heat sinks are riveted to inner walls of a plurality of mounting holes in a one-to-one correspondence.

[0041] In some embodiments of the present application, the heat sink includes a heat sink column.

[0042] In some embodiments of the present application, the substrate includes a middle portion, and a heat sink is disposed in the middle portion.

[0043] In some embodiments of the present application, the substrate includes an edge portion, and the edge portion is located on one side of the middle portion close to the edge of the substrate.

[0044] In some embodiments of the present application, a connection structure is provided at the edge portion.

[0045] In some embodiments of the present application, the connection structure includes a connection hole.

[0046] In some embodiments of the present application, the shape of the mounting hole is adapted to the cross-sectional shape of the mounting portion.

[0047] In some embodiments of the present application, the mounting hole is a round hole.

[0048] In some embodiments of the present application, the cross-section of the mounting portion is circular.

[0049] In some embodiments of the present application, the inner diameter of the mounting hole is A, the diameter of the mounting portion is B, the ratio of A to B is C, and C satisfies: 0.85≤C<1.

[0050] In some embodiments of the present application, the inner diameter A of the mounting hole satisfies: 2.2 mm ≤ A < 2.5 mm.

[0051] In some embodiments of the present application, the diameter B of the mounting portion satisfies: 2.5 mm ≤ B ≤ 2.6 mm.

[0052] In some embodiments of the present application, the height of the heat sink is D, and D satisfies: 6mm≤D≤8mm.

[0053] In some embodiments of the present application, the first groove has a first groove wall, and the first groove wall is a wall surface of the first groove on a side close to the opening of the mounting hole.

[0054] In some embodiments of the present application, along the depth direction of the mounting hole, there is a distance between the first groove wall and the opening of the mounting hole.

[0055] In some embodiments of the present application, the spacing is E, and E satisfies: E>0.2mm.

[0056] In some embodiments of the present application, the depth of the mounting hole is F, and the extension dimension of the first groove is G along the depth direction of the mounting hole.

[0057] The ratio of G to F is H, and H satisfies: 0.3≤H<1.

[0058] In some embodiments of the present application, F satisfies: 0.5mm<F≤1.0mm.

[0059] In some embodiments of the present application, G satisfies: 0.3mm≤G≤0.5mm.

[0060] In some embodiments of the present application, the groove depth of the first groove is I, the diameter of the mounting portion is B, the ratio of I to B is J, and J satisfies: 0.12≤J≤0.2.

[0061] In some embodiments of the present application, the groove depth of the first groove is I, the inner diameter of the mounting hole is A, the ratio of I to A is K, and K satisfies: 0.12≤K<0.23.

[0062] In some embodiments of the present application, the groove depth I of the first groove satisfies: 0.3mm≤I≤0.5mm.

[0063] In some embodiments of the present application, the depth of the mounting hole is F, the thickness of the substrate is L, the ratio of F to L is M, and M satisfies: 0.14<M≤0.4.

[0064] In some embodiments of the present application, the substrate thickness L satisfies: 2.5 mm ≤ L ≤ 3.5 mm.

[0065] In some embodiments of the present application, the heat sink is riveted to at least one side in the thickness direction of the substrate.

[0066] In a second aspect, the present application provides a method for preparing a heat dissipation plate, which is used to prepare a heat dissipation plate. The method for preparing a heat dissipation plate comprises:

[0067] providing a substrate;

[0068] forming a mounting hole on the substrate;

[0069] Provide heat sink;

[0070] Extend a portion of the heat sink into the mounting hole, and rivet the heat sink in the mounting hole to the hole wall of the mounting hole.

[0071] In some embodiments of the present application, forming a mounting hole on a substrate specifically includes:

[0072] The mounting holes are formed on the substrate by a stamping process.

[0073] In some embodiments of the present application, a portion of the heat sink is extended into the mounting hole, and the heat sink located in the mounting hole is riveted to the hole wall of the mounting hole, specifically including:

[0074] Parts of the heat sink are riveted to the mounting holes through a riveting process.

[0075] In some embodiments of the present application, a mounting hole is formed on a substrate by a stamping process, specifically including:

[0076] Fix the substrate on the punching machine;

[0077] A pressing plate having a through hole is installed on one side of the substrate;

[0078] Use the punching needle of the punching machine to pass through the through hole on the pressing plate and drill a hole in the base plate to form a mounting hole.

[0079] In some embodiments of the present application, a heat sink is provided, specifically comprising:

[0080] Prepare heat sinks using a spindle machine or cold heading machine.

[0081] In some embodiments of the present application, a portion of the heat sink is riveted to the mounting hole by a riveting process, specifically including:

[0082] Control the riveting equipment to transport the heat sink to the installation hole;

[0083] Control the ejector pin of the riveting device to move toward the substrate, and use the ejector pin to press the heat sink into the mounting hole;

[0084] Control the ejector pin to retract;

[0085] The punch of the riveting device is controlled to move toward the heat sink; the punch is used to press the substrate on the peripheral side of the heat sink to deform the substrate to form a first protrusion, and the first protrusion is embedded in the first groove of the heat sink.

[0086] In some embodiments of the present application, the riveting device controls the substrate to move a step distance, and repeats the steps of the riveting device conveying the heat sink, the ejector pressing the heat sink, the ejector retracting, and the punch pressing the substrate.

[0087] In some embodiments of the present application, the pressure applied by the ejector pin to the heat sink is F N1 , F N1 Satisfy: 100N≤F N1 ≤200N.

[0088] In some embodiments of the present application, the pressure applied by the punch to the substrate is F N2 , F N2 Satisfy: 200N≤F N2 ≤500N.

[0089] In some embodiments of the present application, after riveting a portion of the heat sink to the mounting hole by a riveting process, the method for preparing the heat sink further includes:

[0090] The side wall of the substrate is marked by a laser marking machine.

[0091] In some embodiments of the present application, after marking the side wall of the substrate by a laser marking machine, the method for preparing the heat sink further includes:

[0092] The substrate and the heat sink are electroplated to form an intermediate heat sink.

[0093] In some embodiments of the present application, after the substrate and the heat sink are electroplated to form an intermediate heat sink, the method for preparing the heat sink further includes:

[0094] A hydraulic press is used to press the arc on the middle heat sink to form the heat sink.

[0095] In some embodiments of the present application, after the middle heat sink is pressed into an arc by a hydraulic press to form the heat sink, the method for preparing the heat sink further includes:

[0096] Check the curvature of the heat sink.

[0097] In some embodiments of the present application, after the curvature test of the heat sink is performed, the method for preparing the heat sink further includes:

[0098] Perform a visual inspection of the heat sink.

[0099] In some embodiments of the present application, after the appearance inspection of the heat sink is performed, the method for preparing the heat sink further includes:

[0100] Packing the heat sink.

[0101] In a third aspect, an embodiment of the present application provides a heat dissipation device, including a heat dissipation plate.

[0102] In a fourth aspect, an embodiment of the present application provides an electronic device, including a heat dissipation device.

[0103] The embodiments of the present application provide a heat sink, a method for preparing a heat sink, a heat sink device, and an electronic device, wherein the heat sink includes a substrate and a heat sink. The substrate has a mounting hole. Part of the heat sink extends into the mounting hole, and the heat sink located in the mounting hole is riveted to the hole wall of the mounting hole. The substrate is responsible for effectively conducting the heat generated by the heat source to the heat sink. The heat sink is used to increase the surface area of ​​the heat sink, thereby improving the heat dissipation efficiency. The method for preparing a heat sink includes: providing a substrate; forming a mounting hole on the substrate; providing a heat sink; and riveting the part of the heat sink extending into the mounting hole to the hole wall of the mounting hole. The method for preparing a heat sink provided in the embodiments of the present application can achieve the connection between the substrate and the heat sink by directly machining the mounting hole on the substrate and riveting part of the heat sink to the mounting hole. There is no need to prepare the heat sink through forging and heat treatment process steps, which simplifies the preparation process of the heat sink, reduces the complexity of the preparation process of the heat sink, and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0104] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0105] Figure 1 It is a process flow chart of preparing a heat sink in the related art;

[0106] Figure 2 Schematic diagram of the heat dissipation plate structure provided in the embodiment of the present application Figure 1 ;

[0107] Figure 3 A schematic structural diagram of a substrate of a heat sink provided in an embodiment of the present application;

[0108] Figure 4 Schematic diagram of the structure of the heat sink of the heat sink provided in the embodiment of the present application Figure 1 ;

[0109] Figure 5 A schematic diagram of the structure after the heat sink and the substrate are connected in the heat sink provided in the embodiment of the present application;

[0110] Figure 6 Schematic diagram of the structure of the heat sink of the heat sink provided in the embodiment of the present application Figure 2 ;

[0111] Figure 7 Schematic diagram of the structure of the heat sink provided in the embodiment of the present application Figure 2 ;

[0112] Figure 8 A process flow chart of the heat sink preparation process provided in the embodiment of the present application;

[0113] Fig. 9 A flow chart of a method for preparing a heat sink provided in an embodiment of the present application;

[0114] Fig.10 Schematic diagram of forming mounting holes on a substrate by a stamping process in a method for preparing a heat sink provided in an embodiment of the present application Figure 1 ;

[0115] Fig.11 A schematic diagram of the structure of a pressure plate in a method for preparing a heat sink provided in an embodiment of the present application;

[0116] Fig.12 Schematic diagram of forming mounting holes on a substrate by a stamping process in a method for preparing a heat sink provided in an embodiment of the present application Figure 2 ;

[0117] Fig.13 for Fig.12 Enlarged view of the middle P region;

[0118] Fig.14 Schematic diagram of riveting a portion of a heat sink to a mounting hole by a riveting process in a method for preparing a heat sink provided in an embodiment of the present application Figure 1 ;

[0119] Fig.15 Schematic diagram of riveting a portion of a heat sink to a mounting hole by a riveting process in a method for preparing a heat sink provided in an embodiment of the present application Figure 2 ;

[0120] Fig.16 for Fig.15 Enlarged view of the middle Q region;

[0121] Fig.17 Schematic diagram of riveting a portion of a heat sink to a mounting hole by a riveting process in a method for preparing a heat sink provided in an embodiment of the present application Figure 3 ;

[0122] Fig.18 Schematic diagram of riveting a portion of a heat sink to a mounting hole by a riveting process in a method for preparing a heat sink provided in an embodiment of the present application Figure 4 ;

[0123] Fig.19 for Fig.18 Enlarged view of the middle R region;

[0124] Fig. 20A schematic diagram of riveting a plurality of heat sinks into mounting holes of a substrate using a riveting device in a method for preparing a heat sink provided in an embodiment of the present application.

[0125] Description of reference numerals:

[0126] 100: substrate; 110: mounting hole; 120: first protrusion; 130: boss; 140: connection hole;

[0127] 200: heat sink; 210: mounting portion; 220: first groove;

[0128] 300: pressing plate; 310: through hole; 320: pelvic cavity;

[0129] 400: riveting equipment; 410: punch; 420: ejector; 430: catheter; 440: punch.

[0130] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0131] A heat sink is a device or component used to dissipate heat, usually to help electronic devices or other heat sources dissipate heat effectively to prevent overheating. It increases the surface area in contact with the surrounding environment to improve the efficiency of heat conduction and dissipation.

[0132] Reference Figure 1 As shown, the preparation process of the heat sink includes forging, needle cutting, edge cutting, heat treatment, computer numerical control, marking, electroplating, arc pressing, etc. The following briefly introduces the various preparation processes of the heat sink:

[0133] Incoming material processing: Use a hydraulic shearing machine to shear the edges of the substrate to facilitate the installation and coordination of the substrate and the mold in the subsequent forging and forming process.

[0134] The substrate is placed in an oven and heat treated at 180° C. Heat treatment of the substrate can increase the ductility and toughness of the substrate so that the substrate can be easily deformed without cracking or breaking during the forging process.

[0135] Forging: The base plate is clamped on a 3000t hydraulic press. The hydraulic press is equipped with a DM4.0 drive module fine pin base plate cold forging die. The die is provided with holes. During the forging process, the upper die is pressed down, the base plate becomes thinner, and the base plate passes through the small holes to form a heat dissipation column.

[0136] Needle cutting: Cut the needle on the cutting machine (working pressure 50bar, working tonnage 1t). Fix the substrate with the heat dissipation column on the cutting table, and cut it horizontally with the guillotine to ensure the uniform height of the heat dissipation column.

[0137] Edge trimming: The edge trimming machine is used to trim along the edge of the substrate.

[0138] Use trimming machine for leveling.

[0139] Heat treatment: The hardness of the substrate is improved through annealing process.

[0140] Computer Numerical Control (CNC): Use CNC with an accuracy of 0.01mm to finish the substrate with heat dissipation columns.

[0141] Marking: Use a laser engraving marking machine to mark the side of the substrate with the heat dissipation column.

[0142] Electroplating: Electroplating is performed on the substrate formed with heat dissipation columns.

[0143] Arc pressing: A 30-50 ton hydraulic press is used to press the arc on the substrate formed with heat dissipation columns.

[0144] Inspection: curvature inspection, appearance inspection.

[0145] According to the preparation process of the heat sink in the related art, it is found that the preparation of the existing heat sink requires about ten processes, and there is a problem of complex preparation process. In addition, the existing heat sink preparation process requires forging, heat treatment and other processes. Among them, the forging process is characterized by high energy consumption. In addition, cracks or other defects may occur in the heat sink during the forging process. In addition, the heat treatment process is time-consuming, which reduces the production efficiency of the heat sink.

[0146] In view of this, the embodiments of the present application provide a heat sink, a method for preparing a heat sink, a heat sink device and an electronic device. The heat sink includes a substrate and a heat sink. The substrate has a mounting hole. Part of the heat sink extends into the mounting hole, and the heat sink located in the mounting hole is riveted to the hole wall of the mounting hole. The substrate is responsible for effectively conducting the heat generated by the heat source to the heat sink. The heat sink is used to increase the surface area of ​​the heat sink, thereby improving the heat dissipation efficiency. The method for preparing a heat sink includes: providing a substrate; forming a mounting hole on the substrate; providing a heat sink; extending part of the heat sink into the mounting hole, and the heat sink located in the mounting hole is riveted to the hole wall of the mounting hole. The method for preparing a heat sink provided in the embodiments of the present application can achieve the connection between the substrate and the heat sink by directly machining the mounting hole on the substrate and riveting part of the heat sink to the mounting hole. There is no need to prepare the heat sink through forging and heat treatment process steps, which simplifies the preparation process of the heat sink, reduces the complexity of the heat sink preparation process, improves production efficiency, and reduces the energy consumption of the preparation method of the heat sink.

[0147] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0148] First, refer to Figures 2 to 4 As shown, the embodiment of the application provides a heat sink. The heat sink is used to dissipate heat from a device to be cooled. The heat sink includes a substrate 100 and a heat sink 200 .

[0149] The base plate 100 has a mounting hole 110 . A portion of the heat sink 200 extends into the mounting hole 110 , and the heat sink 200 located in the mounting hole 110 is riveted to the hole wall of the mounting hole 110 .

[0150] Exemplarily, the substrate 100 is responsible for effectively conducting the heat generated by the heat source to the heat sink 200. At the same time, the substrate 100 provides mechanical support for the entire heat sink. The substrate 100 ensures that the heat sink 200 is firmly fixed to the device to be cooled.

[0151] The substrate 100 has thermal conductivity to ensure that the heat is quickly distributed and transferred to the heat sink 200 for dissipation.

[0152] The material of the substrate 100 may be copper, aluminum, copper alloy, aluminum alloy, copper-aluminum alloy, etc. The present application does not limit the material of the substrate 100 .

[0153] The heat sink 200 is used to increase the surface area of ​​the heat sink, thereby improving the heat dissipation efficiency. Part of the heat sink 200 extends into the mounting hole 110 of the substrate 100 and is fixed to the hole wall of the mounting hole 110 by riveting. This riveting connection method provides a firm mechanical connection between the substrate 100 and the heat sink 200. The connection between the substrate 100 and the heat sink 200 can withstand thermal expansion and mechanical vibration, ensuring that the heat sink 200 will not loosen or fall off during use.

[0154] At the same time, the riveting connection method is a relatively simple and fast assembly method, which is conducive to the large-scale production of heat sinks.

[0155] As a feasible implementation manner, the heat sink 200 and the mounting hole 110 are interference fit.

[0156] Exemplarily, an interference fit is a mechanical connection in which the mating dimensions of two parts are designed to interfere with each other, i.e., a certain force needs to be applied to hold them together during assembly.

[0157] In the embodiment of the present application, by setting the heat sink 200 and the mounting hole 110 to be interference fit, it is helpful to improve the connection strength between the heat sink 200 and the substrate 100. The interference fit does not require bolts, nuts or other fasteners, which simplifies the assembly process of the substrate 100 and the heat sink 200. At the same time, the interference fit effectively prevents relative sliding or rotation between the substrate 100 and the heat sink 200.

[0158] As an achievable implementation, the dimension of the heat sink 200 along the direction perpendicular to the extension direction is larger than the opening dimension of the mounting hole 110. Figure 2 In this way, there is dimensional interference between the mounting holes 110 of the substrate 100 and the heat sink 200, and a close fit is achieved between the heat sink 200 and the substrate 100, which helps the connection between the substrate 100 and the heat sink 200 to withstand mechanical stress and vibration, ensuring that the heat sink 200 remains stable during use of the heat sink.

[0159] As a feasible implementation, the heat sink 200 has a mounting portion 210 , and the mounting portion 210 is located in the mounting hole 110 .

[0160] The mounting portion 210 is used to cooperate with the mounting hole 110 of the substrate 100. The mounting hole 110 on the substrate 100 is used to accommodate the mounting portion 210 of the heat sink 200. The size and shape of the mounting hole 110 match the mounting portion 210 to ensure the connection strength between the heat sink 200 and the substrate 100.

[0161] As a feasible implementation, the peripheral side wall of the mounting portion 210 has a first groove 220 .

[0162] As a feasible implementation method, refer to Figure 5 and Figure 7 As shown, a first protrusion 120 is disposed on a side wall of the mounting hole 110 , and the first protrusion 120 is embedded in the first groove 220 .

[0163] Illustratively, the cooperation between the first protrusion 120 and the first groove 220 provides a natural locking mechanism for the substrate 100 and the heat sink 200, which can effectively prevent relative movement between the substrate 100 and the heat sink 200, enhance the mechanical strength of the connection between the substrate 100 and the heat sink 200, and improve the stability of the connection.

[0164] As a feasible implementation manner, the first groove 220 is an annular groove, and the first groove 220 is arranged around the outer circumference of the mounting portion 210 .

[0165] Exemplarily, the annular groove is a continuous groove that surrounds the entire periphery of the mounting portion 210 .

[0166] Since the first groove 220 is annular, the mechanical force applied to the connection between the mounting portion 210 and the substrate 100 is evenly distributed around the mounting portion 210, which helps to reduce stress concentration and improve the connection stability between the mounting portion 210 and the substrate 100.

[0167] As a feasible implementation manner, the first protrusion 120 is an annular protrusion, and the first protrusion 120 is arranged around the inner peripheral side wall of the mounting hole 110 .

[0168] Exemplarily, the annular protrusion is a continuous protrusion structure, which is provided along the entire inner peripheral side wall of the mounting hole 110 .

[0169] When the mounting portion 210 and the mounting hole 110 are connected through the annular groove and the annular protrusion, this embedded connection method provides all-round support and fixation for the connection between the mounting portion 210 and the substrate 100, ensuring the stability of the mounting portion 210 in all directions. At the same time, the mounting portion 210 and the substrate 100 form a firm mechanical lock through this embedded connection method. The mounting portion 210 and the substrate 100 connected through this embedded connection method can withstand large axial and radial loads, thereby improving the mechanical strength of the heat sink.

[0170] In addition, since the annular protrusion and the annular groove are both annular structures, the mechanical force applied to the connection between the mounting portion 210 and the substrate 100 can be evenly distributed around the entire connection, which helps to reduce stress concentration and reduce the risk of fatigue and damage to the heat sink.

[0171] As a feasible implementation manner, there are multiple first grooves 220 , and the multiple first grooves 220 are arranged at intervals along the circumference of the mounting portion 210 .

[0172] For example, the plurality of first grooves 220 provide a multi-point locking mechanism. At the same time, the first grooves 220 disposed at intervals help to relieve stress concentration at the connection between the mounting portion 210 and the substrate 100 because stress can be distributed between different first grooves 220 .

[0173] As a feasible implementation manner, there are multiple first protrusions 120 , and the multiple first protrusions 120 are arranged at intervals along the circumference of the mounting hole 110 .

[0174] Exemplarily, the plurality of first protrusions 120 provide a multi-point locking mechanism, thereby enhancing the connection strength between the mounting portion 210 and the mounting hole 110. Even if one of the first protrusions 120 is damaged, the other first protrusions 120 can still maintain the integrity of the connection.

[0175] The design of the plurality of first protrusions 120 helps to disperse the mechanical stress to a plurality of points, reducing the stress concentration at a single location, thereby reducing the risk of damage to the connection between the mounting portion 210 and the substrate 100.

[0176] As a feasible implementation manner, the plurality of first protrusions 120 are embedded in the plurality of first grooves 220 in a one-to-one correspondence.

[0177] Exemplarily, each first protrusion 120 cooperates with the corresponding first groove 220 to form multiple independent locking points. This multi-point locking mechanism significantly enhances the mechanical strength and stability of the connection between the mounting portion 210 and the substrate 100, so that the heat sink can withstand greater mechanical stress.

[0178] Since the plurality of first protrusions 120 and the plurality of first grooves 220 share the mechanical stress, the stress concentration at a certain point can be effectively reduced, which helps to reduce the risk of damage at the connection between the mounting portion 210 and the substrate 100 and improve the stability of the connection between the mounting portion 210 and the substrate 100.

[0179] As a feasible implementation manner, a second protrusion is provided on the peripheral side wall of the mounting portion 210 .

[0180] As a feasible implementation, the side wall of the mounting hole 110 has a second groove, and the second protrusion is embedded in the second groove.

[0181] Illustratively, the cooperation of the second protrusion and the second groove provides a natural locking mechanism for the substrate 100 and the heat sink 200, which can effectively prevent relative movement between the substrate 100 and the heat sink 200, enhance the mechanical strength of the connection between the substrate 100 and the heat sink 200, and improve the stability of the connection.

[0182] As a feasible implementation manner, the second protrusion is an annular protrusion, and the second protrusion is arranged around the outer circumference of the mounting portion 210 .

[0183] Exemplarily, the annular protrusion is a continuous protrusion structure disposed along the outer circumference of the mounting portion 210 .

[0184] Since the second protrusion is annular, the mechanical force applied to the connection between the mounting portion 210 and the substrate 100 is evenly distributed around the mounting portion 210, which helps to reduce stress concentration and improve the connection stability between the mounting portion 210 and the substrate 100.

[0185] As a feasible implementation manner, the second groove is an annular groove, and the second groove is arranged around the inner peripheral side wall of the mounting hole 110 .

[0186] Exemplarily, the annular groove is a continuous groove surrounding the entire inner circumferential side wall of the mounting hole 110 .

[0187] For example, when the mounting portion 210 and the mounting hole 110 are connected by the annular protrusion and the annular groove, this embedded connection method provides all-round support and fixation for the connection between the mounting portion 210 and the substrate 100, ensuring the stability of the mounting portion 210 in all directions. At the same time, the mounting portion 210 and the substrate 100 form a firm mechanical lock through this embedded connection method, and the mounting portion 210 and the substrate 100 connected by this embedded connection method can withstand large axial and radial loads, thereby improving the mechanical strength of the heat sink.

[0188] In addition, since the annular protrusion and the annular groove are both annular structures, the mechanical force applied to the connection between the mounting portion 210 and the substrate 100 can be evenly distributed around the entire connection, which helps to reduce stress concentration and reduce the risk of fatigue and damage to the heat sink.

[0189] As a feasible implementation manner, there are multiple second protrusions, and the multiple second protrusions are arranged at intervals along the circumference of the mounting portion 210 .

[0190] Exemplarily, the plurality of second protrusions provide a multi-point locking mechanism, thereby enhancing the connection strength between the mounting portion 210 and the substrate 100. Even if one of the second protrusions is damaged, the other second protrusions can still maintain the integrity of the connection.

[0191] The design of multiple second protrusions helps to disperse the mechanical stress to multiple points, reducing the stress concentration at a single location, which helps to reduce the risk of damage to the connection between the mounting portion 210 and the substrate 100.

[0192] As a feasible implementation manner, there are multiple second grooves, and the multiple second grooves are arranged at intervals along the circumference of the mounting hole 110 .

[0193] Exemplarily, the plurality of second grooves provide a multi-point locking mechanism. At the same time, the second grooves arranged at intervals help to relieve stress concentration at the connection between the mounting portion 210 and the substrate 100 because stress can be distributed between different second grooves.

[0194] As a feasible implementation manner, the plurality of second protrusions are embedded in the plurality of second grooves in a one-to-one correspondence.

[0195] Exemplarily, each second protrusion cooperates with a corresponding second groove to form multiple independent locking points. This multi-point locking mechanism significantly enhances the mechanical strength and stability of the connection between the mounting portion 210 and the substrate 100, so that the heat sink can withstand greater mechanical stress and vibration.

[0196] Since the plurality of second protrusions and the plurality of second grooves share the mechanical stress, the stress concentration at a certain point can be effectively reduced, which helps to reduce the risk of damage at the connection between the mounting portion 210 and the substrate 100 and improve the stability of the connection between the mounting portion 210 and the substrate 100.

[0197] As a feasible implementation, the peripheral side wall of the mounting portion 210 has a first groove 220 , and the peripheral side wall of the mounting portion 210 is provided with a second protrusion.

[0198] As a feasible implementation, the side wall of the mounting hole 110 has a second groove, and the side wall of the mounting hole 110 is provided with a first protrusion 120; the first protrusion 120 is embedded in the first groove 220, and the second protrusion is embedded in the second groove.

[0199] Illustratively, the cooperation between the first protrusion 120 and the first groove 220 provides a natural locking mechanism for the substrate 100 and the heat sink 200, which can effectively prevent relative movement between the substrate 100 and the heat sink 200, enhance the mechanical strength of the connection between the substrate 100 and the heat sink 200, and improve the stability of the connection.

[0200] The cooperation between the second protrusion and the second groove provides a natural locking mechanism for the substrate 100 and the heat sink 200, which can further effectively prevent the relative movement between the substrate 100 and the heat sink 200, further enhance the mechanical strength of the connection between the substrate 100 and the heat sink 200, and improve the stability of the connection.

[0201] As a feasible implementation manner, the first groove 220 is an annular groove, and the first groove 220 is arranged around the outer circumference of the mounting portion 210 .

[0202] Exemplarily, the annular groove is a continuous groove that surrounds the entire periphery of the mounting portion 210 .

[0203] Since the first groove 220 is annular, the mechanical force applied to the connection between the mounting portion 210 and the substrate 100 is evenly distributed around the mounting portion 210, which helps to reduce stress concentration and improve the connection stability between the mounting portion 210 and the substrate 100.

[0204] As a feasible implementation manner, the second protrusion is an annular protrusion, and the second protrusion is arranged around the outer circumference of the mounting portion 210 .

[0205] Exemplarily, the annular protrusion is a continuous protrusion structure, and the annular protrusion is disposed along the entire periphery of the mounting portion 210 .

[0206] In addition, since the annular protrusion and the annular groove are both annular structures, the mechanical force applied to the connection between the mounting portion 210 and the substrate 100 can be evenly distributed around the entire connection, which helps to reduce stress concentration and reduce the risk of fatigue and damage to the heat sink.

[0207] As a feasible implementation manner, the second groove is an annular groove, and the second groove is arranged around the inner peripheral side wall of the mounting hole 110 .

[0208] Illustratively, the annular groove is a continuous groove surrounding the entire inner circumference of the mounting hole 110 .

[0209] As a feasible implementation manner, the first protrusion 120 is an annular protrusion, and the first protrusion 120 is arranged around the inner peripheral side wall of the mounting hole 110 .

[0210] Exemplarily, the annular protrusion is a continuous protrusion structure, which is disposed along the entire inner circumference of the mounting hole 110 .

[0211] As a feasible implementation manner, there are multiple first grooves 220 , and the multiple first grooves 220 are arranged at intervals along the circumference of the mounting portion 210 .

[0212] For example, the plurality of first grooves 220 provide a multi-point locking mechanism. At the same time, the first grooves 220 disposed at intervals help to relieve stress concentration at the connection between the mounting portion 210 and the substrate 100 because stress can be distributed between different first grooves 220 .

[0213] As a feasible implementation, there are multiple second protrusions; along the circumference of the mounting portion 210, the multiple second protrusions are arranged at intervals.

[0214] Exemplarily, the plurality of second protrusions provide a multi-point locking mechanism, thereby enhancing the connection strength between the mounting portion 210 and the substrate 100. Even if one of the second protrusions is damaged, the other second protrusions can still maintain the integrity of the connection.

[0215] The design of multiple second protrusions helps to disperse the mechanical stress to multiple points, reducing the stress concentration at a single location, which helps to reduce the risk of damage to the connection between the mounting portion 210 and the substrate 100.

[0216] As a feasible implementation manner, along the circumference of the mounting portion 210 , a plurality of first grooves 220 and a plurality of second protrusions are alternately arranged.

[0217] Exemplarily, the alternately arranged first grooves 220 and second protrusions are used to enhance the stability and firmness of the connection between the mounting portion 210 and the substrate 100. The first grooves 220 cooperate with the first protrusions 120, and the second grooves cooperate with the second protrusions to achieve a tighter combination to ensure that the heat sink can withstand various stresses and loads during use.

[0218] As a feasible implementation manner, there are multiple second grooves, and the multiple second grooves are arranged at intervals along the circumference of the mounting hole 110 .

[0219] Exemplarily, the plurality of second grooves provide a multi-point locking mechanism. At the same time, the second grooves arranged at intervals help to relieve stress concentration at the connection between the mounting portion 210 and the substrate 100 because stress can be distributed between different second grooves.

[0220] As a feasible implementation manner, there are multiple first protrusions 120 , and the multiple first protrusions 120 are arranged at intervals along the circumference of the mounting hole 110 .

[0221] Exemplarily, the plurality of first protrusions 120 provide a multi-point locking mechanism, thereby enhancing the connection strength between the mounting portion 210 and the mounting hole 110. Even if one of the first protrusions 120 is damaged, the other first protrusions 120 can still maintain the integrity of the connection.

[0222] The design of the plurality of first protrusions 120 helps to disperse the mechanical stress to a plurality of points, reducing the stress concentration at a single location, thereby reducing the risk of damage to the connection between the mounting portion 210 and the substrate 100.

[0223] As a feasible implementation manner, a plurality of second grooves and a plurality of first protrusions 120 are alternately arranged along the circumference of the mounting hole.

[0224] Exemplarily, the alternately arranged second grooves and first protrusions 120 are used to enhance the stability and firmness of the connection between the mounting portion 210 and the substrate 100. The first groove 220 cooperates with the first protrusion 120, and the second groove cooperates with the second protrusion to achieve a tighter combination to ensure that the heat sink can withstand various stresses and loads during use.

[0225] As a feasible implementation, there are multiple mounting holes 110 , and the multiple mounting holes 110 are arranged in an array on the substrate 100 .

[0226] Exemplarily, the array-arranged layout of mounting holes 110 helps to evenly distribute the mechanical load applied to the substrate 100 , reduce stress concentration, and enhance the stability and stability of the overall structure of the substrate 100 .

[0227] As a feasible implementation, there are multiple heat sinks 200 , and the multiple heat sinks 200 are arranged in an array on the substrate 100 .

[0228] Exemplarily, the array arrangement of multiple heat sinks 200 can effectively cover the heat source area, ensuring that the heat is evenly distributed and quickly dissipated into the environment.

[0229] As a feasible implementation, the plurality of heat sinks 200 are riveted to the hole walls of the plurality of mounting holes 110 in a one-to-one correspondence.

[0230] In this way, it is ensured that the heat acquired by the substrate 100 is evenly conducted to the heat dissipation element 200, thereby improving the heat dissipation efficiency.

[0231] As a feasible implementation, the heat sink 200 includes a heat sink column. The heat sink column has mechanical strength and stability and can withstand certain physical pressure and vibration.

[0232] As an achievable implementation, the substrate 100 includes a middle portion, and the middle portion is provided with a heat sink 200. The middle portion is generally an area where the heat source of the components to be dissipated is concentrated on the substrate 100. By providing the heat sink 200 here, the heat can be effectively managed and dissipated to prevent local overheating.

[0233] As a feasible implementation manner, the substrate 100 includes an edge portion, and the edge portion is located at a side of the middle portion close to the edge of the substrate 100 .

[0234] The edge portion can be used to install and fix the substrate 100, providing additional support and stability. This is particularly important for applications that require the substrate 100 to be fixed in a chassis or frame.

[0235] As an achievable implementation, a connection structure is provided at the edge portion. The connection structure provides a stable mechanical connection point to ensure a firm fixation between the substrate 100 and the device to be cooled. This helps prevent loosening or displacement due to vibration or impact.

[0236] As a feasible implementation manner, the connection structure includes a connection hole 140 .

[0237] Exemplarily, the connection hole 140 includes a screw hole. The screw hole is used to install a screw or a bolt to achieve connection and fixation between the heat sink and other components.

[0238] The connecting hole 140 further comprises a countersunk hole, which is used to accommodate the head of a countersunk screw so that the top of the screw is flush with the surface of the substrate 100 .

[0239] As a feasible implementation, the shape of the mounting hole 110 is adapted to the cross-sectional shape of the mounting portion 210. By matching the shape of the mounting hole 110 with the cross-sectional shape of the mounting portion 210, the mounting portion 210 can be effectively prevented from rotating or shifting in the mounting hole 110, thereby improving the stability of the connection between the mounting portion 210 and the substrate 100.

[0240] As a feasible implementation, the mounting hole 110 is a circular hole. The circular hole makes the stress evenly distributed around the mounting hole 110, thus reducing stress concentration.

[0241] Circular holes can be easily achieved through conventional processing techniques such as drilling and punching. The manufacturing process is simple and efficient, suitable for large-scale production.

[0242] As an achievable implementation, the cross section of the mounting portion 210 is circular. The circular cross section can evenly distribute the stress applied to the mounting portion 210.

[0243] As a feasible implementation method, refer to Figure 6 to Figure 7 As shown, the inner diameter of the mounting hole 110 is A, the diameter of the mounting portion 210 is B, the ratio of A to B is C, and C satisfies: 0.85≤C<1.

[0244] Exemplarily, the interference fit between the mounting portion 210 and the mounting hole 110 is achieved by limiting the range of the ratio C of the inner diameter of the mounting hole 110 to the diameter of the mounting portion 210 to 0.85-1.

[0245] On the other hand, if the ratio of the inner diameter of the mounting hole 110 to the diameter of the mounting portion 210 is greater than or equal to 1, the connection between the mounting portion 210 and the mounting hole 110 may not be tight enough, or even a gap may appear. A loose connection between the mounting portion 210 and the mounting hole 110 may reduce the mechanical strength and increase the risk of the heat sink 200 becoming loose or shifting during use.

[0246] If the ratio of the inner diameter of the mounting hole 110 to the diameter of the mounting portion 210 is less than 0.85, this means that the inner diameter of the mounting hole 110 is much smaller than the diameter of the mounting portion 210, which may cause assembly difficulties and require greater force for installation. An overly tight fit may cause the mounting portion 210 to be damaged during assembly.

[0247] As a feasible implementation, the inner diameter A of the mounting hole 110 satisfies: 2.2 mm ≤ A < 2.5 mm.

[0248] Optionally, the inner diameter A of the mounting hole 110 satisfies: 2.2 mm ≤ A ≤ 2.3 mm. Alternatively, the inner diameter A of the mounting hole 110 satisfies: 2.3 mm ≤ A < 2.5 mm. Alternatively, the inner diameter A of the mounting hole 110 may be 2.2 mm, 2.3 mm, or 2.4 mm.

[0249] As a feasible implementation, the diameter B of the mounting portion 210 satisfies: 2.5 mm ≤ B ≤ 2.6 mm.

[0250] Optionally, the diameter B of the mounting portion 210 satisfies: 2.5 mm ≤ B ≤ 2.55 mm. Alternatively, the diameter B of the mounting portion 210 satisfies: 2.55 mm ≤ B ≤ 2.60 mm. Alternatively, the diameter of the mounting portion 210 may be 2.56 mm, 2.57 mm, 2.58 mm, or 2.59 mm.

[0251] As a feasible implementation manner, the height of the heat sink 200 is D, and D satisfies: 6 mm ≤ D ≤ 8 mm.

[0252] Optionally, the height D of the heat sink 200 satisfies: 6 mm ≤ D ≤ 7 mm. Alternatively, the height D of the heat sink 200 satisfies: 7 mm ≤ D ≤ 8 mm. Alternatively, the height D of the heat sink 200 may be 6.5 mm, 6.6 mm, 6.7 mm, 6.8 mm, 6.9 mm, or 7.0 mm.

[0253] For example, the heat sink 200 has an appropriate length to effectively transfer heat to the surrounding environment.

[0254] As a feasible implementation, the first groove 220 has a first groove wall, and the first groove wall is a wall surface of the first groove 220 on a side close to the opening of the mounting hole 110 .

[0255] As a feasible implementation, there is a distance between the first groove wall and the opening of the mounting hole 110 along the depth direction of the mounting hole 110. By leaving a distance between the opening of the mounting hole 110 and the groove wall, the connection strength between the mounting portion 210 and the substrate can be improved, thereby improving the durability and service life of the heat sink.

[0256] As a feasible implementation, the spacing is E, and E satisfies: E>0.2mm.

[0257] Optionally, the spacing E satisfies: 0.2 mm < E ≤ 0.25 mm. Alternatively, the spacing E satisfies: 0.25 mm < E ≤ 0.3 mm. Alternatively, E may be 0.21 mm, 0.22 mm, 0.23 mm, or 0.24 mm.

[0258] As an achievable implementation manner, the depth of the mounting hole 110 is F, and the extension dimension of the first groove 220 is G along the depth direction of the mounting hole 110 .

[0259] The ratio of G to F is H, and H satisfies: 0.3≤H<1.

[0260] For example, a suitable ratio of the extension length of the first groove 220 to the depth of the mounting hole 110 can enhance the overall strength and stability of the connection between the mounting portion 210 and the substrate 100 .

[0261] As a feasible implementation, F satisfies: 0.5 mm<F≤1.0 mm.

[0262] Optionally, F satisfies: 0.5 mm < F ≤ 0.75 mm. Alternatively, F satisfies: 0.75 mm < F ≤ 1.0 mm. Alternatively, F may be 0.6 mm, 0.7 mm, 0.8 mm, or 0.9 mm.

[0263] As a feasible implementation, G satisfies: 0.3 mm ≤ G ≤ 0.5 mm.

[0264] For example, G satisfies: 0.3 mm ≤ G ≤ 0.4 mm. Alternatively, G satisfies: 0.4 mm ≤ G ≤ 0.5 mm. Alternatively, G may be 0.3 mm, 0.4 mm, or 0.5 mm.

[0265] As a feasible implementation, the groove depth of the first groove 220 is I, the diameter of the mounting portion 210 is B, the ratio of I to B is J, and J satisfies: 0.12≤J≤0.2.

[0266] Exemplarily, a ratio of the groove depth of the first groove 220 to the diameter of the mounting portion 210 in the range of 0.12-0.2 can help better distribute stress during the installation of the mounting portion 210 , reduce stress concentration, and extend the service life of the mounting portion 210 .

[0267] As a feasible implementation, the groove depth of the first groove 220 is I, the inner diameter of the mounting hole 110 is A, the ratio of I to A is K, and K satisfies: 0.12≤K<0.23.

[0268] Exemplarily, the ratio of the groove depth of the first groove 220 to the inner diameter of the mounting hole 110 is in the range of 0.12-0.23, which can improve the connection strength between the mounting portion 210 and the substrate 100 through the mounting hole 110 .

[0269] As a feasible implementation, the groove depth I of the first groove 220 satisfies: 0.3 mm≤I≤0.5 mm.

[0270] Optionally, the groove depth I of the first groove 220 satisfies: 0.3 mm ≤ I ≤ 0.4 mm. Alternatively, the groove depth I of the first groove 220 satisfies: 0.4 mm ≤ I ≤ 0.5 mm. Alternatively, the groove depth of the first groove 220 may be 0.3 mm, 0.4 mm, or 0.5 mm.

[0271] Exemplarily, a suitable depth of the first groove 220 may be used to fix the first protrusion 120 , ensuring that the mounting portion 210 and the mounting hole 110 are firmly connected via the first protrusion 120 and the first groove 220 .

[0272] As a feasible implementation, the depth of the mounting hole 110 is F, the thickness of the substrate 100 is L, the ratio of F to L is M, and M satisfies: 0.14<M≤0.4.

[0273] Exemplarily, the ratio of the depth of the mounting hole 110 to the thickness of the substrate 100 is in the range of 0.14-0.4, which can ensure the structural integrity of the substrate 100 and avoid stress concentration and potential cracks in the substrate 100 caused by an overly deep mounting hole 110 .

[0274] As a feasible implementation, the thickness L of the substrate 100 satisfies: 2.5 mm≤L≤3.5 mm.

[0275] For example, a proper thickness of the substrate 100 can optimize the heat conduction path, so that heat is more effectively transferred from the heat source to the heat sink 200 .

[0276] As a feasible implementation, the heat sink 200 is riveted to at least one side in the thickness direction of the substrate 100. In this way, the heat sink 200 located on one side of the thickness of the substrate 100 is used to exchange heat with the outside.

[0277] In some embodiments, the heat sink dissipates heat from the insulated gate bipolar transistor. The insulated gate bipolar transistor (IGBT) is an efficient and reliable power semiconductor device. In the field of electric vehicles, IGBT can control the drive system of the motor and the power conversion of the charging pile.

[0278] In some embodiments, the substrate 100 is a copper plate. The heat sink 200 is a copper column. The inner diameter of the mounting hole 110 is 2.4 mm. The depth of the mounting hole 110 is 1.0 mm. The diameter of the mounting portion 210 is 2.5 mm. The groove depth of the first groove 220 is 0.4 mm. The groove width of the first groove 220 is 0.5 mm.

[0279] Second, refer to Figures 8 to 9 As shown, the present application provides a method for preparing a heat dissipation plate, which is used to prepare a heat dissipation plate. The method for preparing a heat dissipation plate includes:

[0280] S100: providing a substrate;

[0281] S200: forming a mounting hole on the substrate;

[0282] S300: Provide heat sink;

[0283] S400: Extend part of the heat sink into the mounting hole, and rivet the heat sink in the mounting hole to the hole wall of the mounting hole.

[0284] For example, the method for preparing the heat sink provided in the embodiment of the present application can realize the connection between the substrate 100 and the heat sink 200 by directly machining the mounting hole 110 on the substrate 100 and riveting part of the heat sink 200 to the mounting hole 110. Compared with the related art, the method for preparing the heat sink provided in the embodiment of the present application omits the forging and heat treatment process steps, simplifies the preparation process of the heat sink, reduces the production complexity, and improves the production efficiency.

[0285] Among them, the preparation method of the heat sink provided in the embodiment of the present application does not involve forging and heat treatment processes, so the preparation method of the heat sink significantly reduces energy consumption and is suitable for energy-saving production requirements. At the same time, the preparation method of the heat sink provided in the embodiment of the present application does not require large-scale forging and heat treatment equipment, which reduces equipment investment and maintenance costs.

[0286] The preparation method of the heat sink provided in the embodiment of the present application processes the mounting hole 110 by mechanical processing and connects the heat sink 200 and the substrate 100 by riveting. Compared with forming the heat sink 200 by forging on the substrate 100, no heat treatment is required, which speeds up the production cycle and improves production efficiency.

[0287] The preparation method of the heat sink provided in the embodiment of the present application, by mechanically processing the mounting hole 110 and connecting the heat sink 200 and the substrate 100 through a riveting process, performs processes such as needle cutting and edge trimming, thereby improving material utilization, reducing material waste, and reducing production costs compared to the prior art.

[0288] As a feasible implementation method, refer to Figures 10 to 12As shown, a mounting hole 110 is formed on the substrate 100, specifically comprising:

[0289] The mounting hole 110 is formed on the substrate 100 through a punching process.

[0290] For example, stamping is a high-speed processing technology that can complete the processing of a large number of mounting holes 110 in a short time, greatly improving production efficiency. The service life of the stamping die in the stamping process is long, which can reduce the processing cost of a single heat sink.

[0291] At the same time, the stamping process can achieve high-precision processing of the mounting hole 110, ensuring that the size and shape of the mounting hole 110 meet the design requirements. The stamping process can produce smooth edges of the mounting hole 110, reduce the generation of burrs and irregular edges, and reduce the need for subsequent processing.

[0292] As an achievable implementation manner, the mounting hole 110 is formed on the substrate 100 by a stamping process, specifically including:

[0293] Fixing the substrate 100 on the punching machine;

[0294] A pressing plate 300 having a through hole 310 is installed on one side of the substrate 100;

[0295] The punching needle 410 of the punching machine passes through the through hole 310 on the pressing plate 300 and drills a hole in the base plate 100 to form the mounting hole 110 .

[0296] Exemplarily, the substrate 100 is placed on a workbench of a punching machine and is firmly fixed using a clamp or other fixing device. This step ensures that the substrate 100 does not move during the punching process, thereby improving the processing accuracy.

[0297] A pressing plate 300 having a through hole 310 is mounted on one side of the substrate 100. The through hole 310 of the pressing plate 300 should be aligned with the mounting hole 110 planned to be formed on the substrate 100. Ensure that the pressing plate 300 is firmly fixed to prevent displacement during the stamping process.

[0298] Align the punching needle 410 of the punching machine with the through hole 310 on the pressing plate 300 to ensure that the punching needle 410 can accurately pass through the through hole 310 to reach the substrate 100. Start the punching machine to make the punching needle 410 pass through the through hole 310 on the pressing plate 300 and drill a hole on the substrate 100 to form the required mounting hole 110.

[0299] Among them, refer to Fig.11 As shown, the compression plate 300 has a pelvic cavity 320. Fig.12 and Fig.13As shown, when the mounting hole 110 is formed on the substrate 100 , the surface of the substrate 100 is deformed, and part of the substrate 100 is squeezed into the basin 320 of the pressing plate 300 , and a boss 130 is formed on the substrate 100 .

[0300] By using the precise alignment of the pressing plate 300 and the punching needle 410, the high accuracy of the position and size of the mounting hole 110 is ensured. The use of the pressing plate 300 ensures that the result of each punching is consistent and reduces the processing error.

[0301] The stamping process can quickly complete the processing of the mounting hole 110, is suitable for mass production, and improves production efficiency.

[0302] The punch press may be an 80t punch press. 80t refers to the nominal pressure or rated pressure of the punch press, in tons (t).

[0303] As an achievable implementation, a heat sink 200 is provided, specifically comprising:

[0304] The heat sink 200 is prepared by a spindle machine or a cold heading machine.

[0305] For example, a spindle machine is generally used for precision machining and can produce a high-precision heat sink 200. The spindle machine can perform a variety of operations such as turning, drilling, and threading. The first groove 220 can be prepared in the mounting portion 210 of the heat sink 200 by the spindle machine.

[0306] The cold heading machine forms quickly through a plastic deformation process and is suitable for mass production of the heat sink 200. Since the cold heading machine adopts a cold processing process, the material utilization rate is high, which reduces the material waste in the cutting process.

[0307] As a feasible implementation method, refer to Figures 14 to 17 As shown, a portion of the heat sink 200 is extended into the mounting hole 110, and the heat sink 200 located in the mounting hole 110 is riveted to the hole wall of the mounting hole 110, specifically including:

[0308] Part of the heat sink 200 is riveted to the mounting hole 110 by a riveting process.

[0309] For example, the riveting process does not require complex equipment, reducing production costs and equipment maintenance requirements. At the same time, the riveting process can provide consistent connection quality and reduce variations caused by manual operation.

[0310] As an achievable implementation, a portion of the heat sink 200 is riveted to the mounting hole 110 by a riveting process, specifically including:

[0311] Controlling the riveting device 400 to transport the heat sink 200 to the mounting hole 110;

[0312] Control the ejector pin 420 of the riveting device 400 to move toward the substrate 100, and use the ejector pin 420 to press the heat sink 200 into the mounting hole 110;

[0313] Control ejector pin 420 to retract;

[0314] The punch 440 of the riveting device 400 is controlled to move toward the direction close to the heat sink 200; the punch 440 is used to press the substrate 100 on the peripheral side of the heat sink 200 to deform the substrate 100 to form a first protrusion 120, and the first protrusion 120 is embedded in the first groove 220 of the heat sink 200.

[0315] For example, refer to Figures 14 to 16 As shown, first, the conveying system of the riveting device 400 is used to accurately convey the heat sink 200 to the mounting hole 110 of the substrate 100. Ensure that the heat sink 200 is accurately positioned so that it is aligned with the mounting hole 110, and prepare for the subsequent riveting steps. Among them, the conveying system of the riveting device 400 includes a conduit 430, which is used to convey the heat sink 200.

[0316] Then, the ejector pin 420 of the riveting device 400 is controlled to move toward the direction close to the substrate 100. The pressure of the ejector pin 420 is used to press part of the heat sink 200 into the mounting hole 110 of the substrate 100 to ensure its initial fixation.

[0317] After the heat sink 200 is pressed into the mounting hole 110 , the ejector pins 420 are controlled to be retracted to release the pressure on the heat sink 200 , so as to prepare for the next step of stamping.

[0318] Reference Figures 17 to 19 As shown, the punch 440 of the riveting device 400 is then controlled to move toward the heat sink 200. The punch 440 is used to apply pressure to the substrate 100 at the periphery of the heat sink 200, so that the substrate 100 undergoes plastic deformation. The punch 440 squeezes the boss 130 on the surface.

[0319] Reference Figure 5 and Fig.17 As shown, the punch 440 moves toward the heat sink 200. The punch 440 applies pressure to the substrate 100. The direction of the pressure is as shown in FIG. Figure 5 The direction is indicated by the solid black arrow.

[0320] The substrate 100 forms a first protrusion 120 , and the first protrusion 120 is embedded in the first groove 220 of the heat sink 200 to achieve mechanical locking.

[0321] By forming the first protrusion 120 and embedding it into the first groove 220 of the heat sink 200 , a firm mechanical connection between the heat sink 200 and the substrate 100 is achieved, thereby ensuring its stability during use.

[0322] The entire process of the riveting process can be controlled by automated equipment, which improves production efficiency and is suitable for large-scale production.

[0323] During the process of fixing the heat sink 200 and the substrate 100, the heat sink 200 is connected to the substrate 100 in two steps. First, the ejector pins 420 press the heat sink 200 into the mounting holes 110 to ensure that the heat sink 200 is initially fixed to the substrate 100. This step provides initial mechanical stability to prevent the heat sink 200 from moving or deviating from its position during subsequent operations.

[0324] Subsequently, the punch 440 is used to apply pressure to the substrate 100, so that the substrate 100 undergoes plastic deformation, forming the first protrusion 120, and embedding it into the first groove 220 of the heat sink 200. This mechanical interlocking structure significantly enhances the bonding strength between the heat sink 200 and the substrate 100, ensuring that it can withstand external forces such as vibration and thermal expansion during use.

[0325] By applying pressure in steps, the stress concentration problem that may be caused by a one-time strong impact is avoided, the risk of damage to the substrate 100 and the heat sink 200 is reduced, and the service life of the heat sink is extended.

[0326] As a feasible implementation, the riveting device 400 controls the substrate 100 to move a step, and repeats the steps of the riveting device 400 conveying the heat sink 200 , the ejector pin pressing the heat sink 200 , the ejector pin 420 retracting, and the punch 440 pressing the substrate 100 .

[0327] For example, by automatically controlling the movement of the substrate 100, the next position to be riveted can be quickly located, reducing manual intervention and positioning time, thereby improving overall production efficiency. At the same time, the automated step movement ensures that each heat sink 200 can be accurately positioned at the correct position of the substrate 100, ensuring the quality consistency of each riveting point and reducing human errors.

[0328] Reference Fig. 20 As shown, the plurality of heat sinks 200 are riveted to the hole walls of the plurality of mounting holes 110 in a one-to-one correspondence.

[0329] As an achievable implementation, the pressure applied by the ejector pin 420 to the heat sink 200 is F N1 , F N1 Satisfy: 100N≤F N1 ≤200N.

[0330] For example, by limiting the pressure applied by the ejector pin 420 to the heat sink 200 to between 100 N and 200 N, damage to the heat sink 200 or the substrate 100 due to excessive pressure can be avoided.

[0331] As an achievable implementation, the pressure applied by the punch 440 to the substrate 100 is F N2 , F N2 Satisfy: 200N≤F N2 ≤500N.

[0332] Exemplarily, the pressure applied by the punch 440 to the substrate 100 within this range can ensure that the substrate 100 undergoes moderate plastic deformation without causing the heat sink 200 to be broken or damaged.

[0333] The lower limit of the pressure range (200N) ensures that the substrate 100 can be sufficiently deformed to form an effective mechanical interlocking structure, while the upper limit (500N) prevents the substrate 100 or the heat sink 200 from being damaged due to excessive pressure.

[0334] As an achievable implementation, after riveting a portion of the heat sink 200 to the mounting hole 110 by a riveting process, the method for preparing the heat sink further includes:

[0335] The side wall of the substrate 100 is marked by a laser marking machine.

[0336] For example, laser engraving technology can create permanent marks on the sidewalls of the substrate 100 that are not easily worn or faded, ensuring long-term readability and stability of the marks.

[0337] As a feasible implementation method, after marking the side wall of the substrate 100 by a laser engraving marking machine, the method for preparing the heat sink further includes:

[0338] The substrate 100 and the heat sink 200 are electroplated to form an intermediate heat sink.

[0339] For example, the electroplating layer can provide additional protection to prevent the substrate 100 and the heat sink 200 from being affected by oxidation and corrosion during use, thereby extending the service life of the heat sink.

[0340] As a feasible implementation manner, after the substrate 100 and the heat sink 200 are electroplated to form an intermediate heat sink, the method for preparing the heat sink further includes:

[0341] A hydraulic press is used to press the arc on the middle heat sink to form the heat sink.

[0342] For example, during the manufacturing process, the substrate 100 may be warped or deformed due to mechanical processing or internal stress of the material. By pressing the arc, appropriate force can be applied to correct these unevenness, so that the substrate 100 can be restored to a desired flat state.

[0343] As a feasible implementation method, after the middle heat sink is arc-pressed by a hydraulic press to form the heat sink, the preparation method of the heat sink further includes:

[0344] Check the curvature of the heat sink.

[0345] For example, the curvature inspection can verify whether the actual curvature of the heat sink meets the design specifications and tolerance requirements, ensuring that each heat sink meets the design standards.

[0346] As a feasible implementation manner, after the curvature test of the heat sink is performed, the method for preparing the heat sink further includes:

[0347] Perform a visual inspection of the heat sink.

[0348] For example, appearance inspection can identify and eliminate surface defects such as scratches, dents, color differences, stains or other non-standard appearance issues, ensuring that the visual quality of the heat sink meets customer and market expectations.

[0349] As a feasible implementation manner, after the appearance inspection of the heat sink, the preparation method of the heat sink further includes:

[0350] Packing the heat sink.

[0351] After the heat sink 200 is partially riveted to the mounting hole 110, a laser engraving marking machine with a repeatability of 2 μm is used to mark the side of the heat sink. The heat sink is then electroplated, and the thickness of the coating on the surface of the heat sink is between 7-12 μm.

[0352] Then the heat sink was tested for corrosion resistance by soaking it in salt spray for 24 hours. Then the heat sink was pressed by a 30-50 ton hydraulic press. Figure 2 In the direction shown by Y, the height difference of the heat sink is between 0.8-1.0mm. Figure 2 In the direction indicated by X, the height difference of the heat sink is between 0.2-0.3mm. Then, the heat sink is inspected for curvature using a device with a resolution of 0.5μm (such as a three-coordinate measuring machine), and then the heat sink is inspected for appearance, and finally the heat sink is packaged.

[0353] In a third aspect, an embodiment of the present application provides a heat dissipation device, including a heat dissipation plate.

[0354] It is understandable that, since the heat dissipation device of the present application adopts the technical solution of the above-mentioned heat dissipation plate embodiment, it at least has the beneficial effects brought by the technical solution of the above-mentioned embodiment, which will not be described one by one here.

[0355] In a fourth aspect, an embodiment of the present application provides an electronic device, including a heat dissipation device. The electronic device includes a computer, a consumer electronic product, a communication device, and an automotive electronic device. The present application does not limit the specific type of the electronic device.

[0356] It is understandable that, since the electronic device of the present application adopts the technical solution of the above-mentioned heat dissipation device embodiment, it at least has the beneficial effects brought by the technical solution of the above-mentioned embodiment, which will not be described one by one here.

[0357] Finally, it should be noted that those skilled in the art will readily conceive of other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention, which follow the general principles of the present invention and include common knowledge or customary technical means in the art not disclosed by the present invention, are not limited to the precise structure described above and shown in the drawings, and may be modified and changed in various ways without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A heat sink, characterized in that: include: A substrate, the substrate (100) having a mounting hole (110); A heat sink (200), a portion of which extends into the mounting hole (110), and the heat sink (200) located in the mounting hole (110) is riveted to a hole wall of the mounting hole (110).

2. The heat sink according to claim 1, characterized in that: The heat sink (200) and the mounting hole (110) are interference fit.

3. The heat sink according to claim 2, characterized in that: The dimension of the heat sink (200) along a direction perpendicular to the extension direction is greater than the opening dimension of the mounting hole (110).

4. The heat sink according to claim 1, characterized in that: The heat sink (200) has a mounting portion (210), and the mounting portion (210) is located in the mounting hole (110).

5. The heat sink according to claim 4, characterized in that: The peripheral side wall of the mounting portion (210) has a first groove (220).

6. The heat sink according to claim 5, characterized in that: A first protrusion (120) is provided on a side wall of the mounting hole (110), and the first protrusion (120) is embedded in the first groove (220).

7. The heat sink according to claim 5, characterized in that: The first groove (220) is an annular groove, and the first groove (220) is arranged around the outer circumference of the mounting portion (210).

8. The heat sink according to claim 6, characterized in that: The first protrusion (120) is an annular protrusion, and the first protrusion (120) is arranged around the inner peripheral side wall of the mounting hole (110).

9. The heat sink according to claim 6, characterized in that: There are a plurality of the first grooves (220), and the plurality of the first grooves (220) are arranged at intervals along the circumference of the mounting portion (210).

10. The heat sink according to claim 9, characterized in that: There are a plurality of first protrusions (120), and the plurality of first protrusions (120) are arranged at intervals along the circumference of the mounting hole (110).

11. The heat sink according to claim 10, characterized in that The plurality of first protrusions (120) are embedded in the plurality of first grooves (220) in a one-to-one correspondence.

12. The heat sink according to claim 4, characterized in that: The peripheral side wall of the mounting portion (210) is provided with a second protrusion.

13. The heat sink according to claim 12, characterized in that: The side wall of the mounting hole (110) has a second groove, and the second protrusion is embedded in the second groove.

14. The heat sink according to claim 12, characterized in that: The second protrusion is an annular protrusion, and the second protrusion is arranged around the outer circumference of the mounting portion (210).

15. The heat sink according to claim 13, characterized in that: The second groove is an annular groove, and the second groove is arranged around the inner peripheral side wall of the mounting hole (110).

16. The heat sink according to claim 13, characterized in that: There are a plurality of second protrusions, and the plurality of second protrusions are arranged at intervals along the circumference of the mounting portion (210).

17. The heat sink according to claim 16, characterized in that: There are a plurality of second grooves, and the plurality of second grooves are arranged at intervals along the circumference of the mounting hole (110).

18. The heat sink according to claim 17, characterized in that: The plurality of second protrusions are embedded in the plurality of second grooves in a one-to-one correspondence.

19. The heat sink according to claim 4, characterized in that: The peripheral side wall of the mounting portion (210) has a first groove (220), and the peripheral side wall of the mounting portion (210) is provided with a second protrusion.

20. The heat sink according to claim 19, characterized in that The hole side wall of the mounting hole (110) has a second groove, and the hole side wall of the mounting hole (110) is provided with a first protrusion (120); the first protrusion (120) is embedded in the first groove (220), and the second protrusion is embedded in the second groove.

21. The heat sink according to claim 20, characterized in that The first groove (220) is an annular groove, and the first groove (220) is arranged around the outer circumference of the mounting portion (210).

22. The heat sink according to claim 20, characterized in that The second protrusion is an annular protrusion, and the second protrusion is arranged around the outer circumference of the mounting portion (210).

23. The heat sink according to claim 20, characterized in that The second groove is an annular groove, and the second groove is arranged around the inner peripheral side wall of the mounting hole (110).

24. The heat sink according to claim 20, characterized in that: The first protrusion (120) is an annular protrusion, and the first protrusion (120) is arranged around the inner peripheral side wall of the mounting hole (110).

25. The heat sink according to claim 20, characterized in that There are a plurality of the first grooves (220), and the plurality of the first grooves (220) are arranged at intervals along the circumference of the mounting portion (210).

26. The heat sink according to claim 25, characterized in that There are multiple second protrusions, and the multiple second protrusions are arranged at intervals along the circumference of the mounting portion (210).

27. The heat sink according to claim 26, characterized in that Along the circumference of the mounting portion (210), a plurality of the first grooves (220) and a plurality of the second protrusions are alternately arranged.

28. The heat sink according to claim 20, characterized in that There are a plurality of second grooves, and the plurality of second grooves are arranged at intervals along the circumference of the mounting hole (110).

29. The heat sink according to claim 28, characterized in that There are a plurality of first protrusions (120), and the plurality of first protrusions (120) are arranged at intervals along the circumference of the mounting hole (110).

30. The heat sink according to claim 29, characterized in that Along the circumference of the mounting hole (110), a plurality of the second grooves and a plurality of the first protrusions (120) are alternately arranged.

31. The heat sink according to claim 4, characterized in that There are a plurality of mounting holes (110), and the plurality of mounting holes (110) are arranged in an array on the substrate (100).

32. The heat sink according to claim 31, characterized in that There are a plurality of heat sinks (200), and the plurality of heat sinks (200) are arranged in an array on the substrate (100).

33. The heat sink according to claim 32, characterized in that The plurality of heat sinks (200) are riveted to the hole walls of the plurality of mounting holes (110) in a one-to-one correspondence.

34. The heat dissipation plate according to any one of claims 1 to 33, characterized in that: The heat sink (200) comprises a heat sink column.

35. The heat dissipation plate according to any one of claims 1 to 33, characterized in that: The substrate (100) comprises a middle portion, and the heat sink (200) is disposed in the middle portion.

36. The heat sink according to claim 35, characterized in that The substrate (100) comprises an edge portion, and the edge portion is located on the side of the middle portion close to the edge of the substrate (100).

37. The heat sink according to claim 36, characterized in that The edge portion is provided with a connecting structure.

38. The heat sink according to claim 37, characterized in that The connection structure comprises a connection hole (140).

39. The heat sink according to claim 7, characterized in that The shape of the mounting hole (110) is compatible with the cross-sectional shape of the mounting portion (210).

40. The heat sink according to claim 39, characterized in that The mounting hole (110) is a round hole.

41. The heat sink according to claim 40, characterized in that The cross section of the mounting portion (210) is circular.

42. The heat sink according to claim 41, characterized in that The inner diameter of the mounting hole (110) is A, the diameter of the mounting portion (210) is B, the ratio of A to B is C, and C satisfies: 0.85≤C<1.

43. The heat sink according to claim 42, characterized in that The A satisfies: 2.2mm≤A<2.5mm.

44. The heat sink according to claim 42, characterized in that The B satisfies: 2.5mm≤B≤2.6mm.

45. The heat dissipation plate according to any one of claims 1 to 33, characterized in that: The heat sink (200) has a height D, and D satisfies: 6 mm ≤ D ≤ 8 mm.

46. ​​The heat sink according to claim 42, characterized in that The first groove (220) has a first groove wall, which is a wall surface of the first groove (220) on a side close to the opening of the mounting hole (110).

47. The heat sink according to claim 46, characterized in that Along the hole depth direction of the mounting hole (110), there is a distance between the first groove wall and the hole opening of the mounting hole (110).

48. The heat sink according to claim 47, characterized in that The spacing is E, and E satisfies: E>0.2mm.

49. The heat sink according to claim 42, characterized in that The depth F of the mounting hole (110); Along the depth direction of the mounting hole (110), the extension dimension of the first groove (220) is G; The ratio of G to F is H, and H satisfies: 0.3≤H<1.

50. The heat sink according to claim 49, characterized in that The F satisfies: 0.5mm<F≤1.0mm.

51. The heat sink according to claim 49, characterized in that The G satisfies: 0.3mm≤G≤0.5mm.

52. The heat sink according to claim 42, characterized in that The groove depth of the first groove (220) is I, the diameter of the mounting portion (210) is B, the ratio of I to B is J, and J satisfies: 0.12≤J≤0.

2.

53. The heat sink according to claim 41, characterized in that The groove depth of the first groove (220) is I, the inner diameter of the mounting hole (110) is A, the ratio of I to A is K, and K satisfies: 0.12≤K<0.

23.

54. The heat sink according to claim 52, characterized in that The groove depth I of the first groove (220) satisfies: 0.3mm≤I≤0.5mm.

55. The heat sink according to claim 1, characterized in that The depth of the mounting hole (110) is F, the thickness of the substrate (100) is L, the ratio of F to L is M, and M satisfies: 0.14<M≤0.

4.

56. The heat sink according to claim 55, characterized in that The thickness L of the substrate (100) satisfies: 2.5 mm≤L≤3.5 mm.

57. The heat sink according to claim 1, characterized in that The heat sink (200) is riveted to at least one side of the substrate (100) in a thickness direction.

58. A method for preparing a heat dissipation plate, characterized in that: Used to prepare the heat dissipation plate according to any one of claims 1 to 57, the preparation method of the heat dissipation plate comprising: Providing a substrate (100); forming a mounting hole (110) on the substrate (100); Providing a heat sink (200); A portion of the heat sink (200) is extended into the mounting hole (110), and the heat sink (200) located in the mounting hole (110) is riveted to the hole wall of the mounting hole (110).

59. The method for preparing a heat dissipation plate according to claim 58, characterized in that: The step of forming a mounting hole (110) on the substrate (100) specifically comprises: The mounting hole (110) is formed on the substrate (100) by a stamping process.

60. The method for preparing a heat dissipation plate according to claim 58, characterized in that: The step of extending a portion of the heat sink (200) into the mounting hole (110) and riveting the heat sink (200) located in the mounting hole (110) to the hole wall of the mounting hole (110) specifically comprises: Part of the heat sink (200) is riveted to the mounting hole (110) through a riveting process.

61. The method for preparing a heat dissipation plate according to claim 59, characterized in that: The step of forming the mounting hole (110) on the substrate (100) by a stamping process specifically comprises: Fixing the substrate (100) on a punching machine device; A pressing plate (300) having a through hole (310) is installed on one side of the substrate (100); The punching needle (410) of the punching machine device is used to penetrate the through hole (310) on the pressing plate (300) and drill a hole in the base plate (100) to form the mounting hole (110).

62. The method for preparing a heat dissipation plate according to claim 58, characterized in that: The providing of the heat sink (200) specifically comprises: The heat sink (200) is prepared by a spindle machine or a cold heading machine.

63. The method for preparing a heat dissipation plate according to claim 60, characterized in that: The step of riveting a portion of the heat sink (200) to the mounting hole (110) by a riveting process specifically comprises: Controlling the riveting device (400) to transport the heat sink (200) to the mounting hole (110); Controlling the ejector pin (420) of the riveting device (400) to move in a direction close to the substrate (100), and using the ejector pin (420) to press the heat sink (200) into the mounting hole (110); Controlling the ejector pin (420) to retract; The punch (440) of the riveting device (400) is controlled to move in a direction close to the heat sink (200); the punch (440) is used to press the substrate (100) on the peripheral side of the heat sink (200) to deform the substrate (100) to form a first protrusion (120), and the first protrusion (120) is embedded in the first groove (220) of the heat sink (200).

64. The method for preparing a heat dissipation plate according to claim 63, characterized in that: The riveting device (400) controls the substrate (100) to move a step distance, and repeats the steps of the riveting device (400) conveying the heat sink (200), the ejector pin (420) pressing the heat sink (200), the ejector pin (420) retracting, and the punch (440) pressing the substrate (100).

65. The method for preparing a heat dissipation plate according to claim 63, characterized in that: The pressure applied by the ejector pin (420) to the heat sink (200) is F N1 , the F N1 Satisfy: 100N≤F N1 ≤200N.

66. The method for preparing a heat dissipation plate according to claim 63, characterized in that: The pressure applied by the punch (440) to the substrate (100) is F N2 , the F N2 Satisfy: 200N≤F N2 ≤500N.

67. The method for preparing a heat dissipation plate according to claim 60, characterized in that: After riveting a portion of the heat sink (200) to the mounting hole (110) through a riveting process, the method for preparing the heat sink further comprises: The side wall of the substrate (100) is marked by a laser marking machine.

68. The method for preparing a heat dissipation plate according to claim 67, characterized in that: After marking the side wall of the substrate (100) by a laser engraving marking machine, the method for preparing the heat dissipation plate further comprises: The substrate (100) and the heat sink (200) are electroplated to form an intermediate heat sink.

69. The method for preparing a heat dissipation plate according to claim 68, characterized in that: After the substrate (100) and the heat sink (200) are electroplated to form the intermediate heat sink, the method for preparing the heat sink further comprises: A hydraulic press is used to press the middle heat sink into an arc to form the heat sink.

70. The method for preparing a heat dissipation plate according to claim 69, characterized in that: After the intermediate heat sink is pressed with a hydraulic press to form the heat sink, the method for preparing the heat sink further includes: The heat sink is tested for curvature.

71. The method for preparing a heat dissipation plate according to claim 70, characterized in that: After the curvature test of the heat sink is performed, the method for preparing the heat sink further comprises: Perform an appearance inspection on the heat sink.

72. The method for preparing a heat dissipation plate according to claim 71, characterized in that: After the appearance inspection of the heat sink, the method for preparing the heat sink further comprises: The heat sink is packaged.

73. A heat dissipation device, characterized in that: A heat sink comprising the heat dissipation plate described in any one of claims 1-57.

74. An electronic device, characterized in that: Including the heat dissipation device as described in claim 73.

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