Manufacturing method of high-temperature-resistant hair straightener circuit board

Abstract

The invention provides a high-temperature-resistant straight hair rod circuit board manufacturing method which comprises the steps that a circuit board is cut to obtain a plurality of standard PNL boards, copper foils are connected among the standard PNL boards, each standard PNL board is provided with a first processing layer, a second processing layer and a plurality of semi-solidified layers, and the first processing layer, the second processing layer and the semi-solidified layers are arranged on the circuit board. The first processing layer and the second processing layer are connected with the copper foil through the semi-cured layer; performing internal pattern manufacturing on the first processing layer and the second processing layer; browning the first treatment layer and the second treatment layer to form browned films on the surfaces of the first treatment layer and the second treatment layer; typesetting and pressing the first processing layer, the second processing layer, the semi-cured layer and the copper foil to form a four-layer plate; and performing external pattern manufacturing and detection on the four-layer board, and taking the four-layer board passing the detection as a qualified circuit board. According to the technical scheme of the embodiment, the thermal stress of the circuit board can be effectively dispersed, the layering and breaking risks of the circuit board are reduced, and the durability and durability of the hair straightening rod are improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board manufacturing, and in particular to a method for manufacturing a high-temperature resistant hair straightener circuit board. Background Art

[0002] Hair straighteners are used in the beauty and hairdressing industry. The circuit boards inside the hair straighteners need to have a certain degree of high temperature resistance. The finished circuit boards need to work continuously for 1200 hours at 190°C to pass the performance test. However, in the prior art, when the circuit board patches in hair straighteners are manufactured, the inner layer and hole copper of the inner layer of the circuit board are prone to cracking during automatic spot welding of high-lead solder, causing the hair straightener to fail. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for manufacturing a high temperature resistant hair straightener circuit board, which can effectively disperse the thermal stress of the circuit board, reduce the risk of delamination and disconnection of the circuit board, and improve the durability and durability of the hair straightener.

[0004] In a first aspect, an embodiment of the present invention provides a method for manufacturing a high temperature resistant hair straightener circuit board, comprising:

[0005] Cutting the circuit board to obtain a plurality of standard PNL boards, wherein copper foil is connected between the plurality of standard PNL boards, and each of the plurality of standard PNL boards is provided with a first treatment layer, a second treatment layer and a plurality of semi-cured layers, wherein the first treatment layer and the second treatment layer are connected to the copper foil through the semi-cured layers;

[0006] Performing internal patterning on the first processing layer and the second processing layer;

[0007] Browning the first processed layer and the second processed layer after patterning, so that a browning film is formed on the surface of the first processed layer and the second processed layer;

[0008] Arrange and press the first treated layer, the second treated layer, the semi-cured layer and the copper foil to form a four-layer board;

[0009] The four-layer board is subjected to external pattern making, and the four-layer board after the external pattern making is tested, and the four-layer board that passes the test is regarded as a qualified circuit board.

[0010] In some embodiments of the present invention, the step of performing internal patterning on the first processing layer and the second processing layer includes:

[0011] A photosensitive dry film is attached to the surface of the first processing layer and the second processing layer, and the photosensitive dry film is irradiated with ultraviolet light to transfer the pattern on the film to the surface of the photosensitive dry film;

[0012] Chemically etching the first processing layer and the second processing layer, and etching the surfaces of the first processing layer and the second processing layer where the copper surface is not required to cover, so that the first processing layer and the second processing layer are exposed from the substrate, forming circuits and patterns of the first processing layer and the second processing layer;

[0013] Defect detection is performed on the first processing layer and the second processing layer after the etching is completed.

[0014] In some embodiments of the present invention, after forming the four-layer board, the method further comprises:

[0015] Drilling the first treatment layer, the second treatment layer, the semi-cured layer and the copper foil to form a via hole in the PNL board;

[0016] Plasma treating the standard PNL plate;

[0017] The hole wall of the via hole is subjected to copper deposition to form a thin copper layer on the surface of the hole wall, and the thin copper layer is subjected to electrical thickening.

[0018] In some embodiments of the present invention, the external patterning of the four-layer board includes:

[0019] Covering the surface of the four-layer board with a photosensitive dry film, and transferring the pattern on the film to the surface of the photosensitive dry film by ultraviolet light;

[0020] The unexposed photosensitive dry film is removed by developing with a chemical solution to expose the copper surface;

[0021] The copper surface is chemically etched to expose the substrate of the four-layer board, thereby forming the external circuit and outer layer pattern of the four-layer board.

[0022] In some embodiments of the present invention, after forming the external circuits and outer layer patterns of the four-layer board, the method further comprises:

[0023] Connecting a test device to a plurality of test points of the four-layer board;

[0024] Applying a preset high voltage and a low current between the plurality of test points, measuring the current value and the voltage value between the plurality of test points, and calculating the first resistance values ​​of the plurality of test points according to the current value and the voltage value;

[0025] The first resistance value is compared with a preset second resistance value. When the first resistance value is less than the second resistance value, the four-layer board is qualified. When the first resistance value is greater than or equal to the second resistance value, the four-layer board is unqualified.

[0026] In some embodiments of the present invention, the method of testing the four-layer board after the external graphics are made also includes:

[0027] Silvering the copper surface of the four-layer board to form a silver layer on the upper part of the copper surface;

[0028] The four-layer board is subjected to quality inspection, and the four-layer board that passes the quality inspection is used as the qualified circuit board.

[0029] In some embodiments of the present invention, after forming an external circuit pattern on the four-layer board, the method further comprises:

[0030] Confirm the welding positions and non-welding positions of the four-layer board, and cover the non-welding positions with solder mask ink;

[0031] The ink characters of the welding component numbers required for the four-layer board are silk-screened on the welding positions.

[0032] In some embodiments of the present invention, the semi-cured layer is disposed inside the first processing layer and the second processing layer.

[0033] In some embodiments of the present invention, the four-layer board has a thickness of 1.05 mm.

[0034] The method for manufacturing a high temperature resistant hair straightener circuit board according to the embodiment of the present invention has at least the following beneficial effects:

[0035] The circuit board is cut to obtain a plurality of standard PNL boards, copper foils are connected between the plurality of standard PNL boards, and the plurality of standard PNL boards are all provided with a first treatment layer, a second treatment layer and a plurality of semi-cured layers, and the first treatment layer and the second treatment layer are connected to the copper foil through the semi-cured layer; internal graphics are produced on the first treatment layer and the second treatment layer; the first treatment layer and the second treatment layer that have completed the graphics production are browned, so that a browned film is formed on the surface of the first treatment layer and the second treatment layer; the first treatment layer, the second treatment layer, the semi-cured layer and the copper foil are laid out and pressed together to form a four-layer board; external graphics are produced on the four-layer board, and the four-layer board that has completed the external graphics production is tested, and the four-layer board that has passed the test is used as a qualified circuit board. According to the technical solution of this embodiment, the thermal stress of the circuit board can be effectively dispersed, the risk of delamination and disconnection of the circuit board can be reduced, and the durability and durability of the hair straightener can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a flow chart of a method for manufacturing a high temperature resistant hair straightener circuit board provided by one embodiment of the present invention;

[0037] Figure 2is a flow chart of producing internal graphics for a first processing layer and a second processing layer provided by an embodiment of the present invention;

[0038] Figure 3 This is a flow chart after forming a four-layer board provided by an embodiment of the present invention;

[0039] Figure 4 It is a flow chart of making external graphics for a four-layer board provided by an embodiment of the present invention;

[0040] Figure 5 It is a flow chart after forming the external circuits and outer layer graphics of a four-layer board provided by an embodiment of the present invention;

[0041] Figure 6 It is a flow chart of testing a four-layer board with external graphics produced provided by an embodiment of the present invention;

[0042] Figure 7 is a flow chart of forming an external circuit pattern on the four-layer board provided by an embodiment of the present invention;

[0043] Figure 8 It is a schematic diagram of the structure of a four-layer board provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0044] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0045] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0046] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0047] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0048] The embodiment of the present invention provides a method for manufacturing a high-temperature resistant straight hair iron circuit board, comprising cutting the circuit board to obtain a plurality of standard PNL boards, wherein copper foil is connected between the plurality of standard PNL boards, and the plurality of standard PNL boards are provided with a first treatment layer, a second treatment layer and a plurality of semi-cured layers, wherein the first treatment layer and the second treatment layer are connected to the copper foil through the semi-cured layer; internal graphics are produced on the first treatment layer and the second treatment layer; browning is performed on the first treatment layer and the second treatment layer after the graphics are produced, so that a browning film is formed on the surface of the first treatment layer and the second treatment layer; the first treatment layer, the second treatment layer, the semi-cured layer and the copper foil are laid out and pressed together to form a four-layer board; external graphics are produced on the four-layer board, and the four-layer board after the external graphics are produced is tested, and the four-layer board that passes the test is used as a qualified circuit board. According to the technical solution of this embodiment, the thermal stress of the circuit board can be effectively dispersed, the risk of delamination and disconnection of the circuit board can be reduced, and the durability and durability of the straight hair iron can be improved.

[0049] It should be noted that, refer to Figure 8 In this embodiment, a core board with thinner thickness is used on each side (i.e., the first treated layer and the second treated layer) and two semi-cured layers in the middle are pressed together to form a four-layer board, thereby effectively dispersing thermal stress, reducing the risk of delamination and disconnection, and meeting the requirements for safe, long-lasting and durable use of the hair straightener.

[0050] The control method of the embodiment of the present invention is further described below based on the accompanying drawings.

[0051] Reference Figure 1 , Figure 1 A flowchart of a method for manufacturing a high temperature resistant hair straightener circuit board provided by an embodiment of the present invention, the method for manufacturing a high temperature resistant hair straightener circuit board includes but is not limited to the following steps:

[0052] Step S11, cutting the circuit board to obtain a plurality of standard PNL boards, wherein copper foil is connected between the plurality of standard PNL boards, and each of the plurality of standard PNL boards is provided with a first treatment layer, a second treatment layer and a plurality of semi-cured layers, wherein the first treatment layer and the second treatment layer are connected to the copper foil via the semi-cured layer;

[0053] It should be noted that the core plates of the first and second treated layers of this embodiment are made of Rogers Kappa 438 plate with good high temperature resistance and Taiguang EM-526B semi-cured layer with small thermal expansion coefficient.

[0054] Step S12, performing internal pattern making on the first processing layer and the second processing layer;

[0055] It should be noted that after the inner layer circuit of the standard PNL board is manufactured, the optical principle is used to detect common defects of the etched PNL standard board.

[0056] Step S13, browning the first processed layer and the second processed layer after patterning, so that a browning film is formed on the surfaces of the first processed layer and the second processed layer;

[0057] It should be noted that after the core boards of the first and second treatment layers are browned, they are baked at 110 degrees for 30 minutes to increase the interlayer bonding strength of the circuit board and prevent interlayer delamination at high temperatures.

[0058] Step S14, layout and press the first treated layer, the second treated layer, the semi-cured layer and the copper foil to form a four-layer board;

[0059] It should be noted that both the first treated layer and the second treated layer use a core board with a relatively thin thickness, and semi-cured layers are provided on the inner side of the first treated layer and the core board and the inner side of the core board of the second treated layer. The first treated layer, the second treated layer and the two semi-cured layers are pressed together to form a four-layer board, thereby effectively dispersing thermal stress.

[0060] Step S15, external graphics are produced on the four-layer board, and the four-layer board after the external graphics production is completed is tested, and the four-layer board that passes the test is regarded as a qualified circuit board.

[0061] It should be noted that the four-layer board of this embodiment uses a high-density pad, a cold-punched plate is added to prevent flashing, and the hole roughness is Run-out≤15um, so as to prevent the high-temperature chamber hole wall from separating from the inner layer circuit. In order to meet the safety over-current performance requirements, the copper thickness of the finished circuit board is at least 70um, and the hole copper is at least 30um. Furthermore, the main circuit layer of the circuit board is set on the second processing layer.

[0062] In addition, in one embodiment, referring to Figure 2 ,exist Figure 1 Step S11 of the illustrated embodiment also includes but is not limited to the following steps:

[0063] Step S21, attaching a photosensitive dry film to the surface of the first processing layer and the second processing layer, and irradiating the photosensitive dry film with ultraviolet light to transfer the pattern on the film to the surface of the photosensitive dry film;

[0064] Step S22, chemically etching the first treatment layer and the second treatment layer, etching the surfaces of the first treatment layer and the second treatment layer where no copper surface is required to cover, so that the first treatment layer and the second treatment layer are exposed from the substrate, forming circuits and patterns of the first treatment layer and the second treatment layer;

[0065] Step S23, performing defect detection on the first processed layer and the second processed layer after etching.

[0066] It should be noted that the drilled holes are plated with copper through chemical reaction, and the copper on the surface is thickened. A photosensitive dry film is attached to the standard PNL board, and the pattern on the film is transferred to the dry film through ultraviolet light exposure. The copper layer is etched away where it is not needed through chemical etching with liquid medicine to expose the substrate, forming a circuit to complete the pattern production of the first processing layer and the second processing layer.

[0067] In addition, in one embodiment, referring to Figure 3 ,exist Figure 1 After step S14 in the illustrated embodiment, the following steps are also included but not limited to:

[0068] Step S31, drilling the first treatment layer, the second treatment layer, the semi-cured layer and the copper foil to form a via hole in the PNL board;

[0069] Step S32, plasma treatment of the standard PNL plate;

[0070] Step S33, copper is deposited on the hole wall of the via hole to form a thin copper layer on the hole wall surface, and the thin copper layer is electrically thickened.

[0071] It should be noted that the "activation effect" of active particles in the plasma generated in the vacuum chamber is used to remove the drilling dirt on the board surface and in the hole. The specific cleaning process usually includes the following processes: inorganic gas is excited into a plasma state; gas phase substances are adsorbed on the board surface and the hole wall; the adsorbed groups react with molecules on the board surface and the hole wall to generate product molecules; the product molecules are decomposed to form a gas phase; the reaction residues are separated from the board surface and the hole wall.

[0072] Furthermore, the copper layer provides a conductive foundation for subsequent board electrical thickening, ensuring the conductivity of the standard PNL board. The copper layer can also reduce the surface oxide layer during welding, forming a good welding surface, thereby improving the welding quality. In addition, by electrical thickening of the copper layer, the conductivity of the circuit board can be further increased, ensuring the stability and reliability of the circuit. The thickened copper layer can also improve the mechanical strength and corrosion resistance of the standard PNL board.

[0073] In addition, in one embodiment, referring to Figure 4 ,exist Figure 1 Step S15 of the illustrated embodiment also includes but is not limited to the following steps:

[0074] Step S41, covering the surface of the four-layer board with a photosensitive dry film, and transferring the pattern on the film to the surface of the photosensitive dry film by ultraviolet light;

[0075] Step S42, removing the unexposed photosensitive dry film by developing with a chemical solution to expose the copper surface;

[0076] Step S43, chemically etching the copper surface to expose the base material of the four-layer board, and forming the external circuit and outer layer pattern of the four-layer board.

[0077] It should be noted that a thin copper layer is deposited on the drilled through-holes by chemical reaction, and then the copper is thickened by electroplating. A photosensitive dry film is pasted on the production board, and the pattern on the film is transferred to the dry film by ultraviolet light exposure. The unexposed dry film is then removed by chemical development to expose the copper surface for etching. The copper layer is etched away in places where it is not needed to expose the substrate, forming a circuit and completing the production of the outer layer pattern.

[0078] In addition, in one embodiment, referring to Figure 5 ,exist Figure 4 After step S43 in the illustrated embodiment, the following steps are also included but not limited to:

[0079] Step S51, connecting the test device to multiple test points of the four-layer board;

[0080] Step S52, applying a preset high voltage and low current between the multiple test points, measuring the current value and the voltage value between the multiple test points, and calculating the first resistance values ​​of the multiple test points according to the current value and the voltage value;

[0081] Step S53, comparing the first resistance value with a preset second resistance value, when the first resistance value is less than the second resistance value, the four-layer board is qualified, and when the first resistance value is greater than or equal to the second resistance value, the four-layer board is unqualified.

[0082] It should be noted that the probe or flying probe is directly in contact with the four-layer board, and a known level of high voltage or low current is applied between the test points. The system measures the current or voltage between the corresponding test points, and calculates the resistance value based on Ohm's law R+U / I. It is compared with the set resistance value to determine the continuity of the circuit and ensure the performance of the circuit board.

[0083] In addition, in one embodiment, referring to Figure 6 ,exist Figure 1 Step S15 of the illustrated embodiment also includes but is not limited to the following steps:

[0084] Step S61, silvering the copper surface of the four-layer board to form a silver layer on the upper part of the copper surface;

[0085] Step S62, performing quality inspection on the four-layer board, and taking the four-layer board that passes the quality inspection as a qualified circuit board.

[0086] It should be noted that the silver plating can effectively prevent moisture and oxide from corroding the four-layer board, and can also improve the conductivity of the four-layer board, ensuring the transmission rate and stability of the signal. In addition, the silver plating process is relatively direct and convenient, which reduces the complexity of the four-layer board manufacturing process, thereby improving production efficiency. After the silver plating operation is completed, the stability and durability of the four-layer board under high temperature conditions are verified through quality inspection, thereby improving its reliability in actual use.

[0087] In addition, in one embodiment, referring to Figure 7 ,exist Figure 4 After step S43 in the illustrated embodiment, the following steps are also included but not limited to:

[0088] Step S71, confirming the welding positions and non-welding positions of the four-layer board, and covering the non-welding positions with solder mask ink;

[0089] Step S72, silk-screening the ink characters of the welding component numbers required for the four-layer board on the welding positions.

[0090] It should be noted that the positions where components do not need to be welded are covered with solder mask ink by screen printing, and the character ink serving as the welding component numbers is screen printed at the corresponding positions by screen printing.

[0091] The inner sides of the first treatment layer and the second treatment layer are both provided with a semi-cured layer. It should be noted that the semi-cured layer will melt, flow and solidify during the lamination process, thereby tightly combining the first treatment layer and the second treatment layer. This combination method not only improves the physical bonding force between the layers, but also enhances the overall structural strength of the circuit board. Ensure that the circuit board will not have problems such as delamination and cracking during long-term use. The semi-cured layer has good thermal conductivity and can effectively transfer the heat generated inside the circuit board to the radiator or other heat dissipation components. The semi-cured layer is provided on the inner sides of the first treatment layer and the second treatment layer, which can further increase the heat dissipation area and heat dissipation path, thereby improving the heat dissipation performance of the circuit board. The use of the semi-cured layer can simplify the manufacturing process of the circuit board and reduce production costs. Exemplarily, by using the semi-cured layer as an interlayer insulating material, the dependence on complex insulating structures can be reduced, thereby reducing the difficulty and cost of manufacturing. At the same time, the lamination process of the semi-cured layer can realize automated production, further improving the production efficiency and quality stability of the circuit board.

[0092] The thickness of the four-layer board is 1.05 mm. It should be noted that the thickness of 1.05 mm can provide enough space for signal line layout, while ensuring stable signal transmission between layers, reducing signal loss and interference, and helping to conduct and dissipate heat to avoid damage to the circuit board due to overheating. In electronic equipment, good heat dissipation performance is one of the key factors to ensure long-term stable operation of the equipment. In addition, the thickness of 1.05 mm can reasonably control the amount of material used while ensuring performance, thereby reducing material costs. Since this thickness is easy to process and handle, it helps to improve production efficiency and shorten production cycles.

[0093] The above is a specific description of the preferred implementation of the present invention, but the present invention is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions under the shared conditions without violating the spirit of the present invention. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A method for manufacturing a high temperature resistant hair straightener circuit board, characterized in that: include: Cutting the circuit board to obtain a plurality of standard PNL boards, wherein copper foil is connected between the plurality of standard PNL boards, and each of the plurality of standard PNL boards is provided with a first treatment layer, a second treatment layer and a plurality of semi-cured layers, wherein the first treatment layer and the second treatment layer are connected to the copper foil through the semi-cured layers; Performing internal patterning on the first processing layer and the second processing layer; Browning the first processed layer and the second processed layer after patterning, so that a browning film is formed on the surface of the first processed layer and the second processed layer; Arrange and press the first treated layer, the second treated layer, the semi-cured layer and the copper foil to form a four-layer board; The four-layer board is subjected to external pattern making, and the four-layer board after the external pattern making is tested, and the four-layer board that passes the test is regarded as a qualified circuit board.

2. The method for manufacturing a high temperature resistant hair straightener circuit board according to claim 1, characterized in that: The step of performing internal graphics production on the first processing layer and the second processing layer includes: A photosensitive dry film is attached to the surface of the first processing layer and the second processing layer, and the photosensitive dry film is irradiated with ultraviolet light to transfer the pattern on the film to the surface of the photosensitive dry film; Chemically etching the first processing layer and the second processing layer, and etching the surfaces of the first processing layer and the second processing layer where the copper surface is not required to cover, so that the first processing layer and the second processing layer are exposed from the substrate, forming circuits and patterns of the first processing layer and the second processing layer; Defect detection is performed on the first processing layer and the second processing layer after the etching is completed.

3. The method for manufacturing a high temperature resistant hair straightener circuit board according to claim 1, characterized in that: After forming the four-layer board, the method further comprises: Drilling the first treatment layer, the second treatment layer, the semi-cured layer and the copper foil to form a via hole in the PNL board; Plasma treating the standard PNL plate; The hole wall of the via hole is subjected to copper deposition to form a thin copper layer on the surface of the hole wall, and the thin copper layer is subjected to electrical thickening.

4. The method for manufacturing a high temperature resistant hair straightener circuit board according to claim 1, characterized in that: The external graphics production of the four-layer board includes: Covering the surface of the four-layer board with a photosensitive dry film, and transferring the pattern on the film to the surface of the photosensitive dry film by ultraviolet light; The unexposed photosensitive dry film is removed by developing with a chemical solution to expose the copper surface; The copper surface is chemically etched to expose the substrate of the four-layer board, thereby forming the external circuit and outer layer pattern of the four-layer board.

5. The method for manufacturing a high temperature resistant hair straightener circuit board according to claim 4, characterized in that: After forming the external circuits and outer layer patterns of the four-layer board, the method further comprises: Connecting a test device to a plurality of test points of the four-layer board; Applying a preset high voltage and a low current between the plurality of test points, measuring the current value and the voltage value between the plurality of test points, and calculating the first resistance values ​​of the plurality of test points according to the current value and the voltage value; The first resistance value is compared with a preset second resistance value. When the first resistance value is less than the second resistance value, the four-layer board is qualified. When the first resistance value is greater than or equal to the second resistance value, the four-layer board is unqualified.

6. The method for manufacturing a high temperature resistant hair straightener circuit board according to claim 1, characterized in that: The method of testing the four-layer board after the external graphics are made also includes: Silvering the copper surface of the four-layer board to form a silver layer on the upper part of the copper surface; The four-layer board is subjected to quality inspection, and the four-layer board that passes the quality inspection is used as the qualified circuit board.

7. The method for manufacturing a high temperature resistant hair straightener circuit board according to claim 1, characterized in that: After the four-layer board is formed with an external circuit pattern, the method further comprises: Confirm the welding positions and non-welding positions of the four-layer board, and cover the non-welding positions with solder mask ink; The ink characters of the welding component numbers required for the four-layer board are silk-screened on the welding positions.

8. The method for manufacturing a high temperature resistant hair straightener circuit board according to claim 1, characterized in that: The semi-cured layer is disposed inside the first processed layer and the second processed layer.

9. The method for manufacturing a high temperature resistant hair straightener circuit board according to claim 1, characterized in that: The thickness of the four-layer board is 1.05 mm.

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