Integrated wiring method of inertial component

Abstract

The invention relates to an integrated wiring method of an inertial component. The method comprises the following steps: acquiring a three-dimensional diagram of the inertial component; all parts in the inertial assembly are subjected to region division, the inertial assembly is divided into a plurality of polyhedrons, and all the parts in the inertial assembly are distributed on the surfaces of all the polyhedrons; finding out connection points among the polyhedrons, wherein the connection points are provided with wall-through holes to ensure that the wires pass through the wall-through holes, and direction conversion is realized after the wires pass through the wall-through holes; the plane where the connection points of the polyhedron are located serves as a central plane, and the polyhedron is planarized and unfolded; and respectively marking the positions of each component and the electrical interface thereof in the unfolded plane of each layer as follows: designing a minimum channel in the unfolded plane. Through the printed board wiring technology, interference can be eliminated, wiring space can be saved, wiring in a narrow space is suitable, and consistency is good. Especially, after the integrated flexible printed board is adopted for wiring between the inertia assembly and the adjacent rotating frame, the wiring thickness is about 1 mm, and the reliability of equipment in a rotating state is greatly improved.

Description

Technical Field

[0001] The invention belongs to the technical field of flexible wiring, in particular to an integrated wiring method of an inertial component. Background Art

[0002] In an inertial navigation device, the inertial component usually includes three gyroscopes, an accelerometer component, and the acquisition circuits of the gyroscopes and accelerometers, the temperature acquisition circuit, the navigation solution circuit, and the power supply, etc. It is the core of the inertial navigation device. The pure strapdown inertial navigation can be obtained by directly installing the inertial component into the chassis. The single-axis or multi-axis rotating inertial navigation device can be obtained by installing it into a chassis with a rotating frame and configuring the rotation control circuit. Therefore, the performance of the inertial component directly determines the accuracy level of the inertial navigation device. One of the most commonly used wiring methods in the inertial component is wire welding. When complex signals are wired in a small space, it is very easy to generate interference between wires, which directly affects the navigation accuracy; and welding is greatly affected by human factors, and there is no consistency between devices; in the rotating inertial navigation device, the gap between the inertial component and its adjacent rotating axis is only 3 to 5 mm. The use of wire wiring is very easy to cause scratches during the rotation process, causing the device to not work properly. The other method is to combine wires with printed circuit boards. This method alleviates the interference situation, but the components in the inertial component are cross-distributed, and there is very little space to directly design the printed circuit board routing. Wire wiring is still the main method. In addition, a pair of adapters are required at the junction of the wires and the printed circuit board wiring to achieve the connection between the printed circuit board and the wires, which increases the wiring space requirements in the inertial component. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and propose an integrated wiring method for inertial components, which can ensure the flexible connection between multi-point positioning plates and take design measures to enable the connection points to work reliably under vibration, impact, temperature and other environments.

[0004] The present invention solves the technical problem by adopting the following technical solutions:

[0005] An integrated wiring method for an inertial component comprises the following steps:

[0006] Step 1, obtain a three-dimensional image of the inertial component;

[0007] Step 2: Divide all components in the inertial assembly into multiple polyhedrons P1, P2, ...Pn, and distribute the components in the inertial assembly on the surface of each polyhedron;

[0008] Step 3, find the connection points N1, N2, ... between the polyhedrons, set a through-hole at point Ni to ensure that the wiring passes through the through-hole and realizes the direction change after passing through, where i = 1, 2, ..., i ≤ n-1;

[0009] Step 4: Take the plane where the polyhedron connection point Ni is located as the center plane and unfold the polyhedron into a plane;

[0010] Step 5: Mark the positions of each component and its electrical interface in each unfolded plane as Xj (j=1, 2, ...), and design a minimized channel Ri (i≤n-1) in the unfolded plane, which connects all components and connection points Ni in the plane as an information channel between them;

[0011] Step 6: Design n minimized channels in n planarized unfolded planes. The connection point of two adjacent channels is Ni. Move and merge Ni to minimize the number of Ni.

[0012] Step 7: adjust the width of channel Ri according to the quantity and characteristics of information in each plane, design threading points to reduce the number of layers of the printed circuit board, and install fixing holes to fix the integrated wiring board.

[0013] Moreover, the specific implementation method of step 2 is: the hexahedron formed by the acquisition circuit of the accelerometer in the inertial component, the navigation solution circuit and the surface where the power supply is located is divided into P1; the structural parts of the gyroscope installation surface are ignored, and the hexahedron formed by the surface where the gyroscope faces the large surface area inside the platform is P2; the hexahedron formed by the surface where the electrical interface of the meter component is located and the surface where the temperature acquisition circuit is located is P3.

[0014] Moreover, the specific implementation method of step 3 is: each of the constructed hexahedrons P1, P2, and P3 has a face in the same plane, the connection point between P1 and P2 is N1, and the connection point between P2 and P3 is also N1.

[0015] Moreover, the specific implementation method of step 4 is: the two polyhedrons connected by Ni will be unfolded into two parallel and overlapping planes, and so on, and finally n polyhedrons will be unfolded into n parallel and overlapping planes, and the connection points between the planes are Ni (i≤n-1).

[0016] The advantages and positive effects of the present invention are:

[0017] The present invention obtains a three-dimensional diagram of an inertial component; divides all components in the inertial component into regions, divides the inertial component into multiple polyhedrons, and distributes each component in the inertial component on the surface of each polyhedron; finds the connection points between the polyhedrons, sets wall holes at the points to ensure that the wiring passes through the wall holes and realizes direction conversion after passing through; takes the surface where the connection points of the polyhedron are located as the central surface, and flattens the polyhedron; marks the positions of each component and its electrical interface in each layer of the unfolded plane, and designs a minimized channel in the unfolded plane, which connects all components and connection points Ni in the plane as information channels between each other; designs n minimized channels in n flattened planes, the connection point of two adjacent channels is Ni, and moves and merges Ni to minimize the number of Ni; finally, adjusts the width of the channel Ri according to the number and characteristics of information in each plane, designs threading hole points to reduce the number of layers of a printed circuit board, and installs fixing holes to fix an integrated wiring board. The present invention can eliminate interference and save wiring space through printed circuit board wiring technology, is suitable for wiring in a small space, and has good consistency. In particular, between the inertial component and the adjacent rotating frame, the wiring thickness is about 1mm after the integrated flexible printed circuit board wiring is adopted, which greatly improves the reliability of the device in the rotating state. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A three-dimensional diagram of the inertial assembly obtained for the present invention;

[0019] Figure 2 Schematic diagram of constructing hexahedrons P1, P2, and P3 for the present invention;

[0020] Figure 3 It is a schematic diagram of the planarization of the hexahedron of the present invention;

[0021] Figure 4 Schematic diagram of information channels R1, R2, and R3 of the present invention;

[0022] Figure 5 It is a schematic diagram of the integrated wiring in the inertial component of the present invention. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below with reference to the accompanying drawings.

[0024] An integrated wiring method for an inertial component comprises the following steps:

[0025] Step 1: Get a 3D graph of the inertial component.

[0026] like Figure 1 As shown, since the spatial positions of the components in the inertial assembly are staggered, for the convenience of display, only the relative positions of the components are shown in the figure, and the installation structures of the components are ignored.

[0027] Step 2: Divide all components in the inertial assembly into regions, and divide the inertial assembly into a plurality of polyhedrons P1, P2, ...Pn. The components in the inertial assembly are distributed on the surfaces of the polyhedrons.

[0028] The hexahedron formed by the acquisition circuit of the accelerometer in the inertial component, the navigation solution circuit and the power supply is divided into P1; ignoring the structural parts of the gyroscope installation surface, the hexahedron formed by the surface of the gyroscope facing the larger surface inside the platform is P2; the hexahedron formed by the surface where the electrical interface of the meter component is located and the surface where the temperature acquisition circuit is located is P3. The schematic diagram of the hexahedron P1, P2, and P3 is shown in the figure. Figure 2 As shown in the figure, it can be seen that P1, P2, and P3 have a nested relationship, P3 is nested inside P2, and P2 is nested inside P1. Only by flattening the three hexahedrons with a nested relationship into one plane can the integrated wiring design be completed.

[0029] Step 3, find the connection points N1, N2, ... between the polyhedrons, set a through-hole at point Ni to ensure that the wiring passes through the through-hole and realizes the direction change after passing through, where i = 1, 2, ..., i ≤ n-1;

[0030] In order to simplify the design and reduce the number of connection points, the constructed hexahedrons P1, P2, and P3 each have one face in the same plane, that is, the connection point between P1 and P2 is N1, and the connection point between P2 and P3 is also N1.

[0031] Step 4: With the plane where the polyhedron connection point Ni is located as the center plane, the polyhedron is planarized and unfolded. The two polyhedrons connected by Ni will be unfolded into two parallel and overlapping planes. By analogy, n polyhedrons will eventually be unfolded into n parallel and overlapping planes, with the connection point Ni (i≤n-1) between the planes. In this embodiment, the schematic diagram of the planar unfolding of P1, P2, and P3 with the plane where N1 is located as the center plane is as follows: Figure 3 shown.

[0032] Step 5: Identify the positions of each component and its electrical interface in each unfolded plane and record them as Xj (j=1, 2, ...), and design a minimized channel Ri (i≤n-1) in the unfolded plane, which connects all components and connection points Ni in the plane as an information channel between them.

[0033] In this embodiment, the electrical interface positions are denoted as X1, X2, ..., X8, and the minimized channels in the unfolded plane are denoted as R1, R2, R3. Figure 3 shown.

[0034] Step 6: Design n minimized channels in n planarized unfolded planes. The connection point between two adjacent channels is Ni. Move and merge Ni to minimize the number of Ni. When constructing hexahedrons, each of the three hexahedrons has a plane constructed in the same plane, and take the plane as the connection point. Merge and simplify from the source to minimize the number of connection points.

[0035] Step 7: adjust the width of channel Ri according to the quantity and characteristics of information in each plane, design threading points to reduce the number of layers of the printed circuit board, and install fixing holes to fix the integrated wiring board.

[0036] The width of channel Ri is adjusted according to the amount and characteristics of information in each plane, and threading points are designed at appropriate locations to reduce the number of layers of the printed circuit board, and installation holes are set at appropriate locations to fix the integrated wiring board. In this embodiment, since the structural bodies such as the installation structure of each component are omitted in the schematic diagram, only the relative positions between the components are indicated, channels R1, R2, and R3 need to punch holes on the structural body inside the platform to reach the electrical connection position of the component, so channels R1, R2, and R3 need to adjust their shapes according to the actual hole positions. The schematic diagram of the adjusted R1, R2, and R3 channels is as follows: Figure 4 In this embodiment, Figure 4 The N1 position shown in the figure is designed with a wire hole and installation fixation to achieve information exchange between channels R1, R2, and R3. After merging, the integrated wiring in the inertial component is obtained as shown in the figure. Figure 5 .according to Figure 4 Carry out structural design and circuit design, and merge N1 in the processing stage to obtain Figure 5 The integrated wiring board shown realizes integrated wiring within the inertial component and connects all the components distributed on three mutually nested hexahedrons.

[0037] It should be emphasized that the embodiments described in the present invention are illustrative rather than restrictive. Therefore, the present invention includes but is not limited to the embodiments described in the specific implementation manner. Any other implementation manners derived by those skilled in the art based on the technical solution of the present invention also fall within the scope of protection of the present invention.

Claims

1. An integrated wiring method for an inertial component, characterized in that: The following steps are involved: Step 1: Obtain a three-dimensional image of the inertial component; Step 2: Divide all components in the inertial assembly into multiple polyhedrons P1, P2, ...Pn, and distribute the components in the inertial assembly on the surface of each polyhedron; Step 3, find the connection points N1, N2, ... between the polyhedrons, set a through-hole at point Ni to ensure that the wiring passes through the through-hole and realizes the direction change after passing through, where i = 1, 2, ..., i ≤ n-1; Step 4: Take the plane where the polyhedron connection point Ni is located as the center plane and unfold the polyhedron into a plane; Step 5: Mark the positions of each component and its electrical interface in each unfolded plane as Xj (j=1, 2, ...), and design a minimized channel Ri (i≤n-1) in the unfolded plane, which connects all components and connection points Ni in the plane as an information channel between them; Step 6: Design n minimized channels in n planarized unfolded planes. The connection point of two adjacent channels is Ni. Move and merge Ni to minimize the number of Ni. Step 7: adjust the width of channel Ri according to the quantity and characteristics of information in each plane, design threading points to reduce the number of layers of the printed circuit board, and install fixing holes to fix the integrated wiring board.

2. The integrated wiring method of an inertial component according to claim 1, characterized in that: The specific implementation method of step 2 is as follows: the hexahedron formed by the acquisition circuit of the accelerometer in the inertial component, the navigation solution circuit and the surface where the power supply is located is divided into P1; the structural parts of the gyroscope installation surface are ignored, and the hexahedron formed by the surface where the gyroscope faces the large surface area inside the platform is P2; the hexahedron formed by the surface where the electrical interface of the meter component is located and the surface where the temperature acquisition circuit is located is P3.

3. The integrated wiring method of an inertial component according to claim 2, characterized in that: The specific implementation method of step 3 is: each of the constructed hexahedrons P1, P2, and P3 has a face in the same plane, the connection point between P1 and P2 is N1, and the connection point between P2 and P3 is also N1.

4. The integrated wiring method of an inertial component according to claim 3, characterized in that: The specific implementation method of step 4 is: the two polyhedrons connected by Ni will be unfolded into two parallel and overlapping planes, and so on, and finally n polyhedrons will be unfolded into n parallel and overlapping planes, and the connection points between the planes are Ni (i≤n-1).

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