Three-in-one electroplating device and process

Abstract

The invention discloses a three-in-one electroplating device and technology, and belongs to the technical field of circuit board machining, the three-in-one electroplating device comprises a frame, a board placing mechanism is arranged at the position, close to the inner wall, in one end of the frame, and a discharging part is arranged at the position, away from the board placing mechanism, in the other end of the frame; the device is characterized in that a machining groove is formed in the position, corresponding to the discharging part, in the frame; two sets of symmetrically-arranged spray pipes are connected into the machining groove. A circuit board is clamped through the combined hanging tool, then the circuit board can move through cooperation of the pushing mechanism, the circuit board can ascend and descend under the action of the movable platform, the device is in a vertical ascending and descending mode, machining of the circuit board can be completed, and when the circuit board is moved, the circuit board is not in contact with the outside; and the circuit board is not in contact during switching of each process and does not need to be in contact with the roller, so that roller marks on the surface of the circuit board are avoided, and the production quality of the circuit board can be ensured.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board production, and in particular relates to a three-in-one electroplating device and process. Background Art

[0002] Circuit boards are core components that support and connect electronic components in electronic devices. Circuit patterns are formed by etching conductive copper foil on an insulating substrate to achieve electrical connection and functional integration between components. They are divided into single-sided boards, double-sided boards and multi-layer boards, and are widely used in electronic products such as mobile phones, computers, and home appliances.

[0003] Circuit board processing is the process of converting electronic design drawings into physical circuit boards. Through processes such as etching copper foil, lamination, drilling, electroplating, and solder mask printing, conductive circuits and pads are manufactured on insulating substrates to form circuit carriers for solderable components. This is the basis for realizing the functions of electronic equipment.

[0004] During the production process of circuit boards, drilling is usually required to achieve circuit conduction and package plug-ins. The hole metallization process is one of the most important processes in PCB manufacturing technology. In order to achieve hole metallization, chemical copper (PTH process) and polymer conductive film are usually used to achieve conductivity of the resin substrate. The conductive layer achieved by these methods is not sufficient to meet the conditions for use, so it is also necessary to use the copper electroplating method to thicken the conductive layer.

[0005] The chemical copper process equipment of existing PCB manufacturers is mostly traditional gantry type. Gantry type chemical copper process equipment not only consumes manpower and material resources when in use, but also has high safety risks. In order to reduce the disadvantages of gantry type chemical copper process equipment, the market has introduced horizontal copper deposition technology. Horizontal copper deposition technology solves the disadvantages of gantry type chemical copper process equipment, but the roller of horizontal copper deposition equipment will contact with the circuit board surface during the production of circuit boards, and the contact surface is large. After the roller contacts the circuit board surface, it will leave a roller mark on the circuit board surface, which will cause quality risks to the metallization process such as product appearance and exchange of solution in the hole. Summary of the invention

[0006] The present invention provides a three-in-one electroplating device and process, one purpose of which is to solve the problem of poor circuit board production quality in the prior art; the second purpose is to solve the problem of copper accumulation at the lower end of the circuit board, resulting in poor quality of the produced circuit board.

[0007] The purpose of the present invention can be achieved through the following technical solutions: A three-in-one electroplating device comprises a frame, a plate placing mechanism is arranged at a position close to the inner wall inside one end of the frame, a material discharge part is arranged at a position away from the plate placing mechanism inside the other end of the frame, a processing groove is arranged at a position corresponding to the material discharge part inside the frame, and the frame and the material discharge part are arranged in a straight line; this technical scheme is provided with a bulking section, a desmear section, a neutralization section, two groups of hole-forming sections, a micro-etching section, a pre-impregnation and activation section, a speeding section, a copper plating section, a pre-impregnation and flash copper plating section and a washing section, which are an integrated electroplating equipment and process integrating three processes; two groups of symmetrically arranged nozzles are connected in the processing groove, and two groups of symmetrically arranged floating plates are arranged at the positions of the nozzles at the bottom of the processing groove; a pushing mechanism is arranged at the upper middle part of the frame corresponding to the positions of the plate placing mechanism and the material discharge part.

[0008] Preferably, the pushing mechanism includes symmetrically arranged sprockets, and the two sprockets are respectively arranged in the middle of the upper two ends of the frame, a chain is meshed between the two sprockets, and a plurality of evenly arranged columns are connected below the chain. A hanging arm is slidably connected inside the column, and a movable platform is provided at a position corresponding to the hanging arm in the middle of the frame, and a symmetrically arranged combination hanger is hung below one end of the hanging arm away from the middle of the frame.

[0009] Preferably, a side of the boom close to the movable platform is rotatably connected to a roller, and the roller is in contact with the movable platform.

[0010] Preferably, the plate placing mechanism and the material discharging portion are arranged in a staggered manner.

[0011] Preferably, a sleeve is connected above the floating plate, a slide rod is slidably connected above the sleeve, and the slide rod is connected to the processing groove through a positioning block.

[0012] Preferably, two groups of symmetrically arranged lifting mechanisms are provided at the position of the processing groove corresponding to the floating plate, and the lifting mechanism includes a first guide wheel, which is rotatably connected to a position above the processing groove near the side, a second guide wheel and a third guide wheel are rotatably connected to the position above the processing groove corresponding to the first guide wheel, a fourth guide wheel and a fifth guide wheel are rotatably connected to the lower part of the processing groove, and a sixth guide wheel is rotatably connected to a position above the processing groove near the middle.

[0013] Preferably, a group of symmetrically arranged wheel discs are provided at the position of the first guide wheel on the outside of the processing groove, and the first steel wire rope and the second steel wire rope are respectively wound around the outside of the wheel discs.

[0014] Preferably, the first steel wire rope is wound in the order of the first guide wheel, the second guide wheel, the fourth guide wheel, the fifth guide wheel and the sixth guide wheel, and is connected to a sleeve near the middle of the processing groove, and the second steel wire rope is wound in the order of the first guide wheel and the third guide wheel, and is connected to a sleeve far from the middle of the processing groove.

[0015] Preferably, the two combined hangers are connected with hanger supporting square tubes above, and the positions corresponding to the processing grooves at both ends of the hanger supporting square tubes are rotatably connected with symmetrically arranged pulleys, and the positions corresponding to the pulleys above the processing grooves are connected with symmetrically arranged hanger sliding rails, and the pulleys are intermittently fitted with the hanger sliding rails.

[0016] The present invention also provides a three-in-one electroplating process, comprising the following steps: S1: Before electroplating the circuit board, the position of the floating plate is adjusted according to the size of the circuit board. By rotating the wheel, the first guide wheel, the second guide wheel, the third guide wheel, the fourth guide wheel, the fifth guide wheel and the sixth guide wheel make the corresponding two floating plates rise or fall synchronously under the cooperation of the first wire rope and the second wire rope, so that when electroplating circuit boards of different sizes, the floating plate is placed above the lower end of the circuit board, so as to protect the lower end of the circuit board and prevent copper from accumulating at the lower end of the circuit board, resulting in poor quality of the produced circuit board; S2: One of the sprockets rotates, and the other sprocket rotates synchronously with the cooperation of the chain. During the rotation of the chain, the column, the boom and the combined hanger move synchronously. The sprocket will stop rotating intermittently, causing the chain to stop rotating, thereby stopping the column, the boom and the combined hanger from moving. When the column, the boom and the combined hanger stop moving, it is convenient to load and unload the circuit board, and to process the circuit board in steps.

[0017] S3: When the combined hanger moves to the board placing mechanism, the combined hanger is opened with the cooperation of the cylinder, and the circuit board can be loaded onto the combined hanger with the cooperation of the manipulator, so that the combined hanger clamps and fixes the circuit board.

[0018] S4: When the combined hanger drives the circuit board to move to the position of the processing tank, the movable platform descends with the cooperation of the movable platform, causing the combined hanger to descend synchronously, so that the circuit board enters the processing tank. After the circuit board enters the processing tank, it can be processed. The processing flow of the circuit board is: bulking → water washing → degumming → water washing → neutralization → water washing → hole filling → water washing → hole filling → water washing → micro-etching → pre-dip → activation → water washing → speeding up → water washing → copper plating → water washing → pre-dip → flash plating → water washing.

[0019] S5: When the circuit board processing is completed, the combined hanger is moved to the unloading part, and the combined hanger is opened with the cooperation of the cylinder, and the circuit board can be taken out of the combined hanger with the cooperation of the manipulator.

[0020] Beneficial effects of the present invention: The present invention clamps the circuit board through the combined hanger, and then enables the circuit board to be moved through the cooperation of the pushing mechanism, and can be raised and lowered under the action of the movable platform, so that the device is vertically lifted and lowered, and can complete the processing of the circuit board. When the circuit board is moved, the circuit board is non-contact with the outside, and the circuit board is also non-contact when switching between various processes, and does not need to contact with the roller, thereby avoiding the appearance of roller marks on the circuit board surface, thereby ensuring the quality of circuit board production.

[0021] The present invention can combine the three processes of bulking and degumming, copper plating and flash plating into a continuous line through the coordination of a bulking section, a degumming and slag removal section, a neutralization section, two groups of hole-filling sections, a micro-etching section, a pre-dip and activation section, a speeding section, a copper plating section, a pre-dip and flash plating section and a washing section, so as to form a three-in-one continuous processing process, thereby being able to continuously process the circuit board. When one of the processes of processing the circuit board is being carried out, there is no need to wait for the same batch of circuit boards to be processed before subsequent processing can be carried out. The circuit board can be completely processed without causing oxidation on the surface of the circuit board, and the quality of circuit board processing can be improved.

[0022] Before electroplating the circuit board, the position of the floating plate is adjusted according to the size of the circuit board. By rotating the wheel, the first guide wheel, the second guide wheel, the third guide wheel, the fourth guide wheel, the fifth guide wheel and the sixth guide wheel, in cooperation with the first steel wire rope and the second steel wire rope, make the corresponding two floating plates rise or fall synchronously. Therefore, when electroplating circuit boards of different sizes, the floating plate is placed above the lower end of the circuit board, so as to protect the lower end of the circuit board and prevent copper from accumulating at the lower end of the circuit board, resulting in poor quality of the produced circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 is a side view of the present invention; Figure 2 It is a top view of the present invention; Figure 3 It is a side view of the processing groove in the present invention; Figure 4 is a front view of the present invention; Figure 5 It is a front view of the processing groove in the present invention; Figure 6 It is a three-dimensional diagram of the combined hanger in the present invention.

[0025] In the figure: 1, frame; 2, nozzle; 3, sprocket; 4, pulley; 11. Plate placing mechanism; 12. Material unloading part; 13. Processing tank; 21. floating plate; 22. sleeve; 23. slide bar; 24. wheel; 25. first guide wheel; 251. second guide wheel; 252. third guide wheel; 253. fourth guide wheel; 254. fifth guide wheel; 255. sixth guide wheel; 26. first steel wire rope; 27. second steel wire rope; 31. Chain; 32. Column; 33. Hanging arm; 34. Hanger supporting square tube; 35. Combined hanger; 36. Roller; 37. Movable platform; 41. Hanger sliding track. DETAILED DESCRIPTION

[0026] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0027] See also Figure 1 As shown, a three-in-one electroplating device includes a frame 1, and a board placement mechanism 11 is arranged at a position near the inner wall of one end of the frame 1. The board placement mechanism 11 is used to support and transfer the circuit board and load the circuit board into the combined hanger 35.

[0028] A material removal portion 12 is provided at a position inside the other end of the frame 1 away from the board placement mechanism 11 . The material removal portion 12 is used to remove the circuit board from the assembly hanger 35 .

[0029] The board placement mechanism 11 and the unloading portion 12 are staggered. With this arrangement, during the movement of the combined hanger 35, it is convenient to install the circuit board from the board placement mechanism 11 onto the combined hanger 35, and it is convenient to remove the circuit board from the combined hanger 35 at the position of the unloading portion 12.

[0030] See also Figure 1 - Figure 3 As shown, a processing groove 13 is provided inside the frame 1 at a position corresponding to the blanking portion 12 , and the frame 1 and the blanking portion 12 are arranged in a straight line. The processing groove 13 is used to process the circuit board.

[0031] It is worth noting here that this technical solution is equipped with a bulking section, a desmearing section, a neutralization section, two sets of hole filling sections, a micro-etching section, a pre-dip and activation section, a speed-up section, a copper plating section, a pre-dip and flash copper plating section, and a water washing section, which is an integrated electroplating equipment and process integrating three processes; the processing flow of the circuit board is: bulking → water washing → desmearing → water washing → neutralization → water washing → hole filling → water washing → hole filling → water washing → micro-etching → pre-dip → activation → water washing → speed-up → water washing → copper plating → water washing → pre-dip → flash plating → water washing.

[0032] In specific use, the bulking section and the desmearing section are used to remove glue and plastic debris from the circuit board surface; The copper section is used to adjust the pH value of the solution and remove residual substances; The whole hole section is used to clean and activate the hole wall of the circuit board; The micro-etching section is used to roughen the copper surface of the hole wall of the circuit board, thereby improving the bonding strength of the copper; The pre-preg and activation section is used to form a uniform catalytic layer on the non-conductive hole wall of the circuit board to achieve subsequent chemical copper plating; The accelerator section is used to remove the stannous ions on the outer layer of the palladium core, exposing the active center of the palladium metal, thereby enhancing the catalytic ability and ensuring the smooth progress of the chemical copper deposition reaction; The copper plating section is used to deposit a uniform layer of copper on the non-conductive hole wall or substrate surface of the circuit board to achieve inter-layer conduction or electrical connection of components; The pre-dip and flash plating sections are used to improve the bonding strength between the substrate and the copper layer, ensure the uniformity of the plating, and optimize the circuit performance; The water washing section is used to remove residual solution on the circuit board, prevent cross contamination, and ensure the quality of the coating; Through the coordination of the bulking section, the desmearing section, the neutralization section, the two sets of hole-filling sections, the micro-etching section, the pre-dip and activation section, the acceleration section, the copper plating section, the pre-dip and flash plating section and the washing section, the three processes of bulking and desmearing, copper plating and flash plating can be combined into a continuous line to form a three-in-one processing flow, so that the circuit board can be processed continuously. When one of the processes of processing the circuit board is carried out, there is no need to wait for the same batch of circuit boards to be processed before the subsequent processing can be carried out. The circuit board can be completely processed without oxidation on the surface of the circuit board, which can improve the quality of circuit board processing.

[0033] Two groups of symmetrically arranged nozzles 2 are connected to the processing tank 13. The nozzles 2 are used to spray out the electroplating solution and disturb the electroplating solution.

[0034] Two groups of symmetrically arranged floating plates 21 are provided at the bottom of the processing tank 13 corresponding to the position of the nozzle 2. The floating plates 21 correspond to the flash plating section of the processing tank. The floating plates 21 are used to block the electric lines to prevent copper from accumulating at the bottom of the circuit board when the circuit board is electroplated, resulting in poor quality of the produced circuit board.

[0035] A sleeve 22 is connected to the top of the floating plate 21, a slide bar 23 is slidably connected to the top of the sleeve 22, and the top of the slide bar 23 is connected to the processing groove 13 through a positioning block. The cooperation between the sleeve 22 and the slide bar 23 enables the floating plate 21 to be stably lifted and lowered.

[0036] Two groups of symmetrically arranged lifting mechanisms are provided at the position of the processing groove 13 corresponding to the floating plate 21, and the lifting mechanism includes a first guide wheel 25, which is rotatably connected to a position above the processing groove 13 near the side, and a second guide wheel 251 and a third guide wheel 252 are rotatably connected to the position above the processing groove 13 corresponding to the first guide wheel 25, respectively, a fourth guide wheel 253 and a fifth guide wheel 254 are rotatably connected to the lower part of the processing groove 13, and a sixth guide wheel 255 is rotatably connected to a position above the processing groove 13 near the middle. The first guide wheel 25, the second guide wheel 251, the third guide wheel 252, the fourth guide wheel 253, the fifth guide wheel 254 and the sixth guide wheel 255 cooperate with the first steel wire rope 26 and the second steel wire rope 27 to make the two corresponding floating plates 21 rise and fall synchronously.

[0037] A group of symmetrically arranged wheel discs 24 are provided at the position of the first guide wheel 25 on the outside of the processing groove 13 , and the wheel discs 24 are used to wind up the first steel wire rope 26 and the second steel wire rope 27 .

[0038] A first steel wire rope 26 and a second steel wire rope 27 are respectively wound around the outer side of the wheel disc 24 . The first steel wire rope 26 and the second steel wire rope 27 are used to pull the sleeve 22 to make the sleeve 22 rise and fall, thereby making the floating plate 21 rise and fall.

[0039] The first steel wire rope 26 is wound in the order of the first guide wheel 25, the second guide wheel 251, the fourth guide wheel 253, the fifth guide wheel 254 and the sixth guide wheel 255, and is connected to the sleeve 22 near the middle of the processing groove 13. The second steel wire rope 27 is wound in the order of the first guide wheel 25 and the third guide wheel 252, and is connected to the sleeve 22 away from the middle of the processing groove 13. Through this arrangement, when the wheel disc 24 rotates, the two corresponding floating plates 21 can be synchronously raised or lowered.

[0040] In specific use, before electroplating the circuit board, the position of the floating plate 21 is adjusted according to the size of the circuit board. By rotating the turntable, the first guide wheel 25, the second guide wheel 251, the third guide wheel 252, the fourth guide wheel 253, the fifth guide wheel 254 and the sixth guide wheel 255, with the cooperation of the first steel wire rope 26 and the second steel wire rope 27, make the corresponding two floating plates 21 rise or fall synchronously, so that when electroplating circuit boards of different sizes, the floating plate 21 is placed above the lower end of the circuit board, so as to protect the lower end of the circuit board to prevent copper from accumulating at the lower end of the circuit board, resulting in poor quality of the produced circuit boards.

[0041] See also Figure 1 and Figure 2 As shown, a pushing mechanism is provided at the upper middle portion of the frame 1 corresponding to the position of the board placing mechanism 11 and the material unloading portion 12 , and the pushing mechanism is used to synchronously push a plurality of circuit boards.

[0042] The pushing mechanism includes symmetrically arranged sprockets 3, and the two sprockets 3 are respectively set at the middle positions of the upper two ends of the frame 1. A chain 31 is meshed between the two sprockets 3. By rotating one of the sprockets 3, the other sprocket 3 can be moved synchronously with the cooperation of the chain 31. In the process of synchronous movement of the two sprockets 3, multiple circuit boards can be moved synchronously, thereby improving the processing quality of the circuit boards.

[0043] It is worth noting here that the sprocket 3 will stop rotating intermittently, causing the chain 31 to stop rotating, thereby stopping the column 32, the arm 33 and the combined hanger 35 from moving. When the column 32, the arm 33 and the combined hanger 35 stop moving, it is convenient to load and unload the circuit board and to process the circuit board in steps.

[0044] A plurality of evenly arranged upright posts 32 are connected below the chain 31 , and the upright posts 32 are used to connect the boom 33 and limit the position of the boom 33 .

[0045] See also Figure 4 - Figure 6 As shown, a suspension arm 33 is slidably connected inside the column 32 , and the suspension arm 33 is used to support the combined hanger 35 .

[0046] A movable platform 37 is provided at a position in the middle of the frame 1 corresponding to the boom 33 . The movable platform 37 is used to support the boom 33 and can control the lifting and lowering of the boom 33 .

[0047] During specific use, the circuit board is clamped by the combined hanger 35, and then the circuit board can be moved through the cooperation of the pushing mechanism, and can be raised and lowered under the action of the movable platform 37, so that the device is vertically lifted and lowered, and can complete the processing of the circuit board. When the circuit board is moved, the circuit board has no contact with the outside, and the circuit board has no contact when switching between various processes, and does not need to contact with the roller 36, avoiding the appearance of roller 36 marks on the circuit board surface, thereby ensuring the quality of circuit board production.

[0048] A roller 36 is rotatably connected to one side of the boom 33 close to the movable platform 37 , and the roller 36 is in contact with the movable platform 37 . Through the cooperation of the roller 36 , when the boom 33 moves, the friction between the boom 33 and the movable platform 37 can be reduced, so that the boom 33 can move smoothly.

[0049] A symmetrically arranged assembly hanger 35 is suspended below one end of the suspension arm 33 away from the middle of the frame 1 . The assembly hanger 35 is used to clamp and fix the circuit board so that the circuit board can be processed.

[0050] A hanger supporting square tube 34 is connected to the top of each of the two combined hangers 35 , and the hanger supporting square tube 34 is used to support the combined hangers 35 .

[0051] The positions of both ends of the hanger supporting square tube 34 corresponding to the processing grooves 13 are rotatably connected with symmetrically arranged pulleys 4, and the pulleys 4 are used to assist in limiting the moving position of the combined hanger 35 so that the circuit board can move smoothly.

[0052] A symmetrically arranged hanger sliding track 41 is connected to the position corresponding to the pulley 4 above the processing groove 13. The pulley 4 is intermittently fitted with the hanger sliding track 41. Through the cooperation between the pulley 4 and the hanger sliding track 41, the stability of the circuit board can be guaranteed when the circuit board moves in the processing groove 13.

[0053] Working principle: before processing the circuit board, the position of the floating plate 21 is adjusted according to the size of the circuit board so that the floating plate 21 is above the lower end of the circuit board, so that the lower end of the circuit board can be protected to prevent copper from accumulating at the lower end of the circuit board, resulting in poor quality of the produced circuit board; after the position adjustment of the floating plate 21 is completed, one of the sprocket wheels 3 is rotated, and the other sprocket wheel 3 is rotated synchronously with the cooperation of the chain 31. During the rotation process, the chain 31 drives the column 32, the arm 33 and the combined hanger 35 to move synchronously. When the combined hanger 35 moves to the board placing mechanism 11, the combined hanger 35 is opened with the cooperation of the cylinder, and with the cooperation of the manipulator, the circuit board can be loaded onto the combined hanger 35, so that the combined hanger 35 clamps and fixes the circuit board; the combined hanger 35 drives the circuit board to move When it moves to the position of the processing tank 13, with the cooperation of the movable platform 37, the movable platform 37 descends to make the combined hanger 35 descend synchronously, so that the circuit board enters the processing tank 13. After the circuit board enters the processing tank 13, it can be processed. When the combined hanger 35 moves to the unloading part 12 after the processing is completed, with the cooperation of the cylinder, the combined hanger 35 is opened, and with the cooperation of the manipulator, the circuit board can be taken out from the combined hanger 35, and the three processes of bulking and degumming, copper plating, and flash plating are combined into a continuous line, so that the circuit board can be continuously processed. When one of the processes of processing the circuit board is carried out, there is no need to wait for the same batch of circuit boards to be processed before subsequent processing. The circuit board can be completely processed without oxidation on the surface of the circuit board, which can improve the quality of circuit board processing.

[0054] A three-in-one electroplating process comprises the following steps: S1: Before processing the circuit board, the position of the floating plate 21 is adjusted according to the size of the circuit board. By rotating the wheel 24, the first guide wheel 25, the second guide wheel 251, the third guide wheel 252, the fourth guide wheel 253, the fifth guide wheel 254 and the sixth guide wheel 255, with the cooperation of the first steel wire rope 26 and the second steel wire rope 27, make the corresponding two floating plates 21 rise or fall synchronously, so that when electroplating circuit boards of different sizes, the floating plate 21 is placed above the lower end of the circuit board, so as to protect the lower end of the circuit board and prevent copper from accumulating at the lower end of the circuit board, resulting in poor quality of the produced circuit boards.

[0055] S2: One of the sprockets 3 rotates, and the other sprocket 3 rotates synchronously with the cooperation of the chain 31. The chain 31 drives the column 32, the arm 33 and the combined hanger 35 to move synchronously during the rotation. The sprocket 3 will stop rotating intermittently, causing the chain 31 to stop rotating, thereby stopping the column 32, the arm 33 and the combined hanger 35 from moving. When the column 32, the arm 33 and the combined hanger 35 stop moving, it is convenient to load and unload the circuit board, and it is convenient to process the circuit board in steps.

[0056] S3: When the combined hanger 35 moves to the board placing mechanism 11, the combined hanger 35 is opened with the cooperation of the cylinder, and the circuit board can be loaded onto the combined hanger 35 with the cooperation of the manipulator, so that the combined hanger 35 clamps and fixes the circuit board.

[0057] S4: When the combined hanger 35 drives the circuit board to move to the position of the processing tank 13, with the cooperation of the movable platform 37, the movable platform 37 descends to make the combined hanger 35 descend synchronously, so that the circuit board enters the processing tank 13. After the circuit board enters the processing tank 13, it can be processed. The processing flow of the circuit board is: bulking → water washing → degumming → water washing → neutralization → water washing → hole filling → water washing → hole filling → water washing → micro-etching → pre-dip → activation → water washing → acceleration → water washing → copper plating → water washing → pre-dip → flash plating → water washing.

[0058] S5: When the circuit board processing is completed, the assembly hanger 35 is moved to the unloading part 12, and the assembly hanger 35 is opened with the cooperation of the cylinder, and the circuit board can be removed from the assembly hanger 35 with the cooperation of the robot.

[0059] It should be noted that, in this article, terms such as "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0060] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. A three-in-one electroplating device, comprising a frame (1), a plate placing mechanism (11) arranged at a position close to an inner wall at one end of the frame (1), and a material discharge portion (12) arranged at a position away from the plate placing mechanism (11) at the other end of the frame (1), characterized in that: A processing groove (13) is provided inside the frame (1) at a position corresponding to the blanking portion (12); the frame (1) and the blanking portion (12) are arranged in a straight line; the blanking portion (12) is used to remove the circuit board from the combined hanger (35); During the movement of the combined hanger (35), the circuit board is mounted on the combined hanger (35) from the board placing mechanism (11); Two groups of symmetrically arranged nozzles (2) are connected to the processing tank (13), and two groups of symmetrically arranged floating plates (21) are provided at the bottom of the processing tank (13) at positions corresponding to the nozzles (2). The floating plates (21) are used to block the electric lines to prevent copper from accumulating at the bottom of the circuit board when the circuit board is electroplated. The position of the floating plates (21) is adjusted according to the size of the circuit board to protect the lower end of the circuit board. A pushing mechanism is provided in the upper middle portion of the frame (1) at a position corresponding to the plate placing mechanism (11) and the material discharging portion (12).

2. A three-in-one electroplating device according to claim 1, characterized in that: The pushing mechanism comprises symmetrically arranged sprocket wheels (3), wherein the two sprocket wheels (3) are respectively arranged at the middle positions of the upper two ends of the frame (1), a chain (31) is meshed between the two sprocket wheels (3), a plurality of evenly arranged upright posts (32) are connected below the chain (31), a suspension arm (33) is slidably connected inside the upright posts (32), a movable platform (37) is arranged at a position in the middle of the frame (1) corresponding to the suspension arm (33), and a symmetrically arranged combined hanger (35) is suspended below one end of the suspension arm (33) away from the middle of the frame (1).

3. A three-in-one electroplating device according to claim 2, characterized in that: A side of the suspension arm (33) close to the movable platform (37) is rotatably connected to a roller (36), and the roller (36) is in contact with the movable platform (37).

4. A three-in-one electroplating device according to claim 3, characterized in that: The plate placing mechanism (11) and the material discharging portion (12) are arranged in a staggered manner.

5. A three-in-one electroplating device according to claim 4, characterized in that: A sleeve (22) is connected to the top of the floating plate (21), a slide bar (23) is slidably connected to the top of the sleeve (22), and the top of the slide bar (23) is connected to the processing groove (13) via a positioning block.

6. A three-in-one electroplating device according to claim 5, characterized in that: Two sets of symmetrically arranged lifting mechanisms are provided at positions of the processing groove (13) corresponding to the floating plate (21), and the lifting mechanisms include a first guide wheel (25), the first guide wheel (25) being rotatably connected to a position above the processing groove (13) near the side, a second guide wheel (251) and a third guide wheel (252) being rotatably connected to positions above the processing groove (13) corresponding to the first guide wheel (25), a fourth guide wheel (253) and a fifth guide wheel (254) being rotatably connected to the lower part of the processing groove (13), and a sixth guide wheel (255) being rotatably connected to a position above the processing groove (13) near the middle.

7. A three-in-one electroplating device according to claim 6, characterized in that: A group of symmetrically arranged wheel discs (24) are provided at positions outside the processing groove (13) corresponding to the first guide wheel (25), and a first steel wire rope (26) and a second steel wire rope (27) are respectively wound around the outside of the wheel discs (24).

8. A three-in-one electroplating device according to claim 7, characterized in that: The first steel wire rope (26) is wound in the order of the first guide wheel (25), the second guide wheel (251), the fourth guide wheel (253), the fifth guide wheel (254) and the sixth guide wheel (255), and is connected to the sleeve (22) close to the middle of the processing groove (13); the second steel wire rope (27) is wound in the order of the first guide wheel (25) and the third guide wheel (252), and is connected to the sleeve (22) far from the middle of the processing groove (13).

9. A three-in-one electroplating device according to claim 8, characterized in that: The two combined hangers (35) are connected to hanger support square tubes (34) above, and the positions of the two ends of the hanger support square tubes (34) corresponding to the processing grooves (13) are rotatably connected to symmetrically arranged pulleys (4), and the positions above the processing grooves (13) corresponding to the pulleys (4) are connected to symmetrically arranged hanger sliding rails (41), and the pulleys (4) are intermittently fitted to the hanger sliding rails (41).

10. A three-in-one electroplating process, applicable to a three-in-one electroplating device as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: S1: Before electroplating the circuit board, the position of the floating plate (21) is adjusted according to the size of the circuit board, and the wheel (24) is rotated, and the first guide wheel (25), the second guide wheel (251), the third guide wheel (252), the fourth guide wheel (253), the fifth guide wheel (254) and the sixth guide wheel (255) are coordinated with the first steel wire rope (26) and the second steel wire rope (27) to make the corresponding two floating plates (21) rise or fall synchronously, so that when electroplating circuit boards of different sizes, the floating plate (21) is located above the lower end of the circuit board, so that the lower end of the circuit board can be protected; S2: One of the sprockets (3) rotates, and the other sprocket (3) rotates synchronously with the cooperation of the chain (31). The chain (31) drives the column (32), the suspension arm (33) and the combined hanger (35) to move synchronously during the rotation process. The sprocket (3) stops rotating intermittently, causing the chain (31) to stop rotating, thereby causing the column (32), the suspension arm (33) and the combined hanger (35) to stop moving. When the column (32), the suspension arm (33) and the combined hanger (35) stop moving, it is convenient to load and unload the circuit board; S3: When the combined hanger (35) moves to the board placing mechanism (11), the combined hanger (35) is opened with the cooperation of the cylinder, and the circuit board can be loaded onto the combined hanger (35) with the cooperation of the manipulator, so that the combined hanger (35) clamps and fixes the circuit board; S4: When the combined hanger (35) drives the circuit board to move to the position of the processing groove (13), the movable platform (37) is lowered to make the combined hanger (35) lowered synchronously with the cooperation of the movable platform (37), so that the circuit board enters the processing groove (13). After the circuit board enters the processing groove (13), processing can be carried out; S5: When the circuit board processing is completed, the combined hanger (35) is moved to the unloading portion (12), and the combined hanger (35) is opened with the cooperation of the cylinder, and the circuit board can be removed from the combined hanger (35) with the cooperation of the robot.

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