Inductor component

Abstract

The invention provides an inductor component capable of improving an inductance value. The inductor component includes a body including a magnetic layer, a coil disposed in the body and having a shaft, and an insulating layer covering a portion of an outer surface of the coil. The coil has an inductor wiring wound along a plane orthogonal to the axis. The inductor wiring has a first surface and a second surface that face each other in the axial direction. At least a portion of the first surface of the inductor wiring is in contact with the magnetic layer.

Description

Technical Field

[0001] The present disclosure relates to inductor components. Background Art

[0002] Conventionally, as an inductor component, there is an inductor component described in Japanese Patent Application Publication No. 2021-174799 (Patent Document 1). The inductor component includes a base body including a magnetic layer and a coil disposed in the base body and having an axis. The entire outer surface of the coil is covered with an insulating material.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-174799

[0004] However, in conventional inductor components, since the entire outer surface of the coil is covered with an insulating material, the volume of the magnetic layer cannot be ensured, and a desired inductance value may not be obtained. Summary of the invention

[0005] Therefore, an object of the present disclosure is to provide an inductor component capable of improving the inductance value.

[0006] In order to solve the above-mentioned problems, an inductor component according to one embodiment of the present disclosure includes:

[0007] a body including a magnetic layer;

[0008] a coil, disposed in the blank and having an axis; and

[0009] an insulating layer covering a portion of the outer surface of the coil,

[0010] The coil has an inductor wiring, and the inductor wiring is wound along a plane orthogonal to the axis.

[0011] The inductor wiring has a first surface and a second surface facing each other in the axial direction.

[0012] At least a portion of the first surface of the inductor wiring is in contact with the magnetic layer.

[0013] According to the above aspect, since at least a portion of the first surface of the inductor wiring is in contact with the magnetic layer, the volume of the magnetic layer can be increased compared to a case where the entire outer surface of the inductor wiring is covered with an insulating material. As a result, the inductance value of the inductor component can be increased.

[0014] According to the inductor component which is one embodiment of the present disclosure, the inductance value can be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic plan view showing a first embodiment of the inductor component.

[0016] Figure 2 yes Figure 1 II-II sectional view.

[0017] Figure 3 yes Figure 2 An enlarged view of part A.

[0018] Figure 4 It is a schematic cross-sectional view showing a modified example of the inductor component.

[0019] Figure 5A This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0020] Figure 5B This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0021] Figure 5C This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0022] Figure 5D This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0023] Figure 5E This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0024] Fig. 5F This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0025] Figure 5G This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0026] Figure 5H This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0027] Fig.5I This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0028] Figure 5J This is an explanatory diagram for explaining a method for manufacturing an inductor component.

[0029] Figure 6 It is a schematic cross-sectional view showing a second embodiment of the inductor component.

[0030] Figure 7 It is a schematic cross-sectional view showing a third embodiment of the inductor component.

[0031] Figure 8 It is a schematic plan view showing a fourth embodiment of the inductor component. DETAILED DESCRIPTION

[0032] Hereinafter, an inductor component as one embodiment of the present disclosure will be described in detail by way of the illustrated embodiment. Note that some of the drawings are schematic and may not reflect actual dimensions or ratios.

[0033] <First embodiment>

[0034] (structure)

[0035] Figure 1 It is a schematic plan view showing a first embodiment of the inductor component. Figure 2 yes Figure 1 Section II-II of the diagram. Figure 1 In FIG. 1 , for convenience, oblique lines are drawn to indicate the position where the top surface of the covering insulating layer exists. Figure 2 In the figure, the seed layer is omitted for convenience. Figure 2 This corresponds to an example of "a cross section perpendicular to the extending direction of the inductor wiring" described in the claims.

[0036] The inductor component 1 is mounted on electronic equipment such as a personal computer, a DVD player, a digital camera, a TV, a mobile phone, or an automotive electronic device, and is a component having an overall rectangular parallelepiped shape. However, the shape of the inductor component 1 is not particularly limited, and may be a cylindrical shape, a polygonal cylindrical shape, a truncated cone shape, or a polygonal truncated cone shape.

[0037] like Figure 1 and Figure 2 As shown, the inductor component 1 includes a body 10, a coil 15 disposed in the body 10 and having an axis AX, a cover insulating layer 30 and a base insulating layer 70 covering a portion of the outer surface of the coil 15, a first external terminal 51 and a second external terminal 52 exposed on the first main surface 10a of the body 10, and a cover film 60 provided on the first main surface 10a of the body 10. The cover insulating layer 30 and the base insulating layer 70 are equivalent to an example of the "insulating layer" described in the claims.

[0038] The shape of the blank 10 is not particularly limited, but in the present embodiment, it is a rectangular parallelepiped. The outer surface of the blank 10 has a first main surface 10a and a second main surface 10b, and a first side surface 10c, a second side surface 10d, a third side surface 10e, and a fourth side surface 10f located between the first main surface 10a and the second main surface 10b and connecting the first main surface 10a and the second main surface 10b. The first main surface 10a and the second main surface 10b are opposite to each other. The first side surface 10c and the second side surface 10d are opposite to each other. The third side surface 10e and the fourth side surface 10f are opposite to each other.

[0039] In the figure, the thickness direction of the blank 10 is referred to as the Z direction, the direction from the second main surface 10b toward the first main surface 10a is referred to as the positive Z direction, and the opposite direction of the positive Z direction is referred to as the reverse Z direction. In this specification, the main surface side of the first main surface 10a and the second main surface 10b on which the external terminals 51 and 52 are provided is referred to as the upper side. In this embodiment, the positive Z direction is referred to as the upper side. On a plane orthogonal to the Z direction of the blank 10, the long side direction of the blank 10 and the direction in which the first external terminal 51 and the second external terminal 52 are arranged, that is, the length direction, is referred to as the X direction, and the direction orthogonal to the length direction, that is, the width direction of the blank 10 is referred to as the Y direction. In addition, the X direction and the direction from the first side surface 10c toward the second side surface 10d is referred to as the positive X direction, and the opposite direction of the positive X direction is referred to as the reverse X direction. The Y direction and the direction from the third side surface 10e toward the fourth side surface 10f is referred to as the positive Y direction, and the opposite direction of the positive Y direction is referred to as the reverse Y direction. The positive Z direction is equivalent to an example of the "first direction" described in the claims. The anti-Z direction corresponds to an example of the “second direction” described in the claims.

[0040] The body 10 includes a first magnetic layer 11 and a second magnetic layer 12 arranged in sequence along the positive Z direction. The term "in sequence" only indicates the positional relationship between the first magnetic layer 11 and the second magnetic layer 12, and has nothing to do with the order in which the first magnetic layer 11 and the second magnetic layer 12 are formed. The first magnetic layer 11 and the second magnetic layer 12 are an example of the "magnetic layer" described in the claims.

[0041] The first magnetic layer 11 and the second magnetic layer 12 respectively contain magnetic powder and a resin containing the magnetic powder. The resin is, for example, an epoxy resin, or a mixture of epoxy resin and acrylic acid, or an organic insulating material of epoxy resin, acrylic acid and other mixtures. The magnetic powder is, for example, a FeSi alloy such as FeSiCr, a FeCo alloy, a Fe alloy such as NiFe, or an amorphous alloy thereof. The magnetic powder may also be ferrite. The average particle size of the magnetic powder is preferably 5 μm or less. In addition, the first magnetic layer 11 and the second magnetic layer 12 may also be a ferrite or a sintered body of magnetic powder that does not contain an organic resin.

[0042] The coil 15 includes an inductor wiring 150 and a first lead wiring 21 and a second lead wiring 22 arranged in the blank 10 so that the end face is exposed from the first main surface 10a of the blank 10. The inductor wiring refers to a wiring wound in a spiral shape on a plane including an inner peripheral end 151 and an outer peripheral end 152. The coil refers to a component that includes wiring (in this embodiment, the first lead wiring 21 and the second lead wiring 22) for taking out the signal of the inductor wiring to the outside of the blank 10 in addition to the inductor wiring. The inductor wiring 150 is wound between the first magnetic layer 11 and the second magnetic layer 12 along a plane (XY plane) orthogonal to the axis AX of the coil 15. Specifically, the first magnetic layer 11 exists closer to the anti-Z direction than the inductor wiring 150, and the second magnetic layer 12 exists closer to the positive Z direction than the inductor wiring 150 and in a direction orthogonal to the positive Z direction.

[0043] When viewed from the Z direction, the inductor wiring 150 is wound in a spiral shape in a clockwise direction from the outer peripheral end 152 toward the inner peripheral end 151. Preferably, the number of turns of the inductor wiring 150 is one turn or more. In this way, the inductance value can be increased. The so-called one turn or more means that in a cross section orthogonal to the axis of the inductor wiring, the inductor wiring has a state in which parts are adjacent in the radial direction and parallel in the winding direction when viewed from the axial direction, and the so-called less than one turn means that in a cross section orthogonal to the axis, the inductor wiring does not have a state in which parts are adjacent in the radial direction and parallel in the winding direction when viewed from the axial direction. In the present embodiment, the number of turns of the inductor wiring 150 is 2.5 turns.

[0044] The inductor wiring 150 has a top surface 150a and a bottom surface 150b that are opposite to each other in the axis AX direction of the coil 15. Specifically, the inductor wiring 150 has a top surface 150a facing the positive Z direction (i.e., the upper side) and a bottom surface 150b facing the reverse Z direction. In this specification, the top surface 150a of the inductor wiring 150 does not include a connection portion with the first lead wiring 21 and the second lead wiring 22. The top surface 150a is equivalent to an example of the "first surface" described in the claims. The bottom surface 150b is equivalent to an example of the "second surface" described in the claims. The inductor wiring 150 has two side surfaces 150c and 150d connecting the top surface 150a and the bottom surface 150b. Specifically, the inductor wiring 150 has a first side surface 150c facing radially outward and a second side surface 150d facing radially inward.

[0045] The outer peripheral end 152 of the inductor wiring 150 is connected to the first external terminal 51 via the first lead wiring 21 in contact with the top surface of the outer peripheral end 152. The inner peripheral end 151 of the inductor wiring 150 is connected to the second external terminal 52 via the second lead wiring 22 in contact with the top surface of the inner peripheral end 151. With the above structure, the inductor wiring 150 is electrically connected to the first external terminal 51 and the second external terminal 52.

[0046] The inductor wiring 150 is preferably made of Au, Pt, Pd, Ag, Cu, Al, Co, Cr, Zn, Ni, Ti, W, Fe, Sn, In, or a compound thereof. The inductor wiring 150 is formed, for example, by electrolytic plating. Alternatively, the inductor wiring 150 may be formed by electroless plating, sputtering, vapor deposition, coating, or the like.

[0047] The first lead wiring 21 extends from the top surface of the outer peripheral end 152 of the inductor wiring 150 in the positive Z direction and penetrates the inside of the cover insulating layer 30 and the second magnetic layer 12. The first lead wiring 21 is preferably made of Cu, Ag, Au, Fe or a compound thereof. The first lead wiring 21 includes a first conductive wiring 212 and a first columnar wiring 211, wherein the first conductive wiring 212 is provided on the top surface of the outer peripheral end 152 of the inductor wiring 150 and penetrates the inside of the cover insulating layer 30, and the first columnar wiring 211 extends from the top surface of the first conductive wiring 212 in the positive Z direction, penetrates the inside of the second magnetic layer 12, and the end surface is exposed on the first main surface 10a of the base body 10. The conductive wiring is a conductor having a smaller line width (diameter, cross-sectional area) than the columnar wiring.

[0048] The second lead wiring 22 extends from the top surface of the inner peripheral end 151 of the inductor wiring 150 in the positive Z direction and penetrates the inside of the cover insulating layer 30 and the second magnetic layer 12. The second lead wiring 22 is preferably made of Cu, Ag, Au, Fe or a compound thereof. The second lead wiring 22 includes a second conductive wiring 222 and a second columnar wiring 221, wherein the second conductive wiring 222 is provided on the top surface of the inner peripheral end 151 of the inductor wiring 150 and penetrates the inside of the cover insulating layer 30, and the second columnar wiring 221 extends from the top surface of the second conductive wiring 222 in the positive Z direction, penetrates the inside of the second magnetic layer 12, and the end surface is exposed on the first main surface 10a of the base body 10. The first lead wiring 21 and the second lead wiring 22 are preferably made of the same material as the inductor wiring 150.

[0049] The first external terminal 51 and the second external terminal 52 are provided on the first main surface 10a of the body 10. The first external terminal 41 and the second external terminal 42 are made of a conductive material, for example, a three-layer structure in which Cu with low resistance and excellent stress resistance, Ni with excellent corrosion resistance, and Au with excellent solder wettability and reliability are arranged in order from the inside to the outside.

[0050] The first external terminal 51 is in contact with the end surface of the first lead wiring 21 exposed from the first main surface 10a of the base body 10, and is electrically connected to the first lead wiring 21. Thus, the first external terminal 51 is electrically connected to the outer peripheral end 152 of the inductor wiring 150. The second external terminal 52 is in contact with the end surface of the second lead wiring 22 exposed from the first main surface 10a of the base body 10, and is electrically connected to the second lead wiring 22. Thus, the second external terminal 52 is electrically connected to the inner peripheral end 151 of the inductor wiring 150. Figure 1 In FIG. 5 , for convenience, the first external terminal 51 and the second external terminal 52 are indicated by double-dashed lines.

[0051] The insulating cover layer 30 and the insulating base layer 70 are made of an insulating material that does not contain a magnetic substance. The insulating material is preferably made of, for example, epoxy resin, acrylic resin, phenolic resin, polyimide, or a mixture thereof.

[0052] Figure 3 yes Figure 2 A magnified view of part A. Figure 3 As shown, at least a portion of the top surface 150 a of the inductor wiring 150 is in contact with at least one of the first magnetic layer 11 and the second magnetic layer 12 . In the present embodiment, only a portion of the top surface 150 a of the inductor wiring 150 is in contact with the second magnetic layer 12 .

[0053] Specifically, the base insulating layer 70 is stacked on the first magnetic layer 11 to cover the entire upper surface of the first magnetic layer 11. The inductor wiring 150 is stacked on the base insulating layer 70. The entire bottom surface 150b of the inductor wiring 150 is in contact with the upper surface of the base insulating layer 70.

[0054] The insulating cover layer 30 is provided on the base insulating layer 70 and covers a part of the outer surface of the inductor wiring 150. The insulating cover layer 30 has a top surface portion 31 and a wall portion 32.

[0055] The wall portion 32 is provided on at least one of the first side surface 150c and the second side surface 150d of the inductor wiring 150. In the present embodiment, the wall portion 32 is provided on both the first side surface 150c and the second side surface 150d. Figure 21 ), the wall portion 32 extends in the Z direction. The wall portion 32 contacts the entire surface of the first side surface 150c and the entire surface of the second side surface 150d. The lower surface of the wall portion 32 contacts the upper surface of the base insulating layer 70. In short, the wall portion 32 is provided on the inner peripheral surface 150d1 of the innermost periphery of the inductor wiring 150, the outer peripheral surface 150c1 of the outermost periphery of the inductor wiring 150, and between turns of the inductor wiring 150.

[0056] The innermost circumference of the inductor wiring refers to the inner circumference on the radial inner side of the inductor wiring when the inductor wiring has less than one turn, and refers to the inner circumference on the radial inner side of the portion constituting one turn including the inner circumference end in the inductor wiring when the inductor wiring has more than one turn. The outermost circumference of the inductor wiring refers to the outer circumference on the radial outer side of the inductor wiring when the inductor wiring has less than one turn, and refers to the outer circumference on the radial outer side of the portion constituting one turn including the outer circumference end in the inductor wiring when the inductor wiring has more than one turn.

[0057] The top surface portion 31 is provided on a portion of the top surface 150a of the inductor wiring 150. Specifically, the top surface portion 31 is provided in a predetermined range around the first lead wiring 21 in the top surface 150a of the inductor wiring 150 as viewed from the Z direction. The predetermined range is a range in which the insulation between the top surface 150a of the inductor wiring and the first lead wiring 21 can be ensured. In the present embodiment, the shape of the predetermined range is a shape along the outer shape (rectangle) of the first lead wiring 21 as viewed from the Z direction. Thus, the insulation between the top surface 150a of the inductor wiring and the first lead wiring 21 can be easily ensured.

[0058] Similarly, when viewed from the Z direction, the top surface portion 31 is provided in a predetermined range around the second lead wiring 22 in the top surface 150a of the inductor wiring 150. The predetermined range is a range in which the insulation between the top surface 150a of the inductor wiring and the second lead wiring 22 can be ensured. In the present embodiment, when viewed from the Z direction, the shape of the predetermined range is a shape along the outer shape (circular) of the second lead wiring 22. Thus, the insulation between the top surface 150a of the inductor wiring and the second lead wiring 22 can be easily ensured.

[0059] The portion of the top surface 150a of the inductor wiring 150 where the top surface 31 of the cover insulating layer 30 is not provided contacts the second magnetic layer 12. With the above structure, only the portion of the top surface 150a of the inductor wiring 150 where the top surface 31 of the cover insulating layer 30 is not provided contacts the second magnetic layer 12.

[0060] According to the inductor component 1, since at least a portion of the top surface 150a of the inductor wiring 150 is in contact with either the first magnetic layer 11 or the second magnetic layer 12, the volumes of the first magnetic layer 11 and the second magnetic layer 12 can be increased compared to a case where the entire outer surface of the inductor wiring 150 is covered with an insulating material. As a result, the inductance value of the inductor component 1 can be increased.

[0061] In particular, in an inductor component in which the area of ​​the top surface 150a and the area of ​​the bottom surface 150b of the inductor wiring 150 are respectively larger than the area of ​​the inner circumferential surface 150d1 of the innermost circumference of the inductor wiring 150, the above-mentioned effect of increasing the volume of the first magnetic layer 11 and the second magnetic layer 12 is increased compared to a case in which only the inner circumferential surface 150d1 of the outer surface of the inductor wiring 150 is in contact with the second magnetic layer 12.

[0062] Preferably, if Figure 3 As shown in FIG. 1 , in a cross section perpendicular to the extending direction of the inductor wiring 150, the inductor wiring 150 has two side surfaces 150c and 150d connecting the top surface 150a and the bottom surface 150b, and the cover insulating layer 30 has a wall portion 32 provided on at least one of the two side surfaces 150c and 150d. Specifically, the cover insulating layer 30 has a first wall portion 321 provided on the first side surface 150c and a second wall portion 322 provided on the second side surface 150d. With this structure, the inductor can suppress short circuits between the two side surfaces 150c and 150d of the wiring 150 and other conductive components.

[0063] Preferably, when the direction of the axis AX and the direction from the bottom surface 150b toward the top surface 150a of the inductor wiring 150 is defined as the first direction D1, the end surface of the wall portion 32 in the first direction D1 is located closer to the first direction D1 than the top surface 150a of the inductor wiring 150. Specifically, the first end surface 321a of the first wall portion 321 in the first direction D1 is located closer to the first direction D1 than the top surface 150a of the inductor wiring 150. The second end surface 322a of the second wall portion 322 in the first direction D1 is located closer to the first direction D1 than the top surface 150a of the inductor wiring 150. According to this structure, the inductor can more reliably suppress the short circuit between the two side surfaces 150c and 150d of the wiring 150 and other conductive components.

[0064] Preferably, the distance in the first direction D1 between the top surface 150a of the inductor wiring 150 and the end surface of the wall portion 32 in the first direction D1 is 5 μm or more and 20 μm or less. Specifically, the distance h1 in the first direction D1 between the top surface 150a of the inductor wiring 150 and the first end surface 321a of the first wall portion 321 is 5 μm or more and 20 μm or less. The distance h2 in the first direction D1 between the top surface 150a of the inductor wiring 150 and the second end surface 322a of the second wall portion 322 is 5 μm or more and 20 μm or less.

[0065] According to the above structure, since the distance h1 and the distance h2 are 5 μm or more, the inner peripheral surface 150d1 of the innermost circumference of the inductor wiring 150 can be suppressed from short-circuiting via the second magnetic layer 12. In addition, as in the present embodiment, when the inductor wiring 150 is one turn or more, the short-circuiting between adjacent turns can be suppressed. Since the distance h1 and the distance h2 are 20 μm or less, the inductor wiring 150 can be formed into a desired shape. As a result, a desired inductance value can be obtained. In the case where the distance h1 and the distance h2 exceed 20 μm, there is a possibility that after the wall portion 32 is formed, the wall portion 32 is inclined in the positive X direction or the reverse X direction, and the inductor wiring 150 cannot be formed into a desired shape. In addition, since the distance h1 and the distance h2 are 20 μm or less, the volume of the second magnetic layer 12 can be further increased.

[0066] When there are a plurality of wall portions 32 in the X direction in a cross section perpendicular to the extending direction of the inductor wiring 150 as in the present embodiment, it is most preferable that the distance is 5 μm or more and 20 μm or less in all the wall portions 32. However, the present invention is not limited thereto, and the distance may be 5 μm or more and 20 μm or less in a portion of the plurality of wall portions 32 in a cross section perpendicular to the extending direction of the inductor wiring 150.

[0067] Preferably, if Figure 1 and Figure 2 As shown, the cover insulating layer 30 is provided on at least a portion of the top surface 150a of the inductor wiring 150. According to this structure, the volume of the second magnetic layer 12 can be increased while ensuring the insulation between the top surface 150a and other conductive members.

[0068] Preferably, if Figure 1 and Figure 2As shown, the inductor wiring 150 further includes a first lead wiring 21 and a second lead wiring 22. When the direction of the axis AX and the direction from the bottom surface 150b toward the top surface 150a of the inductor wiring 150 is taken as the first direction D1, the first lead wiring 21 and the second lead wiring 22 are connected to the top surface 150a in the end portions (i.e., the inner peripheral end 151 and the outer peripheral end 152) in the extension direction of the inductor wiring 150, extend in the first direction D1 and are exposed from the outer surface of the blank 10, and the covering insulating layer 30 (i.e., the top surface portion 31) provided on a portion of the top surface 150a of the inductor wiring 150 is provided in the range of more than 80μm from the peripheral edge of the first lead wiring 21 and the second lead wiring 22 in the top surface 150a.

[0069] According to the above structure, it is possible to suppress the occurrence of short circuits between the portion of the top surface 150a of the inductor wiring 150 that contacts the second magnetic layer 12 and the first lead wiring 21 and the second lead wiring 22. Specifically, when a potential difference is generated in the conductor portion of the inductor component 1 due to ESD (Electro Static Discharge) or the like, there is a possibility that a short circuit may occur via magnetic powder of the second magnetic layer 12. In particular, since the distance between the first lead wiring 21 and the second lead wiring 22 and the inductor wiring 150 that exists around the first lead wiring 21 and the second lead wiring 22 is relatively short, a short circuit is likely to occur. The inventors have discovered that even if a portion of the top surface 150a of the inductor wiring 150 is not covered by the covering insulating layer 30 to make it contact with the second magnetic layer 12, by setting the top surface portion 31 of the covering insulating layer 30 to a range of more than 80 μm from the periphery of the first lead wiring 21 and the second lead wiring 22, the short circuit risk can be reduced to the same extent as when the entire top surface 150a of the inductor wiring 150 is covered by the covering insulating layer 30.

[0070] (Variation Example)

[0071] Figure 4 It is a schematic cross-sectional view showing an inductor component 1A according to a modified example. Figure 4 Corresponds to Figure 3 .

[0072] like Figure 4As shown, in a cross section orthogonal to the extending direction of the inductor wiring 150, the inductor wiring 150 has two side surfaces 150c and 150d connecting the top surface 150a and the bottom surface 150b, the two side surfaces 150c and 150d of the inductor wiring located at the innermost periphery include an inner peripheral surface 150d1 at the innermost periphery and an outer peripheral surface 150c2 opposite to the inner peripheral surface 150d1, the cover insulating layer 30 has a first wall portion 321 and a second wall portion 322 provided at least on each of the inner peripheral surface 150d1 and the outer peripheral surface 150c2, and an end surface 322a in the first direction D1 of the second wall portion 322 provided on the inner peripheral surface 150d1 is located on the second direction D2 side opposite to the first direction D1 compared to an end surface 321a in the first direction D1 of the first wall portion 321 provided on the outer peripheral surface 150c2.

[0073] Here, when the number of turns of the inductor wiring 150 is less than one turn, the “two side surfaces of the inductor wiring located at the innermost periphery” refer to the two side surfaces of the inductor wiring 150 on the cross section perpendicular to the extending direction of the inductor wiring 150. When the number of turns of the inductor wiring 150 is one turn or more, the “two side surfaces of the inductor wiring located at the innermost periphery” refer to the two side surfaces on the cross section including the innermost periphery of the cross section of the inductor wirings appearing on the cross section perpendicular to the extending direction of the inductor wiring 150.

[0074] According to the above configuration, it is possible to suppress the magnetic flux from being blocked by the second wall portion 322 covering the insulating layer 30 in the portion where the magnetic flux is wound.

[0075] Preferably, if Figure 4 As shown, the end surface 322 a of the second wall portion 322 provided on the inner peripheral surface 150 d 1 in the first direction D1 is located on the same plane as the top surface 150 a of the inductor wiring 150 .

[0076] According to the above configuration, it is possible to further suppress the magnetic flux from being blocked by the second wall portion 322 covering the insulating layer 30 in the portion where the magnetic flux is wound around.

[0077] (Manufacturing method)

[0078] Next, refer to Figure 5A to Figure 5J A method for manufacturing the inductor component 1 will be described. Figure 5A to Figure 5J Corresponds to Figure 1 Section II-II of Figure 2 ). In addition, Figure 5A to Figure 5J In the figure, for convenience, the description of the second lead wiring side is omitted.

[0079] like Figure 5A As shown in FIG. 1 , a base insulating layer 70 containing no magnetic material is formed on a substrate 90. The substrate 90 is made of, for example, sintered ferrite and has a flat plate shape.

[0080] The base insulating layer 70 is made of, for example, a polyimide resin containing no magnetic material. The base insulating layer 70 is formed by applying the polyimide resin on the substrate 90 by printing, coating, or the like. After the base insulating layer 70 is applied, patterning using photolithography may be performed so that only the polyimide resin in the region where the inductor wiring 150 is formed is left. In addition, before forming the base insulating layer 70, an insulating material serving as a grinding protection layer may be formed on the substrate 90.

[0081] like Figure 5B As shown, a seed layer 81 is formed on the base insulating layer 70. Specifically, a material of the seed layer 81 (for example, titanium / copper alloy) is formed on the upper surface of the base insulating layer 70 by sputtering and patterned by photolithography to form the seed layer 81.

[0082] like Figure 5C As shown, a wall portion 32 that becomes a part of the cover insulating layer is formed on the base insulating layer 70. For example, the wall portion 32 is formed by a photosensitive permanent photoresist. The so-called photosensitive permanent photoresist refers to a photoresist that is not removed after processing. Specifically, a photosensitive permanent photoresist is laminated on the base insulating layer 70, and exposure and development are performed. As a result, the material of the unexposed portion is removed, and the wall portion 32 is formed.

[0083] like Figure 5D As shown, power is supplied to the seed layer 81 and electrolytic plating is performed. Thus, the inductor wiring 150 is formed between the wall portions 32 .

[0084] like Figure 5E As shown in FIG. 1 , a top portion 31 covering the insulating layer 30 is formed on a portion of the top surface 150a of the inductor wiring 150. Specifically, a dry film resist (DFR) is laminated on the top surface 150a of the inductor wiring 150, and exposure and development are performed. Thus, the material of the unexposed portion is removed to form the top portion 31. At this time, the dry film resist located in the portion where the top surface 150a of the inductor wiring 150 contacts the second magnetic layer 12 is removed. Thus, when the second magnetic layer 12 is crimped in a post-process, a portion of the top surface 150a of the inductor wiring 150 contacts the second magnetic layer.

[0085] like Fig. 5FAs shown, the seed layer 82 is formed by sputtering so as to cover the exposed portion of the top surface 150a of the inductor wiring 150, the top surface portion 31 of the covering insulating layer 30, and the wall portion 32. At this time, since the distance between the end surface of the wall portion 32 of the covering insulating layer 30 and the top surface 150a of the inductor wiring 150 is 20 μm or less, the sputtered film can be well attached even in the step portion between the upper end surface of the wall portion 32 and the top surface 150a, and the seed layer 82 can be well formed.

[0086] like Figure 5G As shown, the first via wiring 212 and the first columnar wiring 211 are formed on the outer peripheral end 152 of the inductor wiring 150. Specifically, a resist film 320 is formed on the seed layer 82, and an opening portion is provided at a position of the resist film 320 corresponding to the first via wiring 212. At this time, since the distance between the end surface of the wall portion 32 of the cover insulating layer 30 and the top surface 150a of the inductor wiring 150 is less than 20 μm, the resist film 320 can be formed into a desired shape. Thus, the first via wiring 212 and the first columnar wiring 211 can also be formed into a desired shape. Thereafter, power is supplied to the seed layer 82 and electrolytic plating is performed to form a plating layer in the above-mentioned opening portion. Thus, the first via wiring 212 and the first columnar wiring 211 are formed in the opening portion.

[0087] like Figure 5H As shown, the resist film 320 is peeled off, the exposed seed layer 82 is removed, and the second magnetic layer 12 is pressed against the inductor wiring 150 from above the substrate 90. Thus, the inductor wiring 150, the base insulating layer 70, the cover insulating layer 30, and the first columnar wiring 211 are covered by the second magnetic layer 12.

[0088] like Fig.5I As shown, the upper surface of the second magnetic layer 12 is ground to expose the upper surface of the first columnar wiring 211 .

[0089] like Figure 5J As shown, a cover film 60 is formed on the upper surface of the second magnetic layer 12. For example, the cover film 60 is formed by a solder resist. Thereafter, the substrate 90 is ground to expose the lower surface of the base insulating layer 70. Thereafter, the first magnetic layer 11 is crimped from below the base insulating layer 70 toward the inductor wiring 150. Thus, the lower surface of the base insulating layer 70 is covered by the first magnetic layer 11. Thereafter, the lower surface of the first magnetic layer 11 is ground to adjust the thickness of the first magnetic layer 11. Thereafter, the first external terminal 51 is formed so as to cover the upper surface of the first columnar wiring 211. The first external terminal 51 is, for example, a three-layer structure of Cu / Ni / Au formed by electroless plating. Thereafter, singulation is performed by a slicer or the like to manufacture the inductor component 1.

[0090] <Second embodiment>

[0091] Figure 6 It is a schematic cross-sectional view showing a second embodiment of the inductor component. Figure 6 Corresponds to Figure 1 Section II-II of the diagram. Figure 6 In the embodiment, for convenience, the description of the second lead wiring side is omitted. The second embodiment differs from the first embodiment in that the top surface of the cover insulating layer and the base insulating layer are not provided. The following describes this different structure. The other structures are the same as those of the first embodiment, and are marked with the same reference numerals as those of the first embodiment and their descriptions are omitted.

[0092] like Figure 6 As shown in FIG. 1 , the cover insulating layer 30B has only the wall portion 32 and no top portion. Thus, the entire top surface 150a of the inductor wiring 150 is in contact with the second magnetic layer 12. The first lead wiring 21B has no conductive wiring, and the first columnar wiring 211 is directly connected to the inductor wiring 150. According to this structure, since the volume of the second magnetic layer 12 can be further increased, the inductance value of the inductor component 1B can be further increased.

[0093] In the inductor component 1B, the base insulating layer is not provided, and the upper surface of the first magnetic layer 11 is in contact with the lower surface of the second magnetic layer 12. Thus, the entire bottom surface 150b of the inductor wiring 150 is in contact with the first magnetic layer 11. According to this structure, the thickness of the first magnetic layer 11 in the Z direction can be increased compared to the case where the base insulating layer is provided, so the volume of the first magnetic layer 11 can be further increased, and the inductance value of the inductor component 1B can be further improved.

[0094] For example, it is possible to Figure 5E In the process shown, the top surface 31 is not provided. Figure 5J In the illustrated process, after the substrate 90 is ground, the base insulating layer 70 is removed to manufacture the inductor component 1B.

[0095] <Third Embodiment>

[0096] Figure 7 It is a schematic cross-sectional view showing a third embodiment of the inductor component. Figure 7 Corresponds to Figure 3 The third embodiment differs from the first embodiment in that no wall portion covering the insulating layer is provided on the innermost circumferential surface of the inductor wiring. This different structure is described below. The other structures are the same as those of the first embodiment, and the same reference numerals as those of the first embodiment are marked and their description is omitted.

[0097] like Figure 7As shown, at least a portion of the innermost circumferential surface 150d1 of the inductor wiring 150 is in contact with the second magnetic layer 12. In this embodiment, the entire innermost circumferential surface 150d1 of the inductor wiring 150 is in contact with the second magnetic layer 12. According to this structure, the volume of the second magnetic layer 12 can be further increased, so the inductance value of the inductor component 1C can be further increased.

[0098] For example, it is possible to Figure 5C In the steps shown, the inductor component 1C is manufactured without providing the wall portion 32 corresponding to the position of the inner peripheral surface of the innermost periphery of the inductor wiring.

[0099] <Fourth embodiment>

[0100] Figure 8 It is a schematic plan view showing a fourth embodiment of the inductor component. Figure 8 Corresponds to Figure 1 The fourth embodiment differs from the first embodiment mainly in that the position of the top portion of the covering insulating layer is different. The following describes the different structure. The other structures are the same as those of the first embodiment, and are marked with the same reference numerals as those of the first embodiment and their descriptions are omitted. Figure 8 In the figure, for convenience, oblique lines are given to the positions where the top surface portion of the covering insulating layer exists.

[0101] like Figure 8 As shown, it also has a first lead-out wiring 21 and a second lead-out wiring 22. When the direction of the axis AX and the direction from the bottom surface to the top surface of the inductor wiring 150 is taken as the first direction, the first lead-out wiring 21 and the second lead-out wiring 22 are connected to the top surface of the end portions (i.e., the inner peripheral end 151 and the outer peripheral end 152) in the extension direction of the inductor wiring 150, extend in the first direction and are exposed from the outer surface of the blank 10, and the covering insulating layer 30 (i.e., the top surface portion 31) provided on a portion of the top surface of the inductor wiring 150 is separated from the first lead-out wiring 21 and the second lead-out wiring 22.

[0102] Specifically, the top surface portion 31 of the cover insulating layer 30 is provided on the entire portion of the top surface of the inductor wiring 150 except for the regions around the first lead wiring 21 and the second lead wiring 22. Alternatively, the top surface portion 31 of the cover insulating layer 30 may be provided on a portion of the portion except for the regions around the first lead wiring 21 and the second lead wiring 22 as long as it is separated from the first lead wiring 21 and the second lead wiring 22. In the present embodiment, since the top surface portion 31 of the cover insulating layer 30 is not provided on the regions around the first lead wiring 21 and the second lead wiring 22, the first lead wiring 21 and the second lead wiring 22 do not have the first conductive wiring 212 and the second conductive wiring 222, unlike the first embodiment. That is, the bottom surfaces of the first pillar-shaped wiring 211 and the second pillar-shaped wiring 221 of the first lead wiring 21 and the second lead wiring 22 are in direct contact with the top surface of the inductor wiring 150.

[0103] According to the above structure, the top portion 31 can be provided at a desired position where a short circuit is likely to occur between the inductor wirings 150. In addition, since the first lead wiring 21 and the second lead wiring 22 are not Figure 1 Since the first conductive wiring 212 and the second conductive wiring 222 are provided, the contact area between the first lead wiring 21 and the second lead wiring 22 (i.e., the first columnar wiring 211 and the second columnar wiring 221) and the inductor wiring 150 can be increased, and the fixing strength between the first lead wiring 21 and the second lead wiring 22 and the inductor wiring 150 is increased, which can suppress the undesirable conditions such as breakage caused by external stress.

[0104] In addition, the present disclosure is not limited to the above-mentioned embodiment, and design changes can be made within the scope that does not deviate from the gist of the present disclosure. For example, various combinations of the characteristic points of each of the first to fourth embodiments are also possible.

[0105] In the above embodiment, the first lead wiring, the second lead wiring, the first external terminal, the second external terminal, and the cover film are provided, but these components are not essential and may not be provided or may be replaced by other components.

[0106] In the above embodiment, the inductor wiring is a single layer, but it may be two or more layers. In this case, the "top surface of the inductor wiring" refers to the top surface of the inductor wiring of the uppermost layer. The "bottom surface of the inductor wiring" refers to the bottom surface of the inductor wiring of the lowermost layer.

[0107] In the above embodiment, at least a portion of the top surface of the inductor wiring is in contact with the second magnetic layer, but the entire top surface of the inductor wiring may be covered by the cover insulating layer, and at least a portion of the bottom surface of the inductor wiring may be in contact with the first magnetic layer. In this case, the top surface of the inductor wiring corresponds to an example of the "second surface" described in the claims, and the bottom surface of the inductor wiring corresponds to an example of the "first surface" described in the claims.

[0108] In the above embodiment, a wall portion covering the insulating layer exists in the entire region between adjacent turns of the inductor wiring, but a second magnetic layer may exist between adjacent turns. Specifically, a wall portion covering the insulating layer may be provided on at least one of the two side surfaces of the inductor wiring in a cross section orthogonal to the extending direction of the inductor wiring, and a second magnetic layer may exist between adjacent turns.

[0109] (Example)

[0110] Chips were made in which the distance h between the top surface of the inductor wiring and the end surface of the first direction of the wall covering the insulating layer was changed to 3μm, 4μm, 5μm, 6μm, 7μm and 10μm, and each chip was subjected to a moisture load test. In the moisture load test, current flows through the chip under a high temperature and high humidity environment, and the insulation resistance of the inductor wiring is measured after a specified time. The conditions of the moisture load test are 85°C, 85%RH, 1A, and 500hr. The number of chips with normal insulation resistance (number of good chips) among the fifteen chips was investigated. The test results are shown in Table 1.

[0111] [Table 1]

[0112] Distance h(μm) 3 4 5 6 7 10 Number of good chips 12 14 15 15 15 15 Number of defective chips 3 1 0 0 0 0

[0113] Chips were made so that the distance h between the top surface of the inductor wiring and the end face of the first direction of the wall portion covering the insulating layer was changed to 10μm, 15μm, 20μm, 25μm and 30μm, and whether there were any adverse conditions in the manufacturing process. Specifically, the film formation state of the seed layer was observed by an optical microscope for a sample in which a seed layer was formed by sputtering after the wall portion covering the insulating layer was formed. In addition, the film formation state of the resist film was observed by an optical microscope for a sample in which a resist film was formed after the seed layer was formed. Then, the number of chips (good chips) in which the film formation state of the seed layer and the resist film was normal among the fifteen chips was investigated. The results of the investigation are shown in Table 2.

[0114] [Table 2]

[0115] Distance h(μm) 10 15 20 25 30 Number of good chips 15 15 15 11 5 Number of defective chips 0 0 0 4 10

[0116] As shown in Table 1, when the distance h was 4 μm or less, there were chips with abnormal insulation resistance. As shown in Table 2, when the distance h was 25 μm or more, there were chips with defects in the manufacturing process.

[0117] The present disclosure includes the following aspects.

[0118] <1> An inductor component comprising:

[0119] a body including a magnetic layer;

[0120] a coil, disposed in the blank and having an axis; and

[0121] an insulating layer covering a portion of the outer surface of the coil,

[0122] The coil has an inductor wiring, and the inductor wiring is wound along a plane orthogonal to the axis.

[0123] The inductor wiring has a first surface and a second surface, the first surface and the second surface are opposed to each other in the axial direction,

[0124] At least a portion of the first surface of the inductor wiring is in contact with the magnetic layer.

[0125] <2> The inductor component according to <1>, wherein:

[0126] The entire first surface of the inductor wiring is in contact with the magnetic layer.

[0127] <3> The inductor component according to <1> or <2>, wherein:

[0128] The entire second surface of the inductor wiring is in contact with the magnetic layer.

[0129] <4> The inductor component according to any one of <1> to <3>, wherein:

[0130] In a cross section perpendicular to the extending direction of the inductor wiring,

[0131] The inductor wiring has two side surfaces connecting the first surface and the second surface.

[0132] The insulating layer has a wall portion, and the wall portion is disposed on at least one of the two side surfaces.

[0133] <5> The inductor component according to <4>, wherein:

[0134] When a first direction is defined as a direction from the second surface toward the first surface of the inductor wiring in the axial direction, an end surface of the wall portion in the first direction is located closer to the first direction than the first surface of the inductor wiring.

[0135] <6> The inductor component according to <5>, wherein:

[0136] A distance in the first direction between the first surface of the inductor wiring and the end surface of the wall portion in the first direction is not less than 5 μm and not more than 20 μm.

[0137] <7> The inductor component according to any one of <1> to <6>, wherein:

[0138] At least a portion of an inner peripheral surface of an innermost periphery of the inductor wiring is in contact with the magnetic layer.

[0139] <8> The inductor component according to any one of <1> to <6>, wherein:

[0140] In a cross section perpendicular to the extending direction of the inductor wiring,

[0141] The inductor wiring has two side surfaces connecting the first surface and the second surface.

[0142] The two side surfaces of the innermost inductor wiring include an inner peripheral surface of the innermost periphery and an outer peripheral surface facing the inner peripheral surface.

[0143] The insulating layer has a wall portion, and the wall portion is provided at least on each of the inner peripheral surface and the outer peripheral surface.

[0144] When the axial direction and the direction from the second surface of the inductor wiring toward the first surface are taken as the first direction, the end surface of the wall portion provided on the inner peripheral surface in the first direction is located on the second direction side opposite to the first direction compared to the end surface of the wall portion provided on the outer peripheral surface in the first direction.

[0145] <9> The inductor component according to <8>, wherein:

[0146] An end surface of the wall portion provided on the inner peripheral surface in the first direction and the first surface of the inductor wiring are located on the same plane.

[0147] <10> The inductor component according to any one of <1> to <9>, wherein:

[0148] The insulating layer is provided on at least a portion of the first surface of the inductor wiring.

[0149] <11> The inductor component according to <10>, wherein:

[0150] further comprising a lead wiring, wherein when the direction from the second surface of the inductor wiring toward the first surface in the axial direction is defined as a first direction, the lead wiring is connected to the first surface at an end portion of the inductor wiring in an extending direction, and the lead wiring extends in the first direction and is exposed from an outer surface of the base body,

[0151] The insulating layer provided on a portion of the first surface of the inductor wiring is provided in a range of 80 μm or more from the periphery of the lead wiring on the first surface.

[0152] <12> The inductor component according to <10>, wherein:

[0153] further comprising a lead wiring, wherein when the direction from the second surface of the inductor wiring toward the first surface in the axial direction is defined as a first direction, the lead wiring is connected to the first surface at an end portion of the inductor wiring in an extending direction, and the lead wiring extends in the first direction and is exposed from an outer surface of the base body,

[0154] The insulating layer provided on a portion of the first surface of the inductor wiring is separated from the lead wiring.

[0155] Description of Reference Numerals

[0156] 1, 1A, 1B, 1C, 1D…inductor component, 10…basis, 10a…first principal surface, 10b…second principal surface, 10c to 10f…first side surface to fourth side surface, 11…first magnetic layer, 12…second magnetic layer, 15…coil, 21, 21B…first lead wiring, 211…first columnar wiring, 212…first conductive wiring, 22…second lead wiring, 221…second columnar wiring, 222…second conductive wiring, 30, 30B…cover insulating layer, 31…top surface, 32…wall, 321…first wall, 321a…end surface of the first wall, 322…second wall, 322a…end surface of the second wall, 51…first external terminal , 52…second external terminal, 60…covering film, 70…base insulating layer, 81, 82…seed layer, 150…inductor wiring, 150a…top surface (first surface) of the inductor wiring, 150b…bottom surface (second surface) of the inductor wiring, 150c…first side surface of the inductor wiring, 150c1…outer peripheral surface of the outermost periphery of the inductor wiring, 150c2…outer peripheral surface opposite to the inner peripheral surface of the innermost periphery of the inductor wiring, 150d…second side surface of the inductor wiring, 150d1…inner peripheral surface of the innermost periphery of the inductor wiring, 151…inner peripheral end, 152…outer peripheral end, AX…axis of the coil, D1…first direction, D2…second direction, h1, h2…distance.

Claims

1. An inductor component, comprising: a body including a magnetic layer; a coil, disposed in the blank and having an axis; and an insulating layer covering a portion of the outer surface of the coil, The coil has an inductor wiring, and the inductor wiring is wound along a plane orthogonal to the axis. The inductor wiring has a first surface and a second surface, the first surface and the second surface are opposed to each other in the axial direction, At least a portion of the first surface of the inductor wiring is in contact with the magnetic layer.

2. The inductor component according to claim 1, in, The entire first surface of the inductor wiring is in contact with the magnetic layer.

3. The inductor component according to claim 1 or 2, in, The entire second surface of the inductor wiring is in contact with the magnetic layer.

4. The inductor component according to any one of claims 1 to 3, in, In a cross section perpendicular to the extending direction of the inductor wiring, The inductor wiring has two side surfaces connecting the first surface and the second surface. The insulating layer has a wall portion, and the wall portion is disposed on at least one of the two side surfaces.

5. The inductor component according to claim 4, in, When a first direction is defined as a direction from the second surface toward the first surface of the inductor wiring in the axial direction, an end surface of the wall portion in the first direction is located closer to the first direction than the first surface of the inductor wiring.

6. The inductor component according to claim 5, in, A distance in the first direction between the first surface of the inductor wiring and the end surface of the wall portion in the first direction is not less than 5 μm and not more than 20 μm.

7. The inductor component according to any one of claims 1 to 6, in, At least a portion of an inner peripheral surface of an innermost periphery of the inductor wiring is in contact with the magnetic layer.

8. The inductor component according to any one of claims 1 to 6, in, In a cross section perpendicular to the extending direction of the inductor wiring, The inductor wiring has two side surfaces connecting the first surface and the second surface. The two side surfaces of the innermost inductor wiring include an inner peripheral surface of the innermost periphery and an outer peripheral surface facing the inner peripheral surface. The insulating layer has a wall portion, and the wall portion is provided at least on each of the inner peripheral surface and the outer peripheral surface. When the axial direction and the direction from the second surface of the inductor wiring toward the first surface are taken as the first direction, the end surface of the wall portion provided on the inner peripheral surface in the first direction is located on the second direction side opposite to the first direction compared to the end surface of the wall portion provided on the outer peripheral surface in the first direction.

9. The inductor component according to claim 8, in, An end surface of the wall portion provided on the inner peripheral surface in the first direction and the first surface of the inductor wiring are located on the same plane.

10. The inductor component according to any one of claims 1 to 9, in, The insulating layer is provided on at least a portion of the first surface of the inductor wiring.

11. The inductor component according to claim 10, in, further comprising a lead wiring, wherein when the direction from the second surface of the inductor wiring toward the first surface in the axial direction is defined as a first direction, the lead wiring is connected to the first surface at an end portion of the inductor wiring in an extending direction, and the lead wiring extends in the first direction and is exposed from an outer surface of the base body, The insulating layer provided on a portion of the first surface of the inductor wiring is provided in a range of 80 μm or more from the periphery of the lead wiring on the first surface.

12. The inductor component according to claim 10, in, further comprising a lead wiring, wherein when the direction from the second surface of the inductor wiring toward the first surface in the axial direction is defined as a first direction, the lead wiring is connected to the first surface at an end portion of the inductor wiring in an extending direction, and the lead wiring extends in the first direction and is exposed from an outer surface of the base body, The insulating layer provided on a portion of the first surface of the inductor wiring is separated from the lead wiring.

Images