High-gain heat dissipation antenna array

Abstract

The invention provides a high-gain heat dissipation antenna array, which comprises a feed layer, a radiation layer and a metal sheet structure, and is characterized in that the feed layer comprises a switching structure, a feed network and a gap, and energy is coupled to the radiation layer through the gap; a rectangular cavity array is arranged in the radiation layer, a metal via hole array is arranged around each cavity, and electromagnetic energy is excited and radiated through cavity resonance; the metal sheet structure comprises a base and a metal sheet unit array, the base is provided with a rectangular opening through cavity array used for transmitting electromagnetic waves, each metal sheet unit comprises an upper-layer metal sheet, a middle connecting sheet and a lower-layer metal sheet, and the height of the lower-layer metal sheet and the height of the upper-layer metal sheet are adjusted, so that thermal characteristics and electrical characteristics are optimized, and the electromagnetic waves can be transmitted. And the high-gain heat dissipation antenna performance is realized. By reasonably optimizing the shape of the radiating fins, the aperture efficiency of the radiating antenna array is improved, and the antenna array design with high radiating efficiency and high gain is realized.

Description

Technical Field

[0001] The present invention relates to the field of antenna technology, and in particular to a high-gain heat dissipation antenna array. Background Art

[0002] With the rapid development of wireless communication technology, especially the widespread application of 5G and future 6G networks, system functions are constantly enhanced and device power is significantly increased. Although this power increase brings higher performance and a wider range of application scenarios, it also causes heat dissipation to become a significant problem. In traditional architectures, independent heat sinks are usually used to dissipate heat from the chip. However, as the system develops towards miniaturization and integration, it has become an inevitable trend to integrate individual devices into a whole. Traditional heat dissipation solutions are stretched in this compact design because they cannot effectively cope with the heat dissipation challenges brought about by high-density integration. Against this background, heat dissipation antennas came into being. It can not only meet the heat dissipation requirements of the system, but also achieve efficient radiation performance. By combining the heat dissipation structure with the antenna design, the heat dissipation antenna can solve the two key problems of heat dissipation and signal transmission in a limited space.

[0003] Compared with traditional planar antennas, heat dissipation antennas use three-dimensional metal structures, which not only significantly improve the radiation efficiency and working bandwidth, but also effectively solve the heat dissipation problem during high-power operation. By optimizing the heat dissipation path and electromagnetic wave propagation path, heat dissipation antennas can achieve efficient energy conversion and transmission. However, the existing heat dissipation antenna solutions cannot meet the requirements of high-gain application scenarios. How to achieve high gain while maintaining good heat dissipation effect is a design difficulty that needs to be solved urgently. Summary of the invention

[0004] The purpose of the present invention is to provide a high-gain heat dissipation antenna array, which improves the aperture efficiency of the heat dissipation antenna array by reasonably optimizing the shape of the heat sink, and realizes the design of an antenna array with efficient heat dissipation and high gain.

[0005] To solve the above problems, the technical solution of the present invention is:

[0006] A high-gain heat dissipation antenna array comprises a feed layer, a radiation layer and a metal sheet structure, wherein the feed layer comprises a switching structure, a feed network and a gap, and energy is coupled to the radiation layer through the gap; a rectangular cavity array is arranged in the radiation layer, and a metal via array is arranged around each cavity, and electromagnetic energy is excited and radiated through cavity resonance; the metal sheet structure comprises a base and a metal sheet unit array, and a rectangular open cavity array is arranged on the base for propagating electromagnetic waves, and each metal sheet unit comprises an upper metal sheet, an intermediate connecting sheet and a lower metal sheet, and the thermal characteristics and electrical characteristics are optimized by adjusting the height of the lower metal sheet and the upper metal sheet, so as to achieve high-gain heat dissipation antenna performance.

[0007] Preferably, the transition structure in the feeding layer is used to achieve the matching between the standard waveguide and the feeding network. The transition structure includes a rectangular cavity, a plurality of metal vias and a metal patch.

[0008] Preferably, the feeding network in the feeding layer adopts a substrate integrated waveguide structure, and TE waves are propagated inside. 10 waves.

[0009] Preferably, each resonant cavity in the rectangular cavity array in the radiation layer operates in the TE 101 mode.

[0010] Preferably, the rectangular cavity array in the radiation layer is aligned with the rectangular open cavity array structure of the base for transmitting electromagnetic waves. The opening size of each unit of the rectangular cavity array is slightly smaller than that of each unit of the rectangular open cavity array of the base.

[0011] Preferably, a plurality of fixing holes are provided on the feeding layer, the radiation layer and the metal sheet structure. The plurality of fixing holes are used to install the heat dissipation antenna array and connect the standard waveguide components.

[0012] Preferably, metal sheet units are placed in parallel near the two long sides of each rectangular open cavity on the base.

[0013] Preferably, each metal sheet unit includes two parallel upper metal sheets, two parallel lower metal sheets and an intermediate connecting sheet. The distance between the upper metal sheets is smaller than that between the lower metal sheets.

[0014] Preferably, the height of the upper heat dissipation fin is one quarter of the working wavelength of the antenna, and its function is to reflect the diffracted wave on the upper aperture surface so that it is in the same phase as the directly radiated electromagnetic wave.

[0015] Preferably, the height of the lower heat dissipation fin is determined by the heat dissipation requirement.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. Using a rectangular resonant cavity as the radiation unit has a broadband effect;

[0018] 2. Using two layers of heat dissipation fins realizes the independent control of electrothermal;

[0019] 3. Using a specially designed heat dissipation fin shape improves the aperture efficiency of the antenna array. Description of the Drawings

[0020] By reading the following detailed description of the non-limiting embodiments with reference to the accompanying drawings, other features, objects and advantages of the present invention will become more apparent:

[0021] Figure 1 Schematic diagram of the high-gain heat dissipation antenna array structure of the present invention;

[0022] Figure 2 Top view of the feeding layer;

[0023] Figure 3 Top view of the radiation layer;

[0024] Figure 4 Side view of the metal sheet structure;

[0025] Figure 5 Echo loss curve of the high-gain heat dissipation antenna array;

[0026] Figure 6 Gain curve of the high-gain heat dissipation antenna array;

[0027] Figure 7 E-plane normalized radiation pattern of the high-gain heat dissipation antenna array;

[0028] Figure 8 H-plane normalized radiation pattern of the high-gain heat dissipation antenna array;

[0029] Figure 9 Curve of chip temperature varying with input power. Specific embodiments

[0030] The present invention will be described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those of ordinary skill in the art can make several changes and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0031] Specifically, the present invention provides a high-gain heat dissipation antenna array, as Figures 1 to 4As shown, the high-gain heat dissipation antenna array includes a feeding layer 1, a radiation layer 2, and a metal sheet structure 3. The feeding layer 1 includes a transition structure 11 and a feeding network 12, and energy is coupled to the radiation layer 2 through a slot 13 above the feeding network 12. A rectangular cavity array 9 is provided in the radiation layer 2, and a metal via array is arranged around each cavity to excite and radiate electromagnetic energy through cavity resonance. The metal sheet structure 3 is composed of a base 7 and a metal sheet unit array. Each metal sheet unit includes an upper metal sheet 4, an intermediate connecting sheet 5, and a lower metal sheet 6. A rectangular open cavity array 8 is provided in the base 7 for propagating electromagnetic waves. By adjusting the heights of the lower metal sheet and the upper metal sheet, the thermal characteristics and electrical characteristics are optimized, so as to achieve the comprehensive performance of high-efficiency heat dissipation and high gain. In addition, a number of fixing holes 10 are provided on the feeding layer 1, the radiation layer 2, and the metal sheet structure 3, and the number of fixing holes 10 is used to mount the heat dissipation antenna array and connect to a standard waveguide component.

[0032] The transition structure 11 in the feeding layer is used to achieve the matching of the standard waveguide to the feeding network 12. The transition structure 11 includes a rectangular cavity, a number of metal vias, and a metal patch, and the specific dimensions need to be determined according to the operating frequency. The feeding network 12 in the feeding layer adopts a substrate integrated waveguide structure, and TE 10 waves propagate inside, and the specific dimensions need to be determined according to the operating frequency.

[0033] Each resonant cavity of the rectangular cavity array 9 in the radiation layer operates in TE 101 mode, and the specific dimensions need to be determined according to the operating frequency. The rectangular cavity array 9 in the radiation layer is aligned with the rectangular open cavity array 8 of the base for transmitting electromagnetic waves. The opening size of each unit of the rectangular cavity array 9 is slightly smaller than the opening size of each unit of the rectangular open cavity array structure 8 of the base.

[0034] Metal sheet units are placed in parallel near the two long sides of each rectangular open cavity on the base 7. Each metal sheet unit includes two parallel upper metal sheets 4, two parallel lower metal sheets 6, and an intermediate connecting sheet. The spacing between the upper metal sheets is smaller than the spacing between the lower metal sheets. The height of the upper heat dissipation fin 4 is about one quarter of the antenna operating wavelength, and its function is to reflect the diffracted wave of the upper aperture surface so that it is in phase with the directly radiated electromagnetic wave. The height of the lower heat dissipation fin 6 is determined by the heat dissipation requirement.

[0035] As Figure 1Taking a specific high-gain heat dissipation antenna array shown as an example, this embodiment specifically provides a design scheme for a high-gain heat dissipation antenna array with an operating frequency of 60 GHz. The feeding layer 1 and the radiation layer 2 are realized by the low-temperature co-fired ceramic process, and the geometric size is 38 mm × 38 mm × 0.864 mm. The dielectric constant of the substrate material is 5.9, and the loss tangent is 0.002. It consists of nine dielectric layers, and the thickness of each layer is 0.096 mm. Among them, the feeding layer 1 includes four dielectric layers, the radiation layer 2 includes five dielectric layers, the overall size of the metal sheet structure 3 is 38 mm × 22 mm × 15 mm, and the size of each rectangular open cavity array 8 is 3.5 mm × 2.5 mm.

[0036] As Figure 1 shown, the antenna array includes 16 antenna elements (composed of 16 rectangular cavities and 20 groups of metal sheets), and the vertical and horizontal spacings in the horizontal direction are 6.25 mm and 5 mm respectively. Figure 2 is the top view of the feeding layer 1. The feeding network 12 adopts equal division feeding, and the size of the slot 13 is 0.96 mm × 0.2 mm. There are 4 fixing holes 10 on each side of the antenna array for fixing the substrate and the metal sheet structure 3, and 6 annular fixing holes 10 are provided at the front end of the antenna array for connecting standard waveguide components. Figure 3 is the radiation pattern of the radiation layer 2. The opening size of the rectangular cavity array 9 unit is 3 mm × 2 mm. Figure 4 is the side view of the metal sheet structure 3. The height of the base 7 is 1 mm, the heights of the upper heat sink 4 and the lower heat sink 6 are 1.75 mm and 12.25 mm respectively, the thickness of each metal sheet is 0.5 mm, and the height of the middle connecting piece 5 is 1 mm and the thickness is 2.5 mm. Figure 5 is the return loss curve of the high-gain heat dissipation antenna array in this embodiment. In the frequency band of 54.8 GHz to 67.8 GHz, the return loss of the antenna is less than -10 dB. Figure 6 is the gain curve of the high-gain heat dissipation antenna array in this embodiment. The peak gain of the antenna is 21.8 dBi, and the 3-dB gain bandwidth is 54.6 GHz to 67.8 GHz, verifying the high-gain radiation characteristics of the heat dissipation antenna array. Figure 7 is the E-plane normalized radiation pattern of the high-gain heat dissipation antenna array in this embodiment, and the 3-dB main lobe beamwidth is 10°. Figure 8 is the H-plane normalized radiation pattern of the high-gain heat dissipation antenna array in this embodiment, and the 3-dB main lobe beamwidth is 12°. When the chip is placed at the bottom of the feeding layer 1, Figure 9 the curves of the chip temperature varying with the input power with and without the metal sheet structure are respectively plotted. It can be seen that when the metal sheet structure is loaded, the chip temperature is significantly reduced, verifying the heat dissipation ability of the heat dissipation antenna array.

[0037] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A high-gain heat dissipation antenna array, characterized in that: It includes a feeding layer, a radiating layer and a metal sheet structure, wherein the feeding layer includes a switching structure, a feeding network and a gap, and energy is coupled to the radiating layer through the gap; a rectangular cavity array is arranged in the radiating layer, and a metal via array is arranged around each cavity, and electromagnetic energy is excited and radiated through cavity resonance; the metal sheet structure includes a base and a metal sheet unit array, and a rectangular open cavity array is arranged on the base for propagating electromagnetic waves, and each metal sheet unit includes an upper metal sheet, an intermediate connecting sheet and a lower metal sheet, and the thermal and electrical characteristics are optimized by adjusting the height of the lower metal sheet and the upper metal sheet, so as to achieve high-gain heat dissipation antenna performance.

2. The high-gain heat dissipation antenna array according to claim 1, characterized in that: The switching structure in the feed layer is used to achieve matching between a standard waveguide and a feed network, and the switching structure includes a rectangular cavity, a plurality of metal vias and a metal patch.

3. The high-gain heat dissipation antenna array according to claim 1, characterized in that: The feeding network in the feeding layer adopts a substrate integrated waveguide structure, and the internal propagation TE 10 Wave.

4. The high-gain heat dissipation antenna array according to claim 1, characterized in that: Each resonant cavity of the rectangular cavity array in the radiation layer operates at TE 101 mold.

5. The high-gain heat dissipation antenna array according to claim 1, characterized in that: The rectangular cavity array in the radiation layer is aligned with the rectangular open cavity array structure of the base for transmitting electromagnetic waves, and the opening size of each unit of the rectangular cavity array is slightly smaller than the opening size of each unit of the rectangular open cavity array of the base.

6. The high-gain heat dissipation antenna array according to claim 1, characterized in that: The feed layer, the radiation layer and the metal sheet structure are all provided with a plurality of fixing holes, and the plurality of fixing holes are used for installing the heat dissipation antenna array and connecting the standard waveguide components.

7. The high-gain heat dissipation antenna array according to claim 1, characterized in that: Metal sheet units are placed parallel to the long sides of both sides of each rectangular opening cavity on the base.

8. The high-gain heat dissipation antenna array according to claim 1, characterized in that: Each metal sheet unit includes two parallel upper metal sheets, two parallel lower metal sheets and an intermediate connecting sheet, and the spacing between the upper metal sheets is smaller than the spacing between the lower metal sheets.

9. The high-gain heat dissipation antenna array according to claim 1, characterized in that: The height of the upper heat sink is one quarter of the working wavelength of the antenna, and its function is to reflect the diffraction wave of the upper aperture surface to make it in phase with the directly radiated electromagnetic wave.

10. The high-gain heat dissipation antenna array according to claim 1, characterized in that: The height of the lower heat sink is determined by heat dissipation requirements.

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