Ultrasonic cleaning device suitable for semiconductor wafer

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to an ultrasonic cleaning device suitable for semiconductor wafers, the ultrasonic cleaning device comprises a box body, the interior of the box body is fixedly connected with a separation seat, and the interior of the box body is divided into a cleaning cavity and a recycling cavity through the separation seat; the fixing assembly is arranged in the cleaning cavity and used for fixing a wafer to be cleaned; the first auxiliary mechanism comprises a circulation part arranged at the upper end of the box body, and a linkage part is arranged on the circulation part; the driving mechanism is installed at the lower end of the box body and used for operation of other components; and the second auxiliary mechanism comprises an air drying part arranged on the box body, an impurity removing part is arranged in the recycling cavity, a transmission part is arranged at the lower end of the impurity removing part, and a cleaning part is further arranged at the impurity removing part. According to the semiconductor wafer cleaning device, efficient and comprehensive cleaning and air drying of semiconductor wafers and purification and recycling of cleaning liquid can be achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and particularly relates to an ultrasonic cleaning device suitable for semiconductor wafers. Background Art

[0002] During the manufacturing process of semiconductor wafers, strict cleaning steps are required to remove microscopic particles and impurities on the surface to ensure their performance and reliability.

[0003] For example, in a Chinese patent: an ultrasonic cleaning device with a wafer attitude adjustment mechanism in CN114864449B, in this ultrasonic cleaning device with a wafer attitude adjustment mechanism, the driving gear drives the internal gear disk to rotate through the reduction gear, and its rotation speed will be reduced to avoid damage caused by too fast speed during the lifting and rotation of the cleaning basket. At this time, the internal gear disk drives the scroll shaft to rotate, further enabling the eccentric disk to drive the lifting plate to reciprocate up and down. At this time, the cleaning basket on the top of the supporting clamping plate can also reciprocate up and down. At this time, the driving bevel gear drives the driven bevel gear to rotate, further enabling the cleaning basket to rotate during the up and down movement, thus achieving the effect of facilitating the improvement of cleaning uniformity and avoiding poor cleaning of the wafers on one side of the ultrasonic generating device.

[0004] Although the cleaning equipment in the above-mentioned comparative documents can adjust the attitude of the wafer to achieve the purpose of comprehensively cleaning the wafer, there are still some deficiencies in the actual use process: First of all, the wafer needs to be placed in the cleaning basket for cleaning. However, the presence of the cleaning basket will inevitably block some areas of the wafer, or the wafers stacked on each other in the cleaning basket will also cause blockage, resulting in the generation of cleaning dead corners, thereby reducing the cleaning effect; Secondly, after the cleaning process is completed, the wafer cannot be directly air-dried and requires additional equipment for separate air-drying operations. During the transfer of the wafer to the air-drying equipment, it is easy to be contaminated, affecting the cleanliness of the wafer; Finally, for the used cleaning liquid, it cannot be effectively treated, which is not conducive to subsequent recycling and reuse. Summary of the Invention

[0005] The purpose of the present invention is to provide an ultrasonic cleaning device suitable for semiconductor wafers, which can achieve efficient and comprehensive cleaning, air-drying of semiconductor wafers, and purification and reuse of the cleaning liquid.

[0006] The technical solutions adopted by the present invention are specifically as follows: An ultrasonic cleaning device suitable for semiconductor wafers, including a box body, and a partition seat is fixedly connected inside the box body. The inside of the box body is divided into a cleaning chamber and a recovery chamber by the partition seat; A fixing component, which is arranged in the cleaning chamber and is used to fix the wafer to be cleaned; A first auxiliary mechanism, the first auxiliary mechanism includes a circulation part arranged at the upper end of the box body, and a linkage part is arranged on the circulation part; A driving mechanism, which is installed at the lower end of the box body and is used for the operation of other components; A second auxiliary mechanism, the second auxiliary mechanism includes a drying part arranged on the box body, an impurity removing part is arranged inside the recovery chamber, a transmission part is arranged at the lower end of the impurity removing part, and a cleaning part is also arranged at the impurity removing part; Under specific circumstances, the driving mechanism drives the drying part to operate, and the transmission part drives the impurity removing part to operate. When the drying part operates, it dries the cleaned wafer. When the impurity removing part operates, it removes some impurities in the cleaning liquid. In another case, the driving mechanism drives the cleaning part to operate.

[0007] In a preferred solution, the fixing component includes two clamping plates. One of the clamping plates is fixedly connected with a guiding column, and the other clamping plate is slidably connected to the guiding column. A first compression spring is sleeved on the upper end of the guiding column. Fixing frames are arranged in an array on both clamping plates, and the fixing frames on the upper and lower clamping plates correspond to each other. Limiting rods are rotatably connected in an array on the fixing frames, and sleeves are fixedly embedded in an array on the fixing frames. A resisting block is inserted into one end of the sleeve, and a second compression spring is fixedly connected between the resisting block and the sleeve. One column of the limiting rods on the multiple lower fixing frames is connected together, and first linkage gears are installed at both ends. Sliding grooves are opened on both sides of the cleaning chamber, and bumps are arranged at both ends of the lower clamping plate.

[0008] In a preferred solution, the circulation part includes a square groove. The two square grooves are respectively opened on the front and back sides of the box body. Sprayers are arranged in an array at the square groove. A water pump is fixedly installed on the back of the box body. The water pumping end of the water pump is communicated with a water pumping pipeline, and the other end of the water pumping pipeline is communicated with the cleaning chamber. The water discharging end of the water pump is communicated with a water discharging pipeline, and the other end of the water discharging pipeline is communicated with one of the square grooves.

[0009] In a preferred solution, the linkage part includes a hollow shell, the hollow shell is communicated with the water pumping pipeline, a rotating rod is rotatably connected to the hollow shell through a sealing bearing, and the rotating rod extends into the cleaning chamber and is rotatably connected to the box body through a sealing bearing. A second linkage gear is connected to one end of the rotating rod, and a water wheel is connected to the other end of the rotating rod.

[0010] In a preferred solution, the driving mechanism includes a motor, the motor is fixedly installed on the bottom surface of the box body, and a large gear, a first cam and a second cam are installed on the output shaft of the motor.

[0011] In a preferred embodiment, the air drying part includes an air duct which is arranged in the recovery cavity and extends to the outside of the box body at both ends. One end of the air duct is connected with an air inlet hood, and the other end of the air duct is connected with an installation shell. The lower end of the installation shell is rotatably connected with a round rod through a sealing bearing. A fan blade is installed at the upper end of the round rod, and a small gear is installed at the lower end of the round rod. A bipolar ionization module is installed in the installation shell. The upper end of the installation shell is communicated with two shunt pipes, and the other end of the shunt pipe is communicated with the square groove.

[0012] In a preferred embodiment, the impurity removal part includes permanent magnet plates. The two permanent magnet plates are arranged on the front and back sides of the air duct and are fixedly connected with the inner wall of the recovery cavity by support rods. Hollow cylinders are inlaid on both the front and back sides of the box body. A filter screen and an activated carbon adsorption plate are fixedly connected to the inner wall of the hollow cylinder. One end of the hollow cylinder is inserted with a connecting rod, and one end of the connecting rod is fixedly connected with a piston plate. A third compression spring is connected between the piston plate and the inner wall of the hollow cylinder.

[0013] In a preferred embodiment, the transmission part includes a movable rod which is slidably connected to a sleeve block on the bottom surface of the box body. One end of the movable rod is connected with a push rod, and a support frame is fixedly connected to the side surface of the box body. A shift lever is hinged on the support frame.

[0014] In a preferred embodiment, the cleaning part includes brush plates. The two brush plates are respectively arranged on the side surfaces of the two permanent magnet plates. Moving rods are fixedly connected to both sides of the brush plates. A sliding sleeve is sleeved on the outer wall of the moving rod, and the sliding sleeve is fixedly connected with the inner wall of the recovery cavity by a support rod. One end of the moving rod is fixedly connected with a spring, and the other end of the spring is fixedly connected with the sliding sleeve. A piston rod is fixedly connected between the two moving rods by a support plate, and the piston rod is piston-connected with the box body. One end of the two piston rods is fixedly connected with a stress frame.

[0015] In a preferred embodiment, a liquid discharge pipe is arranged on the separation seat, and a solenoid valve is arranged on the liquid discharge pipe.

[0016] The technical effects achieved by the present invention are as follows: Through the design of the fixing component, especially the coordinated action of the upper and lower corresponding fixing frames, the wafer can be firmly fixed. And during the cleaning process, the wafer can rotate freely under the action of the linkage part, so as to ensure that the surface of the wafer can be comprehensively and evenly cleaned. In addition, the design of the circulation part enables the cleaning liquid to flow continuously and rinse the wafer, further improving the cleaning efficiency and cleanliness; In the present invention, the air drying part in the second auxiliary mechanism can be immediately started after the cleaning is completed to efficiently dry the wafer. Particularly, due to the adoption of the bipolar ionization module, positive and negative ions are generated when the air passes through the installation shell. These ions can neutralize the static charges on the surface of the wafer and in the air, preventing dust adsorption, thereby ensuring the cleanliness and cleaning state of the wafer. In addition, by utilizing the waste heat contained in the recycled cleaning liquid, the air can be further heated to form hot air. This method not only significantly improves the efficiency and effect of the drying process, but also realizes the efficient utilization of energy and reduces energy waste; In the present invention, the impurity removal part includes a permanent magnet plate which can effectively adsorb ferromagnetic impurities, and an activated carbon adsorption plate which is specifically used to remove organic pollutants. The introduction of this dual filtration mechanism significantly improves the purification effect of the cleaning liquid. In addition, the design of the transmission part and the cleaning part ensures the automatic operation and maintenance of the entire system, greatly reducing the dependence on manual operation. Such a design not only contributes to environmental protection because it reduces the generation of waste and the emission of harmful substances, but also can reduce production costs by improving the utilization rate of resources to achieve economic benefits. The dual advantages of this system design reflect both the responsibility for the environment and the pursuit of economic benefits. Brief Description of the Drawings

[0017] Figure 1 is a schematic structural diagram of the whole of the present invention; Figure 2 is a bottom view of the overall structure of the present invention; Figure 3 is a schematic structural diagram of the interior of the box body of the present invention; Figure 4 is of the present invention Figure 3 side cross-sectional view; Figure 5 is a schematic structural diagram of the linkage part of the present invention; Figure 6 is a schematic structural diagram of the interior of the cleaning cavity of the present invention; Figure 7 is a schematic structural diagram of the interior of the recycling cavity of the present invention; Figure 8 is a partial schematic structural diagram of the air drying part of the present invention; Figure 9 is a connection schematic diagram of the impurity removal part and the transmission part of the present invention; Figure 10 is a schematic structural diagram of the permanent magnet plate of the present invention; Figure 11 is a schematic structural diagram of the fixing component of the present invention; Figure 12 is a schematic structural diagram of the fixing frame of the present invention; Figure 13 is a cross-sectional view of the present invention Figure 12 ; Figure 14 is a schematic connection diagram of the cleaning part and the driving mechanism of the present invention; Figure 15 is a schematic connection diagram of the large gear, the first cam, the second cam and the motor output shaft of the present invention.

[0018] In the attached drawings, the list of components represented by each reference numeral is as follows: 1. Box body; 11. Cleaning cavity; 12. Recycling cavity; 2. Partition seat; 3. Fixing component; 4. First auxiliary mechanism; 5. Driving mechanism; 6. Second auxiliary mechanism; 31. Chute; 32. Clamping plate; 33. Guide post; 34. First compression spring; 35. Fixing bracket; 36. Limiting rod; 37. Sleeve; 38. Contact block; 39. Second compression spring; 310. First linkage gear; 41. Circulation part; 42. Linkage part; 411. Square groove; 412. Sprinkler head; 413. Water pump; 414. Water pumping pipeline; 415. Drainage pipeline; 421. Hollow shell; 422. Rotating rod; 423. Second linkage gear; 424. Water wheel; 51. Motor; 52. Large gear; 53. First cam; 54. Second cam; 61. Air drying part; 62. Impurity removal part; 63. Transmission part; 64. Cleaning part; 611. Air duct; 612. Air inlet hood; 613. Installation shell; 614. Round rod; 615. Fan blade; 616. Small gear; 617. Bipolar ionization module; 618. Shunt pipe; 621. Permanent magnet plate; 622. Hollow cylinder; 623. Filter screen; 624. Activated carbon adsorption plate; 625. Connecting rod; 626. Piston plate; 627. Third compression spring; 631. Movable rod; 632. Push rod; 633. Support frame; 634. Poking rod; 641. Brush plate; 642. Moving rod; 643. Sliding sleeve; 644. Spring; 645. Piston rod; 646. Force-bearing frame. Detailed implementation manners

[0019] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the following detailed description of the specific implementation manners of the present invention will be given in conjunction with the accompanying drawings of the specification.

[0020] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention may be practiced in other ways than those specifically described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0021] Secondly, as used herein, "an embodiment" or "embodiments" refer to specific features, structures, or characteristics that may be included in at least one implementation of the present invention. The phrase "in a preferred embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.

[0022] Thirdly, the present invention is described in detail in conjunction with schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of clarity, the cross-sectional views showing the device structure are enlarged locally out of proportion, and the schematic diagrams are only examples and should not limit the scope of protection of the present invention. In addition, in actual production, three-dimensional spatial dimensions including length, width, and depth should be included.

[0023] Please refer to the attached Figures 1 to 4 and Figure 11 As shown, this embodiment provides an ultrasonic cleaning device applicable to semiconductor wafers, including a box body 1. A partition seat 2 is fixedly connected inside the box body 1. The partition seat 2 divides the interior of the box body 1 into a cleaning chamber 11 and a recovery chamber 12. A drain pipe is provided on the partition seat 2, and a solenoid valve is provided on the drain pipe. A fixing component 3 is arranged in the cleaning chamber 11 and is used for fixing the wafer to be cleaned. A first auxiliary mechanism 4, the first auxiliary mechanism 4 includes a circulation part 41 arranged at the upper end of the box body 1, and a linkage part 42 is arranged on the circulation part 41. A driving mechanism 5 is installed at the lower end of the box body 1 and is used for the operation of other components. A second auxiliary mechanism 6, the second auxiliary mechanism 6 includes a drying part 61 arranged on the box body 1, a impurity removal part 62 is arranged inside the recovery chamber 12, a transmission part 63 is arranged at the lower end of the impurity removal part 62, and a cleaning part 64 is also arranged at the impurity removal part 62. Under specific circumstances, the driving mechanism 5 drives the drying part 61 to operate, and drives the impurity removal part 62 to operate through the transmission part 63. When the drying part 61 operates, it dries the wafer after cleaning. When the impurity removal part 62 operates, it removes some impurities in the cleaning liquid. In another case, the driving mechanism 5 drives the cleaning part 64 to operate.

[0024] In this embodiment, an ultrasonic generator is installed on the partition seat 2, and the vibration end of the ultrasonic generator is placed on the top of the partition seat 2. A drain pipe is provided on the partition seat 2, and an electromagnetic valve is provided on the drain pipe. An electric heating plate is installed on the inner wall of the cleaning chamber 11.

[0025] The ultrasonic generator and electric heating plate are both products currently available on the market. When selecting, the specifications and usage scenarios should be suitable, and the requirements of this application should be met as much as possible. The specific model specifications and installation methods are not limited here.

[0026] A top cover is arranged at the upper end of the box body 1, and a sewage pipe is arranged at the side.

[0027] Next, please refer to Figures 11 to 13 The fixing assembly 3 includes two clamping plates 32, one of which is fixedly connected to a guide column 33, and the other clamping plate 32 is slidably connected to the guide column 33, and the upper end of the guide column 33 is sleeved with a first compression spring 34, and the two clamping plates 32 are provided with fixing frames 35 distributed in an array, and the fixing frames 35 on the upper and lower clamping plates 32 correspond to each other, and the fixing frames 35 are provided with rotationally connected limit rods 36 distributed in an array, and the fixing frames 35 are also fixedly inlaid with sleeves 37 distributed in an array, and one end of the sleeve 37 is inserted with a resistance block 38, and a second compression spring 39 is fixedly connected between the resistance block 38 and the sleeve 37, and a row of limit rods 36 on the multiple fixing frames 35 below are connected to each other, and a first linkage gear 310 is installed at both ends, and a slide groove 31 is provided on both sides of the cleaning chamber 11, and bumps are provided at both ends of the lower clamping plate 32.

[0028] In this embodiment, by pulling the upper clamping plate 32 to move upward along the guide post 33, the first compression spring 34 is compressed. During this process, the two corresponding upper and lower fixing frames 35 will gradually move away from each other. Next, the wafer to be cleaned is placed on the lower fixing frame 35. Then, the upper clamping plate 32 is released, and it drives the upper fixing frame 35 to move downward under the restoring force of the first compression spring 34. In this way, through the cooperative action of the two corresponding upper and lower fixing frames 35, the wafer can be firmly fixed. On the fixing frame 35, the rotatably connected limiting rod 36 plays a role in supporting and limiting the wafer, ensuring that the wafer can rotate freely relative to the fixing frame 35. When the wafer is inserted into the fixing frame 35, it contacts the abutting blocks 38 on both sides of the fixing frame 35, causing the two abutting blocks 38 on both sides to separate from each other. At this time, the second compression spring 39 exerts a reaction force on the abutting blocks 38 to ensure that the abutting blocks 38 can be in close contact with the wafer, thereby keeping the wafer in a vertical state, which is beneficial to the cleaning process of the wafer. To further optimize the rotation of the wafer, the ends of the abutting blocks 38 are provided with balls, so that the contact between the balls and the wafer will not cause any adverse effects on the rotation of the wafer. After fixing multiple wafers on the fixing component 3, the bumps at both ends of the lower clamping plate 32 need to be inserted into the sliding grooves 31 to complete the connection between the fixing component 3 and the box body 1. When the fixing component 3 is installed in the box body 1, the limiting rod 36 installed with the first linkage gear 310 can be rotated to ensure that the first linkage gear 310 and the second linkage gear 423 can be correctly engaged after installation, so as to ensure the smooth operation of the entire device.

[0029] Next, please also refer to Figure 3 and Figure 4 Figure 7. The circulation part 41 includes square grooves 411. The two square grooves 411 are respectively opened on the front and back sides of the box body 1. The spray heads 412 are arranged in an array at the square grooves 411. A water pump 413 is fixedly installed on the back of the box body 1. The water suction end of the water pump 413 is communicated with a water suction pipe 414, and the other end of the water suction pipe 414 is communicated with the cleaning chamber 11. The water discharge end of the water pump 413 is communicated with a water discharge pipe 415, and the other end of the water discharge pipe 415 is communicated with one of the square grooves 411.

[0030] In this embodiment, first, an appropriate amount of cleaning liquid needs to be injected into the cleaning chamber 11 to ensure that the cleaning liquid covers the surface of the wafer to be cleaned. Subsequently, the top cover of the box body 1 is covered to prevent liquid leakage or contamination during the cleaning process. Next, the injected cleaning liquid is heated by controlling the electric heating plate to reach the ideal cleaning temperature. While heating, the ultrasonic generator is started, and the high-frequency vibration of the ultrasonic wave is used to effectively remove the fine particles and impurities on the surface of the wafer, thereby achieving deep cleaning. During the cleaning process, the water pump 413 is started, and the cleaning liquid at the bottom of the cleaning chamber 11 is continuously pumped out through the pumping pipeline 414. These cleaning liquids will then be discharged into the square groove 411 opened on the back of the box body 1 along the drainage pipeline 415. To further improve the cleaning effect, the cleaning liquid sprayed from the nozzle 412 will rinse the wafer to ensure the cleanliness of the wafer surface. Through this series of steps, the cleaning quality of the wafer can be significantly improved.

[0031] Secondly, please refer to again Figure 5 , the linkage part 42 includes a hollow shell 421, the hollow shell 421 is connected to the pumping pipeline 414, a rotating rod 422 is rotatably connected to the hollow shell 421 through a sealed bearing, and the rotating rod 422 extends into the cleaning chamber 11 and is rotatably connected to the box body 1 through a sealed bearing. One end of the rotating rod 422 is connected with a second linkage gear 423, and the other end of the rotating rod 422 is connected with a water wheel 424.

[0032] In this embodiment, during the cleaning process, the cleaning liquid will flow along the pumping pipeline 414, and when it flows through, it will generate a certain impact force on the water wheel 424. This impact force causes the rotating rod 422 to start rotating. The rotation of the rotating rod 422 will further drive the second linkage gear 423 connected thereto to start rotating. The second linkage gear 423 meshes with the first linkage gear 310 to form an effective transmission mechanism. As the first linkage gear 310 rotates, a limiting rod 36 on the fixing component 3 will also rotate accordingly. During the rotation of the limiting rod 36, a force is applied to the wafer, causing it to start rotating. In this way, the wafer can be comprehensively cleaned to ensure that no part is unable to be cleaned due to being fixed, thereby completely avoiding the problem of cleaning dead corners.

[0033] Please refer to again Figure 2 , Figure 14 and Figure 15 , the driving mechanism 5 includes a motor 51, the motor 51 is fixedly installed on the bottom surface of the box body 1, and a large gear 52, a first cam 53 and a second cam 54 are installed on the output shaft of the motor 51.

[0034] Please refer to again Figure 3 , Figure 7 and Figure 8, the air drying section 61 includes an air duct 611. The air duct 611 is disposed within the recovery chamber 12 and extends to the outside of the box body 1 at both ends. One end of the air duct 611 is connected to an air inlet hood 612, and the other end of the air duct 611 is connected to a mounting shell 613. The lower end of the mounting shell 613 is rotatably connected to a round rod 614 through a sealed bearing. The upper end of the round rod 614 is provided with a fan blade 615, and the lower end of the round rod 614 is provided with a small gear 616. A bipolar ionization module 617 is installed within the mounting shell 613. The upper end of the mounting shell 613 communicates with two flow dividing pipes 618, and the other end of the flow dividing pipe 618 communicates with the square groove 411.

[0035] In this embodiment, after the cleaning work is completed, we first need to open the solenoid valve to allow the cleaning liquid to flow smoothly along the drain pipe into the recovery chamber 12. After a period of drainage, ensure that the cleaning liquid in the cleaning chamber 11 is completely drained, and then close the solenoid valve. Next, start the motor 51, which will drive the large gear 52, the first cam 53, and the second cam 54 to start rotating. The large gear 52 and the small gear 616 are driven by a toothed belt, thereby causing the round rod 614 to start rotating. The rotation of the round rod 614 will drive the fan blade 615 to rotate, thus performing a blowing operation. At this time, the outside air will enter the air duct 611 along the air inlet hood 612 and then flow from the air duct 611 into the mounting shell 613. The air will be divided into two streams within the mounting shell 613 and enter the two square grooves 411 along the two flow dividing pipes 618 respectively. Finally, the air is blown out from the nozzles 412 on the square groove 411 to air-dry the wafer. In addition, since the recovered cleaning liquid still retains a certain temperature, when the air flows within the air duct 611, the waste heat of the cleaning liquid can be utilized through heat transfer. In this way, the air within the air duct 611 will be heated to form hot air, which air-dries the wafer, thereby further improving the drying effect. At the same time, when the air passes through the mounting shell 613, positive and negative ions will be generated by the bipolar ionization module 617. These ions move along with the air flow and finally blow onto the wafer and within the cleaning chamber 11, neutralizing the static charges on the surface of the wafer and in the air. In this way, static electricity can be effectively eliminated, preventing the residual static electricity on the wafer from adsorbing dust in the air after the wafer is taken out of the box body 1, thereby ensuring the cleanliness and cleaning state of the wafer.

[0036] It should be noted that one-way valves are installed at the connection ends of the shunt pipe 618 and the drainage pipe 415 with the square groove 411. The settings of these one-way valves have specific functions and purposes. For the one-way valve on the shunt pipe 618, its main function is to ensure that air can smoothly enter the square groove 411 through the shunt pipe 618, while preventing the medium in the square groove 411 from flowing back into the shunt pipe 618. At the same time, the one-way valve on the drainage pipe 415 also plays a similar role. It allows the cleaning liquid to pass through the drainage pipe 415 unidirectionally into the square groove 411, but at the same time prevents the medium in the square groove 411 from flowing back into the drainage pipe 415. For example, during actual operation, when injecting the cleaning liquid into the square groove 411 through the drainage pipe 415, due to the presence of the one-way valve, the cleaning liquid will smoothly enter the square groove 411 without flowing back into the shunt pipe 618. Similarly, when injecting air into the square groove 411 through the shunt pipe 618, the air can enter the square groove 411 through the shunt pipe 618 without flowing back through the drainage pipe 415. This design not only improves the efficiency of the system but also enhances the safety and reliability of the operation.

[0037] The bipolar ionization module 617 uses products that are already publicly available on the market. When selecting a model, under the premise that the specifications and usage scenarios are suitable, it is advisable to select a model that meets the requirements of this application as much as possible. The specific model specifications and installation methods are not limited here.

[0038] Please refer to again Figure 4 、 Figure 7 、 Figure 9 and Figure 10 In addition, the impurity removal part 62 includes a permanent magnet plate 621. Two permanent magnet plates 621 are arranged on the front and back sides of the air delivery pipe 611 and are fixedly connected to the inner wall of the recovery chamber 12 by support rods. Hollow cylinders 622 are inlaid on both the front and back sides of the box body 1. A filter screen 623 and an activated carbon adsorption plate 624 are fixedly connected to the inner wall of the hollow cylinder 622. One end of the hollow cylinder 622 is plugged with a connecting rod 625. One end of the connecting rod 625 is fixedly connected to a piston plate 626. A third compression spring 627 is connected between the piston plate 626 and the inner wall of the hollow cylinder 622.

[0039] Please refer to again Figure 2 and Figure 9 In addition, the transmission part 63 includes a movable rod 631. The movable rod 631 is slidably connected to a sleeve block on the bottom surface of the box body 1. One end of the movable rod 631 is connected to a push rod 632. A support frame 633 is fixedly connected to the side surface of the box body 1. A lever 634 is hinged on the support frame 633.

[0040] In this embodiment, when the first cam 53 reaches a certain angle during rotation, it contacts the movable rod 631, thereby pushing the two movable rods 631 to move in opposite directions. The movement of these two movable rods 631 drives the two push rods 632 to move away from each other. As the push rods 632 move, they push the lever 634 to rotate around the end of the support frame 633. At this time, the upper end portion of the lever 634 begins to act on the connecting rod 625, causing the connecting rod 625 to move into the interior of the hollow cylinder 622. The movement of the connecting rod 625 drives the piston plate 626 to move accordingly, thereby squeezing out the cleaning liquid in the hollow cylinder 622. At the same time, this movement also causes the third compression spring 627 to be stretched. When the first cam 53 no longer contacts the movable rod 631, the restoring force of the third compression spring 627 will cause the piston plate 626 and the connecting rod 625 to return to their initial positions. During the reset process of the piston plate 626, the cleaning liquid will be sucked back into the hollow cylinder 622. In addition, during the reset process of the connecting rod 625, it will also drive the push rods 632 and the movable rods 631 back to their starting positions, thus forming a cycle of continuously pumping and discharging liquid. During this process, the cleaning liquid will flow through the activated carbon adsorption plate 624, which can effectively adsorb impurities in the cleaning liquid. During the liquid discharge process, the movement of the liquid causes the liquid on both sides to surge towards the middle. This surging helps to mix the cleaning liquid in the recovery chamber 12, prevent the temperature of the cleaning liquid near the air duct 611 from decreasing, and thus avoid affecting the heating effect on the air. At the same time, when the cleaning liquid surges towards the middle, it will contact the permanent magnet plate 621, which can adsorb ferromagnetic impurities in the cleaning liquid, further improving the purification effect of the cleaning liquid and facilitating subsequent recycling and utilization. To prevent particulate impurities from entering the hollow cylinder 622 and adhering to the activated carbon adsorption plate 624, affecting its performance, a filter screen 623 is specially provided at the end of the hollow cylinder 622. The function of the filter screen 623 is to intercept particulate impurities and ensure that they do not enter the interior of the hollow cylinder 622.

[0041] Please refer to again Figure 4 and Figure 14 , the cleaning part 64 includes a brush plate 641. The two brush plates 641 are respectively arranged on the sides of the two permanent magnet plates 621. Both sides of the brush plate 641 are fixedly connected with moving rods 642. A sliding sleeve 643 is sleeved on the outer wall of the moving rod 642, and the sliding sleeve 643 is fixedly connected with the inner wall of the recovery chamber 12 through a support rod. One end of the moving rod 642 is fixedly connected with a spring 644, and the other end of the spring 644 is fixedly connected with the sliding sleeve 643. A piston rod 645 is fixedly connected between the two moving rods 642 by a support plate, and the piston rod 645 is pistonally inserted into the piston 1 of the box body. One end of the two piston rods 645 is fixedly connected with a force-bearing frame 646.

[0042] In this embodiment, when cleaning the interior of the box body 1, first, clean water needs to be injected from the upper end of the box body 1 for rinsing. Subsequently, the solenoid valve needs to be opened so that the water during the cleaning process can smoothly flow into the recovery chamber 12. Immediately afterwards, driven by the motor 51, the second cam 54 starts to rotate. When the second cam 54 rotates to a specific position, it exerts pressure on the force-bearing frame 646, causing the force-bearing frame 646 to move to the right. This rightward movement of the force-bearing frame 646 drives the piston rod 645, the moving rod 642, and the brush plate 641 to move together. During this process, the brush plate 641 exerts pressure on the impurities adsorbed on the permanent magnet plate 621 and scrapes them off. At the same time, due to the presence of the spring 644, when the second cam 54 no longer exerts pressure on the force-bearing frame 646, the spring 644 will, due to its own restoring force, cause the brush plate 641 to move to the left. Through this reciprocating motion, the brush plate 641 can effectively remove the impurities on the permanent magnet plate 621 and be discharged outside the box body 1 along with the water flow during cleaning. The repetition of this process ensures the cleaning effect inside the box body 1.

[0043] It should be noted that: the large gear 52, the first cam 53, and the second cam 54 are all connected to the output shaft of the motor 51 through a ratchet-pawl structure. Specifically: the large gear 52, the first cam 53, and the second cam 54 are all rotatably connected to the output shaft of the motor 51 through bearings, the ratchet is fixedly connected to the output shaft of the motor 51, and rings are fixedly connected to the large gear 52, the first cam 53, and the second cam 54. Pawls are hinged on the rings, and a return spring is connected between the pawls and the rings. When the pawl is successfully engaged with the ratchet, the output shaft of the motor 51 will drive the corresponding structure connected thereto to rotate synchronously during rotation. For example, when the motor 51 performs a reverse operation, the first cam 53 and the large gear 52 will rotate accordingly to air-dry the wafer and filter the cleaning liquid; when the motor 51 performs a forward operation, it will drive the second cam 54 to rotate, thereby driving the cleaning part 64 to perform corresponding cleaning work.

[0044] It should be noted that: the ratchet-pawl structure is common knowledge in the prior art and will not be elaborated here.

[0045] The working principle of the present invention is as follows: Cleaning stage: Inject the cleaning liquid into the cleaning chamber 11 and heat it to an appropriate temperature using the electric heating plate. Start the ultrasonic generator and use its high-frequency vibration to remove the tiny particles and impurities on the wafer surface. At the same time, the water pump 413 extracts the cleaning liquid through the water extraction pipeline 414 and rinses the wafer through the drainage pipeline 415 and the nozzle 412.

[0046] Wafer rotation mechanism: During the cleaning process, when the cleaning liquid flows through the pumping pipeline 414, it impacts the water wheel 424, prompting the rotating rod 422 to rotate, driving the operation of the gear system connected thereto (the second linkage gear 423 and the first linkage gear 310), thereby causing the limiting rod 36 on the fixing assembly 3 to rotate, and further causing the wafer to rotate to ensure thorough cleaning.

[0047] Air-drying stage: After the cleaning is completed, the cleaning liquid is discharged through the drain pipe, and the motor 51 is started to drive the fan blade 615 to rotate to generate a blowing operation. The air is introduced into the nozzle 412 in the square groove 411 after passing through the bipolar ionization module 617 to air-dry the wafer. The hot air helps to improve the drying effect, and at the same time, the ionized air can neutralize static electricity.

[0048] Purification of the cleaning liquid and cleaning of the interior of the box 1: The transmission part 63 pushes the movable parts (such as the movable rod 631 and the push rod 632) through the cam system (the first cam 53) to realize the pumping and draining processes of the cleaning liquid. During this period, impurities are removed through the activated carbon adsorption plate 624 and the permanent magnet plate 621. In addition, the cleaning part 64 removes the impurities adsorbed on the permanent magnet plate 621 through the reciprocating movement of the brush plate 641 to keep the interior of the box 1 clean.

[0049] Special design: The design of the check valve ensures that air and the cleaning liquid will not flow back (the check valve is located at the connection of the shunt pipe 618, the drain pipe 415 and the square groove 411), enhancing the efficiency and safety of the system; the ratchet-pawl structure enables the motor 51 to drive different functional components (the large gear 52, the first cam 53 and the second cam 54) respectively according to needs, realizing the flexibility of multi-functional operation.

[0050] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention. The structures, devices and operation methods not specifically described and explained in the present invention are implemented according to the conventional means in the art without special instructions and limitations.

Claims

1. An ultrasonic cleaning device suitable for semiconductor wafers, characterized in that: It comprises a box body (1), wherein a partition seat (2) is fixedly connected to the interior of the box body (1), and the interior of the box body (1) is divided into a cleaning chamber (11) and a recovery chamber (12) by the partition seat (2); A fixing component (3), the fixing component (3) being arranged in the cleaning chamber (11) and being used to fix the wafer to be cleaned; A first auxiliary mechanism (4), the first auxiliary mechanism (4) comprising a circulation part (41) arranged at the upper end of the box body (1), and a linkage part (42) being arranged on the circulation part (41); A driving mechanism (5), the driving mechanism (5) being mounted at the lower end of the housing (1) and used for the operation of other components; a second auxiliary mechanism (6), the second auxiliary mechanism (6) comprising an air dryer (61) arranged on the box body (1), a debris removal portion (62) being arranged inside the recovery chamber (12), a transmission portion (63) being arranged at the lower end of the debris removal portion (62), and a cleaning portion (64) being further arranged at the debris removal portion (62); In a specific case, the driving mechanism (5) drives the air drying unit (61) to operate, and the transmission unit (63) drives the impurity removal unit (62) to operate. When the air drying unit (61) operates, it dries the cleaned wafers, and when the impurity removal unit (62) operates, it removes some impurities in the cleaning solution. In another case, the driving mechanism (5) drives the cleaning unit (64) to operate.

2. The ultrasonic cleaning device for semiconductor wafers according to claim 1, characterized in that: The fixing assembly (3) comprises two clamping plates (32), one of the clamping plates (32) is fixedly connected to a guide column (33), and the other clamping plate (32) is slidably connected to the guide column (33), the upper end of the guide column (33) is sleeved with a first compression spring (34), and the two clamping plates (32) are both provided with fixing frames (35) distributed in an array, and the fixing frames (35) are rotatably connected to limit rods (36) distributed in an array, and the fixing frames (35) are also provided with a plurality of fixing frames (35) distributed in an array. A sleeve (37) is fixedly embedded in the distribution, a resistance block (38) is inserted at one end of the sleeve (37), and a second compression spring (39) is fixedly connected between the resistance block (38) and the sleeve (37), a row of limit rods (36) on the plurality of fixed frames (35) below are connected to each other, and a first linkage gear (310) is installed at both ends, and sliding grooves (31) are provided on both sides of the cleaning chamber (11), and protrusions are provided at both ends of the clamping plate (32) below.

3. The ultrasonic cleaning device for semiconductor wafers according to claim 1, characterized in that: The circulation part (41) comprises a square groove (411), two of the square grooves (411) are respectively opened on the front and rear sides of the box body (1), and nozzles (412) are arranged in an array at the square grooves (411). A water pump (413) is fixedly installed on the back of the box body (1), a water pump end of the water pump (413) is connected to a water pump pipe (414), and the other end of the water pump pipe (414) is connected to the cleaning chamber (11), and a water discharge end of the water pump (413) is connected to a water discharge pipe (415), and the other end of the water discharge pipe (415) is connected to one of the square grooves (411).

4. The ultrasonic cleaning device for semiconductor wafers according to claim 3, characterized in that: The linkage part (42) comprises a hollow shell (421), the hollow shell (421) being connected to the water pumping pipe (414), a rotating rod (422) being rotatably connected to the hollow shell (421) via a sealed bearing, the rotating rod (422) extending into the cleaning chamber (11) and being rotatably connected to the housing (1) via a sealed bearing, one end of the rotating rod (422) being connected to a second linkage gear (423), and the other end of the rotating rod (422) being connected to a water wheel (424).

5. The ultrasonic cleaning device for semiconductor wafers according to claim 1, characterized in that: The driving mechanism (5) comprises a motor (51), the motor (51) being fixedly mounted on the bottom surface of the box body (1), and a large gear (52), a first cam (53) and a second cam (54) being mounted on an output shaft of the motor (51).

6. The ultrasonic cleaning device for semiconductor wafers according to claim 3, characterized in that: The air trunk portion (61) comprises an air delivery pipe (611), the air delivery pipe (611) being arranged in the recovery chamber (12), and both ends of the air delivery pipe (611) extending to the outside of the box body (1), one end of the air delivery pipe (611) being connected to an air inlet cover (612), and the other end of the air delivery pipe (611) being connected to a mounting shell (613), the lower end of the mounting shell (613) being rotatably connected to a round rod (614) via a sealed bearing, the upper end of the round rod (614) being mounted with a fan blade (615), and the lower end of the round rod (614) being mounted with a pinion gear (616), a bipolar ionization module (617) being mounted in the mounting shell (613), the upper end of the mounting shell (613) being connected to two shunt pipes (618), and the other end of the shunt pipe (618) being connected to the square groove (411).

7. The ultrasonic cleaning device for semiconductor wafers according to claim 6, characterized in that: The impurity removal section (62) comprises a permanent magnet plate (621), wherein two permanent magnet plates (621) are arranged on the front and rear sides of the air delivery pipe (611) and are fixedly connected to the inner wall of the recovery chamber (12) by means of a support rod; the front and rear sides of the box body (1) are both inlaid with a hollow cylinder (622), the inner wall of the hollow cylinder (622) is fixedly connected to a filter screen (623) and an activated carbon adsorption plate (624), one end of the hollow cylinder (622) is plugged with a connecting rod (625), one end of the connecting rod (625) is fixedly connected to a piston plate (626), and a third compression spring (627) is connected between the piston plate (626) and the inner wall of the hollow cylinder (622).

8. The ultrasonic cleaning device for semiconductor wafers according to claim 1, characterized in that: The transmission part (63) comprises a movable rod (631), the movable rod (631) being slidably connected to a sleeve block on the bottom surface of the box body (1), one end of the movable rod (631) being connected to a push rod (632), a support frame (633) being fixedly connected to the side surface of the box body (1), and a lever (634) being hingedly connected to the support frame (633).

9. The ultrasonic cleaning device for semiconductor wafers according to claim 7, characterized in that: The cleaning portion (64) comprises a brush plate (641), wherein two of the brush plates (641) are respectively arranged on the sides of two permanent magnet plates (621), and both sides of the brush plate (641) are fixedly connected to a moving rod (642), and the outer wall of the moving rod (642) is provided with a sliding sleeve (643), and the sliding sleeve (643) is fixedly connected to the inner wall of the recovery chamber (12) through a support rod, and one end of the moving rod (642) is fixedly connected to a spring (644), and the other end of the spring (644) is fixedly connected to the sliding sleeve (643), and a piston rod (645) is fixedly connected between the two moving rods (642) by means of a support plate, and the piston rod (645) is piston-connected to the box body (1), and one end of the two piston rods (645) is fixedly connected to a force frame (646).

10. The ultrasonic cleaning device for semiconductor wafers according to claim 1, characterized in that: The separator (2) is provided with a liquid discharge pipe, and a solenoid valve is provided on the liquid discharge pipe.

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