Electromagnetic wave absorbing device

Abstract

The invention provides an electromagnetic wave absorption device. The electromagnetic wave absorption device comprises communication equipment, a heat dissipation assembly and a wave absorption assembly, wherein the heat dissipation assembly and the wave absorption assembly are installed on the communication equipment; the heat dissipation assembly comprises a bottom plate, and the bottom plate is provided with at least one cooling fin. The wave absorbing assembly is arranged on the cooling fins in a sleeving mode and comprises an outer-layer wave absorbing component and inner-layer wave absorbing components, and at least one inner-layer wave absorbing component is installed in the outer-layer wave absorbing component; the outer-layer wave-absorbing part is used for absorbing interference electromagnetic waves in the communication process of the communication equipment, and the inner-layer wave-absorbing part is used for absorbing residual interference electromagnetic waves penetrating through the outer-layer wave-absorbing part.

Description

Technical Field

[0001] The embodiments of this specification relate to the technical field of electromagnetic wave protection and absorption, and in particular to an electromagnetic wave absorption device. Background Art

[0002] Wave-absorbing technology mainly relies on absorbing coatings or absorbers to absorb excess electromagnetic waves. However, absorbers have problems such as high cost, high mass, difficult transportation, and strong selectivity for test wavelengths. Although absorbing coatings can avoid the above problems, due to their small heat capacity, they are prone to excessive temperature rise in high-power radio tests, resulting in local heat accumulation, which may cause thermal damage to the tested product. At the same time, when the absorbing coating is in hard contact with the metal, the high reflectivity of the metal will weaken the absorbing performance, causing the reflected echo to damage precision components. Traditional heat dissipation methods mainly rely on thermal radiation and heat conduction, and have low heat dissipation efficiency. Therefore, there is an urgent need for a more effective electromagnetic wave absorption device to solve the above problems. Summary of the invention

[0003] In view of this, an embodiment of the present specification provides an electromagnetic wave absorbing device.

[0004] According to a first aspect of an embodiment of this specification, there is provided an electromagnetic wave absorbing device, comprising:

[0005] Communication equipment, heat dissipation components and wave absorbing components installed on communication equipment;

[0006] The heat dissipation assembly comprises a base plate, and at least one heat sink is mounted on the base plate;

[0007] The absorbing component is sleeved on the heat sink, and the absorbing component comprises an outer absorbing component and an inner absorbing component, and at least one inner absorbing component is installed in the outer absorbing component;

[0008] The outer absorbing component is used to absorb interference electromagnetic waves during the communication process of the communication device, and the inner absorbing component is used to absorb the remaining interference electromagnetic waves that penetrate the outer absorbing component.

[0009] Optionally, the inner and outer surfaces of the outer absorbing component are adsorbed with absorbing materials to absorb the interfering electromagnetic waves; the inner and outer surfaces of the inner absorbing component are adsorbed with absorbing materials to absorb the remaining interfering electromagnetic waves that penetrate the outer absorbing component.

[0010] Optionally, the outer absorbing component is obtained by splicing absorbing material and at least one snap-fit, and the outer absorbing component corresponds to an outer absorbing space. The inner absorbing component is obtained by splicing absorbing material and at least one snap-fit, and the inner absorbing component corresponds to an inner absorbing space. The outer absorbing space is larger than the inner absorbing space.

[0011] Optionally, the at least one heat sink is an anodized aluminum alloy radiation heat sink for dissipating heat; the surface of the at least one heat sink is fixed with an absorbing material corresponding to the absorbing component by a buckle, the shape and size of the absorbing material are the same as the shape and size of the at least one heat sink, and the absorbing material is used to absorb interfering electromagnetic waves.

[0012] Optionally, a thermal pad is sandwiched between the heat sink and the base plate, and the heat sink and the thermal pad are mounted on the base plate by fasteners. The thermal pad is located between the base plate and the connecting plate of the heat sink, and the connecting plate overlaps with the thermal pad. The thermal pad is used to conduct heat in the heat sink to the base plate for heat dissipation.

[0013] Optionally, the heat sink is located between the outer absorbing component and the inner absorbing component, an air layer exists between the heat sink and the outer absorbing component, and an air layer exists between the heat sink and the inner absorbing component.

[0014] Optionally, the absorbing assembly is sleeved on the heat sink, and the length of the bottom side of the heat sink is equal to the length of the bottom diagonal of the absorbing assembly, so as to fix the absorbing assembly and the heat sink.

[0015] Optionally, a first inner absorbing component and a second inner absorbing component are diagonally installed inside the outer absorbing component to absorb remaining interference electromagnetic waves penetrating the outer absorbing component, and the outer absorbing component and the inner absorbing component are connected without glue.

[0016] The present specification provides an electromagnetic wave absorption device, including a communication device, a heat dissipation component installed on the communication device, and an absorbing component. The heat dissipation component includes a base plate, and at least one heat sink is installed on the base plate. The absorbing component is sleeved on the heat sink, and the absorbing component includes an outer absorbing component and an inner absorbing component, and at least one inner absorbing component is installed in the outer absorbing component. The outer absorbing component is used to absorb interference electromagnetic waves during the communication process of the communication device, and the inner absorbing component is used to absorb the remaining interference electromagnetic waves that penetrate the outer absorbing component. Using a lightweight absorbing component can absorb electromagnetic waves of different frequencies and improve the electromagnetic wave absorption performance. The base plate and the heat sink installed on the base plate can dissipate heat during the absorbing process, avoid local heat accumulation, and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of an electromagnetic wave absorption device provided by an embodiment of this specification;

[0018] Figure 2 It is a schematic diagram of an electromagnetic wave absorbing device absorbing component provided by an embodiment of this specification;

[0019] Figure 3 It is a schematic diagram of a heat dissipation component of an electromagnetic wave absorption device provided in one embodiment of the present specification.

[0020] Reference numerals

[0021] 1-base plate, 2-heat sink, 3-wave absorbing component, 4-communication equipment, 21-connecting plate, 31-inner absorbing component, 32-outer absorbing component, 5-thermal pad. DETAILED DESCRIPTION

[0022] The specific implementation of the present application is described below in conjunction with the accompanying drawings.

[0023] Many specific details are described in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application, so the present application is not limited by the specific implementation disclosed below.

[0024] The terms used in one or more embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit one or more embodiments of the present application. The singular forms of "a", "said" and "the" used in one or more embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in one or more embodiments of the present application refers to and includes any or all possible combinations of one or more associated listed items.

[0025] It should be understood that, although the terms first, second, etc. may be used to describe various information in one or more embodiments of the present application, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of one or more embodiments of the present application, the first may also be referred to as the second, and similarly, the second may also be referred to as the first. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0026] In the present application, “upper”, “lower”, “front”, “back”, “left”, “right”, etc. are only used to indicate the relative position relationship between related parts, rather than to limit the absolute positions of these related parts.

[0027] In the present application, “first”, “second”, etc. are only used to distinguish each other, rather than to indicate the degree of importance and order, or the premise of mutual existence.

[0028] In the present application, “equal”, “same”, etc. are not strictly limited in mathematical and / or geometric senses, but also include errors that can be understood by those skilled in the art and are allowed in manufacturing or use.

[0029] Unless otherwise stated, the numerical ranges in the present application include not only the entire range within its two endpoints but also several sub-ranges contained therein.

[0030] Wave-absorbing technology refers to the technology of using specific materials (i.e., absorbing materials) to absorb or significantly reduce the energy of electromagnetic waves projected onto its surface. These materials interact with electromagnetic waves through their internal microstructures, converting the energy of electromagnetic waves into heat or other forms of energy, thereby achieving the purpose of reducing or eliminating electromagnetic wave interference. With the rapid development of modern communication technology, especially the widespread application of technologies such as 5G, 6G, and autonomous driving radar, the problem of electromagnetic wave interference has become increasingly prominent. Most traditional electromagnetic wave shielding materials use a reflection mechanism with a reflectivity of more than 90%, while the electromagnetic waves that can actually be absorbed are often only about 10%. This effect can no longer meet the needs of modern science and technology for electromagnetic wave management. Therefore, wave-absorbing technology and its materials have developed rapidly.

[0031] Radio testing is an important support for the development of modern wireless communication technology. It plays a key role in ensuring the performance of communication equipment and promoting technological innovation. On the one hand, radio testing can verify the signal transmission quality and anti-interference ability of equipment in complex electromagnetic environments, ensure its reliability and stability, and meet a wide range of application needs; on the other hand, test data provides a theoretical basis for the research and development of new communication technologies (such as 5G, 6G and Internet of Things protocols), while supporting the formulation of international standards to ensure interoperability between devices. In addition, radio testing also plays an important role in optimizing the utilization of spectrum resources. By evaluating the frequency allocation, channel interference and bandwidth efficiency of equipment, it provides technical support for the efficient allocation of spectrum resources. Especially in the context of mobile phone direct connection technology, the communication frequency band is relatively low and the signal wavelength is long, which puts higher requirements on the performance of absorbing materials. Low-frequency signals are more likely to penetrate and reflect, resulting in increased interference between devices and affecting communication quality. Absorbing materials need to have excellent low-frequency absorption performance to effectively suppress the reflection and propagation of electromagnetic waves, reduce interference between devices, and improve the stability and reliability of signal transmission. Through radio testing, the absorption effect of absorbing materials in actual application environments can be evaluated, and their performance can be further optimized to meet the high requirements of mobile phone direct connection technology for low-frequency band communications. Therefore, radio testing is of irreplaceable significance in ensuring the sustainable development and widespread application of modern communication technology.

[0032] In practical applications, absorbing technology mainly relies on absorbing coatings or absorbers to absorb excess electromagnetic waves. However, absorbers have problems such as high cost, high mass, difficult transportation, and strong selectivity for test wavelengths. Although absorbing coatings can avoid the above problems, they are prone to excessive temperature rise in high-power radio tests due to their small heat capacity, resulting in local heat accumulation and possible thermal damage to the tested products. At the same time, when the absorbing coating is in hard contact with metal, the high reflectivity of the metal will weaken the absorbing performance, causing the reflected echo to damage precision components. In addition, traditional heat dissipation methods mainly rely on thermal radiation and heat conduction, with low heat dissipation efficiency, especially when the pyramid angle is high or the heat conduction path is long, which cannot meet the needs of complex test environments; and the design using adhesives is prone to volatilization and contamination of precision products at high temperatures. Although the temperature rise rate of the absorbing material can be effectively reduced by increasing the heat capacity of the tooling on which the absorbing material is applied, thereby slowing down the impact of high temperature on the absorbing performance to a certain extent, its cooling design does not fully consider the high reflectivity of metal to electromagnetic waves when the absorbing material is in hard contact with the metal. Since metal reflection can significantly weaken the electromagnetic wave absorption capacity of the absorbing material, this enhanced heat dissipation method greatly reduces the overall absorbing performance of the absorbing material during the cooling process, limiting its applicability in high-precision radio testing.

[0033] In view of this, the present application provides an electromagnetic wave absorption device, including a communication device, a heat dissipation component installed on the communication device, and an absorbing component. The heat dissipation component includes a bottom plate, and at least one heat sink is installed on the bottom plate. The absorbing component is sleeved on the heat sink, and the absorbing component includes an outer absorbing component and an inner absorbing component, and at least one inner absorbing component is installed in the outer absorbing component. The outer absorbing component is used to absorb interference electromagnetic waves during the communication process of the communication device, and the inner absorbing component is used to absorb the remaining interference electromagnetic waves that penetrate the outer absorbing component. Using a lightweight absorbing component can absorb electromagnetic waves of different frequencies and improve the electromagnetic wave absorption performance. The bottom plate and the heat sink installed on the bottom plate can dissipate heat during the absorbing process, avoid local heat accumulation, and improve the heat dissipation efficiency. By combining the comprehensive heat dissipation method of thermal radiation, heat conduction and heat convection, the design of the contact between the absorbing coating and the metal heat sink is optimized to solve the problem of insufficient compatibility between the absorbing performance and the heat dissipation performance. At the same time, the colloid design is abandoned to ensure the environmental protection and applicability of the device, thereby meeting the needs of high-precision radio testing.

[0034] See also Figure 1 As shown, Figure 1A schematic structural diagram of an electromagnetic wave absorbing device provided by an embodiment of the present application is shown. The electromagnetic wave absorbing device includes: a communication device 4, a heat dissipation component and an absorbing component 3 installed on the communication device 4; the heat dissipation component includes a base plate 1, and at least one heat sink 2 is installed on the base plate 1; the absorbing component 3 is sleeved on the heat sink 2, and the absorbing component 3 includes an outer absorbing component 32 and an inner absorbing component 31, and at least one inner absorbing component 31 is installed in the outer absorbing component 32; the outer absorbing component 32 is used to absorb interference electromagnetic waves during the communication process of the communication device 4, and the inner absorbing component 31 is used to absorb the remaining interference electromagnetic waves that penetrate the outer absorbing component 32.

[0035] In the communication scenario, in order to ensure the performance of the communication device 4, the communication device 4 is usually equipped with an electromagnetic wave absorption device to reduce electromagnetic wave interference and improve communication quality and stability. The electromagnetic wave absorption device includes a heat dissipation component and an absorbing component 3. The heat dissipation component is installed on the surface of the communication device 4 to absorb the interference electromagnetic waves generated by the outside world during the operation of the communication device 4, which will affect the normal operation of the communication device 4. The heat dissipation component of the electromagnetic wave absorption device includes a base plate 1 and a heat sink 2 installed on the base plate 1. The absorbing component 3 includes an outer absorbing component 32 and an inner absorbing component 31. At least one inner absorbing component 31 can be installed inside the outer absorbing component 32.

[0036] In practical applications, for electromagnetic waves that may interfere with communication equipment, the outer absorbing component 32 can absorb interfering electromagnetic waves with longer wavelengths, and the interfering electromagnetic waves that penetrate the outer absorbing component 32 will be reflected between the outer absorbing component 32 and the inner absorbing component 31, and then absorbed by the inner absorbing component 31. After the interfering electromagnetic waves are absorbed, the energy of the interfering electromagnetic waves is converted into heat energy, which is dissipated through the heat sink 2 and the base plate 1. The air layer between the heat sink 2 and the absorbing component 3 further enhances the convective heat transfer effect, thereby improving the heat dissipation performance of the electromagnetic wave absorbing device. When electromagnetic waves penetrate the outer absorbing component 32, the inner surface of the outer absorbing component 32 and the outer surface of the inner absorbing component 31 can absorb electromagnetic waves. Multiple heat sinks 2 can be neatly arranged on the base plate 1.

[0037] In specific implementation, the heat sink 2 can be fixed on the base plate 1 in an upright state by fasteners such as screws. An absorbing component 3 is mounted on each heat sink 2 to improve the absorbing efficiency and heat dissipation efficiency. The diagonal length of the bottom square of the absorbing component 3 can be equal to the length of the bottom side of the triangular heat sink 2, so that when the absorbing component 3 is mounted, the bottom side of the triangular heat sink 2 can be tightly connected with the absorbing component 3, and the absorbing component 3 is fixed to the heat sink 2 by the interaction force, so as to achieve the purpose of mounting the absorbing component 3 on the heat sink 2, and realize the installation of the absorbing component 3 on the base plate 1. The inner absorbing component 31 and the outer absorbing component 32 can be connected by a relatively light connection method such as a stapler, sewing with needle and thread, without the need to use adhesives such as glue for pasting. The outer absorbing component 32 and the inner absorbing component 31 are connected by mechanical fixing or other non-adhesive methods to avoid the contamination of precision products by colloid volatilization.

[0038] The heat dissipation component and the wave absorbing component 3 in the electromagnetic wave absorbing device can also be applied to the fields of autonomous driving, aerospace, medical treatment, construction, etc. In the radar system of an autonomous vehicle, the wave absorbing technology can improve the detection accuracy and anti-interference ability of the radar system. The electromagnetic wave absorbing device can reduce the electromagnetic wave interference around the radar system, thereby improving the radar's perception of the surrounding environment and ensuring driving safety. In aerospace equipment such as satellites and aircraft, the electromagnetic wave absorbing device can be used to reduce the impact of electromagnetic waves on equipment performance. For example, in a satellite communication system, the electromagnetic wave interference between the satellite and the ground station can be reduced and the communication quality can be improved by using the electromagnetic wave absorbing device. At the same time, in aviation equipment such as aircraft, the electromagnetic wave absorbing device can also be used to reduce the reflection of radar waves and improve the stealth performance of the aircraft. In medical electronic equipment, the electromagnetic wave absorbing device can be used to reduce the impact of electromagnetic radiation on doctors and patients. For example, in nuclear magnetic resonance imaging (MRI) equipment, the electromagnetic wave interference around the equipment can be reduced by using absorbing materials to improve the imaging quality. In buildings such as urban high-rise buildings, electromagnetic wave reflection may cause problems such as ghosting. By applying electromagnetic wave absorption devices in buildings, the reflection and scattering of electromagnetic waves can be effectively reduced and the electromagnetic environment can be improved.

[0039] In summary, the electromagnetic wave absorption device does not use adhesives, which prevents the volatilization of colloids due to temperature changes from contaminating precision products, and provides more reliable use guarantees for high-precision radio testing. With optimized cooling design and multiple heat dissipation methods, it can exert stable wave absorption performance in complex and changeable environments, providing more reliable technical support for high-precision radio testing. By adding a thermal convection method, the limitations of heat conduction being constrained by distance and the long time it takes for heat to be transferred to the bottom plate (cold plate) when the angle cone is high are overcome, thereby expanding the scope of application of the use environment. Combining the three heat conduction methods of thermal radiation, thermal conduction and thermal convection, the heat dissipation effect is more significant, and high heat dissipation performance can be maintained in any environment, effectively reducing the temperature rise rate of the absorbing material.

[0040] Furthermore, considering the electromagnetic wave absorption performance of the absorbing component 3 and the heat dissipation component, absorbing positions can be sprayed on the inner and outer surfaces of the outer absorbing component 32, so that the absorbing material is adsorbed on the inner and outer surfaces of the outer absorbing component 32 to absorb interfering electromagnetic waves. Similarly, the absorbing material is sprayed on the inner and outer surfaces of the inner absorbing component 31 to enhance the electromagnetic wave absorption effect of the inner absorbing component 31. In specific implementation, the inner and outer surfaces of the outer absorbing component 32 adsorb the absorbing material to absorb the interfering electromagnetic waves; the inner and outer surfaces of the inner absorbing component 31 adsorb the absorbing material to absorb the remaining interfering electromagnetic waves that penetrate the outer absorbing component 32.

[0041] In practical applications, both the outer absorbing component 32 and the inner absorbing component 31 can be constructed of absorbing materials sprayed with absorbing substances. The absorbing substance can be a black material with the function of absorbing electromagnetic waves, and the absorbing position can include materials such as carbon black and flame retardants. The absorbing material sprayed with the absorbing substance is curled and / or bent to form a hollow cone. The size of the outer absorbing component 32 and the inner absorbing component 31 can be freely adjusted, so that the inner absorbing component 31 is smaller than the outer absorbing component 32, and the inner absorbing component 31 can be placed in the outer absorbing component 32, and there is still space for placing the heat sink 2 in the outer absorbing component 32, as well as the space between the heat sink 2 and the outer absorbing component 32, and the space between the heat sink 2 and the inner absorbing component 31, so that the interfering electromagnetic waves penetrating the outer absorbing component 32 can be reflected in the space by the outer absorbing component 32, the heat sink 2 and the inner absorbing component 31. During the reflection process, the electromagnetic waves will be absorbed by the inner surface of the outer absorbing component 32, the outer surface of the inner absorbing component 31, and the absorbing material on the surface of the heat sink 2. The expansion of the electromagnetic wave absorption area can improve the absorption efficiency of the interfering electromagnetic waves.

[0042] Furthermore, the electromagnetic wave absorbing device uses absorbing materials and at least one buckle to obtain the outer absorbing component 32, and the outer absorbing component 32 corresponds to the outer absorbing space. The inner absorbing component 31 is obtained by using absorbing materials and at least one buckle to obtain the inner absorbing component 31, and the inner absorbing component 31 corresponds to the inner absorbing space. The outer absorbing space is larger than the inner absorbing space.

[0043] In a specific implementation, the outer absorbing component 32 can be spliced ​​from absorbing materials, and the absorbing materials are folded and / or curled into a cone, and fixed by buckles to obtain the outer absorbing component 32. Similarly, the inner absorbing component 31 can also be spliced ​​from absorbing materials, and the absorbing materials are folded and / or curled into a cone, and fixed by buckles to obtain the inner absorbing component 31. The outer absorbing component 32 can be a cone or a pyramid, and the inner absorbing component 31 can be a cone or a pyramid. Both the outer absorbing component 32 and the inner absorbing component 31 adopt a non-glue fixed structure design, which can avoid the contamination of precision products by the volatilization of colloid.

[0044] like Figure 2 As shown, the outer absorbing component 32 can be composed of two parts, namely, a cone and a column. The outer absorbing component 32 is spliced ​​together by a tetrahedron and a tetrahedron. The tetrahedron can be a cube formed by splicing four identical squares, and the side length of the cube is equal to the length of the base of each triangle of the tetrahedron. The inner absorbing component 31 is placed or installed in the outer absorbing space of the outer absorbing component 32, so that the interfering electromagnetic waves penetrating the outer absorbing component 32 can be reflected in the outer absorbing space, and then absorbed by the inner surface of the outer absorbing component 32 and the outer surface of the inner absorbing component 31. Improve the absorption efficiency of interfering electromagnetic waves. The installation position and number of the inner absorbing component 31 can be reasonably planned according to the size of the outer absorbing space and the insertion position of the heat sink 2.

[0045] Furthermore, considering that the heat sink 2 needs to be inserted into the absorbing component 3, and when the outer absorbing component 32 absorbs interfering electromagnetic waves, some interfering electromagnetic waves penetrate the outer absorbing component 32 and enter the inner part of the outer absorbing component 32. At this time, in order to enable the heat sink 2 to also have the ability to absorb interfering electromagnetic waves, the absorbing material of the absorbing component 3 can be fixed on the surface of the heat sink 2. In a specific implementation, the at least one heat sink 2 is an anodized aluminum alloy radiation heat sink 2 for dissipating heat; the absorbing material corresponding to the absorbing component 3 is fixed on the surface of the at least one heat sink 2 by a buckle, and the shape and size of the absorbing material are the same as those of the at least one heat sink 2, and the absorbing material is used to absorb interfering electromagnetic waves.

[0046] In practical applications, the heat sink 2 can be an anodized aluminum alloy radiation heat sink 2, which can achieve rapid cooling and dissipate the heat generated after the interference electromagnetic waves are absorbed. The absorbing material used in the absorbing component 3 is fixed on the surface of the heat sink 2 by a buckle, and the absorbing material can be cut to the size of the heat sink 2, so that the cut absorbing material can overlap with the heat sink 2, and the cut absorbing material is placed on the two surfaces of the heat sink 2 and fixed by buckles, so that the heat sink 2 has the ability to absorb interference electromagnetic waves, and the heat generated by absorbing the interference electromagnetic waves can be dissipated through the heat sink 2, thereby improving the heat dissipation efficiency.

[0047] The absorbing material is fixed to the heat sink 2 by snaps, without the need for pasting with colloid materials, to avoid the contamination of precision products by colloid volatilization. The absorbing material is cut to the same size and shape as the heat sink 2, so that the absorbing material and the heat sink 2 can fit tightly. The front and back surfaces of the absorbing material are sprayed with absorbing materials to improve the absorption efficiency of interfering electromagnetic waves. The high reflectivity of metal to electromagnetic waves when the absorbing material is in hard contact with metal is fully considered. Through optimized design, the influence of metal reflection on the absorbing ability of the absorbing material is significantly reduced, thereby avoiding a significant decrease in absorbing performance and improving the applicability of the absorbing material in high-precision radio testing.

[0048] Furthermore, a thermal pad 5 is sandwiched between the heat sink 2 and the base plate 1, and the heat sink 2 and the thermal pad 5 are installed on the base plate 1 by fasteners. The thermal pad 5 is located between the base plate 1 and the connecting piece 21 of the heat sink 2, and the connecting piece 21 overlaps with the thermal pad 5. The thermal pad 5 is used to conduct the heat in the heat sink 2 to the base plate 1 for heat dissipation.

[0049] In a specific implementation, a thermal pad 5 may be sandwiched between the heat sink 2 and the base plate 1, so that the heat of the heat sink 2 can be quickly transferred to the base plate 1 for heat dissipation. In order to facilitate fixing the heat sink 2 on the base plate 1, the heat sink 2 may include a heat sink 2 portion having the same shape and size as the thermal pad 5, that is, a connecting piece 21. Holes may be provided on the connecting piece 21 and the thermal pad 5 at the same position, so that the heat sink 2 and the thermal pad 5 can be fixed to the base plate 1 by fasteners such as screws.

[0050] In practical applications, such as Figure 3As shown, the main part of the heat sink 2 can be a triangular metal sheet, which is connected to the connecting piece 21 by bending, and the connecting piece 21 is provided with a hole. The main part of the heat sink 2 can be an isosceles triangle with a long waist, and the height of the main part of the heat sink 2 needs to be less than the height of the absorbing component 3, so that the heat sink 2 can be completely inserted into the absorbing component 3. The connecting piece 21 of the heat sink 2 can be the same shape and size as the thermal pad 5. The thermal pad 5 can be evenly arranged on the bottom plate 1, and each heat sink 2 is connected to the bottom plate 1 through a thermal pad 5 using fasteners such as screws. The heat sink 2 can be set to any shape such as circular, square, trapezoidal, triangular, etc. as needed. Correspondingly, the thermal pad 5 and the connecting piece 21 of the heat sink 2 can also be set to any shape such as circular, square, trapezoidal, triangular, etc. as needed.

[0051] It should be noted that when the surface of the heat sink 2 is covered with the absorbing material, the absorbing material needs to cover both the front and back surfaces of the heat sink 2, including the main body of the heat sink 2 and the connecting piece 21. In order to facilitate the fixing of the heat sink 2 on the base plate 1, it is also necessary to punch holes in the absorbing material covering the connecting piece 21, so that the fasteners can pass through the holes to install the heat sink 2 on the base plate 1. The thermal pad 5 is sandwiched between the heat sink 2 and the base plate 1, so that the heat of the heat sink 2 can be quickly transferred to the base plate 1 through the thermal pad 5, thereby improving the heat dissipation efficiency and achieving the purpose of rapid cooling.

[0052] Furthermore, considering that the interfering electromagnetic waves may not be completely absorbed by the outer absorbing component 32, the interfering electromagnetic waves that penetrate the outer absorbing component 32 enter the inner part of the outer absorbing component 32. At this time, the air layer in the outer absorbing component 32 can further enhance the convective heat transfer effect and improve the heat dissipation performance of the electromagnetic wave absorbing device. In specific implementation, the heat sink 2 is located between the outer absorbing component 32 and the inner absorbing component 31, and there is an air layer between the heat sink 2 and the outer absorbing component 32, and there is an air layer between the heat sink 2 and the inner absorbing component 31.

[0053] In practical applications, since the absorbing assembly 3 needs to be installed on the heat dissipation assembly, the heat sink 2 installed on the bottom plate 1 in the heat dissipation assembly needs to penetrate into the outer absorbing component 32 of the absorbing assembly 3. Since the heat sink 2 is a metal sheet with a certain thickness, after the absorbing assembly 3 is mounted on the heat sink 2, there is an air layer between the heat sink 2 and the outer absorbing component 32 of the absorbing assembly 3, which can further enhance the convective heat transfer effect, thereby improving the heat dissipation performance of the electromagnetic wave absorbing device.

[0054] In addition, since at least one inner absorbing component 31 is installed in the outer absorbing component 32, there are air layers between the outer absorbing component 32 and the heat sink 2, and between the heat sink 2 and the inner absorbing component 31. The interfering electromagnetic waves that penetrate into the outer absorbing component 32 through the outer absorbing component 32 can be gradually absorbed by the outer surface of the inner absorbing component 3, the inner surface of the outer absorbing component 32, and the absorbing material sprayed with the absorbing material installed on the surface of the heat sink 2 during the reflection process, thereby improving the absorption efficiency of the interfering electromagnetic waves.

[0055] Furthermore, the absorbing component 3 is sleeved on the heat sink 2 , and the length of the bottom side of the heat sink 2 is equal to the length of the bottom diagonal of the absorbing component 3 , so as to fix the absorbing component 3 and the heat sink 2 .

[0056] In specific implementation, the connection between the absorbing component 3 and the heat sink 2 can be a contact connection, that is, the length of the bottom edge of the heat sink 2 is equal to the diagonal of the bottom surface of the absorbing component 3. When the absorbing component 3 is put on the heat sink 2, the bottom of the absorbing component 3 can be in contact with the bottom edge of the heat sink 2 and tightly connected, so as to achieve the purpose of installing the absorbing component 3 on the base plate 1. When the base plate 1 is tilted, the absorbing component 3 will not fall off because the absorbing component 3 is light in weight and is tightly connected to the heat sink 2. The absorbing material constituting the absorbing component 3 can be a light material with a certain supporting capacity, such as non-woven fabric.

[0057] Furthermore, a first inner absorbing component 31 and a second inner absorbing component 31 are diagonally installed inside the outer absorbing component 32 to absorb the remaining interference electromagnetic waves penetrating the outer absorbing component 32, and the outer absorbing component 32 and the inner absorbing component 31 are connected without glue.

[0058] Two inner absorbing components, i.e., a first inner absorbing component 31 and a second inner absorbing component 31, may be installed diagonally inside the outer absorbing component 32. The first inner absorbing component 31 and the second inner absorbing component 31 may absorb interfering electromagnetic waves that penetrate the outer absorbing component 32 and enter the inner part of the outer absorbing component 32.

[0059] like Figure 2 As shown, the outer absorbing component 32 is composed of two structures, a quadrangular prism and a quadrangular pyramid, and the inner absorbing component 31 can be constructed as a right-angled triangular pyramid structure. Since the heat sink 2 needs to be installed at the diagonal of the bottom of the quadrangular prism in the outer absorbing component 32, the inner absorbing component 31 can be installed diagonally at the two corners of the quadrangular prism in the absorbing component. The inner absorbing component 31 and the outer absorbing component 32 can be connected by sewing or staples. The outer absorbing component 32 and the inner absorbing component 31 are connected without glue, which can avoid the contamination of precision products by colloid volatilization.

[0060] The preferred specific implementation modes and embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above implementation modes and embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the concept of the present application.

[0061] The above describes specific embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0062] It should be noted that, for the above-mentioned method embodiments, for the sake of simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described action sequence, because according to the present application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0063] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0064] The preferred embodiments of the present application disclosed above are only used to help explain the present application. The optional embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of the present application. The present application selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can understand and use the present application well. The present application is only limited by the claims and their full scope and equivalents.

Claims

1. An electromagnetic wave absorbing device, comprising: Communication equipment, heat dissipation components and wave absorbing components installed on communication equipment; The heat dissipation assembly comprises a base plate, and at least one heat sink is mounted on the base plate; The absorbing component is sleeved on the heat sink, and the absorbing component comprises an outer absorbing component and an inner absorbing component, and at least one inner absorbing component is installed in the outer absorbing component; The outer absorbing component is used to absorb interference electromagnetic waves during the communication process of the communication device, and the inner absorbing component is used to absorb the remaining interference electromagnetic waves that penetrate the outer absorbing component.

2. According to the electromagnetic wave absorption device of claim 1, the inner surface and outer surface of the outer absorbing component are adsorbed with absorbing materials to absorb the interfering electromagnetic waves; the inner surface and outer surface of the inner absorbing component are adsorbed with absorbing materials to absorb the remaining interfering electromagnetic waves that penetrate the outer absorbing component.

3. According to the electromagnetic wave absorbing device of claim 1, the outer absorbing component is obtained by splicing absorbing materials and at least one buckle, and the outer absorbing component corresponds to the outer absorbing space, and the inner absorbing component is obtained by splicing absorbing materials and at least one buckle, and the inner absorbing component corresponds to the inner absorbing space, and the outer absorbing space is larger than the inner absorbing space.

4. According to the electromagnetic wave absorption device of claim 1, the at least one heat sink is an anodized aluminum alloy radiation heat sink for dissipating heat; the surface of the at least one heat sink is fixed with an absorbing material corresponding to the absorbing component by a buckle, the shape and size of the absorbing material are the same as the shape and size of the at least one heat sink, and the absorbing material is used to absorb interfering electromagnetic waves.

5. According to the electromagnetic wave absorption device of claim 1, a thermal pad is sandwiched between the heat sink and the base plate, and the heat sink and the thermal pad are installed on the base plate by fasteners, the thermal pad is located between the base plate and the connecting plate of the heat sink, the connecting plate overlaps with the thermal pad, and the thermal pad is used to conduct heat in the heat sink to the base plate for heat dissipation.

6. The electromagnetic wave absorbing device according to claim 1, wherein the heat sink is located between the outer absorbing component and the inner absorbing component, an air layer exists between the heat sink and the outer absorbing component, and an air layer exists between the heat sink and the inner absorbing component.

7. The electromagnetic wave absorbing device according to claim 1, wherein the absorbing component is sleeved on the heat sink, and the bottom side length of the heat sink is equal to the bottom diagonal length of the absorbing component, so as to fix the absorbing component and the heat sink.

8. The electromagnetic wave absorbing device according to claim 1, wherein a first inner absorbing component and a second inner absorbing component are diagonally installed inside the outer absorbing component to absorb the remaining interfering electromagnetic waves that penetrate the outer absorbing component, and the outer absorbing component and the inner absorbing component are connected without glue.

Images