Circuit board and circuit board gold plating processing technology

Abstract

The invention belongs to the technical field of circuit board processing, and discloses a circuit board and a circuit board gold plating processing technology. The circuit board comprises a board body, a golden finger assembly, a to-be-gold-plated assembly and a first groove hole, the board body is sequentially provided with an effective area and an excess material area in the first direction, and a to-be-processed area with a notch is reserved in the effective area; the golden finger assembly comprises a golden finger and a first lead, the golden finger is arranged in the effective area, the first lead extends in the first direction, one end is connected to the golden finger, and the other end is connected to the first end of the excess material area; the to-be-gold-plated assembly comprises a to-be-gold-plated part and a second lead, the to-be-gold-plated part is arranged in the effective area and located on the peripheral side of the to-be-machined area of the notch, the second lead extends in the first direction, one end of the second lead is connected to the to-be-gold-plated part, and the other end of the second lead is connected to the first end of the excess material area; the number of the first groove holes is at least two, every two first groove holes form a group, and each group of first groove holes are formed in the two sides of the second lead respectively and located in the to-be-machined area of the notch.

Description

Technical Field

[0001] The present invention relates to the technical field of printed circuit board processing, and particularly relates to a printed circuit board and a gold plating processing technology for the printed circuit board. Background Art

[0002] A gold finger is a computer hardware composed of multiple golden conductive contacts. It is named because its surface is gold-plated and the conductive contacts are arranged in a finger-like shape. The gold finger is the output and input port of the memory signal, and is used between the memory module and the memory slot, between the graphics card and the graphics card slot, etc. All data streams and electron flows of the memory processing unit are exchanged with the PC system through the contact between the gold finger and the memory slot. For the processing of the gold finger on the printed circuit board, a gold plating operation needs to be performed on the gold finger, that is, a circuit is connected to one end of the printed circuit board.

[0003] In the prior art, the plug-in end of the gold finger of the printed circuit board has a notch. In order to ensure the fit between the notch and the plug-in component, the dimensional accuracy of the notch is required to be + / - 0.050 mm. Therefore, the notch can only be made by a drilling process. Since there are also parts to be gold-plated arranged inside the notch of some gold finger printed circuit boards, affected by the position of the notch, the lead of this part to be gold-plated cannot directly extend to the end of the printed circuit board for synchronous gold plating processing with the gold finger, but needs to be gold-plated separately, which not only reduces the processing efficiency of the printed circuit board, but also increases the processing complexity of the printed circuit board. Summary of the Invention

[0004] The purpose of the present invention is to provide a printed circuit board and a gold plating processing technology for the printed circuit board, so as to solve the problem that in the prior art, there are also parts to be gold-plated arranged inside the notch of some gold finger printed circuit boards. Affected by the position of the notch, the lead of this part to be gold-plated cannot directly extend to the end of the printed circuit board for synchronous gold plating processing with the gold finger, but needs to be gold-plated separately, improving the processing efficiency of the printed circuit board and reducing the processing complexity of the printed circuit board.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] On the one hand, a printed circuit board is provided, including:

[0007] A board body, which is sequentially arranged as an effective area and a waste material area along a first direction, and a to-be-processed area with a notch is reserved in the effective area;

[0008] A gold finger assembly, which includes a gold finger and a first lead. The gold finger is arranged in the effective area, and the first lead extends along the first direction, with one end connected to the gold finger and the other end connected to the first end of the waste material area;

[0009] Component to be gold-plated, the component to be gold-plated includes a part to be gold-plated and a second lead. The part to be gold-plated is disposed in the effective area and is located on the periphery of the to-be-processed area of the notch. The second lead extends along the first direction, one end is connected to the part to be gold-plated, and the other end is connected to the first end of the surplus material area;

[0010] First slot holes, there are at least two first slot holes. Two of the first slot holes form a group. Each group of the first slot holes is respectively disposed on both sides of the second lead and is located in the to-be-processed area of the notch.

[0011] As an alternative technical solution of the circuit board, the distance between the two mutually facing edges of the two first slot holes is the same as the width of the to-be-processed area of the notch.

[0012] As an alternative technical solution of the circuit board, the notch is U-shaped, and the first slot hole is a semi-circular end strip.

[0013] As an alternative technical solution of the circuit board, the two first slot holes extend along the first direction to the surplus material area of the board body and the semi-circular ends close to the surplus material area are completely located in the surplus material area, and the semi-circular ends in the effective area are tangent to the U-shaped part of the notch.

[0014] As an alternative technical solution of the circuit board, the first slot holes are processed using drilling equipment.

[0015] As an alternative technical solution of the circuit board, there are multiple to-be-processed areas of the notch, and the components to be gold-plated correspond to the to-be-processed areas of the notch one by one.

[0016] As an alternative technical solution of the circuit board, there are multiple gold finger components, which are spaced between multiple to-be-processed areas of the notch.

[0017] On the other hand, a circuit board gold-plating processing process is provided, which is applied to the above-mentioned circuit board and includes the following steps:

[0018] S1. Connect the circuit to the first end of the surplus material area, gold-plate the gold fingers through the first lead, and gold-plate the part to be gold-plated through the second lead;

[0019] S2. Remove the surplus material area of the board body;

[0020] S3. Remove the surplus material in the to-be-processed area of the notch and process the notch.

[0021] As an alternative technical solution of the circuit board gold-plating processing process, in steps S2 and S3, a router or a milling machine is used to cut off the surplus material area and process the U-shaped side walls of the notch

[0022] Advantages of the present invention:

[0023] This application discloses a circuit board and a gold plating processing technology for the circuit board. The circuit board includes a board body, a gold finger assembly, a component to be gold plated, and a first slot. The board body is sequentially arranged in a first direction as an effective area and a surplus material area, and a to-be-processed area with a notch is reserved in the effective area; the gold finger assembly includes a gold finger and a first lead. The gold finger is arranged in the effective area, and the first lead extends in the first direction, with one end connected to the gold finger and the other end connected to the first end of the surplus material area; the component to be gold plated includes a component to be gold plated and a second lead. The component to be gold plated is arranged in the effective area and on the periphery of the to-be-processed area of the notch. The second lead extends in the first direction, with one end connected to the component to be gold plated and the other end connected to the first end of the surplus material area; there are at least two first slots, and two first slots form a group. Each group of first slots is respectively arranged on both sides of the second lead and is located in the to-be-processed area of the notch. This application uses two first slots to locate the position of the notch and make way for the second lead, extends both the first lead and the second lead to the first end for synchronous gold plating, and then processes a notch in the first slot, improving the processing efficiency of the circuit board and reducing the processing complexity of the circuit board. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the description of the embodiments of the present invention. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the content of the embodiments of the present invention and these drawings.

[0025] Figure 1 is a schematic structural diagram of a circuit board in the prior art;

[0026] Figure 2 is a schematic structural diagram of the circuit board provided by the embodiment of the present invention;

[0027] Figure 3 is a flowchart of the gold plating processing technology for the circuit board provided by the embodiment of the present invention.

[0028] In the figure:

[0029] 10. Board body; 11. Notch;

[0030] 20. Gold finger assembly; 21. Gold finger; 22. First lead;

[0031] 30. Component to be gold plated; 31. Component to be gold plated; 32. Second lead;

[0032] 40. First slot. Detailed Embodiments

[0033] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only for explaining the present invention, rather than limiting the present invention. Additionally, it should be noted that for the sake of description, only parts related to the present invention rather than all structures are shown in the drawings.

[0034] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0035] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath", and "under" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0036] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and do not have special meanings.

[0037] In the prior art, the gold finger insertion end of a circuit board has a notch. To ensure the fit between the notch and the plug-in component, the dimensional accuracy of the notch is required to be within + / -0.050 mm. Therefore, the notch can only be made by drilling. Since there are also components to be gold-plated on the inner side of the notch of some gold finger circuit boards, affected by the position of the notch, the leads of these components to be gold-plated cannot directly extend to the end of the circuit board for synchronous gold-plating processing with the gold fingers, but need to be gold-plated separately, which not only reduces the processing efficiency of the circuit board but also increases the processing complexity of the circuit board.

[0038] To solve the above problems, this embodiment provides a circuit board. Refer toFigure 1 and Figure 2 , including a board body 10, a gold finger assembly 20, a component to be gold-plated 30, and a first slot 40.

[0039] Further, the board body 10 is arranged in an effective area and a waste material area in sequence along a first direction, and a processing area with a notch 11 is reserved in the effective area. Specifically, refer to Figure 2 . A dotted line extending along a second direction divides the board body 10 into an effective area and a waste material area. In this embodiment, the first direction is the Y direction, and the second direction is the X direction.

[0040] Further, the gold finger assembly 20 includes a gold finger 21 and a first lead 22. The gold finger 21 is arranged in the effective area, the first lead 22 extends along the first direction, one end is connected to the gold finger 21, and the other end is connected to the first end of the waste material area; specifically, the gold finger assemblies 20 are multiple and are arranged at intervals between the processing areas of multiple notches 11, and the gold fingers 21 and the first leads 22 correspond one by one. In this embodiment, two gold fingers 21 are arranged at intervals between the processing areas of two adjacent notches 11, and two gold fingers 21 are also arranged at intervals between the processing area of the notch 11 and the edge of the board body 10. In other embodiments, the number and the interval distance of the gold fingers 21 can be set according to the requirements of the circuit board.

[0041] Further, the component to be gold-plated 30 includes a component to be gold-plated 31 and a second lead 32. The component to be gold-plated 31 is arranged in the effective area and is located on the periphery of the processing area of the notch 11. The second lead 32 extends along the first direction, one end is connected to the component to be gold-plated 31, and the other end is connected to the first end of the waste material area; specifically, there are multiple processing areas of the notch 11, and the components to be gold-plated 30 correspond to the processing areas of the notch 11 one by one.

[0042] Further, there are at least two first slots 40. Two first slots 40 form a group, and each group of first slots 40 are respectively arranged on both sides of the second lead 32 and are both located in the processing area of the notch 11. Specifically, due to the high processing accuracy of the drilling equipment, the first slots 40 are processed by the drilling equipment. The drilling equipment can effectively ensure the control of the dimensional accuracy (width and depth) of the final notch 11, and avoid affecting the insertion and extraction of the gold finger circuit board and the card slot, and prevent the gold finger circuit board from being scrapped due to inability to insert into the card slot.

[0043] Further, the distance between the two edges of the two first slot holes 40 facing away from each other is the same as the width of the to-be-machined area of the notch 11. That is: the two edges of the two first slot holes 40 facing away from each other coincide with the edges of the notch 11, ensuring the accuracy of the edges of the notch 11. The notch 11 is U-shaped, and the first slot hole 40 is a semi-circular end long strip. The two first slot holes 40 extend along the first direction to the surplus material area of the plate body 10 and the semi-circular ends close to the surplus material area are completely located in the surplus material area. The semi-circular ends within the effective area are tangent to the U-shaped part of the notch 11. By the tangency of the semi-circular ends within the effective area and the U-shaped part of the notch 11 and the coincidence of the two edges of the two first slot holes 40 facing away from each other with the edges of the notch 11, the position of the notch 11 is positioned.

[0044] By using the two first slot holes 40 to position the notch 11 and make way for the second lead 32, both the first lead 22 and the second lead 32 are extended to the first end for synchronous gold plating and then the notch 11 is machined on the first slot hole 40, improving the processing efficiency of the circuit board and reducing the processing complexity of the circuit board.

[0045] Further, this embodiment also provides a circuit board gold plating processing technology, applying the above-mentioned circuit board, referring to Figure 3 , including the following steps:

[0046] S1. Connect a circuit at the first end of the surplus material area, gold plate the gold fingers 21 through the first lead 22, and gold plate the to-be-gold-plated part 31 through the second lead 32;

[0047] S2. Remove the surplus material area of the plate body 10;

[0048] S3. Remove the surplus material in the to-be-machined area of the notch 11 and machine the notch 11.

[0049] Specifically, in steps S2 and S3, a router or a milling machine is used to cut off the surplus material area and machine the U-shaped side walls of the notch 11. After the gold fingers are gold plated, a router or a milling machine is used to machine and remove the surplus material area and the gold finger leads, and the notch 11 is integrally machined through the first slot hole 40.

[0050] Obviously, the above-mentioned embodiments of the present invention are merely examples for clearly explaining the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the claims of the present invention.

Claims

1. A circuit board, characterized in that: include: A plate body (10), wherein the plate body (10) is sequentially arranged along a first direction into an effective area and a residual material area, and a to-be-processed area having a notch (11) is reserved in the effective area; A gold finger assembly (20), the gold finger assembly (20) comprising a gold finger (21) and a first lead (22), the gold finger (21) being arranged in the effective area, the first lead (22) extending along the first direction, one end of which is connected to the gold finger (21), and the other end of which is connected to the first end of the residual material area; A component to be gold-plated (30), the component to be gold-plated (30) comprising a piece to be gold-plated (31) and a second lead (32), the piece to be gold-plated (31) being arranged in the effective area and located on the periphery of the area to be processed of the notch (11), the second lead (32) extending along the first direction, one end of which is connected to the piece to be gold-plated (31), and the other end of which is connected to the first end of the excess material area; A first slot hole (40), wherein the number of the first slot holes (40) is at least two, and two of the first slot holes (40) form a group. Each group of the first slot holes (40) is respectively arranged on both sides of the second lead wire (32) and are all located in the area of ​​the notch (11) to be processed.

2. The circuit board according to claim 1, characterized in that: The distance between two edges of the two first slots (40) that are away from each other is the same as the width of the to-be-processed area of ​​the notch (11).

3. The circuit board according to claim 1, characterized in that: The notch (11) is U-shaped, and the first slot (40) is an elongated strip with a semicircular end.

4. The circuit board according to claim 3, characterized in that: The two first slots (40) extend along the first direction to the excess material area of ​​the plate body (10), and the semicircular ends close to the excess material area are completely located in the excess material area, and the semicircular ends in the effective area are tangent to the U-shaped portion of the notch (11).

5. The circuit board according to claim 1, characterized in that: The first slot (40) is processed using drilling equipment.

6. The circuit board according to claim 1, characterized in that: The notch (11) has a plurality of areas to be processed, and the components to be gold-plated (30) correspond one to one to the areas to be processed in the notch (11).

7. The circuit board according to claim 1, characterized in that: The gold finger components (20) are in plurality and are arranged at intervals between the processing areas of the plurality of notches (11).

8. A gold plating process for a circuit board, applied to the circuit board as claimed in any one of claims 1 to 7, characterized in that: The following steps are involved: S1, connecting a circuit to the first end of the residual material area, gold-plating the gold finger (21) through the first lead (22), and gold-plating the part to be gold-plated (31) through the second lead (32); S2, removing the excess material area of ​​the plate body (10); S3, removing the remaining material in the area to be processed of the notch (11), and processing the notch (11).

9. The circuit board gold plating process according to claim 8, characterized in that: In step S2 and step S3, a gong machine or a milling machine is used to cut off the excess material area and process the U-shaped side wall of the notch (11).

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