Micro-fluidic chip film coating device based on PID constant temperature and constant pressure

Abstract

The invention relates to the technical field of PID-based constant-temperature and constant-pressure micro-fluidic chip film coating devices, in particular to a PID-based constant-temperature and constant-pressure micro-fluidic chip film coating device which comprises a fixed base, the fixed base is provided with a connecting mechanism, and the connecting mechanism comprises a bearing assembly arranged on the left section of the fixed base; a connecting assembly is arranged on the right section of the fixed base and connected with a dust removal assembly, and the dust removal assembly is connected with a film covering assembly. The film covering assembly is stably connected with other parts and has high flexibility, and accurate positioning and efficient operation can be carried out according to different chip sizes and film covering requirements. For diversified micro-fluidic chip products in the fields of biomedicine, chemical analysis, environmental monitoring and the like, the device shows excellent applicability, the flexibility and universality in the production process are effectively improved, the production efficiency is greatly improved, and the requirements of the market for large-scale and diversified production of micro-fluidic chips are met.

Description

Technical Field

[0001] The present invention relates to the technical field of microfluidic chip film covering devices based on PID constant temperature and constant pressure, and in particular to a microfluidic chip film covering device based on PID constant temperature and constant pressure. Background Art

[0002] In the field of microfluidic chip manufacturing, the film covering process is a key link to ensure the stable performance and normal function of the chip. As a cutting-edge scientific and technological product for precisely controlling tiny fluids, the surface film covering quality of a microfluidic chip is directly related to various performance indicators and service life of the chip.

[0003] Many problems that urgently need to be solved have emerged in the actual application of traditional microfluidic chip film covering devices. From the perspective of structural design, the coordination among the components of traditional film covering devices is poor. For example, the connection between the film covering component and other parts is not firm and flexible enough, making it difficult to perform precise positioning and efficient operation according to different chip sizes and film covering requirements. This greatly reduces the applicability of traditional devices when facing diverse microfluidic chip products, severely restricting the improvement of production efficiency.

[0004] With the wide application and rapid development of microfluidic chip technology in many fields such as biomedicine, chemical analysis, and environmental monitoring, the market has put forward higher requirements for the quality, performance, and production efficiency of chips. Traditional microfluidic chip film covering devices can no longer meet these new demands. Developing a microfluidic chip film covering device based on PID constant temperature and constant pressure has become an urgent need for the industry's development. This new type of device can effectively overcome the deficiencies of traditional devices in aspects such as temperature and pressure control and structural design, significantly improve the film covering quality and production efficiency of microfluidic chips, and promote the microfluidic chip technology to enter a new stage of development. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a microfluidic chip film covering device based on PID constant temperature and constant pressure, which solves many problems that urgently need to be solved in the actual application of traditional microfluidic chip film covering devices. From the perspective of structural design, the coordination among the components of traditional film covering devices is poor. The connection between the film covering component and other parts is not firm and flexible enough, making it difficult to perform precise positioning and efficient operation according to different chip sizes and film covering requirements. This greatly reduces the applicability of traditional devices when facing diverse microfluidic chip products, severely restricting the improvement of production efficiency.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a microfluidic chip coating device based on PID constant temperature and constant pressure, comprising a fixed base, the fixed base is provided with a connecting mechanism, the connecting mechanism includes a receiving component arranged on the left section of the fixed base, the right section of the fixed base is provided with a connecting component, the connecting component is connected with a dust removal component, and the dust removal component is connected with a coating component; The coating assembly includes a connecting frame fixedly connected to the right end of the fixed base, the inner wall of the connecting frame is fixedly connected to a connecting spring five, one inner end of the connecting spring five is fixedly connected to a limiting connecting rod, one inner end of the limiting connecting rod is rotatably connected to a limiting toothed ring, the inner wall of the limiting toothed ring is rotatably connected to a meshing gear, the inner side of the meshing gear is meshed with a stamping frame, the outer wall of the middle section of the stamping frame is fixedly connected to a toothed ring, the bottom of the stamping frame is fixedly connected to a coating frame, and the toothed ring is meshed with a rack rod.

[0007] A further improvement is that the receiving component includes two connecting springs fixedly connected to the front and rear ends of the fixed base, the outer end of the two connecting springs is fixedly connected to a slider, the top of the slider is fixedly connected to a clamping frame, the inner wall of the fixed base is fixedly connected to a connecting spring, one inner end of the connecting spring is fixedly connected to a traction seat, the top of the traction seat is fixedly connected to a constant temperature heating seat plate, and the constant temperature heating seat plate receives a chip.

[0008] A further improvement is that the connecting assembly includes a side frame fixedly connected to the right end of the fixed base, one inner end of the side frame is fixedly connected to a connecting spring three, one inner end of the connecting spring three is fixedly connected to a sliding rod, the inner side of the sliding rod is fixedly connected to a triangular slider, the outer end of the triangular slider is slidably connected to a slide frame, the inner side of the slide frame is fixedly connected to a fixed slider, and the bottom of the fixed slider is fixedly connected to a connecting spring four.

[0009] A further improvement is that the dust removal assembly includes a fixed frame, a pneumatic slide rod is fixedly installed on the outer end of the fixed frame, a pneumatic slider is slidably connected to the outer wall of the pneumatic slide rod, a hinged rod is fixedly connected to the inner side of the pneumatic slider, and a dust blowing gun is fixedly installed on the bottom of the hinged rod.

[0010] A further improvement is that the rack rod is fixedly connected to the inner outer wall of the fixed frame, and the stamping frame is fixedly installed on the slide; the connecting frame is fixed to the right end of the fixed base, and the connecting spring five on the inner wall of the connecting frame is connected to the limit connecting rod, and the inner side of the limit connecting rod is rotatably connected to the limit tooth ring; the meshing gear rotatably connected to the inner wall of the limit tooth ring is meshed with the stamping frame, and the tooth ring on the outer wall of the middle section of the stamping frame is meshed with the rack rod, and the rack rod is fixed to the inner outer wall of the fixed frame.

[0011] Further improvement lies in that the bottom of the towing seat is slidably connected to the inner wall of the top of the fixed base, and one end of the inner side of the clamping frame is slidably connected to the outer wall of the outer end of the side frame; the outer ends of the connecting springs II at the front and rear ends of the fixed base are connected to sliders, and the clamping frame on the top of the slider can be used to preliminarily position the chip from both sides; the inner side of the connecting spring I on the inner wall of the fixed base is connected to the towing seat, and the constant-temperature heating seat plate on the top of the towing seat is used to place the chip; the constant-temperature heating seat plate can accurately adjust the temperature through PID control technology to preheat the chip.

[0012] Further improvement lies in that the triangular slider is slidably connected to the triangular slider fixedly connected to the carriage, and the fixed slider is slidably connected to the inner wall of the limit sliding opening formed in the side frame; when a certain external force is applied, the triangular slider can slide in the carriage to drive the carriage to move; a connecting spring IV is connected to the bottom of the fixed slider on the inner side of the carriage to play a buffering and adjusting role; the fixed slider can slide on the inner wall of the limit sliding opening formed in the side frame to ensure the stability of the movement of the carriage; the carriage, as a key part connecting other components, can transmit the external power to the dust removal component and the film coating component and adjust their positions as needed.

[0013] Further improvement lies in that the fixed frame is fixedly connected to the outer wall of the carriage, and the articulated rod is slidably connected to the inner wall of the fixed frame; the fixed frame is fixed on the outer wall of the carriage, the pneumatic slide rod is installed at the outer end of the fixed frame, and the pneumatic slider slides on the outer wall of the pneumatic slide rod; the articulated rod connected to the inner side of the pneumatic slider can slide on the inner wall of the fixed frame, and the dust blowing gun installed at the bottom of the articulated rod can perform a dust blowing operation on the surface of the chip.

[0014] Further improvement lies in that the limit connecting rod is slidably connected to the inner wall of the carriage, and the film coating frame is used to clamp the film for coating the chip; through external control, the rack bar moves to drive the gear ring to rotate, and then the stamping frame moves up and down; the film coating frame at the bottom of the stamping frame is used to clamp the film for coating the chip, and under the drive of the stamping frame, the film is accurately covered on the surface of the chip; the limit connecting rod slides on the inner wall of the carriage to play a limiting and stabilizing role, and the connecting spring V can fine-tune the pressure during the film coating process as needed to ensure that the film coating process is carried out under a constant pressure state.

[0015] By means of the above technical solution, the present invention provides a microfluidic chip film coating device based on PID constant temperature and constant pressure, which has at least the following beneficial effects: 1. The structure design of the novel device of the present invention is ingenious, with strong cooperation among components. The connection between the film covering component and other parts is stable and highly flexible, enabling precise positioning and efficient operation according to different chip sizes and film covering requirements. Facing diverse microfluidic chip products in multiple fields such as biomedicine, chemical analysis, and environmental monitoring, the device demonstrates excellent applicability, effectively enhancing the flexibility and versatility in the production process, greatly improving the production efficiency, and meeting the market demand for large-scale and diverse production of microfluidic chips.

[0016] 2. The connecting spring five in the device of the present invention constructs an intelligent pressure fine-tuning mechanism, which can dynamically adjust the pressure in real time according to the actual film covering situation. Once the pressure setting deviates, the connecting spring five can quickly respond and perform self-adaptive adjustment to ensure that the film covering process is under constant pressure throughout. This innovative pressure adjustment mechanism highly meets the stringent process requirements of constant pressure film covering for microfluidic chips, further improving the film covering quality, providing a strong guarantee for the production of high-quality microfluidic chips, and promoting the development of microfluidic chip manufacturing technology towards higher precision.

[0017] 3. Based on the precise constant temperature regulation of PID, the present invention can strictly control the temperature environment of the microfluidic chip and the film covering material. By precisely adjusting the temperature, it effectively avoids the change of the physical properties of the material caused by temperature fluctuations, and enhances the bonding force between the film covering and the chip substrate. In the application scenarios of microfluidic chips involving precise chemical reactions, a stable and suitable temperature ensures that the reaction process is not disturbed, significantly improving the accuracy of chip detection, laying a solid foundation for the long-term stable operation of the chip, and greatly enhancing the overall performance and reliability of the chip.

[0018] 4. The device of the present invention can apply uniform and constant pressure during the film covering process, perfectly matching the characteristics of the microfluidic chip with its small size and fine structure. The uniform and stable pressure effectively prevents the occurrence of problems such as bubbles, wrinkles, and local poor adhesion during the film covering process. This not only ensures the smooth flow of the fluid inside the chip, avoiding interference with the chip function, but also reduces the risk of film covering detachment during subsequent use, greatly improving the yield rate of the chips and reducing the waste of resources and cost increase caused by product quality problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application.

[0020] In the drawings: Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic diagram of the dorsal structure of the present invention; Figure 3 It is a schematic diagram of the oblique side structure of the present invention; Figure 4 For the present invention Figure 3 The enlarged structural diagram at A in the middle; Figure 5 For the present invention Figure 3 The enlarged structural diagram at B in the middle; Figure 6 It is a schematic diagram of the local structure of the dust removal component of the present invention; Figure 7 It is a schematic diagram of the local structure of the film covering component of the present invention.

[0021] In the figure: 1, fixed base; 2, connecting mechanism; 21, receiving assembly; 211, connecting spring 1; 212, traction seat; 213, constant temperature heating seat plate; 214, chip; 215, connecting spring 2; 216, slider; 217, clamping frame; 22, connecting assembly; 221, side frame; 222, connecting spring 3; 223, slide bar; 224, triangular slider; 225, slide frame; 226, fixed slider; 2 27. Connecting spring four; 23. Dust removal assembly; 231. Fixed frame; 232. Pneumatic slide rod; 233. Pneumatic slider; 234. Articulated rod; 235. Dust blowing gun; 24. Laminating assembly; 241. Rack rod; 242. Gear ring; 243. Punching frame; 244. Laminating frame; 245. Limiting gear ring; 246. Meshing gear; 247. Connecting frame; 248. Connecting spring five; 249. Limiting connecting rod. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0023] The traditional microfluidic chip coating device has exposed many problems that need to be solved in practical applications. From the perspective of structural design, the components of the traditional coating device have poor coordination, the connection between the coating component and other components is not stable and flexible enough, and it is difficult to accurately position and efficiently operate according to different chip sizes and coating requirements. When facing a variety of microfluidic chip products, the applicability of the traditional device is greatly reduced, which seriously restricts the problem of improving production efficiency. This embodiment provides a microfluidic chip coating device based on PID constant temperature and constant pressure, please refer to Figures 1-7The embodiment provides a microfluidic chip coating device based on PID constant temperature and constant pressure, including a fixed base 1, the fixed base 1 is provided with a connecting mechanism 2, the connecting mechanism 2 includes a receiving component 21 arranged on the left section of the fixed base 1, the fixed base 1 is provided with a connecting component 22 on the right section, the connecting component 22 is connected to a dust removal component 23, and the dust removal component 23 is connected to a coating component 24; the coating component 24 includes a connecting frame 247 fixedly connected to the right end of the fixed base 1, and the connecting frame 247 has a connecting frame 247 inside. The wall is fixedly connected with a connecting spring 5 248, one inner end of the connecting spring 5 248 is fixedly connected with a limiting connecting rod 249, one inner end of the limiting connecting rod 249 is rotatably connected with a limiting toothed ring 245, the inner wall of the limiting toothed ring 245 is rotatably connected with a meshing gear 246, the inner side of the meshing gear 246 is meshed with a stamping frame 243, the outer wall of the middle section of the stamping frame 243 is fixedly connected with a toothed ring 242, the bottom of the stamping frame 243 is fixedly connected with a coating frame 244, and the toothed ring 242 is meshed with a rack rod 241.

[0024] In this embodiment, the film coating assembly 24 is also connected to the slide 225; the connecting frame 247 is fixed to the right end of the fixed base 1, and the connecting spring 5 248 on the inner wall of the connecting frame 247 is connected to the limit connecting rod 249, and the inner side of the limit connecting rod 249 is rotatably connected to the limit toothed ring 245; the meshing gear 246 rotatably connected to the inner wall of the limit toothed ring 245 is meshed with the stamping frame 243, and the toothed ring 242 on the outer wall of the middle section of the stamping frame 243 is meshed with the rack rod 241, and the rack rod 241 is fixed to the inner outer wall of the fixed frame 231; when the slide 225 drives the entire film coating assembly 24 to move to the appropriate position, the film coating assembly 24 is moved to the appropriate position through the external control. The rack rod 241 is controlled to move, driving the gear ring 242 to rotate, thereby moving the stamping frame 243 up and down; the coating frame 244 at the bottom of the stamping frame 243 is used to clamp the film for chip coating, and driven by the stamping frame 243, the film is accurately covered on the surface of the chip 214; the limiting connecting rod 249 slides on the inner wall of the slide 225 to play a role of limiting and stabilizing, and the connecting spring 248 can fine-tune the pressure during the coating process as needed to ensure that the coating process is carried out under constant pressure; at the same time, combined with the constant temperature control of the constant temperature heating seat plate 213, accurate coating based on PID constant temperature and constant pressure is achieved.

[0025] Furthermore, the rack rod 241 is fixedly connected to the inner outer wall of the fixed frame 231, and the punching frame 243 is fixedly installed on the slide 225; the limiting connecting rod 249 is slidably connected to the inner wall of the slide 225, and the film coating frame 244 is used to clamp the film for chip coating.

[0026] Furthermore, after the slide 225 drives the entire coating assembly 24 to move to the appropriate position, the rack rod 241 is moved through external control, driving the gear ring 242 to rotate, and then the stamping frame 243 moves up and down; the coating frame 244 at the bottom of the stamping frame 243 is used to clamp the film for chip coating, and under the drive of the stamping frame 243, the film is accurately covered on the surface of the chip 214; the limiting link 249 slides on the inner wall of the slide 225 to play a role of limiting and stabilizing, and the connecting spring five 248 can fine-tune the pressure during the coating process as needed to ensure that the coating process is carried out under a constant pressure state. Example

[0027] On the basis of the second embodiment, the receiving component 21 includes a second connecting spring 215 fixedly connected to the front and rear ends of the fixed base 1, the outer end of the second connecting spring 215 is fixedly connected to a slider 216, the top of the slider 216 is fixedly connected to a clamping frame 217, the inner wall of the fixed base 1 is fixedly connected to a connecting spring 1 211, the inner end of the connecting spring 1 211 is fixedly connected to a traction seat 212, the top of the traction seat 212 is fixedly connected to a constant temperature heating seat plate 213, and the constant temperature heating seat plate 213 receives the core Plate 214; the connecting component 22 includes a side frame 221 fixedly connected to the right end of the fixed base 1, one inner end of the side frame 221 is fixedly connected to a connecting spring three 222, one inner end of the connecting spring three 222 is fixedly connected to a slide rod 223, the inner side of the slide rod 223 is fixedly connected to a triangular slider 224, the outer end of the triangular slider 224 is slidably connected to a slide frame 225, the inner side of the slide frame 225 is fixedly connected to a fixed slider 226, and the bottom of the fixed slider 226 is fixedly connected to a connecting spring four 227.

[0028] In this embodiment, the receiving component 21 is located at the left section of the fixed base 1; the outer ends of the connecting springs II 215 at the front and rear ends of the fixed base 1 are connected to the sliders 216, and the clamping frames 217 on the tops of the sliders 216 can be used to preliminarily position the chip 214 from both sides; the inner sides of the connecting springs I 211 on the inner wall of the fixed base 1 are connected to the traction seats 212, and the constant-temperature heating seat plates 213 on the tops of the traction seats 212 are used to place the chip 214; the constant-temperature heating seat plate 213 can accurately adjust the temperature through the PID control technology to preheat the chip 214; the bottom of the traction seat 212 can slide on the inner wall of the top of the fixed base 1, and in subsequent processes, the position of the chip 214 can be adjusted as needed; one end of the inner side of the clamping frame 217 can slide on the outer wall of the outer end of the side frame 221 to play a role in assisting in positioning and stabilizing the chip 214; the connecting component 22 is arranged at the right section of the fixed base 1; the side frame 221 is fixed to the right end of the fixed base 1, the connecting spring III 222 inside the side frame 221 is connected to the sliding rod 223, and the triangular slider 224 inside the sliding rod 223 is slidably connected to the sliding frame 225; when a certain external force is applied, the triangular slider 224 can slide inside the sliding frame 225 to drive the sliding frame 225 to move; the bottom of the fixed slider 226 inside the sliding frame 225 is connected with a connecting spring IV 227 to play a role in buffering and adjusting; the fixed slider 226 can slide on the inner wall of the limiting sliding opening opened on the side frame 221 to ensure the stability of the movement of the sliding frame 225; the sliding frame 225, as a key part for connecting other components, can transmit the external power to the dust removal component 23 and the film coating component 24 and adjust their positions as needed.

[0029] Further, the bottom of the traction seat 212 is slidably connected to the inner wall of the top of the fixed base 1, and one end of the inner side of the clamping frame 217 is slidably connected to the outer wall of the outer end of the side frame 221; the triangular slider 224 is slidably connected to the triangular slider fixedly connected to the sliding frame 225, and the fixed slider 226 is slidably connected to the inner wall of the limiting sliding opening opened on the side frame 221.

[0030] Furthermore, one end of the inner side of the clamping frame 217 can slide on the outer wall of the outer end of the side frame 221 to play a role in assisting in positioning and stabilizing the chip 214; the connecting component 22 is arranged at the right section of the fixed base 1; the side frame 221 is fixed to the right end of the fixed base 1, the connecting spring III 222 inside the side frame 221 is connected to the sliding rod 223, and the triangular slider 224 inside the sliding rod 223 is slidably connected to the sliding frame 225; when a certain external force is applied, the triangular slider 224 can slide inside the sliding frame 225 to drive the sliding frame 225 to move; the bottom of the fixed slider 226 inside the sliding frame 225 is connected with a connecting spring IV 227 to play a role in buffering and adjusting. Embodiment

[0031] On the basis of Embodiment 1, the dust removal assembly 23 includes a fixed frame 231. An air-operated sliding rod 232 is fixedly installed at the outer end of the fixed frame 231. An air-operated sliding block 233 is slidably connected to the outer wall of the air-operated sliding rod 232. An articulated rod 234 is fixedly connected to the inner side of the air-operated sliding block 233. A dust blowing gun 235 is fixedly installed at the bottom of the articulated rod 234.

[0032] In this embodiment, the dust removal assembly 23 is connected to the carriage 225 in the connection assembly 22; the fixed frame 231 is fixed to the outer wall of the carriage 225, the air-operated sliding rod 232 is installed at the outer end of the fixed frame 231, and the air-operated sliding block 233 slides on the outer wall of the air-operated sliding rod 232; the articulated rod 234 connected to the inner side of the air-operated sliding block 233 can slide on the inner wall of the fixed frame 231, and the dust blowing gun 235 installed at the bottom of the articulated rod 234 can perform a dust blowing operation on the surface of the chip 214; when the carriage 225 moves to a suitable position above the chip 214, the air-operated sliding rod 232 drives the air-operated sliding block 233 to move, and drives the dust blowing gun 235 to approach the surface of the chip 214 through the articulated rod 234, blowing out high-pressure gas to remove the dust particles on the surface of the chip 214 and ensuring the cleanliness of the surface of the chip 214 before film coating.

[0033] Furthermore, the fixed frame 231 is fixedly connected to the outer wall of the carriage 225, and the articulated rod 234 is slidably connected to the inner wall of the fixed frame 231.

[0034] Even further, when the carriage 225 moves to a suitable position above the chip 214, the air-operated sliding rod 232 drives the air-operated sliding block 233 to move, and drives the dust blowing gun 235 to approach the surface of the chip 214 through the articulated rod 234, blowing out high-pressure gas to remove the dust particles on the surface of the chip 214 and ensuring the cleanliness of the surface of the chip 214 before film coating.

[0035] Working principle: The receiving assembly 21 is located at the left section of the fixed base 1; the outer ends of the connecting springs II 215 at the front and rear ends of the fixed base 1 are connected to the sliders 216, and the clamping frames 217 at the tops of the sliders 216 can be used to preliminarily position the chip 214 from both sides; the inner sides of the connecting springs I 211 on the inner wall of the fixed base 1 are connected to the traction seats 212, and the constant-temperature heating seat plate 213 at the top of the traction seat 212 is used to place the chip 214; the constant-temperature heating seat plate 213 can accurately adjust the temperature through PID control technology to preheat the chip 214; the bottom of the traction seat 212 can slide on the inner wall of the top of the fixed base 1, and in subsequent processes, the position of the chip 214 can be adjusted as needed; one end of the inner side of the clamping frame 217 can slide on the outer wall of the outer end of the side frame 221, playing a role in assisting positioning and stabilizing the chip 214. The connecting component 22 is arranged at the right section of the fixed base 1; the side frame 221 is fixed at the right end of the fixed base 1, the connecting spring three 222 inside the side frame 221 is connected to the sliding rod 223, and the triangular slider 224 inside the sliding rod 223 is slidably connected to the sliding frame 225; when a certain external force is applied, the triangular slider 224 can slide inside the sliding frame 225 to drive the sliding frame 225 to move; the bottom of the fixed slider 226 inside the sliding frame 225 is connected with the connecting spring four 227, which plays a buffering and adjusting role; the fixed slider 226 can slide on the inner wall of the limit sliding opening opened in the side frame 221 to ensure the stability of the movement of the sliding frame 225; the sliding frame 225, as a key part for connecting other components, can transmit the external power to the dust removal component 23 and the film coating component 24 and adjust their positions as needed; The dust removal component 23 is connected to the sliding frame 225 in the connecting component 22; the fixed frame 231 is fixed on the outer wall of the sliding frame 225, the pneumatic sliding rod 232 is installed at the outer end of the fixed frame 231, and the pneumatic slider 233 slides on the outer wall of the pneumatic sliding rod 232; the articulated rod 234 connected to the inside of the pneumatic slider 233 can slide on the inner wall of the fixed frame 231, and the dust blowing gun 235 installed at the bottom of the articulated rod 234 can perform a dust blowing operation on the surface of the chip 214; when the sliding frame 225 moves to a suitable position above the chip 214, the pneumatic sliding rod 232 drives the pneumatic slider 233 to move, and drives the dust blowing gun 235 to approach the surface of the chip 214 through the articulated rod 234, blowing out high-pressure gas to remove the dust particles on the surface of the chip 214 and ensure the cleanliness of the surface of the chip 214 before film coating; The film coating component 24 is also connected to the sliding frame 225; the connecting frame 247 is fixed at the right end of the fixed base 1, the connecting spring five 248 inside the inner wall of the connecting frame 247 is connected to the limit connecting rod 249, and the limit gear ring 245 is rotatably connected to the inside of the limit connecting rod 249; the meshing gear 246 rotatably connected to the inner wall of the limit gear ring 245 meshes with the stamping frame 243, and the gear ring 242 on the outer wall of the middle section of the stamping frame 243 meshes with the rack bar 241, and the rack bar 241 is fixed on the inner side outer wall of the fixed frame 231; when the sliding frame 225 drives the entire film coating component 24 to move to a suitable position, through external control, the rack bar 241 is moved to drive the gear ring 242 to rotate, and then the stamping frame 243 moves up and down; the film coating frame 244 at the bottom of the stamping frame 243 is used to hold the film for chip film coating, and under the drive of the stamping frame 243, the film is accurately covered on the surface of the chip 214; the limit connecting rod 249 slides on the inner wall of the sliding frame 225, playing a limiting and stabilizing role, and the connecting spring five 248 can fine-tune the pressure during the film coating process as needed to ensure that the film coating process is carried out under a constant pressure state; at the same time, combined with the constant temperature control of the constant temperature heating seat plate 213, accurate film coating based on PID constant temperature and constant pressure is realized.

[0036] It should be noted that in this text, the terms "including", "comprising", or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article, or device.

[0037] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A microfluidic chip coating device based on PID constant temperature and constant pressure, comprising a fixed base (1), characterized in that: The fixed base (1) is provided with a connection mechanism (2), the connection mechanism (2) comprises a receiving component (21) arranged on the left section of the fixed base (1), the right section of the fixed base (1) is provided with a connection component (22), the connection component (22) is connected to a dust removal component (23), and the dust removal component (23) is connected to a film coating component (24); The laminating assembly (24) comprises a connecting frame (247) fixedly connected to the right end of the fixed base (1); a connecting spring five (248) is fixedly connected to the inner wall of the connecting frame (247); an inner end of the connecting spring five (248) is fixedly connected to a limiting connecting rod (249); an inner end of the limiting connecting rod (249) is rotatably connected to a limiting toothed ring (245); an inner wall of the limiting toothed ring (245) is rotatably connected to a meshing gear (246); a stamping frame (243) is meshed on the inner side of the meshing gear (246); a toothed ring (242) is fixedly connected to the outer wall of the middle section of the stamping frame (243); a laminating frame (244) is fixedly connected to the bottom of the stamping frame (243); and a rack rod (241) is meshed with the toothed ring (242).

2. The microfluidic chip coating device based on PID constant temperature and constant pressure according to claim 1, characterized in that: The receiving component (21) comprises a second connecting spring (215) fixedly connected to the front and rear ends of the fixed base (1); the outer end of the second connecting spring (215) is fixedly connected to a slider (216); the top of the slider (216) is fixedly connected to a clamp (217); the inner wall of the fixed base (1) is fixedly connected to a first connecting spring (211); the inner end of the first connecting spring (211) is fixedly connected to a traction seat (212); the top of the traction seat (212) is fixedly connected to a constant temperature heating seat plate (213); the constant temperature heating seat plate (213) receives a chip (214).

3. The microfluidic chip coating device based on PID constant temperature and constant pressure according to claim 1, characterized in that: The connecting assembly (22) comprises a side frame (221) fixedly connected to the right end of the fixed base (1); a connecting spring three (222) is fixedly connected to one end of the inner side of the side frame (221); a sliding rod (223) is fixedly connected to one end of the inner side of the connecting spring three (222); a triangular sliding block (224) is fixedly connected to the inner side of the sliding rod (223); a sliding frame (225) is slidably connected to the outer end of the triangular sliding block (224); a fixed sliding block (226) is fixedly connected to the inner side of the sliding frame (225); and a connecting spring four (227) is fixedly connected to the bottom of the fixed sliding block (226).

4. The microfluidic chip coating device based on PID constant temperature and constant pressure according to claim 1, characterized in that: The dust removal assembly (23) comprises a fixed frame (231), a pneumatic slide rod (232) is fixedly mounted on the outer end of the fixed frame (231), a pneumatic slider (233) is slidably connected to the outer wall of the pneumatic slide rod (232), a hinged rod (234) is fixedly connected to the inner side of the pneumatic slider (233), and a dust blowing gun (235) is fixedly mounted on the bottom of the hinged rod (234).

5. The microfluidic chip coating device based on PID constant temperature and constant pressure according to claim 1, characterized in that: The rack rod (241) is fixedly connected to the inner outer wall of the fixed frame (231), and the punching frame (243) is fixedly mounted on the slide frame (225).

6. The microfluidic chip coating device based on PID constant temperature and constant pressure according to claim 2, characterized in that: The bottom of the traction seat (212) is slidably connected to the top inner wall of the fixed base (1), and one inner end of the clamping frame (217) is slidably connected to the outer wall of the outer end of the side frame (221).

7. The microfluidic chip coating device based on PID constant temperature and constant pressure according to claim 3, characterized in that: The triangular slider (224) is slidably connected to a triangular slider fixedly connected to the slide frame (225), and the fixed slider (226) is slidably connected to the inner wall of the limit sliding opening opened in the side frame (221).

8. The microfluidic chip coating device based on PID constant temperature and constant pressure according to claim 4, characterized in that: The fixed frame (231) is fixedly connected to the outer wall of the slide frame (225), and the hinge rod (234) is slidably connected to the inner wall of the fixed frame (231).

9. The microfluidic chip coating device based on PID constant temperature and constant pressure according to claim 1, characterized in that: The limiting connecting rod (249) is slidably connected to the inner wall of the slide frame (225), and the film coating frame (244) is used to clamp the film for chip coating.

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